A fully automatic calibration and calibration device based on air quality sensor module
By using the separation of the bottom plate and the mother plate, the communication between the upper machine and the lower machine solves the problem of the air quality sensor module calibration and calibration.
Patent Information
- Application Number
- CN201910163142.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-03-05
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2039-03-05
AI Technical Summary
The prior art has problems such as time-consuming, poor calibration consistency, low efficiency and many artificial interference factors in the calibration and calibration process of air quality sensor modules.
The method of separating the bottom plate and the mother board, through the communication of the upper machine and the lower machine, the superposition of multiple bottom plates and female boards, increasing the number of test modules, thereby improving the efficiency of batch production, and the communication connection of the base plate with the test motherboard by testing the bottom board and the testing motherboard. , More accurately perceive the module state to ensure product quality.
The efficient and batch production of the air quality sensor module has been achieved, the efficiency and consistency of calibration and calibration are improved, artificial interference is reduced, and product quality is guaranteed.
Smart Images

Figure CN109725115B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of artificial intelligence technology, and in particular to a fully automatic calibration and demarcation device based on an air quality sensor module. Background Art
[0002] Due to the late development of domestic MEMS air quality sensor technology, many testing and production equipment are imperfect and incomplete, and the entire existing technology is relatively rudimentary and does not have much reference significance. The existing technology is basically a relatively primitive technology, using each module to calibrate and calibrate separately, which has many disadvantages and inconveniences, mainly reflected in: (1) Time-consuming: single module calibration or calibration of 8 or less modules: calibration takes a long time, calibration consistency is poor, there is a little correlation between a single or 8 modules, but the correlation is seriously insufficient, or relatively poor. (2) Poor consistency: the consistency of calibration results is relatively poor: the differences between different batches are relatively large. (3) Low efficiency: only calibrate 1 or less than 8 modules each time. (4) Many human interference factors: different reference gases need to be manually updated. Summary of the invention
[0003] The purpose of the present invention is to provide a fully automatic calibration and demarcation device based on an air quality sensor module. By separating a base plate and a motherboard, a plurality of base plates and motherboards are superimposed, so that the number of test modules can be increased exponentially, thereby improving the efficiency of mass production of air quality sensor modules. By adopting communication between an upper computer and a lower computer, the specific state of each module at work can be perceived more conveniently and comprehensively, and the correct judgment of the module test results is more accurate and effective, thereby ensuring product quality and solving the problems in the prior art.
[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a fully automatic calibration and demarcation device based on an air quality sensor module, comprising a chassis, a bracket is installed at the bottom of the chassis, a test base plate and a test motherboard are installed on the bracket, the test base plate is communicatively connected to the test motherboard through a circuit, a first fan is installed on the side wall of the chassis, and the first fan is connected to the test base plate through a circuit; a heater and a second fan are also installed at the bottom of the chassis, the heater is connected to the heating circuit contained in the test base plate through a circuit, and the second fan is connected to the fan drive circuit contained in the test base plate through a circuit; a gas phase / liquid phase injection fixture is also installed in the chassis, and the gas phase / liquid phase injection fixture is connected to the J pin of the motor drive circuit contained in the test base plate through a circuit; a closed door device for air inlet and outlet is also provided at one end of the fan, and the closed door device is connected to the DC of the motor drive circuit contained in the test base plate through a circuit. The test baseboard contains a data transmission circuit, a fan drive circuit, a key communication circuit, a motor drive circuit, a buzzer circuit, a test baseboard MCU chip circuit, a liquid heating circuit, a communication expansion circuit, a test motherboard main control chip circuit, a gas mixing fan drive circuit and a battery charging and discharging circuit.
[0005] Preferably, the data transmission circuit is composed of a serial port JS1 and resistors R17-R20, wherein pin 6 of the serial port JS1 is connected in series with resistor R19 and then connected to the RXD1 terminal, and pin 7 of the serial port JS1 is connected in series with resistor R20 and then connected to the TXD1 terminal, one end of the resistor R17 and the resistor R18 are respectively electrically connected to the circuit interfaces of pins 6 and 7 of the serial port JS1, and the other ends are both connected to the VDD_MCU terminal.
