Electronic device including antenna

Abstract

According to various embodiments, an electronic device comprises: a housing; a first substrate disposed in the housing; a second substrate arranged to face the first substrate; a conductive patch disposed on the second substrate; at least one conductive post located near the conductive patch on the second substrate; and a wireless communication circuit disposed on the first substrate and configured to transmit and / or receive wireless signals via the conductive patch, wherein one end of the at least one conductive post is positioned to be couplable to the conductive patch, and the other end can be electromagnetically connected to a ground layer of the first substrate.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] Electronic devices can communicate with external electronic devices using various wireless communication technologies. For example, the wireless communication technologies may include at least one of ultra-wideband (UWB) communication, wireless fidelity (Wi-Fi) communication, long-term evolution (LTE) communication, 5G communication (or new radio (NR) communication), or Bluetooth communication. The electronic device may include at least one antenna for using the above-described wireless communication technologies. Such an antenna may include a chip antenna including a conductive patch electrically connected to a substrate.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band ranging from about 600 MHz to 6000 MHz, a 5G antenna operating in a frequency band ranging from about 3 GHz to 300 GHz, or an antenna for measuring the location of an external electronic device located in close proximity. For example, the antenna for measuring the location of an external electronic device located in close proximity may include an ultra wide band (UWB) antenna comprising at least two antenna elements operating in a frequency band ranging from about 6 GHz to 8.5 GHz.

[0005] The UWB antenna can be operated at different frequency bands through at least three conductive patches arranged on a flexible substrate (e.g., FPCB, flexible printed circuit board), and by using this, angle off arrival (AOA) service can be provided to detect the position and / or distance of an external electronic device.

[0006] However, as electronic devices become increasingly slimmer, UWB antennas formed with FPCBs can become increasingly difficult to deploy due to their relatively high price and size. To address these issues, chip antennas (e.g., low-temperature co-fired ceramic (LTCC) antennas) are being deployed on printed circuit boards (PCBs), offering relatively high placement flexibility and low cost.

[0007] However, when chip antennas set to the same frequency band are applied to different devices by model, the same radiation performance should be exhibited, but the antenna characteristics may change depending on the density of electrical components or the arrangement conditions of surrounding structures (e.g., cover members made of high-k materials such as ceramics), resulting in deterioration of the radiation performance. Furthermore, setting (e.g., tuning) the operating frequency band may be difficult due to the characteristics of already manufactured chip antennas.

[0008] According to an exemplary embodiment of the present disclosure, an electronic device including an antenna configured to enable common use on a device-by-device basis through easy frequency change can be provided.

[0009] Various embodiments may provide an electronic device including an antenna whose frequency can be set relatively freely from the arrangement of surrounding electrical components.

[0010] Various embodiments may provide an electronic device including an antenna that may help slim down the electronic device by reducing the placement space.

[0011] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0012] According to various embodiments, an electronic device includes a housing, a first substrate disposed in the housing and including a first side and a second side facing in a direction opposite to the first side, a second substrate disposed on the first side and including a third side facing in the same direction as the first side and a fourth side facing the first side, a conductive patch disposed in a space between the third side and the fourth side or on the third side, at least one conductive post disposed between the conductive patch and the fourth side, and a wireless communication circuit disposed on the first substrate and configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive patch, wherein one end of the at least one conductive post is disposed at a position coupleable with the conductive patch, and the other end is electromagnetically connected to a ground layer of the first substrate.

[0013] A chip antenna according to exemplary embodiments of the present disclosure includes at least one conductive post arranged between a conductive patch and a substrate so as to be coupled to the conductive patch, and by adjusting a capacitance value between the conductive post and the ground of the substrate, the capacitance value between the conductive patch and the conductive post is adjusted together, thereby enabling an operating frequency band of the chip antenna to be easily set (e.g., tuned), and helping to secure improved design freedom from commonality of the chip antenna for each device and arrangement of peripheral electrical components.

[0014] In addition, various effects may be provided, either directly or indirectly, through this document.

[0015] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0016] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0017] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0018] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0020] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0021] FIG. 4A is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure.

[0022] FIG. 4b is a perspective view showing the rear side of a chip antenna according to various embodiments of the present disclosure.

[0023] FIG. 5A is a plan view of a portion of a first substrate equipped with a chip antenna according to various embodiments of the present disclosure.

[0024] FIG. 5b is a cross-sectional view of a portion of the first substrate taken along line 5b-5b of FIG. 5a according to various embodiments of the present disclosure.

[0025] FIG. 5c is another embodiment of FIG. 5b according to various embodiments of the present disclosure.

[0026] Figure 6a is a graph of a comparative example showing the frequency transition state of an antenna according to the replacement of a cover member corresponding to a chip antenna.

[0027] FIG. 6b is a graph illustrating a frequency transition state of an antenna including a conductive post according to replacement of a cover member according to various embodiments of the present disclosure.

[0028] FIGS. 7A to 7H are drawings illustrating a state in which a chip antenna including a conductive post according to various embodiments of the present disclosure is placed on a first substrate.

[0029] FIGS. 8A to 8F are drawings illustrating the arrangement structure of a conductive post between a conductive patch and a first substrate according to various embodiments of the present disclosure.

[0030] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), the sound output module (155), or the electronic device (101) and 450.

[0041] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) connected directly or wirelessly.

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0056] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include other embodiments of the electronic device.

[0057] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0059] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0060] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0061] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may also include a tray member arranged through at least a portion of the side bezel structure (218).

[0062] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0063] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0064] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0065] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0067] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). In one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0068] According to various embodiments, the electronic device (200) may include a chip antenna (300) disposed in an internal space and having a radiating signal formed generally in a direction (e.g., in the -z-axis direction) toward a rear plate (211) (e.g., a rear cover, a cover member, or a second cover). In one embodiment, the chip antenna (300) may include a conductive patch (e.g., the conductive patch (311) of FIG. 4A) and may be mounted on an internal substrate (e.g., the first substrate (240) of FIG. 3). In one embodiment, the chip antenna (300) may include a UWB antenna including one conductive patch. However, the present invention is not limited thereto, and the chip antenna (300) may also be configured to operate in various frequency bands. In one embodiment, the electronic device (200) can estimate the location and / or direction of the opposing electronic device through distance information measured while the electronic device (200) moves based on multivariate surveying used for positioning such as GPS for direction finding using a chip antenna (300) including a single conductive patch. In some embodiments, the chip antenna (300) may include a UWB antenna including at least three conductive patches as antenna elements. In this case, the electronic device (200) can support an AoA (angle of arrival) service that estimates the direction of the opposing electronic device by detecting a relative phase using the three conductive patches.

