Evaporation method, method for manufacturing electronic device, and evaporation apparatus

Abstract

The present application provides a kind of even if substrate large-scale also can inhibit film blur evaporation method, the manufacturing method of electronic equipment and evaporation device.In the evaporation method of the present application, the substrate is positioned in the state of standing, and the mask composed of multiple long strip-shaped masks (310) is configured on the main surface side of the substrate, the evaporation source is moved relative to the substrate and the mask, and the film is formed on the main surface of the substrate through the multiple opening portions (311) formed in the multiple long strip-shaped masks (310) respectively, characterized in that the multiple opening portions (311) are all composed of rectangular openings, and when the film is formed, the evaporation source is moved in the direction consistent with the long side direction of the opening portion (311).

Description

Technical Field

[0001] This invention relates to a vapor deposition method for forming a film on a substrate, a method for manufacturing electronic devices, and a vapor deposition apparatus. Background Technology

[0002] In recent years, the size of substrates in electronic devices such as organic EL (Organic Electron) displays has been increasing. Therefore, when forming films on substrates, the deflection caused by the weight of the substrate or mask cannot be ignored. That is, if an organic film is formed on a substrate while it is deflected, a so-called "film blurring" will occur, where the shape and size of the openings in the mask are not fully formed. Therefore, in display devices, for example, film blurring results in color mixing and reduced brightness, making it difficult to achieve high image resolution.

[0003] Therefore, as a countermeasure against substrate deflection, a technique for vapor deposition in a state where the substrate is upright has been developed; as a countermeasure against mask deflection, a technique for arranging and configuring multiple elongated masks has been developed.

[0004] However, no technology has been found that comprehensively considers multiple conditions in order to suppress membrane blurring, and there is still room for improvement.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Korean Patent Publication No. 10-2018-7430 Summary of the Invention

[0008] The purpose of this invention is to provide a vapor deposition method, a method for manufacturing electronic devices, and a vapor deposition apparatus that can suppress film blurring even when the substrate is large-scale.

[0009] Methods for solving problems

[0010] The present invention employs the following means to solve the above-mentioned problems.

[0011] The vapor deposition method of the present invention is as follows:

[0012] The substrate is positioned in an upright state, and a mask consisting of multiple elongated masks is disposed on the main surface of the substrate. An evaporation source, moving relative to the substrate and the masks, deposits a film on the main surface of the substrate through multiple openings formed in the elongated masks. The method is characterized in that...

[0013] Each of the aforementioned openings is composed of a rectangular opening.

[0014] During film formation, the evaporation source is moved in a direction consistent with the long side direction of the opening.

[0015] In addition, other vapor deposition methods of the present invention are as follows:

[0016] The substrate is positioned in an upright state, and a mask consisting of multiple elongated masks is disposed on the main surface of the substrate. An evaporation source, moving relative to the substrate and the masks, deposits a film on the main surface of the substrate through multiple openings formed in the elongated masks. The method is characterized in that...

[0017] A plurality of evaporation sources are arranged in a column along the long side of the elongated mask, and film formation is performed while moving the plurality of evaporation sources in a direction parallel to the main surface of the substrate and perpendicular to the long side of the elongated mask.

[0018] Furthermore, the method for manufacturing the electronic device of the present invention is characterized by having:

[0019] The process of transferring the substrate and mask into a chamber equipped with an evaporation source; and

[0020] The process of forming an organic film on the substrate using any of the above-described vapor deposition methods.

[0021] In addition, the vapor deposition apparatus of the present invention includes:

[0022] A substrate positioning mechanism that positions the substrate in an upright position.

[0023] A mask positioning mechanism, wherein a mask composed of multiple elongated masks is disposed on the main surface side of a substrate positioned by the substrate positioning mechanism; and

[0024] An evaporation source moving mechanism that moves the evaporation source parallel and linearly to the main surface of the substrate positioned by the substrate positioning mechanism.

[0025] The vapor deposition apparatus moves the evaporation source via the evaporation source moving mechanism while depositing a film on the main surface of the substrate through multiple openings formed in the multiple elongated masks, characterized in that...