[0006] Preferably, the fan drive circuit is composed of a transistor Q6, a transistor Q7 and resistors R21-R24, wherein the S pole of the transistor Q6 is connected to the VDC_IN terminal, the D pole of the transistor Q6 is connected to the 5V_FAN3 terminal, the G pole of the transistor Q6 is connected in series with the resistor R22 and then connected to the pin 3 of the transistor Q7, the pin 1 of the transistor Q7 is connected in series with the resistor R24 and then connected to the FAN3 terminal, the two ends of the resistor R21 are connected in parallel to the circuit interface between the S pole and the G pole of the transistor Q6, one end of the resistor R23 is electrically connected to the circuit interface of the resistor R24, and the other end of the resistor R23 is connected to the VDC_IN terminal.
[0007] Preferably, the key communication circuit is composed of a key switch K1-key switch K3 and a communication interface SIP3, wherein the key switch K1 is connected to the K_CHE CK terminal, the key switch K2 is connected to the K_CHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, and the other end is connected to the K_CHE CK2 terminal, pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and pin 2 of the communication interface SIP3 is connected to the RXD1 terminal.
[0008] Preferably, the test baseboard MCU chip circuit is composed of a main control chip U1, pins 19 and 20 of the main control chip U1 are respectively connected to the RXD and TXD terminals, pins 23 and 24 of the main control chip U1 are respectively connected to the K_CHECK and K_CHECK1 terminals, pin 36 of the main control chip U1 is connected to the FAN1 terminal, pins 37, 38, and 39 of the main control chip U1 are respectively connected to the P00, P01, and P002 terminals, and pin 12 of the main control chip U1 is connected to the VDD_MCU terminal.
[0009] Preferably, the buzzer circuit is composed of a transistor Q9 and a buzzer BL1, wherein pin 1 of the transistor Q9 is connected in series with a resistor R133 and then connected to a BUZ / PWN terminal, pin 3 of the transistor Q9 is connected to pin 2 of the buzzer BL1, and pin 1 of the buzzer BL1 is connected to a BAT_5V terminal.
[0010] Preferably, the motor drive circuit is composed of a motor drive chip U9 and a socket J01, a socket J02, a socket J03, a motor DC and a speaker SPKR, the socket J01 is connected to the test baseboard MCU chip circuit 12 through a line, the socket J02 is connected to the motor of the liquid / gas phase injection fixture through a line, and the socket J03 is connected to the closed door device that controls the air inlet and outlet through a line.
[0011] Preferably, the gas mixing fan driving circuit is composed of transistors Q3, Q4 and socket CN1, pin 1 of the transistor Q4 is connected in series with resistor R4 and then connected to the test baseboard MCU chip circuit 12 through a line, pin 3 of the transistor Q4 is connected in series with resistor R2 and then connected to pin G of the transistor Q3, pin S of the transistor Q3 is connected to the power supply VDC_IN port through a line, pin D of the transistor Q3 is connected to the socket CN1, and the socket CN1 is connected to the second fan through a line.
[0012] Preferably, the liquid heating circuit consists of transistors Q1, Q2 and socket CN5, pin 1 of transistor Q1 is connected in series with resistor R8 and then connected to HEAT1 terminal, pin D of transistor Q2 is connected to pin 1 of socket CN5, and socket CN5 is connected to the heating device through a line.
[0013] Preferably, the clamping circuit of the module to be tested is evenly arranged on the test motherboard, and the clamping circuit consists of spring test pins S1, CN1 and CN2. The spring test pin S1 clamps the air quality sensor module, CN1 is connected to pins 3 and 4 of the test module, and CN2 is connected to the main control chip circuit of the test motherboard through a line.
[0014] Preferably, the test motherboard also contains a display screen circuit, which is composed of an FPC board, and the FPC board is connected to the main control chip circuit of the test motherboard through a line.
[0015] Preferably, the communication expansion circuit 14 is composed of a switch chip U10, pins 3 and 13 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit through lines, pins 1, 5, 2, 4 and pins 12, 14, 15, 11 of the switch chip U10 are respectively connected to pins 3 and 4 of the terminal SI of the clamping circuit of the module to be tested through lines, and pins 9, 10, 6 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit through lines.
