Light emitting device and light source module having the same

Abstract

The present invention provides a light-emitting device and a light source module having the same. The light-emitting device according to an embodiment includes: a body having a groove; a light-emitting chip disposed in the groove; and a first moisture-proof layer that seals the light-emitting chip and extends from a surface of the light-emitting chip to a bottom of the groove. The light-emitting chip has a wavelength ranging from 100 nm to 280 nm, and the first moisture-proof layer includes a fluororesin-based material.

Description

[0001] This application is a divisional application of patent application No. 201580041846.2 (PCT / KR2015 / 007423) filed on February 3, 2017, filed on July 17, 2015, and entitled “Light-emitting device and light source module having a light-emitting device”. Technical Field

[0002] The present invention relates to a light emitting device and a light source module comprising the light emitting device. Background Art

[0003] The light emitting diode may configure a light emitting source by using a compound semiconductor such as GaAs-based, AlGaAs-based, GaN-based, InGaN-based, and InGaAlP-based materials.

[0004] Such light emitting diodes are packaged and used as light emitting devices emitting various colors, and the light emitting devices are used as light sources in various fields of lighting indicators displaying colors, character indicators, and image indicators.

[0005] In particular, in the case of ultraviolet light-emitting diodes (UV LEDs), short wavelengths are used for disinfection and purification, and long wavelengths can be used in exposure equipment or curing equipment. However, the environment in which short-wavelength UV LEDs are used is extremely humid or underwater, so that moisture-proof and waterproof functions are degraded, thereby causing equipment malfunction and possibly degrading operational reliability. Summary of the Invention

[0006] Technical issues

[0007] The embodiment provides a light emitting device having a new waterproof and moisture-proof structure.

[0008] The embodiment provides a light emitting device having a moisture-proof layer covering a surface of a light emitting chip.

[0009] The embodiment provides a light emitting device having a moisture-proof layer covering a surface of a body in which a light emitting chip is arranged.

[0010] The embodiment provides a light emitting device including a moisture-proof layer extending from a light-transmitting layer disposed on a light emitting chip to a surface of a body.

[0011] The embodiment provides a light emitting device having a plurality of moisture-proof layers covering a surface of a body and a surface of a light emitting chip.

[0012] The embodiment provides a light emitting device having a body and a moisture-proof layer covering a surface of a substrate.

[0013] The embodiment provides a light emitting device and a light source module having a moisture-proof layer including an ultraviolet light emitting chip and fluorine.

[0014] The embodiment provides a light emitting device and a light source module having a moisture-proof layer that protects an ultraviolet light emitting chip and protects devices from water or moisture.

[0015] The embodiments may improve the reliability of an ultraviolet light source module.

[0016] Technical Solution

[0017] According to an embodiment, there is provided a light emitting device including: a main body having a groove; a light emitting chip arranged in the groove; and a first moisture-proof layer sealing the light emitting chip and extending from a surface of the light emitting chip to a bottom of the groove; and the light emitting chip including a wavelength range of 100 nm to 280 nm, and the first moisture-proof layer including a fluororesin-based material.

[0018] According to an embodiment, a light emitting device is provided, including: a main body including a groove; a light emitting chip arranged in the groove; a light-transmitting layer arranged in the groove; and a first moisture-proof layer extending from an upper surface of the light-transmitting layer to an upper surface of the main body; and the light emitting chip including a wavelength range of 100 nm to 280 nm, and the first moisture-proof layer including a fluororesin-based material.

[0019] According to an embodiment, a light source module is provided, including: a light emitting device having a first moisture-proof layer on a surface of a body; and a circuit board arranged below the body of the light emitting device, and the first moisture-proof layer of the light emitting device is extended to the side surface of the body and the upper surface of the circuit board.

[0020] Beneficial effects

[0021] Embodiments may be provided as a moisture-proof module within products applied to high humidity and underwater environments.

[0022] Embodiments may be provided as sterilization devices in high humidity environments and underwater.

[0023] Embodiments may reduce transmission losses of UV-C wavelengths.

[0024] Embodiments may minimize discoloration and degradation by UV-C. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view of a light emitting device according to a first embodiment;

[0026] Figure 2 It is removed Figure 1 Perspective view of the translucent layer in

[0027] Figure 3 The light-transmitting layer is removed Figure 1 A plan view of a light emitting device;

[0028] Figure 4 yes Figure 1 a rear view of the light emitting device;

[0029] Figure 5 yes Figure 1 AA side cross-sectional view of the light emitting device;

[0030] Figure 6 yes Figure 3 BB side cross-sectional view of the light emitting device;

[0031] Figure 7 is a side sectional view of a light emitting device according to a second embodiment;

[0032] Figure 8 is a side sectional view of a light emitting device according to a third embodiment;

[0033] Figure 9 is a side sectional view of a light emitting device according to a fourth embodiment;

[0034] Figure 10 is a side sectional view of a light emitting device according to a fifth embodiment;

[0035] Figure 11 is a side sectional view of a light emitting device according to a sixth embodiment;

[0036] Figure 12 is a side sectional view of a light emitting device according to a seventh embodiment;

[0037] Figure 13 is a side sectional view of a light emitting device according to an eighth embodiment;

[0038] Figure 14 is a side sectional view of a light emitting device according to a ninth embodiment;

[0039] Figure 15 is a side sectional view of a light source module according to a tenth embodiment;

[0040] Figure 16 is a side sectional view of a light source module according to an eleventh embodiment;

[0041] Figure 17 is a side sectional view of a light source module according to a twelfth embodiment;

[0042] Figure 18 is a side sectional view of a light source module according to a thirteenth embodiment;

[0043] Figure 19is a graph comparing transmittance according to the number of immersions of the moisture-proof layer according to an embodiment;

[0044] Figure 20 is a graph comparing transmittances according to materials of a moisture barrier layer according to an embodiment; and

[0045] Figure 21 is a graph illustrating moisture resistance depending on the material of the moisture-proof layer according to an embodiment. DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily perform them. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein.

[0047] Throughout the specification, when a component is referred to as "comprising" an element, it means that the component may also include other elements without excluding other elements, unless otherwise expressly stated. In order to clearly illustrate the present invention in the drawings, components not related to the description are omitted, and like reference numerals are added with respect to like components throughout the specification.

[0048] In the description of the embodiments, when a component such as a layer, film, region, and plate is “on” another component, this includes not only a case where the component is “directly on” another component but also a case where another component exists therebetween. Conversely, when a component is “directly on” another component, it means that no other component exists therebetween.

[0049] In the following, reference will be made to the Figures 1 to 6 A light emitting device according to a first embodiment of the present invention is described.

[0050] Figure 1 is a perspective view of a light emitting device according to a first embodiment, Figure 2 It is removed Figure 1 Perspective view of the translucent layer, Figure 3 The light-transmitting layer is removed Figure 1 A plan view of a light emitting device, Figure 4 yes Figure 1 The rear view of the light emitting device, Figure 5 yes Figure 1 AA side cross-sectional view of the light emitting device and Figure 6 yes Figure 3 BB side cross-sectional view of the light-emitting device.

