Workpiece carrier, use, and method for automatically producing a laser diode module

Abstract

The invention relates to a workpiece carrier (10) for producing a laser diode module. The workpiece carrier (10) has: a number of positioning devices (22, 24) for positioning the workpiece carrier (10); a main body (18) having a fastening portion (30) and an opening (32); and a fastening device (40) designed to fasten a base plate (12) of the laser diode module to the fastening portion (30). At least portions of the opening (32) are covered by the base plate (12) when the base plate (12) is fastened to the fastening portion (30) by means of the fastening device (40).

Description

[0001] Title: Workpiece carrier, workpiece carrier arrangement, manufacturing plant, use and method for the automatic production of a laser diode module

[0002] Description

[0003] The invention relates to a workpiece carrier, a workpiece carrier arrangement, a manufacturing plant, a use of the workpiece carrier, the workpiece carrier arrangement and / or the manufacturing plant and a method, each for manufacturing a laser diode module.

[0004] A laser diode module can provide an output laser beam, for example, for optical pumping of a laser-active medium in a solid-state laser. The solid-state laser can be configured as a disk laser or fiber laser, for instance. Consequently, the output laser beam provided by the laser diode module can be suitable for optical pumping, for example, of solid-state lasers.

[0005] Besides optical pumping, other applications for the output laser beam of the laser diode module are possible – provided the output laser beam is supplied with a specific power, for example, in workpiece processing or in medical technology. In such applications, the output laser beam can function not only as an optical pump source, but also, at the very least, as an unamplified processing laser beam and / or treatment laser beam.

[0006] A typical laser diode module has one or more emitters soldered to a base plate of the laser diode module by means of a mounting plate. Each emitter can be configured to convert electrical power into optical power by generating a laser beam.

[0007] The laser diode module can have multiple optical components attached to the base plate. These components serve to convert the laser beams generated by the emitters into the output laser beam and / or to direct the output laser beam to an output of the laser diode module, so that the output laser beam leaves the module with the desired beam characteristics. The optical components can be, for example, lenses, mirrors, polarizers, and / or waveguides.

[0008] Typically, laser diode modules have a compact design, which is why, during the manufacture of the laser diode module, the optical components must be positioned and attached precisely, especially with a positioning accuracy of less than 1 pm (micrometer) relative to each other on the base plate.

[0009] Manufacturing a laser diode module often requires several different work steps or production steps, which are performed at different workstations. Frequently, the base plate of the laser diode module, to which the emitters and optical components are mounted, is manually inserted into and removed from the various workstations by a production worker, and transported between them. The production worker ensures that the base plate is positioned with the precision required for each step at every workstation.

[0010] The object of the present invention is to provide a workpiece carrier, a workpiece carrier arrangement, a manufacturing plant, a use and a method, each of which enables the automatic production of a laser diode module.

[0011] The invention solves this problem with a workpiece carrier having the features of claim 1, with a workpiece carrier arrangement having the features of claim 9, with a manufacturing plant having the features of claim 10, with a use having the features of claim 12 and with a method having the features of claim 13. Advantageous embodiments and further developments of the invention are set forth in the dependent claims.

[0012] A workpiece carrier according to the invention is designed for the, in particular automatic, production of a laser diode module. The workpiece carrier has a number, for example 1, 2, or 3, of positioning devices, a base body, and a fastening device. The number of positioning devices is designed for positioning the workpiece carrier, particularly in a workstation. The base body has a fastening section and an opening. The fastening device is designed for attaching a base plate of the laser diode module to the fastening section, in particular releasably. The opening is at least partially, and in particular completely, covered by the base plate when the base plate is attached to the fastening section by means of the fastening device.

[0013] Advantageously, the number of positioning devices allows the workpiece carrier to be positioned in at least one workstation for manufacturing the laser diode module. Due to the breakthrough, contact between the base plate and the base body can be advantageously reduced. This reduces heat transfer between the base plate and the base body, thus minimizing or completely preventing unwanted displacement of the base plate relative to the base body and / or unwanted warping between the base plate and the base body as a result of heating or cooling of the base plate, for example, during a soldering process. This allows the base plate to be heated and / or cooled during the manufacturing of the laser diode module without the need to correct unwanted displacement and / or warping.In other words, the breakthrough can reduce thermal coupling between the base body and the base plate, which is why repeatable positioning of the base plate in the workstations for manufacturing the laser diode module can be achieved.

[0014] Furthermore, due to the reduced contact between the cutout and the base plate, the transmission of mechanical vibrations occurring during the manufacturing of the laser diode module from the base body to the base plate can be reduced. This minimizes or completely prevents unwanted displacement of the base plate relative to the base body and / or unwanted distortion between the base plate and the base body. In other words, the cutout reduces mechanical coupling between the base body and the base plate, thus enabling repeatable positioning of the base plate in the workstations used for manufacturing the laser diode module.

[0015] Due to the repeatable positioning of the base plate in the workstations for manufacturing the laser diode module, the workpiece carrier can enable the automatic, in particular fully automatic, production of the laser diode module.

[0016] Another aspect of the automatic, especially fully automatic, manufacturing of the laser diode module can be that the influence of a production employee on the manufacturing of the laser diode module, process times for manufacturing the laser diode module and / or production costs for manufacturing the laser diode module can be reduced.

[0017] Each workstation for manufacturing the laser diode module can have an interface for positioning the workpiece carrier. This interface allows the workpiece carrier to be positioned within the workstation in a way that is necessary for the correct execution of a manufacturing step. The interface can include, for example, one or more of the following components: a guide, a stop, a recess, a dowel pin, and a centering bore.

