Liquid processing equipment

Abstract

The present invention provides a technology for suppressing the adhesion of particles to a substrate in a liquid processing device that supplies a processing liquid to a substrate for processing. The liquid processing device is configured such that when a processing fluid is supplied from each nozzle unit (5, 6, 7) to a wafer (W) held horizontally for processing, a covering member (15) provided with an opening (16a, 16b, 16c) for moving each nozzle unit (5, 6, 7) covers the upper portion of a movable base (54, 64, 74) and a guide rail (55, 65, 75), and exhausts the driving area below the covering member (15). The movable base (54, 64, 74) is used to move each nozzle unit (5, 6, 7) between the upper portion of the wafer and a standby position. Furthermore, when each nozzle unit is in the standby position, the opening (16a, 16b, 16c) is closed by the nozzle arm (52, 62, 72) of each nozzle unit.

Description

Technical Field

[0001] The present invention relates to a liquid processing device that supplies a processing liquid from a nozzle to a substrate for processing. Background Art

[0002] In the photolithography process, one of the manufacturing processes for semiconductor devices, a resist is applied to the surface of a semiconductor wafer (hereinafter referred to as a "wafer"), exposed to light in a predetermined pattern, and then developed to form a resist pattern. This process is typically performed using a system in which an exposure device is connected to a coating and developing device for coating and developing the resist. Various liquid processing devices are incorporated into the coating and developing device to supply processing liquids such as resist liquid and developer to the wafer.

[0003] In such liquid processing apparatuses, the following structure is known: as described in Patent Documents 1 and 2, a nozzle for discharging a processing fluid is positioned in a standby position away from a semiconductor wafer (hereinafter referred to as a "wafer") serving as a substrate, and the wafer is placed on a substrate holding portion. The nozzle is then moved above the wafer, and the processing fluid is discharged onto the wafer to perform liquid processing.

[0004] Furthermore, for example, in a device that performs development, after a developer is supplied to a wafer and development is completed, a cleaning liquid and an inert gas are discharged from dedicated nozzles to remove dissolved substances from the wafer surface.

[0005] The moving mechanism for moving the treatment fluid nozzle that discharges the treatment liquid or treatment gas is configured to include, for example, a ball screw, which is driven to move along a guide rail. Furthermore, the moving mechanism is connected to a pipe for transmitting power, and is provided with a pipe limiting member for limiting the bending direction of the pipe.

[0006] Such a ball screw, guide rail, or piping restriction member may generate dust when the moving mechanism moves. The dust generated from the moving mechanism scatters above the cover and may adhere to the wafer held by the substrate holding portion.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-26744

[0010] Patent Document 2: Japanese Patent Application Laid-Open No. 2012-28571 Summary of the Invention

[0011] The technical problem that the invention aims to solve

[0012] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology for suppressing adhesion of particles to a substrate in a liquid processing apparatus that processes a substrate by supplying a processing liquid thereto.

[0013] The liquid processing device of the present invention supplies a processing liquid to a substrate from a nozzle to perform liquid processing. The liquid processing device is characterized by comprising:

[0014] a cover body provided to surround a substrate holding portion for holding a substrate horizontally;

[0015] a nozzle arm having the nozzle provided at a front end portion and supported by a support portion at a rear end portion;

[0016] a moving mechanism for moving the nozzle arm between a standby position and a processing position for supplying a processing fluid from the nozzle to the substrate via the support portion;

[0017] a lifting mechanism for raising and lowering the support portion;

[0018] a cover member including a top plate portion provided above a drive region where the moving mechanism and the lifting mechanism are arranged, for separating the drive region from a region within the cover body where the substrate is held;

[0019] An opening formed at a portion of the top plate corresponding to a movement path of the support portion to allow the support portion to move; and

[0020] An exhaust mechanism for exhausting the driving area.

[0021] Effects of the Invention

[0022] The present invention includes a cover member that separates a drive area from an area within the housing that holds the substrate, and vents the drive area. The drive area houses a mechanism that enables the support portion, located at the rear end of the nozzle arm, to move laterally and vertically. Furthermore, an opening for the support portion to move is formed in the top plate of the cover member. This prevents particles generated by the mechanism housing the drive area from adhering to the substrate within the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a perspective view showing the developing device of the present invention.

[0024] Figure 2 It is a longitudinal sectional side view of the developing device.

[0025] Figure 3 It is a cross-sectional view showing a development processing unit.

[0026] Figure 4It is a plan view showing the bottom of a cover member and a punched plate in a display device.

[0027] Figure 5 It is a perspective view showing the first nozzle unit.

[0028] Figure 6 This is a side view of the first nozzle unit as viewed from the rear.

[0029] Figure 7 It is a perspective view showing a wiring restriction member.

[0030] Figure 8 It is an explanatory diagram showing the effect of the present invention.

[0031] Figure 9 It is an explanatory diagram showing the effect of the present invention.

[0032] Figure 10 It is an explanatory diagram showing the effect of the present invention.

[0033] Figure 11 It is an explanatory diagram showing the effect of the present invention.

[0034] Figure 12 It is an explanatory diagram showing the effect of the present invention.

[0035] Figure 13 It is an explanatory diagram showing the effect of the present invention.

[0036] Figure 14 It is an explanatory diagram showing the effect of the present invention.

[0037] Figure 15 It is an explanatory diagram showing the effect of the present invention.

[0038] Figure 16 It is a perspective view showing another example of the liquid processing apparatus of the present invention.