[0051] refer to Figures 1 to 6The light emitting device 100 includes a body 110 having a groove 111; a plurality of electrodes 121, 123, and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123, and 125; a light-transmitting layer 161 arranged on the groove 111; and a fluororesin-based moisture-proof layer 171 covering the surface of the light emitting chip 131. The light emitting chip 131 can emit UV-C wavelengths, which are ultraviolet wavelengths ranging from 100 nm to 280 nm. The wavelength of the light emitting chip 131 is not limited thereto, and the light emitting chip 131 can emit at least one wavelength of visible light or infrared light.

[0052] The body 110 includes an insulating material such as a ceramic material. The ceramic material includes low-temperature co-fired ceramics (LTCC) or high-temperature co-fired ceramics (HTCC) that are co-fired. The material of the body 110 may be AlN, and may be formed of a metal nitride having a thermal conductivity of 140 W / mK or higher.

[0053] As in Figures 5 and 6 As shown in , a connection pattern 117 may be disposed in the body 110 , and the connection pattern 117 may provide an electrical connection path between the groove 111 and the lower surface of the body 110 .

[0054] The upper periphery of the body 110 includes a stepped structure 115. The stepped structure 115 is arranged at the upper periphery of the groove 111 as an area lower than the upper surface of the body 110. The depth of the stepped structure 115 is the depth from the upper surface of the body 110 and can be formed to be deeper than the thickness of the light-transmitting layer 161, but is not limited thereto.

[0055] The groove 111 is a region where a portion of the upper portion of the body 110 is opened, and may be formed at a predetermined depth from the upper surface of the body 110. For example, the groove 111 may be formed at a depth smaller than that of the step structure 115 of the body 110. Here, the direction in which the groove 111 is formed may be a direction in which light generated from the light emitting chip 131 is emitted.

[0056] The groove 111 may have a polygonal, circular, or elliptical shape. The groove 111 may have a chamfered shape, for example, a curved shape. Here, the groove 111 may be located further inside the stepped structure 115 of the body 110 .

[0057] The width of the lower portion of the groove 111 may be the same as that of the upper portion of the groove 111, or the width of the upper portion may be formed larger. In addition, the sidewall 116 of the groove 111 may be formed to be perpendicular to the extension line of the bottom surface of the groove 111 or be inclined.

[0058] As in Figures 2 to 3 As shown in FIG, a plurality of sub-grooves 112 and 113 may be arranged in the groove 111. The bottom surface of each of the sub-grooves 112 and 113 may be arranged at a lower depth than the bottom surface of the groove 111. The space between the plurality of sub-grooves 112 and 113 may be greater than the width of the light-emitting chip 131. The protective device 133 may be arranged on at least one of the plurality of sub-grooves 112 and 113. The depth of each of the sub-grooves 112 and 113 may be equal to or deeper than the thickness of the protective device 133. The depth of each of the sub-grooves 112 and 113 may be formed to a depth such that the upper surface of the protective device 133 does not protrude above the bottom surface of the groove 111. When the protective device 133 is arranged on at least one of the sub-grooves 112 and 113, the protective device 133 does not protrude above the bottom surface of the groove 111, and the absorption of light emitted from the light-emitting chip 131 can be reduced, the deterioration of light extraction efficiency can be prevented, and the directivity angle of the light can be prevented from being distorted.

[0059] Based on the light emitting chip 131, a plurality of sub-grooves 112 and 113 are arranged on opposite sides. Therefore, the heat generated from the light emitting chip 131 can be evenly distributed in the groove 111, and thus the thermal resistance of the light emitting device can be improved. As another example, the protective device 133 can be arranged in the first sub-groove 112 among the plurality of sub-grooves 112 and 113, and the other second sub-groove 113 can be used as a dummy. The protective device 133 includes a Zener diode. The protective device 133 is connected to the light emitting chip 131 in parallel and electrically protects the light emitting chip 131. The first and second sub-grooves 112 and 113 may not be formed, and in such a case, the protective device 133 may be removed or may be arranged at the bottom of the groove 111.

[0060] Electrodes 121, 123, 125, 127, and 129 are arranged in the groove 111 and the sub-grooves 112 and 113, and the electrodes 121, 123, 125, 127, and 129 selectively supply power to the light emitting chip 131 and the protective device 133. The electrodes 121, 123, 125, 127, and 129 may optionally include metals such as platinum (Pt), titanium (Ti), copper (Cu), nickel (Ni), gold (Au), tantalum (Ta), and aluminum (Al). At least one of the electrodes 121, 123, 125, 127, and 129 may be formed as a single layer or multiple layers. Here, in the multi-layer electrode, a gold (Au) material having good bonding may be arranged on the top layer, and a titanium (Ti), chromium (Cr), or tantalum (Ta) material having good adhesion to the body 110 may be arranged on the bottom layer, and platinum (Pt), nickel (Ni), copper (Cu), etc. may be arranged in an intermediate layer between the top layer and the bottom layer. The present invention is not limited to such a laminated structure of the electrode.

[0061] Specifically describing the electrodes 121, 123, 125, 127, and 129, a first electrode 121 on which the light emitting chip 131 is arranged, a second electrode 123 and a third electrode 125 separated from the first electrode 121, and a fourth and fifth electrodes 127 and 129 arranged in the sub-grooves 112 and 113, respectively, are included. The first electrode 121 is arranged at the center of the bottom of the groove 111, and the second electrode 123 and the third electrode 125 may be arranged at both sides of the first electrode 121. Any one of the first electrode 121 and the second electrode 123 may be removed, but the present invention is not limited thereto. As another example, the light emitting chip 131 may be arranged on a plurality of electrodes of the first to third electrodes 121, 123, and 125, but the present invention is not limited thereto.

[0062] One of the fourth and fifth electrodes 127 and 129 , for example, the fourth electrode 127 , may be electrically connected to the protection device 133 .

[0063] Power of the first polarity may be supplied to the second and third electrodes 123 and 125, and power of the second polarity may be supplied to the first, fourth, and fifth electrodes 121, 127, and 129. The polarity of each of the electrodes 121, 123, 125, 127, and 129 may vary depending on an electrode pattern or a connection method with each device, and is not limited thereto.

[0064] Here, the first electrode 121 may be used as a non-polar layer or a heat dissipation plate when it is not electrically connected to the light emitting chip 131. Each of the electrodes 121, 123, 125, 127, and 129 may be defined as a metal layer, but is not limited thereto.

[0065] A portion 121A of the first electrode 121 may extend to the body 110 and may be electrically connected to another electrode through a connection pattern 117. The first to fifth electrodes 121, 123, 125, 127, and 129 may be selectively connected to the connection pattern 117 inside the body 110. For example, the connection pattern 117 connects the first electrode 121, the fourth and fifth electrodes 127 and 129, and the first pad 141 to each other, and may connect the second and third electrodes 123 and 125 to the second pad 145 to each other, but the present invention is not limited thereto.

[0066] As in Figures 4 to 6 As shown in FIG, a plurality of pads 141 and 145 are arranged on the lower surface of the body 110. The plurality of pads 141 and 145 include a first pad 141 and a second pad 145, and the first and second pads 141 and 145 may be separated from each other on the lower surface of the body 110. At least one of the first and second pads 141 and 145 may be arranged in plural, and the current path may be dispersed, but is not limited thereto.

