Electroplating device

Abstract

An electroplating device, comprising a film frame and an ion film, wherein the ion film is arranged at the bottom of the film frame; the film frame comprises a plurality of first spraying holes, which are used for discharging a cathode liquid; and liquid outflow directions of the plurality of first spraying holes form a first preset angle with a vertical downward direction, the first preset angle being an acute angle. The cathode liquid discharged from the first spraying holes washes the ion film downwards, such that the fluidity of a flow field of a lower layer of a cathode cavity is promoted, crystallization precipitation is reduced, and the voltage between an anode of the electroplating device and a substrate is prevented from increasing due to the continuously increasing resistance between the anode and the substrate.

Description

electroplating equipment Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to an electroplating device. Background Art

[0002] FIG1 shows a schematic diagram of the structure of an electroplating apparatus, which includes a plating chamber, a membrane frame 100', an ion membrane 200', an electroplating power supply 800', and a substrate holding device 600'. The interior of the plating chamber includes a cathode chamber 300' and an anode chamber 400'. The sidewalls of the membrane frame 100' enclose the cathode chamber 300', while the anode chamber 400' is located below the cathode chamber 300'. The anode chamber 400' houses an anode 410'. The ion membrane 200' is disposed at the bottom of the membrane frame 100', separating the anode chamber 400' from the cathode chamber 300'. The anode 410' is immersed in the anolyte and electrically connected to the positive electrode of the electroplating power supply 800' via a titanium plate 450'. The substrate 500' is immersed in the catholyte and electrically connected to the negative electrode of the electroplating power supply 800' via a substrate holding device 600', with the substrate 500' acting as a cathode. The metal ions in the anolyte in the anode chamber 400' pass through the ion membrane 200' and enter the cathode liquid in the cathode chamber 300'. During electroplating, the electroplating power supply 800' outputs a constant current, and the substrate holding device 600' clamps the substrate 500' so that the substrate 500' is immersed in the cathode liquid in the cathode chamber 300' with its front side facing downward. The metal ions in the cathode liquid and the anolyte, such as C u 2+ The metal ions migrate to the surface of the substrate 500 ′, the substrate 500 ′ acquires electrons, and the metal ions are plated onto the surface of the substrate 500 ′ to form an electroplating layer.

[0003] Typically, after multiple substrate electroplating processes (often referred to as "runs") are performed in an electroplating apparatus, the voltage between the anode 410' and the substrate 500' increases. This phenomenon is often caused by an increase in the resistance between the anode 410' and the substrate 500'. Referring to FIG2 , a voltage curve between the anode 410' and the substrate 500' measured after 14 runs of the electroplating apparatus is shown. FIG2 shows that after 14 runs, the voltage between the anode 410' and the substrate 500' increases significantly, approaching 25V. It is worth noting that when the voltage between the anode 410' and the substrate 500' reaches the maximum output voltage of the electroplating power supply 800', the electroplating power supply 800' switches from a constant current output mode to a constant voltage output mode. If the resistance between the anode 410' and the substrate 500' continues to increase during this period, the output current of the electroplating power supply 800' may deviate from the set current, thereby affecting electroplating performance, such as the uniformity of the plated film thickness.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to solve the problem in the prior art that the voltage between the anode and the substrate increases after the electroplating device runs the film multiple times.

[0006] To solve the above problems, an embodiment of the present invention proposes an electroplating device, including a membrane frame and an ion membrane, the ion membrane is arranged at the bottom of the membrane frame, the membrane frame includes a plurality of first injection holes for discharging cathode liquid, and the liquid outlet direction of the plurality of first injection holes forms a first predetermined angle with the vertical downward direction, and the first predetermined angle is an acute angle.

[0007] As described above, the electroplating device of the present invention has the following advantages:

[0008] The membrane frame used in the electroplating device is provided with a plurality of first injection holes, and the liquid outlet direction of the plurality of first injection holes forms a first predetermined angle with the vertical downward direction. The first predetermined angle is an acute angle, so that the liquid outlet direction of the plurality of first injection holes is toward the ion membrane. The cathode liquid discharged from the first injection holes washes the ion membrane below the membrane frame obliquely downward, promotes the flow field fluidity of the lower layer of the cathode chamber, thereby reducing the crystal precipitation on the ion membrane, avoiding the continuous increase of the resistance between the anode and the substrate, thereby improving the voltage increase problem between the anode and the substrate, and achieving good electroplating performance.

[0009] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in the specification of the present invention.

[0010] Summary of the Figures

[0011] The features and properties of the present invention are further described by the following examples and accompanying drawings.

