Matrix temperature control chip of thermal forming machine
A technology for controlling chips and thermoforming machines, used in temperature control, non-electric variable control, control/regulation systems, etc., can solve the problem of not considering the coupling interference of control points, etc., to improve temperature field distribution, reduce use costs, reduce The effect of production costs
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2014-04-23
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the field of material thermoforming equipment manufacturing, and relates to a special chip for temperature control of a sheet / plate thermoforming machine and a temperature decoupling control method in the forming machine. Background technique
[0002] Thermoforming machines are commonly used heating equipment in industrial production. Usually, the molding objects are thermoplastic plates and sheets. The upper and lower ends of the thermoforming machine are equipped with ceramic heating chips that can be individually set for heating power. During work, the blank is heated to an elastic-plastic state at a certain temperature and then pressed and sheared to obtain a product. The temperature field control characteristic is the core performance index of the molding machine. Due to different molding materials and different thicknesses of sheets used, the control temperature is often different. Even for the same workpiece, the tempera...
Examples
Embodiment Construction
[0013] like figure 1 As shown, the control chip of the present invention is divided into 7 processing units that operate in parallel with each other: IO unit, clock unit, communication unit, temperature field solution unit, matrix decoupling control unit, PID calculation unit, PWM output unit, wherein the communication The unit obtains the temperature field setting target (3) through the peripheral communication interface and transmits it to the PID calculation unit in the chip. The IO unit obtains the temperature value of each test point (4) through the external thermocouple and AD conversion chip and filters it. Transmission to the temperature field solving unit, the temperature field solving unit uses the temperature field solving function to find the distribution of the temperature field in the furnace (5) and the control point decoupling matrix, the PID calculation unit sets the target (3) and the actual temperature field distribution according to the temperature field (5...