PCB board, PCB board manufacturing method and electrical equipment

Abstract

Embodiments of the present invention provide a PCB board, a method for manufacturing a PCB board, and an electrical device. The PCB board includes an insulating dielectric layer, which is a glass substrate layer having a top surface and a bottom surface disposed opposite each other; a conductive circuit layer, which is disposed on the top surface of the insulating dielectric layer; and a top ink layer, which is coated on the conductive circuit layer. The technical solution provided by the embodiments of the present invention prevents deformation or warping of the PCB board, and the conductive circuit layer is not easily peeled off from the insulating dielectric layer, resulting in excellent performance of the PCB board.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a PCB board, a manufacturing method of a PCB board, and electrical equipment. Background Art

[0002] Typically, a PCB (Printed Circuit Board) consists of an insulating layer and a conductive layer. In the traditional PCB industry, the insulating layer is made of organic materials. Organic materials used in PCBs can include phenolic resin, glass fiber / epoxy resin, Polyimide, BT / Epoxy, etc. Generally, an aluminum substrate or glass fiber board is used as the substrate layer, the resin is used as the insulating layer, and copper foil is laid on the insulating layer.

[0003] The resin insulation layer is the main cause of PCB warping. The resin has large expansion and contraction coefficients, which can easily cause deformation and warping. Deformation can even cause the conductive layer to peel off from the insulation layer, thus affecting the performance of the PCB. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to solve the above problems or at least partially solve the above problems.

[0005] A first embodiment of the present invention provides a PCB board, comprising:

[0006] an insulating dielectric layer, wherein the insulating dielectric layer is a glass substrate layer, and the glass substrate layer includes a top surface and a bottom surface that are oppositely disposed;

[0007] a conductive circuit layer, the conductive circuit layer being disposed on a top surface of the insulating dielectric layer;

[0008] A top ink layer is coated on the conductive circuit layer.

[0009] Furthermore, it also includes:

[0010] A bottom ink layer is coated on the bottom surface of the insulating dielectric layer.

[0011] Furthermore, the top ink layer is a white reflective ink layer.

[0012] Furthermore, the bottom ink layer is a non-transparent ink layer.

[0013] Furthermore, the conductive circuit layer is a silver paste circuit layer printed with silver paste.

[0014] Furthermore, it also includes a character layer, which is printed on the top ink layer.

[0015] The PCB board provided in the embodiment of the first aspect of the present invention uses a glass substrate layer as the substrate and the insulating dielectric layer, replacing the structure of the prior art in which an aluminum substrate or a fiberglass board is bonded with an insulating resin. Since the expansion and contraction coefficients of glass are very small, deformation and warping will not occur, and the conductive circuit layer will not be peeled off from the insulating dielectric layer. This improves the performance of the PCB board. In addition, the glass can also serve as a heat dissipation function, eliminating the need for a separate heat dissipation structure, which can effectively save costs.

[0016] Another embodiment of the present invention provides an electrical device, including the PCB board described above.

[0017] Furthermore, the electrical equipment is a lamp.

[0018] Furthermore, it also includes a light source, which is arranged on the top surface of the PCB board and is electrically connected to the conductive circuit layer.

[0019] Furthermore, it also includes a transparent cover and a lamp body, the transparent cover is arranged opposite to the top surface of the PCB board, the lamp body is arranged between the transparent cover and the PCB board, and is used to connect the transparent cover and the PCB board, and there is a distance between the transparent cover and the top surface of the PCB board to form a light-emitting cavity.

[0020] Furthermore, it also includes:

[0021] The reflector is provided between the transparent cover and the top surface of the PCB board and is located in the light-emitting cavity. The reflective surface of the reflector gradually tilts outward from the top surface of the PCB board toward the direction where the transparent cover is located.

[0022] Furthermore, the lamp body is made of plastic or glass.

[0023] Furthermore, when the lamp body is a plastic part, the lamp body and the PCB board are detachably connected;

[0024] When the lamp body is a glass piece, the lamp body and the glass substrate layer of the PCB board are formed in one piece.

[0025] Furthermore, the transparent cover is a glass cover, or the transparent cover is a transparent plastic cover.

