A mesh type ultrasonic atomizing sheet and its manufacturing process

Abstract

The present invention belongs to the field of ultrasonic atomization technology, and specifically relates to a mesh ultrasonic atomization sheet and a manufacturing process. The present invention discloses a mesh ultrasonic atomization sheet including an upper FPC material PCB board and a lower FPC material PCB board, wherein the upper FPC material PCB board includes a first PI film, a first copper foil and an upper PI film, and the lower FPC material PCB board includes a second PI film, a second copper foil and a lower PI film. An annular piezoelectric ceramic is connected between the first copper foil and the second copper foil, and the upper and lower surfaces of the annular piezoelectric ceramic are provided with lead-free solder paste, and the annular piezoelectric ceramic is welded to the first copper foil and the second copper foil through the lead-free solder paste, and the center position of the second PI film is provided with an arc transition surface, and the arc transition surface is provided with a micron-sized small hole, and the micron-sized small hole is a conical platform structure.

Description

Technical Field

[0001] The invention belongs to the technical field of ultrasonic atomization, and in particular relates to a mesh type ultrasonic atomization sheet and a manufacturing process. Background Art

[0002] At present, the mesh atomization drive technology in the market has become mature, and more industries have begun to introduce ultrasonic atomization technology. The introduction of ultrasonic atomization technology has solved some shortcomings in the original application, such as greatly reduced energy consumption, smaller fog particles, and good consistency of fog particles.

[0003] like Figure 1 As shown in the figure, the main structure of the traditional mesh ultrasonic atomizer is composed of an annular piezoelectric ceramic, a stainless steel sheet with a large number of micron-sized holes at the center of the circle, a wire welded on one electrode of the annular piezoelectric ceramic, and another wire welded on the stainless steel sheet; however, the traditional mesh ultrasonic atomizer has the following disadvantages:

[0004] 1. Since the deformation energy is transferred to the stainless steel sheet and the hardness of the stainless steel material is relatively high, the force required for the piezoelectric ceramic to deform is relatively high, and the piezoelectric ceramic needs to generate greater energy to pull the stainless steel sheet to deform;

[0005] 2. Since the carrier for transmitting deformation energy is a chemical adhesive, and the conductivity of the adhesive cannot be compared with that of metal materials, there is a certain resistance, resulting in current transmission loss;

[0006] 3. Since the micron-level mesh needs to be processed on the stainless steel sheet, the power requirement of the punching equipment is relatively high. The punching equipment needs sufficient energy to form a conical hole on the metal surface. Since the heat conduction speed of the metal is relatively fast, a lot of splashing metal residues will be generated due to uneven heat transfer during the punching process, and some metal residues will be attached to the inner wall of the hole in a semi-molten state. Therefore, the conical inner wall and edge of the mesh are very rough, which affects the efficiency of liquid passage. At the same time, when the atomizer is working, the repeated deformation of the metal is easy to form stress concentration points on the rough surface, causing the metal to break. Since a lot of metal residues are generated during the punching process, the metal sheet must be cleaned for a long time after punching, forming a large amount of wastewater containing heavy metal particles.

[0007] 4. The high temperature generated during the wire welding process can easily cause failure in some areas of the annular piezoelectric ceramics. The failure temperature of conventional piezoelectric ceramics is only 250°C, but the local temperature during the wire welding process can reach 380°C, which causes failure in some areas of the piezoelectric ceramics due to high temperature, resulting in poor overall consistency of the product.

[0008] 5. Since stainless steel sheets are not ideal welding materials, the weldability between their surface and solder is poor. Therefore, when welding wires on stainless steel sheets, it is necessary to use acidic chemicals to corrode the protruding parts of the stainless steel sheets in advance, so as to make the local surface rough and improve weldability. However, in fact, the welding process still leads to low welding strength due to the poor weldability of the material itself, which is easy to form poor contact, affect conductivity and fall off easily. In addition, acidic chemicals are more dangerous during use, and the pollutants formed are difficult to handle, and the process does not meet environmental protection requirements.

[0009] 6. In the actual production process of the product, the process flow is too long, the production complexity is relatively high, and some processes are difficult to achieve automated manufacturing.

