Halbach magnet assembly device and halbach magnet manufacturing method using same assembly device

Abstract

The present invention relates to an assembly device for a Halbach magnet and a manufacturing method thereof and, more specifically, to an assembly device and a manufacturing method using same, wherein the assembly device for a Halbach magnet includes a through-hole in which magnets coated with an adhesive are inserted and stacked to facilitate assembly of the Halbach magnet, which is difficult to assemble due to repulsive force between adjacent magnets, and the stacked magnets are bonded in a Halbach array to form and discharge the Halbach magnet.

Description

Halbach magnet assembly device and method for manufacturing a Halbach magnet using the assembly device

[0001] The present invention relates to a Halbach magnet assembly device and a method for manufacturing the same, and more specifically, to an assembly device that facilitates the assembly of Halbach magnets, which are difficult to assemble due to the repulsive force between adjacent magnets, and a method for manufacturing using the same.

[0002] When using multiple magnets, the strength of the magnetic field varies depending on the arrangement of the magnets.

[0003] Figure 1 is a diagram showing a Halbach magnet.

[0004] A plurality of magnets (M1 to M5) arranged with magnetic fluxes in different directions as shown in (a) of FIG. 1 is called a Halbach array.

[0005] When assembled in a Halbach arrangement as in (a) of Fig. 1, a Halbach magnet (Ma) assembled as in (b) is formed, and the formed Halbach magnet (Ma) exhibits a magnetic flux distribution as in (c).

[0006] An assembly formed by such a Halbach arrangement is called a Halbach magnet (Ma). Compared to arranging them in the same direction, the magnetic field on the top of the Halbach magnet (Ma) is stronger and the magnetic field on the bottom is weaker. As the magnetic field on the bottom decreases, the magnetic field on the top increases. Theoretically, the magnetic field on the top can increase by up to twice. A Halbach magnet can concentrate magnetic force in the direction where it is needed and reduce magnetic force in the direction where it is not needed by arranging multiple magnets in a specific direction. However, when magnets are joined, the magnetization directions differ, causing a repulsive force in the vertical direction to be generated, resulting in an upward pushing problem.

[0007] Referring to Figures 1 (b) and (c), in the conventional method, to join magnets in a Halbach arrangement, a structure and a support plate (10) capable of fixing magnets (M1 to M5) were made, and force was applied one by one to the support plate (10) and assembled with adhesive.

[0008] However, since a support plate (10) must be introduced, there is a problem that the size of the assembled Halbach magnet (Ma) increases, and there is also a disadvantage that productivity decreases because the magnets must be bonded and cured one by one during assembly.

[0009] For this reason, Halbach magnets are not yet widely used in industry, even though they can dramatically improve magnetic performance.

[0010] The technical problem that the present invention aims to solve is to provide an assembly device that can minimize the size of the Halbach magnet and also increase the productivity of the assembly process.

[0011] The Halbach magnet assembly device of the present invention for solving the above technical problem may be characterized by comprising a body including a through hole in which magnets are stacked, an upper cover equipped with a tip for compressing the magnets, and a lower cover for closing or opening the outlet of the through hole, wherein the magnets coated with adhesive are inserted in a Halbach arrangement at the entrance of the through hole, and the Halbach magnets are discharged through the outlet.

[0012] In some embodiments of the present invention, the XY cross-sections of the through hole and the magnet are in the shape of a rectangle, and the width and length of the through hole are larger than the width and length of the magnet by a, wherein the range of a may be 0.1mm ≤ a ≤ 0.3mm.

[0013] In some embodiments of the present invention, the tip and the XY cross-section of the magnet have a rectangular shape, and the width and length of the tip may be the same as the width and length of the magnet.

[0014] In some embodiments of the present invention, the body may be formed of a non-magnetic material.

[0015] In some embodiments of the present invention, an injection needle for applying the adhesive may be included.

[0016] In some embodiments of the present invention, the amount of adhesive applied may be an amount capable of covering 70 to 90% of the surface area of ​​one side of the magnet with a thickness of 8 to 10 μm.

[0017] In some embodiments of the present invention, a heating wire may be installed in the body to raise the internal temperature of the through hole.

[0018] The method for manufacturing a Halbach magnet according to the present invention for solving the above technical problem may include the step of applying a measured amount of adhesive to one surface of a magnet (S10), the step of inserting the magnet into a through hole in the order of a Halbach arrangement (S20), the step of applying pressure to the magnet with a tip (S30), and the step of discharging the cured Halbach magnet (S40).