[0026] The electrical device provided in the second embodiment of the present invention includes the above-mentioned PCB board. Since the above-mentioned PCB board uses a glass substrate layer as the substrate and the insulating dielectric layer, replacing the structure of the prior art using an aluminum substrate or a fiberglass board bonded with an insulating resin, the expansion and contraction coefficients of the glass are very small, so deformation and warping will not occur, and the conductive circuit layer will not be peeled off from the insulating dielectric layer. Therefore, the performance of the PCB board and the electrical device is improved. In addition, the glass can also have the function of heat dissipation, eliminating the need for a separate heat dissipation structure, which can effectively save costs.

[0027] A third aspect of the present invention provides a method for manufacturing a PCB board, wherein the PCB board is any one of the PCB boards described above, and the manufacturing method comprises the following steps:

[0028] Cutting the material to obtain a glass substrate layer of preset size;

[0029] Arranging a conductive circuit layer on the top surface of the glass substrate layer;

[0030] Coating a top ink layer on the conductive circuit layer and reserving a preset position for pre-installing electronic components;

[0031] The top ink layer is cured.

[0032] Furthermore, before coating the top ink layer on the conductive circuit layer and reserving a preset position for pre-installing electronic components, the method further includes:

[0033] A primer ink layer is applied to the bottom surface of the glass substrate layer.

[0034] Furthermore, the step of arranging a conductive circuit layer on the top surface of the glass substrate layer includes:

[0035] Silver paste circuits are screen-printed on the top surface of the glass substrate layer to form a conductive circuit layer.

[0036] Furthermore, after the step of coating the bottom ink layer on the bottom surface of the glass substrate layer, the method further includes:

[0037] Heating the glass substrate layer so that the glass substrate layer is evenly heated to a preset temperature;

[0038] The heated glass substrate layer is cooled using a preset cooling method to allow the underlying ink layer, glass substrate layer and silver paste circuit to be tempered and fused.

[0039] Furthermore, before the step of coating the bottom ink layer on the bottom surface of the glass substrate layer, the method further includes:

[0040] The silver paste circuit is sintered.

[0041] Furthermore, after the step of curing the top ink layer, the method further includes:

[0042] Printing a character layer on the top ink layer;

[0043] Solidify the character layer.

[0044] The manufacturing method of a PCB board provided in an embodiment of the third aspect of the present invention uses a glass substrate layer as the substrate and the insulating dielectric layer, replacing the structure of the prior art in which an aluminum substrate or a fiberglass board is bonded with an insulating resin. Since the expansion and contraction coefficients of glass are very small, deformation and warping will not occur, and the conductive circuit layer will not be peeled off from the insulating dielectric layer. This improves the performance of the PCB board. In addition, the glass can also have a heat dissipation function, eliminating the need for a separate heat dissipation structure, which can effectively save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0046] Figure 1 A side sectional view of a PCB board provided in the first embodiment of the present invention;

[0047] Figure 2 A schematic structural diagram of a lamp provided in the second embodiment of the present invention;

[0048] Figure 3 This is another structural schematic diagram of the lamp provided in the second embodiment of the present invention;

[0049] Figure 4 A schematic diagram of the structure of a terminal device provided in Embodiment 2 of the present invention;

[0050] Figure 5 A flowchart of a method for manufacturing a PCB board provided in Embodiment 3 of the present invention;

[0051] Figure 6 This is a flow chart of a method for manufacturing a PCB board provided in Example 4 of the present invention. DETAILED DESCRIPTION

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0053] Throughout the specification and claims, the word "including" is an open-ended term and should be interpreted as "including but not limited to." "Substantially" means that within an acceptable error range, a person skilled in the art can solve the technical problem and substantially achieve the technical effect.

[0054] Furthermore, the term "connected" as used herein encompasses both direct and indirect means of connection. Thus, if a first device is described as being connected to a second device, this means that the first device may be directly connected to the second device or indirectly connected to the second device through another device. The following description of preferred embodiments of the present invention is intended to illustrate the general principles of the invention and is not intended to limit the scope of the invention. The scope of protection of the present invention shall be determined by the appended claims.