[0012] FIG1 is a schematic structural diagram of an electroplating device;

[0013] FIG2 is a graph showing a voltage curve between the anode and the substrate measured after 14 runs of the electroplating apparatus shown in FIG1 ;

[0014] FIG3 is a schematic structural diagram of a membrane frame;

[0015] FIG4 is a cross-sectional view of a branch pipe;

[0016] FIG5 is a flow field distribution diagram of the lower layer of the cathode chamber after an electroplating device uses the membrane rack shown in FIG3 ;

[0017] FIG6 is a schematic structural diagram of a membrane frame provided in Example 1 of the present invention;

[0018] 7 and 8 are schematic cross-sectional views of a membrane frame according to Example 1 of the present invention;

[0019] FIG9 is a cross-sectional view of a branch pipe provided in Example 1 of the present invention;

[0020] FIG10 is a schematic diagram of a partial structure of a membrane frame provided in Example 1 of the present invention;

[0021] FIG11 is a schematic diagram showing the direction in which cathode liquid is discharged from the first injection holes of two adjacent branch pipes of the membrane rack provided in Example 1 of the present invention;

[0022] FIG12 is a bottom cross-sectional schematic diagram of a branch pipe provided in Example 1 of the present invention, in which a plurality of first injection holes are provided on only one side wall thereof;

[0023] FIG13 is a schematic diagram of a structure in which the bottom of the membrane frame is facing upwards provided in Example 1 of the present invention;

[0024] FIG14 is a bottom view schematic diagram of the membrane frame provided in Example 1 of the present invention;

[0025] FIG15 is a flow field distribution diagram of the lower layer of the cathode chamber provided in Example 1 of the present invention;

[0026] FIG16 is a graph showing a voltage curve between the anode and the substrate measured after 14 runs of the electroplating apparatus provided in Example 1 of the present invention;

[0027] FIG17 is a cross-sectional schematic diagram of a membrane frame with through holes provided in Example 1 of the present invention;

[0028] FIG18 is a bottom view of a membrane frame with through holes provided in Example 1 of the present invention;

[0029] FIG19 is a flow field distribution diagram of the lower layer of the cathode chamber after the electroplating device provided in Example 1 of the present invention uses a membrane frame with through holes.

[0030] Figure 20 is a schematic structural diagram of a membrane frame provided in Example 2 of the present invention;

[0031] FIG21 is a cross-sectional view of a branch pipe provided in Example 2 of the present invention;

[0032] FIG22 is another cross-sectional view of the branch pipe provided in Example 2 of the present invention;

[0033] FIG23 is a schematic diagram of a partial structure of a membrane frame provided in Example 2 of the present invention;

[0034] FIG24 is a schematic diagram showing the direction in which cathode liquid is discharged from the second injection holes of two adjacent branch pipes of the membrane rack provided in Example 2 of the present invention; and

[0035] FIG25 is a flow field distribution diagram of the lower layer of the cathode chamber provided in Example 2 of the present invention.

[0036] Preferred embodiments of the present invention

[0037] The following is an explanation of the embodiments of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0038] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0039] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0042] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0043] FIG1 is a schematic structural diagram of an electroplating apparatus according to one embodiment, comprising an electroplating chamber, a membrane frame 100′, an ion membrane 200′, a substrate holding device 600′, an electroplating power supply 800′, an ammeter 910′, and a voltmeter 920′. The interior of the electroplating chamber includes a cathode chamber 300′ and an anode chamber 400′. The sidewalls of the membrane frame 100′ enclose the cathode chamber 300′, which is used to accommodate the cathode liquid. The anode chamber 400′ is located below the cathode chamber 300′ and is used to accommodate the anode 410′ and the anolyte. The ion membrane 200′ is disposed at the bottom of the membrane frame 100′ to separate the anode chamber 400′ from the cathode chamber 300′. Anode 410' is immersed in the anolyte and electrically connected to the positive electrode of the electroplating power supply 800' via titanium plate 450'. Substrate 500' is immersed in the catholyte and electrically connected to the negative electrode of the electroplating power supply 800' via substrate holding device 600', with substrate 500' acting as the cathode. An ammeter 910' is used to measure the current in the entire circuit, and a voltmeter 920' is used to measure the voltage between anode 410' and substrate 500'. It should be noted that the anolyte and catholyte can be collectively referred to as the electroplating solution, which may include, for example, copper sulfate.

[0044] After multiple consecutive substrate electroplating processes (hereinafter referred to as "runs") are performed in an electroplating apparatus, the voltage between anode 410' and substrate 500' may increase. For example, during the 14th run in the electroplating apparatus, the voltage increases from the set 21V to nearly 25V (see Figure 2). This phenomenon is mostly caused by an increase in the resistance between anode 410' and substrate 500'. The inventors of this application have discovered that one of the reasons for this increase in resistance is the presence of crystals deposited on ion membrane 200', such as copper sulfate crystals precipitated from the electroplating solution, which passivate ion membrane 200'. To reduce crystal deposition, the flow field fluidity of cathode chamber 300' can be enhanced.

[0045] In conjunction with Figures 3 and 4, Figure 3 shows a schematic structural diagram of a membrane frame, and Figure 4 shows a cross-sectional view of a branch pipe of a membrane frame. The liquid outlet direction of the injection hole 152' of the membrane frame 100' forms a predetermined angle α with the vertical upward direction (refer to Figure 4). The cathode liquid in the liquid supply channel 140' of the branch pipe 120' is discharged obliquely upward through the injection hole 152', which can promote the flow field fluidity of the upper layer of the cathode chamber 300'. However, the flow field fluidity of the lower layer of the cathode chamber 300' is very small, which can easily cause the plating solution to crystallize and precipitate on the ion membrane 200' (combined with reference to Figure 1), resulting in an increase in the resistance between the anode 410' and the substrate 500', and then an increase in the voltage between the anode 410' and the substrate 500'.