[0018] The interfaces of the workstations can be identical, partially identical, or different from one another. Often, the interfaces of the workstations are partially identical, which is why the number of interface variants is less than the number of workstations required to manufacture the laser diode module.

[0019] The number of positioning devices can be configured to position the workpiece carrier at a number of workstations, for example, 3, 5, or 10, for the purpose of manufacturing the laser diode module. The positioning devices can interact with the interfaces so that the workpiece carrier is positioned at each workstation in the precise, and in particular predefined, position required for the correct execution of the manufacturing steps for the laser diode module. Each positioning device can enable the workpiece carrier to be inserted into a workstation with precise alignment in the predefined position.

[0020] The positioning device can have one or more of the following components: a guide, a stop, a recess, a cylindrical pin, and a centering bore. The positioning device can be used to position the workpiece carrier in an interface of a workstation for manufacturing the laser diode module. Additionally or alternatively, the interface of the workstation for manufacturing the laser diode module can be used with the positioning device for positioning the workpiece carrier. For example, a positioning device can have a centering bore. The interfaces of the workstations can, for example, have a centering pin. The centering pin of the workstations can be inserted into the centering bore of the workpiece carrier for positioning the workpiece carrier in a predefined position.

[0021] The number of positioning devices can be equal to the number of interface variants of the workstations used for manufacturing the laser diode module. In other words, the number of different workstation interfaces can be equal to the number of positioning devices.

[0022] The number of positioning devices can be arranged on the base body, or the base body can have the number of positioning devices.

[0023] The base body can be plate-shaped. The base body can be a metal plate. The base body can be made of a material with a content of at least 75 wt% (weight percent) aluminum, preferably at least 90 wt% or 95 wt% aluminum.

[0024] The fastening section and the opening can be arranged relative to each other in such a way that the opening is at least partially covered by the base plate when the base plate is attached to the fastening section by means of the fastening device.

[0025] The mounting section can be flat. The mounting section can be designed as a surface section, in particular a flat surface section, of the base body. If the base plate is attached to the mounting section by means of the mounting device, the mounting section and the base plate can form a contact.

[0026] The fastening device can be switchable between a release state and a clamping state. In the release state, the fastening device can be configured to allow the base plate to be positioned on the fastening section and / or to be detached from the fastening section. In the clamping state, the fastening device can be configured to prevent the base plate from being positioned on the fastening section and / or from being detached from the fastening section. Preferably, in the clamping state, the fastening device can prevent movement of the base plate orthogonal to the fastening section.

[0027] The fastening device can be configured to press, in particular to compress or pre-tension, the base plate against the mounting section for attachment to the base body. The base plate can be fastened to the mounting section by means of the fastening device when the fastening device presses the base plate against the mounting section. The fastening device can include at least one spring for pressing the base plate against the base body.

[0028] The fastening device can comprise a first fastening unit and a second fastening unit. Each fastening unit can be configured to press a section of the base plate against the fastening section. In the clamped state, each fastening unit can be configured to prevent movement of the base plate orthogonal to the fastening section. The opening can be located between the first fastening unit and the second fastening unit.

[0029] The opening can extend from a first side of the base body to a second side of the base body. The first side can be opposite the second side. The second side can include the fastening section. The cross-section of the opening can be rectangular. The fastening section can be adjacent to the opening, particularly to an opening of the opening. The fastening section can completely surround the opening, particularly the opening of the opening.

[0030] The opening can have a straight path. A cross-section of the opening can taper section by section. The opening can have a first section where its cross-section tapers and a second section where its cross-section is constant. The first section can be located on the first side of the base body. The second section can be located on the second side of the base body. The tapered cross-section can simplify the insertion of a workstation tool into the opening. The area of ​​a cross-sectional facet of the opening, in particular the area of ​​the opening itself, can be larger than the area of ​​the fastening section.In particular, the cross-sectional area of ​​the opening, especially the area of ​​the opening of the opening, may be at least five, eight or ten times larger than the area of ​​the fastening section.

[0031] The workpiece carrier can have internal electrical contacts. These internal contacts can be connected to an electrical voltage source for testing and / or verifying a manufacturing step. For example, an emitter can be soldered to the base plate using a mounting plate. The emitter can then be energized via the workpiece carrier's internal electrical contacts to test whether it was damaged during the soldering process.

[0032] The term emitter can refer to a laser diode bar. The emitter can be made of a semiconductor laser material. The emitter and the mounting plate can be of a chip-on-submount design. Each emitter can be configured to convert electrical power into optical power by generating a light beam, particularly a laser beam. The emitter can be configured as a laser diode.

[0033] The workpiece carrier, in particular the base body, may have a coupling device. The coupling device may be configured to attach a fixture to the workpiece carrier. The coupling device may have a number, for example, 1, 2, or 3, of threaded holes. The fixture may, for example, serve to perform a positioning, holding, or transport task, particularly without requiring the base plate to be removed from the workpiece carrier. The fixture may be temporarily attached to the workpiece carrier for a manufacturing step performed at a workstation or permanently for the production of the laser diode module using the coupling device.

[0034] The workpiece carrier can be configured for the production of multiple laser diode modules. For example, the workpiece carrier can be configured for the production of one laser diode module and another. The base body can have an additional mounting section and an additional opening. The workpiece carrier can have an additional mounting device for attaching another base plate of the additional laser diode module to the additional mounting section. The additional base plate and the other components of the workpiece carrier can be identical in construction to the base plate and components of the workpiece carrier described above, and therefore the description also applies to the additional base plate and the other components of the workpiece carrier.