[0055] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0056] Those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples without mutual contradiction.

[0057] The mechanism that causes PCB warping in existing technology is as follows: The insulating dielectric layer of conventional PCBs is made of inorganic materials, and the moisture content of the glass fiber cloth contained within is a significant factor in PCB warping. Because glass fiber cloth absorbs moisture, when the PCB becomes damp, the high and low temperatures encountered during soldering can cause the PCB to warp and deform.

[0058] Example 1

[0059] In order to at least solve the above-mentioned series of problems causing PCB board warping, an embodiment of the present invention provides a PCB board. Specifically, Figure 1This is a side sectional view of a PCB board provided in the first embodiment of the present invention. The PCB board can be used in various electronic devices, such as lamps (such as LED lamps), mobile phones, tablet computers, laptop computers or game consoles, or in some electrical devices in automobiles.

[0060] like Figure 1 As shown, the PCB board provided in this embodiment includes: an insulating dielectric layer 10, a conductive circuit layer 20 and a top ink layer 30.

[0061] The insulating dielectric layer 10 is a glass substrate layer, which includes a top surface A and a bottom surface B disposed opposite each other. The insulating dielectric layer 10 can be made of or processed from glass of a predetermined size. The glass substrate layer itself is a transparent material, and light can be refracted through the transparent glass substrate layer.

[0062] The conductive circuit layer 20 is disposed on the top surface A of the insulating dielectric layer 10. A top ink layer 30 is applied to the conductive circuit layer 20. When applying the top ink layer 30, preset positions for pre-installing various electronic components (such as light sources, resistors, power supplies, etc.) can be reserved, so that each electronic component can be connected to the conductive circuit layer 20 through the corresponding reserved preset positions. When the top ink layer is used as a solder mask ink layer, its color is not limited. For example, commonly used green or black ink can be used as the top solder mask ink. In this embodiment, white reflective ink is used as the top ink layer 30. On the one hand, it can serve as a solder mask. On the other hand, when the PCB board is used in a lamp, such as an LED lamp, the top ink layer 30 is a white reflective ink layer. This allows light emitted from the light source to be reflected by the white reflective ink layer. This can maximize the reflection of the lamp's light, significantly reducing light loss and preventing light from being refracted through the transparent glass substrate layer, thereby improving the lamp's luminous efficiency.

[0063] The PCB board provided in this embodiment utilizes a glass substrate layer as both the base and insulating dielectric layer, replacing the existing structure of aluminum substrates or fiberglass boards bonded with insulating resin. Fiberglass boards have low thermal conductivity and cannot be used in high-power, high-density lighting products. While aluminum substrates have good thermal conductivity, they still require the use of insulating resin. Because the expansion and contraction coefficients of glass are very small, the PCB board in this embodiment does not deform or warp, and thus does not cause the conductive circuit layer to separate from the insulating dielectric layer. This improves the performance of the PCB board, and the glass also serves as a heat dissipator, eliminating the need for a separate heat dissipation structure and significantly reducing costs.

[0064] In addition, compared with the prior art method of combining an aluminum substrate with an insulating resin, the PCB board designed in this embodiment directly replaces the aluminum substrate with glass as the substrate, and utilizes the insulating and thermal conductive properties of glass, thereby achieving basically the same effect as the structure of combining an aluminum substrate with an insulating resin. There is no need to set up an insulating resin separately, which can effectively save costs.

[0065] In conventional PCBs, insulating resin serves as the insulating layer between the PCB copper foil (conductive circuit layer) and the aluminum substrate. However, under high pressure and high temperature, this insulating resin is prone to insulation failure, providing only basic insulation. This results in the PCB being susceptible to insulation failure under high-voltage and high-temperature operating conditions, making stable performance impossible. However, the PCB in this embodiment eliminates the need for insulating resin, achieving both insulation and heat dissipation through the glass substrate. This eliminates the need for insulating resin and, consequently, eliminates the issue of insulation failure. Furthermore, the glass substrate undergoes much less thermal deformation after tempering than the aluminum substrate, effectively ensuring the PCB's stable performance.

