Magnetic field shielding structure and mobile device including the same

Abstract

The present invention provides a magnetic field shielding structure and a mobile device including the magnetic field shielding structure, wherein the magnetic field shielding structure comprises: a magnetic layer; and a resonant shielding circuit, comprising a capacitor and a conductor connected to the capacitor and having a loop form. At least a portion of the magnetic layer overlaps with a region surrounded by the conductor in a thickness direction of the magnetic layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2017-0043152 filed on April 3, 2017, in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2017-0045125 filed on April 7, 2017, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein in their entirety by reference for all purposes. Technical Field

[0002] The present disclosure relates to a magnetic field shielding structure and a mobile device including the magnetic field shielding structure. Background Art

[0003] In recent years, mobile devices with wireless charging capabilities that comply with the Wireless Power Consortium (WPC) communication protocol, the Near Field Communication (NFC) communication protocol, or the Magnetic Secure Transfer (MST) communication protocol have been introduced. The WPC, NFC, and MST communication protocols have different operating frequencies, different data transfer rates, and different power transfer capabilities.

[0004] Such a mobile device may include a sheet of magnetic material that blocks and focuses electromagnetic waves. For example, a sheet of magnetic material may be disposed between a power receiving coil and a battery of such a mobile device (operating as a wireless power receiver) to prevent the magnetic field generated in the power receiving coil from reaching the battery and to enable the electromagnetic waves generated by the wireless power transmitter to be effectively transmitted to the power receiving coil of the mobile device. Such a sheet of magnetic material needs to be relatively thick to provide sufficient shielding performance, thereby increasing the thickness of the mobile device. In addition, as the thickness of the magnetic material sheet increases, the core loss of the high frequency band also increases. Therefore, the increase in performance due to the increase in the thickness of the magnetic material sheet may be less than expected. Summary of the invention

[0005] This summary is provided to introduce selected concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0006] In one general aspect, a magnetic field shielding structure includes: a magnetic layer; and a resonant shielding circuit including a capacitor and a conductor connected to the capacitor and having a loop form; wherein at least a portion of the magnetic layer overlaps with an area surrounded by the conductor in a thickness direction of the magnetic layer.

[0007] The conductor may be disposed on a surface of the magnetic layer.

[0008] The capacitor may be disposed on a surface of the magnetic layer.

[0009] The magnetic field shielding structure further includes a bonding layer interposed between the magnetic layer and the conductor and bonding the magnetic layer to the conductor.

[0010] The conductor may be a conductor in a circuit board.

[0011] The magnetic layer may be provided in a region surrounded by the conductor.

[0012] The magnetic layer and the conductor may be disposed at the same height.

[0013] The capacitor may be a multilayer ceramic capacitor.

[0014] The conductor may be a coil having at least two turns.

[0015] The coil may be a solenoid.

[0016] The different turns of the coil may be arranged at the same height.

[0017] The capacitor and the conductor may form an LC circuit.

[0018] The resonant shielding circuit may be electrically isolated.

[0019] The magnetic layer may include a plurality of magnetic layers forming a stack structure.

[0020] The conductor may be disposed on a surface of the stacked structure.

[0021] The conductor may be interposed between two adjacent magnetic layers of the stacked structure.

[0022] The conductor may surround a side surface of the stack structure.

[0023] The magnetic field shielding structure may further include another resonant shielding circuit.

[0024] The conductor of the resonant shield circuit may be disposed on one surface of the magnetic layer; and the conductor of the other resonant shield circuit may be disposed on another surface of the magnetic layer on the side of the magnetic layer opposite to the one surface.

[0025] The conductor of the resonant shield circuit and the conductor of the other resonant shield circuit may be disposed on a same surface of the magnetic layer.

[0026] In another general aspect, a mobile device includes: a mobile device body; a battery; a coil portion; and a magnetic field shielding structure, which is located between the battery and the coil portion and includes a magnetic layer and a resonant shielding circuit, the resonant shielding circuit including a capacitor and a conductor connected to the capacitor and having a loop form, wherein at least a portion of the magnetic layer overlaps with an area surrounded by the conductor in a thickness direction of the magnetic layer.

[0027] The magnetic layer may be interposed between the resonance shield circuit and the coil part.

