Waveguide feeding substrate and preparation method thereof, antenna system and preparation method thereof

Abstract

The present invention provides a waveguide feeding substrate and a preparation method thereof, an antenna system and a preparation method thereof, and belongs to the field of communication technology. The waveguide feeding substrate of the present invention includes: a first substrate, which has a receiving groove; the receiving groove includes a bottom, and a first side wall and a second side wall connected to the bottom and arranged oppositely; a waveguide feeding structure, which is embedded in the receiving groove, and the waveguide feeding structure is a hollow structure, which has a first surface arranged at the bottom of the receiving groove, a second surface arranged opposite to the first surface; and a third surface and a fourth surface connected between the first surface and the second surface and arranged oppositely; wherein the third surface is arranged on the first side wall, and the second surface is arranged on the second side wall; and an opening is arranged on the second surface. In this way, the first substrate and the antenna substrate can be fixed together through a bonding process, and the process has high precision, and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

Description

Technical Field

[0001] The present invention belongs to the field of communication technology, and in particular relates to a waveguide feeding substrate and a preparation method thereof, an antenna system and a preparation method thereof. Background Art

[0002] At present, the feeding of liquid crystal antennas is mainly based on microstrip line feeding and substrate integrated waveguide (SIW) feeding. The characteristics of microstrip line feeding are large isolation and high integration, and the disadvantage is large insertion loss. The characteristic of substrate integrated waveguide feeding is that it can replace rectangular waveguides. It is superior to traditional rectangular metal waveguides in terms of cross-sectional size, loss characteristics, processing cost and integration capability. However, the substrate integrated waveguide feeding structure is mostly a dielectric plate with through holes and metal plating on the upper and lower layers, which is similar to the performance of metal waveguides. The dielectric plate is mostly PCB. If the glass structure is integrated with the PCB structure, due to the material properties of the glass itself, it is not easy to integrate with substrates such as PCB. It is necessary to add a fixed frame or other means to fix the two together. The assembly accuracy is poor. Due to the high requirements for the alignment accuracy of the feeding position, it is easy to produce large losses. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a waveguide feeding substrate and a preparation method thereof, an antenna system and a preparation method thereof, which can effectively improve the assembly accuracy of the waveguide feeding substrate and the antenna substrate.

[0004] The technical solution adopted to solve the technical problem of the present invention is a waveguide feeding substrate, comprising:

[0005] A first substrate having a receiving groove; the receiving groove comprises a bottom, and a first side wall and a second side wall connected to the bottom and arranged opposite to each other;

[0006] A waveguide feeding structure is embedded in the receiving groove, and the waveguide feeding structure is a hollow structure, which has a first surface arranged at the bottom of the receiving groove, a second surface arranged opposite to the first surface, and a third surface and a fourth surface connected between the first surface and the second surface and arranged opposite to each other; wherein the third surface is arranged on the first side wall, the second surface is arranged on the second side wall; and an opening is arranged on the second surface. Preferably, the material of the first substrate includes: any one of glass, silicon, quartz, and ceramic.

[0007] Further preferably, the material of the waveguide feeding structure includes metal.

[0008] Preferably, a second substrate is provided on the second surface of the waveguide feeding structure.

[0009] The technical solution adopted to solve the technical problem of the present invention is a method for preparing a waveguide feeding substrate, comprising:

[0010] A first substrate is taken, and a receiving groove is formed by etching on the first substrate; wherein the receiving groove comprises: a bottom, and a first side wall and a second side wall connected to the bottom and arranged opposite to each other;

[0011] A waveguide feeding structure is formed and embedded in the accommodating groove; the waveguide feeding structure is a hollow structure, which has a first surface arranged at the bottom of the accommodating groove, a second surface arranged opposite to the first surface, and a third surface and a fourth surface connected between the first surface and the second surface and arranged opposite to each other; wherein the third surface is formed on the first side wall, and the second surface is formed on the second side wall; an opening is arranged on the second surface.

[0012] Preferably, the material of the first substrate includes any one of glass, silicon, quartz and ceramic.