[0066] Furthermore, glass substrates exhibit less crosstalk between different circuits than existing aluminum substrates, resulting in improved EMC (Electro Magnetic Compatibility). Glass substrates also offer superior dielectric strength compared to aluminum substrates. This embodiment employs glass as the PCB substrate, resolving the long-standing voltage withstand issue with aluminum substrates. Existing aluminum substrates can only withstand voltages up to 3kV without arcing, while ensuring heat dissipation and a creepage distance of 3mm. Glass substrates, however, can withstand voltages exceeding 5kV.

[0067] Based on the above embodiment, the PCB board of the present invention may further include a bottom ink layer 40, which is applied to the bottom surface B of the insulating dielectric layer 10. The bottom ink layer 40 is preferably a non-transparent ink layer. Specifically, the bottom ink layer 40 may be a black ink layer. When the PCB board in this embodiment is mounted on a lamp, the bottom surface B may face the outside of the lamp. Since the substrate is a transparent glass substrate, a non-transparent black ink layer, for example, may be applied to the bottom surface B. This effectively conceals the electronic components and conductive circuits, improving the appearance.

[0068] The conductive circuit layer 20 can also be formed by laying down copper foil. More preferably, the conductive circuit layer 20 can be a silver paste circuit layer printed with silver paste. Specifically, the silver paste can be printed using a stencil. Silver paste is a viscous slurry composed of a mechanical mixture of high-purity (99.9%) metallic silver particles, a binder, a solvent, and additives. The size of the silver particles on the insulating dielectric layer 10 is related to the conductive properties of the silver paste. Given the same volume, larger particles have a lower probability of contact between particles, leaving more space occupied by the non-conductive resin, which blocks the conductive particles and reduces conductivity. Conversely, smaller particles have a higher probability of contact and better conductivity. Particle size affects conductivity. Controlling the size of the silver paste particles ensures that the conductive particles (silver particles) can pass smoothly through the stencil mesh and be densely deposited on the insulating dielectric layer 10 (glass substrate layer), thereby forming a full conductive pattern and forming the silver paste circuit layer. The PCB board of this embodiment directly coats the conductive circuit on the glass substrate without providing other insulating layers, thereby further reducing the manufacturing cost of the PCB board.

[0069] It is worth noting that the design of the routing of traditional PCB boards may also be a factor that causes PCB board warping. When designing the routing of PCB boards, due to the layout of electronic components and some reasons of the functions of electronic products, the routing of the PCB board on the top and bottom layers is uneven, or one side has longitudinal routing and the other side has transverse routing, or one side has a large area of copper plating and the other side has no or very small amount of copper plating. The expansion and contraction properties of copper foil and glass fiber cloth are different. When the copper foil on the surface of the PCB board is unevenly distributed, the copper foil stretching the surface of the PCB board will cause the circuit board to twist and deform. This embodiment can more effectively prevent the deformation of the PCB board by coordinating the silver paste circuit and the glass substrate layer.

[0070] Furthermore, a character layer 50 may be printed on the top ink layer 30 and cured. It can be understood that the character layer 50 is a printed character layer dispersed on the top ink layer 30. The printed characters may be located next to the electronic components soldered on the PCB to indicate the names of the corresponding electronic components.

[0071] In addition, when the PCB board provided in this embodiment is applied to other fields, such as electrical equipment in automobiles, the top ink layer 30 and the bottom ink layer 40 can be black ink layers. The black ink layer can also achieve the effect of solder resistance. The absorption coefficient of the black ink layer is greater than that of white ink. Alternatively, ink layers of other colors can be used in other application fields. The specific selection can be made according to actual conditions.

[0072] Example 2

[0073] This embodiment provides an electrical device, including the PCB board provided in Embodiment 1. Specifically, the electrical device may be a lamp. Figure 2 This is a schematic diagram of the structure of a lamp provided in the second embodiment of the present invention, and the viewing angle is a side sectional view, as shown in FIG. Figure 2 As shown, the lamp of this embodiment also includes a light source 60, which is disposed on the top surface A of the PCB 110 and is electrically connected to the conductive circuit layer. Light source 60 and electronic components are attached to the glass substrate of the PCB, providing direct heat dissipation without the need for thermally conductive grease or other heat-dissipating materials. This reduces assembly uncertainty compared to the conventional aluminum substrate + heat sink combination and is more environmentally friendly.