[0039] Description of Reference Numerals

[0040] 1 Development processing unit

[0041] 2 Rotating chuck

[0042] 3. Cover

[0043] 5 Development nozzle section

[0044] 6 Clean the nozzle

[0045] 7 Auxiliary nozzle

[0046] 8 Wiring restriction components

[0047] 9 Exhaust pipe

[0048] 15 Covering parts

[0049] 16a~16c opening

[0050] 18 FFU

[0051] 38 exhaust pipe

[0052] 39 First exhaust port

[0053] 52, 62, 72 nozzle arms

[0054] 54, 64, 74 mobile base

[0055] 94 Second exhaust port

[0056] 95 Exhaust damper

[0057] W chip. DETAILED DESCRIPTION

[0058] An example in which the liquid process according to the embodiment of the present invention is applied to a developing device will be described. Figure 1 is a schematic perspective view showing one embodiment of a developing device, Figure 2 This is a longitudinal side view of a developing device. The developing device comprises a rectangular housing 10. A feed port 11 for feeding wafers W, serving as substrates, is formed on a side surface at one longitudinal end. A shutter 12 is provided at the feed port 11 to open and close the feed port. A developing unit 1 is provided near the front of the housing 10, with the feed port 11 side of the housing 10 being considered the front and the rear of the housing 10 viewed from the feed port 11. In the following description, the feed port 11 side of the housing 10 is considered the front, and the rear of the housing 10 viewed from the feed port 11 is considered the rear.

[0059] Reference Figure 3 The development processing unit 1 is described. The development processing unit 1 includes a rotary chuck 2, which serves as a substrate holding unit for horizontally adsorbing and holding the chip W. The rotary chuck 2 horizontally adsorbs and holds the central portion of the back side of the chip W, and is configured to be able to rotate freely around a vertical axis. The rotary chuck 2 is formed into a circular shape when viewed from above, and is connected to a drive mechanism (rotary chuck motor) 22 via a rotating lifting shaft 21. In addition, the rotary chuck 2 is connected to a suction tube not shown in the figure, and has the function of a vacuum chuck, which adsorbs the chip W while holding the chip W via an adsorption hole not shown in the figure. In addition, on the side of the rotary chuck 2, three lifting pins 392 connected to the lifting mechanism 391 are arranged at equal intervals in the circumferential direction. Through the coordinated action of the external conveying mechanism and the lifting pins 392, the chip W can be transferred to the rotary chuck 2.

[0060] A cover 3, which is annular in shape when viewed from above, is provided around the spin chuck 2 to suppress scattering of the developer, a processing fluid, and to recover the developer. The cover 3 surrounds the sides and bottom of the wafer W held on the spin chuck 2 in the entire circumferential direction. The top surface of the cover 3 forms an opening 31 having a larger diameter than the wafer W. The wafer W can be transferred between the transport mechanism of the coating and developing device, which will be described later, and the spin chuck 2 through this opening 31.

[0061] The cover 3 also has a side wall 32 with an inwardly inclined portion 321 formed at its upper end. A liquid receiving portion 33, for example, in the form of a recess, is formed on the bottom side of the cover 3. The liquid receiving portion 33 is divided into an outer area and an inner area by a partition wall 36 extending downward from the periphery of an annular inner cover 34 and extending along its entire circumference below the periphery of the wafer W. A drain pipe 35 is connected to the bottom of the outer area to drain any remaining developer. A circular plate portion 37 is provided on the inner periphery of the inner cover. An edge portion 37a is formed along the entire circumference of the upper surface of the periphery of the plate portion 37. This edge portion 37a forms a very narrow gap between the plate portion 37 and the wafer W held on the spin chuck 2.

[0062] When looking at the front from the rear side, the exhaust pipe 38 for exhausting the atmosphere in the cover body 3 protrudes from the bottom surface of the cover body 3 to the left and right positions of the rotary chuck 2 on the inner side of the partition wall portion 36, and the upper end of the exhaust pipe 38 forms a first exhaust port 39 opening inside the cover body 3.

[0063] like Figure 2 、 Figure 4 As shown in FIG. 1 , an exhaust pipe 9 serving as an exhaust passage is provided below the cover 3. The exhaust pipe 9 is configured to extend in the horizontal direction. Figure 4 As shown, one end thereof branches into two branches to form a branch pipe 91, and the other end is connected to a collecting pipe 92. Figure 2 、 Figure 4 As shown, an opening 93 is formed on the upper surface side of each end of the branch pipe 91, and the lower end of the exhaust pipe 38 is connected to each opening 93. In addition, a second exhaust port 94 for exhausting the atmosphere in the housing 10 is formed on the upper surface side of the exhaust pipe 9, which is closer to the collecting pipe 92 than the branching position of the branch pipe 91, specifically, between the cover body 3 and the supply and discharge port 11 formed in the housing 10.

[0064] like Figure 2As shown, an exhaust damper 95 is provided at the second exhaust port 94, and the exhaust damper 95 is used to adjust the flow ratio of the exhaust volume of the first exhaust port 39 and the exhaust volume of the second exhaust port 94. By adjusting the exhaust damper 95, it is possible to switch between the "hood exhaust" state and the "component exhaust" state, wherein the "hood exhaust" state is a state in which more exhaust is carried out from the first exhaust port side 39 and less exhaust is carried out from the second exhaust port 94, so that the exhaust volume inside the hood body 3 is more, and the "component exhaust" state is a state in which the exhaust volume of the first exhaust port 39 is less and the exhaust volume of the second exhaust port 94 is more, so that the exhaust volume outside the hood body 3 is more than the exhaust volume inside the hood body 3. In addition, Figure 2 Reference numeral 96 shown in the figure is a liquid discharge passage for discharging the liquid discharged from the liquid discharge pipe 35 .