[0028] In another general aspect, a magnetic field shield structure includes: a magnetic layer; and a resonant shield circuit configured to block at least a portion of a magnetic field passing through the magnetic layer and including a capacitor and a conductor connected to both ends of the capacitor and having a loop form.

[0029] The resonant shielding circuit may have a resonant frequency that is substantially equal to the frequency of the magnetic field.

[0030] At least a portion of the magnetic layer may be interposed between the power receiving coil and the resonance shield circuit.

[0031] The conductor may be provided on the surface of the magnetic layer, or provided inside the magnetic layer, or the magnetic layer may be provided in a region surrounded by the conductor.

[0032] In another general aspect, a mobile device includes: a mobile device body; a battery, disposed in the mobile device body; a power receiving coil, disposed in the mobile device body and configured to receive wireless power through either or both of magnetic induction and magnetic resonance; and a magnetic field shielding structure, disposed in the mobile device body between the battery and the power receiving coil and configured to block at least a portion of the magnetic field generated by the power receiving coil from reaching the battery; wherein the magnetic field shielding structure includes: a magnetic layer, configured to block at least a portion of the magnetic field generated by the power receiving coil from passing through the magnetic layer; and a resonant shielding circuit, configured to block at least a portion of any leakage magnetic field from the magnetic field generated by the power receiving coil that passes through the magnetic layer, the resonant shielding circuit including a capacitor and a conductor connected to both ends of the capacitor and having a loop form.

[0033] The magnetic layer may also be configured to block at least a portion of the magnetic field generated by the power receiving coil by a magnetic induction method; and the resonant shielding circuit may also be configured to block at least a portion of any leakage magnetic field passing through the magnetic layer by a magnetic resonance method.

[0034] At least a portion of the magnetic layer may be disposed between the power receiving coil and the resonance shield circuit.

[0035] The conductor may be provided on the surface of the magnetic layer, or provided inside the magnetic layer, or the magnetic layer may be provided in a region surrounded by the conductor.

[0036] Other features and aspects will be apparent from the following detailed description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a perspective view of an example of an appearance of a mobile device and a wireless charging system applied to the mobile device.

[0038] Figure 2 yes Figure 1 An exploded cross-sectional view of an example of the main internal structure of a mobile device and a wireless charging system.

[0039] Figure 3 is a schematic perspective view of an example of a magnetic field shielding structure.

[0040] Figure 4 It is shown Figure 3 A top view of an example of a resonant shielding circuit.

[0041] Figures 5 to 11 Other examples of magnetic field shielding structures are shown.

[0042] Fig.12 An example of the main components of a mobile device is shown.

[0043] Fig.13 and Fig.14 Other examples of magnetic field shielding structures are shown.

[0044] In all drawings and detailed description, the same reference numerals refer to the same elements. The drawings may not be drawn to scale, and the relative size, proportion, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0045] The following specific embodiments are provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example and is not limited to the examples set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, for increased clarity and brevity, descriptions of features known in the art may be omitted.

[0046] The features described herein may be implemented in different forms and shall not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the various possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0047] Throughout the specification, it will be understood that when an element such as a layer, region, or wafer (substrate) is referred to as being "on", "connected to," or "bonded to" another element, it may be directly "on", "connected to," or "bonded to" another element, or there may be other elements between the two elements, i.e., it may be indirectly "on", "connected to," or "bonded to" another element. In contrast, when an element is referred to as being "directly on", "directly connected to," or "directly bonded to" another element, there may be no other elements between the two elements. The term "and / or" as used herein includes any one and any combination of any two or more of the relevant listed items.

[0048] Figure 1 is a perspective view of an example of an appearance of a mobile device and a wireless charging system applied to the mobile device. Figure 2 yes Figure 1 An exploded cross-sectional view of an example of the main internal structure of a mobile device and a wireless charging system.

[0049] Reference Figure 1 and Figure 2 , a mobile device and a wireless charging system applied to the mobile device include a wireless power transmitter 10 and a wireless power receiver 20. Figure 1 and Figure 2 In the example of FIG. 4 , the wireless power receiver 20 is included in a mobile device 30 such as a mobile phone, a laptop or a tablet computer.

[0050] Inside the wireless power transmitter 10, a power transmission coil 11 is formed on a substrate 12, so when alternating current (AC) power is applied to the (wireless) power transmission coil 11, a magnetic field is generated around the (wireless) power transmission coil 11. This magnetic field induces an electromotive force in the power receiving coil 21 embedded in the wireless power receiver 20, so that the battery 22 of the wireless power receiver 20 is charged by the electromotive force induced in the power receiving coil 21.