[0074] Furthermore, the device includes a transparent cover 70 and a lamp body 80. The transparent cover 70 is positioned opposite the top surface A of the PCB board, and the lamp body 80 is positioned between the transparent cover 70 and the PCB board 110, connecting the transparent cover 70 and the PCB board 110. A gap is provided between the transparent cover 70 and the top surface A of the PCB board 110 to form a light-emitting cavity a. Preferably, the transparent cover 70 is a glass cover, or a transparent plastic cover.

[0075] like Figure 2 As shown, the lamp body 80 can be a plastic component. When the lamp body 80 is a plastic component, the lamp body 80 can be detachably connected to the PCB board. For example, the lamp body 80 can be snap-fitted to the PCB board 110. The edges of the PCB board 110 are connected to the lamp body 80, and the center of the PCB board 110 is directly exposed to the air for heat dissipation. Because the PCB board 110 uses glass as the substrate layer, glass has excellent insulation and thermal conductivity. Direct contact with the air for heat dissipation eliminates the need for a heat sink to assist in heat dissipation, effectively saving costs.

[0076] As an alternative, Figure 3 As shown, the lamp body 80 can also be a glass part, and the lamp body 80 can be integrally formed with the glass substrate layer of the PCB board 110, that is, the glass substrate layer of the PCB board 110 also serves as the lamp body. However, the assembly process between the PCB board and the lamp body of the lamp in the prior art is complicated, and requires locking screws and applying insulating thermal grease; the so-called lamp body of the lamp is a heat sink connected to the PCB board. In the prior art, the PCB board combining an aluminum substrate and insulating resin is connected to the heat dissipation lamp body, and screws and other connectors are required to connect, and thermal grease needs to be applied. The lamp in this embodiment uses the PCB board provided in the embodiment. The substrate of the PCB board in Example 1 is a glass substrate. Since glass itself has good thermal conductivity and insulation, Figure 3The lamp shown here directly utilizes the glass substrate of the PCB as part of the lamp body, eliminating the need for screw tightening and thermal grease application. This simplifies the lamp manufacturing process and reduces costs. Glass-based PCBs offer excellent heat dissipation, and the glass serves as both the lamp body and heat sink, eliminating the need for aluminum or fiberglass substrates. This significantly reduces both material and manufacturing costs. Furthermore, using a glass-based PCB as the lamp's PCB further improves luminous efficiency.

[0077] Optionally, this embodiment also provides another lamp, which, based on the above embodiment, may further include an insulating rear shell (not shown in the figure), which is buckled onto the bottom surface B of the PCB board 110, and there is a distance between the insulating shell and the bottom surface B of the PCB board to form a heat dissipation cavity.

[0078] In addition, the lamp in this embodiment may further include a reflector 90. The reflector 90 is disposed between the transparent cover and the top surface A of the PCB board 110 and within the light-emitting cavity a. The reflective surface 901 of the reflector 90 gradually slopes outward from the top surface A of the PCB board 110 toward the transparent cover 70. This arrangement of the reflector 90 effectively disperses light emitted by the light source along a predetermined path, thereby significantly improving the light utilization rate and efficiency of the lamp.

[0079] The lamp provided in the embodiment of the present invention includes the PCB board provided in the embodiment 1 and has the structure and function of the PCB board described in the embodiment 1. For details, please refer to the description of the embodiment 1, which will not be repeated in this embodiment.

[0080] Specifically, the electrical device in the embodiment of the present invention may also be a terminal device. Figure 4 This is a schematic diagram of the structure of the terminal device provided in the third embodiment of the present invention. For details, please refer to Figure 4 , the terminal device 100 in this embodiment can be a computer or a mobile phone.

