Experimental device integrating three laser processing technologies

Abstract

The present invention discloses an experimental device integrating three laser processing technologies, including an ultrafast laser, a carbon dioxide laser, a first group of reflectors located on the light transmission path of the laser emitted by the ultrafast laser, a second group of reflectors located on the light transmission path of the laser emitted by the carbon dioxide laser, an XY axis motion platform and a Z axis motion platform, the XY axis motion platform is provided with a workpiece that can be moved with it, and the Z axis motion platform is provided with a first galvanometer component, a second galvanometer component, a carbon dioxide mirror seat component and a laser cutting component that can be moved with it for processing the workpiece. The present invention integrates three different processes of trimming, chamfering and punching into one experimental device, and uses multiple reflectors to form different light propagation routes, and then uses different laser light paths to complete different processing technologies, effectively reducing the number of equipment, saving equipment floor space and cost, and effectively improving experimental processing efficiency.

Description

Technical Field

[0001] The invention relates to hard and brittle material processing equipment, in particular to an experimental device integrating three laser processing technologies. Background Art

[0002] Ultrashort pulse lasers are widely used in the processing of hard and brittle materials due to their short pulse time, high peak energy, small heat-affected zone, and better "cold" processing. Ultrashort pulse lasers are often used in the processing of hard and brittle materials such as edge trimming, chamfering, and drilling. Existing workpiece processing requires the use of multiple laser processing equipment to complete different types of processing techniques, which requires a large equipment footprint, high cost, and low efficiency.

[0003] Therefore, it is urgent to solve the above problems. Summary of the invention

[0004] Purpose of the invention: The purpose of the present invention is to provide an experimental device integrating three laser processing technologies, which can utilize multiple laser light paths to complete different processing technologies, reduce the number of equipment, save equipment floor space and cost, and effectively improve experimental processing efficiency.

[0005] Technical solution: To achieve the above objectives, the present invention discloses an experimental device integrating three laser processing technologies, including an ultrafast laser, a carbon dioxide laser, a first group of reflectors located on the light transmission path of the laser emitted by the ultrafast laser, a second group of reflectors located on the light transmission path of the laser emitted by the carbon dioxide laser, an XY-axis motion platform and a Z-axis motion platform, the XY-axis motion platform being provided with a workpiece that can be moved therewith, and the Z-axis motion platform being provided with a first galvanometer assembly, a second galvanometer assembly, a carbon dioxide mirror seat assembly and a laser cutting assembly that can be moved therewith for processing the workpiece.

[0006] It also includes a vibration isolation optical platform, on which a gantry frame for placing a Z-axis motion platform is provided. The ultrafast laser, the carbon dioxide laser and the XY-axis motion platform are all arranged on the vibration isolation optical platform.

[0007] Furthermore, it also includes a light shutter located at the light output point of the carbon dioxide laser.

[0008] Preferably, the first group of reflectors includes a first reflector, a second reflector, a third reflector, a fourth reflector, a fifth reflector, a sixth reflector, a seventh reflector and an eighth reflector, wherein the first reflector, the second reflector, the third reflector, the fourth reflector, the fifth reflector and the seventh reflector are arranged in sequence according to the light emitting direction of the ultrafast laser, the direction of the light beam when processing the workpiece and the spatial position of the experimental device to form a first laser propagation path, and transmit the laser to the first galvanometer assembly for processing the workpiece; the first reflector, the second reflector, the third reflector, the fourth reflector, the fifth reflector and the sixth reflector are arranged in sequence according to the light emitting direction of the ultrafast laser, the direction of the light beam when processing the workpiece and the spatial position of the experimental device to form a second laser propagation path, and transmit the laser to the second galvanometer assembly for processing the workpiece; the first reflector, the second reflector, the third reflector, the fourth reflector, the fifth reflector and the eighth reflector are arranged in sequence according to the light emitting direction of the ultrafast laser, the direction of the light beam when processing the workpiece and the spatial position of the experimental device to form a third laser propagation path, and transmit the laser to the laser cutting assembly for processing the workpiece.

[0009] Furthermore, the second group of reflectors includes a ninth reflector, a tenth reflector, an eleventh reflector and a twelfth reflector, which are arranged in sequence according to the light emitting direction of the carbon dioxide laser, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a fourth laser propagation path, and transmit the laser to the carbon dioxide mirror holder assembly for processing the workpiece.