[0035] Sectional covering can be understood as sectional covering, sectional concealing, sectional masking, sectional masking or sectional overlaying.

[0036] Another aspect of the workpiece carrier is that the cutout allows for machining of the underside of the base plate facing the mounting section. Specifically, a tool from a workstation can be inserted into the cutout. This tool could be, for example, a cooling element and / or a heating element for creating a solder joint. This allows components of the laser diode module to be placed on the upper side of the base plate, opposite the underside, and then soldered to the base plate. To create the solder joint, the heating element can be inserted into the cutout in such a way that direct contact is established between the heating element and the base plate. The heating element can then heat the base plate to the temperature required for soldering. Afterward, the heating element can be removed from the cutout.The cooling element can be inserted into the opening in such a way that direct contact is established between the cooling element and the base plate. The cooling element cools the base plate, reducing heat transfer from the base plate to the workpiece carrier. This allows for the soldering of the connection between the base plate and the components.

[0037] Another aspect of the workpiece carrier can be that the base plate can remain attached to the mounting section until the laser diode module is completely manufactured. In other words, the base plate can be attached to the mounting section for the laser diode module manufacturing process, and only after the manufacturing process is complete can the base plate be detached from the mounting section. The manufacturing process can be completed by attaching the laser diode module housing to the base plate. A further aspect of the workpiece carrier can be its ability to accommodate base plates of varying sizes, enabling the production of different laser diode modules using the same workstations. Specifically, the mounting device can be designed to secure base plates of different sizes to the mounting section.

[0038] In a further development of the workpiece carrier, the base body has a coating, particularly for reducing or preventing heat transfer between the base plate and the base body. Advantageously, this further reduces the mechanical and / or thermal coupling between the base body and the base plate. The coating can also be referred to as thermal insulation. The coating can form a surface of the base body. The coating can be an oxide layer. The coating can be a hard anodized coating. The coating can be applied to a core of the base body. The thermal conductivity of the coating can be lower than that of the core of the base body.

[0039] In a further development of the workpiece carrier, the fastening section is smaller than the opening. Advantageously, this allows for minimal contact between the base body and the base plate, resulting in low mechanical and / or thermal coupling between the base body and the base plate.

[0040] The fastening section can be smaller than the portion of the opening covered by the base plate if the base plate is attached to the fastening section by means of the fastening device. In particular, the area of ​​the fastening section can be smaller than the area of ​​the portion of the opening covered by the base plate if the base plate is attached to the fastening section by means of the fastening device.

[0041] In a further development of the workpiece carrier, the opening is at least five, eight, or ten times larger than the mounting section. This ratio between the opening and the mounting section allows for a particularly effective reduction of the thermal and / or mechanical coupling between the base body and the base plate. In this further development of the workpiece carrier, the carrier incorporates a drive mechanism designed to interact with a conveyor system for transporting the workpiece carrier from one workstation to another for manufacturing the laser diode module. Advantageously, the drive mechanism ensures safe transport. The conveyor system eliminates the need for manual transport between workstations by a production worker.

[0042] The conveyor system can connect the individual workstations for manufacturing the laser diode module. The conveyor system can transport the workpiece carrier to the individual workstations one after the other.

[0043] The drive device can have one or more of the following components: a guide, a stop, a recess, a cylindrical pin, and a centering bore. The drive device can be used to transport the workpiece carrier into an interface of the conveyor system. Additionally or alternatively, the interface of the conveyor system can be used with the drive device to transport the workpiece carrier.

[0044] In a further development of the workpiece carrier, the workpiece carrier features a gripper interface for inserting the workpiece carrier into a workstation and / or for removing the workpiece carrier from a workstation using a gripper. Advantageously, this allows the workpiece carrier to be inserted into or removed from a workstation that has limited space for insertion or removal.

[0045] The gripper interface can, for example, have a number, in particular 3 or 4, of recesses and / or a number, in particular 3 or 4, of cylindrical pins. The gripper interface can be arranged on an edge of the base body.

[0046] In a further development of the workpiece carrier, the workpiece carrier incorporates an identification device for identifying the workpiece carrier itself. Advantageously, this allows the workpiece carrier to be identified during the manufacturing of the laser diode module. In particular, this allows the base plate to be indirectly identified, thus eliminating the need for identification directly on the base plate. This advantageously enables the use of base plates for manufacturing a laser diode module whose size precludes the placement of an identification device.

[0047] The identification device can be machine-readable. The identification device can be arranged on the base body. In particular, the identification device can be arranged on an edge of the base body. The identification device can have binary coordination. The identification device can be readable by means of an inductive measurement.

[0048] The identification device can have multiple threaded holes arranged in the base body. The identification device can have a plurality of screws, for example, 8, 10, or 15. The workpiece carrier can be coded by selectively screwing the screws into the threaded holes using the identification device.

[0049] An assignment between the coding and the components of the laser diode module can be made after the base plate is attached to the mounting section and before the first manufacturing step, which is performed by a workstation, is carried out. The assignment between the coding and the components of the laser diode module can be removed after the laser diode module has been manufactured and the base plate has been detached from the mounting section.

[0050] In a further development of the workpiece carrier, the workpiece carrier features a centering device for positioning, in particular centering, the base plate relative to the opening. Advantageously, this allows the base plate to be positioned in a predetermined position on the mounting section.