[0081] The terminal device 100 may include a housing 101, and one or more of the following components: a processor 102, a memory 103, a power supply circuit 104, a multimedia component 105, an audio component 106, an input / output (I / O) interface 107, a sensor component 108, and a communication component 109. The power supply circuit 104 is used to supply power to various circuits or components of the terminal device 100; the memory 103 is used to store executable program code; the processor 102 reads the executable program code stored in the memory 103 to run the program corresponding to the executable program code; the terminal device 100 also includes a PCB board 110 as provided in any of the above embodiments. The PCB board 110 is disposed within the space enclosed by the housing 101, and the processor 102 and the memory 103 are disposed on the PCB board 110.

[0082] The terminal device provided in the embodiment of the present invention includes the PCB board provided in the embodiment 1 and has the structure and function of the PCB board described in the embodiment 1. For details, please refer to the description of the embodiment 1, which will not be repeated in this embodiment.

[0083] Of course, the electrical device provided in this embodiment can also be other devices, and this embodiment does not list them one by one. All electrical devices that include the PCB board provided in this embodiment 1 are within the scope of protection of the present invention.

[0084] Example 3

[0085] Excessive warpage can also occur during the PCB manufacturing process. During PCB production, electroplating is performed in a solution, while the solder mask and white ink curing process requires high-temperature baking. The transition from one process to another requires washing and drying. These frequent high and low temperatures can cause PCB warpage if the PCB is not positioned flat during manufacturing.

[0086] Moreover, from an environmental perspective, the circuit board production process in the existing technology involves etching, solder mask ink, tin spraying, etc., all of which contain numerous chemical raw materials and heavy metals. For example, etching must be carried out using strong acid solutions such as sulfuric acid and hydrochloric acid, and solder mask ink also has a specific formula of chemical components. Some processes also require the use of ammonia, etc. In short, the manufacturing process of traditional PCB boards is a highly polluting manufacturing process, which is not conducive to environmental protection.

[0087] In order to solve the above problems in the traditional PCB board manufacturing process, the present invention also provides a PCB board manufacturing method. Specifically, Figure 5 Flowchart of the method for manufacturing a PCB board provided in the third embodiment of the present invention; Figure 5 As shown, the manufacturing method of the PCB board provided in this embodiment, the PCB board is the PCB board of embodiment 1, and the manufacturing method includes the following steps:

[0088] S101: Cutting the material to obtain a glass substrate layer of a preset size.

[0089] S102: Arranging a conductive circuit layer on the top surface of the glass substrate layer.

[0090] In this embodiment, preferably, arranging the conductive circuit layer on the top surface of the glass substrate layer specifically includes: screen printing silver paste circuits on the top surface of the glass substrate layer to form a conductive circuit layer, and sintering the silver paste circuit layer. The sintering treatment can improve the strength of the silver paste circuit layer and prevent the silver paste from flowing during subsequent processes. The drying temperature can usually be controlled at 120°C-300°C. The sintering temperature is controlled at 400°C to 600°C. The method of laying silver paste circuits is simpler than the method of laying copper foil in the prior art. Of course, as an optional method, the silver paste circuit can also be printed onto the glass substrate layer by gravure printing.

[0091] The process of printing the silver paste circuit layer in this embodiment is roughly as follows: screen stretching → photosensitive resin sizing → drying → plate exposure → development → drying.

[0092] The process of stretching the screen refers to the process of firmly combining the stretched screen with the screen frame. In this embodiment, preferably, the mesh number of the selected screen can be 150-300 meshes, and the thickness of the applied photosensitive adhesive can be 10-20 μm.

[0093] Photosensitive adhesive sizing refers to evenly applying photosensitive adhesive on the silk screen to block all the mesh holes of the silk screen to form a photosensitive film.

[0094] The purpose of drying is to preliminarily dry the photosensitive adhesive on the screen.

[0095] Plate making refers to coating a layer of photosensitive film on the surface of the screen and then drying it, covering it with a film with an image (circuit pattern), and irradiating the film with strong light. The image on the film is exposed and photocopied onto the photosensitive film on the plate.

[0096] Development refers to curing the mesh positions that the circuit pattern has not passed through. The mesh positions that the circuit pattern has passed through are blocked and not transparent, so they cannot be cured, forming leaks, so that the subsequent silver paste can pass through, and then the silver paste can pass through the mesh positions corresponding to the circuit pattern and be printed on the glass substrate.