[0010] Furthermore, the first galvanometer assembly includes a first connecting base plate, and a first galvanometer, a first field mirror and a thirteenth reflecting mirror all located on the first connecting base plate, wherein the thirteenth reflecting mirror is used to reflect the laser light emitted by the ultrafast laser and transmit it to the first field mirror for processing the workpiece.

[0011] Preferably, the second galvanometer assembly includes a second connecting base plate, and a second galvanometer, a second field mirror and a fourteenth reflector all located on the second connecting base plate, wherein the fourteenth reflector is used to reflect the laser light emitted by the ultrafast laser and transmit it to the second field mirror for processing the workpiece.

[0012] Furthermore, the carbon dioxide mirror seat assembly includes a laser head adjustment block and a guide block fixed on the Z-axis motion platform, and a laser head mounting block installed with a carbon dioxide mirror seat, which is bolted to the laser head adjustment block and can move up and down along the Z-axis motion platform. The laser head mounting block is provided with a slide groove adapted to the guide block and a bar hole for connecting to the Z-axis motion platform, and the laser head mounting block can be movably connected to the Z-axis motion platform through screws and the bar hole.

[0013] Furthermore, the laser cutting assembly includes a laser cutting head and a connecting assembly for clamping the laser cutting head and fixed at intervals on the Z-axis motion platform. The connecting assembly includes an upper pressing block and a lower pressing block with a semicircular structure that are engaged with each other.

[0014] Preferably, the Z-axis motion platform is also provided with a microscope camera for observing the quality of the processed surface of the workpiece. The microscope camera is fixed to the Z-axis motion platform through a camera bracket. The camera bracket includes two vertical frames fixed to the Z-axis motion platform and arranged opposite to each other, and a crossbeam located between the two vertical frames.

[0015] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: the present invention integrates three different processes of edge trimming, chamfering and punching into one experimental device, and uses multiple reflectors to form different light propagation routes, and then uses different laser light paths to complete different processing techniques, effectively reducing the number of equipment, saving equipment floor space and costs, and effectively improving experimental processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 It is a front view of the present invention;

[0018] Figure 3 It is a structural schematic diagram of the gantry frame in the present invention;

[0019] Figure 4 It is a schematic diagram of the assembly of some components in the present invention;

[0020] Figure 5 is a schematic structural diagram of the first galvanometer assembly in the present invention;

[0021] Figure 6 is a schematic structural diagram of the second galvanometer assembly in the present invention;

[0022] Figure 7 It is a structural schematic diagram of the carbon dioxide mirror base assembly in the present invention;

[0023] Figure 8 It is a schematic diagram of the structure of the laser cutting assembly in the present invention;

[0024] Fig. 9 This is a schematic diagram of the installation of the microscope camera in the present invention;

[0025] Fig.10 It is a schematic diagram of the structure of the beam expander assembly in the present invention. DETAILED DESCRIPTION

[0026] The technical solution of the present invention is further described below in conjunction with the accompanying drawings.

[0027] like Figure 1 and Figure 2 As shown, an experimental device integrating three laser processing technologies of the present invention comprises an ultrafast laser 1, a carbon dioxide laser 2, an XY axis motion platform 3, a Z axis motion platform 4, a first galvanometer assembly 5, a second galvanometer assembly 6, a carbon dioxide mirror seat assembly 7, a laser cutting assembly 8, a vibration isolation optical platform 9, a gantry frame 10, a first reflector 11, a second reflector 12, a third reflector 13, a fourth reflector 14, a fifth reflector 15, a sixth reflector 16, a seventh reflector 17, an eighth reflector 18, a ninth reflector 19, a tenth reflector 20, an eleventh reflector 21, a twelfth reflector 22, a microscope camera 23, a camera bracket 24, an optical shutter 25, a beam expander lens group 26, a first workpiece 27, a second workpiece 28 and a third workpiece 29. The ultrafast laser 1, the carbon dioxide laser 2, the XY-axis motion platform 3, the gantry frame 10, the first reflector 11, the second reflector 12, the third reflector 13, the fourth reflector 14, the ninth reflector 19, the tenth reflector 20, the optical shutter 25 and the beam expander group 26 of the present invention are all arranged on a vibration isolation optical platform 9.

[0028] The XY-axis motion platform 3 of the present invention includes an X-axis motion platform driven by an X-axis motor and a Y-axis motion platform driven by a Y-axis motor. A first workpiece 27, a second workpiece 28 and a third workpiece 29 are mounted on the XY-axis motion platform 3 through a fixture 30, and the first workpiece 27, the second workpiece 28 and the third workpiece 29 can all move back and forth along the X-axis and the Y-axis with the XY-axis motion platform 3.