[0013] The step of forming a waveguide feeding structure embedded in the receiving groove comprises:

[0014] A first surface of the waveguide feeding structure is formed in the receiving groove, and a third surface and a fourth surface connected to the first surface and arranged opposite to each other; wherein the first surface is formed at the bottom of the receiving groove, the third surface is formed on the first side wall, and the second surface is formed on the second side wall;

[0015] Filling a sacrificial structure in the receiving grooves formed on the first surface, the third surface, and the fourth surface of the waveguide feeding structure;

[0016] On the first substrate formed with the sacrificial structure, a second surface of the waveguide feeding structure is formed by a patterning process, and the second surface is connected to the third surface and the fourth surface; wherein the second surface has an opening;

[0017] The sacrificial structure is released through the opening on the second surface to form the waveguide feeding structure.

[0018] Preferably, the waveguide feeding substrate comprises a second base located on the second surface of the waveguide feeding structure; the step of forming the waveguide feeding structure embedded in the receiving groove comprises:

[0019] A first surface of the waveguide feeding structure is formed in the receiving groove, and a third surface and a fourth surface connected to the first surface and arranged opposite to each other; wherein the first surface is formed at the bottom of the receiving groove, the third surface is formed on the first side wall, and the second surface is formed on the second side wall;

[0020] By a patterning process, forming a pattern including the second surface of the waveguide feeding structure on the second substrate;

[0021] The first substrate on which the first surface, the third surface and the fourth surface of the waveguide feeding structure are formed is bonded with the second substrate on which the second surface of the waveguide feeding structure is formed to form the waveguide feeding structure.

[0022] Preferably, the material of the second substrate includes any one of glass, silicon, quartz and ceramic.

[0023] The technical solution adopted to solve the technical problem of the present invention is an antenna system, which includes the above-mentioned waveguide feeding substrate and an antenna substrate bonded to the waveguide feeding substrate.

[0024] The technical solution adopted to solve the technical problem of the present invention is a method for preparing an antenna system, including the above-mentioned method of the waveguide feeding substrate, and the step of forming an antenna substrate on the waveguide feeding structure of the waveguide feeding substrate.

[0025] Preferably, the step of forming an antenna substrate on the waveguide feeding structure of the waveguide feeding substrate comprises:

[0026] The antenna substrate is fixed on the waveguide feeding structure of the waveguide feeding substrate through a bonding process.

[0027] The present invention has the following beneficial effects:

[0028] Since the waveguide feeding structure is arranged on the first substrate in the waveguide feeding substrate provided in the present invention, the first substrate and the antenna substrate can be fixed together through a bonding process. The process has high precision and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic structural diagram of a waveguide feeding substrate according to Embodiment 1 of the present invention;

[0030] Figure 2 is a flow chart of a method for preparing a waveguide feeding substrate according to embodiment 1 of the present invention;

[0031] Figure 3 is a process flow chart of a method for preparing a waveguide feeding substrate according to embodiment 1 of the present invention;

[0032] Figure 4 is a schematic structural diagram of an antenna system according to Embodiment 1 of the present invention;

[0033] Figure 5 is a process flow chart of a method for preparing an antenna system according to Embodiment 1 of the present invention;

[0034] Figure 6Schematic diagram of the structure of a waveguide feeding substrate according to Embodiment 2 of the present invention;

[0035] Figure 7 is a flow chart of a method for preparing a waveguide feeding substrate according to Embodiment 2 of the present invention;

[0036] Figure 8 is a process flow chart of a method for preparing a waveguide feeding substrate according to embodiment 2 of the present invention;

[0037] Fig. 9 is a schematic structural diagram of an antenna system according to Embodiment 2 of the present invention;

[0038] Fig.10 This is a process flow chart of a method for preparing an antenna system according to Embodiment 2 of the present invention.

[0039] The figures are marked as follows: 1. first substrate; 11. receiving groove; 2. waveguide feeding structure; 21. first surface; 22. second surface; 23. third surface, 24. fourth surface; 3. second substrate; 4. sacrificial structure; 5. antenna substrate. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0041] Unless otherwise defined, the technical terms or scientific terms used in this embodiment should be understood by a person with ordinary skills in the technical field to which the present invention belongs. The words "first", "second" and similar words used in this embodiment do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0043] Embodiment 1:

[0044] like Figure 1As shown, this embodiment provides a waveguide feeding substrate, including: a first substrate 1 and a waveguide feeding structure 2; wherein, a receiving groove 11 is provided on the first substrate 1; the receiving groove 11 has a base, and a first side wall and a second side wall connected to the bottom and arranged oppositely (that is, the receiving groove 11 is similar to a U-shaped groove); the waveguide feeding structure 2 is embedded in the receiving groove 11, and the waveguide feeding structure 2 is an internal hollow structure, which has a first surface 21 in contact with the bottom of the receiving groove, a second surface 22 arranged opposite to the first surface 21, and a third surface 23 and a fourth surface 24 connected between the first surface 21 and the second surface 22 and arranged oppositely; wherein the third surface 23 is arranged on the first side wall of the receiving groove 11, the fourth surface 24 is arranged on the second side wall, and an opening is arranged on the second surface 22 of the feeding structure; the opening can be used to feed the electromagnetic wave signal into the access port of the microstrip line of the phase shifter, so that the electromagnetic wave signal is transmitted along the axial direction of the microstrip line.

[0045] Among them, the waveguide feeding structure 2 is applied to the antenna substrate, and the antenna substrate is usually composed of a phase shifter and a metal patch arranged on the phase shifter; among them, taking the liquid crystal phase shifter as an example, it usually includes a first substrate and a second substrate, and a liquid crystal layer formed on the first substrate and the second substrate. The first substrate is usually composed of a base and a microstrip line on the surface of the base close to the liquid crystal layer. The second substrate is composed of another substrate (the material may be the same as the substrate in the first substrate), and periodically arranged patch electrodes arranged on the surface of the substrate close to the liquid crystal layer, and a metal patch is arranged on the surface of the substrate away from the patch electrode for radiating electromagnetic waves.

[0046] Since the waveguide feeding structure 2 is arranged on the first substrate 1 in the waveguide feeding substrate provided in the present embodiment, the first substrate 1 and the substrate with the microstrip line in the antenna substrate can be fixed together through a bonding process. The process has high precision and the structure of the antenna system formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0047] Since the microstrip line is usually formed on a glass substrate, the material of the first substrate 1 in this embodiment is selected to be a material that can be bonded to glass. Specifically, the material of the first substrate 1 includes: any one of glass, silicon, quartz, and ceramic.

[0048] The material of the waveguide feeding structure 2 in this embodiment includes metal. Specifically, the metal material may include copper, aluminum, invar and steel, but is not limited to the aforementioned materials, and different metal materials may be selected according to different application occasions and bands.

[0049] Accordingly, in this embodiment, with respect to the above-mentioned waveguide feeding substrate, Figure 2 and Figure 3As shown, this embodiment also provides a method for preparing the waveguide feeding substrate, which specifically includes the following steps:

[0050] Step 1: Take a first substrate 1 and etch a receiving groove 11 on the first substrate 1; wherein the receiving groove 11 includes a bottom, an opening opposite to the bottom, a first side wall connected to the bottom and oppositely arranged and connected to the bottom, and a second side wall.

[0051] Step 2: On the substrate after completing the above steps, three-sided metal growth is performed on the bottom of the receiving groove 11 and the two side walls to form the first surface 21, the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2. The first surface 21 is formed at the bottom of the receiving groove 11, the third surface 23 is formed on the first side wall of the receiving groove 11, and the fourth surface 24 is formed on the second side wall.

[0052] Among them, this step specifically includes: forming a metal material at the bottom of the accommodating groove 11, as well as the first side wall and the second side wall through an electroplating process to form a first surface 21, a third surface 23 and a fourth surface 24 of the waveguide feeding structure 2. At this time, the first surface 21, the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2 are integrally formed.

[0053] It should be noted here that the electroplating process refers to a method of applying a layer of metal to a conductor using the principle of electrolysis. Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis in a salt solution containing the pre-plated metal, with the base metal to be plated as the cathode, to form a coating.

[0054] Of course, the above steps are also limited to the electroplating process, as long as the process can form a metal layer on three sides of the bottom of the receiving groove 11 and the two side walls.

[0055] Step 3: forming a sacrificial structure 4 on the substrate after completing the above steps; wherein the sacrificial structure 4 is filled with the accommodating groove 11 formed with the first surface 21 , the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2 .

[0056] Among them, this step can specifically include: depositing a sacrificial layer on the substrate of the receiving groove 11 on which the first surface 21, the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2 are formed, removing the sacrificial layer material outside the receiving groove 11, and forming a sacrificial structure 4 that fills the receiving groove 11.

