Preparation method of formaldehyde-free soybean meal-based wood adhesive for wood-based panels

A wood adhesive and soybean meal-based technology is applied in the field of preparation of formaldehyde-free soybean meal-based wood adhesives for wood-based panels, and can solve the problems of unsatisfactory wet bonding strength of plywood, uneven raw material particles of protein adhesive, and cross-linking. Uneven distribution of structure and other problems, to achieve the effect of easy spraying and sizing, improving physical and chemical properties, and high bonding strength

CN109880586BActive Publication Date: 2021-01-15GUANGXI UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2021-01-15

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Abstract

The invention relates to a preparation method of a formaldehyde-free soybean meal-based wood adhesive for artificial boards, and belongs to the technical field of adhesives. According to the invention, renewable resources, namely soybean meal, are used as raw materials, a water phase is selected as a solvent, and a process step of an alkali-acid two-step method is adopted. Epoxy resin, dicyandiamide, low-molecular-weight polyamide and soybean protein are combined for modification, a chemical reaction is carried out at the same time, and therefore the formaldehyde-free soybean meal-based wood adhesive with very high water resistance and bonding strength is prepared; the adhesive has the advantages of no formaldehyde, low viscosity, good cold pressing performance, low cost, high adhesive strength and the like; the adhesive does not volatilize formaldehyde, phenol or other harmful substances, has the characteristic of no formaldehyde, and is safe and environment-friendly, and the preparedsoybean meal-based wood adhesive is low in viscosity, convenient for applying, good in coating and pre-pressing performance, easy to spray and apply, convenient for repairing of plywood and capable of preventing a shaving board from being scattered, and the problems that a soybean adhesive is high in viscosity and difficult to spray are solved.
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Description

technical field

[0001] The invention relates to a preparation method of a formaldehyde-free soybean meal-based wood adhesive for wood-based panels, and belongs to the technical field of adhesives. Background technique

[0002] my country is short of precious wood resources, but there are abundant artificial forest resources. The wood-based panels prepared by using artificial forest fast-growing wood and agricultural and forestry processing residues through adhesives are the main raw materials for furniture floors and interior decoration in the living environment. In 2015, The total output of wood-based panels in my country is 310 million cubic meters, accounting for about 50% of the world's total output. Based on the average production of 9 cubic meters of wood-based panels per ton of adhesive, the consumption of wood adhesives in my country in 2015 was about 40 million tons (solid content 50%), of which urea-formaldehyde resin and its modified products accounted for 20% of t...

Examples

Embodiment 1

[0027] A preparation method of formaldehyde-free soybean meal-based wood adhesive for wood-based panels, comprising the following steps:

[0028] (1) Put the soybean meal into the water and mix it for 10 minutes according to the weight ratio of water: soybean meal = 75:25; use the alkaline substance sodium hydroxide to adjust the pH value of the mixture to 10.0, and continue stirring for 30 minutes.

[0029] (2) Adjust the pH value to 4.0 with acidic hydrochloric acid and stir for 25 minutes to obtain mixture A;

[0030] (3) According to the weight ratio of epoxy resin: dicyandiamide: low molecular weight polyamide is 8:1:1, mix epoxy resin, dicyandiamide and low molecular weight polyamide, and stir at 50°C for 35min to obtain Soybean gum high-efficiency composite curing agent; the molecular weight of the low molecular weight polyamide is 1000-1500;

[0031] (4) According to the weight ratio of mixture A:soybean gum high-efficiency composite curing agent of 5:1, mix mixture A...

Embodiment 2

[0033] A preparation method of formaldehyde-free soybean meal-based wood adhesive for wood-based panels, comprising the following steps:

[0034](1) Put the soybean meal into the water and mix and stir for 15 minutes according to the ratio of water:soybean meal=80:30 by weight; adjust the pH value of the mixture to 11.0 with alkaline substance potassium hydroxide, and continue stirring for 25 minutes.

[0035] (2) Adjust the pH value to 5.0 with acidic hydrochloric acid and stir for 30 minutes to obtain mixture A;

[0036] (3) According to the weight ratio of epoxy resin: dicyandiamide: low molecular weight polyamide is 8:1:1, mix epoxy resin, dicyandiamide and low molecular weight polyamide, and stir at 53°C for 33min to obtain Soybean gum high-efficiency composite curing agent; the molecular weight of the low molecular weight polyamide is 1000-1500;

[0037] (4) According to the weight ratio of mixture A: soybean gum high-efficiency composite curing agent of 5:1, mix mixtur...

Embodiment 3

[0039] A preparation method of formaldehyde-free soybean meal-based wood adhesive for wood-based panels, comprising the following steps:

[0040] (1) Put the soybean meal into the water and mix it for 20 minutes according to the weight ratio of water: soybean meal = 95:35; use the alkaline substance sodium hydroxide to adjust the pH value of the mixture to 13.0, and continue stirring for 20 minutes.

[0041] (2) Adjust the pH value to 6.0 with acidic substance phosphoric acid and stir for 33 minutes to obtain mixture A;

[0042] (3) According to the weight ratio of epoxy resin: dicyandiamide: low molecular weight polyamide is 8:1:1, mix epoxy resin, dicyandiamide and low molecular weight polyamide, and stir at 55°C for 30min to obtain Soybean gum high-efficiency composite curing agent; the molecular weight of the low molecular weight polyamide is 1000-1500;

[0043] (4) According to the weight ratio of mixture A:soybean gum high-efficiency composite curing agent of 5:1, mix m...