[0019] In some embodiments of the present invention, in step S10, the amount of adhesive applied may be an amount capable of covering 70 to 90% of the surface area of ​​one side of the magnet with a thickness of 8 to 10 μm.

[0020] In some embodiments of the present invention, the internal temperature of the through hole may be 110 to 180 ℃.

[0021] According to the present invention, since the magnet is directly bonded without another support structure, the size of the finished Halbach magnet is not large, and the coating process, insertion, and ejection processes can be easily repeated, thereby increasing the productivity of the assembly process.

[0022] Figure 1 is a diagram showing a Halbach magnet.

[0023] FIG. 2 is an assembly device for manufacturing a Halbach magnet according to one embodiment of the present invention.

[0024] FIG. 3 is a diagram showing a method for manufacturing a Halbach magnet according to one embodiment of the present invention.

[0025] FIG. 4 is a diagram showing a method for manufacturing a Halbach magnet according to one embodiment of the present invention.

[0026] FIG. 5 is a diagram showing a method for manufacturing a Halbach magnet according to one embodiment of the present invention.

[0027] FIG. 6 is a drawing showing a Halbach magnet according to one embodiment of the present invention.

[0028] FIG. 7 is the body of an assembly device according to another embodiment of the present invention.

[0029] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0030] "And / or" includes each of the mentioned items and all combinations of one or more.

[0031] The terms used herein are for describing embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, "comprising" and / or "comprising" does not exclude the presence or addition of one or more other components, steps, actions, and / or elements to the mentioned components, steps, actions, and / or elements.

[0032] Furthermore, throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly" or "electrically connected" with other members or elements interposed between them.

[0033] Additionally, throughout the specification, the description that each layer (film), region, pattern, or structure is formed "on" or "under" the substrate, each layer (film), region, pad, or pattern includes both direct formation and formation through another layer. The criteria for "on" or "under" each layer are described based on the drawings.

[0034] Furthermore, expressions such as 'first, second,' etc., are used solely to distinguish multiple compositions and do not limit the order or other characteristics between the compositions.

[0035] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0036] Hereinafter, a Halbach magnet assembly device according to the present invention will be described with reference to the drawings.

[0037] FIG. 2 is an assembly apparatus for manufacturing a Halbach magnet according to one embodiment of the present invention, and FIG. 3 to 5 are drawings showing a method for manufacturing a Halbach magnet according to one embodiment of the present invention.

[0038] Referring to FIGS. 2 to 5, a Halbach magnet assembly device according to the present invention may include a body (100) having a through hole (101) in which magnets (M1 to M5) are stacked, an upper cover (200) equipped with a tip (201) for compressing the magnets (M1 to M5), and a lower cover (300) for closing or opening the outlet of the through hole (101). At the entrance of the through hole (101), magnets (M1 to M5) coated with adhesive (Ad) are inserted in a Halbach arrangement, and a Halbach magnet (Ma) can be discharged from the outlet.

[0039] The through hole (101) of the above body (100) is formed in the Z-axis direction, and the entrance of the through hole (101) may be formed at the top in the Z-axis direction, and the exit of the through hole (101) may be formed at the bottom in the Z-axis direction.

[0040] Magnets (M1 to M5) are inserted in the order of a Halbach array at the entrance of the through hole (101) of the body (100), and a Halbach magnet (Ma) formed in the Halbach array is discharged through the exit. At this time, it is preferable that the body (100) be formed of a non-magnetic material so that magnetic interference does not occur during the process of inserting the magnets (M1 to M5) and discharging the Halbach magnet (Ma). For example, it may be formed of a non-magnetic metal such as aluminum or copper.

[0041] The lower cover (300) closes the outlet of the through hole (101) during assembly to prevent the magnets (M1 to M5) inserted into the through hole (101) from escaping downward during assembly, and after the joining of the magnets (M1 to M5) is completed and formed into a Halbach magnet (Ma), the lower cover (300) is removed to open the outlet of the through hole (101) and discharge the Halbach magnet (Ma).

[0042] Magnets (M1 to M5) are inserted into the through hole (101) so that the magnets (M1 to M5) are not twisted in the X-axis and Y-axis directions and are constrained by the through hole (101) to maintain their position. By maintaining the position in this way, the magnets (M1 to M5) are prevented from detaching or twisting due to the repulsive force between them, and a Halbach magnet (Ma) can be assembled with the position maintained in a correct alignment.

[0043] At this time, the XY cross-sections of the through hole (101) and the magnets (M1 to M5) are in the shape of a rectangle, and the horizontal and vertical lengths of the through hole (101) are larger than the horizontal and vertical lengths of the magnets (M1 to M5) by a, and the range of a may be 0.1mm ≤ a ≤ 0.3mm.