[0010] In view of the above problems, the industry needs a mesh ultrasonic atomizer with simplified manufacturing process, environmentally friendly process and suitable for automated manufacturing. Summary of the invention

[0011] In view of the problems raised by the above background technology, the purpose of the present invention is to provide a mesh type ultrasonic atomization sheet and a manufacturing process.

[0012] In order to achieve the above technical objectives, the technical solution adopted by the present invention is as follows:

[0013] A mesh-type ultrasonic atomizer comprises an upper FPC material PCB board and a lower FPC material PCB board, the upper FPC material PCB board comprises a first PI film, a first copper foil and an upper PI film, the lower FPC material PCB board comprises a second PI film, a second copper foil and a lower PI film, an annular piezoelectric ceramic is connected between the first copper foil and the second copper foil, the upper and lower surfaces of the annular piezoelectric ceramic are provided with lead-free solder paste, the annular piezoelectric ceramic is welded to the first copper foil and the second copper foil through the lead-free solder paste, an arc-shaped transition surface is provided at the center of the second PI film, the arc-shaped transition surface is provided with a micron-sized small hole, and the micron-sized small hole is a conical table structure.

[0014] As a preferred solution of the present invention, the upper PI film layer and the lower PI film layer are pressed tightly together.

[0015] As a preferred solution of the present invention, the inner diameter of the second copper foil is smaller than the inner diameter of the annular piezoelectric ceramic, the second copper foil is connected to an annular PI film, the annular outer diameter of the annular PI film is smaller than the inner diameter of the annular piezoelectric ceramic and larger than the diameter of the arc transition surface.

[0016] As a preferred solution of the present invention, the diameter size of the upper part of the micron-sized pore is 2 μm to 8 μm, and the diameter size of the lower part is 50 μm to 60 μm.

[0017] A manufacturing process of a mesh type ultrasonic atomizer comprises the following steps:

[0018] S1: punching holes in the arc-shaped transition surface of the second PI film of the lower FPC material PCB board by laser drilling;

[0019] S2: Printing lead-free solder paste onto the upper and lower surfaces of the annular piezoelectric ceramic by screen printing or dispensing process;

[0020] S3: Preliminarily bonding the annular piezoelectric ceramic obtained in S2 to the upper FPC material PCB board and the lower FPC material PCB board;

[0021] S4: curing the annular piezoelectric ceramic, the upper FPC material PCB board and the lower FPC material PCB board through a reflow soldering device;

[0022] S5: Testing. If the test is qualified, the mesh type ultrasonic atomizer sheet is obtained.

[0023] Beneficial effects of the present invention:

[0024] 1. The materials of the mesh ultrasonic atomizer of the present invention and the traditional mesh ultrasonic atomizer, whether the main materials or the auxiliary materials, have good and mature manufacturing processes. However, the materials used in the present invention meet the environmental protection standards, while the traditional mesh ultrasonic atomizer uses chemical agents that do not meet the environmental protection process and also uses twice as much materials;

[0025] 2. The second PI film is a kind of polymer plastic material, so it has good plasticity. It can be easily shaped by heating and other methods, so the arc surface at the center of the circle can be easily formed, and the material only needs a small amount of energy when punching with a laser punching device. The material can be completely volatilized during the laser punching process, and the surface after punching is smooth. The liquid has little resistance when passing through the hole, and the misting efficiency is high;

[0026] 3. The second PI film can be completely volatilized during the punching process, so there is no need to clean it after the punching process. The edge of the hole is smooth, and the fatigue life of the material itself is better than that of metal. Therefore, the repeated deformation during the operation of the atomizer will not produce obvious stress concentration points, and it is not easy to have risks such as material breakage. The overall working life of the atomizer has been greatly improved;

[0027] 4. The second PI film itself has excellent chemical resistance and biocompatibility, which greatly expands the application of the atomizer sheet and is very safe in the medical field;

[0028] 5. The mesh-type ultrasonic atomizer sheet prepared by the present invention not only reduces the materials but also greatly reduces the production process, thereby reducing the manufacturing cost of the product and increasing the production capacity per unit time;

