Heat Transfer of Power Module

Abstract

The present invention is titled "Heat Transfer of a Power Module". In one general aspect, the present invention discloses an apparatus that may include a module having a semiconductor die. The apparatus may include a heat sink coupled to the module and including a substrate and a plurality of protrusions. The apparatus may include a cover having channels, wherein the plurality of protrusions of the heat sink are disposed within the channels, and the apparatus may include a sealing mechanism disposed between the cover and the module.

Description

Technical Field

[0001] This specification generally relates to heat transfer techniques associated with modules. Background Art

[0002] Generally speaking, a heat sink can transfer heat generated by electronic components included in a power supply to, for example, an air coolant. By transferring or guiding the heat away from the electronic components, the temperature of the electronic components can be adjusted to a desired level. Adjusting the temperature of the electronic components to avoid overheating can also prevent damage to the electronic components. Any overheating or damage to the electronic components in the power supply can have a negative impact on the performance of the power supply and, in some cases, may cause the power supply to fail completely. The heat sinks used in some technologies may be undesirable for certain applications. Summary of the Invention

[0003] In one general aspect, a device may include a module having a semiconductor die. The device may include a heat sink that is coupled to the module and includes a substrate and a plurality of protrusions. The device may include a cover having channels, wherein the plurality of protrusions of the heat sink are disposed within the channels, and the device may include a sealing mechanism disposed between the cover and the module.

[0004] Details of one or more embodiments are set forth in the accompanying drawings and the following description. Other features will be apparent from the description and drawings, and from the claims. Brief Description of the Drawings

[0005] Figures 1A to 1E are schematic diagrams showing various views of a module assembly.

[0006] Figure 2A and Figure 2B are schematic diagrams showing a variant form of the module assembly shown in Figures 1A to 1E .

[0007] Figure 3 are schematic diagrams showing a variant form of the protrusions shown in Figure 2B .

[0008] Figures 4A to 4F are schematic diagrams showing a variant form of the module assembly shown in Figures 1A to 3 .

[0009] Figures 5 to 9B are schematic diagrams showing a variant form of the module assembly.

[0010] Figure 10 and Figure 11 show examples of heat sinks.

[0011] Figure 12 are schematic diagrams showing a variant form of the module assembly shown in Figure 6 .

[0012] Figure 13 Shows an exploded view of components included in a module assembly.

[0013] Figure 14 Is a schematic diagram showing a side view of an exemplary module assembly, which can be a variant of the module assembly shown in Figure 13 Therein.

[0014] Figure 15 And Figure 16 Shows a side cross-sectional view of an exemplary module assembly.

[0015] Figure 17 Is a schematic diagram showing an exemplary cover.

[0016] Figures 18A to 18H Shows a method of manufacturing at least some of the heat sink-based module assemblies described herein.

[0017] Figures 19A to 19F Shows another method of manufacturing at least some of the heat sink-based module assemblies described herein.

[0018] Figures 20A to 20D Shows a method of manufacturing at least some of the cover-bump module assemblies described herein.

[0019] Figure 21 Is a schematic diagram showing an exemplary module.

[0020] Figure 22 Is a flowchart showing a method for manufacturing the module assemblies described herein. Detailed Description

[0021] The module assemblies described herein include a module that can include a semiconductor die encapsulated in a molding material, and a direct bond metal (DBM) substrate electrically coupled to the semiconductor die. The module assembly can include a cover surrounding at least a portion of the module such that a heat transfer mechanism is disposed within a channel of the cover. The heat transfer mechanism can be, or can include, a heat sink, a bump extending from the cover, and the like. The module assemblies described herein can be configured as dual-cooled module assemblies, and the module can have more than one DBM substrate.

[0022] The module assemblies described herein can be configured to provide sufficient cooling for the module while meeting the size and cost goals of the module assembly. In some embodiments, the heat transfer mechanism (e.g., heat sink) included in the module assembly can be manufactured using a metallic material. However, to reduce the total module assembly cost, the heat transfer mechanism can be manufactured as a composite metal and plastic structure, or in some cases, only as a plastic structure.

[0023] In some embodiments, the heat transfer mechanism may provide indirect cooling to components included in the module assembly. In some embodiments, the heat transfer mechanism of the module assembly may use a double-sided cooling module to provide direct cooling to components included in the module assembly. In some embodiments, the heat transfer mechanism in the module assembly may provide a combination of indirect cooling and direct cooling to components included in the module assembly. Such a heat transfer mechanism may be referred to as a hybrid heat transfer mechanism or a hybrid heat transfer structure.

[0024] The hybrid heat transfer mechanism can provide high-performance cooling at low cost because the hybrid heat transfer mechanism can be designed and assembled to provide direct cooling, may include protrusions (e.g., fins) attached to a direct bond metal (DBM) substrate (e.g., a direct bond copper (DBC) substrate, a substrate having a dielectric layer disposed between two metal layers (e.g., one or more metal layers having electrical traces)), and may include a tubular heat transfer design for use with a double cooling module. In some embodiments, the hybrid heat transfer mechanism may avoid using a thermal interface material (TIM) between the DBC substrate and the copper substrate.

[0025] The module assembly described herein may include using a hybrid heat transfer mechanism, including preventing leakage of a liquid coolant along with package alignment in a molded all-plastic structure. The molded all-plastic structure of the hybrid heat transfer mechanism may provide improved creepage distance between components compared to conventional structures. The molded all-plastic structure may provide scalability for one to three or more modules, allowing for horizontal and / or vertical stacking of the modules. The hybrid heat transfer mechanism described herein may provide improved thermal performance, thereby reducing the die size of the overall module assembly while providing an improvement in the maximum current-carrying capacity of the module assembly.

[0026] For example, the heat transfer mechanism described herein, and specifically the hybrid heat transfer mechanism, may be included in various module assemblies for applications including high-power device applications. For example, high-power device applications may include high-power applications greater than, for example, 600V (e.g., especially when using silicon carbide (SiC) dies) and high-power applications greater than, for example, 400V (e.g., when using silicon dies). In some embodiments, the module assembly may be included in various applications, including but not limited to automotive applications (e.g., automotive high-power modules (AHPMs), electric vehicles, hybrid electric vehicles), computer applications, industrial equipment, on-vehicle charging applications, inverter applications, etc.

[0027] Figures 1A to 1E is a schematic diagram showing various views of a module assembly 100 according to some embodiments. Figure 1A and Figure 1B is a schematic diagram showing a cross-sectional view of the module assembly 100. Figures 1C to 1E are schematic diagrams showing a front view, a side view, and a top view of the module assembly 100, respectively.Figure 1A is a cross-sectional view taken along line A1 of Figure 1D and Figure 1B is a cross-sectional view taken along line A2 of Figure 1E .