[0057] The material of the sacrificial layer may be silicon dioxide, polysilicon, polymer, etc.

[0058] Step 4: On the substrate after the above steps, a pattern including the second surface 22 of the waveguide feeding structure 2 is formed by a patterning process. The second surface 22 has an opening and is connected to the third surface 23 and the fourth surface 24.

[0059] This step specifically includes: using a sputtering or electroplating process to form a metal material layer on the substrate formed by the sacrificial structure, and then exposing, developing, and etching to form a pattern including the second surface 22 of the waveguide feeding structure 2. It should be noted that the formation of the metal material layer is not limited to sputtering and electroplating, and any other process capable of depositing a metal film layer can also be used.

[0060] Step 5: remove the sacrificial structure 4 through the opening of the waveguide feeding structure 2 to form a waveguide feeding structure.

[0061] The sacrificial structure 4 is released by a dry or wet etching process to form a waveguide feeding structure.

[0062] Accordingly, for the above-mentioned waveguide feeding structure 2, as Figure 4 As shown, this embodiment further provides an antenna system, which includes the above-mentioned waveguide feeding substrate. Of course, the antenna structure also includes an antenna substrate 5.

[0063] Since the antenna system in this embodiment includes the above-mentioned waveguide feeding substrate, the first substrate 1 of the waveguide feeding structure 2 and the substrate with a microstrip line in the antenna substrate 5 can be fixed together through a bonding process. This process has high precision, and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0064] Accordingly, for the above antenna system, Figure 5 As shown, this embodiment also provides a method for preparing the antenna system, wherein the waveguide feeding substrate in the antenna system can be prepared by the above method. The method for preparing the antenna system specifically includes:

[0065] The prepared antenna substrate 5 is fixed to the waveguide feeding substrate by bonding.

[0066] Among them, the antenna substrate 5 is taken as an example, which is composed of a phase shifter and a metal patch arranged on the phase shifter; among them, taking a liquid crystal phase shifter as an example, it usually includes a first substrate and a second substrate, and a liquid crystal layer formed on the first substrate and the second substrate. The first substrate is usually composed of a base and a microstrip line on the surface of the substrate close to the liquid crystal layer. The second substrate is composed of another substrate (the material may be the same as the substrate in the first substrate), and periodically arranged patch electrodes arranged on the surface of the substrate close to the liquid crystal layer, and a metal patch is arranged on the surface of the substrate away from the patch electrode to radiate electromagnetic waves.

[0067] In this way, during bonding, the waveguide feeding structure 2 of the waveguide feeding substrate faces the substrate with the microstrip line to fix the waveguide feeding substrate and the antenna substrate 5 together. This process has high precision and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0068] Embodiment 2:

[0069] like Figure 6 As shown, this embodiment provides a waveguide feeding substrate, which is substantially the same as the waveguide feeding substrate in the embodiment, except that a second substrate is provided on the second surface 22 of the waveguide feeding structure 2 .

[0070] When the waveguide feeding substrate and the antenna substrate in this embodiment are fixed together, the second substrate 3 of the waveguide feeding substrate and the substrate with the microstrip line in the antenna substrate can be fixed together through a bonding process. The process has high precision and the structure of the antenna system formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0071] The materials of the first substrate 1 and the waveguide feeding structure 2 in the waveguide feeding substrate of this embodiment can be the same as those in Embodiment 1. The material of the second substrate 3 can be the same as that of the first substrate 1, and a material that can be bonded to glass is selected. Specifically, the material of the second substrate 3 includes: any one of glass, silicon, quartz, and ceramic.

[0072] Accordingly, for the waveguide feeding substrate in this embodiment, combined with Figure 7 and 8 As shown, this embodiment also provides a method for preparing the waveguide feeding substrate, which specifically includes the following steps:

[0073] Step 1: Take a first substrate 1 and etch a receiving groove 11 on the first substrate 1; wherein the receiving groove 11 includes a bottom, an opening opposite to the bottom, a first side wall connected to the bottom and oppositely arranged and connected to the bottom, and a second side wall.

[0074] Step 2: On the substrate after completing the above steps, three-sided metal growth is performed on the bottom of the receiving groove 11 and the two side walls to form the first surface 21, the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2. The first surface 21 is formed at the bottom of the receiving groove 11, the third surface 23 is formed on the first side wall of the receiving groove 11, and the fourth surface 24 is formed on the second side wall.