[0026] Each of the aforementioned openings is composed of a rectangular opening, and,

[0027] The direction of movement of the evaporation source based on the evaporation source moving mechanism is consistent with the direction of the long side of the opening.

[0028] Furthermore, another vapor deposition apparatus of the present invention includes:

[0029] A substrate positioning mechanism that positions the substrate in an upright position.

[0030] A mask positioning mechanism, wherein a mask composed of multiple elongated masks is disposed on the main surface side of a substrate positioned by the substrate positioning mechanism; and

[0031] An evaporation source moving mechanism that moves the evaporation source parallel and linearly to the main surface of the substrate positioned by the substrate positioning mechanism.

[0032] The vapor deposition apparatus moves the evaporation source via the evaporation source moving mechanism while depositing a film on the main surface of the substrate through multiple openings formed in the multiple elongated masks, characterized in that...

[0033] The evaporation sources are arranged in multiple columns along the long side of the elongated mask, and...

[0034] The evaporation sources are moved by the evaporation source moving mechanism in a direction perpendicular to the long side of the elongated mask.

[0035] The effects of the invention

[0036] As explained above, according to the present invention, even when the substrate is enlarged, film blurring can be suppressed. Attached Figure Description

[0037] Figure 1 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 1 of the present invention, viewed from above.

[0038] Figure 2 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 1 of the present invention, viewed from the back side.

[0039] Figure 3 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 1 of the present invention, viewed from the side.

[0040] Figure 4 This is an explanatory diagram of the substrate positioning mechanism according to Embodiment 1 of the present invention.

[0041] Figure 5 This is an explanatory diagram of the mask positioning mechanism according to Embodiment 1 of the present invention.

[0042] Figure 6 This is an explanatory diagram of the mask positioning mechanism according to Embodiment 1 of the present invention.

[0043] Figure 7 This is a schematic structural diagram of the evaporation source of Embodiment 1 of the present invention, viewed from above.

[0044] Figure 8 This is a schematic structural diagram of the evaporation source of Embodiment 1 of the present invention, viewed from the front side.

[0045] Figure 9This is an explanatory diagram showing a specific example of an organic film formed on a substrate according to Embodiment 1 of the present invention.

[0046] Figure 10 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 2 of the present invention viewed from above.

[0047] Figure 11 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 2 of the present invention, viewed from the back side.

[0048] Figure 12 This is a schematic structural diagram of the vapor deposition apparatus of Embodiment 2 of the present invention, viewed from the side.

[0049] Figure 13 This is an explanatory diagram regarding the accuracy of film formation in relation to the positional relationship between the opening and the evaporation source.

[0050] Figure 14 This is an explanatory diagram showing the relationship between the long side direction of the opening and the moving direction of the evaporation source.

[0051] Figure 15 This is an explanatory diagram showing the relationship between the direction of the long side of the elongated mask and the direction of the long side of the opening.

[0052] Figure 16 This is an explanatory diagram showing the relationship between the direction of the long side of a strip-shaped mask and the vertical direction.

[0053] Figure 17 This is an explanatory diagram showing the relationship between the direction of the long side of the elongated mask and the direction of movement of the evaporation source.

[0054] Figure 18 It is a table that summarizes whether various conditions are met.

[0055] Explanation of reference numerals in the attached figures

[0056] 10, 10A… Evaporation apparatus, 200… Substrate, 300… Mask, 310… Strip mask, 311… Opening, 400… Evaporation source apparatus, 410… Evaporation source unit, 413… Evaporation source Detailed Implementation

[0057] Hereinafter, with reference to the accompanying drawings, illustrative details of embodiments for carrying out the present invention will be provided. However, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc., of the constituent components described in these embodiments do not imply that the scope of the present invention is limited thereto.

[0058] The vapor deposition method of the present invention can be applied to vapor deposition apparatuses configured such that the evaporation source moves in the vertical direction or in the horizontal direction. First, these vapor deposition apparatuses will be described respectively (the former as Example 1 and the latter as Example 2). It should be noted that in the following description, the main surface of the substrate refers to the surface on which the film is formed. Furthermore, in the vapor deposition apparatus, a mask is disposed on the main surface side of the substrate, and the evaporation source is disposed on the side opposite to the substrate, separated by the mask. In the following description, the view of various structures from the substrate side toward the mask and the evaporation source is referred to as "view from the front side," and the view of various structures from the opposite side is referred to as "view from the back side."