[0028] As Figure 1A shown, the module assembly 100 includes a module 110 coupled to a heat sink 130. The heat sink 130 is disposed within a channel 124 of a cover 120 (also referred to as a module cover). The heat sink 130 may be referred to as a heat transfer mechanism (e.g., a heat transfer element), or may be a certain type of heat transfer mechanism. The cover 120 is disposed around at least a portion of the module 110.

[0029] Although the orientation of the device may be flipped or reversed, for the sake of simplicity in describing some of the elements herein, the top direction will be referenced relative to the top of the page, and the bottom direction will be referenced relative to the bottom of the page. The direction extending between the top and bottom may be referred to as the vertical direction (Y-direction), and the direction orthogonal to the vertical direction (X-direction or Z-direction, depending on the orientation of the figure) may be referred to as the horizontal direction (or lateral direction).

[0030] As Figure 1B shown, the cover 120 includes an inlet opening 121 and an outlet opening 122 such that a fluid (e.g., a gas (e.g., air), water, coolant) can flow within the channel 124 and around the heat sink 130. Thus, the inlet opening 121 can be in fluid communication with the outlet opening 122 via the channel 124. The openings 121, 122 can be two-way openings such that the fluid can flow through the channel 124 in opposite directions. The openings 121, 122 are openings through at least a portion (e.g., a wall) of the cover 120.

[0031] An exemplary fluid flow direction is shown by the dashed lines shown in Figure 1B . In this embodiment, heat can be transferred (e.g., effectively transferred) away from the module 110 via the heat sink 130 and the fluid flowing within the channel 124. The module 110 is aligned along a plane B2 such that the module 110 is aligned along the fluid flow direction between the inlet opening 121 and the outlet opening 122.

[0032] As Figure 1A shown, the heat sink includes protrusions 134 (e.g., a plurality of protrusions) and a substrate 132 (also referred to as a base plate). Although not shown in Figure 1A , in some embodiments, a thermal interface material (TIM) may be disposed between the heat sink 130 and the module 110 to facilitate heat transfer between the module 110 and the heat sink 130.

[0033] As Figure 1AAs shown, the heat sink 130 is disposed between the wall (e.g., the top wall) of the cover 120 and the module 110. The heat sink 130 is also disposed between the side walls of the cover 120.

[0034] Shown in Figure 1A the protrusion 134 in extends from the substrate 132 towards the inner surface of the cover 120 (along a direction not parallel to (e.g., orthogonal to) the substrate 132). Since the protrusion 134 is included in the heat sink 130, the protrusion 134 may be referred to as a heat sink protrusion.

[0035] As Figure 1A and Figure 1B shown, the protrusion 134 may be a fin included within or as part of the heat sink 130. One or more of the protrusions 134 may be longitudinally aligned along the direction of fluid flow. Thus, one or more of the protrusions 134 may be longitudinally aligned between the inlet opening 121 and the outlet opening 122. In some embodiments, the heat sink 130 may include more protrusions 134 than Figure 1A and Figure 1B shown in.

[0036] As Figure 1A shown, the protrusion 134 has a narrow transverse width (along the X direction) relative to the vertical height (along the Y direction). As Figure 1B shown, the protrusion 134 has a relatively long longitudinal length (along the Z direction) relative to the width or height. In some embodiments, the protrusion 134 may have a different shape than Figure 1A and Figure 1B shown in. Different protrusion shapes are shown and described in more detail below.

[0037] In some embodiments, the substrate 132 and one or more of the protrusions 134 may be integrally formed. In some embodiments, one or more of the protrusions 134 may be coupled (e.g., welded, soldered, glued) to the substrate 132. In the embodiments described herein, when an element is coupled to or in contact with another element, the element may be thermally coupled or in thermal contact via, for example, a thermal interface material, solder, conductive adhesive, etc.

[0038] The heat sink 130 (and its parts) may be made of various materials, including metallic materials and / or their alloys (e.g., copper, aluminum, nickel, nickel-plated metal, etc.). In some embodiments, one or more parts of the heat sink 130 may be made of a plastic material. In some embodiments, the substrate 132 and one or more of the protrusions 134 may be made of different materials.

[0039] Although in Figure 1AAlthough not shown, module 110 may include one or more semiconductor dies (e.g., silicon semiconductor die, silicon carbide (SiC) semiconductor die). The semiconductor die may be encapsulated within a molding (e.g., molding material (e.g., epoxy resin)) included in module 110. The semiconductor die may include a power semiconductor die. In some embodiments, the semiconductor die may include vertical metal oxide semiconductor field effect transistor (MOSFET) devices, bipolar junction transistor (BJT) devices, diode devices, application specific integrated circuits (ASICs), passive components (e.g., resistors, capacitors, inductors), etc.

[0040] Although not shown, in some embodiments, module 110 may include one or more direct bond metals (DBMs) (e.g., direct bond copper (DBC)) substrates. For example, a first DBM substrate may be disposed on a first side of module 110, and a second DBM substrate may be disposed on a second side of module 110. The semiconductor die may be disposed within the module between the first DBM substrate and the second DBM substrate. The outer surface of one or more of the DBM substrates may be exposed and may define at least a portion of the surface of module 100. In some embodiments, one or more semiconductor dies may be coupled to the inner surface of one or more of the DBM substrates.

[0041] In some embodiments, heat sink 130 may be coupled to one of the DBM substrates of module 110. In some embodiments, the module may be, for example, an automotive high power module (AHPM) package.

[0042] In this embodiment, substrate 132 is aligned along plane B1, and module 110 is aligned along plane B2. Thus, substrate 132 is aligned parallel to module 110. In some embodiments, substrate 132 may not be aligned parallel to module 110.

[0043] In this embodiment, the protrusions 134 of heat sink 130 are aligned orthogonally to plane B1. In some embodiments, one or more of the protrusions 134 may not be aligned orthogonally to plane B1. In some embodiments, a first protrusion from the protrusions 134 may not be aligned parallel to a second protrusion from the protrusions 134.

[0044] As Figure 1A shown, the tip of each of the protrusions 134 may be spaced apart from the top inner surface of cover 120 by a gap C1. Gap C1 may be relatively small (e.g., 3 times or less) compared to the height of the protrusions 134 (to facilitate heat transfer). The top inner surface of the cover may be on the opposite side of module assembly 100 relative to module 110. The protrusions 134 may be aligned with the side inner surface of cover 120. The top inner surface of the side inner surface of cover 120 may generally define the boundary (e.g., top and sides) of channel 124.

[0045] In some embodiments, the lateral spacing between the protrusions 134 may be equal or unequal. For example, the space between the first pair of protrusions 134 may be the same as or different from the space between the second pair of protrusions 134.

