Method and apparatus for identifying tray component placement

Abstract

The present invention relates to an automatic mounting field of an electronic component and, more specifically, to a technology related to image acquisition, management, and quality verification of a component during a component mounting process. The component mounting apparatus for achieving the above-described task according to an embodiment of the present specification may comprise: a head provided with at least one nozzle to transport a component; a sensor disposed on the head; and a controller which measures the height of each of a plurality of pockets provided in a tray at a specific position of the tray on the basis of the sensor, compares the measured height, the pickup height included in design information, and the thickness of the component to identify whether the component is disposed in each of the plurality of pockets, and, when the component is disposed in at least one of the plurality of pockets, controls the head on the basis of the at least one pocket.

Description

Method and apparatus for identifying tray component placement

[0001] The present invention relates to the field of automatic mounting of electronic components, and more specifically, to technology regarding image acquisition, management, and quality verification of components during the component mounting process.

[0002] The present invention belongs to the field of electronic component mounting technology, and more specifically, relates to technology concerning automated component mounting equipment and a method for controlling the same.

[0003] In today's electronic manufacturing processes, the rapid and accurate mounting of components is essential. To this end, component mounters use highly sophisticated vision systems to identify components and place them precisely in the correct positions.

[0004] With the recent advancement of chip mounter systems, there is an increasing demand for efficient methods to supply large and irregularly shaped materials, such as BGAs and QFPs. To supply these materials, tray feeders and standardized trays known as JEDEC Trays are being used.

[0005] Users manage the required quantity of parts per tray by inputting them into the chip mounter system. For the equipment to operate smoothly, the quantity of parts in the tray must exactly match the quantity entered by the user, and there is a possibility that the equipment may stop operating if the parts quantity is exhausted.

[0006] The embodiments of this specification are proposed to solve the aforementioned problems and disclose a component mounting device and method for improving the accuracy and efficiency of component mounting by accurately and quickly determining whether a component is present in each pocket of a tray.

[0007] A component mounting device according to one embodiment of the present specification for achieving the above-described objective may include: a head having at least one nozzle for transporting a component; a sensor disposed on the head; and a controller that measures the height of each of a plurality of pockets provided in the tray at a specific location on the tray based on the sensor, identifies whether the component is placed in each of the plurality of pockets by comparing the measured height with the pickup height included in design information and the thickness of the component, and controls the head based on the at least one pocket when the component is placed in at least one of the plurality of pockets.

[0008] The controller determines that, for one of the plurality of pockets, if the measured height is greater than the value obtained by adding an allowable tolerance to the height of an empty pocket, or if there is no measured height, that the component is not placed in the pocket, and the allowable tolerance may be determined as a ratio of the thickness of the component.

[0009] The controller can calculate an empty pocket height for each of the plurality of pockets based on the difference between the thickness of the component and the pickup height for picking up the component included in the design information, and identify whether the component is placed in each of the plurality of pockets by comparing the empty pocket height with the measured height.

[0010] The above controller can transmit a warning message if the component is not placed in all of the plurality of pockets.

[0011] A component mounting method according to one embodiment of the present specification for achieving the above-described objective may include: a step of measuring the height of each of a plurality of pockets located at a specific position in a tray using a sensor placed in a head; a step of identifying whether a component is placed in each pocket by comparing the measured height with the pickup height and the thickness of the component included in design information; and a step of controlling the head based on the corresponding pocket when a component is placed in at least one of the plurality of pockets.

[0012] The above identifying step may include, for each of the plurality of pockets, a step of calculating an empty pocket height based on the difference between the pickup height for picking up a part included in the design information and the thickness of the part; and a step of identifying whether a part is placed in each pocket by comparing the empty pocket height with the measured height.

[0013] According to the present invention, the accuracy of the component mounting process can be improved more effectively.

[0014] FIG. 1 is a drawing showing an equipment monitoring system according to one embodiment of the present invention.

[0015] FIG. 2 is a diagram illustrating the operation of a component mounting device measuring the height of a tray according to one embodiment of the present invention.