[0059] <Example 1 of the vapor deposition apparatus>

[0060] Reference Figures 1 to 8 The vapor deposition apparatus of Embodiment 1 of the present invention will be described. Figures 1-3 This is a schematic structural diagram of the vapor deposition apparatus according to Embodiment 1 of the present invention, which schematically shows the main structure of the vapor deposition apparatus. It should be noted that... Figure 1 This is a diagram showing the vapor deposition apparatus from above. Figure 2 This is a diagram showing the vapor deposition apparatus from the back side. Figure 3 This is a side view of the vapor deposition apparatus. Figure 4 Figure (a) is an explanatory diagram of the substrate positioning mechanism of Embodiment 1 of the present invention. Figure (b) is a view of the substrate and the substrate positioning mechanism inside the vapor deposition apparatus from the back side of the vapor deposition apparatus. Figure (c) is a view of the substrate and the substrate positioning mechanism inside the vapor deposition apparatus from the side side of the vapor deposition apparatus. Figure 5 and Figure 6 This is an explanatory diagram of the mask positioning mechanism according to Embodiment 1 of the present invention. Figure 5 (a) is a diagram showing the mask positioning mechanism inside the vapor deposition apparatus as viewed from the back side. Figure 5 (b) is a diagram showing the mask positioning mechanism inside the vapor deposition apparatus as viewed from the side. Figure 6 This is a diagram showing the installation method of a long strip mask. Figure 7 and Figure 8 This is a schematic structural diagram of the evaporation source according to Embodiment 1 of the present invention, which schematically shows the main structure of the evaporation source. It should be noted that... Figure 7 This is a diagram showing the evaporation source from above. Figure 8 This is a diagram showing the evaporation source viewed from the front side.

[0061] The vapor deposition apparatus 10 includes a chamber 100 and an evaporation source device 400. The chamber 100 is configured to be in a near-vacuum state by a vacuum pump (not shown), and the evaporation source device 400 is disposed inside the chamber 100. Inside the chamber 100, a substrate 200 is positioned in an upright state, and a mask 300 is disposed on the main surface side of the substrate 200. The evaporation source device 400 performs the following function: by heating the material to be vapor deposited onto the substrate 200, the material is evaporated or sublimated, and the evaporated or sublimated material O is sprayed onto the substrate 200.

[0062] In the figures, arrows X and Y represent the horizontal direction, and arrow Z represents the vertical direction. Additionally, arrow Y represents the normal direction relative to the main surface of substrate 200, indicating the direction from the evaporation source device 400 toward substrate 200, and arrow X represents the direction perpendicular to this direction.

[0063] <<Substrate Positioning Mechanism>>

[0064] Special reference Figure 4 The positioning mechanism of the substrate 200 will be described below. The substrate 200 is fixed to a substrate frame 210, which is configured to reciprocate freely relative to the direction of arrow X. A guide rod 220 is fixed to the lower end of the substrate frame 210, and a guide rail 240 is fixed to the upper end. The guide rod 220 is configured to be movable while being guided by a plurality of first guide rollers 230, which are arranged in a row in the X direction. The guide rail 240 is configured to be movable while being guided by a plurality of second guide rollers 250, which are arranged in a row in the X direction. Furthermore, the first guide rollers 230, guide rod 220, guide rail 240, and second guide rollers 250 are arranged in a row in the vertical direction. With the above structure, the substrate 200 fixed to the substrate frame 210 can be positioned in a vertically upright state and can reciprocate in the direction of arrow X.

[0065] <<Mask Positioning Mechanism>>

[0066] Special reference Figure 5 and Figure 6The positioning mechanism of the mask 300 will be described below. The mask 300 is fixed to a mask frame 320, which is configured to reciprocate freely relative to the X-direction of the arrow. A guide rod 330 is fixed to the lower end of the mask frame 320, and a guide rail 360 is fixed to the upper end. The guide rod 330 is configured to move while being guided by a plurality of third guide rollers 340, which are arranged in a row in the X-direction. The guide rail 360 is configured to move while being guided by a plurality of fourth guide rollers 370, which are arranged in a row in the X-direction. Furthermore, the third guide rollers 340, guide rod 330, guide rail 360, and fourth guide rollers 370 are arranged in a row in the vertical direction. With the above structure, the mask 300, fixed to the mask frame 320, is positioned in an upright state in the vertical direction and can reciprocate in the X-direction of the arrow.