[0044] In order for the through hole (101) to restrain the magnets (M1 to M5) without twisting, it is advantageous for the size of the through hole (101) to have a small difference from the size of the magnets (M1 to M5) to the extent that insertion does not become difficult. Taking into account the allowable error when machining the through hole (101) and the magnets (M1 to M5), the size of the through hole (101) can be set to be 0.1 mm larger or equal to the size of the magnets (M1 to M5).

[0045] Also, insertion may be easier if the size of the through hole (101) is larger than the size of the magnet (M1 to M5). However, considering that the magnet (M1 to M5) is small in size, such as a few millimeters, if the size of the through hole (101) is larger than the size of the magnet (M1 to M5) by more than 0.3 mm, distortion may occur in the XY cross-section.

[0046] Therefore, it is desirable to manage the range of a as 0.1mm≤a≤0.3mm.

[0047] The tip (201) of the upper cover (200) can apply pressure in the -Z axis direction so that the magnets (M1 to M5) can be joined after the magnets (M1 to M5) are inserted into the through hole (101) in a Halbach arrangement.

[0048] At this time, the tip (201) and the XY cross-section of the magnet (M1 to M5) are in the shape of a square, and it is preferable that the width and length of the tip (201) are the same as the width and length of the magnet (M1 to M5). This is because pressing with the contact surface having the same area is the most effective way to prevent twisting in the Z direction.

[0049] Since the tip (201) is in contact with the upper surface of the magnets (M1 to M5), it is formed with the same area, and the portion other than the tip (201) can be formed with a cross-section that is equal to or smaller than the area of ​​the tip.

[0050] In this way, if the area other than the tip is smaller than the area of ​​the tip, mechanical interference that may occur between the tip (201) and the through hole (101) during the compression process can be eliminated.

[0051] Since the tip (201) must be able to discharge the magnet (M1 to M5) or Halbach magnet (Ma) inserted into the through hole (101), it is preferable that the length of the tip (201) be equal to or greater than the length of the through hole (101).

[0052] Referring to FIG. 3, the adhesive (Ad) is applied to the upper surface of the four magnets (M1 to M4) that are inserted first, and is not applied to the magnet (M5) located at the end of the Halbach array. In this way, the “magnet-adhesive application” or “magnet-adhesive non-application” process can be appropriately repeated in correspondence with the Halbach array.

[0053] The assembly device according to the present invention may include an injection needle (110) for applying adhesive (Ad).

[0054] In the “magnet-adhesive application” process, a predetermined amount of adhesive (Ad) can be injected into the upper surface of the magnets (M1 to M4) through the injection needle (110).

[0055] An appropriate amount is one that can cover at least 70% of the surface without overflowing due to excessive application, and a corresponding amount can be supplied using a device such as an injection needle.

[0056] The amount of adhesive (Ad) added can be determined to cover 70 to 90% of the surface area of ​​the upper surface of the magnets (M1 to M4) with a thickness of 8 to 10 μm. This is because it is possible to maximize adhesive strength with an appropriate thickness and area while simultaneously preventing the adhesive (Ad) from overflowing to the outside of the assembly.

[0057] The adhesive (Ad) used in the present invention is not particularly limited as long as it can secure the adhesive strength of the finished assembly.

[0058] However, to reduce the processing time required for the curing process, it is desirable that the curing be completed to a level of 70% or more within 20 minutes and that the liquid flow be controlled due to viscosity. For example, 3M’s DP420 Epoxy Adhesive can be used.

[0059] FIG. 6 is a drawing showing a Halbach magnet according to one embodiment of the present invention.

[0060] Referring to FIG. 6, a Halbach magnet (Ma) formed by n magnets has adhesive (Ad) applied from the first magnet (M1) to the n-1th magnet (M4), and the last nth magnet (Mn) is not coated with adhesive (Ad). FIG. 6 shows the case where n is 5.

[0061] In this way, an adhesive layer (Ad) can be formed covering 70 to 90% of the area with a thickness of 8 to 10 μm between the first magnet (M1) and the nth magnet (Mn), and in the example of FIG. 6, between the first magnet (M1) and the 5th magnet (M5).

[0062] FIG. 7 is the body of an assembly device according to another embodiment of the present invention.

[0063] Referring to FIG. 7, a heating wire (120) may be installed in the body (100) to raise the internal temperature of the through hole (101).

[0064] At this time, the body (100) may be made of a non-magnetic metal material, and the heating wire (120) may be a conductor capable of Joule heating (ohmic heating, resistive heating) with an insulating portion formed thereon.