[0051] The centering device can have a first centering bore and a second centering bore. The first and second centering bores can be located in the base body. The opening can be located between the first and second centering bores.

[0052] The centering device can comprise a cylindrical pin and a sword pin. The cylindrical pin can be inserted into the first centering bore, and the sword pin can be inserted into the second centering bore. The cylindrical pin can be configured to prevent straight movement of the base plate parallel to the mounting section. The sword pin can be configured to prevent rotation of the base plate around the cylindrical pin, particularly around a longitudinal axis of the cylindrical pin. In particular, the sword pin can be configured solely to prevent rotation of the base plate around the cylindrical pin, particularly around the longitudinal axis of the cylindrical pin.

[0053] A workpiece carrier arrangement according to the invention is designed for manufacturing a laser diode module. The workpiece carrier arrangement comprises a base plate of the laser diode module and a workpiece carrier as previously described. The base plate is attached to the mounting section by means of the mounting device in a fixed state and is not attached to the mounting section in a released state, in particular a freed state.

[0054] The previously given description of the base plate can apply accordingly to the workpiece carrier arrangement.

[0055] The base plate, when fastened, can contact the fastening section via a contact surface, particularly a flat one. In the fastened state, the base plate can cover the opening, at least partially, and in particular completely. In the fastened state, the base plate can enclose the opening, forming a covered area. The area of ​​the contact surface can be smaller than the area of ​​the covered area. The area of ​​the covered area can be at least five, eight, or ten times larger than the area of ​​the contact surface.

[0056] The fixed state can be established before the first manufacturing step, which is performed by a workstation. The unfixed state can be established after the laser diode module has been manufactured. The fixed state can be maintained continuously between the execution of the first manufacturing step and the completion of the laser diode module manufacturing process.

[0057] The base plate can be plate-shaped. The base plate can be a metal plate. The base plate can be a single piece. The base plate can be made of a material containing at least 40% copper by weight, preferably at least 60% or 80% copper by weight. The base plate can have a fixing section for fastening the base plate by means of the fastening device. In the fastened state, the fastening device can contact the fixing section.

[0058] A manufacturing system according to the invention is designed for producing a laser diode module. The manufacturing system comprises a plurality, for example 3, 5 or 15, of workstations for producing the laser diode module, at least one workpiece carrier as previously described, and a conveyor system for transporting the workpiece carrier between the workstations. Advantageously, the manufacturing system enables fully automated production of a laser diode module.

[0059] The previously given description of the conveyor system and / or the workstations can apply accordingly to the production plant.

[0060] The conveyor system can be designed to transport the workpiece carrier between the workstations.

[0061] At least one workstation can be equipped to place an optical component of the laser diode module onto the base plate. The optical component can be, for example, a mirror or a lens. At least one workstation can be equipped to create a soldered and / or adhesive bond. At least one workstation can be equipped to create the electrical wiring of the emitters. At least one workstation can be equipped to test the laser diode module for functionality, in particular to verify its functionality. At least one workstation can be equipped to label the laser diode module. At least one workstation can be equipped to attach the laser diode module housing to the base plate.

[0062] The production plant can have multiple workpiece carriers. In particular, the production plant can have at least 20, 50, or 150 workpiece carriers.

[0063] In a further development of the production plant, at least one workstation is a soldering station. The soldering station has a cooling element and / or a heating element for creating a solder joint. The cooling element and / or the heating element can be used for direct contact with the base plate for the purpose of creating the solder joint in the opening. Advantageously, this allows the solder joint to be created with minimal heating and / or cooling of the base body, thereby reducing or completely preventing unwanted displacement of the base plate relative to the base body and / or unwanted warping between the base plate and the base body due to thermal effects.

[0064] For example, the emitter and the mounting plate can be placed on the base plate. The heating element can then be inserted into the opening, forming contact with the base plate. The heating element cannot touch the base body. The heating element can heat the base plate to create the solder joint. Afterward, the heating element can be removed from the opening. The cooling element can be inserted into the opening, forming contact with the base plate. The cooling element cannot touch the base body. The cooling element can cool the base plate sufficiently to form the solder joint between the base plate and the mounting plate.

[0065] One use according to the invention relates to a previously described workpiece carrier, a previously described workpiece carrier arrangement, and / or a previously described manufacturing plant for producing the laser diode module. In other words, the use according to the invention relates to the production of the laser diode module using the previously described workpiece carrier, the previously described workpiece carrier arrangement, and / or the previously described manufacturing plant.

[0066] A method according to the invention serves to manufacture a laser diode module. The method comprises: producing a fixed state in which a base plate of the laser diode module is attached to a workpiece carrier such that an opening in the workpiece carrier is at least partially covered by the base plate; and automatically manufacturing the laser diode module by means of a manufacturing system, in particular one described above, which has a plurality of workstations.

[0067] The manufacturing system described above can be configured to execute the process. In particular, the process can be configured to operate the manufacturing system described above. The description of the manufacturing system given above can apply to identical or functionally equivalent features of the process and / or vice versa. In a further development of the process, the automated production of the laser diode module includes the automated transport of the workpiece carrier to the workstations by means of a conveyor system within the manufacturing system.

[0068] In a further development of the process, the automatic manufacturing includes at least the automatic production of a soldered joint, in which a cooling element and / or a heating element is placed in the opening and a touching contact is established between the base plate and the cooling element and / or the heating element.