[0046] Refer to Figure 5, which shows a flow field distribution diagram of the lower layer of the cathode cavity after an electroplating device uses the membrane rack shown in Figure 3. It can be seen from Figure 5 that the dark area in the flow field region is very large, indicating that there are many dead zones in the flow field in the lower layer of the cathode cavity 300'; the light area in the flow field region is very small, indicating that the flow field fluidity in the lower layer of the cathode cavity 300' is very small.

[0047] In order to improve the flow field fluidity of the lower layer of the cathode chamber 300' and prevent the voltage between the anode 410' and the substrate 500' from increasing after multiple runs, the present invention improves the design of the film frame 100' of the electroplating device, as shown in the following embodiments.

[0048] Example 1:

[0049] Referring to Figures 6 to 9, Figure 6 shows a schematic structural diagram of the membrane frame in the embodiment of the present application; Figures 7 and 8 show schematic cross-sectional diagrams of the membrane frame in the embodiment of the present application; Figure 9 shows a cross-sectional view of the branch pipe in the embodiment of the present application, which is formed along the section line DD in Figure 6.

[0050] As shown in Figure 6, the membrane frame 100 includes a membrane frame sidewall 110 and a plurality of branch pipes 120. Each branch pipe 120 has a first end and a second end. The first end of each branch pipe 120 extends to the central channel 130 in the center of the membrane frame 100, and the second end of each branch pipe 120 is connected to the membrane frame sidewall 110. As shown in Figures 7 and 8, an ion membrane 200 is disposed at the bottom of the membrane frame 100, and a plurality of first injection holes 151 direct liquid outflow toward the ion membrane 200. Specifically, as shown in Figure 9, the liquid outflow direction of the first injection holes 151 in the branch pipes 120 forms a first predetermined angle β1 with the vertical downward direction. The first predetermined angle β1 is an acute angle, for example, 30° to 60°, or 45°. In other embodiments, the angle of the first predetermined angle β1 can be designed according to specific needs.

[0051] As shown in FIG8 , each branch pipe 120 is provided with a liquid supply channel 140 and a plurality of first spray holes 151. The liquid supply channel 140 is disposed within the branch pipe 120 and extends along its length. The liquid supply channel 140 connects the plurality of first spray holes 151 with the cathode liquid inlet 111 disposed on the membrane frame sidewall 110. When cathode liquid is supplied to the cathode chamber 300, the cathode liquid flows from the cathode liquid inlet 111 into the liquid supply channel 140. The cathode liquid in the liquid supply channel 140 then enters the cathode chamber 300 through the plurality of first spray holes 151. The cathode liquid discharged from the first spray holes 151 flushes the ion membrane 200 obliquely downward, increasing the fluidity of the flow field in the lower layer of the cathode chamber 300. This reduces crystal precipitation on the ion membrane 200 and prevents a continuous increase in resistance between the anode and the substrate, which in turn causes an increase in voltage between the anode and the substrate. This ensures good electroplating performance and uniform electroplating film thickness. It should be noted that the lower layer of the cathode chamber 300 refers to the area in the cathode chamber 300 close to the ion membrane 200 , and particularly refers to the area in the cathode chamber 300 below the first injection hole 151 .

[0052] 10 and 11 , FIG10 shows a schematic diagram of a partial structure of the membrane rack; FIG11 shows a schematic diagram of the direction in which cathode liquid is discharged from the first injection holes of two adjacent branches of the membrane rack; wherein the dotted arrows in FIG11 indicate the direction in which cathode liquid is discharged from the first injection holes.

[0053] As shown in FIG10 , each branch tube 120 has two opposing sidewalls, namely a first sidewall 1201 and a second sidewall 1202. Along the circumference of the membrane frame 100, the sidewall on the same side of each branch tube 120 is the first sidewall 1201, and the second sidewall 1202 is on the opposite side of the first sidewall 1201. Specifically, referring to FIG9 and FIG10 , the first sidewall 1201 has a straight wall and chamfered structures 12013 and 12014, with the straight wall connecting the chamfered structures 12013 and 12014. The second sidewall 1202 has a straight wall and chamfered structures 12023 and 12024, with the straight wall connecting the chamfered structures 12023 and 12024. A plurality of first injection holes 151 are provided on the first sidewall 1201 and / or the second sidewall 1202. Specifically, in this embodiment, the first injection holes 151 are provided on the straight wall of the corresponding sidewall. In some embodiments, the first injection holes 151 may be disposed at the chamfered structure 12014 of the first sidewall 1201 and the chamfered structure 12024 of the second sidewall 1202 .

[0054] The plurality of first spray holes 151 are formed in at least one row on the sidewall of the branch pipe 120 along the height direction thereof. The plurality of first spray holes in each row of first spray holes 151 are arranged in a row at intervals along the length direction L of the branch pipe 120. For example, FIG10 shows a row of first spray holes 151 on a corresponding sidewall of the branch pipe 120. The plurality of first spray holes in this row of first spray holes 151 are arranged in a row at intervals along the length direction L of the branch pipe 120. It should be noted that the height direction of the branch pipe 120 in this embodiment is the vertical direction, which is perpendicular to the length direction L.