[0016] Preferably, the battery charge and discharge circuit is composed of a charge and discharge management chip U3 and a socket CN4, pin 5 of the charge and discharge management chip U3 is connected to the socket CN4, the socket CN4 is connected to the battery, and pin 4 of the charge and discharge management chip U3 is connected to the power input terminal through resistors R176 and R171.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] This fully automatic calibration and demarcation equipment based on the air quality sensor module adopts a method of separating the test base plate and the test mother board, and realizes the superposition of multiple test base plates and test mother boards, so that the number of test modules can be increased exponentially, thereby improving the efficiency of mass production of air quality sensor modules. The use of communication connection between the test base plate and the test mother board can more conveniently and comprehensively perceive the specific status of each module at work, and the correct judgment of the module test results is more accurate and effective, ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is the overall structural front view of the present invention;
[0020] Figure 2 A data transmission circuit diagram of the present invention;
[0021] Figure 3 The fan driving circuit diagram of the present invention;
[0022] Figure 4 It is a key communication circuit diagram of the present invention;
[0023] Figure 5The motor driving circuit diagram of the present invention;
[0024] Figure 6 The buzzer circuit diagram of the present invention;
[0025] Figure 7 is a display screen circuit diagram of the present invention;
[0026] Figure 8 The circuit diagram of the test baseboard MCU chip of the present invention;
[0027] Fig. 9 It is a liquid heating circuit diagram of the present invention;
[0028] Fig.10 It is a module communication expansion circuit diagram of the present invention;
[0029] Fig.11 This is a circuit diagram of the main control chip of the test motherboard of the present invention;
[0030] Fig.12 A fan driving circuit diagram for mixed gas of the present invention;
[0031] Fig.13 A clamping circuit diagram of a module to be tested of the present invention;
[0032] Fig.14 It is a battery charging and discharging circuit diagram of the present invention.
[0033] In the figure: 1. chassis; 2. bracket; 3. test base plate; 4. test motherboard; 5. first fan; 6. data transmission circuit; 7. fan drive circuit; 8. key communication circuit; 9. motor drive circuit; 10. buzzer circuit; 11. display screen circuit; 12. test base plate MCU chip circuit; 13. liquid heating circuit; 14. communication expansion circuit; 15. test motherboard main control chip circuit; 16. gas mixing fan drive circuit; 17. clamping circuit; 18. battery charging and discharging circuit; 19. heater; 20. second fan; 21. liquid / gas phase injection fixture; 22. closed door device. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0035] See also Figure 1 , 713. A fully automatic calibration and calibration device based on an air quality sensor module, comprising a chassis 1, a bracket 2 is installed at the bottom of the chassis 1, a test base plate 3 and a test motherboard 4 are installed on the bracket 2, the test base plate 3 is connected to the test motherboard 4 through a line, a first fan 5 is installed on the side wall of the chassis 1, and the first fan 5 is connected to the test base plate 3 through a line; a heater 19 and a second fan 20 are also installed at the bottom of the chassis 1, and the heater 19 is connected to the test base plate 3 through a line. The heating circuit 13 contained on the chassis 1 is connected, and the second fan 20 is connected to the fan driving circuit 16 contained on the test base plate 3 through a circuit; a gas phase / liquid phase injection fixture 21 is also installed in the chassis 1, and the gas phase / liquid phase injection fixture 21 is connected to the J02 pin of the motor driving circuit 9 contained on the test base plate 3 through a circuit; one end of the fan 5 is also provided with a closed door device 22 for air inlet and outlet, and the closed door device 22 is connected to the DC of the motor driving circuit 9 contained on the test base plate 3 through a circuit. motor foot connection; the test baseboard 3 contains a data transmission circuit 6, a fan drive circuit 7, a key communication circuit 8, a motor drive circuit 9, a buzzer circuit 10, a test baseboard MCU chip circuit 12, a liquid heating circuit 13, a communication expansion circuit 14, a test motherboard main control chip circuit 15, a gas mixing fan drive circuit 16 and a battery charge and discharge circuit 18; the test motherboard 4 is evenly arranged with a clamping circuit 17 of the module to be tested, the clamping circuit 17 is composed of a spring test pin S1, CN1 and CN2, the spring test pin S1 clamps the air quality sensor module, CN1 is connected to the feet 3 and 4 of the test module, CN1 can be connected to a computer or other equipment for burning the software program of the module to be tested, CN2 is connected to the test motherboard main control chip circuit 15 through a line, CN2 can be connected to a computer or other equipment for reading the transmitted data with the test module; the test motherboard 4 also contains a display screen circuit 11, the display screen circuit 11 is composed of an FPC board, and the FPC board is connected to the test motherboard main control chip circuit 15 through a line.