[0069] Further advantages and advantageous embodiments of the invention can be seen from the figures, their description, and the claims. All features disclosed in the figures, their description, and the claims can be essential to the invention, both individually and in any combination. The figures show:

[0070] Fig. 1 shows a schematic representation of a section of a manufacturing plant,

[0071] Fig. 2 shows a schematic oblique view of a workpiece carrier of the production plant with a base plate of a laser diode module to be manufactured,

[0072] Fig. 3 shows a schematic oblique view of the workpiece carrier without the base plate.

[0073] Fig. 4 shows another schematic oblique view of the workpiece carrier without the base plate,

[0074] Fig. 5 shows a schematic top view of the workpiece carrier and the base plate.

[0075] Fig. 6 shows a schematic view of detail VI according to Fig. 5.

[0076] Fig. 7 is a schematic view of detail VII according to Fig. 5.

[0077] Fig. 8 shows another schematic oblique view of the workpiece carrier,

[0078] Fig. 9 shows a schematic sectional view of the workpiece carrier along a section line IX-IX according to Fig. 5, and

[0079] Fig. 10 shows a schematic sectional view according to Fig. 9 during the production of a soldered joint. Fig. 1 shows a section of a production system 500 for the fully automated production of a laser diode module.

[0080] The manufacturing plant 500 has a plurality, for example 3, 5 or 15, of workstations 502 for manufacturing the laser diode module. Figure 1 shows four workstations 502 as an example. Each workstation 502 performs one manufacturing step for the production of the laser diode module.

[0081] One of the 502 workstations can place optical components of the laser diode module onto a base plate of the laser diode module and attach them to the base plate using an adhesive bond. One of the 502 workstations can solder a mounting plate, to which an emitter is attached, to the base plate. One of the 502 workstations can create the electrical wiring for the emitter. One of the 502 workstations can test the laser diode module. One of the 502 workstations can label the laser diode module. One of the 502 workstations can attach a housing for the laser diode module to the base plate.

[0082] The production plant 500 has a conveyor system 504 for transporting workpiece carriers 10 from the production plant 500 to the workstations 502. The workpiece carrier 10 can carry the base plate of the laser diode module.

[0083] The production system 500 can have a large number of workpiece carriers 10, for example 10, 20, 50 or more than 100. The workpiece carriers 10 of the production system 500 can be of identical design.

[0084] The workstations 502 are arranged on the conveyor system 504. When a workstation 502 has completed its manufacturing step, the workpiece carrier 10, together with the base plate attached to the workpiece carrier 10, is transported by the conveyor system 504 to the next workstation 502, until the workpiece carrier 10 has passed through all workstations 502.

[0085] Fig. 2 shows a workpiece carrier 10 of the production system 500 and a base plate 12 arranged on the workpiece carrier 10. Figs. 3 and 4 each show the workpiece carrier 10 without the base plate 12. The workpiece carrier 10 is designed for the automated production of the laser diode module. The base plate 12 and the workpiece carrier 10 form a workpiece carrier assembly 14. In a fixed state, the base plate 12 is attached to the workpiece carrier 10, and in a detached state, the base plate 12 is not attached to the workpiece carrier 10.

[0086] To automatically manufacture the laser diode module using the production system 500, a production worker attaches the base plate 12 to the workpiece carrier 10. In the attached state, the base plate 12 is arranged on the workpiece carrier 10 in the arrangement shown in Fig. 2.

[0087] The production worker feeds the workpiece carrier 10, with the attached base plate 12, to the conveyor system 504. The conveyor system 504 transports the workpiece carrier assembly 14 to the workstations 502. The workstations 502 process the base plate 12 to produce the laser diode module. After passing through all workstations 502, the production worker removes the workpiece carrier 10 together with the produced laser diode module. The production worker detaches the produced laser diode module from the workpiece carrier 10 by restoring it to its detached state. The attached state has been maintained continuously throughout its passage through all workstations 502.

[0088] Fig. 2 shows that the base plate 12 is plate-shaped. The base plate 12 is formed in one piece. The base plate is made of a material with a copper content of at least 60 wt%. The base plate 12 has a flat surface 16 to which the optical components of the laser diode module are attached using the manufacturing system 500.

[0089] Figures 2 to 4 show that the workpiece carrier 10 has a base body 18. The base body 18 is plate-shaped. The base body 18 is formed from a metal plate. The base body 18 is made of a material with a content of at least 90 wt% aluminum.

[0090] The base body 18 has a coating 20. The coating 20 forms a surface of the base body 18. The coating 20 is a hard anodized coating. The coating 20 serves to reduce or prevent heat transfer between the base plate 12 and the base body 18. The workpiece carrier 10 has a number of positioning devices 22, 24 for positioning the workpiece carrier 10 in a workstation 502, in particular in a work area of ​​the workstation 502, in a predetermined position, see Figs. 3 and 4.

[0091] The workpiece carrier 10 shown in the figures has a first positioning device 22 and a second positioning device 24. In an alternative embodiment not shown, the workpiece carrier can have more than two or a single positioning device.

[0092] The first positioning device 22 is formed by two centering bores in the base body 18. The second positioning device 24 is formed by four centering bores in the base body 18. The centering bores of the first positioning device 22 differ from the centering bores of the second positioning device 24 in their diameter and in their positions, in particular in their positions on the base body 18.