[0016] FIG. 3 is a drawing illustrating the detailed configuration of a tray according to one embodiment of the present invention.

[0017] FIG. 4 is a drawing illustrating the operation of a component mounting device according to one embodiment of the present invention.

[0018] FIG. 5 is a diagram schematically illustrating the block configuration of a component mounting device according to one embodiment of the present invention.

[0019] The terms used in this invention are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art as described in this invention. Terms used in this invention that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not interpreted in an ideal or overly formal sense unless explicitly defined in this invention. In some cases, even terms defined in this invention may not be interpreted to exclude embodiments of this invention.

[0020] Below, with reference to the attached drawings, various embodiments are described in detail to enable those skilled in the art to easily implement the present invention. However, since the technical concept of the present invention can be modified and implemented in various forms, it is not limited to the embodiments described in this specification. In describing the embodiments disclosed in this specification, if it is determined that specifically describing related known technologies may obscure the essence of the technical concept of the present invention, such specific description of known technologies is omitted. Identical or similar components are assigned the same reference numerals, and redundant descriptions thereof are omitted.

[0021] In this embodiment, the term "~part" refers to a component that performs a specific function performed by software or hardware such as an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). However, "~part" is not limited to being performed by software or hardware. "~part" may exist in the form of data stored on an addressable storage medium, or it may be implemented by instructions and configured so that one or more processors execute a specific function.

[0022] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be permanently or temporarily embodied in any type of machine, component, physical device, virtual equipment, computer storage medium or device, or transmitted signal wave in order to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on one or more computer-readable recording media. Software may be read into main memory from other computer-readable media, such as data storage devices, or from other devices via communication interfaces. Software instructions stored in main memory may cause the processor to perform processes or steps, which will be described in detail below. Alternatively, processes consistent with the principles of the present invention may be executed using a fixed wiring circuit instead of or in combination with software instructions. Accordingly, embodiments consistent with the principles of the present invention are not limited to any specific combination of hardware circuits and software.

[0023] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Terms such as “first,” “second,” etc., may be used to describe various components, but the components should not be limited by these terms. These terms are used solely for the purpose of distinguishing one component from another.

[0024] FIG. 1 is a drawing showing an equipment monitoring system according to an embodiment of the present invention. Referring to FIG. 1, the equipment monitoring system may include an equipment monitoring device (110) and a component mounting device SMT (Surface Mounting Technology) (120). Such an equipment monitoring system may be applied to a tray feeder system for supplying large and various shaped odd-shaped materials such as Ball Grid Array (BGA) and Quad Flat Package (QFP).

[0025] The equipment monitoring device (110) performs the role of monitoring hardware defects of the component mounting device (120). Specifically, it monitors whether the component mounting device (120) is operating normally in real time and can send or display a notification message if a problem occurs.

[0026] The equipment monitoring system (10) includes a plurality of component mounting devices (120), and each component mounting device (120) can perform the task of mounting components on a printed circuit board. Each component mounting device (120) can generate a message based on whether it is operating normally while performing component mounting and transmit it to the equipment monitoring device (110).

[0027] FIG. 2 is a diagram illustrating the operation of a component mounting device (120) according to one embodiment of the present invention measuring the height of a tray.

[0028] According to an embodiment, the component mounting device may be equipped with a head (200) that picks up and moves components using at least one nozzle. This head may include a sensor to measure the height of a plurality of pockets located at a specific position on a tray (200). This head (200) may include a head body (210), a sensor (220), and a nozzle (230).

[0029] The head body (210) can support equipment that can be placed on the head (200). For example, the head body (210) can be configured to have a sensor (220) placed on one side. The sensor (220) can measure the surface height of the tray (300) or sense the shape of a part. For example, the sensor (220) may be a height sensor that is a laser sensor that irradiates a laser beam onto the tray (300) and calculates the distance by measuring the time it takes for the beam to be reflected back.