[0097] Drying is to dry the screen on which the circuit pattern is formed.

[0098] Then, silver paste is coated on the silk screen, and the mesh holes corresponding to the circuit pattern expose the silver paste to the glass substrate, forming a silver paste circuit layer on the glass substrate.

[0099] S103: coating a top ink layer on the conductive circuit layer and reserving a preset position for pre-installing electronic components.

[0100] It is understandable that the top ink layer applied can be selected according to actual needs. Specifically, for example, when the application field is the field of lamps, the top ink layer applied can be a white reflective ink layer to improve the lighting effect of the lamp.

[0101] S104: performing a curing process on the top ink layer.

[0102] Specifically, the top ink layer can be pre-cured by thermal curing at a temperature of 120°C-300°C, more preferably 150±5°C, and then cured by ultraviolet light (UV). Ultraviolet light (UV) curing refers to the process of using ultraviolet light as an energy source to induce the 100% rapid conversion of reactive liquid materials into solids. By combining the two curing methods, the curing effect can be further improved, and the cured top ink layer is not easy to peel off.

[0103] Furthermore, after the top ink layer is cured, a character layer can be printed on top of the top ink layer. Similarly, after printing the character layer, the character layer needs to be dried and cured. The curing method used can be the same as the curing method for the top ink layer, and will not be further described here.

[0104] Example 4

[0105] Figure 6 Flowchart of the method for manufacturing a PCB board provided in the fourth embodiment of the present invention; Figure 6 As shown, based on the third embodiment, this embodiment further includes, before step S103, the following steps:

[0106] S201: coating a bottom ink layer on the bottom surface of the glass substrate layer.

[0107] A base layer of ink is applied to the bottom surface of the glass substrate to shield the electronic components and conductive circuit layers of the PCB, thereby improving the appearance of the electrical device. After applying the base layer of ink, a preliminary drying process can be performed, specifically at 120°C-300°C, more preferably at 150±5°C.

[0108] After step S201, the following steps may also be included:

[0109] S202: heating the glass substrate layer so that the temperature of the glass substrate layer is uniformly raised to a preset temperature.

[0110] S203: Cooling the heated glass substrate layer using a preset cooling method to achieve fusion of the underlying ink layer, the glass substrate layer, and the silver paste circuit.

[0111] In this embodiment, an ordinary glass substrate layer can be heated in a heating furnace to a temperature close to the softening temperature of the glass (600-700°C). The glass eliminates internal stress through its own deformation. The glass is then removed from the heating furnace. Then, a multi-head nozzle can be used to blow high-pressure cold air onto both sides of the glass, causing the glass to quickly and evenly cool to room temperature, thereby obtaining tempered glass. Since the underlying ink layer and silver paste circuit are printed on the glass substrate layer, the underlying ink layer, silver paste circuit and glass substrate layer are tempered and fused together during the tempering process. After fusion, the silver paste circuit and the underlying ink layer are not easily peeled off, thereby effectively extending the service life of the PCB board.

[0112] It should be noted that since the top surface A of the PCB board is used to install electronic components, after being installed in the electrical equipment, the top ink layer will not be frequently touched by humans, while the bottom ink layer is more easily touched by humans. Therefore, the requirements for the anti-peeling ability of the top ink layer are not as high as those for the bottom ink layer. The top ink layer does not need to be tempered together with the glass substrate, and only needs to be subjected to ordinary curing treatment.

[0113] In addition, it is worth noting that in the embodiment where the bottom ink layer is not applied, only the silver paste circuit layer can be tempered and fused with the glass substrate.

[0114] Of course, it is understandable that in addition to rapid air cooling, other cooling methods can also be used for cooling the glass substrate layer in this embodiment, such as water cooling, oil cooling, etc., and those skilled in the art can select a suitable cooling method according to actual conditions.

[0115] The manufacturing method of the PCB board provided in the third or fourth embodiment does not contain any chemical solution treatment process in the entire process. Only the ink and silver paste are chemical in nature. However, the treatment of the ink and silver paste is only coating and curing. The treatment process does not generate wastewater or waste gas, and is very environmentally friendly.