[0093] The centering bores of the two positioning devices 22, 24 penetrate completely through the base body 18. In other words, the two positioning devices 22, 24 extend from a first side 26 of the base body 18 to a second side 28 of the base body 18. The second side 28 of the base body 18 is flat. Advantageously, the flat design of the second side 28 simplifies the fastening and unfastening of the base plate 12 to or from the workpiece carrier 10.

[0094] The two positioning devices 22, 24 serve to interact with the interfaces of the workstations 502, so that the workpiece carrier 10 is positioned in the specified position in each workstation 502. This allows the workpiece carrier 10 to be positioned with repeatable accuracy in several workstations 502, thus enabling the fully automated production of the laser diode module.

[0095] Each workstation 502 has an interface for positioning the workpiece carrier 10. Each interface of the workstations 502 is formed by centering pins that can be inserted into the designated positioning device 22, 24. The workstations 502 of the production system 500 have two interface variants. One interface variant can be inserted into the first positioning device 22, and the other interface variant can be inserted into the second positioning device 24. The two interface variants differ in the diameter of the centering pins and in the arrangement of the centering pins.

[0096] It is also conceivable that all workstations in the production plant have an identically designed interface. In this case, the workpiece carrier can have a single positioning device.

[0097] The base body 18 has a fastening section 30 and an opening 32, see Fig. 4. The fastening section 30 serves to contact the base plate 12 when the base plate 12 is attached to the base body 18.

[0098] The fastening section 30 is planar. The fastening section 30 is a surface section of the base body 18. The second side 28 has the fastening section 30. The fastening section 30 borders, in particular directly, on the opening 32.

[0099] In Fig. 2, the mounting section 30 is covered by the base plate 12. Fig. 2 shows that, in the mounted state, the mounting section 30 and the base plate 12 form a contact. The mounting section 30 can be a contact surface of the contact between the base plate 12 and the base body 18.

[0100] The area of ​​the fastening section 30 is smaller than the area of ​​a cross-section of the opening 32 on the second side 28. In particular, the area of ​​the fastening section 30 is more than six times smaller than the area of ​​a cross-section of the opening 32 on the second side 28. This ensures that a low mechanical and / or thermal coupling is created between the base body 18 and the base plate 12, thus reducing or completely preventing the transfer of heat and / or vibrations between the base body 18 and the base plate 12.

[0101] The opening 32 extends from the first side 26 to the second side 28. The opening 32 extends in a straight line from the first side 26 to the second side 28. One cross-section of the opening 32 is rectangular. The rectangular cross-section of the opening 32 has rounded corners. The opening 32 has an opening 34 on the second side 28. The fastening section 30 adjoins the opening 34. Fig. 2 shows that the opening 32, in particular the opening 34, is at least partially covered by the base plate 12. When the base plate 12 is attached to the workpiece carrier 10, the area of ​​a surface section of the opening 34 covered by the base plate 12 is larger than the area of ​​the mounting section 30. In particular, the area of ​​the surface section of the opening 34 is at least five times larger than the area of ​​the mounting section 30.

[0102] Fig. 4 shows that the cross-section of the opening 32 tapers section by section. The opening 32 has a first section 36 where its cross-section tapers, and a second section 38 where its cross-section is constant. The first section 36 extends away from the first side 26, and the second section 38 extends away from the second side 28.

[0103] Fig. 5 shows that the base plate 12 is attached to the mounting section 30 of the workpiece carrier 10 by means of a fastening device 40. Fig. 5 shows the attached state of the workpiece carrier assembly 14. The fastening device 40 is shown with dashed lines in Fig. 5. For the sake of clarity, the fastening device 40 is not shown in Figs. 2 to 4.

[0104] The fastening device 40 serves to detachably fasten the base plate 12 to the fastening section 30. The base body 18 has fastening holes 42 by means of which the fastening device 40 is attached to the base body 18. The fastening holes 42 define the fastening section 30.

[0105] The fastening device 40 can be switched between a release state and a clamping state. In the release state, the fastening device 40 allows the base plate 12 to be positioned on the fastening section 30 or the base plate 12 to be detached from the fastening section 30. In the clamping state, the fastening device 40 prevents the base plate from being unintentionally removed, in particular detached, from the fastening section 30. Specifically, the fastening device 40 prevents the base plate 12 from being unintentionally removed or detached from the fastening section 30 during the manufacturing of the laser diode module.

[0106] The fastening device 40 has a first fastening unit 44 and a second fastening unit 46. The two fastening units 44, 46 are attached to the base body 18 such that the opening 32 is arranged between the two fastening units 44, 46.

[0107] Each fastening unit 44, 46 has at least one spring that biases a contact section of the fastening unit 44, 46 against the fastening section 30. The workpiece carrier assembly 14 can be moved into the fastened state by moving the contact sections of the two fastening units 44, 46 away from the fastening section 30 while tensioning the springs, arranging the base plate 12 against the fastening section 30, and releasing the contact sections. Upon release, the biased spring presses the two contact sections against the base plate 12. Each contact section forms a contact with a fixing section 48 of the base plate 12. The fixing section 48 may be separated from the flat surface 16 by a step. The base plate 12 is pressed into the fastened state against the fastening section 30 by means of the fastening device 40.The fastening device 40 can be configured to press the base plate 12 against the fastening section 30 with a force that has a direction orthogonal to the fastening section 30.

[0108] The workpiece carrier assembly 14 can be brought into the released state by moving the contact sections of the two fastening units 44, 46 away from the fastening section 30 while tensioning the springs, removing the base plate 12 from the fastening section 30 and releasing the contact sections.

