Preparation method of white light chip
A chip and white light technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems such as the utilization rate of light has not been effectively improved, with yellow or blue light spots, LED chips can not reach, etc., to achieve luminous Small angle, low cost, uniform spot effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2018-12-11
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor light emitting diodes, in particular to a method for preparing a white light chip. Background technique
[0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. Light, thus directly converting electrical energy into light energy. LED, especially white LED, is widely used as a new lighting source material. It has the advantages of fast response, good shock resistance, long life, energy saving and environmental protection, etc. and has developed rapidly. It has been widely used in landscaping and Indoor and outdoor lighting and other fields.
[0003] At present, the preparation of white light LED is mainly made by coating yellow phosphor powder on the blue light chip, that is, directly coating or spraying a layer of phosphor powder glue on the surface of the blue light LED chip, and the white light LED chip p...
Examples
Embodiment Construction
[0021] This embodiment adopts the following steps:
[0022] Prepare and select a fluorescent film 3 that meets the requirements, and electroplate metal on the electrode of the flip-chip blue LED chip 1 as a metal electrode. Place the fluorescent film 3 on the support substrate 4, and then dot transparent silica gel on the surface of the fluorescent film 3 according to preset rules, such as uniformly spot transparent silica gel 2 of the same size on the surface of the fluorescent film 3; after that, prepare the metal electrode The flip-chip blue LED chip 1 (the surface on the side where the metal electrode is not prepared) is placed on the position of the transparent silica gel in the fluorescent film, and baked at a temperature of 150° for 2 hours, so that the surface around the flip-chip blue LED chip The transparent silica gel 2 presents a concave arc shape, such as figure 1 shown;
[0023] Cut the fluorescent film 3 along the cutting line, and expand the distance between...