[0069] FIG. 3 is an exploded perspective view of the electronic device of FIGS. 2A and 2B according to various embodiments of the present disclosure.

[0070] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., the side bezel structure (218) of FIGS. 2A and 2B), an extension member (2181) (e.g., a bracket or a support member), a front plate (202) (e.g., a front cover), a display (201), a first substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or a support member), an antenna member (270), and a rear plate (211) (e.g., a rear cover or a cover member). In one embodiment, the side member (218), the front plate (202), and the rear plate (211) may be configured as a housing (e.g., the housing (210) of FIG. 2A) (e.g., a housing structure) that forms at least a portion of an internal space of the electronic device (200). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the extension member (2181) or the support bracket (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description will be omitted below.

[0071] According to various embodiments, the extension member (2181) may be disposed within the electronic device (200) and structurally coupled to the side member (218) or formed integrally with the side member (218). The extension member (2181) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The extension member (2181) may have a display (201) coupled to one surface and a first substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the first substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the display (201) may be disposed to be supported by the extension member (2181).

[0072] The memory may include, for example, volatile memory or non-volatile memory.

[0073] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0074] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (250) may be integrally disposed within the electronic device (200). In another embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0075] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (218) and / or the extension member (2181).

[0076] According to various embodiments, the electronic device (200) may include a chip antenna (300) mounted on a first substrate (240). In one embodiment, the chip antenna (300) may be electrically connected to the first substrate (240) and may be positioned such that a radiated signal is formed generally in a direction in which the rear plate (211) faces (e.g., the -z-axis direction). In one embodiment, the chip antenna (300) may be electrically connected to the first substrate (240) and may be fixed thereto by being soldered. In one embodiment, the chip antenna (300) may be configured to operate in at least one designated frequency band.

[0077] According to various embodiments, the chip antenna (30) may include a conductive patch (e.g., the conductive patch (311) of FIG. 5A) electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) disposed on a first substrate (240). In one embodiment, the chip antenna (300) may include at least one conductive post (e.g., the first conductive post (VP1) and / or the second conductive post (VP2) of FIG. 5A) disposed in an area overlapping the conductive patch (311) when the first substrate (240) is viewed from above. In one embodiment, the at least one conductive post (VP1, VP2) may be disposed such that one end is positioned to be coupleable with the conductive patch (311) and the other end is electromagnetically connected to a ground layer (e.g., a ground plane or ground) of the first substrate (240). For example, the other end of at least one conductive post (VP1, VP2) may be electrically connected to a ground layer of the first substrate (240) via a connecting member (e.g., solder, conductive tape, conductive contact, or conductive bonding) (e.g., connecting member (S) of FIG. 5B) when the chip antenna (300) is mounted on the first substrate (240). In some embodiments, the other end of at least one conductive post (VP1, VP2) may be arranged in such a way that it has a coupling distance with the ground layer of the first substrate (240) when the chip antenna (300) is mounted on the first substrate (240).

[0078] According to various embodiments, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in a designated frequency band via the conductive patch (311). In this case, the operating frequency band of the chip antenna (300) may be determined according to a capacitance value (e.g., a coupling amount) between one end of at least one conductive post (VP1, VP2) and the conductive patch (311). In one embodiment, the capacitance value between one end of at least one conductive post (VP1, VP2) and the conductive patch (311) may be determined through an electromagnetic connection structure between the other end of at least one conductive post (VP1, VP2) and the ground layer of the first substrate (240).

[0079] According to various embodiments, the first substrate (240) may be disposed in a space between the extension member (2181) of the side member (218) and the back plate (211). In one embodiment, the first substrate (240) is disposed such that a first side (e.g., a first side (2401) of FIG. 4A) faces the back plate (211), and a second substrate (e.g., a second substrate (310) of FIG. 4A) of the chip antenna (300) may be disposed between the first substrate (240) and the back plate (211), such that a third side (e.g., a third side (3101) of FIG. 4A) of the second substrate (310) faces the back plate (211). In one embodiment, the back plate (211) may be formed of a glass material or a ceramic material. In one embodiment, the display (201) may be positioned between the extension member (2181) of the side member (218) and the front plate (202) so as to be visible from the outside through at least a portion of the front plate (202).

[0080] According to exemplary embodiments of the present disclosure, a chip antenna (300) can relatively easily induce a frequency shift according to a capacitance value between a conductive post (VP1, VP2) and a conductive patch (311) determined through an electromagnetic connection structure between at least one conductive post (VP1, VP2) and a ground layer of a first substrate (240), thereby helping to commonize the chip antenna (300) for each device, and can enable a design that is relatively free from the arrangement of peripheral electrical components. Moreover, when the rear plate (211) (e.g., cover member) corresponding to the chip antenna (300) is changed from a high-k material (e.g., ceramic material) to a relatively low-k material (e.g., glass or injection-molded material), or vice versa, the frequency fluctuation range of the chip antenna (300), which fluctuates relatively greatly, is reduced through a change in the electrical connection structure between at least one conductive post (VP1, VP2) and the ground layer of the first substrate (240), thereby helping to improve the radiation performance of the chip antenna (300).

[0081] FIG. 4A is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure. FIG. 4B is a perspective view showing the rear surface of a chip antenna according to various embodiments of the present disclosure.

[0082] Referring to FIGS. 4A and 4B, an electronic device (e.g., the electronic device (200) of FIG. 3) may include a chip antenna (300) as a first substrate (240) disposed in an internal space and a second substrate (310) (or antenna structure) mounted on the first substrate (240). In one embodiment, the first substrate (240) may include a first surface (2401), a second surface (2402) facing in an opposite direction to the first surface (2401), and a side surface (2403) surrounding a space between the first surface (2401) and the second surface (2402). In one embodiment, the second substrate (310) may include a third surface (3101) facing in the same direction as the first surface (2401), and a fourth surface (3102) facing in an opposite direction to the third surface (3101) and facing the first surface (2401). Accordingly, when the second substrate (310) is mounted on the first substrate (240), the fourth surface (3102) of the second substrate (310) may be in contact with the first surface (2401) of the first substrate (240). In one embodiment, the first substrate (240) may be formed of, for example, a flame retardant 4 (FR4) material. In one embodiment, the second substrate (310) may be formed of, for example, a ceramic material. In one embodiment, the second substrate (310) may include a conductive patch (311) as an antenna element. In one embodiment, the conductive patch (311) may be exposed on the third surface (3101) or may be disposed in a space between the third surface (3101) and the fourth surface (3102). In some embodiments, the conductive patch (311) may be replaced with two or more conductive patches.