[0030] The nozzle (230) can be controlled by a controller and used to move a component for mounting to a printed circuit board. For example, the nozzle (230) can be moved by the controller to a close proximity to a component placed in a pocket based on the distance to each pocket of the tray, and can attach the component to the nozzle end by using the pressure difference by reducing the air pressure inside the nozzle.

[0031] FIG. 3 is a drawing illustrating the detailed configuration of a tray (300) according to one embodiment of the present invention. Specifically, FIG. 3 is an example of a top view of a tray (300), and such a tray (300) is a tray conforming to JEDEC standards and can be used to arrange, store, and transport electronic components having a certain standard size.

[0032] Referring to FIG. 3, the tray (300) in the component mounting device may include a plurality of grids (310), and each grid (310) is provided with a pocket (311) in which a component can be placed. A component may or may not be placed in such a pocket (311), and depending on whether a component is placed, there may be a difference when the sensor measures the height of the pocket (311).

[0033] FIG. 4 is a drawing illustrating the operation of a component mounting device according to one embodiment of the present invention.

[0034] Referring to FIG. 4, the component mounting device can measure the height of each of the multiple pockets at a specific location on the tray using a sensor placed on the head in step S410.

[0035] A component mounting device according to one embodiment can identify whether a component is placed in each pocket by comparing the measured height with the pickup height and the thickness of the component included in the design information at step S420. This design information may include detailed specifications regarding the design, assembly, and function of a product or component during the manufacturing and assembly process. For example, the design information may include at least one of: i) detailed drawings and technical specifications including the exact dimensions, shape, and material specifications of the product or component; ii) detailed instructions on how to assemble each component; iii) functional specifications and performance standards that the product or component must satisfy; iv) quality standards and inspection standards that the product or component must satisfy; v) a list of all components required for product assembly and detailed information on each component; and vi) information on the height required to pick up the component and the thickness of the component.

[0036] The component mounting device calculates the empty pocket height based on the difference between the pickup height for picking up components included in the design information and the thickness of the components, and can identify whether components are placed in each pocket by comparing the empty pocket height with the measured height.

[0037] For example, a component mounting device determines that a component is not placed in one of a plurality of pockets if, for one pocket, the measured height is greater than the value obtained by adding a tolerance to the height of an empty pocket, or if there is no measured height, and the tolerance can be determined as the ratio of the thickness of the component.

[0038] In step S430, a component mounting device according to one embodiment can control a head based on a pocket when a component is placed in at least one of a plurality of pockets.

[0039] For example, when the component placement device senses that a component is in a pocket of the tray via a sensor, it can switch the system state of the component placement device to the Done state and control the header to proceed with the pickup process. If the sensor detects that there is at least one component in the pocket of the tray, the component placement device can measure the height of all pockets starting from the pocket (0,0) position based on the design information of the tray. Additionally, if there are no components in any pocket, the component placement device can generate an error report and stop the corresponding gantry. The component placement device can transmit a warning message to the equipment monitoring device.

[0040] FIG. 5 is a diagram schematically illustrating the configuration of a component mounting device according to one embodiment of the present invention.

[0041] Referring to FIG. 5, the component mounting device may include a head unit (510), a communication unit (520), and a controller (530), and the head unit (510) may be equipped with a sensor (511) and may also include one or more nozzles to transport components.

[0042] The communication unit (520) is responsible for data transmission between the controller (530) and an external device, thereby enabling efficient operation and real-time monitoring of the device. The communication unit (520) performs functions for transmitting and receiving signals through a network. All or part of the communication unit (520) may be referred to as a transmitting unit, a receiving unit, or a transmitting and receiving unit. The communication unit (520) may provide a function for the component mounting device and at least one other node to communicate with each other through a communication network. According to one embodiment of the present disclosure, when the controller (530) of the component mounting device generates a request signal according to program code stored in a recording device such as memory, the request signal may be transmitted to at least one other node through a communication network under the control of the communication unit (520). Conversely, control signals, commands, content, files, etc. provided under the control of the processor of at least one other node may be received by the component mounting device through the communication unit (520).