[0067] Furthermore, the plurality of third guide rollers 340 and fourth guide rollers 370 are configured to be positioned by the first alignment mechanism 350 and the second alignment mechanism 380, respectively. Thus, the mask frame 320 is configured to be positionally adjustable in the X direction, the Z direction, and in a direction of rotation within the XZ plane. The mechanisms used for such alignment adjustments are known technologies, as disclosed in Japanese Patent Application Publications Nos. 2012-72478 and 2012-140671, and therefore detailed descriptions are omitted. As described above, the position of the mask frame 320 can be adjusted by the first alignment mechanism 350 and the second alignment mechanism 380, thus enabling the alignment of the mask 300 relative to the substrate 200.

[0068] Furthermore, the mask 300 in this embodiment is composed of a plurality of elongated masks 310. Regarding its structure, please refer specifically to... Figure 6 The mask frame 320 is constructed of a plate-like member, which is rectangular in shape and has a rectangular hole 321 in the center. Multiple elongated masks 310 are fixed to the mask frame 320 in an adjacent manner. It should be noted that, when each elongated mask 310 is stretched along its long side, its two ends are fixed to the mask frame 320 by welding or the like. Furthermore, multiple openings 311 are provided on each of the elongated masks 310. These openings 311 are all rectangular.

[0069] <<Evaporation Source Device>>

[0070] Specifically, refer to Figures 1-3 , Figure 7 and Figure 8The evaporation source device 400 will be described below. The evaporation source device 400 includes: an evaporation source unit 410 having multiple evaporation sources 413; a pair of linear guide rails 420 and a pair of ball screws 430 respectively disposed on both sides of the evaporation source unit 410; an atmospheric arm 440 connected to the evaporation source unit 410; and a drive mechanism 450 for rotating the ball screws 430. The drive mechanism 450 consists of a drive source such as a motor and multiple gears that transmit power from the drive source to the ball screws 430. By rotating the ball screws 430 using this drive mechanism 450, the evaporation source unit 410 can be moved reciprocally along the linear guide rails 420. Furthermore, the interior of the atmospheric arm 440 is kept in an atmospheric state. Various signal lines connected to the evaporation sources 413 and water-cooling flow paths are disposed inside the atmospheric arm 440. However, a structure with connecting bellows can be used instead of the atmospheric arm 440.

[0071] The evaporation source unit 410 includes multiple housings 411, quartz monitors 412 disposed at the ends of each housing 411, and multiple evaporation sources 413 arranged in a row inside each housing 411. (Enlarged view) Figure 8 As shown in the circled area, the evaporation source 413 includes a crucible 413a for vaporizing the material, a material storage section 413b for storing the vaporized material, and a nozzle 413c for spraying the vaporized material. In this embodiment, the housings 411 are arranged in three rows along the vertical direction. The evaporation sources 413 in the upper and lower housings 411 are used for spraying dopant material, while the evaporation source 413 in the central housing 411 is used for spraying the main material. In this embodiment, the dopant material is sprayed through the upper and lower evaporation sources 413, and the main material is sprayed through the central evaporation source 413; however, this is only one example, and the materials sprayed by each evaporation source are not limited to this. The quartz monitor 412 indirectly measures the thickness of the film formed on the substrate 200.