[0046] In some embodiments, the heat sink 130 and / or a portion thereof (e.g., the substrate 132 and / or the protrusions 134) may be entirely disposed within the channel 124 of the cover 120. In some embodiments, the heat sink 130 and / or a portion thereof may be entirely disposed within the cavity defined by the module 110 and the cover 120.

[0047] As Figures 1A to 1D shown, the sealing mechanism 140 is coupled between the cover 120 and the module 110. The sealing mechanism 140 can be configured to prevent fluid within the channel 124 from leaking through the interface between the cover 120 and the module 110. In this embodiment, the sealing mechanism 140 is aligned with or disposed within a plane parallel to at least one of plane B1 or plane B2. In some embodiments, the sealing mechanism may surround (e.g., substantially surround) the perimeter of the module 110 (or within or along the perimeter). In some embodiments, the sealing mechanism may surround (e.g., substantially surround) the perimeter of the cover 120. In some embodiments, the sealing mechanism 140 may be an adhesive and / or a sealant. In some embodiments, the sealing mechanism 140 may be an O-ring disposed within a groove (e.g., a double-groove O-ring) of the cover 120. In some embodiments, the sealing mechanism 140 may not be disposed within a groove or a portion of the cover 120. More details regarding the sealing mechanism 140 are described below.

[0048] The cover 120 may be made of, for example, a plastic material. In some embodiments, the cover 120 may be manufactured by molding a composite material. In some embodiments, the cover 120 may be made using an injection molding process. In some embodiments, the cover 120 may be made of a metal material (e.g., a metal alloy, aluminum, copper, steel, etc.) or may include the metal material. In some embodiments, the heat sink 130 may be made of a material different from (e.g., plastic vs. metal) or the same as the cover 120.

[0049] As Figure 1A shown, the lead 150 (which may also be referred to as a lead frame portion) may be coupled to or included as part of the module 110. The semiconductor die included within the module 110 may be electrically coupled to the lead 150. The lead 150 may be used as an electrical connection to the semiconductor die (e.g., input / output (I / O) pins, power pins, ground pins, etc.). Although the drawing shows a single lead 150, multiple leads may be coupled to the module 110.

[0050] Shown inFigure 1E The top view of the module component 100 in [reference] shows an inlet opening 121 and an outlet opening 122. In some embodiments, the inlet opening 121 and / or the outlet opening 122 may have a different shape than that shown in [reference]. In some embodiments, a port may be coupled to one or more of the inlet opening 121 and / or the outlet opening 122. Figure 1E In some embodiments, a port may be coupled to one or more of the inlet opening 121 and / or the outlet opening 122.

[0051] Figure 2A and Figure 2B are schematic diagrams showing variants of the module component 100 shown in [reference]. The module component 100 does not include a heat sink, but instead includes a protrusion 134A extending from the cover 120. The protrusion 134A may be referred to as a heat transfer mechanism, or may be a type of heat transfer mechanism. The external views of the module component 100 shown in [reference] are also applicable to the module component 100 shown in [reference]. The features described above in connection with [reference] generally apply to the module component 100. Figures 1A to 1E The module component 100 does not include a heat sink, but instead includes a protrusion 134A extending from the cover 120. The protrusion 134A may be referred to as a heat transfer mechanism, or may be a type of heat transfer mechanism. The external views of the module component 100 shown in [reference] are also applicable to the module component 100 shown in [reference]. The features described above in connection with [reference] generally apply to the module component 100. Figure 1C and Figure 1E The external views of the module component 100 shown in [reference] are also applicable to the module component 100 shown in [reference]. The features described above in connection with [reference] generally apply to the module component 100. Figure 2A and Figure 2B The external views of the module component 100 shown in [reference] are also applicable to the module component 100 shown in [reference]. The features described above in connection with [reference] generally apply to the module component 100. Figures 1A to 1E The features described above in connection with [reference] generally apply to the module component 100.

[0052] As Figure 2A and Figure 2B shown, the protrusion 134A extends from the cover 120 towards the top surface (e.g., the exposed surface) of the module 110 (along a direction not parallel to (e.g., orthogonal to) the module 110). Since the protrusion 134A extends from the cover 120, in this embodiment, the protrusion 134A may be referred to as a cover protrusion. In some embodiments, one or more of the protrusions 134A may be integrally formed as part of the cover 120. In some embodiments, the protrusion 134A may be used as a turbulence enhancer. An advantage of the cover protrusion embodiment may be that a thermal interface material may not be required (compared to the thermal interface material between the heat sink and the module 110 in a heat sink and heat sink configuration).

[0053] As Figure 2A shown, the protrusion 134A is disposed between and extends from a wall (e.g., the top wall or a portion thereof) of the cover 120 and the module 110. The protrusion 134A is disposed between and aligned along the side walls (e.g., the inner surface of the side walls) of the cover 120.

[0054] As Figure 2A shown, the bottom end of each of the protrusions 134A may be spaced apart from the top surface of the module 110 by a gap D1. The gap D1 may be relatively small (e.g., 3 times or less) compared to the height of the protrusion 134 (to facilitate heat transfer). The protrusion 134A may be aligned with the inner side surface of the cover 120. In some embodiments, the protrusion 134A may be made of a material different from (e.g., plastic vs. metal) or the same as the cover 120.

[0055] Figure 3 is a schematic diagram showing a variant form of the protrusion 134A shown in Figure 2B . As Figure 3 shown, the protrusion 134B has an elongated shape. In some embodiments, the protrusion 134B may have a column shape, a cylindrical shape, a conical shape, a spiral shape, etc. The cross-sectional profile of one or more of the protrusions 134B may have a square shape, a circular shape, an oval shape, a rectangular shape, etc. As Figure 3 shown, the protrusion 134B has a narrow lateral width (along the X direction) relative to the vertical height (along the Y direction). The protrusion 134B also has a relatively short length (along the Z direction) relative to the height. In some embodiments, the width may be equal to or different from the length.

[0056] In some embodiments, the protrusions 134B (when viewed along the direction E shown in Figure 3 ) can be arranged in a regular pattern, a random pattern, an irregular pattern, etc. The protrusions 134B can be arranged to mix the fluid flowing through the channel 124 between the inlet opening 121 and the outlet opening 122 to facilitate heat transfer.

[0057] Figures 4A to 4F is a schematic diagram showing a variant form of the module component 100 shown in Figures 1A to 3 .

[0058] As Figure 4A and Figure 4B shown, the vertical heights of at least some of the protrusions 134A and 134 are different from (e.g., higher than) the vertical heights of the other protrusions (as opposed to the uniform height in other exemplary embodiments). In Figure 4A , the protrusion 134A closest to the side wall of the cover 120 is higher than the protrusion 134A towards the middle part of the cover 120. Although not shown in Figure 4A , the protrusion 134A closest to the side wall of the cover 120 is shorter than the protrusion 134A towards the middle part of the cover 120.