[0067] A radiation member (not shown) may be disposed in the body 110. The radiation member may be disposed under the light emitting chip 131, that is, under the first electrode 121, and may dissipate heat generated from the light emitting chip 131. A material of the radiation member may be metal, for example, alloy.

[0068] The light emitting chip 131 may be arranged in the groove 111. The light emitting chip 131 is a UV LED and may be a UV LED that emits a wavelength in the range of 100 nm to 280 nm. That is, the light emitting chip 131 may emit short-wavelength ultraviolet light of 280 nm or less. The ultraviolet wavelength has the effect of reducing various biological contaminations such as bacteria and viruses.

[0069] The light emitting chip 131 may be bonded to the first electrode 121 via a conductive adhesive and may be connected to the second electrode 123 via a first connecting member 135. The light emitting chip 131 may be electrically connected to the first electrode 121, the second electrode 123, or the third electrode 125. Wire bonding, die bonding, and flip-chip bonding may be used to selectively connect the light emitting chip 131, and such bonding methods may vary depending on the electrode position and chip type of the chip. The protective device 133 may be bonded to the fourth electrode 127 and may be connected to the third electrode 125 via a second connecting member 137, and may be electrically connected to both the third electrode 125 and the fourth electrode 127. The first and second connecting members 135 and 137 may include, for example, wires.

[0070] The light emitting chip 131 may be formed of a compound semiconductor of Group II and VI elements, or a compound semiconductor of Group III and V elements. The light emitting chip 131 may selectively include a semiconductor light emitting device manufactured using a compound semiconductor such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs. The light emitting chip 131 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer. The active layer may be implemented as a pair such as InGaN / GaN, InGaN / AlGaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / InAlGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, and InP / GaAs.

[0071] The moisture-proof layer 171 is formed on the groove 111 and may have a thickness covering the upper surface of the light emitting chip 131. For example, the moisture-proof layer 171 is formed thicker than the light emitting chip 131 to protect the light emitting chip 131 from water or moisture.

[0072] The moisture-proof layer 171 may include fluorine. Fluorine has a strong chemical bond with carbon and does not cause molecular bond breakage due to ultraviolet light. The moisture-proof layer 171 can be defined as a fluororesin base layer, and the molecular chain of the moisture-proof layer 171 is a helical structure, and the molecular chain structure has a three-dimensional helical structure, so that fluorine ions are sealed around the carbon-carbon bond. The moisture-proof layer 171 protects the molecular chain from being destroyed by the penetration of ultraviolet light or oxygen. In addition, the moisture-proof layer 171 can protect the device by blocking oxygen or moisture such as water or oil from penetrating to the surface of the device as much as possible. The moisture-proof layer 171 transmits light emitted from the light-emitting chip 131, which is a translucent material.

[0073] In addition, the moisture-proof layer 171 may be used together with at least one of PCTFE (polychlorotrifluoroethylene), ETFE (ethylene tetrafluoroethylene), FEP (fluorinated ethylene propylene copolymer), and PFA (perfluoroalkoxy). Figure 19 In the transmittance curve, in the ultraviolet range, and according to Figure 20 and Figure 21 The moisture-proof material has a high transmittance in the order of PCTFE, ETFE, FEP, and PFA in terms of moisture absorption ratio at ultraviolet wavelengths, with PFA shown in this order. Therefore, at least one of PCTFE, FEP, and PFA can be used as a moisture-proof layer.

[0074] The moisture-proof layer 171 is attached to the surface of the light emitting chip 131 and may be extended to the bottom surface of the groove 111. The moisture-proof layer 171 may extend from the bottom of the groove 111 to the sidewall 116. The moisture-proof layer 171 is sealed to the top and side surfaces of the light emitting chip 131 and the sidewall 116 of the groove 111 to protect the light emitting chip 131 from water or moisture.

[0075] The moisture-proof layer 171 prevents water from penetrating into an interface between the light emitting chip 131 and the bottom surface of the groove 111 .

[0076] In addition, the moisture-proof layer 171 seals the plurality of electrodes 121, 123, 125, 127 and the protective device 133. This moisture-proof layer 171 can prevent water from penetrating into the protective device 133. Since the moisture-proof layer 171 is effective for moisture-proofing in the groove 111, a water-resistant light emitting device can be provided.

[0077] By using the moisture-proof layer 171 having the fluorine resin material, there is no damage such as breaking of bonds between molecules due to the wavelength of ultraviolet light emitted from the light emitting chip 131 , and a reduction in light extraction efficiency can be minimized.

[0078] refer to Figure 5 The thickness of the moisture-proof layer 171 may be equal to or less than 1 mm, and may cover at least the light-emitting chip 131. When the thickness is greater than 1 mm, the transmittance of ultraviolet light may be reduced. The thickness T1 from the upper surface of the light-emitting chip 131 may be formed, for example, in the range of 0.5 μm to 10 μm. When the thickness T1 of the moisture-proof layer 171 exceeds the above range, the light transmittance is significantly reduced, and when it is less than the above range, the moisture resistance may be reduced.

[0079] The moisture-proof layer 171 according to the embodiment may have a transmittance of 70% to 95% with respect to the wavelength emitted from the light-emitting chip 131. When the transmittance is less than 70%, optical reliability may be degraded due to reduced functionality. The moisture-proof layer 171 may transmit light without damaging the light emitted from the light-emitting chip 131.

[0080] In one example of a coating method for the moisture-proof layer 171, a fluororesin-based moisture-proof layer in which liquid fluorine is melted in a resin solvent is coated. Table 1 is a table for measuring transmittance according to the fluorine content. The content of fluorine dissolved in the resin solvent was tested after dissolving and coating in the range of 1 to 3 wt%. As shown below, when the fluorine content was 1 wt%, the average transmittance after curing was 94.5%, and in the case of 2 wt%, the average transmittance after curing was 90.4%, and in the case of 3 wt%, the average transmittance after curing was 82.9%.

[0081] [Table 1]

[0082]

[0083] It can be seen that the transmittance is reduced as the fluorine content is increased. The fluorine content in the moisture-proof layer 171 according to the embodiment may be small after curing, but is not limited thereto.

[0084] In addition, the transmittance can be changed according to the number of layers to be coated, that is, the number of dippings. For example, as the number of dippings increases, the transmittance can be reduced. When the transmittance is 100% in the case where the moisture-proof layer 171 is not formed on the light-emitting chip 131, the transmittance after dipping once is 90.60%, the transmittance after dipping four times is 75.86%, and the transmittance after dipping five times is 72.13%. In addition, it can be seen that as the number of dippings increases, the thickness is increased and the transmittance is reduced. The embodiment can provide a structure for impermeability and moisture resistance in which the moisture-proof layer 171 has a thickness of 10 μm or less from the top surface of the light-emitting chip 131.

[0085] As shown in the table Figure 1 、 Figure 5 as well as Figure 6 As shown in FIG, the light-transmitting layer 161 is arranged in the groove 111. The light-transmitting layer 161 includes a glass material such as quartz glass. Therefore, the light-transmitting layer 161 can be defined as a material that can transmit the light emitted from the light-emitting chip 131 without loss such as breaking of bonds between molecules due to the wavelength of ultraviolet light.