[0083] According to various embodiments, the first substrate (240) may include a first plurality of connection pads (CP1) disposed on the first surface (2401) in an area overlapping the second substrate (310) when the first surface (2401) is viewed from above. In one embodiment, the first plurality of connection pads (CP1) may be disposed in such a way that they are exposed to the first surface (241) of the first substrate (240). In one embodiment, the second substrate (310) may include a second plurality of connection pads (CP2) disposed in such a way that they are exposed to the fourth surface (3102) and positioned to correspond to each of the first plurality of connection pads (CP1). In one embodiment, the second plurality of connection pads (CP2) may be disposed in such a way that they are exposed to the fourth surface (3102) of the second substrate (310). In one embodiment, when the second substrate (310) is mounted on the first substrate (240), each of the first plurality of connection pads (CP1) faces each of the second plurality of connection pads (CP2), and at least some of the first plurality of connection pads (CP1) can be electrically connected to the corresponding second plurality of connection pads (CP2) through a connection member. In one embodiment, the connection member can include at least one of solder, a conductive tape, a conductive contact, or a conductive bonding.

[0084] According to various embodiments, the conductive patch (311) may be electrically connected to a wireless communication circuit (e.g., a wireless communication circuit (192) of FIG. 5b) disposed on the first substrate (240) through an electrical connection (e.g., a power supply) between at least one connection pad (e.g., a first power supply pad (243) of FIG. 5b) of the first plurality of connection pads (CP1) and at least one connection pad (e.g., a second power supply pad (313) of FIG. 5b) of the second plurality of connection pads (CP2).

[0085] According to various embodiments, the first substrate (240) may be formed of a material (e.g., FR4) having a first permittivity (e.g., a permittivity of about 4 to 10) (e.g., a relative permittivity). In one embodiment, the second substrate (310) may be formed of a material (e.g., ceramic) having a second permittivity (e.g., a permittivity of about 30 to 40) (e.g., a relative permittivity) higher than the first permittivity. For example, the second substrate (310) including the conductive patch (311) as an antenna element may be designed to be a high-k dielectric, thereby helping to miniaturize the chip antenna (300).

[0086] According to various embodiments, it may be difficult to set the operating frequency band of the already manufactured chip antenna (300) due to its characteristics. For example, when a chip antenna (300) manufactured to operate in a specific frequency band is applied to different electronic devices, the operating frequency band of the chip antenna may be unintentionally shifted for each electronic device due to the density or arrangement structure of surrounding electrical components (e.g., electrical elements, shield cans, and / or connectors), thereby reducing radiation performance. In addition, when a cover member facing the chip antenna (300) (e.g., the cover member (211) of FIG. 4A) is replaced with a cover member made of a material with a different permittivity, the radiation performance may deteriorate due to a large variation in the operating frequency band of the already manufactured chip antenna (300).

[0087] According to exemplary embodiments of the present disclosure, the chip antenna (300) can help improve radiation performance by reducing the frequency fluctuation of the chip antenna (300), which was relatively large, by inducing a frequency shift relatively easily according to a capacitance value between at least one conductive post (VP1, VP2) and a conductive patch (311) determined through an electromagnetic connection structure between at least one conductive post (VP1, VP2) and a ground layer of a first substrate (240).

[0088] FIG. 5A is a plan view of a portion of a first substrate equipped with a chip antenna according to various embodiments of the present disclosure.

[0089] Referring to FIG. 5A, an electronic device (e.g., the electronic device (200) of FIG. 3) may include a first substrate (240) disposed in an internal space and a chip antenna (300) disposed on a first surface (2401) of the first substrate (240). In one embodiment, the chip antenna (300) may include a second substrate (310) mounted on the first surface (2401) of the first substrate (240) and electrically connected to the first substrate (240). In one embodiment, the chip antenna (300) may include a conductive patch (311) having a rectangular shape (e.g., a rectangle) disposed on the second substrate (310). In one embodiment, the conductive patch (311) may include a first side (311a) having a first length (e.g., a first edge or first edge) and a second side (311b) extending in a direction perpendicular to the first side (311a) and having a second length longer than the first length (e.g., a second edge or second edge).

[0090] According to various embodiments, the chip antenna (300) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) via a feed portion (F) (e.g., a feed point) positioned at a first point (L1) other than the center (C) of the conductive patch (311) when the first surface (2401) is viewed from above. In one embodiment, the chip antenna (300) may include at least one conductive post (VP1, VP2) positioned under the conductive patch (311) at a position spaced apart from the first point (L1). In one embodiment, at least one conductive post (VP1, VP2) may include a first conductive post (VP1) positioned at a second point (L2) spaced apart from a first point (L1) when the first side (2401) is viewed from above, and a second conductive post (VP2) positioned at a third point (L3) spaced apart from the first point (L1) and the second point (L2). In one embodiment, the first conductive post (VP1) may be positioned at a second point (L2) that is located at a distance from the first point (L1) further than the center (C) on a first imaginary line (EL1) that passes through the center (C) and is parallel to the first side (311a) when the first side (2401) is viewed from above, with the center (C) therebetween. In one embodiment, the second conductive post (VP2) may be positioned at a third point (L3) located at a distance further from the first point (L1) than the center, with the center (C) interposed between the second imaginary line (EL2) passing through the center (C) and parallel to the second side (311b) when the first surface (2401) is viewed from above.

[0091] According to various embodiments, the electronic device (200) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a first substrate (240). In one embodiment, the wireless communication circuit (192) may be electrically connected to a conductive patch (311) via a feeding portion (F). In one embodiment, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in at least one frequency band via the conductive patch (311) of the chip antenna (300). In one embodiment, the chip antenna (300) may be configured as an antenna operating in a dual band (e.g., a single-feed dual-band antenna). For example, the wireless communication circuit (192) may be configured to operate in a first frequency band via a first polarization resonating along a direction parallel to a first side (311a) of the conductive patch (311). In this case, the first frequency band may be influenced by a first conductive post (VP1) arranged along a first virtual line (EL1) parallel to the first side (311a) and overlapping so as to be coupled with the conductive patch (311). For example, the first frequency band may be determined through a capacitance value between the conductive patch (311) and the first conductive post (VP1). In one embodiment, the wireless communication circuit (192) may be configured to operate in a second frequency band lower than the first frequency band through a second polarization that resonates along a direction parallel to the second side (311b) of the conductive patch (311). In this case, the second frequency band may be influenced by a second conductive post (VP2) arranged along a second virtual line (EL2) parallel to the second side (311b) and overlapping so as to be coupled with the conductive patch (311). For example, the second frequency band may be determined through a capacitance value between the conductive patch (311) and the second conductive post (VP2). In one embodiment, the first frequency band may include a frequency band (e.g., Ch 9) in the range of about 7.75 GHz to 8.25 GHz.In one embodiment, the second frequency band may include a frequency band in the range of about 6.25 GHz to 6.75 GHz (e.g., Ch 5).