[0043]

[0044] A controller (530) according to one embodiment processes data received from a sensor (511) and controls a head unit (510) to determine whether a component is placed in each pocket. The controller can also calculate the height of an empty pocket and compare it with a measured height to identify whether a component is present in each pocket.

[0045] A controller (530) according to one embodiment measures the height of each of a plurality of pockets provided in the tray at a specific location of the tray based on a sensor (511), identifies whether a component is placed in each of the plurality of pockets by comparing the measured height with the pickup height and the thickness of the component included in the design information, and if a component is placed in at least one of the plurality of pockets, can control the head based on at least one pocket.

[0046] A controller (530) according to one embodiment determines that, for one of a plurality of pockets, if the measured height is greater than the value obtained by adding an allowable error to the height of an empty pocket, or if there is no measured height, that a component is not placed in one pocket, and the allowable error may be determined as a ratio of the thickness of the component.

[0047] A controller (530) according to one embodiment can calculate an empty pocket height for each of the plurality of pockets based on the difference between the pickup height for picking up a part included in the design information and the thickness of the part, and can identify whether a part is placed in each of the plurality of pockets by comparing the empty pocket height with the measured height.

[0048] A controller (530) according to one embodiment can transmit a warning message if no components are placed in all of the multiple pockets.

[0049] Such a controller (530) may be implemented as a single CPU or multiple CPUs (or DSP, SoC). The controller (530) may be implemented as a digital signal processor (DSP), a microprocessor, or a time controller (TCON) that processes digital signals. However, it is not limited thereto, and may include or be defined by one or more of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a communication processor (CP), or an ARM processor.

[0050] The foregoing description of exemplary embodiments of the present invention provides an explanation and example of the invention, but is not intended to encompass the invention or limit it to the disclosed form. In light of the foregoing teachings, various modifications and variations are possible, or various modifications and variations can be learned from the practice of the present invention. For example, although a series of acts has been described in relation to a flowchart, the order of these acts may be changed in other embodiments consistent with the principles of the present invention. Also, non-dependent acts may be executed in parallel.

[0051] Although the present invention has been described in relation to the preferred embodiments mentioned above, various modifications and variations are possible without departing from the essence and scope of the invention. Accordingly, the appended claims will include such modifications and variations insofar as they fall within the essence of the invention.

Claims

1. In a component mounting device, A head for transporting parts equipped with at least one nozzle; A sensor disposed in the head above; and A component mounting device comprising a controller that measures the height of each of a plurality of pockets provided in the tray at a specific location of the tray based on the sensor, identifies whether the component is placed in each of the plurality of pockets by comparing the measured height with the pickup height and the thickness of the component included in design information, and controls the head based on the at least one pocket when the component is placed in at least one of the plurality of pockets.

2. In Paragraph 1, The above controller is, A component mounting device that, for each of the plurality of pockets, calculates an empty pocket height based on the difference between the thickness of the component and the pickup height for picking up the component included in the design information, and identifies whether the component is placed in each of the plurality of pockets by comparing the empty pocket height with the measured height.

3. In Paragraph 2, The above controller is, For one of the plurality of pockets, if the measured height is greater than the value obtained by adding the allowable error to the height of the empty pocket, or if there is no measured height, it is determined that the component is not placed in the one pocket. A component mounting device in which the above tolerance is determined by the ratio of the thickness of the above component.

4. In Paragraph 1, The above controller is, A component mounting device that transmits a warning message when the component is not placed in all of the plurality of pockets.

5. Regarding the component mounting method, A step of measuring the height of each of a plurality of pockets at a specific location on the tray using a sensor placed on the head; A step of identifying whether a part is placed in each pocket by comparing the measured height with the pickup height and thickness of the part included in the design information; and A method comprising the step of controlling a head based on a pocket when a component is placed in at least one of the plurality of pockets.

6. In Paragraph 6, The above identification step is, For each of the above plurality of pockets, A step of calculating an empty pocket height based on the difference between the pickup height for picking up a part included in the design information and the thickness of the part; and A method comprising the step of identifying whether a component is placed in each pocket by comparing the height of the empty pocket with the height measured above.

Images