[0029] like Figure 3 As shown, the gantry frame 10 of the present invention includes an upper breadboard 1001 located at the crossbeam, a left connecting plate 1002 located at the column, and a balancing cylinder 1003, wherein the upper breadboard 1001 is used to install the fifth reflector 15, the sixth reflector 16, the seventh reflector 17, the eighth reflector 18, the tenth reflector 20, and the eleventh reflector 21, and a reserved hole is provided on the left connecting plate 1002, which can be directly installed when adding optical parts later without additional holes, and the balancing cylinder 1003 is used to balance the weight of the movable parts on the Z-axis motion platform. Figure 4 As shown, the Z-axis motion platform 4 of the present invention is arranged on the gantry frame 10, and is driven by a servo motor and a roller screw to realize the up and down movement of the Z-axis motion platform 4 along the gantry frame 10. The Z-axis motion platform 4 includes a Z-axis slide plate 401, on which a first galvanometer assembly 5, a second galvanometer assembly 6, a carbon dioxide mirror seat assembly 7 and a laser cutting assembly 8 are installed, and the first galvanometer assembly 5, the second galvanometer assembly 6, the carbon dioxide mirror seat assembly 7 and the laser cutting assembly 8 can move up and down along the Z axis with the Z-axis motion platform 4.

[0030] like Figure 5 As shown, the first galvanometer assembly 5 includes a first connecting base plate 501 fixedly connected to the Z-axis slide 401, and a first galvanometer 502, a first field mirror 503 and a thirteenth reflector 504 all located on the first connecting base plate 501, wherein the thirteenth reflector 504 is used to reflect the laser light emitted by the ultrafast laser 1 and transmit it to the first field mirror 503 for processing the workpiece, wherein the first galvanometer 502 can be a 14mm galvanometer. Figure 6 As shown, the second galvanometer assembly 6 includes a second connecting base plate 601 fixedly connected to the Z-axis slide 401, and a second galvanometer 602, a second field mirror 603 and a fourteenth reflector 604 all located on the second connecting base plate 601, wherein the fourteenth reflector 604 is used to reflect the laser emitted by the ultrafast laser 1 and transmit it to the second field mirror 603 for processing the workpiece, and the second galvanometer 602 can be a 10 mm galvanometer. Figure 7 As shown, the carbon dioxide mirror seat assembly 7 includes a laser head adjustment block 701 and a guide block 702 fixed on the Z-axis slide 401, and a laser head mounting block 704 with a carbon dioxide mirror seat 703 installed, which is bolted to the laser head adjustment block 701 and can move up and down along the Z-axis slide 401. The laser head mounting block 704 is provided with a slide groove adapted to the guide block 702 and a bar hole 705 for connecting the Z-axis slide 401. The laser head mounting block 704 is movably connected to the Z-axis slide 401 through screws and the bar hole 705; loosen the two screws passing through the bar hole 705 for fixing the laser head mounting block 704, and adjust the bolts 706 on the laser head adjustment block 701 at the same time, so that the laser head mounting block 704 moves up and down along the guide block 702. Figure 8 As shown, the laser cutting assembly 8 includes a laser cutting head 801 and a connecting assembly for clamping the laser cutting head 801 and fixed at intervals on the Z-axis slide 401. The connecting assembly includes an upper pressing block 802 and a lower pressing block 803 with a semicircular structure that are engaged with each other. The lower pressing block 803 is fixedly connected to the Z-axis slide 401 by screws.

[0031] The first reflector 11, the second reflector 12, the third reflector 13, the fourth reflector 14, the fifth reflector 15, the sixth reflector 16, the seventh reflector 17 and the eighth reflector 18 of the present invention constitute a first group of reflectors, and the first group of reflectors is located on the light transmission path of the laser emitted by the ultrafast laser 1. The ninth reflector 19, the tenth reflector 20, the eleventh reflector 21 and the twelfth reflector 22 of the present invention constitute a second group of reflectors, and the second group of reflectors is located on the light transmission path of the laser emitted by the carbon dioxide laser 2.

[0032] The first reflector 11, the second reflector 12, the third reflector 13, the fourth reflector 14, the fifth reflector 15 and the seventh reflector 17 of the present invention are arranged in sequence according to the light emitting direction of the ultrafast laser 1, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a first laser propagation path, and transmit the laser to the first field mirror 503 of the first galvanometer assembly 5 to perform drilling processing on the third workpiece 29.