[0029] 6. The preparation process of the mesh ultrasonic atomizer sheet of the present invention uses robots to realize the automation of the production line in part of the process, so as to realize fully streamlined production of the production line. All processes can realize the same rhythm operation, and the production efficiency per unit time is greatly improved. The space requirement is extremely low, and the production capacity can be flexibly managed. When the production capacity is further increased, the space utilization rate is improved, and the site cost is reduced. The most important thing is that the mesh ultrasonic atomizer sheet of the present invention generates extremely low pollutants during the production process, and is a very environmentally friendly preparation process. The preparation process of the mesh ultrasonic atomizer sheet of the present invention has very few requirements for the type of equipment, and only laser drilling equipment and reflow soldering equipment are required, and the construction cost of the production line has been significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention can be further illustrated by the non-limiting examples given in the accompanying drawings;

[0031] Figure 1 It is a schematic diagram of the structure of a traditional mesh ultrasonic atomizer;

[0032] Figure 2 It is a structural schematic diagram of an embodiment of a mesh-type ultrasonic atomizer sheet of the present invention;

[0033] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of;

[0034] Figure 4 A schematic cross-sectional structure diagram of another embodiment of a mesh-type ultrasonic atomizer sheet of the present invention;

[0035] Figure 5 It is a schematic diagram of the structure of an enlarged arc-shaped transition surface in a mesh-type ultrasonic atomizer of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of a mesh-type ultrasonic atomizer prepared by using lead-free solder paste;

[0037] Figure 7 This is a schematic diagram of the structure of a mesh ultrasonic atomizer prepared by SMT glue; Figure 1 It is a structural schematic diagram of an embodiment of a mesh-type ultrasonic atomizer sheet of the present invention;

[0038] Figure 8 This is a schematic diagram of the process flow of a traditional mesh ultrasonic atomizer;

[0039] Fig. 9This is a schematic diagram of the process flow of a mesh-type ultrasonic atomizer sheet of the present invention;

[0040] The main component symbols are described as follows:

[0041] Upper FPC material PCB board 1, first PI film 11, first copper foil 12, upper PI film 13, lower FPC material PCB board 2, second PI film 21, second copper foil 22, lower PI film 23, arc transition surface 24, annular piezoelectric ceramic 3, lead-free solder paste 31, micron-sized small hole 4, annular PI film 5. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0043] like Figure 2 , Figure 3 , Figure 5 As shown, a mesh type ultrasonic atomizer includes an upper FPC material PCB board 1 and a lower FPC material PCB board 2, the upper FPC material PCB board 1 includes a first PI film 11, a first copper foil 12 and an upper PI film 13, the lower FPC material PCB board 2 includes a second PI film 21, a second copper foil 22 and a lower PI film 23, an annular piezoelectric ceramic 3 is connected between the first copper foil 12 and the second copper foil 22, the upper and lower surfaces of the annular piezoelectric ceramic 3 are provided with lead-free solder paste 31, the annular piezoelectric ceramic 3 is welded to the first copper foil 12 and the second copper foil 22 through the lead-free solder paste 31, an arc transition surface 24 is provided at the center of the second PI film 21, the arc transition surface 24 is provided with a micron-sized small hole 4, and the micron-sized small hole 4 is a conical table structure.

[0044] Among them, the upper PI film layer 13 and the lower PI film layer 23 are pressed tightly. The pressing and fitting of the upper PI film layer 13 and the lower PI film layer 23 helps to connect the upper FPC material PCB board 1 and the lower FPC material PCB board 2 together, thereby increasing the stability of the mesh ultrasonic atomization sheet and improving the service life. At the same time, the conductive planes of the upper FPC material PCB board 1 and the lower FPC material PCB board 2 are parallel, and have good AC signal coupling ability, so that the spatial radiation of the product is effectively reduced.

[0045] like Figure 4As shown, the inner diameter of the second copper foil 22 is smaller than the inner diameter of the annular piezoelectric ceramic 3, the second copper foil 22 is connected to an annular PI film 5, and the annular outer diameter of the annular PI film 5 is smaller than the inner diameter of the annular piezoelectric ceramic 3 and larger than the diameter of the arc transition surface 24. This design makes the circular area of ​​the second copper foil 22 larger, and in order to prevent corrosion problems on the enlarged part of the second copper foil 22, the annular PI film 5 is used to shield part of its redundant area; the benefit brought by this is that the deformation energy of the annular piezoelectric ceramic 3 can be transmitted more through the second copper foil 22.