[0059] In Figure 4B , the protrusion 134 closest to the side wall of the cover 120 is shorter than the protrusion 134 towards the middle part of the cover 120. Although not shown in Figure 4B , the protrusion 134 closest to the side wall of the cover 120 is higher than the protrusion 134 towards the middle part of the cover 120.

[0060] Figure 4CA projection 134A is shown that extends from the cover 120 and contacts (e.g., is in thermal contact with, is coupled to) the top surface of the module 110. In this embodiment, less than all of the projections 134A extend from the cover 120 to the top surface of the module 110. In some embodiments, all of the projections 134A may extend from the cover 120 to the top surface of the module 110. Thermal interface material may be excluded from the top (upper) surface of the module 110.

[0061] Figure 4D A projection 134A is shown that extends from the cover 120 and contacts a substrate 132 disposed between the top surface of the module 110 and the projection 134A. In this embodiment, less than all of the projections 134A extend from the cover 120 to the top surface of the module 110. In some embodiments, all of the projections 134A may extend from the cover 120 to the top surface of the module 110. The projection 134A in contact with the substrate 132 may maintain the substrate 132 in a fixed position relative to the module 110.

[0062] Figure 4E A projection 134 is shown that extends from the heat sink 130 and contacts the inner top surface of the cover 120. In this embodiment, less than all of the projections 134 extend from the heat sink 130 to the inner top surface of the cover 120. In some embodiments, all of the projections 134 may extend from the heat sink 130 to the inner top surface of the cover 120. The projection 134 in contact with the cover 120 may maintain the heat sink 130 in a fixed position relative to the module 110.

[0063] Figure 4F A projection 134 is shown that extends between substrates 132-1 and 132-2. In this embodiment, all of the projections 134A extend between substrates 132-1 and 132-2. The contact of the heat sink 130 with (and to) the inner surface of the cover 120 and the module 110 may maintain the heat sink in a desired fixed position and be in thermal contact with the module 110.

[0064] In some embodiments, less than all of the projections 134A extend between substrates 132-1 and 132-2. In some embodiments, the substrate 132-2 may not contact the cover 120. In other words, the top surface of the substrate 132-2 may be separated from the inner top surface of the cover 120.

[0065] Figure 5It is a schematic diagram showing a variant form of the module component 100. In this embodiment, the cover 120 terminates on top of the substrate 132 of the heat sink 130. Accordingly, the width of the channel 124 is smaller than the width of the substrate 132. The sealing mechanism 140 is coupled between at least a portion of the cover 120 and the substrate 132. In this embodiment, a portion of the substrate 132 is exposed outside the cover 120 instead of being completely encapsulated within the cover 120. The substrate 132 is disposed between the cover and the module 110.

[0066] Figure 6 It is a schematic diagram showing another variant form of the module component 100. In this embodiment, the cover 120 terminates on top of the substrate 132 of the heat sink 130. In this embodiment, the coupling mechanism 162 is configured to couple (e.g., fixedly couple) the cover 120 to the substrate 132. In this embodiment, the substrate 132 can be fixedly coupled (e.g., welded, soldered, glued) to the module 110. Accordingly, the cover 120 is fixedly coupled to the module 110 within the module component 100 via the substrate 132. The substrate 132 is disposed between the cover and the module 110. As Figure 5 shown, the sealing mechanism 140 is coupled between at least a portion of the cover 120 and the substrate 132. In this embodiment, a portion of the substrate 132 is exposed outside the cover 120 instead of being completely encapsulated within the cover 120.

[0067] In some embodiments, fewer or more than two coupling mechanisms 162 may be used. In some embodiments, one or more of the coupling mechanisms 162 may include screws, rivets, snaps, latches, anchors, springs, glue, press-fit components, etc. Although not shown in this embodiment, in some embodiments, one or more of the coupling mechanisms 162 may be disposed within an opening (e.g., an opening through a hole, a groove) in the cover 120.

[0068] Figure 7 It is a schematic diagram showing a variant form of the module component 100 described herein. Figure 7 A module component 100 including bilateral cooling for the module 110 is shown. Shown in Figure 7 The features can be applied to any of the embodiments described herein. For example, the embodiments described in connection with FIGS. 1 to Figure 6 can be applied in a bilateral cooling configuration, as Figure 7 shown.

[0069] In shown in Figure 7In the embodiment, the module component 100 includes a first cover 120A, a first channel 124A, and a first sealing mechanism 140A disposed on the first side (e.g., the top side) of the module 110, and a second cover 120B, a second channel 124B, and a second sealing mechanism 140B disposed on the second side (e.g., the bottom side) of the module 110. Although not shown, heat transfer mechanisms such as a heat sink (e.g., heat sink 130), heat sink protrusions (e.g., protrusions 134), cover protrusions (e.g., protrusions 134A), etc. may be disposed within the channels 124A and / or 124B.

[0070] In this embodiment, a first DBM substrate 112A (e.g., a DBC substrate) and a second DBM substrate 112B of the module 110 are shown. The portion 114 disposed between the DBM substrate 112A and the DBM substrate 112B may include semiconductor dies, molding materials, one or more spacers, lead frames, etc.

[0071] In this embodiment, the first cover 120A (and the elements included in the cover 120A) and the second cover 120B (and the elements included in the cover 120A) are coupled around the module 110 via a coupling mechanism 160. In some embodiments, the first cover 120A and the second cover 120B may be fixedly coupled around the module 110 via the coupling mechanism 160 such that the module 110 is in a fixed position between the first cover 120A and the second cover 120B. In some embodiments, the covers 120A, 120B are coupled via one or more of the coupling mechanisms 160 disposed transversely to the module 110.

[0072] In some embodiments, fewer or more than two coupling mechanisms 160 may be used. In some embodiments, one or more of the coupling mechanisms 160 may include, or may be, screws (e.g., spring-loaded screws), rivets, snaps, latches, anchors, springs, press-fit mechanisms, adhesives, etc. Although not shown in this embodiment, in some embodiments, one or more of the coupling mechanisms 160 may be disposed within openings (e.g., through holes, openings of grooves) in the cover 120A and / or the cover 120B. In some embodiments, one or more of the coupling mechanisms 160 may be disposed within openings and / or grooves within one or more of the covers 120A, 120B.

[0073] Figure 8It is a schematic diagram showing another variant form of the module component 100. In this embodiment, the module component 100 includes two modules, namely module 110A and module 110B. In this embodiment, the modules 110A, 110B are aligned along the same plane E1. The modules 110A, 110B are aligned along the fluid flow direction between the inlet opening 121 and the outlet opening 122. Therefore, the fluid flowing in the channel 124 can be used to transfer heat away from both of the modules 110A, 110B.