[0086] The outer periphery of the light-transmitting layer 161 is coupled to the stepped structure 115 of the main body 110. An adhesive layer 163 is disposed between the light-transmitting layer 161 and the stepped structure 115 of the main body 110, and the adhesive layer 163 includes a resin material such as silicon or epoxy. The light-transmitting layer 161 may have a width wider than the width of the groove 111. The lower surface area of ​​the light-transmitting layer 161 may be larger than the bottom surface area of ​​the groove 111. Therefore, the light-transmitting layer 161 can be easily coupled to the stepped structure 115 of the main body 110.

[0087] The light-transmitting layer 161 may be separated from the light-emitting chip 131. Since the light-transmitting layer 161 is separated from the light-emitting chip 131, thermal expansion caused by the light-emitting chip 131 can be reduced. The area between the light-transmitting layer 161 and the moisture-proof layer 171 may be a blank space or may be filled with non-metallic or metallic chemical elements, but the present invention is not limited thereto. A lens may be coupled to the light-transmitting layer 161, but the present invention is not limited thereto. Furthermore, a molding member is further arranged on the side surface of the body 110 to provide moisture protection and device protection.

[0088] Figure 7 is a side sectional view of a light emitting device according to a second embodiment.

[0089] refer to Figure 7 According to the embodiment, the light emitting device includes a main body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123, 125; a light-transmitting layer 161 arranged on the groove 111; and a fluororesin-based moisture-proof layer 172 arranged between the light-transmitting layer 161 and the upper surface of the main body 110.

[0090] The light emitting chip 131 may emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-transmitting layer 161 may be formed of a transparent material such as glass, which is protected from damage caused by ultraviolet light wavelengths. The moisture-proof layer 172 extends from the upper surface of the light-transmitting layer 161 to the upper surface of the body 110. The moisture-proof layer 172 has a fluororesin-based material and can transmit light without breaking the bonds between molecules by the light emitted from the light emitting chip 131.

[0091] The moisture-proof layer 172 covers the upper surfaces of the body 110 and the transmissive layer 161 to block water or moisture from penetrating the upper surface of the body 110. The moisture-proof layer 172 may contact the adhesive layer 163 bonded to the transmissive layer 161 and the stepped structure 115 of the body 110.

[0092] The moisture-proof layer 172 can be formed to have a thickness ranging from 0.5 μm to 10 μm. The thickness may vary depending on the number of impregnations of the moisture-proof layer 172, but it can be a thickness range in which the transmittance is 70% or more. When the thickness of the moisture-proof layer 172 exceeds the above-mentioned range, the transmittance is significantly reduced, and when the thickness is less than the above-mentioned range, the moisture resistance is deteriorated. The moisture-proof layer 172 can be extended from the upper surface of the main body 110 to a portion of the side surface of the main body 110, but the present invention is not limited thereto. By further extending the moisture-proof layer 172 to a portion of the side surface of the main body 110, the water or moisture blocking effect can be further enhanced.

[0093] The lens may be coupled to the moisture-proof layer 172, but the present invention is not limited thereto. In addition, a molding member may be further disposed on the side surface of the body 110 to perform moisture-proofing and device protection.

[0094] Figure 8 is a side sectional view of a light emitting device according to a third embodiment.

[0095] refer to Figure 8According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a light-transmitting layer 161 arranged in the groove 111; and a fluororesin-based moisture-proof layer 174 arranged on an upper surface of the light-transmitting layer 161 and an upper side surface of the body 110.

[0096] The light emitting chip 131 may emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-transmitting layer 161 may be formed of a glass material that does not suffer damage due to ultraviolet light wavelengths, such as damage to bonds between molecules. The moisture-proof layer 174 extends from the upper surface of the light-transmitting layer 161 to the upper surface of the body 110. The moisture-proof layer 174 includes a fluororesin-based material and can transmit light without being damaged by the light emitted from the light emitting chip 131.

[0097] To prevent moisture, a moisture-proof layer 174 can extend from the upper surface of the transmissive layer 161 to the upper and side surfaces of the main body 110. The moisture-proof layer 174 is arranged over the entire upper surface area of ​​the transmissive layer 161, the entire upper surface area of ​​the main body 110, and the entire side surface area of ​​the main body 110, and can prevent water or moisture from penetrating through the main body 110 or other components. When the thickness of the moisture-proof layer 174 exceeds the above-mentioned range, which can be in the range of 0.5 μm to 10 μm, the light transmittance is significantly reduced, and when the thickness is less than the above range, the moisture resistance is degraded. The moisture-proof layer 174 can extend over the lower surface of the main body 110, and in this case, it can be formed on the area other than the first and second pads 141 and 145. Therefore, it can prevent water or moisture from penetrating the lower surface of the main body 110.

[0098] The lens may be coupled to the moisture-proof layer 174, but the present invention is not limited thereto. In addition, a molding member may be further disposed on an outer portion of the moisture-proof layer 174, and it may perform moisture-proofing and device protection.

[0099] Figure 9 is a side sectional view of a light emitting device according to a fourth embodiment.

[0100] refer to Figure 9According to the embodiment, the light emitting device includes: a main body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a first moisture-proof layer 171A sealing the light emitting chip 131 on the groove 111; a light-transmitting layer 161 arranged in the groove 111; and a second moisture-proof layer 174A arranged on the upper surface of the light-transmitting layer 161 and the upper side surface of the main body 110.

[0101] The light emitting chip 131 may emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-transmitting layer 161 may be formed of a glass material that is not damaged by ultraviolet light wavelengths. The first and second moisture-proof layers 171A and 174A may have a fluorine resin-based material and may transmit light without being damaged by the light emitted from the light emitting chip 131.

[0102] The first moisture-proof layer 171A may be adhered and extended from the surface of the light-emitting chip 131 in the groove 111 to the top of the groove 111. The first moisture-proof layer 171A prevents water or moisture from penetrating into the light-emitting chip 131 in the groove 111. The first moisture-proof layer 171A may extend to and contact the sidewalls of the groove 111, but is not limited thereto. The distance between the upper surface of the first moisture-proof layer 171A and the upper surface of the light-emitting chip 131 may be equal to or less than 10 μm, and the distance between the bottom of the groove 111 and the upper surface of the first moisture-proof layer 171A may be equal to or less than 1 mm. If the first moisture-proof layer 171A exceeds 10 μm from the upper surface of the light-emitting chip 131, the light transmittance or moisture resistance may be significantly reduced. If the distance between the bottom of the groove 111 and the upper surface of the first moisture-proof layer 171A is greater than 1 mm, the light transmittance may be significantly reduced.

[0103] The second moisture-proof layer 174A may extend from the upper surface of the light-transmitting layer 161 to the upper surface of the main body 110, or may extend from the upper surface of the light-transmitting layer 161 to the upper and side surfaces of the main body 110. In addition, the second moisture-proof layer 174A may extend to the lower surface of the main body 110 and may block water or moisture from penetrating through the lower surface of the main body 110. The second moisture-proof layer 174A may prevent water or moisture from penetrating through the surface of the main body 110. The second moisture-proof layer 174A may have a thickness of 10 μm or less, and when the thickness is greater than 10 μm, light transmittance and moisture-proofness may be reduced.