[0046] The diameter of the upper part of the micron-sized pore 4 is 2 μm to 8 μm, and the diameter of the lower part is 50 μm to 60 μm. The aperture of the micron-sized pore 4 can directly affect the droplet particles of the water mist, and such a size can make the atomization effect better.

[0047] The working principle of the present invention is as follows:

[0048] An alternating voltage of a certain frequency is applied to the first copper foil 12 and the second copper foil 22. The frequency of the alternating voltage is assumed to be 108KHz. At this time, the voltage is transmitted to the two electrodes of the annular piezoelectric ceramic 3 through the first copper foil 12 and the second copper foil 22 and the welded lead-free solder paste 31. The annular piezoelectric ceramic 3 is controlled by the external electric field to produce a regular deformation consistent with the input frequency. The deformation energy is transmitted to the first copper foil 12 and the second copper foil 22 through the lead-free solder paste 31. The second copper foil 22 and the second PI film 21 are pressed together. Therefore, the deformation energy of the second copper foil 22 is concentrated on the second PI film 21. The center position of the second PI film 21 There is an arc-shaped transition surface 24, and the secondary processed micron-sized holes 4 are all in the area of ​​the arc-shaped transition surface 24. At this time, the arc-shaped transition surface 24 area produces a reciprocating motion consistent with the input frequency, and the motion direction is perpendicular to the surface of the mesh ultrasonic atomizer. At this time, the lower surface of the second PI film 21 contacts the liquid to be atomized, and the liquid is squeezed by the second PI film 21 and sprayed along the position of the hole; since the micron-sized holes 4 are conical table structures, the more the liquid moves toward the upper surface of the second PI film 21, the greater the squeezing force it is subjected to, and the easier it is for the liquid to pass through the micron-sized holes 4 on the second PI film 21, thereby forming water mist.

[0049] By analyzing the structural differences between the mesh type ultrasonic atomizer of the present invention and the conventional mesh type ultrasonic atomizer in terms of parts and materials, Table 1 is obtained:

[0050] Table 1: Comparison of materials used in the atomizer sheet of the present invention and the conventional atomizer sheet

[0051]

[0052] According to Table 1, it can be seen that the materials of the mesh ultrasonic atomizer sheet of the present invention and the traditional mesh ultrasonic atomizer sheet, whether main materials or auxiliary materials, have good and mature manufacturing processes; however, the materials used in the present invention all meet environmental protection standards, while the traditional mesh ultrasonic atomizer sheet uses chemical agents that do not meet environmental protection processes, and the traditional ultrasonic atomizer sheet has twice as many material types; the complexity of the material types makes the manufacturing process of the traditional mesh ultrasonic atomizer sheet more complicated.

[0053] like Fig. 9 As shown, a manufacturing process of a mesh type ultrasonic atomizer sheet includes the following steps:

[0054] S1: punching holes in the arc-shaped transition surface 24 of the second PI film 21 of the lower FPC material PCB board 2 by laser punching;

[0055] S2: Printing the lead-free solder paste 31 onto the upper and lower surfaces of the annular piezoelectric ceramic 7 by screen printing or dispensing process;

[0056] S3: Preliminarily bonding the annular piezoelectric ceramic 7 obtained in S2 to the upper FPC material PCB board 1 and the lower FPC material PCB board 2;

[0057] S4: curing the annular piezoelectric ceramic 7 with the upper FPC material PCB board 1 and the lower FPC material PCB board 2 through a reflow soldering device;

[0058] S5: Testing. If the test is qualified, the mesh type ultrasonic atomizer sheet is obtained.

[0059] Figure 8 This is a flow chart of the traditional mesh ultrasonic atomizer process. Figure 8 and Fig. 9 By comparing the two, we can see that the new mesh ultrasonic atomizer not only reduces the materials but also greatly reduces the production process, which reduces the manufacturing cost of the product and increases the production capacity per unit time. The specific differences are as follows:

[0060] The cleaning and baking process in the preparation of traditional mesh ultrasonic atomizers requires a certain amount of equipment to be accumulated on the production line and then manually transferred to the equipment, and then continuously operated in the equipment. This process creates a short board effect in the manufacturing process, resulting in a large amount of transfer storage required for the production line, and a large demand for labor;

[0061] The wire welding in the preparation process of traditional mesh ultrasonic atomizers relies heavily on skilled welding workers. Due to the poor weldability of stainless steel metal materials, the welding efficiency itself is low, and the high temperature generated during the welding process can easily damage the piezoelectric ceramics.