[0036] See also Figure 2 The data transmission circuit 6 is composed of a serial port JS1 and resistors R17-R20, wherein pin 6 of the serial port JS1 is connected in series with resistor R19 and then connected to the RXD1 terminal, and pin 7 of the serial port JS1 is connected in series with resistor R20 and then connected to the TXD1 terminal. One end of the resistor R17 and the resistor R18 are respectively electrically connected to the circuit interface of pins 6 and 7 of the serial port JS1, and the other ends are connected to the VDD_MCU terminal; the communication connection between the upper computer and the lower computer is realized through the data transmission circuit 6, which is convenient for data transmission.
[0037] See also Figure 3The fan driving circuit 7 is composed of a transistor Q6, a transistor Q7 and resistors R21-R24, wherein the S pole of the transistor Q6 is connected to the VDC_IN terminal, the D pole of the transistor Q6 is connected to the 5V_FAN3 terminal, the G pole of the transistor Q6 is connected in series with the resistor R22 and then connected to the pin 3 of the transistor Q7, the pin 1 of the transistor Q7 is connected in series with the resistor R24 and then connected to the FAN3 terminal, the two ends of the resistor R21 are connected in parallel to the S pole and G pole circuit interface of the transistor Q6, one end of the resistor R23 is electrically connected to the circuit interface of the resistor R24, and the other end of the resistor R23 is connected to the VDC_IN terminal; the operation of the fan 5 is started by the fan driving circuit 7, thereby ensuring a completely uniform mixing concentration of the gas and the air in the chassis 1.
[0038] See also Figure 4 The key communication circuit 8 is composed of a key switch K1, a key switch K3 and a communication interface SIP3, wherein the key switch K1 is connected to the K_CHE CK terminal, the key switch K2 is connected to the K_CHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, and the other end is connected to the K_CHE CK2 terminal, pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and pin 2 of the communication interface SIP3 is connected to the RXD1 terminal; human-computer interaction is realized through the key communication circuit 8, which is convenient for people to operate human-computer devices.
[0039] See also Figure 5 The motor drive circuit 9 is composed of a motor drive chip U9 and sockets J01, J02, J03, a motor DC and a speaker SPKR. The socket J01 is connected to the test baseboard MCU chip circuit 12 through a line, the socket J02 is connected to the motor of the liquid / gas phase injection fixture 21 through a line, and the socket J03 is connected to the closed door device 22 of the air inlet and outlet through a line; the control and operation of the connected equipment are realized through the motor drive circuit 9.
[0040] See also Figure 6 The buzzer circuit 10 is composed of a transistor Q9 and a buzzer BL1. The pin 1 of the transistor Q9 is connected in series with a resistor R133 and then connected to the BUZ / PWN terminal. The pin 3 of the transistor Q9 is connected to the pin 2 of the buzzer BL1. The pin 1 of the buzzer BL1 is connected to the BAT_5V terminal. The buzzer circuit 10 provides a warning when a safety accident occurs.
[0041] See also Figure 8The test baseboard MCU chip circuit 12 is composed of a main control chip U1, whose pins 19 and 20 are respectively connected to the RXD and TXD terminals, whose pins 23 and 24 are respectively connected to the K_CHECK and K_CHECK1 terminals, whose pin 36 is connected to the FAN1 terminal, whose pins 37, 38 and 39 are respectively connected to the P00, P01 and P002 terminals, and whose pin 12 is connected to the VDD_MCU terminal.