[0033] The first reflector 11, the second reflector 12, the third reflector 13, the fourth reflector 14, the fifth reflector 15 and the sixth reflector 16 of the present invention are arranged in sequence according to the light emitting direction of the ultrafast laser 1, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a second laser propagation path, and transmit the laser to the second field mirror 603 of the second galvanometer assembly 6 to perform chamfering on the second workpiece 28. The first galvanometer assembly 5 and the second galvanometer assembly 6 of the present invention can be interchanged for processing, that is, the first galvanometer assembly 5 can perform a punching process or a chamfering process; the second galvanometer assembly 6 can also perform a chamfering process or a punching process. However, since the energy required for the laser is different for the two processing processes, if the first galvanometer assembly 5 performs a chamfering process or the second galvanometer assembly 6 performs a punching process, it is necessary to retest and set a series of parameters such as laser power and Z-axis height, and the quality of the product after the processing process also needs to be re-inspected. In the present invention, the first galvanometer assembly 5 performs a punching process and the second galvanometer assembly 6 performs a chamfering process, which is the optimal process solution.

[0034] The first reflector 11, the second reflector 12, the third reflector 13, the fourth reflector 14, the fifth reflector 15 and the eighth reflector 18 of the present invention are arranged in sequence according to the light emitting direction of the ultrafast laser 1, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a third laser propagation path, and transmit the laser to the laser cutting head 801 of the laser cutting assembly 8 to perform pre-trimming processing on the first workpiece 27.

[0035] The ninth reflector 19, the tenth reflector 20, the eleventh reflector 21 and the twelfth reflector 22 of the present invention are arranged in sequence according to the light emitting direction of the carbon dioxide laser 2, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a fourth laser propagation path, and transmit the laser to the carbon dioxide mirror seat 703 of the carbon dioxide mirror seat assembly 7 to perform post-processing of trimming the first workpiece 27.

[0036] like Fig. 9The Z-axis slide plate 401 of the Z-axis motion platform 4 of the present invention is also equipped with a microscope camera 23 for observing the quality of the processed surface of the workpiece. The microscope camera 23 is fixed to the Z-axis slide plate 401 through a camera bracket 24, wherein the microscope camera 23 is fixedly connected to the camera bracket 24 through a pressing block. The camera bracket includes two vertical frames fixedly arranged opposite to the Z-axis motion platform, and a crossbeam located between the two vertical frames. The microscope camera 23 can be used for early debugging to facilitate observation of the quality of the processed surface of the parts. There are two microscope cameras 23, which are respectively located above the second workpiece 28 and the third workpiece 29, and the microscope camera 23 can be used to achieve precise positioning.

[0037] The light outlet of the carbon dioxide laser 2 of the present invention is also provided with an optical shutter 25, which is placed in front of the carbon dioxide laser 2 and mainly functions to control the passage and disconnection of the laser. In this way, the carbon dioxide laser can remain in the on state and emit light stably all the time, and only the opening and closing of the optical shutter needs to be controlled.

[0038] like Figure 1 and Fig.10 As shown, the present invention is provided with a beam expander group 26 between the second reflector 12 and the third reflector 13. The beam expander group 26 of the present invention comprises a sliding rail 2601 fixedly connected to the vibration isolation optical platform 9, and a plurality of rail bases 2602 that can slide back and forth along the sliding rail 2601, and each rail base 2602 is sequentially connected with a beam expander column 2603 and a beam expander 2604; wherein a waist-shaped hole is provided on the sliding rail 2601, and is fixedly connected to the vibration isolation optical platform 9 through bolts and the waist-shaped hole, and the beam expander group 26 can increase the beam diameter emitted by the laser through beam expansion, and the ultimate goal is to make the focused light spot smaller.