[0062] The traditional mesh ultrasonic atomizer preparation process requires a lot of transfer storage and the process is too complicated, resulting in a large demand for space. While increasing production capacity, the space utilization rate is seriously reduced;

[0063] Traditional mesh ultrasonic atomizers require a wide variety of production equipment, resulting in high production line construction costs and high equipment depreciation costs;

[0064] On the other hand, the mesh ultrasonic atomizer sheet preparation process of the present invention uses robots to realize the automation of the production line in some processes, so as to realize fully streamlined production of the production line. All processes can realize the same rhythm operation, and the production efficiency per unit time is greatly improved. The space requirement is extremely low, and the production capacity can be flexibly managed. When the production capacity is further increased, the space utilization rate is improved, and the site cost is reduced. The most important thing is that the new atomizer sheet generates extremely low pollutants during the production process, and it is a very environmentally friendly preparation process. The new atomizer sheet preparation process has very few requirements for the type of equipment, and only laser drilling equipment and reflow soldering equipment are required, and the construction cost of the production line has been significantly reduced.

[0065] By comparing the respective characteristics of the mesh ultrasonic atomizer sheet of the present invention and the conventional mesh ultrasonic atomizer sheet, a comparison table of the atomizer sheet of the present invention and the conventional atomizer sheet can be obtained, see Table 2;

[0066] Table 2: Comparison table of the atomizer sheet of the present invention and the conventional atomizer sheet

[0067]

[0068]

[0069]

[0070] From Table 2, it can be seen that the present invention brings about further innovation in the production process by innovating the materials and structural applications of the mesh ultrasonic atomizer, and finally obtains a new product with better performance than traditional products and a more environmentally friendly production process.

[0071] It should be noted that the working principle of annular piezoelectric ceramics is as follows: applying voltage to the electrodes on both sides of the annular piezoelectric ceramics can cause the annular piezoelectric ceramics to deform. At the same time, since the ceramic itself of the annular piezoelectric ceramics is a non-conductor, the reason for its deformation is the space charge field generated by the voltage on the electrodes; therefore, the characteristics of the annular piezoelectric ceramics can be understood as when the upper FPC material PCB board and the lower FPC material PCB board are attached to the two sides of the annular piezoelectric ceramics, even if there is no connection with the electrodes, applying voltage to the metal layer in the upper FPC material PCB board and the lower FPC material PCB board can also form a space charge field on the two sides of the annular piezoelectric ceramics to cause deformation. Based on the above principle, we can use a An annular piezoelectric ceramic without electrode coating, that is, there is no metal electrode coating on both sides of the annular piezoelectric ceramic, is placed between the upper FPC material PCB board and the lower FPC material PCB board, and is bonded with an insulating adhesive. The adhesive plays a role in transmitting deformation force and fixing the upper FPC material PCB board and the lower FPC material PCB board on both sides of the annular piezoelectric ceramic. At this time, applying voltage to the conductive metal layer can cause the annular piezoelectric ceramic to deform, and the deformation energy will be transferred to the lower FPC material PCB board by the adhesive to utilize its energy. In this application, the copper foil layer of the upper FPC material PCB board and the lower FPC material PCB board can be understood as the electrode of the piezoelectric ceramic for subsequent reading.

[0072] Based on the above principles and in order to simplify the process, the following optimization can be made: replace the lead-free solder paste with "SMT red glue 'hereinafter referred to as SMT glue'" adhesive, apply the SMT glue to both sides of the annular piezoelectric ceramic by using screen printing, or dispensing equipment, and then preliminarily bond the annular piezoelectric ceramic to the upper FPC material PCB board and the lower FPC material PCB board, and then place it in a reflow soldering device for further curing, and finally obtain a product that is completely consistent with the work of the present invention; it can be understood that its working principle is consistent with the previous introduction, only the adhesive material is replaced from lead-free solder paste to SMT glue, and the manufacturing process is completely unchanged; the advantage of the improved process is that it can further reduce the manufacturing cost of the product, and the operating temperature of the SMT glue material is also lower than that of the lead-free solder paste, which further reduces the impact of the annular piezoelectric ceramic in the welding process. At the same time, annular piezoelectric ceramics without coated electrodes can be used, which reduces the procurement cost of annular piezoelectric ceramics, and because the SMT glue is an insulating adhesive, there is no need to worry about the problem of electrode short circuit during the manufacturing process, and even if there is overflow of glue, it will not affect the product performance, thereby improving the fault tolerance of the production process;