[0072] In this embodiment, the evaporation source unit 410 performs vapor deposition on the substrate 200 while moving vertically, using the evaporation source device 400 configured as described above. Furthermore, Figure 2 and Figure 3 In the diagram, the evaporation source unit 410X, in its standby state before vapor deposition, is indicated by a dashed line. Additionally, Figure 2In the figure, range F represents the movement range of the evaporation source unit 410 during vapor deposition. As shown, the evaporation source unit 410 is configured to move from a position slightly below the lower end of the substrate 200 and mask 300 in the vertical direction to a position slightly above the upper end of the substrate 200 and mask 300 in the vertical direction. This allows a film of constant thickness to be formed relative to the substrate 200 at a desired location. Furthermore, the width L1 of the evaporation source unit 410 is configured to be smaller than the width L2 of the mask 300 (the sum of the widths of the multiple elongated masks 310) (see reference). Figure 1 That is, in the evaporation source unit 410 of this embodiment, as... Figure 7 and Figure 8 As shown, the nozzles 413c of the evaporation source 413 disposed on the outer side in the width direction are configured to face outwards, while the nozzles 413c of the evaporation source 413 disposed on the inner side in the width direction are configured to face inwards. Therefore, material ejected from the plurality of evaporation sources 413 is uniformly ejected over a range wider than the width of the evaporation source unit 410. Thus, as described above, even if the width L1 < width L2, a film of constant thickness can be formed at the desired location on the substrate 200.

[0073] <Manufacturing Methods of Electronic Devices>

[0074] A method for manufacturing electronic devices using the aforementioned vapor deposition apparatus and method will be described. Here, as an example of an electronic device, an organic EL (electro-optical polymer) used in display devices will be used. The process of manufacturing an organic EL includes at least a process of transporting a substrate and a mask, a process of forming an organic film on the substrate, and a process of forming a metal film after the organic film formation process. These processes will be described below.

[0075] <<Transportation process>>

[0076] First, the substrate 200 is moved into the cavity 100 using the substrate positioning mechanism described above. Then, the substrate 200 is positioned in an upright state. Next, the mask 300 is moved into the cavity 100 using the mask positioning mechanism. Then, the mask 300 is aligned and adjusted relative to the substrate 200. This results in a state where a mask 300, composed of multiple elongated masks 310, is disposed on the main surface side of the substrate 200. It should be noted that in this embodiment, the alignment and adjustment of the mask 300 relative to the substrate 200 is performed inside the cavity 100; however, a structure could also be used where alignment and adjustment are performed outside the cavity before moving the substrate and mask into the cavity.

[0077] <<The Film Formation Process of Organic Membranes>>

[0078] With the substrate 200 and mask 300 positioned inside the chamber 100, the evaporation source unit 410 performs vapor deposition while moving vertically relative to the substrate 200 and mask 300 (multiple elongated masks 310). That is, vaporized material is ejected from the multiple evaporation sources 413 provided in the evaporation source unit 410 and deposited onto the main surface of the substrate 200 through multiple openings 311 formed on the multiple elongated masks 310.

[0079] Furthermore, in the case of organic EL used in the manufacture of display devices, the above-described transfer process and organic film formation process are repeated at least three times. That is, in the case of this organic EL, organic films for red pixels, organic films for green pixels, and organic films for blue pixels need to be formed on the substrate 200. Figure 9 The diagram shows a partial enlarged view of substrate 200X and partial enlarged views of masks 300X, 300Y, and 300Z. As shown, organic films R for red pixels, G for green pixels, and B for blue pixels need to be arranged and formed on substrate 200X. Therefore, organic film R is formed using the red pixel mask 300X with the material corresponding to the red pixels, followed by organic film G being formed using the green pixel mask 300Y with the material corresponding to the green pixels, and finally organic film B being formed using the blue pixel mask 300Z with the material corresponding to the blue pixels. Of course, the order of red, green, and blue is not limited to this. As described above, since three types of organic films R, G, and B need to be formed, the above-described transfer process and organic film formation process need to be repeated at least three times.

[0080] <<Metal Film Formation Process>>

[0081] After forming three organic films R, G, and B on substrate 200, electron transport layers, electron injection layers, etc., are formed on these organic films R, G, and B. Then, a metal film is further deposited by vapor deposition. Thus, electron transport layers, etc., are formed on these organic films R, G, and B, and then a metal film is formed thereon. Furthermore, the vapor deposition method for the metal film can be the same as that used for depositing the organic films, or other known techniques can be used.

