Adhesive tape structure and adhesive tape container
A technology of adhesive tape and structure, which is applied in the direction of adhesives, film/sheet adhesives, layered products, etc., can solve the problems such as the limit of long size, and achieve the effect of preventing bonding and realizing long size
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2016-07-20
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a technique for increasing the size of an adhesive tape for solar cell tab wire bonding or the like. Background technique
[0002] Conventionally, long-sized adhesive tapes for bonding various electronic components and the like are known.
[0003] Such an adhesive tape is formed on a narrow and long release sheet, and is shipped in the form of a roll wound on a reel.
[0004] In addition, at the manufacturing site, the adhesive tape is pulled out from the reel for use, and when the adhesive tape is used up, the production line is temporarily stopped and the adhesive tape is replaced with the reel.
[0005] However, if the length of the adhesive tape is short, it is necessary to stop the production line every time the reel is replaced, which reduces the production efficiency.
[0006] Therefore, in recent years, so-called "lengthening" which makes the length of the adhesive tape which can be wound up on one reel as lon...
Examples
Embodiment 1
[0142] Using the above-mentioned adhesive tape and connecting tape, a Figure 5 (a) Sample of the adhesive tape structure of the structure shown.
[0143] In this case, as the substrate-side adhesive member, a silicon-based adhesive tape (Dexerials Co., Ltd. Society) system T4082S).
[0144] On the other hand, as the peeling side adhesive member, an adhesive made of acrylic resin (SK Dyne 1717 manufactured by Soken Chemical Co., Ltd.) with a thickness of 40 μm formed on a PET base material with a thickness of 38 μm was used. A silicon-based adhesive tape with a layer length of 5 cm.
[0145] Then, two adhesive tapes having a length of 50 m were bonded with the connecting tape having a length of 30 cm using the adhesive member on the substrate side and the adhesive member on the peeling side to prepare a sample of an adhesive tape structure.
Embodiment 2
[0147] A sample of an adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side adhesive member was 10 μm. it is Figure 6 structure shown.
Embodiment 3
[0149] A sample of an adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side adhesive member was 20 μm. it is Figure 6 structure shown.