[0055] Continuing with FIG10 , in some embodiments, for each branch pipe 120, a plurality of first spray holes 151 are disposed on the first sidewall 1201 and the second sidewall 1202, forming a row on each of the first sidewall 1201 and the second sidewall 1202. The row of first spray holes 151 disposed on the first sidewall 1201 and the row of first spray holes 151 disposed on the second sidewall 1202 are located at the same height of the branch pipe 120 and are staggered in the length direction L of the branch pipe 120.

[0056] In some embodiments, for each branch pipe 120, a plurality of first spray holes 151 are disposed on the first sidewall 1201 and the second sidewall 1202, and the plurality of first spray holes 151 are arranged in multiple rows on the first sidewall 1201 and the second sidewall 1202 along the height direction of the branch pipe 120. The multiple rows of first spray holes 151 disposed on the first sidewall 1201 correspond to the multiple rows of first spray holes 151 disposed on the second sidewall 1202 along the height direction of the branch pipe 120, wherein the first spray holes 151 located on different sidewalls and at the same height are staggered along the length direction L of the branch pipe 120.

[0057] In some embodiments, the plurality of first spray holes 151 are formed in at least two rows on the sidewall of the branch pipe 120 along the height direction thereof, and the first spray holes 151 in two adjacent rows on the same sidewall of the branch pipe 120 are staggered in the length direction L of the branch pipe 120 .

[0058] In some embodiments, referring to FIG11 , the first injection holes 151 on opposite side walls of two adjacent branch pipes 120 are staggered. In this example, the first side wall 1201 of each branch pipe 120 is opposite the second side wall 1202 of the adjacent branch pipe 120. When the first injection hole 151 on the first side wall 1201 and the first injection hole 151 on the second side wall 1202 of each branch pipe 120 discharge cathode liquid respectively, the direction in which the cathode liquid is discharged from the first injection hole 151 on the first side wall 1201 of the branch pipe 120 is staggered with the direction in which the cathode liquid is discharged from the first injection hole 151 on the second side wall 1202 of the adjacent branch pipe 120. This can reduce the mutual impact of the cathode liquid discharged from the opposite side walls, thereby smoothing the flow rate of the plating solution near the substrate in the cathode chamber.

[0059] In some embodiments, the plurality of first injection holes 151 are disposed on the sidewalls of each branch pipe 120 on the same side of the circumferential direction of the film frame 100. Referring to FIG. 12 , FIG. 12 shows a schematic bottom-up cross-sectional view of a branch pipe 120 having a plurality of first injection holes 151 disposed only on the first sidewall 1201. As shown in FIG. 12 , the plurality of first injection holes 151 are disposed on the first sidewall 1201 of each branch pipe 120, wherein the first sidewall 1201 is located on the same side of each branch pipe 120 along the circumferential direction of the film frame 100 (e.g., on the right side in a clockwise direction of the film frame 100). In other examples, the plurality of first injection holes 151 are disposed on the second sidewall 1202 of each branch pipe 120, wherein the second sidewall 1202 is located on the same side of each branch pipe 120 along the circumferential direction of the film frame 100.

[0060] 10 , 13 , and 14 , which illustrate schematic bottom views of the membrane frame. The membrane frame 100 further includes an intermediate retaining wall 131 and an intermediate channel 130. The intermediate retaining wall 131 defines the intermediate channel 130 extending vertically and is connected to the first end of each branch tube 120. A first groove 123 is provided at the bottom of the first end of each branch tube 120. The multiple first grooves 123 provided at the bottom of the first end of each branch tube 120 create an intermediate annular region around the outer periphery of the intermediate retaining wall 131 for liquid circulation (see the dashed circle located around the outer periphery of the intermediate retaining wall 131 in FIG14 ). This allows the plating solution to circulate within this intermediate annular region, enhancing the fluidity of the flow field in the corner region between the intermediate retaining wall 131 and each branch tube 120, reducing dead zones in the flow field in these corner regions, and further enhancing the overall fluidity of the lower layer of the cathode chamber.

[0061] In some embodiments, a second groove 124 is provided at the bottom of the second end of each branch pipe 120 connected to the membrane frame side wall 110. The plurality of second grooves 124 can facilitate the circulation of the plating solution on both sides of the second end of the branch pipe 120, thereby enhancing the fluidity of the flow field in the corner area between the membrane frame side wall 110 and each branch pipe 120, reducing the dead zone of the flow field in the corner area, and further enhancing the overall fluidity of the lower layer of the cathode chamber.

[0062] As shown in Figures 13 and 14 , the membrane frame 100 further includes an outer retaining wall 160, which is disposed between the first and second ends of the plurality of branch tubes 120 and serves to separate the cathode chamber 300 into at least two independent cathode regions. In this embodiment, the membrane frame 100 includes an outer retaining wall 160, which divides the cathode chamber 300 into two cathode regions. The area enclosed by the outer retaining wall 160 is a first cathode region 310, and the area between the outer retaining wall 160 and the membrane frame sidewall 110 is a second cathode region 320. The first ends of the plurality of branch tubes 120 are located in the first cathode region 310, and the second ends of the plurality of branch tubes 120 are located in the second cathode region 320.

