Heat dissipation device for power devices, air conditioner

Abstract

The present invention proposes a heat dissipation device for a power device of an air conditioner and an air conditioner. The heat dissipation device of the power device comprises: a semiconductor refrigeration plate, the power device and the cold surface of the semiconductor refrigeration plate are in contact with each other; a direct current power supply, which is electrically connected to the semiconductor refrigeration plate and is used to supply power to the semiconductor refrigeration plate; a control module, which is used to control the magnitude of the current input by the direct current power supply to the semiconductor refrigeration plate according to the magnitude of the internal working current of the semiconductor refrigeration plate, so as to control the cold surface temperature of the semiconductor refrigeration plate and thus control the working temperature of the power device. The heat dissipation device of the power device of the present invention solves the defect that the air conditioner controller cannot meet the heat dissipation of the heating device under the condition of limited appearance structure. The semiconductor refrigeration and heat dissipation technology provided can better solve the heat dissipation problem of the power device, and there is no need to install a temperature detection device. Under the premise of saving costs, the service life of the key power device is guaranteed, and the reliability and operation quality of the controller are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioners, and in particular to a heat dissipation device for a power device and an air conditioner. Background Art

[0002] The use of power devices and power electronic devices is indispensable in the electrical control system of air conditioners, especially variable frequency air conditioners. During the operation of high-current and high-power devices such as thyristors, rectifier bridges, IGBTs and fast recovery FRDs of PFC circuits, IPM modules for compressor variable frequency control, and DC fan control modules, the transfer and conversion of energy will generate heat, and heat dissipation measures need to be considered. Whether the heat dissipation form of the air conditioning control system is good or not will directly affect the operating performance of the core power devices, and the reliability of the power devices determines the quality of the air conditioner. At present, air cooling and refrigerant pipe (water cooling) heat dissipation are the most widely used in air conditioners. Due to its simple structure and convenient production and installation, most air conditioner manufacturers mainly use air cooling heat dissipation. Air cooling heat dissipation has strict requirements on the direction of air flow, and the design of the flow direction and the shape of the radiator directly affects the heat dissipation effect. This method is simple to install, but the radiator is relatively bulky and inefficient. Refrigerant pipe heat dissipation (a type of water cooling) mainly relies on the flow of the refrigerant in the air conditioner itself to conduct heat away. The refrigerant pipe is in direct contact with the radiator, and the flow of low-temperature refrigerant can quickly and effectively dissipate heat. Since the flow of refrigerant depends on the system itself, it is difficult to adjust the flow of refrigerant at any time after the size of the refrigerant pipe is determined. On the other hand, the quality of copper pipe production and welding will also affect the heat dissipation effect of the refrigerant pipe. With the development trend of miniaturization, the compact space design makes the control panel in a completely closed or semi-closed structure. In addition, the diversity of air conditioning use environments has limited these two heat dissipation measures.

[0003] Therefore, how to solve the defect that the air-conditioning controller cannot meet the heat dissipation requirements of the heating device under the condition of limited appearance structure has become an urgent problem to be solved. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention is to provide a heat dissipation device for a power device.

[0006] A second aspect of the present invention is to provide an air conditioner.

[0007] In view of this, according to one aspect of the present invention, a heat dissipation device for a power device is proposed, which is used in an air conditioner, and includes: a semiconductor refrigeration plate, the power device and the cold surface of the semiconductor refrigeration plate are in contact with each other; a DC power supply, which is electrically connected to the semiconductor refrigeration plate and is used to supply power to the semiconductor refrigeration plate; and a control module, which is used to control the magnitude of the current input by the DC power supply to the semiconductor refrigeration plate according to the magnitude of the internal working current of the semiconductor refrigeration plate, so as to control the temperature of the cold surface of the semiconductor refrigeration plate and then control the working temperature of the power device.