[0104] The material of the first and second moisture-proof layers 171A and 174A can be used together with at least one of PCTFE (polychlorotrifluoroethylene), ETFE (ethylene tetrafluoroethylene), FEP (fluorinated ethylene propylene copolymer), and PFA (perfluoroalkoxy). The first and second moisture-proof layers 171A and 174A can include the same material or different materials. For example, the first and second moisture-proof layers 171A and 174A can be formed of PCTFE, or the first moisture-proof layer 171A can be formed of PCTFE, and the second moisture-proof layer 174A can be formed of ETFE, a material different from that of the first moisture-proof layer. Alternatively, the first moisture-proof layer 171A can be formed of a material having a higher water or moisture barrier rate (hereinafter abbreviated as moisture barrier) than the second moisture-proof layer 174A, and can protect the light-emitting chip 131. Conversely, the second moisture-proof layer 174A is formed of a material having a higher moisture barrier rate than the first moisture-proof layer 171A, so that the moisture barrier rate can be increased mainly on the surface of the light-emitting device. The first moisture-proof layer 171A may be formed of a material having higher transmittance than the second moisture-proof layer 174A, and a decrease in transmittance may be reduced. The embodiment may be effective for moisture-proofing by performing double moisture-proofing using the first and second moisture-proof layers 171A and 174A.

[0105] The lens may be coupled to the second moisture-proof layer 174, but the present invention is not limited thereto. In addition, a molding member may be further disposed on the outer portion of the second moisture-proof layer 174, and may perform moisture-proofing and device protection.

[0106] Figure 10 is a side sectional view of a light emitting device according to a fifth embodiment.

[0107] refer to Figure 10 According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a first moisture-proof layer 171A sealing the light emitting chip 131 on the groove 111; a light-transmitting layer 161 arranged in the groove 111; and a second moisture-proof layer 173 arranged on the outer periphery of the upper surface of the light-transmitting layer 161 and the upper side surface of the body 110.

[0108] The light emitting chip 131 may emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-transmitting layer 161 may be formed of a glass material that is not damaged by ultraviolet light wavelengths. The first and second moisture-proof layers 171A and 173 may have a fluorine resin-based material and may transmit light without being damaged by the light emitted from the light emitting chip 131.

[0109] The first moisture-proof layer 171A may extend from the surface of the light-emitting chip 131 in the groove 111 to the bottom of the groove 111. The first moisture-proof layer 171A blocks water or moisture from penetrating the light-emitting chip 131 in the groove 111. The first moisture-proof layer 171A may contact the sidewalls of the groove 111, but is not limited thereto. The distance between the upper surface of the first moisture-proof layer 171A and the upper surface of the light-emitting chip 131 may be equal to or less than 10 μm. When the distance exceeds 10 μm, the light transmittance or moisture resistance may be reduced. The second moisture-proof layer 173 may extend from the outer periphery of the upper surface of the light-transmitting layer 161 to the upper surface of the main body 110, or from the outer periphery of the upper surface of the light-transmitting layer 161 to the outer upper and side surfaces of the main body 110, and may block water or moisture. Furthermore, the second moisture-proof layer 173 may extend to the lower surface of the main body 110 to block water or moisture from penetrating through the lower surface of the main body 110.

[0110] The second moisture-proof layer 173 has an open area 173B and can expose the upper surface of the light-transmitting layer 161 through the open area 173B. The second moisture-proof layer 173 can be arranged so as not to overlap the bottom area of ​​the groove 111 in the vertical direction. The width D2 of the open area 173B of the second moisture-proof layer 173 can be wider than or equal to the bottom width D1 of the groove 111. By arranging the open area 173B in the second moisture-proof layer 173, interference with light emitted from the light-emitting chip 131 is minimized and light extraction efficiency can be improved.

[0111] The second moisture-proof layer 173 can prevent water or moisture from penetrating through the surface of the body 110. The thickness of the second moisture-proof layer 173 may be approximately 0.5 μm to 10 μm. When the thickness of the second moisture-proof layer 173 exceeds the above range, the light transmittance is significantly reduced, and when the thickness is less than the above range, the moisture resistance may be deteriorated.

[0112] The lens may be coupled to the second moisture-proof layer 173 , but the present invention is not limited thereto.

[0113] The material of the first and second moisture-proof layers 171A and 173 can be used together with at least one of PCTFE (polychlorotrifluoroethylene), ETFE (ethylene tetrafluoroethylene), FEP (fluorinated ethylene propylene copolymer), and PFA (perfluoroalkoxy). The first and second moisture-proof layers 171A and 173 can include the same material or different materials. For example, the first and second moisture-proof layers 171A and 173 can be formed of PCTFE, or the first moisture-proof layer 171A can be formed of PCTFE, and the second moisture-proof layer 173 can be formed of ETFE, which is a material different from the first moisture-proof layer.

[0114] In addition, the first moisture-proof layer 171A can be formed of a material having a higher moisture resistance than the second moisture-proof layer 173 to protect the light-emitting chip 131, or the second moisture-proof layer 173 can be formed of a material having a higher moisture resistance than the first moisture-proof layer 171A, thereby increasing the main moisture resistance on the surface of the light-emitting device. The first moisture-proof layer 171A can be formed of a material having a higher transmittance than the second moisture-proof layer 173, thereby reducing the reduction in transmittance. In addition, a molding member is further arranged on the outer portion of the second moisture-proof layer 173, and can perform moisture protection and device protection.

[0115] Figure 11 is a side sectional view of a light emitting device according to a sixth embodiment.

[0116] refer to Figure 11 According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121A and 125A arranged in the groove 111; a light emitting chip 131A arranged on at least one of the plurality of electrodes 121A and 125A; a first moisture-proof layer 171A covering a surface of the light emitting chip 131; and a light-transmitting layer 161 arranged on the first moisture-proof layer 171A.

[0117] The light-emitting chip 131A can emit ultraviolet light, i.e., a wavelength in the range of 100 nm to 280 nm. The light-emitting chip 131A is arranged on the plurality of electrodes 121A and 125A in a flip-chip manner. Since the light-emitting chip 131A is arranged in a flip-chip manner, there is no need to arrange a separate connecting member. Therefore, it is possible to block water or moisture from passing through the connecting member connected to the light-emitting chip 131A, and to prevent defects in the connecting member.

[0118] The light emitting chip 131A according to the embodiment may be disposed in the groove 111 in a flip chip manner and the first moisture-proof layer 171A may be disposed in the groove 111. As another example, the structure of the first moisture-proof layer 171A may selectively adopt the above embodiment, but the present invention is not limited thereto.

[0119] In addition, a second moisture-proof layer 176 may be arranged on the lower surface of the main body 110. The second moisture-proof layer 176 may be arranged on the lower surface of the main body 110 and may contact the first and second pads 141 and 145 as a fluororesin-based moisture-proof layer. The second moisture-proof layer 176 is arranged on the lower surface of the main body 110 and may block the penetration of water or moisture through the first and second pads 141 and 145. The second moisture-proof layer 176 may be extended from the lower surface of the main body 110 to the side surface portion and may prevent the penetration of water or moisture. In addition, a molding member is further arranged on the outer portion of the main body 110 and may perform moisture protection and device protection.