[0075] This step specifically includes: forming metal material at the bottom of the receiving groove 11 and the first side wall and the second side wall through an electroplating process to form the first surface 21, the third surface 23 and the fourth surface 24 of the waveguide feeding structure 2.

[0076] It should be noted here that the electroplating process refers to a method of applying a layer of metal to a conductor using the principle of electrolysis. Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis in a salt solution containing the pre-plated metal, with the base metal to be plated as the cathode, to form a coating.

[0077] Of course, the above steps are also limited to the electroplating process, as long as the process can form a metal layer on three sides of the bottom of the receiving groove 11 and the two side walls.

[0078] Step 3: Take a second substrate 3, and form a pattern including the second surface 22 of the waveguide feeding structure 2 on the second substrate 3 by a patterning process; wherein the second surface 22 of the waveguide feeding structure 2 has an opening.

[0079] This step specifically includes: forming a metal material layer on the second substrate 3 by sputtering or electroplating, and then exposing, developing, and etching to form a pattern including the second surface 22 of the waveguide feeding structure 2. It should be noted that the formation of the metal material layer is not limited to sputtering and electroplating, and any other process capable of depositing a metal film layer can also be used.

[0080] Step 4: Fix the first substrate completed with the above steps and the second substrate completed with the above steps together to form a waveguide feeding substrate.

[0081] Specifically, this step may adopt a bonding process to fix the first substrate that has completed the above steps and the second substrate that has completed the above steps together to form a waveguide feeding substrate.

[0082] It should be noted that the above step 3 can be implemented before step 1. That is, the preparation of the second surface 22 of the waveguide feeding structure 2 on the second substrate can be completed first, and then the preparation of the first surface 21, the third surface 23, and the fourth surface 24 of the waveguide feeding structure 2 on the first substrate can be completed.

[0083] Accordingly, for the above-mentioned waveguide feeding structure 2, as Fig. 9 As shown, this embodiment further provides an antenna system, which includes the above-mentioned waveguide feeding substrate. Of course, the antenna structure also includes an antenna substrate 5.

[0084] Since the antenna system in this embodiment includes the above-mentioned waveguide feeding substrate, the second substrate 3 of the waveguide feeding structure 2 and the substrate with a microstrip line in the antenna substrate 5 can be fixed together through a bonding process. This process has high precision, and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0085] Accordingly, for the above antenna system, Fig.10 As shown, this embodiment also provides a method for preparing the antenna system, wherein the waveguide feeding substrate in the antenna system can be prepared by the above method. The method for preparing the antenna system specifically includes:

[0086] The prepared antenna substrate 5 is fixed to the waveguide feeding substrate by bonding.

[0087] Among them, the antenna substrate 5 is taken as an example, which is composed of a phase shifter and a metal patch arranged on the phase shifter; among them, taking a liquid crystal phase shifter as an example, it usually includes a first substrate and a second substrate, and a liquid crystal layer formed on the first substrate and the second substrate. The first substrate is usually composed of a base and a microstrip line on the surface of the substrate close to the liquid crystal layer. The second substrate is composed of another substrate (the material may be the same as the substrate in the first substrate), and periodically arranged patch electrodes arranged on the surface of the substrate close to the liquid crystal layer, and a metal patch is arranged on the surface of the substrate away from the patch electrode to radiate electromagnetic waves.

[0088] In this way, during bonding, the waveguide feeding structure 2 of the waveguide feeding substrate faces the substrate with the microstrip line to fix the second substrate 3 of the waveguide feeding substrate and the antenna substrate 5 together. This process has high precision, and the antenna system structure formed is stable, which can greatly reduce the loss and error of the antenna system caused by mechanical assembly.