[0008] The heat dissipation device of the power device provided by the present invention is applied to the air conditioner to dissipate the heat of the power device of the air conditioner, and includes a semiconductor refrigeration sheet. When the semiconductor refrigeration sheet is powered on, the two sides form a hot surface and a cold surface respectively, so that the power device and the cold surface of the semiconductor refrigeration sheet are in contact with each other. The rapidity and efficiency of the refrigeration of the semiconductor refrigeration sheet make the heat dissipation effect of the power device better. The heat dissipation device of the power device also includes a DC power supply, which is electrically connected to the semiconductor refrigeration sheet and is used to supply power to the semiconductor refrigeration sheet so that the semiconductor refrigeration sheet forms a cold surface after power is supplied to dissipate the heat of the power device. The heat dissipation device of the power device also includes a control module, which is electrically connected to the semiconductor refrigeration sheet and controls the temperature of the semiconductor refrigeration sheet by controlling the current of the semiconductor refrigeration sheet, thereby controlling the working temperature of the power device. The cooling plate is a current-controlled device. Changing the current can change the temperature of the cold surface of the semiconductor cooling plate. There is a corresponding relationship between the current and the temperature, and the control is simple and the tracking is good. There are no moving parts in the semiconductor refrigeration technology and the reliability is high, which makes it flexible to install and use. It gets rid of the limitations of air cooling and refrigerant pipe heat dissipation on the installation space and position to a large extent. Therefore, the control module of the present invention directly controls the temperature of the power device according to the working current of the semiconductor cooling plate. There is no need to install a temperature detection device for the power device or the semiconductor cooling plate. It solves the defect that the air-conditioning controller cannot meet the heat dissipation of the heating device when the appearance structure is limited while saving costs. The provided semiconductor refrigeration and heat dissipation technology better solves the heat dissipation problem of the power device, ensures the service life of the key power device, and improves the reliability and operation quality of the controller.

[0009] The heat dissipation device of the power device according to the present invention may also have the following technical features:

[0010] In the above technical solution, preferably, the control module specifically includes a switching device, which is arranged between the DC power supply and the semiconductor refrigeration plate, and is used to control the start and stop of the DC power supply to the semiconductor refrigeration plate; a wide-amplitude pulse modulation module, which is used to adjust the duty cycle of the control pulse signal sent to the switching device according to the size of the working current inside the semiconductor refrigeration plate, so that the switching device can be opened or closed according to the control pulse signal.

[0011] In this technical solution, the control module in the heat dissipation device of the power device specifically includes a switching device. A switching device is also arranged between the DC power supply and the semiconductor refrigerator. When the switching device is turned off, the DC power supply stops supplying power to the semiconductor refrigerator. When the switching device is turned on, the DC power supply is restored to supply power to the semiconductor refrigerator. The wide-amplitude pulse modulation module is connected to the switching device. The duty cycle of the control pulse signal sent to the switching device is adjusted according to the internal working current of the semiconductor refrigerator. The switching device opens or closes according to the control pulse signal, thereby realizing the control of the input current of the semiconductor refrigerator. The working current of the semiconductor refrigerator is directly used to control the current input to the semiconductor refrigerator, thereby forming a closed-loop feedback. The control process is more direct, the control is simpler, and the tracking is better.

[0012] In any of the above technical solutions, preferably, the current sampling module is used to collect the working current and send the working current to the wide-amplitude pulse modulation module, so that the wide-amplitude pulse modulation module adjusts the duty cycle.

[0013] In this technical solution, the heat dissipation device of the power device also includes a current sampling module. The working current of the semiconductor refrigeration plate is obtained using the current sampling module, and there is no need to install a temperature detection device. On the one hand, this saves costs. On the other hand, there is no need to convert the temperature into a working current and then control the input current according to the working current. The control process is more direct, the control is simpler, and the tracking is better.

[0014] In any of the above technical solutions, preferably, an input filter module is provided between the DC power supply and the switching device, and is used to filter the current input to the switching device.

[0015] In this technical solution, the heat dissipation device of the power device also includes an input filter module, which is arranged between the DC power supply and the switching device to filter the current of the input switching device. Its essence is to filter the current in the control module, thereby achieving effective filtering of a specific frequency point or frequencies other than the frequency point, making the control process more accurate.

[0016] In any of the above technical solutions, preferably, the output filter module and the input filter module are arranged between the switch device and the semiconductor refrigeration plate to filter the current of the output switch device.

[0017] In this technical solution, the heat dissipation device of the power device also includes an output filtering module, which is arranged between the switching device and the semiconductor refrigeration plate to filter the current of the output switching device. Its essence is to filter the current input to the semiconductor refrigeration plate, thereby filtering out noise, and the current input to the semiconductor refrigeration plate is a "pure" current.