[0051] The battery 22 may be, for example, a rechargeable battery such as a nickel-metal hydride (NiMH) or lithium ion (Li-ion) battery, but is not limited thereto. In addition, the battery 22 may be detachable from the wireless power receiver 20 and may be integrated with the wireless power receiver 20.

[0052] The power transmission coil 11 and the power reception coil 21 are electromagnetically coupled to each other and can be formed by winding a metal wire such as copper (Cu) to form a coil. The winding can be circular, elliptical, quadrilateral, diamond or any other shape. The overall size, number of turns and other parameters of the coil can vary depending on the required characteristics.

[0053] The magnetic field shielding structure 100 is interposed between the power receiving coil 21 and the battery 22. The magnetic field shielding structure 100 is interposed between the power receiving coil 21 and the battery 22 to focus the magnetic flux transmitted by the wireless power transmitter 10 so that the magnetic flux is effectively received by the power receiving coil 21. In addition, the magnetic field shielding structure 100 prevents at least a portion of the magnetic flux from reaching the battery 22.

[0054] The magnetic field shielding structure 100 can be combined with the coil part to be applied to the receiving part of the above-mentioned wireless charging device. In addition to the wireless charging device, the coil part can also be used in magnetic secure transmission (MST) communication and near field communication (NFC) communication. In addition, in addition to being applied to the receiving part of the wireless charging device, the magnetic field shielding structure 100 can also be applied to the sending part. In the following, the power transmitting coil and the power receiving coil as a whole may be referred to as the coil part. In the following, the magnetic field shielding structure 100 will be described in more detail.

[0055] Figure 3 is a schematic perspective view of an example of a magnetic field shielding structure. Figure 4 It is shown Figure 3 A top view of an example of a resonant shielding circuit.

[0056] Reference Figure 3 , the magnetic field shielding structure 100 includes a magnetic layer 101 and a resonant shielding circuit 110. The resonant shielding circuit 110 includes a capacitor 112 and a conductor 111 connected to the capacitor 112 and having a loop form. In addition, at least a portion of the magnetic layer 101 overlaps with a region surrounded by the conductor 111 in the thickness direction of the magnetic layer 101. That is, a line extending in the thickness direction of the magnetic layer 101 passes through both the magnetic layer 101 and the region surrounded by the conductor 111, wherein the magnetic layer 101 overlaps with the region surrounded by the conductor 111. The thickness direction of the magnetic layer 101 is defined as a direction perpendicular to the main surface of the magnetic layer 101 having a sheet form.

[0057] The magnetic layer 101 that focuses and blocks electromagnetic waves can be formed using a metal strip or sheet including an amorphous alloy and a nanocrystalline alloy. Iron (Fe)-based or cobalt (Co)-based magnetic alloys can be used as nanocrystalline alloys. Fe-based magnetic alloys can be formed using materials including silicon (Si) such as Fe-Si-B (boron) alloys. When the content of a metal such as Fe is relatively high, the saturation magnetic flux density increases. However, when the Fe content is significantly high, it is difficult to form a nanocrystalline alloy. Therefore, the Fe content can be in the range of 70 atomic % to 90 atomic %. In terms of the possibility of forming a nanocrystalline alloy, the sum of the Si content and the B content can be in the range of 10 atomic % to 30 atomic %. In order to prevent corrosion, anti-corrosion elements such as chromium (Cr) and Co can be added to the above-mentioned basic components in an amount of 20 atomic % or less, and a relatively small amount of another metal element can be included to provide other desired properties.

[0058] In the case of using a nanocrystalline alloy, as an example, an Fe-based nanocrystalline magnetic alloy may be used. A Fe-Si-B-Cu-niobium (Nb) alloy may be used as the Fe-based nanocrystalline alloy.