[0042] See also Fig. 9 The liquid heating circuit 13 is composed of transistors Q1, Q2 and socket CN5. Pin 1 of transistor Q1 is connected in series with resistor R8 and then connected to HEAT1 terminal. Pin D of transistor Q2 is connected to pin 1 of socket CN5. Socket CN5 is connected to the heating device through a line.
[0043] See also Fig.10 The communication expansion circuit 14 is composed of a switch chip U10, which completes the expansion from 1 channel to 4 channels and 1 channel to multiple channels. Pins 3 and 13 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit 15 through a line. Pins 1, 5, 2, 4 and pins 12, 14, 15, 11 of the switch chip U10 are respectively connected to pins 3 and 4 of the terminal SI of the clamping circuit 17 of the module to be tested through lines. Pins 9, 10, 6 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit 15 through lines.
[0044] See also Fig.12 The gas mixing fan driving circuit 16 is composed of transistors Q3, Q4 and socket CN1. Pin 1 of the transistor Q4 is connected in series with resistor R4 and then connected to the test baseboard MCU chip circuit 12 through a line. Pin 3 of the transistor Q4 is connected in series with resistor R2 and then connected to pin G of the transistor Q3. Pin S of the transistor Q3 is connected to the power supply VDC_IN port through a line. Pin D of the transistor Q3 is connected to the socket CN1, and the socket CN1 is connected to the second fan 20 through a line.
[0045] See also Fig.14 The battery charge and discharge circuit 18 is composed of a charge and discharge management chip U3 and a socket CN4. Pin 5 of the charge and discharge management chip U3 is connected to the socket CN4, the socket CN4 is connected to the battery, and pin 4 of the charge and discharge management chip U3 is connected to the power input terminal through resistors R176 and R171.
[0046] To sum up: this fully automatic calibration and calibration equipment based on the air quality sensor module adopts a method of separating the test base plate 3 and the test mother board 4, realizes the superposition of multiple test base plates 3 and test mother boards 4, so that the number of test modules can be increased exponentially, thereby improving the efficiency of mass production of air quality sensor modules, and the use of the test base plate 3 and the test mother board 4 for communication connection can more conveniently and comprehensively perceive the specific status of each module at work, and the correct judgment of the module test results is more accurate and effective, thereby ensuring product quality, thereby effectively solving the problems in the prior art.
[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A fully automatic calibration and calibration device based on an air quality sensor module, comprising a chassis (1), characterized in that The bottom of the case (1) is provided with a bracket (2), a test base plate (3) and a test motherboard (4) are provided on the bracket (2), the test base plate (3) is connected to the test motherboard (4) through a circuit, a first fan (5) is provided on the side wall of the case (1), the first fan (5) is connected to the test base plate (3) through a circuit; a heater (19) and a second fan (20) are provided at the bottom of the case (1), the heater (19) is connected to a heating circuit (13) on the test base plate (3) through a circuit, the second fan (20) is connected to a fan drive circuit (16) on the test base plate (3) through a circuit; a gas phase / liquid phase injection fixture (21) is provided in the case (1), the gas phase / liquid phase injection fixture (21) is connected to a J02 pin of a motor drive circuit (9) on the test base plate (3) through a circuit; one end of the fan (5) is provided with an air inlet and outlet The sealed door device (22) is connected to the DC motor pin of the motor drive circuit (9) contained on the test base plate (3) through a circuit: the test base plate (3) contains a data transmission circuit (6), a fan drive circuit (7), a key communication circuit (8), a motor drive circuit (9), a buzzer circuit (10), a test base plate MCU chip circuit (12), a liquid heating circuit (13), a communication expansion circuit (14), a test motherboard main control chip circuit (15), a gas mixing fan drive circuit (16) and a battery charging and discharging circuit (18); The data transmission circuit (6) is composed of a serial port JS1 and resistors R17-R20, wherein pin 6 of the serial port JS1 is connected in series with resistor R19 and then connected to the RXD1 terminal, and pin 7 of the serial port JS1 is connected in series with resistor R20 and then connected to the TXD1 terminal, one end of the resistor R17 and the resistor R18 are respectively electrically connected to the circuit interface of pin 6 and pin 7 of the serial port JS1, and the other ends are both connected to the VDD MCU terminal; The key communication circuit (8) is composed of a key switch K1-key switch K3 and a communication interface SIP3, wherein the key switch K1 is connected to the KCHE CK terminal, the key switch K2 is connected to the KCHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, and the other end is connected to the KCHE CK2 terminal, the pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and the pin 2 of the communication interface SIP3 is connected to the RXD1 terminal; The test baseboard MCU chip circuit (12) is composed of a main control chip U1, wherein pins 19 and 20 of the main control chip U1 are respectively connected to RXD and TXD terminals, pins 23 and 24 of the main control chip U1 are respectively connected to KCHECK and KCHECK1 terminals, pin 36 of the main control chip U1 is connected to the FAN1 terminal, pins 37, 38 and 39 of the main control chip U1 are respectively connected to P00, P01 and P002 terminals, and pin 12 of the main control chip U1 is connected to the VDD MCU terminal.
2. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The buzzer circuit (10) is composed of a transistor Q9 and a buzzer BL1, wherein the pin 1 of the transistor Q9 is connected in series with a resistor R133 and then connected to a BUZ / PWN terminal, the pin 3 of the transistor Q9 is connected to the pin 2 of the buzzer BL1, and the pin 1 of the buzzer BL1 is connected to a BAT 5V terminal.
3. A fully automatic calibration and calibration device based on an air quality sensor module according to claim 1, characterized in that The motor drive circuit (9) is composed of a motor drive chip U9, a socket J01, a socket J02, a socket J03, a motor DC and a speaker SPKR. The socket J01 is connected to the test baseboard MCU chip circuit (12) through a line, the socket J02 is connected to the motor of the liquid / gas phase injection fixture (21) through a line, and the socket J03 is connected to the airtight door device (22) for controlling the air inlet and outlet through a line.
4. A fully automatic calibration and calibration device based on an air quality sensor module according to claim 1, characterized in that The gas mixing fan driving circuit (16) is composed of transistors Q3, Q4 and a socket CN1; pin 1 of the transistor Q4 is connected in series with a resistor R4 and then connected to a test baseboard MCU chip circuit (12) through a line; pin 3 of the transistor Q4 is connected in series with a resistor R2 and then connected to pin G of the transistor Q3; pin S of the transistor Q3 is connected to a power supply VDC IN port through a line; pin D of the transistor Q3 is connected to the socket CN1; and the socket CN1 is connected to a second fan (20) through a line.
5. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The liquid heating circuit (13) is composed of transistors Q1, Q2 and a socket CN5, wherein pin 1 of the transistor Q1 is connected in series with a resistor R8 and then connected to a HEAT1 terminal, pin D of the transistor Q2 is connected to pin 1 of the socket CN5, and the socket CN5 is connected to a heating device through a line.
6. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The clamping circuit (17) of the module to be tested is evenly arranged on the test motherboard (4), and the clamping circuit (17) is composed of a spring test pin S1, CN1 and CN2. The spring test pin S1 clamps the air quality sensor module, CN1 is connected to pins 3 and 4 of the test module, and CN2 is connected to the main control chip circuit (15) of the test motherboard through a line.
7. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The test motherboard (4) also includes a display screen circuit (11), which is composed of an FPC board. The FPC board is connected to the test motherboard main control chip circuit (15) through a line.
8. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The communication expansion circuit (14) is composed of a switch chip U10, wherein pins 3 and 13 of the switch chip U10 are connected to a port of a test motherboard main control chip circuit (15) through a line, pins 1, 5, 2, 4 and pins 12, 14, 15, 11 of the switch chip U10 are respectively connected to pins 3 and 4 of a terminal S1 of a clamping circuit (17) of a module to be tested through a line, and pins 9, 10, 6 of the switch chip U10 are connected to a port of a test motherboard main control chip circuit (15) through a line.
9. The fully automatic calibration and calibration device based on the air quality sensor module according to claim 1 is characterized in that The battery charge and discharge circuit (18) is composed of a charge and discharge management chip U3 and a socket CN4, wherein pin 5 of the charge and discharge management chip U3 is connected to the socket CN4, the socket CN4 is connected to the battery, and pin 4 of the charge and discharge management chip U3 is connected to the power input terminal through resistors R176 and R171.
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