[0065] The developing device includes a developing nozzle unit 5, a cleaning nozzle unit 6, and an auxiliary nozzle unit 7 for supplying a processing fluid to the wafer W held on the spin chuck 2. The developing nozzle unit 5 is a nozzle for supplying a developer liquid as a first processing fluid, the cleaning nozzle unit 6 is a nozzle for supplying a cleaning liquid (rinsing liquid) and a drying gas, and the auxiliary nozzle unit is a nozzle for supplying a developer liquid different from the developer liquid supplied from the developing nozzle, for example, a developer liquid to which a surfactant is added.

[0066] The developing nozzle unit 5 has a developing nozzle 51 with a slit-shaped opening extending in the front-back direction at its lower end surface. When the developing nozzle unit 5 is located at the processing position, the developing liquid is discharged in a strip shape to the area including the center of the wafer W. Figure 1 、 Figure 4 and Figure 5 As shown, the shadow nozzle 51 extends horizontally in the front-to-back direction, and when viewed from the rear, the front end side is set at the front end of the first nozzle arm 52 extending horizontally to the right. Figure 5 、 Figure 6 The rear end of the first nozzle arm 52 is connected to the upper end of a downwardly extending support column 53, which serves as a support portion. The lower end of the support column 53 is connected to the movable base 54 via a lifting mechanism 59. In the developing nozzle unit 5, the lower end of the support column 53 is connected to the right side of the movable base 54. The lifting mechanism 59 is connected to, for example, a guide support column (not shown), which extends from the upper surface of the movable base 54 to a position half the height of the upper surface of the top plate 20 (described later). The support column 53 is raised and lowered by, for example, a ball screw mechanism.

[0067] Furthermore, the bottom surface of the housing 10 is provided with a guide rail 55 extending in the front-to-back direction and a drive mechanism (not shown). The drive mechanism comprises a motor, a timing belt, and pulleys, etc., for moving the movable base 54 in the front-to-back direction along the guide rail 55. The motor rotates the pulley, driving the timing belt, thereby moving the movable base 54 in the front-to-back direction along the guide rail 55. The movable base 54, the drive mechanism, and the guide rail 55 constitute a moving mechanism for moving the developing nozzle 51 forward and backward in the front-to-back direction.

[0068] In addition, in the developing nozzle unit 5, the guide rail 55 is provided at a position to the left of the first nozzle arm 52, and the guide rail 55 is connected to a position to the left of the moving base 54. Figure 2 As shown, the moving mechanism including the moving base 54 and the guide rail 55 is provided at a position lower than the upper end of the cover body 3 .

[0069] In addition, a developer supply passage (not shown) is formed inside the first nozzle arm 52, the downstream end of which is connected to the developer nozzle 51. The upstream end of the developer supply passage is connected to one end of a developer supply pipe 56. Figure 5 As shown, the developer supply pipe 56 is connected to the rear side of the base end of the first nozzle arm 52. The developer supply pipe 56 is bent downward and the other end is led forward. Figure 5 、 Figure 6 As shown, when the developer supply pipe 56 is on the downstream side of the first nozzle arm 52, the upstream portion of the developer supply pipe 56 is secured by a fixture 50, which is positioned below the movement path of the first nozzle arm 52 so as not to interfere with the first nozzle arm 52, the support column 53, and the movable base 54. Consequently, when the movable base 54 moves, the portion of the developer supply pipe 56 secured by the fixture 50 remains stationary, allowing the downstream portion of the developer supply pipe 56 relative to the fixture 50 to bend and deform freely. Furthermore, the upstream portion of the developer supply pipe 56 relative to the fixture 50 is further connected to a developer supply source 58, described below.

[0070] Furthermore, a wiring section 57 consisting of power supply lines and signal lines is connected to the movable base 54. The power supply lines drive the lifting mechanism that raises and lowers the nozzle arm 52 vertically, such as an electric motor that drives a ball screw, and the signal lines transmit signal waves to a sensor that confirms the movement position. The wiring section 57 bends upward, with the other end further forward. The other end of the wiring section 57 is fixed to the upper left side of the aforementioned fixture 50. Furthermore, the other end of the wiring section 57, further from the fixture 50, is connected to, for example, a control unit, and the power supply unit.

[0071] In addition, a wiring restriction member 8 is provided between the movable base 54 and the fixing member 50 of the wiring portion 57 to restrict the bending direction. Figure 7 As described above, the wiring restraining member 8 is constructed by connecting a plurality of connecting members 81 in the longitudinal direction of the wiring restraining member 8. Each connecting member 81 includes two connecting plates 82 arranged opposite each other, with each connecting plate 82 having its ends in the width direction (one side and the other side of the connecting member 81) fixed to each other by respective mounting plates 83. A step (a height difference) is formed on the opposing surfaces (the inner surfaces) of each of the two connecting plates 82 at one end in the longitudinal direction, and a connecting hole 84 is formed in the step portion, extending through the thickness direction.

[0072] In addition, a step is formed on the outer surface of each of the other ends in the longitudinal direction of the two connecting plates, and a connecting pin 85 protruding outward is formed in the step portion. Each connecting component 81 is configured so that one end in the longitudinal direction and the other end in the longitudinal direction of the connecting plate 82 engage with each other. Adjacent connecting components 81 are connected in the longitudinal direction of the connecting plate 82 by inserting the connecting pin 85 into the connecting hole 84. At this time, the connecting plates 82 that are interlocked with each other can rotate within a specified angular range with the connecting pin 85 as the rotation axis. Since the two connecting plates 82 are fixed to each other by the mounting plate 83, their movement in the thickness direction (the direction in which the two opposing connecting plates 82 are arranged) is restricted.