[0065] In order to shorten the curing time of the adhesive (Ad), it is advantageous to expose it to a high-temperature environment after applying the adhesive (Ad), so the internal temperature of the through hole (101) can be increased by installing a heating wire (120) to generate heat.

[0066] At this time, the internal temperature of the through hole (101) is preferably 130 to 180 ℃. This is because the appropriate time reduction effect while maintaining the adhesive strength of the adhesive (Ad) can be obtained in the range of 125 ℃ to 180 ℃, and if heat higher than 180 ℃ is applied to the magnet, the magnet may cause a decrease in magnetic flux due to heat.

[0067] Referring to FIGS. 3 to 5, the method for manufacturing a Halbach magnet according to the present invention may include the step (S10) of applying a measured amount of adhesive (Ad) to one surface of a magnet (M1 to M5), the step (S20) of inserting the magnet (M1 to M5) into a through hole (101) in the order of a Halbach arrangement, the step (S30) of applying pressure to the magnet (M1 to M5) with a tip, and the step (S40) of discharging a cured Halbach magnet (Ma).

[0068] In the above S10 step, the amount of adhesive applied may be an amount capable of covering 70 to 90% of the area of ​​one surface of the magnet with a thickness of 8 to 10 μm as described above.

[0069] Also, the adhesive (Ad) is applied to the upper surface of the four magnets (M1 to M4) that are inserted first, but is not applied to the magnet (M5) located at the end of the Halbach array. In this way, the “magnet-adhesive application” or “magnet-adhesive non-application” process can be appropriately repeated in correspondence with the Halbach array.

[0070] A measured amount of adhesive (Ad) can be applied using an injection needle (110).

[0071] In step S30 above, the internal temperature of the through hole (101) can be maintained at a high temperature. At this time, the internal temperature is preferably 130 to 180 ℃ as described above.

[0072] As such, by using the Halbach magnet assembly device according to the present invention, the magnet is directly bonded without other support structures, so the size of the assembled finished product does not increase, and the coating process and the insertion and discharge processes can be easily repeated, thereby increasing the productivity of the assembly process.

[0073] Although the present invention has been described above, those skilled in the art will recognize that the invention may be implemented in other forms while maintaining the technical concept and essential features of the invention.

[0074] The scope of the present invention shall be defined by the claims, but all modifications or variations derived from configurations directly derived from the descriptions in the claims, as well as configurations equivalent thereto, shall be interpreted as being included within the scope of the present invention.

Claims

1. A body including a through hole into which magnets are laminated; An upper cover equipped with a tip for compressing the magnet; It includes a lower cover that closes or opens the exit of the above-mentioned through hole, and A Halbach magnet assembly device characterized in that, at the entrance of the above-mentioned through hole, the magnet coated with adhesive is inserted in a Halbach arrangement, and at the exit, the Halbach magnet is discharged.

2. In Paragraph 1, A Halbach magnet assembly device in which the XY cross-sections of the through hole and the magnet are in the shape of a rectangle, the width and height of the through hole are larger than the width and height of the magnet by a, wherein the range of a is 0.1mm ≤ a ≤ 0.3mm.

3. In Paragraph 1, A Halbach magnet assembly device characterized in that the tip and the XY cross-section of the magnet have a rectangular shape, and the width and length of the tip are the same as the width and length of the magnet.

4. In Paragraph 1, A Halbach magnet assembly device formed of a non-magnetic material.

5. In Paragraph 1, Halbach magnet assembly device comprising an injection needle for applying the above adhesive.

6. In Paragraph 1, A Halbach magnet assembly device, wherein the amount of adhesive applied is such that it can cover 70 to 90% of the surface area of ​​one side of the magnet with a thickness of 8 to 10 μm.

7. In Paragraph 1, Halbach magnet assembly device having a heating element installed in the above body.

8. A step of applying a measured amount of adhesive to one surface of the magnet (S10); Step (S20) of inserting the above magnets into the through holes in the order of the Halbach array; Step of applying pressure to the above magnet with a tip (S30); A method for manufacturing a Halbach magnet, comprising the step (S40) of discharging a hardened Halbach magnet.

9. In Paragraph 8, A method for manufacturing a Halbach magnet, wherein in the above step S10, the amount of adhesive applied is an amount capable of covering 70 to 90% of the surface area of ​​one side of the magnet with a thickness of 8 to 10 μm.

10. In Paragraph 8, A method for manufacturing a Halbach magnet, wherein the internal temperature of the through hole is maintained at 110 to 180 ℃ in the above S30 step.

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