[0092] According to various embodiments, at least one conductive post (VP1, VP2) may be positioned so as to at least partially overlap the conductive patch (311) when the first side (2401) is viewed from above. In one embodiment, at least one conductive post (VP1, VP2) (e.g., the sub-patch (3122) of FIG. 5B) may be formed to have a smaller area than the conductive patch (311) when the first side (2401) is viewed from above. In one embodiment, either the first conductive post (VP1) or the second conductive post (VP2) may be omitted.

[0093] FIG. 5B is a cross-sectional view of a portion of the first substrate taken along line 5B-5B of FIG. 5A according to various embodiments of the present disclosure. FIG. 5C is another embodiment of FIG. 5B according to various embodiments of the present disclosure.

[0094] Referring to FIGS. 5B and 5C , an electronic device (e.g., the electronic device (200) of FIG. 3 ) may include a first substrate (240) including a first surface (2401) and a second surface (2402) facing in an opposite direction from the first surface (2401), and a chip antenna (300) disposed on the first surface (2401) of the first substrate (240). In one embodiment, the chip antenna (300) may include a second substrate (310) including a third surface (3101) facing in the same direction as the first surface (2401) and a fourth surface (3102) facing in an opposite direction from the third surface (3101) and facing the first surface (2401), and a conductive patch (311) disposed to be exposed between the third surface (3101) and the fourth surface (3102) or through the third surface (3101). In one embodiment, the chip antenna (300) may be arranged in such a manner that a first plurality of connection pads (e.g., the first plurality of connection pads (CP1) of FIG. 4A) exposed on a first surface (2401) of a first substrate (240) and a second plurality of connection pads (e.g., the second plurality of connection pads (CP2) of FIG. 4B) exposed on a fourth surface (3102) of a second substrate (310) are electrically connected and fixed through a connection member (S) (e.g., solder) after they are brought into contact.

[0095] According to various embodiments, the first substrate (240) may include a first feed pad (243) exposed on the first surface (2401). The first feed pad (243) may be at least one of the first plurality of connection pads (CP1). In one embodiment, the first feed pad (243) may be electrically connected to a wireless communication circuit (192) disposed on the second surface (2402) through a first conductive via (CV1) and a wiring (1921) (e.g., a trace) disposed to penetrate a plurality of layers (2404) (e.g., an insulating layer) between the first surface (2401) and the second surface (2402). In some embodiments, the wireless communication circuit (192) may be disposed on the first surface (2401) of the first substrate (240) so as to be spaced apart from the chip antenna (300). In one embodiment, the second substrate (310) may include a second feed pad (313) that is exposed on the fourth surface (3102) and electrically connected to a conductive patch (311) through a second conductive via (CV2). In one embodiment, a corresponding portion of the conductive patch (311) connected to the second conductive via (CV2) may include a feed portion (e.g., feed portion (F) of FIG. 5A). In one embodiment, the second feed pad (313) may be at least one of the second plurality of connection pads (CP2). In one embodiment, when the chip antenna (300) is mounted on the first substrate (240), the first feed pad (243) may be electrically connected to the second feed pad (313) through a connecting member (S) (e.g., solder), and a fixing force may be provided. In one embodiment, a wireless communication circuit (192) disposed on a first substrate (240) may be electrically connected to a conductive patch (311) through a wiring (1921), a first conductive via (CV1), a first power supply pad (243), a connecting member (S), a second power supply pad (313), and a second conductive via (CV2).

[0096] According to various embodiments, the first substrate (240) may include at least one first conductive layer (241) disposed in a plurality of layers (2403). In one embodiment, the at least one first conductive layer (241) may include a ground layer (e.g., a ground plane) of the first substrate (240). In one embodiment, the second substrate (310) may include a second conductive layer (341) disposed between the third side (3101) and the fourth side (3102) or exposed on the fourth side (3102). In one embodiment, the second conductive layer (341) may be applied as a ground layer (e.g., a ground plane) for the conductive patch (311). In one embodiment, when at least one first conductive layer (241) is formed of a plurality of conductive layers, some of the conductive layer(s) may not be exposed to the first surface (2401) of the first substrate (240) and may be disposed on some of the layers (2404). In one embodiment, when the chip antenna (300) is mounted on the first substrate (240), the first conductive layer (241) may be electrically connected to the second conductive layer (341) through a connecting member (S) (e.g., solder) to provide fixing force. In one embodiment, the first conductive layer (241) and the second conductive layer (341) may be electrically connected to each other in a manner in which at least one pad of the first plurality of connecting pads (CP1) and at least one pad of the second plurality of connecting pads (CP2) are electrically connected through the connecting member (S).

[0097] According to various embodiments, the chip antenna (300) may include a first conductive post (VP1) disposed in a space between the conductive patch (311) and the fourth face (3102). In one embodiment, the first conductive post (VP1) may be disposed at a position overlapping the conductive patch (311) when the first face (2401) is viewed from above. In one embodiment, the first conductive post (VP1) may include a conductive via (3121) disposed in a space between the third face (3101) and the fourth face (3102), a sub-patch (3122) connected to one end of the conductive via (3121) and disposed to have a separation distance (d1) that is coupleable with the conductive patch (311), and a conductive pad (3123) connected to the other end of the conductive via (3121) and disposed to be exposed to the fourth face (3102). In one embodiment, the conductive pad (3123) may be electrically and physically connected to the first conductive layer (241) (e.g., the ground layer) through a connecting member (S). In this case, the conductive pad (3123) may be, for example, one of the second plurality of connecting pads (CP2). In some embodiments, the conductive pad (3123) may be positioned so as not to be exposed to the fourth surface (3102), in which case the connecting member (S) may be unnecessary and positioned so as to be coupleable with the first conductive layer (241). In some embodiments, the conductive pad (3123) may be omitted, in which case at least a portion of the conductive via (3121) may be positioned so as to be coupleable with the first conductive layer (241).

[0098] According to various embodiments, the sub-patch (3122) may be positioned to overlap and couple with the conductive patch (311) when the first side (2401) is viewed from above. In one embodiment, the sub-patch (3122) may be formed to have a surface parallel to the surface of the conductive patch (311). In one embodiment, the sub-patch (3122) may be formed in various shapes and / or various sizes, such as a square or a circle, when the first side (2401) is viewed from above.