Claims

1. An experimental device integrating three laser processing technologies, characterized in that: The invention comprises an ultrafast laser (1), a carbon dioxide laser (2), a first group of reflectors located on the light transmission path of the laser light emitted by the ultrafast laser (1), a second group of reflectors located on the light transmission path of the laser light emitted by the carbon dioxide laser (2), an XY axis motion platform (3) and a Z axis motion platform (4); the XY axis motion platform (3) is provided with a workpiece for placing the workpiece that can move with the XY axis motion platform (3); the Z axis motion platform (4) is provided with a first galvanometer assembly (5), a second galvanometer assembly (6), a carbon dioxide mirror seat assembly (7) and a laser cutting assembly (8) that can move with the Z axis motion platform (4) for processing the workpiece; the first group of reflectors comprises a first reflector (11), a second reflector (12), a second reflector (13) and a second galvanometer assembly (6); three reflectors (13), a fourth reflector (14), a fifth reflector (15), a sixth reflector (16), a seventh reflector (17) and an eighth reflector (18), wherein the first reflector (11), the second reflector (12), the third reflector (13), the fourth reflector (14), the fifth reflector (15) and the seventh reflector (17) are arranged in sequence according to the light emitting direction of the ultrafast laser, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a first laser propagation path, and transmit the laser to the first galvanometer assembly (5) for processing the workpiece; the first galvanometer assembly (5) comprises a first connecting base plate (501), and a first galvanometer ( 502), a first field mirror (503) and a thirteenth reflecting mirror (504), wherein the thirteenth reflecting mirror (504) is used to reflect the laser light emitted by the ultrafast laser (1) and transmit it to the first field mirror (503) for processing the third workpiece (29); the first reflecting mirror (11), the second reflecting mirror (12), the third reflecting mirror (13), the fourth reflecting mirror (14), the fifth reflecting mirror (15) and the sixth reflecting mirror (16) are arranged in sequence according to the light emitting direction of the ultrafast laser, the light beam direction when processing the workpiece and the spatial position of the experimental device to form a second laser propagation path, and transmit the laser light to the second galvanometer assembly (6) for processing the workpiece; the second galvanometer assembly (6) includes a second connecting base plate (601), and A second galvanometer (602), a second field mirror (603) and a fourteenth reflector (604) are all located on the second connecting base plate (601), wherein the fourteenth reflector (604) is used to reflect the laser light emitted by the ultrafast laser (1) and transmit it to the second field mirror (603) for processing the second workpiece (28); the first reflector (11), the second reflector (12), the third reflector (13), the fourth reflector (14), the fifth reflector (15) and the eighth reflector (18) are arranged in sequence according to the light emission direction of the ultrafast laser, the direction of the light beam when processing the workpiece and the spatial position of the experimental device to form a third laser propagation path, and transmit the laser light to the laser cutting assembly (8) for processing the first workpiece (27);The laser cutting assembly (8) comprises a laser cutting head (801) and a connecting assembly for clamping the laser cutting head (801) and fixed at intervals on the Z-axis motion platform (4), the connecting assembly comprising an upper pressing block (802) and a lower pressing block (803) with a semicircular structure that engage with each other; the second group of reflectors comprises a ninth reflector (19), a tenth reflector (20), an eleventh reflector (21) and a twelfth reflector (22), and are arranged in sequence according to the light emitting direction of the carbon dioxide laser, the direction of the light beam when processing the workpiece and the spatial position of the experimental device to form a fourth laser propagation path, and transmit the laser to the carbon dioxide mirror seat assembly (7) for The invention relates to a method for processing a first workpiece (27); the carbon dioxide mirror seat assembly (7) comprises a laser head adjustment block (701) and a guide block (702) fixed on a Z-axis motion platform (4); and a laser head mounting block (704) which is bolted to the laser head adjustment block (701) and can be moved up and down along the Z-axis motion platform (4) and is mounted with a carbon dioxide mirror seat (703); the laser head mounting block (704) is provided with a slide groove matched with the guide block (702) and a strip hole (705) for connecting to the Z-axis motion platform; the laser head mounting block (704) is movably connected to the Z-axis motion platform (4) through screws and the strip hole (705). ; 2. The experimental device integrating three laser processing technologies according to claim 1, characterized in that: It also comprises a vibration isolation optical platform (9), on which a gantry frame (10) for placing a Z-axis motion platform (4) is provided, and the ultrafast laser (1), the carbon dioxide laser (2) and the XY-axis motion platform (3) are all arranged on the vibration isolation optical platform (9).

3. The experimental device integrating three laser processing technologies according to claim 1, characterized in that: A light shutter (25) is also provided at the light outlet of the carbon dioxide laser (2).

4. The experimental device integrating three laser processing technologies according to claim 1, characterized in that: The Z-axis motion platform (4) is also provided with a microscope camera (23) for observing the quality of the processed surface of the workpiece. The microscope camera (23) is fixed to the Z-axis motion platform (4) via a camera bracket (24). The camera bracket (24) includes two vertical frames fixedly arranged opposite to the Z-axis motion platform, and a crossbeam located between the two vertical frames.

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