[0063] In some embodiments, in the first cathode region 310 , a third groove (not shown) is provided at the bottom of each branch pipe 120 where it connects to the outer retaining wall 160 to enhance fluidity in the corner area between the outer retaining wall 160 and each branch pipe 120 .

[0064] In some embodiments, as shown in Figure 13 , the membrane frame 100 is further provided with reinforcing ribs 170 in the second cathode region 320. These ribs connect the outer retaining wall 160 and the membrane frame sidewall 110, reinforcing the outer retaining wall 160. In this embodiment, a reinforcing rib 170 is provided between adjacent branch pipes 120. Together, these ribs 170 and the branch pipes 120 circumferentially divide the second cathode region 320 into multiple subregions. To enhance fluidity between the subregions, a fourth groove 171 is provided at the bottom of the ribs 170. As shown in Figure 13 , each subregion is defined by the outer retaining wall 160, the branch pipes 120, the membrane frame 100 sidewall 110, and the reinforcing ribs 170.

[0065] By setting a second groove 124 at the bottom of the second end of the branch pipe 120 and setting a fourth groove 171 at the bottom of the reinforcing rib 170, an edge ring area for liquid circulation is formed in the circumference of the second cathode area 320. The plating liquids of any two adjacent sub-areas of the second cathode area 320 circulate with each other, thereby enhancing the flow field fluidity of the second cathode area 320 and reducing the flow field dead zone of the second cathode area 320.

[0066] [Corrected 16.07.2024 in accordance with Rule 91] Referring to Figure 15 , FIG15 shows the flow field distribution diagram of the lower cathode chamber of an electroplating apparatus using the membrane holder of Example 1. Compared to the flow field distribution diagram of the lower cathode chamber 300′ shown in FIG5 , the light-colored area of ​​the flow field region in FIG15 is significantly increased, indicating that the overall flow field fluidity in the lower cathode chamber 300 is significantly accelerated.

[0067] Referring to Figure 16 , it shows a graph of the voltage between the anode and substrate measured after 14 runs of the electroplating apparatus using the film holder of this embodiment. Compared to the graph of the voltage between the anode and substrate shown in Figure 2 , the voltage curves shown in Figure 10 are essentially similar during each run. After 14 runs, the voltage stabilized at approximately 22V.

[0068] Therefore, in combination with Figures 15 and 16, it can be seen that after the electroplating device adopts the membrane rack of this embodiment 1, the flow field fluidity of the lower layer of the cathode chamber 300 is significantly enhanced, which can reduce the crystal precipitation on the ion membrane 200, thereby reducing the voltage increase between the anode and the substrate after multiple runs.

[0069] As shown in Figure 15, within the first cathode region 310, the flow field fluidity at the locations of the multiple first grooves provided at the bottom of the first end of each branch tube (referenced by the location indicated by a1) is slightly weak. Based on this, to further improve fluid fluidity, a through hole can be provided at the first end of each branch tube. Referring to Figures 17 and 18, a through hole 1231 is provided at the first end of each branch tube 120. Through hole 1231 connects the liquid supply channel 140 with the first groove 123 at the bottom of the first end of the corresponding branch tube 120. This allows the cathode liquid in the liquid supply channel 140 to flush the ion membrane 200 below the first groove 123, thereby enhancing the flow field fluidity at the location of the first groove 123 at the bottom of the first end of each branch tube 120 and further enhancing the flow field fluidity in the corner area between the intermediate retaining wall 131 and each branch tube 120. Figure 19 shows a flow field distribution diagram of the lower layer of the cathode chamber after the electroplating apparatus uses a membrane rack with through holes. As can be seen from Figure 19, the flow field fluidity at the location of the first groove at the bottom of the first end of each branch tube (referenced by the location indicated by a2) is significantly enhanced.

[0070] Similarly, referring to Figures 17 and 18 , a through hole 1231 may also be provided at the second end of each branch tube 120 within the second cathode region 320. This through hole 1231 connects the liquid supply channel 140 with the second groove 124 at the bottom of the second end of each branch tube 120, thereby enhancing the flow field fluidity at the location of the second groove 124 and further enhancing the flow field fluidity in the corner area between the membrane support sidewall 110 and each branch tube 120. Compared to the flow field fluidity at the location of the second groove at the bottom of the second end of each branch tube (referenced by the location b1) in Figure 15 , the flow field fluidity at the location of the second groove at the bottom of the second end of each branch tube (referenced by the location b2) shown in Figure 19 is relatively enhanced.

[0071] In some embodiments, a through hole (not shown) can be provided at the junction of each branch pipe 120 and the outer ring retaining wall 160. The through hole connects the liquid supply channel 140 and the third groove, so that the cathode liquid in the liquid supply channel 140 flushes downwardly the ion membrane 200 below the third groove to enhance the fluidity of the flow field at the position of the third groove.

[0072] In this embodiment, since the liquid outlet direction of the first injection hole 151 on the branch pipe 120 of the membrane frame 100 is toward the ion membrane 200 at the bottom of the membrane frame 100, which is obliquely downward, the first injection hole 151 can be punched from bottom to top, so that the tool penetrates from the bottom of the membrane frame 100 to punch the branch pipe 120, which is convenient for punching and the tool is not easy to break.