[0059] In addition to alloys, the magnetic layer 101 can be formed using ferrite. For example, the magnetic layer 101 can be formed using a manganese (Mn)-zinc (Zn)-based ferrite material, a Mn-nickel (Ni)-based ferrite material, a barium (Ba)-based ferrite material, or a strontium (Sr)-based ferrite material. In addition, the above materials can be formed as nanocrystalline powders. In addition, the magnetic layer 101 can be formed using a polymer composite material in the form of a base material such as a resin filled with magnetic particles. The magnetic layer 101 can be set in an integral form, but can have a structure in which the magnetic layer 101 is split into multiple pieces. The split structure provides electrical insulation properties between multiple pieces, thereby helping to reduce eddy currents generated in the magnetic layer. The split structure can be formed randomly, but can be set in the form of a surface of the magnetic layer 101 split into split parts. The split part having a regular split structure can be used to adjust the magnetic permeability of the magnetic layer 101. The magnetic permeability can be changed by changing the degree of splitting of each region of the magnetic layer 101. Multiple split parts can be arranged in a regular form and at regular intervals.

[0060] The resonant shielding circuit 110 has a structure capable of resonating and electromagnetically inducing with respect to a magnetic field directed toward or passing through the magnetic layer 101. To this end, the resonant shielding circuit 110 includes a conductor 111 in the form of a loop and a capacitor 112 connected to both ends of the conductor 111. Figure 3 In the example shown, the conductor 111 and the capacitor 112 are provided on the same surface of the magnetic layer 101. With the above arrangement method, at least a portion of the magnetic layer 101 overlaps with the region surrounded by the conductor 111 in the thickness direction of the magnetic layer 101.

[0061] The opposite ends of the conductor 111 are connected to the electrodes of the capacitor 112. The capacitor 112 forms an LC circuit by being connected to the conductor 111. In one example, the capacitor 112 is a multilayer ceramic capacitor (MLCC) (which is a chip component). The MLCC has excellent structural stability and relatively high capacitance, so the MLCC is an appropriate choice for effectively adjusting the resonant frequency of the resonant shielding circuit 110. However, other types of capacitors such as chip ceramic capacitors, tantalum (Ta) capacitors, planar capacitors, or variable capacitors may be used instead of MLCCs.

[0062] Reference Figure 4 , the loop form of the conductor 111 may be rectangular rather than elliptical.

[0063] The conductor 111 is made of a material having conductivity. For example, the conductor 111 may be a metal conductor such as a copper (Cu) conductor.

[0064] In terms of the function and operating principle of the resonant shielding circuit 110, in the case where the leakage magnetic field leaking into the resonant shielding circuit 110 induces a current in the conductor 111, the induced current generates a magnetic field opposite to the leakage magnetic field, thereby canceling and blocking the leakage magnetic field. In detail, in the case where at least a portion of the magnetic layer 101 overlaps with the area surrounded by the conductor 111 in the thickness direction of the magnetic layer 101, the magnetic field directed to the magnetic layer 101 or passing through the magnetic layer 101 will be effectively blocked by the resonant reaction of the resonant shielding circuit 110. The resonant frequency of the resonant shielding circuit 110 can be set to be substantially equal to the frequency of the leakage magnetic field blocked by the resonant shielding circuit 110.

[0065] Blocking the magnetic field through resonant reaction produces a relatively low level of impedance, resulting in lower inductive losses than blocking the magnetic field through a sheet of magnetic material. In addition, the conductor 111 in the form of a loop can be relatively thin and small, thereby contributing to the thinning of the magnetic field shielding structure 100. The shielding function is improved by using the resonant shielding circuit 110 and the magnetic layer 101 together. In addition, the magnetic field shielding structure 100 for various purposes can be implemented by changing the shielding characteristics of the magnetic layer 101 and the resonant shielding circuit 110. For example, the magnetic layer 101 can perform a shielding function for wireless charging using a magnetic induction method. The resonant shielding circuit 110 can perform a shielding function for wireless charging using a magnetic resonance method, and vice versa. In addition, in addition to being used in performing the WPC function, at least a portion of the magnetic layer 101 and the resonant shielding circuit 110 can be used in performing the NFC function or the MST function.

[0066] In another example, in order to reduce the thickness of the resonant shield circuit 110, the capacitor 112 is not disposed on the magnetic layer 101, but is disposed outside the magnetic layer 101. When the capacitor 112 is disposed outside the magnetic layer 101, the capacitor 112 is disposed in a different region of the wireless charging device while being electrically connected to the conductor 111.