[0073] like Figure 6 Figure 7 As shown, Figure 6 This is a schematic diagram of the structure of a mesh ultrasonic atomizer prepared by lead-free solder paste. Figure 7This is a schematic diagram of the structure of a mesh ultrasonic atomizer prepared by SMT glue. Figure 6 , Figure 7 Other layers of the product, such as the PI film layer, are hidden in the figure. In order to facilitate understanding of the improved position, annular piezoelectric ceramic electrode layers A3 and A5 are added, and their installation sequence is numbered. For details of each layer, please see Table 3:

[0074] Table 3: Comparison of atomized sheets made with lead-free solder paste and atomized sheets made with SMT glue

[0075]

[0076] It can be seen from Table 3 that by using SMT glue, the requirements for annular piezoelectric ceramics are reduced, and the annular piezoelectric ceramics are no longer required to have a conductive coating. At the same time, the SMT glue and the ceramic body of the annular piezoelectric ceramics are both insulating materials, which eliminates electrode short-circuit failures caused by glue overflow during welding; at the same time, it does not affect the working performance of the annular piezoelectric ceramics.

[0077] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A mesh type ultrasonic atomizer, characterized in that: The invention comprises an upper FPC material PCB board (1) and a lower FPC material PCB board (2), wherein the upper FPC material PCB board (1) comprises a first PI film (11), a first copper foil (12) and an upper PI film (13), and the lower FPC material PCB board (2) comprises a second PI film (21), a second copper foil (22) and a lower PI film (23), wherein the first copper foil (12) is located between the first PI film (11) and the upper PI film (13), and the second copper foil (22) is located between the second PI film (21) and the lower PI film (23); an annular piezoelectric ceramic (3) is connected between the first copper foil (12) and the second copper foil (22), and the upper and lower surfaces of the annular piezoelectric ceramic (3) are provided with a non-conductive material. Lead-tin paste (31), the annular piezoelectric ceramic (3) is welded with the first copper foil (12) and the second copper foil (22) through the lead-free solder paste (31), the center position of the second PI film (21) is provided with an arc transition surface (24), the arc transition surface (24) is provided with a micron-sized small hole (4), and the micron-sized small hole (4) is a conical platform structure; the upper PI film (13) and the lower PI film (23) are pressed tightly together; the inner diameter of the second copper foil (22) is smaller than the inner diameter of the annular piezoelectric ceramic (3), the second copper foil (22) is connected to an annular PI film (5), and the annular outer diameter of the annular PI film (5) is smaller than the inner diameter of the annular piezoelectric ceramic (3) and larger than the diameter of the arc transition surface (24).

2. The mesh-type ultrasonic atomizer sheet according to claim 1, characterized in that: The diameter size of the upper part of the micrometer-sized small hole (4) is 2 μm to 8 μm, and the diameter size of the lower part is 50 μm to 60 μm.

3. A process for manufacturing a mesh-type ultrasonic atomizer sheet according to any one of claims 1 to 2, characterized in that: The following steps are involved: S1: punching holes in the arc-shaped transition surface (24) of the second PI film (21) of the lower FPC material PCB board (2) by laser; S2: Printing the lead-free solder paste (31) onto the upper and lower surfaces of the annular piezoelectric ceramic (3) by screen printing or dispensing process; S3: Preliminarily bonding the annular piezoelectric ceramic (3) obtained in S2 to the upper FPC material PCB board (1) and the lower FPC material PCB board (2); S4: curing the annular piezoelectric ceramic (3) and the upper FPC material PCB board (1) and the lower FPC material PCB board (2) by reflow soldering equipment; S5: Testing. If the test is qualified, the mesh type ultrasonic atomizer sheet is obtained.

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