Method for coupling hemispherical lens to terahertz optoelectronic chip

Abstract

OF THE DISCLOSURE Provided is a method for coupling a hemispherical lens to a terahertz optoelectronic chip. First, a printed circuit board and a hemispherical lens are ultrasonically cleaned. Then, a flat side of the hemispherical lens is placed against a back side of the printed circuit board, and UV glue is applied at the junction and cured with a UV lamp. The printed circuit board and the hemispherical lens are fixed on a base. A two-dimensional imaging instrument is used to align a center hole of the terahertz optoelectronic chip with a center of the hemispherical lens. Finally, a chip mounter is used to complete the coupling of the terahertz optoelectronic chip and the hemispherical lens. The coupling method of this application can be used in a fabrication process of transmission or reception chips, with a high degree of standardization, good compatibility, and high repeatability, making it suitable for large-scale manufacturing. Figure 1