[0120] Figure 12 is a side sectional view of a light emitting device according to a seventh embodiment.

[0121] refer to Figure 12 According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121A and 125A arranged in the groove 111; a light emitting chip 131A arranged on the plurality of electrodes 121A and 125A; a first moisture-proof layer 171B covering a surface of the light emitting chip 131A; and a light-transmitting layer 161 arranged on the first moisture-proof layer 171B.

[0122] The light-emitting chip 131A can emit ultraviolet light, i.e., a wavelength in the range of 100 nm to 280 nm. The light-emitting chip 131A is arranged on the plurality of electrodes 121A and 125A, for example, in a flip-chip arrangement. Since the light-emitting chip 131A is arranged in a flip-chip arrangement, there is no need to arrange a separate connecting member. Therefore, water or moisture can be blocked from passing through the connecting member connected to the light-emitting chip 131A, and defects in the connecting member can be prevented.

[0123] According to the embodiment, the light-emitting device can be arranged in the groove 111 in a flip-chip manner, and the first moisture-proof layer 171B can be arranged in the groove 111. The first moisture-proof layer 171B can extend from the upper surfaces of the first and second electrodes 121A and 125 to the upper surface of the light-emitting chip 131A in a stepped structure. Therefore, the moisture-proof layer 171B can provide a uniform moisture-proof effect in the area of ​​the groove 111. In addition, a molding member can be further arranged on the outer side of the body 110 to perform moisture-proofing and device protection. The thickness of the upper surface of the moisture-proof layer 171B starting from the upper surface of the light-emitting chip 131A can be, for example, in the range of 0.5 μm to 10 μm. When the thickness of the moisture-proof layer 171B exceeds the above-mentioned range, the light transmittance is significantly reduced. When the thickness of the moisture-proof layer 171B is less than the above-mentioned range, the moisture-proof performance may be degraded. In the embodiment, the light-emitting device is described as being arranged in the groove 111 in a flip-chip manner, but the present invention is not limited to this. The light emitting devices may be arranged in the grooves in a horizontal or vertical manner.

[0124] Figure 13 is a side sectional view of a light emitting device according to an eighth embodiment.

[0125] refer to Figure 13According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121A and 125A arranged in the groove 111; a light emitting chip 131A arranged on the plurality of electrodes 121A and 125A; a light-transmitting layer 161 arranged in the groove 111; and a moisture-proof layer 171C arranged on a lower surface of the light-transmitting layer 161.

[0126] Moisture-proof layer 171C may be disposed on the lower surface of light-transmitting layer 161, and its outer periphery may be adhered to adhesive 163. Thus, the step of forming moisture-proof layer 171C in a separate region is simplified, and moisture-proof layer 171C is formed on the lower surface of light-transmitting layer 161, so that moisture-proof layer 171C can be disposed during the step of coupling light-transmitting layer 161. Furthermore, the outer portion of moisture-proof layer 171C is vertically overlapped with step structure 115, so that water or moisture can be prevented from penetrating through step structure 115.

[0127] The light-emitting chip 131A can emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-emitting chip 131A can be arranged in the electrodes 121A and 125A in a flip-chip manner or can be connected to the above-mentioned connection member. However, the present invention is not limited thereto. The thickness of the moisture-proof layer 171C can be in the range of 0.5 μm to 10 μm. When the thickness of the moisture-proof layer 171C exceeds the above range, the transmittance is significantly reduced, and when the thickness is less than the above range, the moisture resistance is reduced.

[0128] Figure 14 is a side sectional view of a light emitting device according to a ninth embodiment.

[0129] refer to Figure 14 According to the embodiment, the light emitting device includes: a body 110 having a groove 111; a plurality of electrodes 121A and 125A arranged in the groove 111; a light emitting chip 131A arranged on the plurality of electrodes 121A and 125A; and a moisture-proof layer 171A arranged on a surface of the light emitting chip 131A.

[0130] The sidewall 116 of the groove 111 may be extended in a vertical direction from the upper surface of the body 110, thereby simplifying the manufacturing process. In addition, by removing the light-transmitting layer in the groove 111, light loss due to the light-transmitting layer may be reduced.

[0131] The light emitting chip 131A may emit ultraviolet light wavelengths, that is, wavelengths in the range of 100 nm to 280 nm. The light emitting chip 131A may be arranged on the electrodes 121A and 125A in a flip-chip manner. The upper surface of the moisture barrier 171A may be formed as in Figure 12. The thickness of the moisture-proof layer 171A may be less than or equal to 1 mm, and the thickness may cover at least the light-emitting chip 131A, and when it exceeds 1 mm, the transmittance of ultraviolet light may be reduced. The thickness starting from the upper surface of the light-emitting chip 131A may be formed, for example, in the range of 0.5 μm to 10 μm. When the thickness of the moisture-proof layer 171A exceeds the range mentioned above, the transmittance is significantly reduced, and when the thickness is less than the above range, the moisture resistance is reduced.

[0132] Figure 15 is a side sectional view of a light emitting device according to a tenth embodiment.

[0133] refer to Figure 15 According to the embodiment, the light source module includes: a main body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a light-transmitting layer 161 arranged in the groove 111; a circuit board 201 arranged under the main body 110; and a moisture-proof layer 178 arranged on the upper surface of the light-transmitting layer 161, the upper surface and side surfaces of the main body 110, and the upper surface of the circuit board 201.

[0134] The light-emitting chip 131 can emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-emitting chip 131 can be arranged in a flip-chip arrangement or by die bonding. The light-transmitting layer 161 can be formed from a glass material that is not susceptible to damage caused by ultraviolet light wavelengths, such as the breaking of bonds between molecules. The moisture-proof layer 178 comprises a fluororesin-based material and can transmit light without being damaged by the light emitted from the light-emitting chip 131. The moisture-proof layer 178 can extend from the upper surface of the light-transmitting layer 161 to the upper surface of the main body 110 and the upper surface of the circuit board 201. The moisture-proof layer 178 can prevent water or moisture from penetrating through the side and upper surfaces of the main body 110, as well as water or moisture from penetrating the circuit board 201. The thickness of the moisture-proof layer 178 can range from 0.5 μm to 10 μm. When the thickness of the moisture-proof layer 178 exceeds this range, the light transmittance is significantly reduced, while when the thickness is less than this range, the moisture resistance is reduced.

[0135] A portion of the moisture-proof layer 178 may be disposed in a region between the lower surface of the body 110 and the circuit board 201 and may block water or moisture from penetrating.

[0136] The circuit board 201 includes a plurality of pads 204 and 205 , and the plurality of pads 204 and 205 may be electrically connected to the first and second pads 141 and 145 disposed on the lower surface of the body 110 .

[0137] The circuit board 201 can be connected to the signal cables 211 and 213 through the external connection terminals 207 and 208, and the signal cables 211 and 213 can be supplied with power from the outside. The moisture-proof layer 178 covers the joint portion of the external connection terminals 207 and 208 and the signal cables 211 and 213, and it can prevent water or moisture from penetrating.