[0074] Although not shown, a heat sink (e.g., heat sink 130), heat sink protrusions (e.g., protrusion 134), cover protrusions (e.g., protrusion 134A), etc. may be provided in the channel 124. Although not shown, heat transfer mechanisms such as a heat sink (e.g., heat sink 130), heat sink protrusions (e.g., protrusion 134), cover protrusions (e.g., protrusion 134A), etc. may be provided in the channel 124. Separate heat transfer mechanisms may be associated with each of the modules 110A, 110B.

[0075] As Figure 8 shown, different sealing mechanisms are associated with each of the modules 110A, 110B. Specifically, the sealing mechanism 140A is associated with the module 110A, and the sealing mechanism 140B is associated with the module 110B. Therefore, each of the modules 110A, 110B can be separately sealed relative to the channel 124 and the fluid flowing through it. The cover 120 includes a support portion 128 of the cover 120 disposed between the modules 110A, 110B.

[0076] Shown in Figure 8 The module component can also be configured in a bilateral cooling configuration. Such a bilateral configuration is shown in Figure 9A and Figure 9B in.

[0077] As Figure 9A shown, the module component 100 includes a first cover 120A, a first channel 124A, and first sealing mechanisms 140A-1, 140A-2 disposed on the first side (e.g., the top side) of the module 110, and a second cover 120B, a second channel 124B, and second sealing mechanisms 140B-1, 140B-2 disposed on the second side (e.g., the bottom side) of the module 110. The inlet opening 121A and the outlet opening 122A are associated with the channel 124A, and the inlet opening 121B and the outlet opening 122B are associated with the channel 124B.

[0078] Shown in Figure 9AThis embodiment in [document] includes protrusions 134A-1 and 134B-1, which are associated with module 110A and are provided on opposite sides of module 110A for bilateral cooling of module 110A. Similarly, this embodiment includes protrusions 134A-2 and 134B-2, which are associated with module 110B and are provided on opposite sides of module 110B for bilateral cooling of module 110B.

[0079] Figure 9B Shows a variant of the module assembly 100 shown in Figure 9A [document], which has heat sinks 130A-1, 130A-2, 130B-1, 130B-2 instead of cover protrusions. The common features will not be combined Figure 9A and will not be described again to simplify the description.

[0080] Shown in Figure 9A and Figure 9B The features in [document] can be applied to any of the embodiments described herein. For example, the embodiment described in connection with FIGS. 1 to Figure 8 can be applied in the bilateral cooling configuration shown in Figure 9A and Figure 9B [document].

[0081] Although the flow of the fluid is shown in Figure 9A and Figure 9B to be in the same direction within channels 124A, 124B in [document], in some embodiments, the flow of the fluid can be in the opposite direction. For example, the fluid flow in channel 124A can be in a first direction, and the fluid flow in channel 124B can be in a second direction opposite to the first direction.

[0082] Although not shown in Figure 9A and Figure 9B [document], different combinations of heat transfer mechanisms can be included in channels 124A, 124B. For example, cover protrusions and heat sinks can be associated with module 110A and provided on opposite sides of module 110A. As another example, cover protrusions and heat sinks can be included in a single channel (e.g., channel 124A).

[0083] Although not shown in Figure 9A and Figure 9B [document], a single set of inlet openings and outlet openings can be associated with both channels 124A, 124B. Such embodiments are described in more detail below (e.g., at least Figures 13 to 16 ).

[0084] Although not shown in Figure 9B [document], the heat sink can be configured to span multiple modules. For example, a single heat sink can be configured to span modules 110A and 110B. In such embodiments, a sealing mechanism can be associated withFigure 9B is differently processed as shown without a support portion (e.g., the support portion 128 shown in Figure 8 ). Such an exemplary embodiment is described in conjunction with at least the following Figure 16 shown and described.

[0085] Figure 10 and Figure 11 shows an example of a heat sink that can be used to provide non-direct (e.g., indirect) cooling to a module (e.g., module 110) within a module assembly (e.g., module assembly 100). Figure 10 shows a cross-sectional view 130 of a bimetallic heat sink 1030. The bimetallic heat sink 1030 can be manufactured without welding, thereby reducing the power assembly cost and thus the total cost of the power supply. The bimetallic heat sink 1030 can include different types of metals for different parts of the heat sink 1030.

[0086] Specifically, the bimetallic heat sink 1030 includes a copper (Cu) substrate 1032 that can be nickel-plated (Ni), and one or more protrusions 1034a, 1034b (e.g., fin structures) that can be made of different metals (nickel-plated and copper (Cu) foils), respectively. The protrusions 1034a-b can be soldered to the substrate 1032 using solder 1031. Therefore, no welding is required. In some cases, the protrusions 1034a-b and the substrate 1032 can be manufactured separately before being assembled into the bimetallic heat sink 1030. In this embodiment, at least one of the protrusions 1034 (or any of the protrusions 134 described herein) has a serpentine structure. In some embodiments, all of the protrusions 1034 can include a serpentine structure.

[0087] Figure 11 shows a perspective view of an exemplary heat sink 1134. The heat sink 1134 can be a bimetallic heat sink. As Figure 11 shown, the protrusions (e.g., fins) can have different lengths F1, F2 and different heights G1, G2. Specifically, a first group of protrusions 1134 (in the middle portion of the protrusions between the outer portions of the protrusions) has a height G1 that is greater than the height G2 of a second group of protrusions 1134 (in the outer portions of the protrusions). The first group of protrusions 1134 has a length F1 that is greater than the length F2 of the second group of protrusions 1134. The heat sink 1134 also includes an opening 1135 in the substrate 1132 for coupling the heat sink 1134 to, for example, a cover and / or a module.

[0088] Figure 12 is shown showing as shown in Figure 6Schematic diagram of a variant form of the module components in it. In this variant form, the cover 120 is coupled to the substrate 132 of the heat sink via spring-loaded screws 162-1, 162-2, and the spring-loaded screws are disposed within grooves 125-1, 125-2. The sealing mechanism 140 can be disposed within a groove 1226 (e.g., a recess) within the cover 120. By using the sealing mechanism 140 with the spring-loaded screws 125-1, 125-2, leakage from the channel 124 can be reduced, prevented, or eliminated.

[0089] A thermal interface material (TIM) 1211 can be disposed between the substrate 132 of the heat sink 130 and the module 110 (e.g., the DBM substrate of the module 110). In this embodiment, the cover 120 can be coupled to (e.g., screwed to, fixedly coupled to) a sub-component that includes the heat sink 130, the TIM 1211, and the module 110.