[0099] According to various embodiments, the operating frequency band of the chip antenna (300) may be determined according to the capacitance value (e.g., coupling amount) between the conductive patch (311) and the sub-patch (3121). In one embodiment, the operating frequency band of the chip antenna (300) may vary depending on the capacitance value between the conductive patch (311) and the sub-patch (3121). For example, as the capacitance value increases, the frequency band may be low-shifted, and as the capacitance value decreases, the frequency band may be high-shifted. In one embodiment, the operating frequency band of the chip antenna (300) may be determined through the separation distance between the conductive patch (311) and the sub-patch (3121). In one embodiment, the operating frequency band of the chip antenna (300) may be determined through the coupling area between the conductive patch (311) and the sub-patch (3121).

[0100] According to various embodiments, the operating frequency band of the chip antenna (300) can be determined through the electromagnetic connection structure between the conductive pad (3123) and the first conductive layer (241). For example, a change in the electromagnetic connection structure between the conductive pad (3123) and the first conductive layer (241) can induce a change in the capacitance value between the conductive patch (311) and the sub-patch (3121). In one embodiment, as shown in FIG. 5c, when the conductive pad (3123) is coupled to the first conductive layer (241) through a specific separation distance (d2) without a connecting member (S), the capacitance value between the sub-patch (3122) and the conductive patch (311) can be reduced. In one embodiment, when the conductive pad (3123) is physically contacted and electrically connected to the first conductive layer (241) through the connecting member (S), the capacitance value between the sub patch (3122) and the conductive patch (311) can be relatively increased.

[0101] According to exemplary embodiments of the present disclosure, a chip antenna (300) can relatively easily induce a frequency shift according to a capacitance value between a first conductive post (VP1) and a conductive patch (311) determined through an electromagnetic connection structure between a conductive pad (3123) of a first conductive post (VP1) and a first conductive layer (e.g., a ground layer) of a first substrate (240), thereby helping to commonize the chip antenna (300) for each device, and can enable a design that is relatively free from the arrangement of peripheral electrical components. Moreover, when the cover member corresponding to the chip antenna (300) (e.g., the rear plate (211) of FIG. 3) is changed from a high-k material (e.g., a ceramic material) to a relatively low-k material (e.g., glass or an injection-molded material), or from a low-k material to a high-k material, the frequency fluctuation range of the chip antenna (300), which was relatively large, is reduced through a change in the electromagnetic connection structure between the first conductive post (VP1) and the first conductive layer of the first substrate (240), thereby helping to improve the radiation performance of the chip antenna (300).

[0102] Although not shown, the arrangement structure of the conductive patch (311) and the second conductive post (e.g., the second conductive post (VP2) of FIG. 5a) can also be applied substantially identically to the arrangement structure of the conductive patch (311) and the first conductive post (VP1).

[0103] FIG. 6a is a comparative graph illustrating the frequency transition state of an antenna according to the replacement of a cover member corresponding to a chip antenna. FIG. 6b is a graph illustrating the frequency transition state of an antenna including a conductive post according to the replacement of a cover member according to various embodiments of the present disclosure.

[0104] Referring to FIG. 6A, the chip antenna (300) may be arranged to form a radiated signal through the cover member (211) of the electronic device (200). For example, when the cover member (211) is replaced from a cover member made of a glass material (e.g., graph 601) to a cover member made of a ceramic material, which is a relatively high-k material (e.g., graph 602), it can be confirmed that the frequency band of the chip antenna (300) is low-shifted in the first frequency band from about 7.88 GHz to about 7.62 GHz with a fluctuation range of about 260 MHz, and is low-shifted in the second frequency band from about 6.41 GHz to about 6.27 GHz with a fluctuation range of about 140 MHz. Such excessive frequency fluctuation range may mean that the radiation performance of the chip antenna is significantly reduced when a cover member made of a material with a different permittivity is replaced while the chip antenna is arranged.

[0105] Referring to FIG. 6B, when the cover member (211) is replaced from a cover member made of a glass material (e.g., graph 603) to a cover member made of a ceramic material, which is a relatively high-k material (e.g., graph 604), it can be confirmed that the frequency band of the chip antenna (300) is low-shifted in the first frequency band from about 8.02 GHz to about 7.97 GHz with a fluctuation range of about 50 MHz, and is high-shifted in the second frequency band from about 6.52 GHz to about 6.50 GHz with a fluctuation range of about -20 MHz. This may mean that when the capacitance value between at least one conductive post (VP1, VP2) and the conductive patch (311) according to an exemplary embodiment of the present disclosure is appropriately adjusted, the frequency band of the chip antenna (300) is reduced in frequency fluctuation range despite the replacement of the cover member (311) having different permittivities, thereby improving the radiation performance of the chip antenna (300).

[0106] For example, when the cover member (211) made of glass applied to the electronic device (200) is changed to a cover member (211) made of ceramic material having a relatively high permittivity, the operating frequency band of the chip antenna (300) may be low-shifted with a large fluctuation range. In this case, when the direct electrical connection (shorted) is changed to an indirect electrical connection (capacitively coupled) by removing the connection member (S) arranged between at least one conductive post (VP1, VP2) and the first conductive layer (241) (e.g., ground layer) of the first substrate (240), the capacitance value between the at least one conductive post (VP1, VP2) and the conductive patch (311) is reduced, thereby inducing a high shift in frequency, and as a result, the operating frequency band of the antenna may have a relatively small fluctuation range. This may mean that even if structures with different permittivities that may affect the antenna (e.g., cover members) are replaced, or peripheral conductive structures with different arrangement structures for each device are placed around the chip antenna, the chip antenna (300) can be set to have a relatively small frequency fluctuation range by adjusting the capacitance value between at least one conductive post (VP1, VP2) and the conductive patch (311), thereby helping to improve radiation performance.

[0107] FIGS. 7A to 7H are drawings illustrating a state in which a chip antenna including a conductive post according to various embodiments of the present disclosure is placed on a first substrate.

[0108] In explaining the arrangement structure of the conductive post of FIGS. 7a to 7h, the same symbols are given to components that are substantially the same as the arrangement structure of the conductive post (VP1) of FIGS. 5b and 5c, and a detailed description thereof may be omitted.

[0109] According to various embodiments, the chip antenna can be induced to have a relatively small frequency fluctuation range despite changes in the surrounding environment (e.g., placement near different conductive structures for each device, or replacement of cover elements with different permittivity) through at least one conductive post (VP-1, VP-2, VP-3, VP-4, VP-5, VP-6, VP-7) having various arrangements as presented through FIGS. 7a to 7h, thereby helping to improve radiation performance.