[0073] Example 2:

[0074] Referring to Figures 20 to 22, Figure 20 is a schematic structural diagram of a membrane frame 100A of an electroplating device provided in Example 2 of the present invention; Figure 21 is a cross-sectional view of a branch pipe provided in Example 2 of the present invention; and Figure 22 is another cross-sectional view of a branch pipe provided in Example 2 of the present invention. Compared to Example 1, this embodiment differs in that: 1) branch pipe 120A includes not only a plurality of first spray holes 151A but also a plurality of second spray holes 152A. When a substrate is immersed in the cathode liquid in cathode chamber 300A for electroplating, the first spray holes 151A discharge liquid toward the ion membrane 200A, while the second spray holes 152A discharge liquid toward the substrate, i.e., the second spray holes 152A discharge liquid away from the ion membrane 200A. 2) No groove is provided at the bottom of each branch pipe 120A (please refer to the first groove 123, the second groove 124 and the third groove not shown in Figure 13 of Example 1), and no groove is provided at the bottom of the reinforcing rib 170A (please refer to the fourth groove 171 in Figure 13 of Example 1).

[0075] As shown in Figures 21 and 22, the liquid discharge direction of the first spray hole 151A forms a first predetermined angle β2 with the vertical downward direction, and the liquid discharge direction of the second spray hole 152A forms a second predetermined angle β3 with the vertical upward direction. The first predetermined angle β2 and the second predetermined angle β3 are both acute angles. The first predetermined angle β2 and the second predetermined angle β3 are the same, for example, 30° to 60°, or 45°.

[0076] 20 , each branch pipe 120A has two opposing sidewalls, namely a first sidewall 1201A and a second sidewall 1202A. Specifically, referring to FIG21 and FIG22 , first sidewall 1201A comprises a straight wall and chamfered structures 12013A and 12014A, wherein the straight wall connects the chamfered structures 12013A and 12014A. Second sidewall 1202A comprises a straight wall and chamfered structures 12023A and 12024A, wherein the straight wall connects the chamfered structures 12023A and 12024A. Multiple first injection holes 151A and multiple second injection holes 152A are disposed on the first sidewall 1201A and / or the second sidewall 1202A of each branch pipe 120A. Specifically, in this embodiment, the first injection holes 151A are disposed on the straight wall of the corresponding sidewall, and the second injection holes 152A are disposed at the chamfered structure (i.e., chamfered structure 12013A or chamfered structure 12023A) of the corresponding sidewall. In some embodiments, both the first sidewall 1201A and the second sidewall 1202A may be straight walls, in which case the first injection holes 151A and the second injection holes 152A are disposed on the straight walls of the corresponding sidewalls.

[0077] A plurality of first spray holes 151A and a plurality of second spray holes 152A are respectively formed in at least one row on the side wall of the branch pipe 120A along the height direction thereof. The plurality of first spray holes in each row of first spray holes 151A are arranged in a row at intervals along the length direction L of the branch pipe 120A, and the plurality of second spray holes in each row of second spray holes 152A are arranged in a row at intervals along the length direction L of the branch pipe 120A.

[0078] In some embodiments, as shown in Figure 20, a row of first spray holes 151A and a row of second spray holes 152A are formed on the first side wall 1201A and the second side wall 1202A of each branch pipe 120A, and the second spray holes 152A on the same side wall are located above the first spray holes 151A. In this embodiment, the first spray holes 151A and the second spray holes 152A on the same side wall are staggered in the length direction L of the branch pipe 120. In addition, with respect to the same branch pipe 120A, a row of first injection holes 151A provided on the first side wall 1201A and a row of first injection holes 151A provided on the second side wall 1202A are located at the same height of the branch pipe 120A and are staggered in the longitudinal direction L of the branch pipe 120A; similarly, with respect to the second injection holes 152A, a row of second injection holes 152A provided on the first side wall 1201A and a row of second injection holes 152A provided on the second side wall 1202A are located at the same height of the branch pipe 120A and are staggered in the longitudinal direction L of the branch pipe 120A.

[0079] In some embodiments, each branch pipe 120A has multiple rows of first spray holes 151A and multiple rows of second spray holes 152A formed on the first sidewall 1201A and the second sidewall 1202A, respectively, along the height of the branch pipe 120A. In the same branch pipe 120A, the multiple rows of first spray holes 151A on the first sidewall 1201A correspond to the multiple rows of first spray holes 151A on the second sidewall 1202A along the height of the branch pipe 120A. The first spray holes 151A located on different sidewalls at the same height are staggered along the length L of the branch pipe 120A. Similarly, regarding the second injection holes 152A, in the same branch pipe 120A, the multiple rows of second injection holes 152A arranged on the first side wall 1201A and the multiple rows of second injection holes 152A arranged on the second side wall 1202A correspond to each other in the height direction of the branch pipe 120A, wherein the second injection holes 152A located on different side walls and at the same height are staggered in the length direction L of the branch pipe 120A.

[0080] In some embodiments, the plurality of first injection holes 151A are formed in at least two rows along the height direction of the branch pipe 120A on the sidewall thereof. On the same sidewall of the branch pipe 120A, the second injection holes 152A are located above the first injection holes 151A. Two adjacent rows of first injection holes 151A on the same sidewall of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A. Similarly, the plurality of second injection holes 152A are formed in at least two rows along the height direction of the branch pipe 120A on the sidewall thereof. Two adjacent rows of second injection holes 152A on the same sidewall of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A. In this embodiment, a row of first injection holes 151A and a row of second injection holes 152A, located on the same sidewall of the branch pipe 120A and adjacent in the height direction of the branch pipe 120A, are staggered in the length direction L of the branch pipe 120A.