[0090] Figure 13 An exploded view of the components included in the module assembly 100 is shown. The module assembly 100 includes a first cover 120A and a second cover 120B. The module assembly 100 includes heat transfer mechanisms 130A-1 to 130A-3 on one side of modules 1310A to 1310C, and heat transfer mechanisms 130B-1 to 130B-3. In this embodiment, the heat transfer mechanisms 130A-1 to 130A-3 and 130B-1 to 130B-3 are heat sinks.

[0091] An inlet opening 121A (and port) and an outlet opening 122A (and port) are included in the cover 120A to facilitate fluid flow through the channels in the covers 120A, 120B. The channel 124B within the cover 120B is shown in Figure 13 and the channel within the cover 120A is not visible in Figure 13 An inlet opening 121B and an outlet opening 122B are included in the cover 120B to facilitate fluid flow to receive and enter the channel 124B from the cover 120A. The inlet opening 121B and the outlet opening 122B are in fluid communication with the channel 124B. When assembled, the inlet opening 121A and the outlet opening 122A are in fluid communication with the channel 124B because the openings 121A and 122A pass through the entire cover 120A (and provide an entrance to the openings 121B, 122B).

[0092] For example, fluid can pass from the inlet opening 121A of the cover 120A through the opening 121B and flow along the double-sided arrow disposed within the channel 124B shown in Figure 13 Fluid can flow from the outlet opening 122B of the cover 120B through the opening 122A of the cover 120A.

[0093] Grooves 1341B-1 to 1341B-3 (also referred to as recesses) for a sealing mechanism are included in the cover 120B. Grooves 1343-1 and 1343-2 (also referred to as recesses) are included in the cover 120B such that the openings 121A, 122A of the cover 120A can be sealed to the openings 121B, 122B of the cover 120B. An O-ring, sealant, or some other material can be disposed in one or more of the grooves 1341B-1 to 1341B-3 and / or 1343-1, 1343-2.

[0094] The covers 120A, 120B respectively include flanges 1365A, 1365B. The covers 120A, 120B (and components included therein or therebetween (e.g., modules)) can be coupled using the flanges 1365A, 1365B. Specifically, coupling mechanisms (such as those described above) (e.g., screws, rivets, etc.) can be used to couple the covers 120A, 120B via the flanges 1365A, 1365B.

[0095] As Figure 13 shown, each of the covers includes an opening associated with each of the modules. For example, an opening 1329B is included in the cover 120B and is associated with the heat sink 130B-3 and the module 13010A. The heat sink 130B-3 can be disposed within the opening 1329B. The opening 1329B is in fluid communication with the channel 124B and the openings 121B and 122B. In this embodiment, the groove 1341B-1 (and / or the sealing mechanism) defines a perimeter around or along the opening 1329B.

[0096] Figure 14 is a schematic side view showing an exemplary module assembly 100, which can be a variant of the module assembly shown in Figure 13 In this schematic, Figure 13 the components of

[0097] Figure 15 and Figure 16 show a side cross-sectional view of an exemplary module assembly 100, which is similar to those module assemblies shown in Figure 13 and Figure 14 and can be a variant of the other module assemblies 100 described above. Shown in Figure 15The module component 100 therein includes a first cover 120A coupled to a second cover 120B. The module component 100 includes a set of heat transfer mechanisms 1530A-1 to 1530A-3 on one side of modules 1510A to 1510C, and a set of heat transfer mechanisms 1530B-1 to 1530B-3. In this embodiment, the heat transfer mechanisms 1530A-1 to 1530A-3 and 1530B-1 to 1530B-3 are cover protrusions. Each of modules 1510A to 1510C can be a module for bilateral cooling and may include one or more DBM substrates (e.g., DBC substrates). Sealing mechanisms 1540 (only a few are marked) are used to seal the elements included in this module component 100.

[0098] An inlet opening 121A (and port) and an outlet opening 122A (and port) are included in the cover 120A to facilitate the flow of fluid through channels 1524A, 1524B in the covers 120A, 120B. The fluid flowing within the module component 100 is shown by arrows. Shown in Figure 15 the covers 120A, 120B therein can be made of, for example, composite plastic materials.

[0099] Shown in Figure 16 the module component 100 therein includes a first cover 120A coupled to a second cover 120B. The module component 100 includes a heat transfer mechanism 1630A on one side of modules 1610A to 1610C, and a heat transfer mechanism 1630B. In this embodiment, the heat transfer mechanisms 1630A, 1630B are heat sinks. Each of modules 1610A to 1610C can be a module for bilateral cooling and may include one or more DBM substrates (e.g., DBC substrates).

[0100] In some embodiments, the heat sinks 1630A, 1630B can be respectively integrated into the covers 120A, 120B. In some embodiments, the heat sinks 1630A, 1630B can be respectively integrally formed within the covers 120A, 120B. In some embodiments, shown in Figure 16 the covers 120A, 120B therein can be made of, for example, metallic materials.

[0101] As Figure 16 shown, the heat sinks 1630A, 1630B span all of the modules 1610A to 1610C. This is achieved by the structures of the inner walls 1625A, 1625B of the covers 120A, 120B respectively. Specifically, the heat sinks are respectively in contact with (e.g., coupled to) the inner walls 1625A, 1625B of the covers 120A, 120B. The inner walls 1625A, 1625B are in contact with the modules 1610A to 1610C. Thus, when the covers 120A, 120B are coupled together, asFigure 16 As shown, inner walls 1625A, 1625B define a cavity 1637 (e.g., a space), and modules 1610A to 1610C are disposed within the cavity. The height of the cavity 1637 can be large enough such that modules 1610A to 1610C can be disposed therein.

[0102] In this embodiment, inner walls 1625A, 1625B can be used as substrates of a heat sink. In some embodiments, one or more of inner walls 1625A, 1625B can be replaced by a substrate of the heat sink. In some embodiments, one or more of inner walls 1625A, 1625B can define portions of channels of corresponding covers 120A, 120B.

[0103] As Figure 16 shown, a thermal interface material is disposed between each of modules 1610A to 1610C and inner walls 1625A, 1625B. For example, thermal interface material 1614A-2 is disposed between inner wall 1625A of cover 120A and module 1610B. Similarly, thermal interface material 1614B-2 is disposed between inner wall 1625B of cover 120B and module 1610B.

[0104] Sealing mechanisms 1640 (only a few are labeled) are used to seal elements included in the module assembly 100. Due to the configuration having the cavity 1637, the sealing mechanisms 1640 are for fluid flow between openings 121A, 122B, but not between modules 1610A to 1610C.