[0067] The conductor 111 and the capacitor 112 form an LC circuit, thereby enabling the resonant shielding circuit 110 to perform a shielding function through a resonant reaction. In addition, the conductor 111 and the capacitor 112 enable a resonance phenomenon to be generated at a specific frequency determined by the L value and the C value of the LC circuit. The L value and the C value of the LC circuit can be adjusted to change the specific frequency at which the resonance phenomenon is generated. The conductor 111 and the capacitor 112 are electrically isolated from different circuits such as external conductors. In other words, the resonant shielding circuit 110 does not include another circuit except the conductor 111 and the capacitor 112, and is electrically isolated.

[0068] Figures 5 to 11 Other examples of magnetic field shielding structures are shown.

[0069] Figure 5 An example of a structure in which a bonding layer 120 is interposed between the magnetic layer 101 and the conductor 111 so that the magnetic layer 101 is stably bonded to the conductor 111 is shown. In contrast, the above example does not include a bonding layer. The above direct combination structure can be implemented, for example, using a method of printing a conductor on the magnetic layer 101. However, in another example, a more stable combination structure is formed by using a bonding layer 120. In the case where the bonding layer 120 is suitable for bonding the magnetic layer 101 to the conductor 111, any bonding layer commonly used in the prior art can be used. For example, a double-sided tape can be used.

[0070] Figure 6 An example of implementing the resonant shielding circuit 110 in the circuit board 130 is shown. To this end, a conductor 111 and a capacitor 112 in the form of a loop are formed using a printed circuit board (PCB) process known in the art. For example, the circuit board 130 may be a flexible printed circuit board (FPCB). The resonant shielding circuit 110 may be implemented in the form of the circuit board 130 so that structural stability can be ensured and the resonant frequency of the LC circuit formed by the resonant shielding circuit 110 can be effectively adjusted. However, in another example, only the conductor 111 through which the magnetic flux passes is formed in the circuit board 130, and the capacitor 112 is provided in a different region.

[0071] Figure 7 1 shows an example in which the magnetic layer 101 is disposed within the loop of the conductor 111. In other words, the magnetic layer 101 is disposed in a region surrounded by the conductor 111. For this reason, the size of the loop of the conductor 111 is larger than the size of the magnetic layer 101. Figure 7In the case where the conductor 111 surrounds the magnetic layer 101 and is disposed at the same height as the magnetic layer 101 , sufficient shielding performance can be obtained and the overall thickness of the magnetic field shielding structure can be reduced. Figure 7 An example is shown in which the magnetic layer 101 is separated from the conductor 111. However, in another example, the magnetic layer 101 contacts the inner surface of the conductor 111.

[0072] Figure 8 Shown with Figures 3 to 7 The conductor 111 is an example of a different form than the conductor 121. In detail, in order to adjust the resonant frequency and shielding characteristics of the resonant shielding circuit 110, the conductor 121 is a coil having at least two turns. Figure 8 In the example shown in , the coil has four turns. However, this is only an example, and the coil has more than four turns or less than four turns. In order to form a coil structure with multiple turns, the conductor 121 may have a structure such as Fig. 9 In addition, at least one end of the conductor 121 may be bent to be connected to an electrode of the capacitor 112.

[0073] Fig. 9 An example is shown in which a conductor 131 having a coil structure including multiple turns is formed in the circuit board 130. Coil patterns forming different turns in the coil structure are formed at the same height. A portion of the conductor 131 may be bent to be connected to the capacitor 112. However, in the case where the conductor 131 is formed in the circuit board 130, a solenoid coil structure may also be used as Figure 8 .

[0074] Fig.10 An example is shown in which the magnetic layer 101 includes a plurality of magnetic layers forming a stacked structure, thereby improving shielding performance by the magnetic layer 101. In this case, the size of the shielding structure in the magnetic layer 101 and the number of magnetic layers may be determined in consideration of the desired shielding performance. A bonding layer 102 such as a double-sided tape is provided between adjacent magnetic layers, thereby ensuring structural stability. Fig.10 In the example of FIG. 1 , the conductor 111 is provided on a surface of a stacked structure formed by a plurality of magnetic layers of the magnetic layer 101 .

[0075] Fig.11 Another example is shown in which the conductor 111 is interposed between two adjacent magnetic layers of the stacked structure formed of a plurality of magnetic layers of the magnetic layer 101 .

[0076] Fig.12 An example of the main components of a mobile device is shown.