[0018] In any of the above technical solutions, preferably, a thermally conductive insulating material is filled between the cold surface of the semiconductor refrigeration plate and the power device.

[0019] In this technical solution, generally speaking, semiconductor refrigerators and power devices are solids with fixed shapes and relatively hard surfaces. Therefore, even if the two are in close contact, there will be a certain gap, which will cause the temperature of the cold surface of the semiconductor refrigerator to not be well utilized. Filling the space between the cold surface of the semiconductor refrigerator and the power device with thermally conductive insulating materials, such as thermal paste, can, on the one hand, reduce the gap between the cold surface of the semiconductor refrigerator and the power device, thereby improving the utilization rate of the cooling temperature of the semiconductor refrigerator. On the other hand, the material itself has heat dissipation and thermal conductivity, which can also improve the heat dissipation effect of the power device.

[0020] In any of the above technical solutions, preferably, the semiconductor refrigeration plate includes: two relatively parallel ceramic plates, and a P-type semiconductor material and an N-type semiconductor material clamped and butted between the ceramic plates.

[0021] In this technical solution, the semiconductor cooling plate is two relatively parallel ceramic plates, and P-type semiconductor material and N-type semiconductor material are clamped and connected between the ceramic plates. Semiconductor materials such as silicon carbide (Sic) or gallium nitride (GaN) have very low calorific value themselves, especially GaN semiconductors, whose on-state voltage drop is almost zero, and the heat generated is negligible. The heat dissipation requirements are not high, and the heat dissipation advantages of the cooling plate are obviously visible.

[0022] In any of the above technical solutions, preferably, the butted P-type semiconductor material and N-type semiconductor material are connected in a series circuit.

[0023] In this technical solution, when power is applied to the P-type semiconductor material and the N-type semiconductor material connected in a series circuit, the movement of carriers causes the N-end to absorb energy and become the cold surface, and the P-end to release energy and become the hot surface, thereby achieving heat dissipation of the power device by the cold surface of the semiconductor refrigeration plate.

[0024] In any of the above technical solutions, preferably, the hot surface of the semiconductor refrigeration plate is suspended in the air or in contact with the heat transfer body.

[0025] In this technical solution, while the cold surface of the semiconductor refrigeration plate is used to dissipate heat to the power device, according to the law of conservation of energy, heat will be generated on the other side of the semiconductor refrigeration plate, and the heat dissipation treatment of the hot surface must also be considered. Therefore, the hot surface of the semiconductor refrigeration plate is suspended in the air or in contact with the heat transfer body as needed, such as being installed on the air conditioner sheet metal to dissipate heat, so the cooling power of the refrigeration plate cannot be very large.

[0026] In any of the above technical solutions, preferably, the power device includes one of the following: a rectifier bridge, an insulated gate bipolar transistor (IGBT), a power diode, a compressor control module, and a fan control module.

[0027] In this technical solution, the types of power devices are specifically listed. Rectifier bridge, insulated gate bipolar transistor (IGBT), power diode, compressor control module, and fan control module are all core power devices of the air conditioner. The reliability of these devices determines the quality of the air conditioner. During the operation of the air conditioner, a lot of heat will be generated. Therefore, these power devices need to be cooled. Of course, they are not limited to the power devices of the air conditioner listed above.

[0028] According to a second aspect of the present invention, the present invention provides an air conditioner, comprising at least one power device and a heat dissipation device for the power device as in any of the above technical solutions, for dissipating heat for the at least one power device.

[0029] The air conditioner provided by the present invention includes the heat dissipation device for power devices in any of the above technical solutions, and therefore has all the beneficial effects of the heat dissipation device for power devices, which will not be described in detail here.

[0030] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0032] Figure 1 A schematic block diagram showing the structure of a heat dissipation device for a power device according to an embodiment of the present invention is shown;

[0033] Figure 2 A schematic diagram showing the structure of a semiconductor cooling plate in a heat dissipation device for a power device according to an embodiment of the present invention is shown;

[0034] Figure 3 A schematic block diagram of an air conditioner according to an embodiment of the present invention is shown.

