Cooling device for heating element and method for manufacturing the cooling device

A heating element and cooling device technology, applied in the computer field, can solve the problems of lowering the surface temperature of heating elements, fewer surface vaporization cores, and poor boiling performance, and achieve the effects of increasing vaporization cores, improving boiling performance, and efficient heat dissipation

CN106455446BActive Publication Date: 2019-02-15DAWNING INFORMATION IND BEIJING +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2019-02-15

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Abstract

The invention discloses a heating element cooling device and a manufacturing method of the cooling device. The cooling device comprises: a metal substrate arranged above the heating element and covering the heating element; the metal substrate is in contact with the surface of the heating element; The surface of the heating element includes: a porous metal covering layer, which is located above the heating element and covers the heating element. By arranging a metal substrate with a porous metal covering layer on the surface of the heating element, the vaporization core is increased, the boiling performance of the heating element is improved, and an efficient heat dissipation effect on the surface temperature of the heating element is realized.
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Description

technical field

[0001] The present invention relates to the field of computer technology, in particular to a cooling device for heating elements of an immersion liquid cooling server and a manufacturing method of the cooling device. Background technique

[0002] In addition to the common air-cooling method that relies on cold air to dissipate heat for the computer, there is also a liquid-cooling method, which directs the coolant directly to the heat source, while the air-cooling method is indirect refrigeration; The heat transferred, that is, the heat dissipation efficiency, can reach 3500 times that of the air-cooled cooling method. Liquid cooling radiators appeared in the market around 2008. Server manufacturers such as HP and IBM and other companies focusing on data center technology have successively launched liquid cooling products.

[0003] Evaporative cooling is a cooling method that uses the latent heat of vaporization when the fluid boils to remove heat from the th...

Examples

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0025] According to an embodiment of the present invention, a cooling device for a heating element is provided.

[0026] Also refer to figure 2 and image 3 , the cooling device of the heating element according to the embodiment of the present invention includes: a metal substrate 21 arranged above the heating element and covering the heating element (not shown); the metal substrate 21 is in contact with the surface of the heating element; and the metal substrate 21 is away from the heating...