[0073] Furthermore, the wiring restraint member 8 is constructed as a strip with multiple joints formed by connecting multiple connecting members 81 along the length of a connecting plate 82. Wiring 80, such as power supply lines and signal lines, is arranged in a row across the width of the wiring restraint member 8 between the mounting plates 83 of each connecting member 81. Therefore, each wiring 80 can bend in the thickness direction of the wiring restraint member 8, while movement in the thickness direction of the connecting plate 82, i.e., the width direction of the wiring restraint member 8, is restricted. The wiring portion 57 is connected to the movable base 54 so that the thickness direction of the wiring restraint member 8 aligns with the vertical direction. It bends from the rear side of the movable base 54 toward the front side, and is connected to the fixed member 50 in a state in which the vertical direction of the wiring restraint member 8 is reversed.

[0074] like Figure 6 As shown, the wiring portion 57 and the developer supply pipe 56 are connected at a distance so as not to intersect each other, and the wiring portion 57 is restricted from bending to the left or right by the wiring restriction member 8. Therefore, when the movable base 54 moves along the guide rail 55, the wiring portion 57 and the developer supply pipe 56 do not intersect each other. In addition, the wiring portion 57 is also provided at a position lower than the upper end of the housing 3.

[0075] The cleaning nozzle unit 6 is composed of a composite nozzle including a cleaning nozzle 61a and a gas nozzle 61b. The cleaning nozzle 61a is used to discharge a cleaning liquid such as pure water, and the gas nozzle 61b is used to supply a drying gas such as nitrogen. Figure 4 As shown, the cleaning nozzle unit 6 and the developing nozzle unit 5 also include a second nozzle arm 62, a support column 63, a movable base 64 and a guide rail 65. These second nozzle arm 62, the support column 63, the movable base 64 and the guide rail 65 are configured to Figure 5 The first nozzle arm 52, the support column 53, the moving base 54, and the guide rail 55 are shown in a left-right inverted shape.

[0076] Furthermore, a cleaning liquid supply passage and a gas supply passage (not shown) are formed within the second nozzle arm 62, connected to the cleaning nozzle 61a and the gas nozzle 61b, respectively. These cleaning liquid supply passages and the gas supply passages are connected to a cleaning liquid supply pipe 66a and a gas supply pipe 66b, respectively, connected to the rear side of the base end of the second nozzle arm 62. In this example, the cleaning liquid supply pipe 66a and the gas supply pipe 66b form a strip-shaped pipe 66 connected to the side. The strip-shaped pipe 66 bends downward from the base end of the second nozzle arm 62, and the other end is led further forward.

[0077] In addition, if Figure 2 As shown, similar to the movable base 54 on which the developing nozzle unit 5 is installed, a wiring unit 67 equipped with a wiring restriction member 8 is connected to the movable base 64. As in the example of the developing nozzle unit 5, the strip-shaped piping 66 and the wiring unit 67 are also fixed to the fixing member 60 so that the wiring 80 and the strip-shaped piping 66 do not intersect each other. Therefore, the area of ​​the strip-shaped piping 66 from the fixing member 60 to the second nozzle arm 62 is configured to be freely bendable, and the area of ​​the wiring unit 67 from the fixing member 60 to the second nozzle arm 62 is configured so that bending in the left-right direction is restricted and the wiring unit 67 can slide forward and backward.

[0078] In addition, the auxiliary nozzle portion 7 is connected to the Figure 5 The developing nozzle portion 5 shown is constructed in substantially the same manner. Figure 4 , the third nozzle arm, the support column, the moving base and the guide rail in the third nozzle unit 7 are represented by reference numerals 72, 73, 74 and 75, respectively.

[0079] In addition, if Figure 3 As shown, the developing nozzle 51, the cleaning nozzle 61a of the cleaning nozzle unit 6, the gas nozzle 61b, and the auxiliary nozzle 71 are connected to the developing liquid supply source 58, the cleaning liquid supply source 68a, the gas supply source 68b, and the developing liquid supply source 78 via the developing liquid supply pipe 56, the cleaning liquid supply pipe 66a, the gas supply pipe 66b, and the developing liquid supply pipe 76, respectively. Figure 3V56, V66a, V66b and V76 are valves provided in the developer supply pipe 56, the cleaning liquid supply pipe 66a, the gas supply pipe 66b and the developer supply pipe 76, respectively, and M56, M66a, M66b and M76 are flow rate adjustment parts, respectively.

[0080] These developing nozzle sections 5 are configured to be able to Figure 1 The processing position for supplying the processing fluid to the wafer W on the rotary chuck 2 is shown in FIG. Figure 4 As shown in the figure, the wafer W in the front-to-back direction is fed in and out of the front side, and can be freely moved forward and backward in the front-to-back direction between the standby position on the rear side opposite to the front side. In addition, the cleaning nozzle unit 6 and the auxiliary nozzle unit 7 are also similarly configured to be able to supply the processing fluid to the wafer W on the spin chuck 2, and to Figure 4 The standby positions shown are freely advanced and retreated in the front-rear direction by moving the bases 64 and 74 along the guide rails 65 and 75 .