[0035] Reference numerals:

[0036] in, Figure 2 The corresponding relationship between the reference numerals and component names in the figure is:

[0037] 10 semiconductor cooling plate, 102 first ceramic plate, 104 second ceramic plate, 106 P type semiconductor material, 108 N type semiconductor material. DETAILED DESCRIPTION

[0038] In order to more clearly understand the above aspects, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0039] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0040] The embodiment of the first aspect of the present invention provides a heat dissipation device for a power device, which is used in an air conditioner. Figure 1 The schematic block diagram of the structure of a heat dissipation device for a power device according to an embodiment of the present invention is shown. The heat dissipation device for a power device comprises:

[0041] The semiconductor cooling sheet 10, the power device A and the cold surface of the semiconductor cooling sheet 10 are in contact with each other;

[0042] A DC power supply 20 is electrically connected to the semiconductor cooling chip and is used to supply power to the semiconductor cooling chip;

[0043] The control module 30 is electrically connected to the semiconductor refrigeration chip 10 and is used to control the working current inside the semiconductor refrigeration chip 10 to control the cold surface temperature of the semiconductor refrigeration chip 10 and further control the working temperature of the power device A.

[0044] The heat dissipation device of the power device provided by the present invention is applied to an air conditioner to dissipate heat for the power device A of the air conditioner, and comprises a semiconductor cooling sheet 10. When powered on, the semiconductor cooling sheet 10 forms a hot surface and a cold surface on both sides, respectively, so that the power device A and the cold surface of the semiconductor cooling sheet 10 are in contact with each other. The rapidity and high efficiency of the cooling by the semiconductor cooling sheet 10 make the heat dissipation effect of the power device A better. The heat dissipation device of the power device A also comprises a DC power supply 20, which is electrically connected to the semiconductor cooling sheet 10 and used to supply power to the semiconductor cooling sheet 10, so that the semiconductor cooling sheet 10 forms a cold surface after being powered on to dissipate heat for the power device A. The heat dissipation device of the power device also comprises a control module 30, which is electrically connected to the semiconductor cooling sheet 10, and controls the temperature of the semiconductor cooling sheet 10 by controlling the current of the semiconductor cooling sheet 10, thereby controlling the power device A. The working temperature of A, because the semiconductor refrigeration chip is a current-controlled device, the temperature of the cold surface of the semiconductor refrigeration chip can be changed by changing the current. There is a corresponding relationship between the current and the temperature, and the control is simple and the tracking is good. There are no moving parts in the semiconductor refrigeration technology and the reliability is high, which makes it flexible to install and use, and to a large extent gets rid of the limitations of air cooling and refrigerant pipe heat dissipation on the installation space and position. Therefore, the control module 30 of the present invention directly controls the temperature of the power device A according to the working current of the semiconductor refrigeration chip 10, and there is no need to install a temperature detection device for the power device A or the semiconductor refrigeration chip 10. It solves the defect that the air-conditioning controller cannot meet the heat dissipation of the heating device when the appearance structure is limited while saving costs. The provided semiconductor refrigeration and heat dissipation technology can better solve the heat dissipation problem of the power device, ensure the service life of the key power device, and improve the reliability and operation quality of the controller.

[0045] In one embodiment of the present invention, preferably, Figure 1 The control module 30 specifically includes: a switch device 302, which is arranged between the DC power supply 20 and the semiconductor refrigeration chip 10, and is used to control the start and stop of the DC power supply 20 supplying power to the semiconductor refrigeration chip 10; a wide-band pulse modulation module 304, which is used to adjust the duty cycle of the control pulse signal sent to the switch device 302 according to the size of the working current inside the semiconductor refrigeration chip 10, so that the switch device 302 is opened or closed according to the control pulse signal.

[0046] In this embodiment, the control module 30 in the heat dissipation device of the power device specifically includes a switching device 302. The power device A is further provided with a switching device 302 between the DC power supply 20 and the semiconductor refrigeration plate 10. When the switching device 302 is turned off, the DC power supply 20 stops supplying power to the semiconductor refrigeration plate 10. When the switching device 302 is turned on, the DC power supply 20 resumes supplying power to the semiconductor refrigeration plate 10. The wide-amplitude pulse modulation module 304 is connected to the switching device 302, and the duty cycle of the control pulse signal sent to the switching device 302 is adjusted according to the internal working current of the semiconductor refrigeration plate 10. The switching device 302 opens or closes according to the control pulse signal, thereby realizing the control of the input current of the semiconductor refrigeration plate 10. The working current of the semiconductor refrigeration plate 10 is directly used to control the current input to the semiconductor refrigeration plate 10, thereby forming a closed-loop feedback, and the control process is more direct, the control is simpler, and the tracking performance is better.