[0138] The plurality of signal cables 211 and 213 are separated from each other and can be drawn out through the moisture-proof layer 178 .

[0139] Figure 16 is a side sectional view of a light emitting device according to an eleventh embodiment.

[0140] refer to Figure 16 According to the embodiment, the light source module includes: a main body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a light-transmitting layer 161 arranged in the groove 111; a circuit board 201 arranged below the main body 110; a moisture-proof layer 177 extending from the upper surface of the light-transmitting layer 161 to the upper surface of the main body 110; and a molding member 181 covering the surfaces of the main body 110 and the circuit board 201.

[0141] The light emitting chip 131 may emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100 nm to 280 nm. The light-transmitting layer 161 may be formed of a glass material that is not susceptible to damage due to ultraviolet light wavelengths. A moisture-proof layer 177 may be extended from the upper surface of the light-transmitting layer 161 to the upper surface of the main body 110 to block water or moisture from penetrating into the main body 110. The moisture-proof layer 177 may have a fluororesin-based material and may transmit light without causing damage to the bonds between molecules caused by the light emitted from the light emitting chip 131.

[0142] Moisture-proof layer 177 may be provided in the form of a film, and adhesive layer 164 may be bonded between moisture-proof layer 177 and the upper surface of body 110. Adhesive layer 164 may be an adhesive for ultraviolet light. Outer frame portion 177A of moisture-proof layer 177 may protrude further outward than the side surface of body 110, thereby increasing the bonding strength with molding member 181. Both molding member 181 and moisture-proof layer 177 may provide dual protection against water or moisture.

[0143] Because moisture-proof layer 177 is provided in film form, it is bonded to the upper surface of body 110 and light-transmitting layer 161 and can be provided with a thickness of 1 mm or less, for example, a thickness ranging from 0.025 mm to 1 mm. Because the coating layer according to the dipping process is not formed in film form on moisture-proof layer 177, transmittance can be maintained at 70% or greater, even if it is provided thicker than the dipping process. In the case where moisture-proof layer 177 is thicker than 1 mm, light extraction efficiency may be reduced. In the case where the thickness is less than 0.025 mm, transmittance is improved, but the work process becomes difficult due to warping or wrinkling.

[0144] The circuit board 201 is disposed under the body 110 and is electrically connected to the light emitting chip 131 in the body 110. The circuit board 201 may include a connector 210 and the connector 210 is connected to signal cables 211 and 213 supplying power.

[0145] The molding member 181 is molded on the side surface of the body 110 and the surface of the circuit board 201 .

[0146] The molding member 181 has an open area 182, and the open area 182 exposes the moisture-proof layer 177. The upper portion 181A of the molding member 181 may be adhered to the outer frame portion 177A of the moisture-proof layer 177, and the lower portion 181B may cover the lower surface of the circuit board 201. The width D3 of the open area 182 may be equal to or wider than the width of the light-transmitting layer 161. By providing the open area 182, light loss due to the contact interface between the molding member 181 and the moisture-proof layer 177 can be reduced.

[0147] The molding member 181 may be formed of a material such as silicon, epoxy, or urethane resin. The upper surface of the molding member 181 may be arranged at a higher position than the upper surface of the main body 110 and may be in close contact with the upper surface of the moisture-proof layer 177. Therefore, the moisture-proof layer 177 may prevent water or moisture from penetrating into the main body 110.

[0148] The molding member 181 molds the connector 210 and the signal cables 211 and 213 to expose a portion of the signal cables 211 and 213. Therefore, by using the moisture-proof layer 177 to prevent moisture and by using the molding member 181 to mold the surfaces of the circuit board 201, the connector 210, and the signal cables 211 and 213, it is possible to prevent water or moisture from penetrating through the interface between the circuit board 201 and the body 110. As another example, the moisture-proof layer may be disposed in the groove 111 of the body 110, but the present invention is not limited thereto.

[0149] Figure 17 is a side sectional view of a light emitting device according to a twelfth embodiment.

[0150] refer to Figure 17 According to the embodiment, the light source module includes: a main body 110 having a groove 111; a plurality of electrodes 121, 123 and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123 and 125; a light-transmitting layer 161 arranged in the groove 111; a circuit board 201 arranged below the main body 110; a moisture-proof layer 178 extending from the upper surface of the light-transmitting layer 161 to the upper and side surfaces of the main body 110 and the upper surface of the circuit board 201; and a molding member 181 extending from the lower surface of the circuit board 201 to the outer side surface of the moisture-proof layer 178.

[0151] The light emitting chip 131 can emit ultraviolet light wavelengths, i.e., wavelengths in the range of 100nm to 280nm. The light-transmitting layer 161 can be formed of a glass material that is not damaged by ultraviolet light wavelengths. The moisture-proof layer 178 has a fluororesin-based material and can transmit light without being damaged by the light emitted from the light-emitting chip 131. The moisture-proof layer 178 can be extended from the upper surface of the light-transmitting layer 161 to the upper surface and side surfaces of the main body 110. The moisture-proof layer 178 is extended to the upper surface of the circuit board 201. A portion of the moisture-proof layer 178 is arranged between the lower surface of the main body 110 and the circuit board 201 to prevent water or moisture from penetrating the lower surface of the main body 110. The thickness of the moisture-proof layer 178 can be in the range of 0.5μm to 10μm, and when the thickness of the moisture-proof layer 178 exceeds the above range, the light transmittance is significantly reduced, and when it is less than the above range, the moisture resistance is reduced.

[0152] Portions of the signal cables 211 and 213 connected to the circuit board 201 are coated with a moisture-proof layer 178 .

[0153] Molding member 183 is molded on the outer portion of moisture barrier 178 and the surface of circuit board 201. Molding member 183 is molded on the outer portion of moisture barrier 178 disposed on the side surface of body 110 to doubly protect the side surface of body 110.

[0154] The molding member 183 has an open area, and the open area exposes the upper surface of the moisture-proof layer 178. The molding member 183 can be formed of a material such as silicon, epoxy, or urethane resin. The upper surface of the molding member 183 can be arranged at a higher position than the upper surface of the body 110 and can be the same horizontal surface as the upper surface of the moisture-proof layer 178. Therefore, the surface shape of the light-emitting device can be flattened, and water or moisture can be prevented from being collected in uneven areas.

[0155] The molding member 183 molds a portion of the signal cables 211 and 213 and exposes a portion of the signal cables 211 and 213. Therefore, by using the moisture-proof layer 178 to prevent moisture and by using the molding member 183 to mold the outer portion of the moisture-proof layer 178, the circuit board 201, and the surfaces of the signal cables 211 and 213, it is possible to prevent water or moisture from penetrating through the interface between the circuit board 201 and the body 110. As another example, the moisture-proof layer may be arranged in the groove 111 of the body 110, but the present invention is not limited thereto.

[0156] Figure 18 is a side sectional view of a light source module according to a thirteenth embodiment.