[0081] In this example, the forward and backward directions of the developing nozzle unit 5, the cleaning nozzle unit 6, and the auxiliary nozzle unit 7 are consistent with the front-back direction of the housing 10. The developing nozzle unit 5, the cleaning nozzle unit 6, and the auxiliary nozzle unit 7 are arranged in the order of the developing nozzle unit 5, the auxiliary nozzle unit 7, and the cleaning nozzle unit 6 from the left in the left-right direction of the housing 10, as shown in FIG. Figure 4 As shown, when each nozzle unit 5, 6, and 7 is in the standby position, the developing nozzle 51, cleaning nozzle 61a, gas nozzle 61b, and auxiliary nozzle 71 are arranged in a row in this order from front to back. Furthermore, when each nozzle unit 5, 6, and 7 is in the standby position, the top surfaces of the nozzle arms 52, 62, and 72 of each nozzle unit 5, 6, and 7 are aligned at the same height. Furthermore, a converging busbar 79 is provided below the developing nozzle 51, cleaning nozzle 61a, gas nozzle 61b, and auxiliary nozzle 71 when the developing nozzle unit 5, cleaning nozzle 6, and auxiliary nozzle unit 7 are in the standby position.

[0082] In addition, return to Figure 1 、 Figure 2A cover member 15 is provided in the rear region of the housing 10, covering the upper portion of the drive region. The drive region houses a moving mechanism comprising movable bases 54, 64, 74 and guide rails 55, 65, 75, as well as lifting mechanisms 59, 69 for raising and lowering support columns 53, 63, 73. The cover member 15 includes a rectangular top plate 20 and a partition wall 19 extending downward from the front end of the top plate 20. Three hook-shaped openings 16a, 16b, and 16c are formed in the top plate 20, corresponding to the shapes of the nozzle arms 52, 62, and 72 of the respective nozzle units 5, 6, and 7 in the standby position. These openings 16a, 16b, and 16c are sized to accommodate the nozzle arms 52, 62, and 72 corresponding to the respective openings 16a, 16b, and 16c. Furthermore, when each nozzle unit 5, 6, or 7 is in the standby position, the nozzle arms 52, 62, or 72 can close the openings 16a, 16b, or 16c, respectively. Therefore, when each nozzle unit 5, 6, or 7 is in the standby position, the upper portion of the movable base 54, 64, or 74 of each nozzle unit 5, 6, or 7 can be covered by the cover member 15 and the nozzle arms 52, 62, or 72. Furthermore, each opening 16a, 16b, or 16c is formed so as to extend forward from the rear end. This direction coincides with the direction of movement of the support posts 53, 63, or 73 supporting the nozzle arms 52, 62, or 72 when each nozzle unit 5, 6, or 7 moves forward from the standby position. Therefore, the support posts 53, 63, or 73 can move along the openings 16a, 16b, or 16c, and each opening 16a, 16b, or 16c can be formed along the movement path of the support posts 53, 63, or 73.

[0083] In addition, a blanking plate 17 is provided in the front area of ​​the housing 10. The blanking plate 17 is provided in a manner that surrounds the cover body 3 and serves as a partition plate that divides the periphery of the cover body 3 into upper and lower parts. The blanking plate 17 is provided continuously in a manner that extends horizontally from the lower end of the partition wall portion 19. Therefore, the gap between the blanking plate 17 and the covering member 15 is closed by the partition wall portion 19. In addition, the space below the blanking plate 17 is connected to the space below the covering member 15, which becomes the driving area, and the above-mentioned second exhaust port 94 opens to the space below the blanking plate 17. Therefore, the space below the blanking plate 17 and the space of the driving area below the covering member 15 are exhausted by exhausting from the second exhaust port 94. In addition, an FFU (Fun Filter unit) 18 is provided above the cover body 3 in the housing 10, which is configured to supply a downward flow of clean air to the cover body 3.

[0084] The developing device also includes a control unit 100. The control unit 100 is comprised of, for example, a computer (not shown) having a program storage unit. The program storage unit stores a computer program including a set of steps (commands) for performing the development process described later using the developing nozzle unit 5, the cleaning nozzle unit 6, and the auxiliary nozzle unit 7. The control unit 100 reads this computer program and controls the operation of the developing device. The computer program can be stored in the program storage unit, for example, on a storage device such as a hard disk, an optical disk, a magnetic disk, or a memory card.

[0085] Next, the function of the developing device of the above embodiment will be described. A wafer W is transported to the developing device by an external transport mechanism (not shown). The wafer W transported to the developing device is coated with a resist, which is then subjected to a predetermined exposure process.

[0086] First, if Figure 8 As shown, before the wafer W is loaded, the shutter 12 of the loading / unloading port 11 is closed, and with the nozzle units 5, 6, and 7 in the standby position, a downflow is supplied from the FFU 18. Furthermore, the exhaust pipe 9 is switched to the module exhaust mode. As described above, the interior of the housing 3 is not exhausted, and the interior of the casing 10 is exhausted from the second exhaust port 94.

[0087] At this time, since nozzles 5, 6, and 7 are in their standby positions, openings 16a, 16b, and 16c of cover member 15 are sealed. Consequently, the downward flow supplied from FFU 18 is blocked on the rear side of housing 10 by cover member 15 and nozzle arms 52, 62, and 72 that close openings 16a, 16b, and 16c, and convects above cover member 15. Furthermore, on the front side of housing 10, the downward flow is not drawn into cover body 3 but flows through blanking plate 17 to the lower side of housing 10.

[0088] Furthermore, due to the assembly exhaust, the atmosphere below the blanking plate 17 is exhausted from the second exhaust port 94 . Furthermore, the atmosphere below the cover member 15 also flows below the blanking plate 17 and is exhausted from the second exhaust port 94 .

[0089] At this time, for example, in the driven parts of the movable bases 54, 64, 74 or the wiring restriction part 8, there is a situation where particles generated by the driving are attached, and the cover part 15 is used to seal the upper part of these driven parts. In addition, the partition wall portion 19 in the cover part 15 blocks the position near the movable bases 54, 64, 74 from the wafer W held by the rotary chuck 2. Therefore, the downflow supplied from the FFU 18 cannot reach the particles, and the particles cannot be swept up by the downflow. In addition, the particles attached to the movable bases 54, 64, 74 and the wiring restriction part 8 are captured and removed by the airflow flowing into the second exhaust port 94 from the lower side of the cover part 15.