[0109] The fastening device 40 and the flat design of the second side 28 of the base body 18 enable base plates of different sizes to be attached to the workpiece carrier 10. This allows different variants of laser diode modules to be manufactured using the production line system 500.

[0110] Fig. 5 shows that the opening 32 is partially covered by the base plate 12 when the base plate is attached to the fastening section 30 by means of the fastening device 40.

[0111] Fig. 4 shows that the workpiece carrier 10 has a centering device 52 for positioning, in particular aligning, the base plate 12 relative to the opening 32. The centering device 52 has a first centering bore 54 and a second centering bore 56. The two centering bores 54, 56 of the centering device 52 extend from the first side 26 to the second side 28. The two centering bores 54, 56 of the centering device 52 completely penetrate the base body 18.

[0112] Fig. 6 shows a view of detail VI and Fig. 7 a view of detail VII, each according to Fig. 5 without the fastening device 40. Figs. 6 and 7 show that the base plate 12 has a first bore 58 and a second bore 60. In the fastened state, the first bore 58 is concentric with the first centering bore 54 and the second bore 60 is concentric with the second centering bore 56.

[0113] The centering device 52 has a cylindrical pin and a sword pin. For clarity, the sword pin and the cylindrical pin are not shown in the figures. The cylindrical pin is inserted into the first centering bore 54 and the sword pin into the second centering bore 56. A section of the cylindrical pin and a section of the sword pin each project beyond the second side 28.

[0114] The section of the cylindrical pin that extends beyond the second side 28 is inserted into the first bore 58 of the base plate 12. The cylindrical pin serves to prevent the base plate from moving in a straight line parallel to the fastening section 30.

[0115] The section of the sword pin that projects beyond the second side 28 is inserted into the second bore 60 of the base plate 12. The sword pin serves, in particular only, to prevent rotational movement of the base plate 12 around the cylindrical pin of the centering device 52, especially around a longitudinal axis of the cylindrical pin of the centering device 52.

[0116] Fig. 3 shows that the workpiece carrier 10 has a drive device 62, 64. The drive device 62, 64 serves to transport the workpiece carrier 10 between the workstations 502 by means of the conveyor system 504.

[0117] The drive mechanism 62, 64 is formed by a first stage 62 and a second stage 64 of the base body 18. In other words, the base body 18 has the first stage 62 and the second stage 64. The two stages 62, 64 are arranged on the first side 26. This gives the first side 26 a stepped design. The conveyor system 504 has an interface designed to contact the two stages 62, 64. The interface can be designed as a recess into which the workpiece carrier 10 is inserted.

[0118] Figures 2, 3, and 4 each show that the workpiece carrier 10 has a gripper interface 66. The gripper interface 66 is used to insert the workpiece carrier 10 into a workstation 502 and / or to remove the workpiece carrier 10 from a workstation 502 using a gripper.

[0119] The gripper interface 66 is formed by four recesses arranged on the base body 18. The four recesses are arranged on one edge of the base body 18. Two of the four recesses are arranged on one side of the base body 18, and the remaining two of the four recesses are arranged on the opposite side of the base body 18.

[0120] Figures 2, 3, and 4 each show that the workpiece carrier 10 has an identification device 68 for identifying the workpiece carrier 10. The identification device 68 is machine-readable. The identification device 68 is formed by a plurality of threaded bores 70, see Figure 2. The threaded bores 70 are arranged on an edge of the base body 18.

[0121] The identification device 68 has a number of screws 72 designed for establishing a binary coordinate by screwing them into selected threaded bores 70. Figure 8 shows an example of a possible binary coordinate.

[0122] The production system 500 has a readout device for reading the identification device 68 by means of an inductive measurement. Through the inductive measurement, the readout device determines whether and at which points in the threaded bores 70 a screw 72 is screwed in. The production of the laser diode module can then be carried out depending on the binary coordinates read out by the readout device.

[0123] Before the first manufacturing step is performed by a workstation 502, the production worker can establish the binary coordinates. Additionally, the production worker can establish an assignment between the binary coordinates and the components of the laser diode module. Fig. 3 shows that the workpiece carrier 10 has a coupling device 74. The coupling device 74 serves to attach a fixture to the workpiece carrier 10. The coupling device 24 is a threaded bore. The coupling device 24 is arranged on the base body 18. The fixture is attached to the workpiece carrier 10 by means of a screw connection. The fixtures serve to perform a positioning, holding, or transport task. Advantageously, the coupling device 74 allows the fixture to be temporarily attached to the workpiece carrier 10, particularly without structurally modifying the workpiece carrier 10.This allows manufacturing steps that require the device to be carried out.

[0124] Fig. 9 shows a schematic sectional view of the workpiece carrier arrangement 14 along a section line IX-IX according to Fig. 5. In Fig. 9, the fastening of the fastening device 40 to the base body 18 is not shown.

[0125] Fig. 9 shows that the opening 32 provides access to the underside 80 of the base plate 12 facing the mounting section 30. The accessibility of the underside 80 of the base plate 12 can be used, for example, to create a soldered connection.

[0126] Fig. 10 shows a schematic sectional view of the workpiece carrier arrangement 14 from Fig. 9 during the production of a soldered joint. A mounting plate 82, which carries an emitter 84 for generating a laser beam, is to be attached to the flat surface 16 of the base plate 12 by means of the soldered joint.