[0077] Reference Figure 1 , Figure 2 and Fig.12, the mobile device includes a mobile main device body, a battery 22, and a power receiving coil 21 supported by a substrate 140. A magnetic field shielding structure 100 is interposed between the battery 22 and the power receiving coil 21 supported by the substrate 140. The magnetic field shielding structure 100 includes a magnetic layer 101 and a resonant shielding circuit 110. The magnetic layer 101 has a stacked structure in which a plurality of magnetic layers are stacked. A conductor 111 having a loop form surrounds a side surface of the stacked structure.

[0078] The resonant shield circuit 110 includes a conductor 111 and a capacitor 112 in a loop form to perform a function of blocking a magnetic field by a resonant reaction. The magnetic layer 101 is interposed between the resonant shield circuit 110 and the power receiving coil 21 supported by the substrate 140. In other words, the resonant shield circuit 110 is separated from the power receiving coil 21 supported by the substrate 140 by the magnetic layer 101. This structure reduces unnecessary coupling between the resonant shield circuit 110 and the power receiving coil 21.

[0079] Fig.13 and Fig.14 Other examples of magnetic field shielding structures are shown. Fig.13 and Fig.14 An example of a magnetic field shielding structure is shown in which a plurality of resonant shielding circuits 110 are provided to improve shielding performance and characteristics. Fig.13 and Fig.14 An example is shown in which two resonant shield circuits 110 are provided. However, according to the size of the magnetic layer 101, three or more resonant shield circuits 110 may be provided.

[0080] Fig.13 An example is shown in which the conductor 111 and the capacitor 112 of one resonant shield circuit 110 are disposed on one surface of the magnetic layer 101 on one side of the magnetic layer 101, and the conductor 111 and the capacitor 112 of the other resonant shield circuit 110 are disposed on the other surface of the magnetic layer 101 on the side of the magnetic layer 101 opposite to the one side of the magnetic layer 101. However, as described above, the capacitor 112 may be disposed at other locations.

[0081] Fig.14 An example is shown in which the conductor 111 and the capacitor 112 of the two resonant shield circuits 110 are provided on one surface of the magnetic layer 101 .

[0082] The above-described example enables the magnetic field shielding structure and the mobile device to be miniaturized due to the reduction in thickness of the magnetic field shielding structure, and has excellent shielding performance.

[0083] Although the present disclosure includes specific examples, it will be apparent after understanding the disclosure of the present application that various changes in form and detail can be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are considered to be descriptive only, not for the purpose of limitation. The description of the features or aspects in each example will be considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in different orders, and / or if the components in the described system, architecture, device or circuit are combined in different ways and / or replaced or supplemented with other components or their equivalents, the components in the described system, architecture, device or circuit can be obtained. Appropriate results can be obtained. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all changes within the scope of the claims and their equivalents will be interpreted as included in the present disclosure.

Claims

1. A magnetic field shielding structure, comprising: Magnetic layer; as well as a resonant shielding circuit comprising a capacitor and a conductor connected to the capacitor and having a loop form; wherein at least a portion of the magnetic layer overlaps with a region surrounded by the conductor in a thickness direction of the magnetic layer, Wherein, the conductor is implemented inside the circuit board, The circuit board is a flexible printed circuit board, and The resonant shielding circuit is electrically isolated.

2. The magnetic field shielding structure according to claim 1, wherein: The conductor is disposed on a surface of the magnetic layer.

3. The magnetic field shielding structure according to claim 2, wherein: The capacitor is disposed on a surface of the magnetic layer. 4 . The magnetic field shielding structure according to claim 2 , further comprising a bonding layer interposed between the magnetic layer and the conductor and bonding the magnetic layer to the conductor.

5. The magnetic field shielding structure according to claim 1, wherein: The magnetic layer is provided in a region surrounded by the conductor.

6. The magnetic field shielding structure according to claim 1, wherein: The magnetic layer and the conductor are disposed at the same height.

7. The magnetic field shielding structure according to claim 1, wherein: The capacitor is a multilayer ceramic capacitor.

8. The magnetic field shielding structure according to claim 1, wherein: The conductor is a coil having at least two turns.

9. The magnetic field shielding structure according to claim 8, wherein: The coil is a solenoid.

10. The magnetic field shielding structure according to claim 8, wherein: The different turns of the coil are arranged at the same height.