[0157] refer to Figure 18 The light source module according to the embodiment includes: a body 110 having a groove 111; a plurality of electrodes 121, 123, and 125 arranged in the groove 111; a light emitting chip 131 arranged on at least one of the plurality of electrodes 121, 123, and 125; a light-transmitting layer 161 arranged in the groove 111; a circuit board 201 arranged below the body 110; a moisture-proof layer 178 extending from the upper surface of the light-transmitting layer 161 to the upper and side surfaces of the body 110 and the upper surface of the circuit board 201; a molding member 183 extending from the lower surface of the circuit board 201 to the outer portion of the moisture-proof layer 178; and a housing 221 on the surface of the molding member 183. Among these configurations, reference will be made to Figure 17 Description and Figure 17 those same parts.

[0158] The housing 221 covers the side surfaces and the lower surface of the molding member 183. That is, Figure 17 The light source module is inserted into the housing part of the housing 221. The housing 221 may be coupled to a cover 223 having an open area. The open area of ​​the cover 223 may be opened in an area corresponding to the groove 111. The cover 223 covers the upper surface of the molding member 183. The housing 221 and the cover 223 may be formed of a plastic material, but are not limited thereto.

[0159] The cover 223 may be coupled or fastened to the housing 221. The housing 221 and the cover 223 protect the entire module from external impact. In addition, the housing 221 may prevent water or moisture from penetrating through the lower portion.

[0160] The light emitting device and the light source module including the light emitting device according to the embodiment can be used as a device for sterilizing condensed water in indoor units, evaporators, and refrigerators, a sterilizing device in equipment such as air washers, a sterilizing device for draining water from water tanks and water purifiers, and a sterilizing device for toilets. Such a sterilizing device may optionally include the above-mentioned moisture barrier.

[0161] The features, structures, functions, etc. described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. In addition, other people in the field to which the embodiments pertain may combine or modify the features, structures, functions, etc. illustrated in the embodiments. Therefore, it should be understood that such combinations and modifications are included in the scope of the present invention.

[0162] [Industrial Applicability]

[0163] The light emitting device of the embodiment can improve the reliability of moisture resistance.

[0164] The light emitting device of the embodiment can be applied to sterilization equipment.

Claims

1. A light source module, comprising: A light-emitting device, wherein the light-emitting device comprises: a main body having a groove; a light emitting chip disposed in the groove; and a light-transmitting layer disposed on the groove and separated from the light-emitting device; and a second moisture-proof layer arranged on an upper surface and a side surface of an outer side of the main body, The light emitting chip emits light with a wavelength ranging from 100 nm to 280 nm. wherein the main body comprises a ceramic material, Wherein, the light-transmitting layer is formed of glass material. Wherein, the second moisture-proof layer comprises a light-transmitting material, The groove includes a blank space between the light emitting chip and the light-transmitting layer, and wherein the second moisture-proof layer extends from the upper surface of the outer side of the main body to the side surface of the main body, wherein the second moisture-proof layer has a thickness ranging from 0.5 μm to 10 μm; Wherein, the second moisture-proof layer comprises a fluororesin-based material.

2. The light source module according to claim 1, in, The second moisture-proof layer is attached to the side surface and the upper surface of the main body.

3. The light source module according to claim 1, in, The body is arranged on a circuit board including a plurality of pads, and Wherein, the second moisture-proof layer extends to the upper surface of the circuit board.

4. The light source module according to claim 3, in, A portion of the second moisture barrier is disposed between the lower surface of the body and the upper surface of the circuit board.

5. The light source module according to claim 2, further comprising: A first moisture-proof layer seals the light-emitting chip and extends from a surface of the light-emitting chip to a bottom of the groove.

6. The light source module according to claim 5, in, The area between the light-transmitting layer and the first moisture-proof layer is filled with empty space, and The light-transmitting layer is coupled to the stepped structure of the main body.

7. The light source module according to claim 3, in, The second moisture barrier disposed on the upper surface of the main body includes an open area, and The light-transmitting layer is exposed through the open area.

8. The light source module according to claim 7, in, The width of the open area is equal to or wider than the bottom width of the groove.

9. The light source module according to claim 3, wherein: The second moisture-proof layer is arranged on an upper surface of the light-transmitting layer.

10. A light source module, comprising: A circuit board, the circuit board comprising a first solder pad and a second solder pad; A light emitting device is arranged on a first solder pad and a second solder pad of the circuit board, wherein the light emitting device comprises: a main body having a groove; a light emitting chip disposed in the groove; and a light-transmitting layer disposed on the groove; and a moisture-proof layer arranged on the upper surface and the side surface of the light-emitting device, The light emitting chip emits light with a wavelength ranging from 100 nm to 280 nm. wherein the light emitting chip is electrically connected to the first pad and the second pad, wherein the moisture-proof layer extends from the side surface of the light-emitting device to the upper surface of the circuit board, and wherein the moisture-proof layer contacts the side surface of the light-emitting device and the upper surface of the circuit board, wherein the moisture-proof layer has a thickness ranging from 0.5 μm to 10 μm; The moisture-proof layer includes a fluororesin-based material.

11. The light source module according to claim 10, in, The moisture barrier has an open area, and The upper surface of the light-transmitting layer is exposed through the open area.

12. The light source module according to claim 11, in, The width of the open area is equal to or wider than the bottom width of the groove.

13. The light source module according to any one of claims 10 to 12, in, A portion of the moisture barrier is disposed between a lower surface of the body and an upper surface of the circuit board.

14. The light source module according to any one of claims 10 to 12, in, The circuit board is connected to a signal cable through an external connection terminal.

15. The light source module according to claim 14, in, The moisture-proof layer covers the joint portion of the external connection terminal and the signal cable. wherein the signal cables are separated from each other and drawn out through the moisture barrier, and A portion of the signal cable connected to the circuit board is coated with the moisture-proof layer.

16. A light source module, comprising: A circuit board, the circuit board comprising a first solder pad and a second solder pad; A light emitting device is arranged on a first solder pad and a second solder pad of the circuit board, wherein the light emitting device comprises: a main body having a groove; a light emitting chip disposed in the groove; and a light-transmitting layer disposed on the groove; and a molding member covering an outer side surface of the light emitting device and an upper surface of the circuit board, The light emitting chip emits light with a wavelength ranging from 100 nm to 280 nm. wherein the light emitting chip is electrically connected to the first pad and the second pad, wherein the molding member has an open area, The width of the open area is equal to or wider than the width of the light-transmitting layer. wherein the molding member contacts a side surface of the body and an upper surface of the circuit board.

17. The light source module according to claim 16, comprising: a moisture-proof layer extending from the upper surface of the light-emitting device to the upper surface of the circuit board, wherein the upper portion of the molding member is adhered to the outer frame portion of the moisture barrier, and The upper portion of the molding member is disposed at a higher position than an upper surface of the light emitting device.

18. The light source module according to claim 16 or 17, in, The lower portion of the molding member covers or contacts the lower surface of the circuit board, and Wherein, the molding member is formed of silicone resin, epoxy resin or urethane resin.

19. The light source module according to claim 16 or 17, in, The circuit board includes a connector connected to a signal cable supplying power, and The molding member molds the connector and the signal cable.

20. The light source module according to claim 17, in, The moisture-proof layer includes a light-transmitting material having a fluorine content ranging from 1 wt % to 3 wt %, and Wherein, the moisture-proof layer has a thickness of 10 μm or less.

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