[0105] Figure 17 is a schematic diagram showing covers 120A and 120B, which include cover protrusions 1734 (e.g., protrusions 1734A-1 to 1734A-3 associated with cover 120A, and protrusions 1734B-1 to 1734B-3 associated with cover 120B). Covers 120A, 120B can be used in any of the module assembly embodiments described herein, including the cover protrusions. In this embodiment, the cover protrusions 1734 are columnar structures and are defined within groups that can be respectively associated with each of the modules. For example, cover protrusion 1734A-2 is a group of protrusions that can be associated with a first module, and cover protrusion 1734A-3 is a group of protrusions that can be associated with a second module.

[0106] Figures 18A to 18H shows a method of manufacturing at least some of the heat sink-based module assemblies 100 described herein. The manufacturing process is shown in a cross-sectional view.

[0107] Figure 18AA heat sink 1830 is shown having projections 1834 coupled to a substrate 1832. The projections 1834 (e.g., serpentine projections, nickel-plated copper pin foils) may be coupled to the substrate 1832 (e.g., nickel-plated copper substrate) via solder 1833, which is printed or dispensed on the substrate 1832. After the projections 1834 are coupled to the substrate 1832 via the solder 1833, the solder 1833 may be reflowed.

[0108] Figure 18B A cover 1820A (e.g., top cover) and a cover 1820B (e.g., bottom cover) are shown. Examples of sealing mechanisms 1840 are shown that may be included in grooves 1826A, 1826B (e.g., recesses) of the covers 1820A, 1820B, respectively.

[0109] Figure 18C Heat sinks 1830A, 1830B are shown coupled to covers 1820A, 1820B, where at least a portion of the heat sinks 1830A, 1830B is disposed within channels 1824A, 1824B. The combination of the covers 1820A, 1820B and the heat sinks 1830A, 1830B defines lid assemblies 1870A, 1870B. The cover 1820A includes an inlet opening 122A.

[0110] Figure 18D A module 1810 is shown including DBM substrates 1814A, 1814B. The module 1810 may include one or more semiconductor die.

[0111] Figure 18E A module subassembly 1871 is shown that includes thermal interface material layers 1811A, 1811B formed on at least the DBM substrates of the module 1810 (e.g., printed thereon). In some embodiments, connection pads may be coupled to the DBM substrates instead of the thermal interface material layers 1811A, 1811B.

[0112] Figure 18F A lid assembly 1870B is shown that is coupled to a first side of the module subassembly 1871 (such that the substrate of the heat sink 1830B is coupled to the DBM substrate 1814B via the TIM 1811B). Figure 18G A lid assembly 1870A is shown coupled to a second side of the module subassembly 1871.

[0113] Figure 18H A final module assembly 100 is shown formed via coupling mechanisms 1862-1, 1862-2 that couple the cover 1820A to the cover 1820B. In this embodiment, the coupling mechanisms 1862-1, 1862-2 are disposed within holes (e.g., coupled therein) through the cover 1820A and within grooves within the cover 1820B.

[0114] Figures 19A to 19F Shows a method of manufacturing at least some of the heat sink-based module assemblies 100 described herein. The manufacturing process is shown in a cross-sectional view.

[0115] Figure 19A Shows a module 1910 including DBM substrates 1914A, 1914B. The module 1910 may include one or more semiconductor dies. In this embodiment, the DBM substrates 1914A, 1914B may be plated with a metal (e.g., nickel plated) such that a heat sink can be directly coupled (e.g., bonded) to the DBM substrates 1914A, 1914B before the mounting cover.

[0116] Figure 19B Shows a heat sink 1930A having a protrusion 1934A coupled to the DBM substrate 1914A. The heat sink 1930A is fabricated directly on the module 1910. The protrusion 1934A (e.g., serpentine protrusion, nickel plated copper pin foil) may be coupled to the DBM substrate 1914A via a solder 1933A that is printed or dispensed on the DBM substrate 1914A. After the protrusion 1934A is coupled to the DBM substrate 1914A via the solder 1933A, the solder 1933A may be reflowed.

[0117] Figure 19C Shows a heat sink 1930B having a protrusion 1934B that is coupled to the module 1910 via a solder 1933B using a method similar to that described in connection with the formation of the heat sink 1930A. The subassembly shown in Figure 19C may be referred to as a heat sink-module subassembly 1980.

[0118] Figure 19D and Figure 19E show a cover 1920B (e.g., bottom cover) and a cover 1920A (e.g., top cover) coupled to the heat sink-module subassembly 1980, respectively. In some embodiments, the cover 1920A may be coupled to the heat sink-module subassembly 1980 before the cover 1920B.

[0119] Similar to that described in connection with Figures 18A to 18H a sealing mechanism may be included within the grooves (e.g., recesses) of the shown covers 1920A, 1920B.

[0120] Shown in Figure 19F the final module assembly 100 may be formed via coupling mechanisms 1962-1, 1962-2 that are similar to those described in connection with Figure 18HThe cover 1920A is coupled to the cover 1920B in the manner described above. In this embodiment, the coupling mechanisms 1962-1, 1962-2 are disposed within the holes (e.g., coupled therein) through the cover 1920A and within the grooves within the cover 1920B.

[0121] Figures 20A to 20D A method of fabricating at least some of the cover-bump module assemblies 100 described herein is shown. The fabrication process is shown in cross-section.

[0122] Figure 20A A cover 2020A (e.g., top cover) and a cover 2020B (e.g., bottom cover) having cover bumps 2034A, 2034B are shown. Examples of sealing mechanisms 2040 that may be included within the trenches 2026A, 2026B (e.g., grooves) of the covers 2020A, 2020B, respectively, are shown.

[0123] Figure 20B A cover 1820B coupled to a module 2010 including DBM substrates 2014A, 2014B is shown. The module 2010 may include one or more semiconductor dies. Figure 20C A cover 1820A coupled to the module 2010 is shown. In some embodiments, the cover 2020A may be coupled to the module 2010 before the cover 2020B.

[0124] Shown in Figure 20D The final module assembly 100 may be formed via coupling mechanisms 2062-1, 2062-2 that couple the cover 2020A to the cover 2020B in a manner similar to that described in connection with Figure 18H and Figure 19F The cover 2020A is coupled to the cover 2020B. In this embodiment, the coupling mechanisms 2062-1, 2062-2 are disposed within the holes (e.g., coupled therein) through the cover 2020A and within the grooves within the cover 2020B.

[0125] Figure 21 is a schematic diagram showing an exemplary module 2110. The module 2110 includes DBM substrates 2114A, 2114B. The module 2110 may include one or more semiconductor dies.