[0082] (Example 2 of the vapor deposition apparatus)

[0083] Figures 10-12This illustrates the vapor deposition apparatus of Embodiment 2 of the present invention. In Embodiment 1 described above, a structure was shown in which vapor deposition was performed while the evaporation source unit (evaporation source) was moved in the vertical direction. However, in this embodiment, a structure is shown in which vapor deposition was performed while the evaporation source unit (evaporation source) was moved in the horizontal direction. Other basic structures and functions are the same as in Embodiment 1; therefore, the same reference numerals are used to label the same structural parts, and their descriptions are appropriately omitted.

[0084] Figures 10-12 This is a schematic structural diagram of the vapor deposition apparatus according to Embodiment 2 of the present invention, which schematically shows the main structure of the vapor deposition apparatus. It should be noted that... Figure 10 This is a diagram showing the vapor deposition apparatus from above. Figure 11 This is a diagram showing the vapor deposition apparatus from the back side. Figure 12 This is a side view of the vapor deposition apparatus.

[0085] In the vapor deposition apparatus 10A of this embodiment, a chamber 100 and an evaporation source device 400 disposed inside the chamber 100 are also included. Furthermore, inside the chamber 100, the substrate 200 is positioned in an upright state, and a mask 300 is disposed on the main surface side of the substrate 200, which is the same as in Embodiment 1 described above. Additionally, in Figures 10-12 In the diagram, arrows X and Y represent the horizontal direction, while arrow Z represents the vertical direction. Additionally, arrow Y represents the normal direction relative to the main surface of substrate 200, indicating the direction from the evaporation source device 400 toward substrate 200, and arrow X represents the direction perpendicular to this direction.

[0086] Regarding the substrate positioning mechanism and mask positioning mechanism, as described in Embodiment 1 above, their description is omitted. Furthermore, regarding the evaporation source device 400, its basic structure is the same as that of Embodiment 1 above, therefore its detailed description is omitted. However, in the case of the evaporation source device 400 of this embodiment, the evaporation source unit 410 does not move freely back and forth in the vertical direction, but rather in the horizontal direction (…). Figure 10 and Figure 11 It moves freely back and forth in the X direction (as described in Embodiment 1 above), differing from the structure in this respect. The structure and operation of the various components constituting the evaporation source device 400 are as explained in Embodiment 1 above, so their description is omitted. It should be noted that in Embodiment 1 above, the multiple evaporation sources 413 are arranged in a row in the horizontal direction, but in this embodiment, the multiple evaporation sources 413 are arranged in a row in the vertical direction.

[0087] In the case of the evaporation source apparatus 400 of this embodiment, as described above, the evaporation source unit 410 performs vapor deposition on the substrate 200 while moving in the horizontal direction. It should be noted that... Figure 10 and Figure 11 In the diagram, the evaporation source unit 410X, in its standby state before vapor deposition, is indicated by a dashed line. Additionally, Figure 11 In this context, range F represents the movement range of the evaporation source unit 410 during vapor deposition. For example... Figure 11 As shown, the evaporation source unit 410 is configured to move from a position slightly to the left of the left end in the horizontal direction of the substrate 200 and mask 300 to a position slightly to the right of the right end in the horizontal direction of the substrate 200 and mask 300. This allows a film of constant thickness to be formed on the substrate 200 at a desired location. Furthermore, regarding the fact that the width L1 of the evaporation source unit 410 is smaller than the width L2 of the mask 300 (the sum of the widths of the multiple elongated masks 310) (see [reference]). Figure 12 The situation is the same as in Example 1 above.

[0088] The method for manufacturing electronic devices using the vapor deposition apparatus 10A of this embodiment is the same as that in Embodiment 1 above, so its description is omitted.

[0089] <An Investigation into the Suppression Effect of Membrane Blur>

[0090] This paper describes the results of an investigation into the influence of the relationship between the long side direction D1 of the rectangular opening 311 of the elongated mask 310, the moving direction D2 of the evaporation source 413, and the long side direction D3 of the elongated mask 310 on the effect of suppressing film blurring.

[0091] The evaporation source 413 is configured to move linearly and parallel to the main surface of the substrate 200. That is, the evaporation source 413 is configured to move linearly and parallel to the surface of the elongated mask 310. Furthermore, regarding the evaporation source 413, it moves vertically when using the vapor deposition apparatus 10 of Embodiment 1, and horizontally when using the vapor deposition apparatus 10A of Embodiment 2. Therefore, the long side direction D1 of the opening 311 and the long side direction D3 of the elongated mask 310 can be either vertical or horizontal. Thus, since each of the three directions D1, D2, and D3 has either a vertical or horizontal orientation, a total of eight possible combinations can be considered.