11. The magnetic field shielding structure according to claim 1, wherein: The capacitor and the conductor form an inductor-capacitor circuit.

12. The magnetic field shielding structure according to claim 1, wherein: The magnetic layer includes a plurality of magnetic layers forming a stacked structure.

13. The magnetic field shielding structure according to claim 12, wherein: The conductor is disposed on a surface of the stacked structure.

14. The magnetic field shielding structure according to claim 12, wherein: The conductor is disposed between two adjacent magnetic layers of the stacked structure.

15. The magnetic field shielding structure according to claim 12, wherein: The conductor surrounds a side surface of the stack structure. 16 . The magnetic field shielding structure of claim 1 , further comprising another resonant shielding circuit.

17. The magnetic field shielding structure according to claim 16, wherein: The conductor of the resonant shield circuit is disposed on one surface of the magnetic layer; and The conductor of the other resonant shield circuit is provided on the other surface of the magnetic layer on the side opposite to the one surface of the magnetic layer.

18. The magnetic field shielding structure according to claim 16, wherein: The conductor of the resonant shield circuit and the conductor of the other resonant shield circuit are disposed on the same surface of the magnetic layer.

19. A mobile device, comprising: A mobile device body; Battery; Coil section; as well as a magnetic field shielding structure interposed between the battery and the coil portion and comprising a magnetic layer and a resonant shielding circuit, the resonant shielding circuit comprising a capacitor and a conductor connected to the capacitor and having a loop form, wherein at least a portion of the magnetic layer overlaps with a region surrounded by the conductor in a thickness direction of the magnetic layer, Wherein, the conductor is implemented inside the circuit board, The circuit board is a flexible printed circuit board, and The resonant shielding circuit is electrically isolated.

20. The mobile device according to claim 19, wherein: The magnetic layer is interposed between the resonance shield circuit and the coil portion.

21. A magnetic field shielding structure, comprising: Magnetic layer; as well as a resonant shielding circuit configured to block at least a portion of a magnetic field passing through the magnetic layer and comprising a capacitor and a conductor connected to both ends of the capacitor and having a loop form, Wherein, the conductor is implemented inside the circuit board, The circuit board is a flexible printed circuit board, and The resonant shielding circuit is electrically isolated.

22. The magnetic field shielding structure according to claim 21, wherein: The resonant shielding circuit has a resonant frequency that is substantially equal to a frequency of the magnetic field.

23. The magnetic field shielding structure according to claim 21, wherein: At least a portion of the magnetic layer is provided between the power receiving coil and the resonance shield circuit.

24. The magnetic field shielding structure according to claim 21, wherein: The conductor is provided on the surface of the magnetic layer, or provided inside the magnetic layer, or the magnetic layer is provided in a region surrounded by the conductor.

25. A mobile device, comprising: A mobile device body; A battery, disposed in the mobile device body; a power receiving coil provided in the mobile device body and configured to receive wireless power through either or both of magnetic induction and magnetic resonance; as well as a magnetic field shielding structure provided between the battery and the power receiving coil in the mobile device body and configured to block at least a portion of the magnetic field generated by the power receiving coil from reaching the battery; Wherein, the magnetic field shielding structure comprises: a magnetic layer configured to block at least a portion of the magnetic field generated by the power receiving coil from passing through the magnetic layer; and a resonant shielding circuit configured to block at least a portion of any leakage magnetic field passing through the magnetic layer from the magnetic field generated by the power receiving coil, the resonant shielding circuit comprising a capacitor and a conductor connected to both ends of the capacitor and having a loop form, Wherein, the conductor is implemented inside the circuit board, The circuit board is a flexible printed circuit board, and The resonant shielding circuit is electrically isolated.

26. The mobile device according to claim 25, wherein: The magnetic layer is further configured to block the at least a portion of the magnetic field generated by the power receiving coil by a magnetic induction method; and The resonant shielding circuit is also configured to block the at least a portion of any leakage magnetic field passing through the magnetic layer by a magnetic resonance method.

27. The mobile device according to claim 25, wherein: At least a portion of the magnetic layer is provided between the power receiving coil and the resonance shield circuit.

28. The mobile device according to claim 25, wherein: The conductor is provided on the surface of the magnetic layer, or provided inside the magnetic layer, or the magnetic layer is provided in a region surrounded by the conductor.

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