[0081] In some embodiments, referring to FIG. 23 , on the same side wall of the branch pipe 120A, at least one row of first injection holes 151A and at least one row of second injection holes 152A alternate in the height direction of the branch pipe 120A, wherein a row of first injection holes 151A and a row of second injection holes 152A adjacent in the height direction of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A, which helps to make the flow field in the cathode chamber 300A more uniform.

[0082] In some embodiments, referring to Figures 21 and 22 , on the same cross-section of branch pipe 120A, first injection hole 151A and second injection hole 152A, located on different side walls, are coaxial. This cross-section is formed along section line UU in Figure 20 . The first injection hole 151A on first side wall 1201A and the second injection hole 152A on second side wall 1202A are coaxial, with their axes passing through liquid supply channel 140A of branch pipe 120A. This coaxial design allows for the drilling of the first and second injection holes 151A, 152A, from the bottom up. Specifically, the tool penetrates diagonally upward from the bottom of membrane holder 100A to drill branch pipe 120A, simultaneously drilling the first injection hole 151A on one side wall and the second injection hole 152A on the other side wall. This facilitates drilling and prevents the tool from breaking.

[0083] Referring to Figure 24, Figure 24 is a schematic diagram illustrating the direction in which cathode liquid is discharged from the second injection holes of two adjacent branch pipes of the film holder 100A. The dashed arrows in Figure 24 indicate the direction in which cathode liquid is discharged from the second injection holes. The second injection holes 152A on the opposing side walls of the two adjacent branch pipes 120A are staggered, with the first side wall 1201A of each branch pipe 120A facing the second side wall 1202A of the adjacent branch pipe 120A. The direction in which the second injection holes 152A on the first side wall 1201A of each branch pipe 120A discharge cathode liquid is staggered with the direction in which the second injection holes 152A on the second side wall 1202A of the adjacent branch pipe 120A discharge cathode liquid. This prevents cathode liquid discharged from the opposing side walls from colliding with each other toward the substrate, reducing the impact of the cathode liquid on the substrate. This results in a smooth cathode liquid flow rate near the substrate, ensuring a good electroplating effect. Similarly, the first injection holes 151A on the opposing side walls of the two adjacent branch pipes 120A are staggered.

[0084] In this embodiment, the second spray hole 152A is designed to open obliquely upward, so that the cathode liquid is discharged obliquely upward, thereby promoting the flow field fluidity in the upper layer of the cathode chamber 300A. The first spray hole 151A is designed to open obliquely downward, so that the cathode liquid flushes the ion membrane 200A obliquely downward (see Figure 20), thereby promoting the flow field fluidity in the lower layer of the cathode chamber 300A, reducing the flow field dead zone, and further reducing crystal precipitation on the ion membrane 200A, preventing the resistance between the anode and the substrate from increasing, which in turn causes the voltage between the anode and the substrate to increase, thereby improving the electroplating performance.

[0085] In addition, when the cathode liquid flow rate supplied to the branch pipe 120A is the same, compared with only opening the second injection hole 152A, the branch pipe 120A in the present application simultaneously opens the first injection hole 151A and the second injection hole 152A, so that the cathode liquid in the branch pipe 120A is discharged in two directions at the same time, which plays a diversion role. While ensuring that the total supply flow rate of the cathode liquid remains unchanged, the cathode liquid flow rate of the second injection hole 152A is reduced, thereby reducing the impact of the cathode liquid on the substrate, and further making the cathode liquid flow rate near the substrate smooth, ensuring a good electroplating effect.

[0086] Referring to Figure 25 , a flow field distribution diagram of the lower cathode chamber of an electroplating apparatus using the membrane holder 100A of Example 2 is shown. Compared to the flow field distribution diagram of the lower cathode chamber 300′ shown in Figure 5 , the light-colored area of ​​the flow field region in Figure 25 is significantly larger, indicating that the flow rate of the electroplating solution in the lower cathode chamber 300A is significantly increased, and the dead zone of the flow field is significantly reduced.

[0087] After the electroplating device uses the membrane rack 100A of this embodiment and has been run for many times, the voltage between the anode and the substrate can be kept stable, and the voltage will not increase significantly due to the increase of crystal precipitation on the ion membrane 200A.

[0088] It should be pointed out that the bottom of the branch pipe 120A of this embodiment 2 can also be configured as needed with the first groove 123, the second groove 124 and the third groove not shown in the figure as shown in Figure 13 of Example 1, and the bottom of the reinforcing rib 170A can also be configured as needed with the fourth groove 171 as shown in Figure 13 of Example 1.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating device, characterized in that: It includes a membrane frame and an ion membrane, wherein the ion membrane is arranged at the bottom of the membrane frame, and the membrane frame includes: A plurality of first spray holes are used to discharge cathode liquid, and the liquid discharge direction of the plurality of first spray holes forms a first predetermined angle with the vertical downward direction, and the first predetermined angle is an acute angle.