[0089] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An antenna system, characterized in that: It includes an antenna substrate and a waveguide feeding substrate bonded to the antenna substrate; The antenna substrate includes a liquid crystal phase shifter and a metal patch arranged on the liquid crystal phase shifter; the liquid crystal phase shifter includes a first substrate, a second substrate, and a liquid crystal layer formed on the first substrate and the second substrate; the first substrate includes a third substrate and a microstrip line arranged on a surface of the third substrate close to the liquid crystal layer; the second substrate includes a fourth substrate and a periodically arranged patch electrode arranged on a surface of the fourth substrate close to the liquid crystal layer; The metal patch is arranged on a surface of the fourth substrate away from the patch electrode; The waveguide feeding substrate comprises: A first substrate having a receiving groove; the receiving groove comprises a bottom, and a first side wall and a second side wall connected to the bottom and arranged opposite to each other; A waveguide feeding structure, which is embedded in the accommodating groove, and the waveguide feeding structure is a hollow structure, which has a first surface arranged at the bottom of the accommodating groove, a second surface arranged opposite to the first surface, and a third surface and a fourth surface connected between the first surface and the second surface and arranged opposite to each other; wherein the third surface is arranged on the first side wall, and the fourth surface is arranged on the second side wall; an opening is arranged on the second surface, and the orthographic projection of the second surface at the bottom of the accommodating groove completely coincides with the orthographic projection of the first surface at the bottom of the accommodating groove.

2. The antenna system according to claim 1, characterized in that The material of the first substrate includes any one of glass, silicon, quartz and ceramic.

3. The antenna system according to claim 2, characterized in that: The material of the waveguide feeding structure includes metal.

4. The antenna system according to claim 1, characterized in that A second substrate is arranged on the second surface of the waveguide feeding structure.

5. The antenna system according to claim 4, characterized in that: The material of the second substrate includes any one of silicon, quartz and ceramic.

6. A method for preparing the antenna system according to any one of claims 1 to 5, characterized in that: The method comprises a method for preparing a waveguide feeding substrate, and a step of forming an antenna substrate on a waveguide feeding structure of the waveguide feeding substrate; The method for preparing a waveguide feeding substrate comprises: A first substrate is taken, and a receiving groove is formed by etching on the first substrate; wherein the receiving groove comprises: a bottom, and a first side wall and a second side wall connected to the bottom and arranged opposite to each other; A waveguide feeding structure is formed and embedded in the receiving groove; the waveguide feeding structure is a hollow structure, which has a first surface arranged at the bottom of the receiving groove, a second surface arranged opposite to the first surface; and a third surface and a fourth surface connected between the first surface and the second surface and arranged opposite to each other; wherein the third surface is formed on the first side wall, and the second surface is formed on the second side wall; an opening is arranged on the second surface.

7. The method for preparing the antenna system according to claim 6, characterized in that: The material of the first substrate includes any one of glass, silicon, quartz and ceramic.

8. The method for preparing the antenna system according to claim 6, characterized in that: The step of forming a waveguide feeding structure embedded in the receiving groove comprises: A first surface of the waveguide feeding structure is formed in the receiving groove, and a third surface and a fourth surface connected to the first surface and arranged opposite to each other; wherein the first surface is formed at the bottom of the receiving groove, the third surface is formed on the first side wall, and the second surface is formed on the second side wall; Filling a sacrificial structure in the receiving grooves formed on the first surface, the third surface, and the fourth surface of the waveguide feeding structure; On the first substrate formed with the sacrificial structure, a second surface of the waveguide feeding structure is formed by a patterning process, and the second surface is connected to the third surface and the fourth surface; wherein the second surface has an opening; The sacrificial structure is released through the opening on the second surface to form the waveguide feeding structure.

9. The method for preparing the antenna system according to claim 6, characterized in that: The waveguide feeding substrate includes a second substrate located on a second surface of the waveguide feeding structure; the step of forming the waveguide feeding structure embedded in the receiving groove includes: A first surface of the waveguide feeding structure is formed in the receiving groove, and a third surface and a fourth surface connected to the first surface and arranged opposite to each other; wherein the first surface is formed at the bottom of the receiving groove, the third surface is formed on the first side wall, and the second surface is formed on the second side wall; By a patterning process, forming a pattern including the second surface of the waveguide feeding structure on the second substrate; The first substrate on which the first surface, the third surface and the fourth surface of the waveguide feeding structure are formed is bonded with the second substrate on which the second surface of the waveguide feeding structure is formed to form the waveguide feeding structure.

10. The method for preparing the antenna system according to claim 9, characterized in that: The material of the second substrate includes any one of glass, silicon, quartz and ceramic.

11. The method for preparing the antenna system according to claim 6, characterized in that: The step of forming an antenna substrate on the waveguide feeding structure of the waveguide feeding substrate comprises: The antenna substrate is fixed on the waveguide feeding structure of the waveguide feeding substrate through a bonding process.

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