[0110] Referring to FIG. 7A, the chip antenna (300) may include at least one conductive post (VP-1, VP-2) having one end coupled to a conductive patch (311) and the other end electromagnetically connected to a first conductive layer (241) (e.g., a ground layer) of a first substrate (240). In one embodiment, the at least one conductive post (VP-1, VP-2) may include a first conductive post (VP-1) overlapping the conductive patch (311) and a second conductive post (VP-2) spaced apart from the first conductive post (VP-1) when the first surface (2401) is viewed from above. In one embodiment, the first conductive post (VP-1) may include a conductive via (3121), a sub-patch (3122) connected to one end of the conductive via (3121) and positioned so as to be coupled with the conductive patch (311), and a conductive pad (3123) connected to the other end of the conductive via (3121) and positioned so as to be coupled with the first conductive layer (241) of the first substrate (240). In some embodiments, the conductive pad (3123) may be in physical contact with the first conductive layer (241) by a connecting member (e.g., the connecting member (S) of FIG. 5B). In one embodiment, the second conductive post (VP-2) may also have substantially the same arrangement structure as the first conductive post (VP-1).

[0111] Referring to FIG. 7b, in the configuration of FIG. 7a, the conductive via (3121) of the first conductive post (VP-1) and the conductive via (3121) of the second conductive post (VP-2) may be connected through one conductive pad (3123-1).

[0112] Referring to FIG. 7c, a conductive post (VP-3) may be configured such that two spaced-apart conductive vias (3121, 3121-1) are arranged at one end and are commonly connected to one sub-patch (3122-1) positioned so as to be coupled with the conductive patch (311), and are arranged at the other end and are commonly connected to one conductive pad (3123-1) that is electromagnetically connected to the first conductive layer (241) of the first substrate (240).

[0113] Referring to FIG. 7D, the conductive post (VP-4) may include a first conductive via (3121), a first sub-patch (3122) disposed at one end of the first conductive via (3121), and a conductive pad (3123) disposed at the other end of the first conductive via (3121) and electromagnetically connected to the first conductive layer (241) of the first substrate (240). In one embodiment, the conductive post (VP-4) may include a second conductive via (3121-1) electrically connected to the first sub-patch (3122), and a second sub-patch (3122-1) connected to one end of the second conductive via (3121-1) and positioned so as to be coupleable with the conductive patch (311). In one embodiment, the second sub-patch (3122-1) may be positioned so as to at least partially overlap the first sub-patch (3122) when the first surface (2401) is viewed from above. In one embodiment, the first sub-patch (3122) and the second sub-patch (3122-1) may have substantially the same shape and / or size. In some embodiments, the first sub-patch (3122) and the second sub-patch (3122-1) may have different shapes and / or sizes.

[0114] Referring to FIG. 7e, the conductive post (VP-5) may include a first conductive via (3121), a first sub-patch (3122) disposed at one end of the first conductive via (3121), and a conductive pad (3123) disposed at the other end of the first conductive via (3121) and electromagnetically connected to the first conductive layer (241) of the first substrate (240). In one embodiment, the conductive post (VP-5) may include a second conductive via (3121-1) electrically connected to the first sub-patch (3122), and a second sub-patch (3122-1) connected to one end of the second conductive via (3121-1). In one embodiment, the conductive post (VP-5) may include a third conductive via (3121-2) electrically connected to the second sub-patch (3122-1) and a third sub-patch (3122-2) connected to one end of the third conductive via (3121-2) and positioned so as to be coupleable with the conductive patch (311). In one embodiment, the second sub-patch (3122-1) and / or the third sub-patch (3122-2) may be positioned so as to at least partially overlap the first sub-patch (3122) when the first surface (2401) is viewed from above. In one embodiment, the first sub-patch (3122) and / or the second sub-patch (3122-1) and / or the third sub-patch (3122-2) may have substantially the same shape and / or size. In some embodiments, the first sub-patch (3122) and / or the second sub-patch (3122-1) and / or the third sub-patch (3122-2) may have different shapes and / or sizes.

[0115] Referring to FIG. 7f, the conductive post (VP-6) may further include an additional sub-patch (3122-1) connected to the top of the sub-patch (3122) through an additional conductive via (3121-2) in the configuration of FIG. 7c and arranged to be coupled with the conductive patch (311).

[0116] Referring to FIG. 7g, the conductive post (VP-7) may further include an additional sub-patch (3122-3) that is arranged to be coupled to the sub-patch (3122) through an additional conductive via (3121-3) extending from the conductive patch (311) between the conductive patch (311) and the sub-patch (3122) in the configuration in which the first conductive post (VP-1) of FIG. 7a is arranged.

[0117] Referring to FIG. 7h, the first substrate (240) may include a first conductive via (CV3) disposed on a layer (2404) and connected to a conductive post (VP-1) and a connecting member (S). In one embodiment, the first conductive via (CV3) may be configured to be insulated from the surrounding electrical structure and in a floating state. In one embodiment, the first substrate (240) may include a second conductive via (CV4) electrically connected to the first conductive layer (241) (e.g., a ground layer) at a location spaced apart from the first conductive via (CV3). In one embodiment, the first substrate (240) may include a variable circuit (T) (e.g., a matching circuit) disposed in an electrical path connecting the first conductive via (CV3) and the second conductive via (CV4) on the second surface (2402). In one embodiment, the variable circuit (T) may include a switch and a plurality of passive elements (e.g., capacitors and / or inductors) that are selectively connected to the switch and have different element values. In one embodiment, the chip antenna (300) may be assisted in easily shifting the operating frequency band by applying at least one of the plurality of passive elements as a matching circuit through switch control of a processor (e.g., processor (120) of FIG. 1).

[0118] FIGS. 8A to 8F are drawings illustrating the arrangement structure of a conductive post between a conductive patch and a first substrate according to various embodiments of the present disclosure.

[0119] In explaining the arrangement structure of the conductive posts of FIGS. 8A to 8F, the same symbols are given to components that are substantially the same as the arrangement structure of the conductive posts (VP1, VP2) of FIG. 5A, and a detailed description thereof may be omitted.