[0116] It should be noted that the implementation steps of the PCB board manufacturing method provided in this embodiment are not limited to the above-defined order. Within a reasonable range, the implementation order between the steps can be changed, or they can be implemented simultaneously.

[0117] The structures and functions of the PCB boards manufactured by the manufacturing methods of the PCB boards provided in the third and fourth embodiments of the present invention are the same as those described in the first and second embodiments. For details, please refer to the description of the first and second embodiments, which will not be repeated here.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for manufacturing a PCB board, characterized in that: The manufacturing method comprises the following steps: Cutting the material to obtain a glass substrate layer of preset size; Screen printing silver paste circuits on the top surface of the glass substrate layer to form a conductive circuit layer; Coating a top ink layer on the conductive circuit layer and reserving a preset position for pre-installing electronic components; Curing the top ink layer; Before coating the top ink layer on the conductive circuit layer and reserving a preset position for pre-installing electronic components, the method further includes: coating a bottom ink layer on the bottom surface of the glass substrate layer; After the step of coating the bottom ink layer on the bottom surface of the glass substrate layer, the method further includes: Heating the glass substrate layer so that the glass substrate layer is evenly heated to a preset temperature; The heated glass substrate layer is cooled using a preset cooling method to allow the underlying ink layer, glass substrate layer and silver paste circuit to be tempered and fused.

2. The method for manufacturing a PCB board according to claim 1, wherein: Before the step of coating the bottom ink layer on the bottom surface of the glass substrate layer, the method further includes: The silver paste circuit is sintered.

3. The method for manufacturing a PCB according to any one of claims 1 to 2, wherein: After the step of curing the top ink layer, the following steps are also included: Printing a character layer on the top ink layer; Solidify the character layer.

4. A PCB board, characterized in that: The PCB board is manufactured according to the manufacturing method of any one of claims 1 to 3, wherein the PCB board comprises: an insulating dielectric layer, wherein the insulating dielectric layer is a glass substrate layer, and the glass substrate layer includes a top surface and a bottom surface that are oppositely disposed; a conductive circuit layer, the conductive circuit layer being disposed on a top surface of the insulating dielectric layer; A top ink layer, the top ink layer being coated on the conductive circuit layer; A bottom ink layer, the bottom ink layer being coated on the bottom surface of the insulating dielectric layer; A character layer is printed on the top ink layer.

5. The PCB board according to claim 4, characterized in that: The top ink layer is a white reflective ink layer.

6. The PCB board according to claim 4, characterized in that: The bottom ink layer is a non-transparent ink layer.

7. An electrical device, characterized in that: Comprising the PCB board as described in any one of claims 4 to 6.

8. The electrical equipment according to claim 7, characterized in that: The electrical equipment is a lamp.

9. The electrical equipment according to claim 8, characterized in that: It also includes a light source, which is arranged on the top surface of the PCB board and is electrically connected to the conductive circuit layer.

10. The electrical equipment according to claim 9, characterized in that: The invention also includes a transparent cover and a lamp body. The transparent cover is arranged opposite to the top surface of the PCB board. The lamp body is arranged between the transparent cover and the PCB board and is used to connect the transparent cover and the PCB board. There is a distance between the transparent cover and the top surface of the PCB board to form a light-emitting cavity.

11. The electrical equipment according to claim 10, characterized in that: Also includes: The reflector is provided between the transparent cover and the top surface of the PCB board and is located in the light-emitting cavity. The reflective surface of the reflector gradually tilts outward from the top surface of the PCB board toward the direction where the transparent cover is located.

12. The electrical equipment according to claim 10 or 11, characterized in that: The lamp body is a plastic part or a glass part.

13. The electrical device according to claim 12, characterized in that: When the lamp body is a plastic part, the lamp body and the PCB board are detachably connected; When the lamp body is a glass piece, the lamp body and the glass substrate layer of the PCB board are formed in one piece.

14. The electrical device according to claim 10, characterized in that: The transparent surface cover is a glass surface cover, or the transparent surface cover is a transparent plastic surface cover.

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