2. The electroplating device according to claim 1, characterized in that: The membrane frame includes a plurality of branch pipes, each of which includes a liquid supply channel for providing cathode liquid and two opposite side walls, the two side walls include a first side wall and a second side wall, the plurality of first injection holes are arranged on the first side wall and / or the second side wall, the liquid supply channel extends along the length direction of the branch pipe, and the plurality of first injection holes are connected to the liquid supply channel.

3. The electroplating device according to claim 2, characterized in that: The plurality of first spray holes form at least one row on the side wall along the height direction of the branch pipe, and the plurality of first spray holes in each row of the first spray holes are arranged in a row at intervals along the length direction of the branch pipe.

4. The electroplating device according to claim 3, characterized in that: At least one row of first injection holes respectively formed on the two side walls of each branch pipe correspond to each other in the height direction of the branch pipe, and the first injection holes at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe.

5. The electroplating device according to claim 3, characterized in that: The plurality of first injection holes form at least two rows on the side wall thereof along the height direction of the branch pipe, and two adjacent rows of first injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe.

6. The electroplating device according to claim 3, characterized in that: The plurality of first injection holes are arranged on the first side wall and the second side wall, and the first injection holes on the opposite side walls of two adjacent branch pipes are arranged alternately.

7. The electroplating device according to claim 2, characterized in that: The membrane frame further comprises a membrane frame side wall, an intermediate retaining wall and an intermediate channel are arranged in the middle of the membrane frame, the intermediate retaining wall defines an intermediate channel extending in a vertical direction, each branch pipe has a first end and a second end, the first end of each branch pipe is connected to the intermediate retaining wall, and the second end of each branch pipe is connected to the membrane frame side wall; wherein, A first groove is disposed at the bottom of the first end of each branch pipe, and / or a second groove is disposed at the bottom of the second end of each branch pipe.

8. The electroplating device according to claim 7, characterized in that: The side wall of the membrane frame is arranged to form a cathode cavity, and the membrane frame further comprises an outer ring retaining wall, which is arranged around the first end and the second end of the plurality of branch pipes and is used to separate the cathode cavity into at least two independent cathode areas; wherein, A third groove is arranged at the bottom of the connection between each branch pipe and the outer ring retaining wall.

9. The electroplating device according to claim 7 or 8, characterized in that: A through hole is also provided in each branch pipe, and the through hole communicates with the liquid supply channel and at least one of the first groove, the second groove or the third groove.

10. The electroplating device according to claim 8, characterized in that: The membrane frame further comprises reinforcing ribs, wherein the reinforcing ribs are connected between the outer ring retaining wall and the side wall of the membrane frame; wherein, A fourth groove is arranged at the bottom of the reinforcing rib.

11. The electroplating device according to claim 1, characterized in that: The film frame also includes: A plurality of second spray holes are used to discharge cathode liquid, wherein the liquid discharge direction of the second spray holes forms a second predetermined angle with the vertical upward direction, and the first predetermined angle and the second predetermined angle are both acute angles.

12. The electroplating device according to claim 11, characterized in that: The first predetermined angle is the same as the second predetermined angle.

13. The electroplating device according to claim 11, characterized in that: The membrane frame includes a plurality of branch pipes, each of which includes a liquid supply channel for providing cathode liquid and two opposite side walls, the two side walls include a first side wall and a second side wall, the plurality of first injection holes and the plurality of second injection holes are arranged on the first side wall and / or the second side wall, the liquid supply channel extends along the length direction of the branch pipe, and the plurality of first injection holes and the plurality of second injection holes are both connected to the liquid supply channel.

14. The electroplating device according to claim 13, characterized in that: The multiple first injection holes and the multiple second injection holes are respectively formed in at least one row on the side wall along the height direction of the branch pipe, and the multiple first injection holes in each row of the first injection holes are arranged in a row along the length direction of the branch pipe, and the multiple second injection holes in each row of the second injection holes are arranged in a row along the length direction of the branch pipe.

15. The electroplating device according to claim 14, characterized in that: On the same cross section of the branch pipe, the first injection hole and the second injection hole respectively located on different side walls of the branch pipe are coaxial.

16. The electroplating device according to claim 14, characterized in that: At least one row of first injection holes respectively formed on the two side walls of each branch pipe corresponds to each other in the height direction of the branch pipe, and at least one row of second injection holes respectively formed on the two side walls of each branch pipe corresponds to each other in the height direction of the branch pipe; and, The first injection holes located at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe; The second injection holes located at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe.

17. The electroplating device according to claim 14, characterized in that: The plurality of first spray holes and the plurality of second spray holes are respectively formed in at least two rows on the side walls where the branch pipes are located along the height direction of the branch pipes; Two adjacent rows of first injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe; Two adjacent rows of second injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe.

18. The electroplating device according to claim 14, characterized in that: On the same side wall of the branch pipe, a row of first spray holes and a row of second spray holes adjacent to each other in the height direction of the branch pipe are alternately arranged in the length direction of the branch pipe.

19. The electroplating device according to claim 14, characterized in that: The plurality of second injection holes are arranged on the first side wall and the second side wall, and the second injection holes on the opposite side walls of two adjacent branch pipes are arranged alternately.

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