[0047] In one embodiment of the present invention, preferably, Figure 1 , the current sampling module 40 is used to collect the working current and send the working current to the wide-amplitude pulse modulation module 304, so that the wide-amplitude pulse modulation module 304 adjusts the duty cycle.

[0048] In this embodiment, the heat dissipation device of the power device also includes a current sampling module 40. The working current of the semiconductor refrigeration plate 10 is obtained using the current sampling module 40, and there is no need to install a temperature detection device. On the one hand, this saves costs. On the other hand, there is no need to convert the temperature into the working current and then control the input current according to the working current. The control process is more direct, the control is simpler, and the tracking is better.

[0049] In one embodiment of the present invention, preferably, Figure 1 , an input filter module 50 , which is arranged between the DC power supply 20 and the switch device 302 , and is used to filter the current input to the switch device 302 .

[0050] In this embodiment, the heat dissipation device of the power device also includes an input filter module 50, which is arranged between the DC power supply 20 and the switching device 302, and filters the current of the input switching device 302. Its essence is to filter the current in the control module 30, thereby achieving effective filtering of a specific frequency point or frequencies other than the frequency point, making the control process more accurate.

[0051] In one embodiment of the present invention, preferably, Figure 1 The output filter module 60 and the input filter module 50 are arranged between the switch device 302 and the semiconductor refrigeration sheet 10 to filter the current of the output switch device 302 .

[0052] In this embodiment, the heat dissipation device of the power device also includes an output filtering module 60, which is arranged between the switching device 302 and the semiconductor refrigeration chip 10, and filters the current of the output switching device 302. Its essence is to filter the current input to the semiconductor refrigeration chip 10, thereby filtering out noise, and the current input to the semiconductor refrigeration chip 10 is a "pure" current.

[0053] In one embodiment of the present invention, preferably, a thermally conductive insulating material is filled between the cold surface of the semiconductor cooling sheet 10 and the power device A.

[0054] In this embodiment, generally speaking, the semiconductor refrigeration plate 10 and the power device A are solids with fixed shapes and relatively hard surfaces, so even if the two are in close contact, there will be a certain gap, which will cause the temperature of the cold surface of the semiconductor refrigeration plate 10 to not be well utilized. Filling the space between the cold surface of the semiconductor refrigeration plate 10 and the power device A with a thermally conductive insulating material, such as heat dissipation paste, can, on the one hand, reduce the gap between the cold surface of the semiconductor refrigeration plate 10 and the power device A, thereby improving the utilization rate of the cooling temperature of the semiconductor refrigeration plate 10. On the other hand, the material itself has heat dissipation and thermal conductivity, which can also improve the heat dissipation effect of the power device A.

[0055] In one embodiment of the present invention, preferably, Figure 2 The semiconductor cooling plate 10 includes: a first ceramic plate 102 and a second ceramic plate 104 which are relatively parallel, and a P-type semiconductor material 106 and an N-type semiconductor material 108 which are clamped and connected between the first ceramic plate 102 and the second ceramic plate 104 .

[0056] In this embodiment, the semiconductor cooling plate 10 is two relatively parallel first ceramic plates 102 and second ceramic plates 104, and a P-type semiconductor material 106 and an N-type semiconductor material 108 are clamped and connected between the first ceramic plate 102 and the second ceramic plate 104. The heat generation of semiconductor materials such as silicon carbide (Sic) or gallium nitride (GaN) is very low. In particular, the on-state voltage drop of GaN semiconductors is almost zero, and the heat generated is negligible. The heat dissipation requirements are not high, and the heat dissipation advantage of the cooling plate is obvious.

[0057] In one embodiment of the present invention, preferably, the butted P-type semiconductor material and N-type semiconductor material are connected in a series circuit.

[0058] In this embodiment, when power is applied to the P-type semiconductor material and the N-type semiconductor material connected in a series circuit, the movement of carriers causes the N-end to absorb energy and become a cold surface, while the P-end releases energy and becomes a hot surface, thereby achieving heat dissipation of the power device A by the cold surface of the semiconductor refrigeration sheet 10.

