Electrical circuit module and method for its manufacture

Abstract

The invention relates to an electrical circuit module (10), in particular for use in a hearing aid, comprising a folded substrate (15), wherein the substrate (15) comprises several interconnected component sections (15.1, 15.2, 15.3, 15.4), of which two adjacent component sections (15.1, 15.2) are connected to each other by a flexible folding area (15.12). The component placement sections (15.1, 15.2, 15.3, 15.4) are each equipped with at least one monolithic circuit in the form of a disk-shaped chip (12.1, 12.2, 12.3, 12.4) such that the chips (12.1, 12.2, 12.3, 12.4) are connected by conductive traces of the substrate (15) according to a circuit function of the circuit module (10). The folded substrate (15) comprises at least one substack (16) formed by the two adjacent component placement sections (15.1, 15.2) that are folded on top of each other along the flexible folding area (15.12), such that the chips (12.1, 12.2, 12.3, 12.4) are connected by conductive traces of the substrate (15) according to a circuit function of the circuit module (10).2) with which the adjacent component sections (15.1, 15.2) are equipped, their upper surfaces coming into contact with each other. The invention is characterized in that at least one of the component sections (15.1, 15.2) is equipped with a chip (12.1, 12.2) having a thickness (d2) that is less than the thickness (d1) of a chip (12.3) with which another of the component sections (15.3) is equipped. The invention further relates to a method for manufacturing such an electrical circuit module.