[0090] Thereafter, the wafer W is carried to the top of the development processing unit 1 through the carry-in / out port by an external transport mechanism. The wafer W is transferred to the spin chuck 2 through the cooperation of the transport mechanism and the lift pins 392 .

[0091] Then, if Figure 9 As shown, while maintaining the exhaust state of the assembly, the developing nozzle unit 5 is raised. At this time, the movable base 54 is slightly advanced, and the first nozzle arm 52 is raised, thereby avoiding interference with the developer supply pipe 56 connected to the rear of the first nozzle arm 52 and the covering member 15. The movable base 54 is further advanced to move the developing nozzle 51 above the wafer W. At this time, the support column 53 supporting the first nozzle arm 52 moves forward along the opening 16a formed corresponding to the developing nozzle unit 5. Furthermore, the developing nozzle 51 is lowered from the discharge port to a height position of 15 mm to 20 mm from the surface of the wafer W. At this time, since the atmosphere in the driving area below the covering member 15 is exhausted, an air flow is formed that flows into the driving area through the opening 16a.

[0092] Then, if Figure 10 As shown, the exhaust is switched to hood exhaust. This creates an airflow within the hood 3 that flows from the upper side of the hood 3 into the exhaust pipe 38 for exhaust. Furthermore, although the amount of exhaust through the second exhaust port 94 decreases, it continues. At this point, as described above, the downward flow of the FFU 18 is blocked by the cover member 15. Therefore, particles adhering to the driven area are prevented from being swept up, thereby preventing particles from adhering to the wafer W held by the spin chuck 2.

[0093] And, as Figure 10 、 Figure 11As shown, while the wafer W is rotated by the rotary chuck 2, the developer is supplied from the developing nozzle 51 to the area including the center of the wafer W. The developer D supplied to the center of the wafer W is spread toward the peripheral edge of the wafer W by spin coating. At this time, the developing nozzle 51 can be moved back and forth between the center and the outer side of the wafer W while discharging the developer. When the developing nozzle 51 moves to the processing position, as shown in FIG. Figure 10 The upstream side of the developer supply pipe 56 is fixed by the fixing member 50, and the downstream end is fixed behind the first nozzle arm 52. Therefore, as the first nozzle arm 52 advances, it is bent and deformed in the front-rear direction.

[0094] Similarly to the developer supply pipe 56, the wiring section 57 is bent and deformed in the vertical direction. However, the wiring restraint 8 restricts its left-right bending, allowing it to bend and deform while sliding in the front-to-back direction without deviating from the left-right direction. Thus, the developer supply pipe 56 and wiring section 57 are positioned so as to be spaced apart from each other in the left-to-right direction and bend in the front-to-back direction. Therefore, when the first nozzle arm 52 is moved in the front-to-back direction, the developer supply pipe 56 and wiring section 57 do not interfere with each other.

[0095] In addition, if Figure 11 As shown, in the cover member 15, the opening 16a where the first nozzle arm 52 is located is open, while the other openings 16b and 16c are closed by the second nozzle arm 62 and the third nozzle arm 72, respectively. Therefore, only one opening 16a is open, and the downflow supplied from the upper FFU 18 enters the lower side of the cover member 15, making it difficult to resist the downflow flowing upward from the opening 16a. Consequently, particles on the lower side of the cover member 15 are prevented from being swept up and flowing toward the cover body 3.

[0096] Then, if Figure 12 As shown, after discharging the developer has stopped, the first nozzle arm 52 is raised, and then the developer nozzle unit 5 is moved rearward and lowered. At this time, the first nozzle arm 52 is lowered while the movable base 54 is moved rearward to prevent interference between the developer supply pipe 56 connected to the rear of the first nozzle arm 52 and the cover member 15. The developer nozzle unit 5 then returns to the standby position, with the opening 16a sealed by the first nozzle arm 52. While the hood is still vented, the wafer W is rotated to spread the developer over the entire surface of the wafer W, and development is performed. The rotation speed of the wafer W is then increased to allow the developer to be shed.

[0097] At this time, if Figure 13As shown, since the nozzle units 5, 6, and 7 are in the standby position, the openings 16a, 16b, and 16c of the cover member 15 are respectively blocked by the first nozzle arm 52, the second nozzle arm 62, and the third nozzle arm 73. Therefore, the downflow supplied from the FFU 18 is blocked by the cover member 15 and the nozzle arms 52, 62, and 72.

[0098] Next, switch the exhaust to component exhaust, such as Figure 14 As shown, the cleaning nozzle unit 6 is raised and advanced in the same manner as the developing nozzle unit 5. After the cleaning nozzle unit 6 is moved above the center of the wafer, it is lowered to match the height of the cleaning nozzle 61a. The hood exhaust is then switched to discharge, and while the wafer W is rotated, pure water, serving as a cleaning liquid, is discharged into an area encompassing the center of the wafer W surface. The discharged cleaning liquid, due to the centrifugal force of the wafer W, spreads outward along the liquid surface, flushing the developer containing the resist dissolving component from the surface of the wafer W, thereby cleaning the surface of the wafer W.

[0099] When a predetermined time has passed since the start of the cleaning liquid discharge, the supply of cleaning liquid is stopped, and the cleaning nozzle unit 6 is moved back and forth so that the gas nozzle 61b is positioned at the processing position. Nitrogen gas is then supplied as a drying gas to the area including the center of the wafer W. The supply of drying gas and the exhaust of gas from the cover 3 form an airflow from the center to the periphery of the wafer W. The liquid adhering to the wafer W is removed from the wafer W by the action of this airflow and centrifugal force, thereby drying the wafer W.