[0059] In one embodiment of the present invention, preferably, the hot surface of the semiconductor cooling plate 10 is suspended in the air or in contact with a heat transfer body.

[0060] In this embodiment, while the cold surface of the semiconductor refrigeration plate 10 is used to dissipate heat to the power device A, according to the law of conservation of energy, heat will be generated on the other side of the semiconductor refrigeration plate 10, and the heat dissipation treatment of the hot surface also needs to be considered. Therefore, the hot surface of the semiconductor refrigeration plate 10 is suspended in the air or in contact with the heat transfer body as needed, such as being installed on the air-conditioning sheet metal to dissipate heat, so the cooling power of the refrigeration plate cannot be very large.

[0061] In one embodiment of the present invention, preferably, the power device A includes one of the following: a rectifier bridge, an insulated gate bipolar transistor (IGBT), a power diode, a compressor control module, and a fan control module.

[0062] In this embodiment, the types of power devices A are specifically listed. The rectifier bridge, insulated gate bipolar transistor (IGBT), power diode, compressor control module, and fan control module are all core power devices A of the air conditioner. The reliability of these devices determines the quality of the air conditioner. During the operation of the air conditioner, a large amount of heat is generated. Therefore, these power devices need to be cooled. Of course, they are not limited to the power devices of the air conditioner listed above.

[0063] In a second aspect of the present invention, an air conditioner 300 is provided. Figure 3 As shown, it includes a power device A and a heat dissipation device 302 of the power device as in any of the above embodiments, which is used to dissipate heat for the power device A.

[0064] The air conditioner 300 provided by the present invention includes the heat dissipation device 302 for power devices in any of the above embodiments, and thus has all the beneficial effects of the heat dissipation device 302 for power devices, which will not be described in detail herein.

[0065] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for a power device, used in an air conditioner, characterized in that: include: A semiconductor refrigeration sheet, wherein the power device and a cold surface of the semiconductor refrigeration sheet are in contact with each other; A direct current power supply, electrically connected to the semiconductor refrigeration chip, for supplying power to the semiconductor refrigeration chip; A control module, used for controlling the magnitude of the current inputted by the DC power supply to the semiconductor refrigeration chip according to the magnitude of the internal working current of the semiconductor refrigeration chip, so as to control the cold surface temperature of the semiconductor refrigeration chip and further control the working temperature of the power device; The control module specifically includes: A switch device, arranged between the DC power supply and the semiconductor refrigeration chip, for controlling the start and stop of the DC power supply to the semiconductor refrigeration chip; A wide-amplitude pulse modulation module, used for adjusting the duty cycle of the control pulse signal sent to the switch device according to the magnitude of the working current, so that the switch device is turned on or off according to the control pulse signal; A current sampling module, the current sampling module is used to collect the working current and send the working current to the wide-amplitude pulse modulation module, so that the wide-amplitude pulse modulation module adjusts the duty cycle; The heat dissipation device of the power device also includes: An input filter module, which is disposed between the DC power supply and the switch device and is used to filter the current input to the switch device and to filter the current in the control module; The output filter module is arranged between the switch device and the semiconductor refrigeration plate, and is used to filter the current output from the switch device and the current input to the semiconductor refrigeration plate.

2. The heat dissipation device for a power device according to claim 1, characterized in that: Also includes: A heat-conducting insulating material is filled between the cold surface of the semiconductor refrigeration sheet and the power device.

3. The heat dissipation device for a power device according to claim 1, characterized in that: The semiconductor refrigeration plate comprises: two relatively parallel ceramic plates, and a P-type semiconductor material and an N-type semiconductor material clamped and butted between the ceramic plates.

4. The heat dissipation device for a power device according to claim 3, characterized in that: The butted P-type semiconductor material and N-type semiconductor material are connected in a series circuit.

5. The heat dissipation device for a power device according to claim 1, characterized in that: The hot surface of the semiconductor refrigeration plate is suspended in the air or in contact with a heat transfer body.

6. The heat dissipation device for a power device according to any one of claims 1 to 5, characterized in that: The power device includes one of the following: a rectifier bridge, an insulated gate bipolar transistor (IGBT), a power diode, a compressor control module, and a fan control module.

7. An air conditioner, characterized in that: include: at least one power device; as well as The heat dissipation device for a power device according to any one of claims 1 to 6, used for dissipating heat for the at least one power device.

Images