[0120] Referring to FIG. 8A, the chip antenna (300) may include a second substrate (310) mounted on a first substrate (240) and a rectangular conductive patch (311) disposed on the second substrate (310). The conductive patch may include a first side (311a) and a second side (311b) extending in a direction perpendicular to the first side (311a) and having a longer length than the first side (311a). In one embodiment, the chip antenna (300) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) via a feeding portion (F) (e.g., a feeding point) positioned at a first point (L1) other than the center (C) of the conductive patch (311) when the first surface (2401) is viewed from above. In one embodiment, the first point (L1) may be positioned on a first virtual line (EL1) that is parallel to the first side (311a) and passes through the center (C).

[0121] According to various embodiments, the chip antenna (300) may include a conductive post (VP) positioned at a distance from a first point (L1) below the conductive patch (311). In one embodiment, the conductive post (VP) may be positioned at a second point (L2) located at a distance from the first point (L1) further than the center (C) on a first virtual line (EL1) with the center (C) interposed therebetween when the first surface (2401) is viewed from above.

[0122] Referring to FIG. 8b, the chip antenna (300) can be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) through a feeding portion (F) (e.g., a feeding point) located at a first point (L1) other than the center (C) of the conductive patch (311) when the first side (2401) is viewed from above. In one embodiment, the first point (L1) can be arranged on a second virtual line (EL2) that is parallel to the second side (311b) and passes through the center (C).

[0123] According to various embodiments, the chip antenna (300) may include a conductive post (VP) positioned at a distance from the first point (L1) below the conductive patch (311). In one embodiment, the conductive post (VP) may be positioned at a second point (L2) located at a distance from the first point (L1) further than the center (C) on a second virtual line (EL2) with the center (C) interposed therebetween when the first surface (2401) is viewed from above.

[0124] Referring to FIG. 8C, the chip antenna (300) may include a second substrate (310) mounted on a first substrate (240) and a rectangular conductive patch (311) disposed on the second substrate (310). The conductive patch may include a first side (311a) and a second side (311b) extending in a direction perpendicular to the first side (311a) and having the same length as the first side (311a). In one embodiment, the chip antenna (300) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) via a feeding portion (F) (e.g., a feeding point) positioned at a first point (L1) other than the center (C) of the conductive patch (311) when the first surface (2401) is viewed from above. In one embodiment, the first point (L1) may include points excluding a first virtual line (EL1) that is parallel to the first side (311a) and passes through the center (C) and a second virtual line (EL2) that is parallel to the second side (311b) and passes through the center (C).

[0125] According to various embodiments, the chip antenna (300) may include a conductive post (VP) positioned at a distance from the first point (L1) below the conductive patch (311). In one embodiment, the conductive post (VP) may be positioned at a second point (L2) located at a distance from the first point (L1) further than the center (C) with the center (C) interposed therebetween when the first surface (2401) is viewed from above.

[0126] Referring to FIG. 8d, the chip antenna (300) may include a second substrate (310) mounted on a first substrate (240) and a rectangular conductive patch (311) disposed on the second substrate (310). The conductive patch may include a first side (311a) and a second side (311b) extending in a direction perpendicular to the first side (311a) and having a longer length than the first side (311a). In one embodiment, the chip antenna (300) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) via a first feed portion (F1) (e.g., a first feed point) positioned at a first point (L1) other than the center (C) of the conductive patch (311) when the first surface (2401) is viewed from above. In one embodiment, the chip antenna (300) may be electrically connected to the wireless communication circuit (192) via a second feed portion (F2) (e.g., a second feed point) located at a center (C) of the conductive patch (311) and a second point (L2) other than the first point (L1) when the first surface (2401) is viewed from above. In one embodiment, the first point (L1) may be arranged on a first virtual line (EL1) that is parallel to the first side (311a) and passes through the center (C). In one embodiment, the second point (L2) may be arranged on a second virtual line (EL2) that is parallel to the second side (311b) and passes through the center (C).

[0127] According to various embodiments, the chip antenna (300) may include a first conductive post (VP1) spaced apart from a first point (L1) and a second conductive post (VP2) spaced apart from the first point (L1) and the first conductive post (VP1) under the conductive patch (311). In one embodiment, the first conductive post (VP1) may be disposed at a third point (L3) located further from the first point (L1) than the center (C) on a first virtual line (EL1) when the first surface (2401) is viewed from above, with the center (C) interposed therebetween. In one embodiment, the second conductive post (VP2) may be disposed at a fourth point (L4) located further from the second point (L2) than the center (C) on a second virtual line (EL2) when the first surface (2401) is viewed from above.

[0128] According to various embodiments, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in a first frequency band via a conductive patch (311) and a first conductive post (VP1) coupled to the conductive patch (311). In one embodiment, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in a second frequency band lower than the first frequency band via a conductive patch (311) and a second conductive post (VP2) coupled to the conductive patch (311).

[0129] Referring to FIG. 8e, in the configuration of FIG. 8d, the second conductive post (VP2) that can affect the second frequency band of the chip antenna (300) may be omitted.

[0130] Referring to FIG. 8f, in the configuration of FIG. 8d, the first conductive post (VP1) that can affect the first frequency band of the chip antenna (300) may be omitted.

[0131] According to various embodiments, an electronic device includes a housing (e.g., a housing (210) of FIG. 2A), a first substrate (e.g., a first substrate (240) of FIG. 4A) disposed in the housing and including a first side (e.g., a first side (2401) of FIG. 4A) and a second side (e.g., a second side (2402) of FIG. 4A) facing the first side, a second substrate (e.g., a second substrate (310) of FIG. 4A) disposed on the first side and including a third side (e.g., a third side (3101) of FIG. 4A) facing the same direction as the first side, and a fourth side (e.g., a fourth side (3102) of FIG. 4A) facing the first side, a conductive patch (e.g., a conductive patch (311) of FIG. 4A) disposed in a space between the third side and the fourth side or on the third side, and a conductive patch and the At least one conductive post (e.g., the first conductive post (VP1) of FIG. 5a) disposed between the fourth surfaces and a wireless communication circuit (e.g., the wireless communication circuit (192) of FIG. 5b) disposed on the first substrate and configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive patch, wherein one end of the at least one conductive post is disposed at a position that can be coupled with the conductive patch, and the other end can be electromagnetically connected to a ground layer of the first substrate (e.g., the first conductive layer (241) of FIG. 5b).

[0132] According to various embodiments, the at least one conductive post may include a conductive via (e.g., a conductive via (3121) of FIG. 5b), a sub-patch (e.g., a sub-patch (3122) of FIG. 5b) connected to a first end of the conductive via, and a conductive pad (e.g., a conductive pad (3123) of FIG. 5b) connected to a second end of the conductive via and exposed on the fourth surface, and one end of the at least one conductive post may include the sub-patch and the other end may include the conductive pad.

[0133] According to various embodiments, the conductive pad and the ground layer of the first substrate can be spaced apart so as to be coupled.