[0100] Then, when the development process of the wafer W is completed, Figure 15 As shown, the exhaust is switched to assembly exhaust, and the wafer W is transported. Then, for example, assembly exhaust is performed with each nozzle unit 5, 6, and 7 in the standby position. The processing of wafer W causes each nozzle unit 5, 6, and 7 to move, potentially generating particles in the moving mechanism, lifting mechanism 59, and wiring control member 8. However, since the downward flow supplied from FFU 18 is blocked by cover member 15 and nozzle arms 52, 62, and 72 that close openings 16a, 16b, and 16c, particles are prevented from being carried away. Furthermore, the atmosphere below cover member 15 is exhausted from second exhaust port 94, thereby removing any generated particles.

[0101] The above description is about the case where the development nozzle unit 5 is used for processing. However, when supplying another developer to substrates of a batch different from the previous batch, the auxiliary nozzle unit 7 is used instead of the development nozzle unit 5 for development processing.

[0102] At this time, when the developer is supplied to the wafer W, the auxiliary nozzle unit 7 is moved with the developing nozzle unit 5 at the standby position, thereby restricting the opening of the openings 16 a , 16 b , and 16 c of the cover member 15 .

[0103] According to the above-described embodiment, when processing fluid is supplied from each nozzle unit 5, 6, or 7 to a wafer W held horizontally, a cover member 15, which includes openings 16a, 16b, and 16c for moving each nozzle unit 5, 6, or 7, covers the area above the movable bases 54, 64, and 74 and guide rails 55, 65, and 75 that move each nozzle unit 5, 6, or 7 between above the wafer W and a standby position. Exhaust is performed in the drive area below the cover member 15. Furthermore, when each nozzle unit 5, 6, or 7 is in the standby position, the openings 16a, 16b, and 16c are sealed by the nozzle arms 52, 62, and 72 of each nozzle unit 5, 6, or 7, respectively. Therefore, particles generated by the movable bases 54, 64, and 74 of each nozzle unit 5, 6, or 7 are prevented from scattering toward the wafer W, thereby suppressing particle adhesion to the wafer W.

[0104] The openings 16a, 16b, and 16c are sized such that even if a slight gap exists when the nozzle arms 52, 62, and 72 are accommodated, particles on the lower side of the cover member 15 cannot flow toward the wafer W held on the spin chuck 2. The width of the gap between the nozzle arms 52, 62, and 72 accommodated in the openings 16a, 16b, and 16c and the top plate 15a may be, for example, in the range of 2 to 7 mm.

[0105] Furthermore, the movable bases 54, 64, and 74 of the nozzle units 5, 6, and 7 are positioned lower than the upper end of the cover 3. When the movable bases 54, 64, and 74, which serve as a source of particles, are positioned higher, they are more susceptible to airflow and are more likely to be swept up by the downdraft due to their proximity to the FFU 18. Therefore, by positioning the movable bases 54, 64, and 74, the guide rails 55, 65, and 75, and the wiring restraining member 8 lower, specifically, lower than the upper end of the cover 3, particles can be prevented from adhering to the wafer W.

[0106] In addition, the present invention is configured so that the nozzle supported by the nozzle arm extending in the front-back direction moves in the left-right direction of the housing 10. Figure 16As shown, a developer nozzle 51 is provided at the front end of a nozzle arm 52a extending in the front-to-back direction, and the rear end of the nozzle arm 52a is supported by a support column 53. Furthermore, the support column 53 can be configured to be movable in the left-right direction, and a movable mechanism for moving the developer nozzle 51 in the left-right direction between the upper portion of the housing 3 and the standby bus 79a outside the housing 3 can be provided below the cover member 15. An opening 16d extending in the left-right direction is formed in the top plate portion 20. Reference numeral 16e in the figure denotes an opening for accommodating support columns that support other nozzles (not shown).

[0107] In such a structure, the cover member 15 covers the upper portion of the driving area and the opening 16d for the nozzle to move is formed in the cover member 15. This effectively suppresses particles generated in the driving area from scattering toward the cover 3.

[0108] Furthermore, in the present invention, the nozzle can be a single nozzle. Furthermore, as in the above-described embodiment, when a structure is provided with multiple nozzles, a nozzle other than the nozzle supplying the processing fluid to the wafer W can also be configured so that the nozzle is positioned in a standby position. When a nozzle moves from the standby position, the opening corresponding to that nozzle is opened. Therefore, by limiting the processing liquid nozzles that move simultaneously from the standby position, it is possible to prevent a large number of openings from being opened simultaneously. Consequently, the possibility of particles generated below the cover member 15 being carried to the upper side of the cover member 15 is reduced.

[0109] Furthermore, as shown in the above-described embodiment, when the nozzle is moved from the standby position to the processing position, the assembly exhaust can be switched. Thus, when the nozzle is moved from the standby position to the processing position, the external atmosphere of the cover member 15 can form an airflow that flows into the driving area through the openings 16a, 16b, and 16c. This further prevents particles generated in the driving area from flowing toward the cover body 3.

[0110] A top plate can be provided above the moving mechanism, and a partition wall extending downward can be provided at the end of the top plate on the spin chuck side. When the movable bases 54, 64, and 74 face downward from the top plate, as viewed from the wafer W held on the spin chuck 2, particles generated below the cover member are less likely to flow from below the top plate on the spin chuck side to the spin chuck side. Therefore, the partition wall can further suppress particle scattering toward the wafer W.