[0127] A workstation 502 of the production plant 500 is configured as a soldering station. The soldering station has a cooling element and a heating element 506 for producing the solder joint. The workpiece carrier assembly 14 is used in the workstation 502 for producing the solder joint. The soldering station 502 inserts the heating element 506 into the opening 32, so that the heating element 506 forms a contact with the underside 80 of the base plate 12. The first section 36 of the opening 32, in which the cross-section of the opening 32 narrows, facilitates the insertion of the heating element 506 into the opening 32. Due to the direct contact between the base plate 12 and the heating element 506, the base plate 12 is heated directly by the heating element 506. A solder for creating the soldered connection, which is arranged between the base plate 12 and the retaining plate 82, melts.After the solder has melted, the heating element 506 is removed from the opening 32. The soldering station 502 inserts the cooling element into the opening 32 so that the cooling element forms contact with the underside 80 of the base plate 12. The base plate 12 is cooled directly by the cooling element through this contact. The solder joint is formed by the cooling and subsequent solidification of the solder. The use of the cooling element serves to reduce heat transfer from the base plate 12 to the workpiece carrier 10.

[0128] The opening 32 thus has a dual function. On the one hand, the opening 32 reduces contact between the base plate 12 and the base body 18, thereby reducing or completely eliminating thermal and mechanical coupling between the base plate 12 and the base body 18. On the other hand, the opening 32 allows direct access to the underside 80 of the base plate 12, enabling, for example, direct heating and / or cooling of the base plate 12, thereby reducing or completely eliminating heat input into the base body 18, for example, during the production of a soldered joint.Consequently, the opening 32 reduces or completely avoids unwanted displacement of the base plate relative to the base body and / or unwanted distortion between the base plate and the base body, which is why the workpiece carrier 10 can be positioned and used with high repeatability in the workstations 502 and the laser diode module can be manufactured with high precision.

Claims

Patent claims 1. Workpiece carrier (10) for manufacturing a laser diode module, comprising: a number of positioning devices (22, 24) for positioning the workpiece carrier (10), a base body (18) with a mounting section (30) and an opening (32), and a mounting device (40) configured to attach a base plate (12) of the laser diode module to the mounting section (30), wherein the opening (32) is at least partially covered by the base plate (12) when the base plate (12) is attached to the mounting section (30) by means of the mounting device (40).

2. Workpiece carrier (10) according to claim 1, wherein the base body (18) has a coating (20).

3. Workpiece carrier (10) according to claim 1 or 2, wherein the fastening section (30) is smaller than the opening (32).

4. Workpiece carrier (10) according to claim 3, wherein the opening (32) is at least five times, eight times or ten times larger than the fastening section (30).

5. Workpiece carrier (10) according to one of the preceding claims, wherein the workpiece carrier (10) has a drive device (62) which is designed to cooperate with a conveyor system (504) for the purpose of transporting the workpiece carrier (10) from one workstation (502) to another workstation (502) for manufacturing the laser diode module.

6. Workpiece carrier (10) according to one of the preceding claims, wherein the workpiece carrier (10) has a gripper interface (66) for inserting the workpiece carrier (10) into a work station (502) and / or for removing the workpiece carrier (10) from a work station (502) by means of a gripper.

7. Workpiece carrier (10) according to one of the preceding claims, wherein the workpiece carrier (10) has an identification device (68) for identifying the workpiece carrier (10).

8. Workpiece carrier (10) according to one of the preceding claims, wherein the workpiece carrier (10) has a centering device (52) for centering the base plate (12) relative to the opening (32).

9. Workpiece carrier arrangement (14) for manufacturing a laser diode module, comprising: a base plate (12) of the laser diode module, and a workpiece carrier (10) according to one of the preceding claims, wherein the base plate (12) is attached to the fastening section (30) by means of the fastening device (40) in a fastened state and is not attached to the fastening section (30) in a detached state.

10. Manufacturing plant (500) for manufacturing a laser diode module, comprising: a plurality of workstations (502) for manufacturing the laser diode module, at least one workpiece carrier (10) according to one of the preceding claims 1 to 8 or at least one workpiece carrier arrangement (14) according to claim 9, and a conveyor system (504) for transporting the workpiece carrier (10) between the workstations (502).

11. Manufacturing plant (500) according to claim 10, wherein at least one of the plurality of workstations (502) is a soldering station (502), wherein the soldering station (502) has a cooling element and / or a heating element (506) for producing a soldered joint, wherein the cooling element and / or the heating element (506) can be used for direct contact with the base plate (12) for the purpose of producing the soldered joint in the opening (32).

12. Use of a workpiece carrier (10) according to one of claims 1 to 8, a workpiece carrier arrangement (14) according to claim 9 and / or a manufacturing plant (500) according to claim 10 or 11 for manufacturing the laser diode module.

13. Method for manufacturing a laser diode module, the method comprising: Producing a fixed state in which a base plate (12) of the laser diode module is attached to a workpiece carrier (10) such that a breakthrough (32) of the workpiece carrier (10) is at least partially covered by the base plate (12), and automatically producing the laser diode module by means of a manufacturing system (500) which has a plurality of workstations (502).

14. The method of claim 13, wherein the automatic manufacturing of the laser diode module is an automatic Transporting the workpiece carrier (10) to the workstations (502) by means of a conveyor system (504) of the production plant (500) is included.

15. Method according to claim 13 or 14, wherein the automatic production comprises at least one automatic production of a soldered connection comprising a cooling element and / or a heating element (506) placed in the opening (32) and a touching contact between the base plate (12) and the cooling element and / or the heating element (506) is established.

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