[0134] According to various embodiments, the conductive pad and the ground layer of the first substrate may be in direct contact through a connecting member (e.g., a connecting member (S) of FIG. 5b).

[0135] According to various embodiments, the connecting member may include solder, conductive tape, or conductive contact that physically and electrically connects the conductive pad to the ground layer of the first substrate.

[0136] According to various embodiments, the sub-patch may be positioned at a position overlapping the conductive patch when the first side is viewed from above.

[0137] According to various embodiments, the sub-patch may have a smaller area than the conductive patch.

[0138] According to various embodiments, the at least one frequency band may be determined through at least one of an area of ​​the sub-patch or a separation distance between the conductive patch and the sub-patch.

[0139] According to various embodiments, the capacitance value between the conductive patch and the sub-patch can be determined through an electromagnetic connection structure between the conductive pad and the ground layer.

[0140] According to various embodiments, the at least one conductive post may be positioned at a position overlapping the conductive patch when the first side is viewed from above.

[0141] According to various embodiments, the housing includes a front cover (e.g., a front plate (202) of FIG. 3), a rear cover facing in an opposite direction to the front cover (e.g., a rear plate (211) of FIG. 3), and a side member (e.g., a side member (218) of FIG. 3) surrounding a space between the front cover and the rear cover, and the first substrate and the second substrate can be disposed in the space between the side member and the rear cover.

[0142] According to various embodiments, the first substrate may be positioned in the space such that the first side faces the rear cover, and the second substrate may be positioned between the first substrate and the rear cover such that the third side faces the rear cover.

[0143] According to various embodiments, the rear cover may be formed of a glass material or a ceramic material.

[0144] According to various embodiments, the space may include a display (e.g., display (201) of FIG. 3) arranged to be visible from the outside through at least a portion of the front cover.

[0145] According to various embodiments, the conductive patch is formed in a rectangular shape including a first side (e.g., a first side (311a) of FIG. 5A) and a second side (e.g., a second side (311b) of FIG. 5A) extending vertically from the first side and longer than the first side, and the wireless communication circuit can be powered at a first point (e.g., a first point (L1) of FIG. 5A) other than the center of the conductive patch (e.g., the center (C) of FIG. 5A).

[0146] According to various embodiments, the at least one conductive post may include a first conductive post (e.g., a first conductive post (VP1) in FIG. 5A) disposed at a position overlapping a second point (e.g., a second point (L2) in FIG. 5A) that is further from the first point than the center, with the center interposed therebetween, on a first virtual line (e.g., a first virtual line (EL1) in FIG. 5A) that passes through the center and is parallel to the first side when the first side is viewed from above.

[0147] According to various embodiments, the at least one conductive post may include a second conductive post (e.g., a second conductive post (VP2) in FIG. 5A) disposed at a position overlapping a third point (e.g., a third point (L3) in FIG. 5A) that is further from the first point than the center, on a second virtual line (e.g., a second virtual line (EL2) in FIG. 5A) that passes through the center and is parallel to the second side when the first side is viewed from above.

[0148] According to various embodiments, the wireless communication circuit may be configured to transmit and / or receive wireless signals in a first frequency band and a second frequency band lower than the first frequency band via the conductive patch.

[0149] According to various embodiments, the first frequency band can be determined through a capacitance value between the conductive patch and the first conductive post.

[0150] According to various embodiments, the second frequency band can be determined through a capacitance value between the conductive patch and the second conductive post.

[0151] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, Housing (210); A first substrate (240) disposed in the housing and including a first surface (2401) and a second surface (2402) facing in the opposite direction to the first surface; A second substrate (310) disposed on the first surface and including a third surface (3101) facing the same direction as the first surface and a fourth surface (3102) facing the first surface; A conductive patch (311) disposed in the space between the third side and the fourth side or on the third side; At least one conductive post (VP1) disposed between the conductive patch and the fourth surface; and A wireless communication circuit (192) is disposed on the first substrate and is configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive patch, An electronic device in which one end of the at least one conductive post is positioned at a position that can be coupled with the conductive patch, and the other end is electromagnetically connected to the ground layer (241) of the first substrate.

2. In paragraph 1, At least one of the above challenging posts, Challenge Via (3121); A sub-patch (3122) connected to the first end of the above-mentioned challenging via; and A conductive pad (3123) connected to the second end of the conductive via and exposed on the fourth surface, An electronic device wherein said one end of said at least one conductive post comprises said sub-patch and said other end comprises said conductive pad.

3. In paragraph 2, An electronic device wherein the conductive pad and the ground layer of the first substrate are spaced apart from each other so as to be coupled.

4. In paragraph 2, An electronic device in which the conductive pad and the ground layer of the first substrate are in direct contact through a connecting member (S).

5. In paragraph 4, An electronic device wherein the connecting member comprises solder, conductive tape or conductive contact that physically and electrically connects the conductive pad to the ground layer of the first substrate.

6. In paragraph 2, The above sub-patch is an electronic device arranged at a position overlapping the conductive patch when the first side is viewed from above.

7. In paragraph 6, An electronic device wherein the sub-patch has a smaller area than the conductive patch.

8. In paragraph 2, An electronic device wherein the at least one frequency band is determined by at least one of an area of ​​the sub-patch or a separation distance between the conductive patch and the sub-patch.

9. In paragraph 2, An electronic device in which the capacitance value between the conductive patch and the sub-patch is determined through an electromagnetic connection structure between the conductive pad and the ground layer.

10. In paragraph 1, An electronic device wherein at least one conductive post is positioned to overlap the conductive patch when the first surface is viewed from above.

11. In paragraph 1, The above housing, Front cover (202); A rear cover (211) facing in the opposite direction to the front cover; and Includes a side member (218) surrounding the space between the front cover and the rear cover, An electronic device wherein the first substrate and the second substrate are disposed in the space between the side member and the rear cover.

12. In paragraph 11, The first substrate is placed in the space so that the first surface faces the rear cover, An electronic device in which the second substrate is positioned between the first substrate and the rear cover, with the third side facing the rear cover.

13. In paragraph 12, The above rear cover is an electronic device formed of glass material or ceramic material.

14. In paragraph 11, An electronic device including a display (201) arranged so as to be visible from the outside through at least a portion of the front cover in the above space.

15. In paragraph 1, The above-mentioned challenging patch is formed in a rectangular shape including a first side (311a) and a second side (311b) extending vertically from the first side and longer than the first side, The above wireless communication circuit is an electronic device that is powered from a first point (L1) other than the center (C) of the conductive patch.

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