[0111] Alternatively, the nozzle standby position can be lowered and the top plate 20 can be lowered. By lowering the top plate 20, even in a configuration without the partition wall 19, the moving mechanism and the lifting mechanism can be removed from the position facing the wafer held on the spin chuck 2. This can prevent particles generated by the moving mechanism and the lifting mechanism from scattering toward the wafer W.

[0112] Alternatively, the auxiliary nozzle may be configured as a nozzle for discharging the cleaning liquid and N2 gas, respectively, and the second and third nozzles may be simultaneously moved above the wafer W to perform the cleaning process. In this configuration, the first nozzle is kept at a standby position while the second and third nozzles are simultaneously moved above the wafer W. This reduces the number of open openings, thereby achieving a more effective cleaning effect.

[0113] Furthermore, in the above-described embodiment, a cover body 3 is provided that surrounds the sides and bottom of the wafer W held on the spin chuck 2 and has a first exhaust port 39 opening inwardly. An exhaust pipe 9 is also provided for exhausting air from the first exhaust port 39. Furthermore, a second exhaust port is provided in the exhaust pipe 9 between the cover body 3 and the wafer W inlet / outlet port 11 formed in the housing 10, and a damper 95 is provided in the exhaust passage to switch exhaust between the first exhaust port 39 and the second exhaust port 94. This prevents particles from flowing out of the housing 10 through the inlet / outlet port 11. Furthermore, since the exhaust passage is provided in a direction different from that of the nozzle's moving mechanism when viewed from the cover body 3, the height of the moving mechanism can be lowered. Consequently, the risk of particle scattering is further reduced.

[0114] Furthermore, the movement of wires 80 connected to movable bases 54, 64, and 74 is restricted by wire restraining member 8, preventing wires 80 from contacting the processing fluid supply pipe. However, friction between wire restraining member 8 and the components can easily generate particles. Therefore, in a liquid processing apparatus employing wire restraining member 8, wire restraining member 8 is positioned below cover member 15, and furthermore, can be positioned below opening 31 of cover 3. This can suppress particles generated by wire restraining member 8 from scattering toward wafer W, thereby achieving a greater effect.

[0115] Furthermore, the present invention can also be applied to resist coating apparatuses, cleaning apparatuses, and the like. Furthermore, the present invention is not limited to apparatuses that supply processing fluids such as developer, but can also be apparatuses that supply processing fluids such as gas or mist to substrates. Alternatively, the present invention can be an apparatus that supplies steam to substrates.

Claims

1. A liquid processing apparatus for performing liquid processing by supplying a processing liquid to a substrate from a nozzle, the liquid processing apparatus comprising: a cover body provided to surround a substrate holding portion for holding a substrate horizontally; a nozzle arm having the nozzle provided at a front end portion and supported by a support portion at a rear end portion; a moving mechanism for moving the nozzle arm between a standby position and a processing position for supplying a processing fluid from the nozzle to the substrate via the support portion; a lifting mechanism for raising and lowering the support portion; a cover member including a top plate portion provided above a drive region where the moving mechanism and the lifting mechanism are arranged, for separating the drive region from a region within the cover body where the substrate is held; an opening formed at a portion of the top plate corresponding to a movement path of the support portion so as to allow the support portion to move; and an exhaust mechanism for exhausting the driving area, The standby position is located at the rear side of the cover body. The moving mechanism is configured to move the nozzle arm in the front-rear direction. The opening is configured to be closable by the nozzle arm located at the standby position.

2. The liquid treatment device according to claim 1, wherein: A partition plate is provided to surround the cover body and divide the space on the upper side and the space on the lower side. The covering member is formed continuously with the partitioning plate.

3. The liquid treatment device according to claim 1, wherein: comprising a plurality of nozzle arms which are capable of moving laterally and raising and lowering independently of one another, A plurality of support parts for supporting the plurality of nozzle arms are arranged in the left-right direction. The nozzles provided in the plurality of nozzle arms are arranged in the front-rear direction.

4. The liquid processing device according to claim 3, wherein: When a nozzle to supply a processing fluid to a substrate among the plurality of nozzles moves from a standby position, the other nozzles are located at the standby position.

5. The liquid processing device according to any one of claims 1 to 4, characterized in that: The horizontal dimension of the gap between the side edge of the nozzle arm and the edge of the opening is within 7 mm.

6. The liquid processing device according to any one of claims 1 to 4, wherein: include: a first exhaust port opening in the cover body; a second exhaust port opened in the lower side area of ​​the dividing plate; and a switching mechanism for switching the ratio of exhaust flow rates between the first exhaust port and the second exhaust port, The partition plate is formed with a plurality of vent holes for introducing gas on the upper side of the partition plate to the lower side.

7. The liquid processing device according to claim 6, wherein: When the nozzle arm is moved from the standby position to the processing position, the switching mechanism is switched so that the exhaust flow rate of the second exhaust port is larger than the exhaust flow rate of the first exhaust port.

8. The liquid processing device according to any one of claims 1 to 4, wherein: include: Wiring connected to the moving mechanism and the lifting mechanism for driving the moving mechanism and the lifting mechanism; a fixing member for fixing a portion of the wiring on the other end side when the side of the wiring connected to the moving mechanism and the lifting mechanism is one end side, so that the portion of the wiring on the other end side remains stationary when the moving mechanism moves; and A wiring restriction member having a joint portion and formed into an elongated strip is used to protect and guide a portion between a connection position on one end side of the wiring and a fixed position on the other end side of the wiring fixed by a fixing member, which bends as the moving mechanism moves. The wiring restriction member is provided at a height position lower than a height position of an opening surface of the cover in the driving region.

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