[0126] Figure 22 is a flow chart showing a method for fabricating a module assembly described herein. As Figure 22 shown, the method may include forming a module having semiconductor dies and a direct bond metal substrate (block 2200). The semiconductor dies may be encapsulated in a molding material within the module. The direct bond metal substrate may have an inner surface electrically coupled to the semiconductor dies.

[0127] As Figure 22As shown, the method may include coupling a cover around at least a portion of a module such that a heat transfer mechanism is disposed within a channel of the cover between a wall of the cover and the module (block 2210). In some embodiments, the heat transfer mechanism is a heat sink coupled to the cover or the module prior to the cover being coupled around the module. In some embodiments, the heat transfer mechanism includes cover protrusions extending from the cover.

[0128] In at least one general aspect, a device may include a module having a semiconductor die; and a heat sink coupled to the module and including: a substrate, and a plurality of protrusions. The device may include a cover having a channel, wherein the plurality of protrusions of the heat sink are disposed within the channel; and a sealing mechanism disposed between the cover and the module.

[0129] In some embodiments, the cover is a first cover including a first channel, the heat sink is a first heat sink, and the first cover and the first heat sink are on a first side of the module. The device may include a second heat sink coupled to a second side of the module, and a second cover including a second channel, wherein the second heat sink is disposed within the second channel. In some embodiments, the first cover is coupled to the second cover via a coupling mechanism transverse to the module. In some embodiments, the sealing mechanism includes an O-ring disposed within a groove included in the cover. In some embodiments, the module is aligned along a first plane, the sealing mechanism is aligned along a second plane, and the sealing mechanism is disposed along a perimeter of the module. In some embodiments, the heat sink includes a first metal and a second metal. In some embodiments, the module is a dual-sided module including a direct bond metal substrate.

[0130] In another general aspect, a device may include a module including a semiconductor die; and a cover including: a channel, and a plurality of protrusions extending from an inner surface of the cover into the channel. The device may include a sealing mechanism disposed between the cover and the module. In some embodiments, the cover includes an inlet opening and an outlet opening fluidly connected to the inlet opening via the channel.

[0131] In yet another general aspect, a method may include forming a module including: a semiconductor die encapsulated in a molding material, and a direct bond metal substrate having an inner surface electrically coupled to the semiconductor die. The method may include coupling a cover around at least a portion of the module such that a heat transfer mechanism is disposed within a channel of the cover between a wall of the cover and the module. In some embodiments, the heat transfer mechanism includes cover protrusions extending from the cover.

[0132] It will be understood that in the foregoing description, when an element is referred to as being on another element, connected to another element, electrically connected to another element, coupled to another element, or electrically coupled to another element, the element can be directly on the other element, connected or coupled to the other element, or there can be one or more intervening elements. In contrast, when an element is referred to as being directly on another element, directly connected to another element, or directly coupled to another element, there are no intervening elements. Although the terms directly on..., directly connected to..., or directly coupled to... may not be used throughout the detailed description, elements shown as being directly on an element, directly connected or directly coupled may be referred to in such a manner. The claims of the present application, if any, may be amended to recite the exemplary relationships described in the specification or shown in the drawings.

[0133] As used in this specification, unless specifically stated otherwise in context, the singular forms may include the plural forms. In addition to the orientations shown in the drawings, the spatially relative terms (e.g., above, on top of, over, below, under, beneath, etc.) are intended to cover different orientations of the device during use or operation. In some embodiments, the relative terms above and below may respectively include vertically above and vertically below. In some embodiments, the term adjacent may include laterally adjacent or horizontally adjacent.

[0134] Embodiments of the various techniques described herein can be implemented in digital electronic circuitry, or in computer hardware, firmware, software, or in combinations thereof (e.g., including therein). Some embodiments can be implemented using various semiconductor processing and / or packaging techniques. Some embodiments can be implemented using various types of semiconductor processing techniques associated with a semiconductor substrate, which includes but is not limited to, for example, silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), etc.

[0135] Although certain features of the described embodiments have been illustrated as described herein, many modifications, alternative forms, variations, and equivalents will now occur to those skilled in the art. Accordingly, it should be understood that the appended claims are intended to cover all such modifications and variations that fall within the scope of the embodiments. It should be understood that these modifications and variations are presented by way of example only and not by way of limitation, and various changes in form and detail can be made. Except for mutually exclusive combinations, any part of the devices and / or methods described herein can be combined in any combination. The embodiments described herein can include various combinations and / or sub - combinations of the functions, components, and / or features of the different embodiments described.

Claims

1. An apparatus for heat transfer of a module, comprising: The module, which includes a semiconductor die; A heat sink, which is coupled to the module and includes: A substrate, and A plurality of protrusions; A cover that defines a channel outside the module, the plurality of protrusions of the heat sink are disposed within the channel, the cover is disposed around the sides and top of the plurality of protrusions, and at least a portion of the module is exposed outside the cover; and A sealing mechanism that is disposed between the cover and the substrate of the heat sink and contacts the substrate.

2. The apparatus according to claim 1, wherein the cover includes an inlet opening and an outlet opening that is in fluid communication with the inlet opening via the channel.

3. The apparatus according to claim 1, wherein the module is a first module and the heat sink is a first heat sink, The apparatus further includes: A second module; And A second heat sink that is coupled to the second module, the second heat sink having a plurality of protrusions within the channel, and the first heat sink and the second heat sink are aligned along the channel.

4. The apparatus according to claim 1, wherein the plurality of protrusions includes at least one protrusion having an end separated from the inner surface of the channel by a gap.

5. The apparatus according to claim 1, further comprising: A coupling mechanism that couples the cover to the substrate of the heat sink.

6. An apparatus for heat transfer of a module, comprising: The module, which includes a semiconductor die; A cover that includes: A channel that is in fluid communication with the outer surface of the module, and A plurality of protrusions that extend from the inner surface of the cover into the channel; And A sealing mechanism that is disposed between the cover and the module and contacts the module, and at least a portion of the module is exposed outside the cover.

7. The apparatus according to claim 6, wherein the end of at least one of the plurality of protrusions is separated from the surface of the module by a gap.

8. The apparatus according to claim 6, wherein the cover includes an inlet opening and an outlet opening that is in fluid communication with the inlet opening via the channel, the module is a first module, The apparatus further includes: A second module, and the first module and the second module are aligned along the channel between the inlet opening and the outlet opening.

9. A method for heat transfer of a module, comprising: Forming the module, which includes: A semiconductor die encapsulated in a molding material, and A direct bond metal substrate having an inner surface electrically coupled to the semiconductor die; and Coupling a cover around at least a portion of the module such that a heat transfer mechanism is disposed within the channel of the cover between the wall of the cover and the module, the channel being outside the module, the cover being disposed around the sides and top of a plurality of protrusions of the heat transfer mechanism, and at least a portion of the module being exposed outside the cover.

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