[0092] Next, regarding the combination conditions of the directions of each part, the results of the investigation on the effect of the membrane blurring suppression are explained.

[0093] <<Condition 1>>

[0094] Reference Figure 13 and Figure 14The results of the investigation on the influence of the relationship between the long side direction D1 of the rectangular opening 311 and the moving direction D2 of the evaporation source 413 on the effect of membrane blurring suppression are presented. Figure 13 This is an explanatory diagram regarding the accuracy of film formation in relation to the positional relationship between the opening and the evaporation source. Figure 14 This is an explanatory diagram showing the relationship between the long side direction of the opening and the moving direction of the evaporation source.

[0095] Preferably, the substrate 200 and the mask 300 are in close contact with each other. However, generally, due to deformation caused by the weight of each structure, etc., Figure 13 As shown, a tiny gap S is generated between the substrate 200 and the mask 300. Therefore, in the surface direction of the main surface of the substrate 200, the farther the evaporation source is from the opening 311 formed in the mask 300, the easier it is for film blurring to occur. That is, in Figure 13 In the case of material ejected from evaporation source 413A, which is located closer to opening 311, onto the main surface of substrate 200 through opening 311, the incident angle of material ejected from evaporation source 413B, which is located farther from opening 311, onto the main surface of substrate 200 through opening 311 is smaller. In the former case, the film formation location is closer to the desired location than the desired location. Figure 13 The T1 position shift can occur in the middle, and in contrast, in the latter case, the film formation position is at a position relative to the desired position. Figure 13 The film thickness can shift by a position of T2 (T2>T1). Therefore, the film thickness in the latter is prone to instability and film blurring.

[0096] Here, a rectangular film corresponding to the shape and size of the opening 311 is formed on the substrate 200. Regarding the rectangular film formed on the substrate 200, improving the dimensional accuracy in the short side direction is often more important than the dimensional accuracy in the long side direction. This will be explained using an organic EL (Elastic Electron) used in the aforementioned display device as an example. As described above, an organic film R for red pixels, an organic film G for green pixels, and an organic film B for blue pixels are arranged and formed on the substrate 200X. Furthermore, these organic films R, G, and B are formed adjacent to each other in the short side direction on the substrate 200X. Therefore, if the dimensional accuracy of these organic films R, G, and B in the short side direction is low, color mixing or reduced brightness will occur in the display device. In contrast, even if the dimensional accuracy of the organic films R, G, and B in the long side direction is reduced, such problems are almost non-existent.

[0097] Based on the above, it is preferable to align the long side direction D1 of the rectangular opening 311 with the moving direction D2 of the evaporation source 413 (this is designated as "Condition 1"). For further information, please refer to... Figure 14 To explain in more detail. Figure 14(a) represents the case where condition 1 is satisfied. Figure 14 (b) indicates the case where condition 1 is not satisfied (the case where the long side direction D1 of the rectangular opening 311 is orthogonal to the moving direction D2 of the evaporation source 413). As can be seen from the description of Embodiments 1 and 2 above, the moving range F of the evaporation source 413 is larger than the long side direction of the elongated mask 310. Therefore, for example, in Figure 14 In (b), the distance from the evaporation source unit 410c to the opening 311X, located at the furthest point from the evaporation source unit 410c, becomes significantly longer, with the evaporation source unit 410c situated at the very end of the movement range F. Therefore, the dimensional accuracy in the short-side direction of the rectangular organic film formed by the material sprayed onto the substrate 200 through this opening 311X decreases. In contrast, under condition 1, when condition 1 is satisfied... Figure 14 In (a), the distance from the evaporation source unit 410c to the opening 311Y, located at the farthest point from the evaporation source unit 410c, becomes significantly longer, with the evaporation source unit 410c situated at the very end of the movement range F. However, for a rectangular organic film formed from material sprayed onto the substrate 200 through this opening 311Y, the dimensional accuracy in the short side direction is hardly affected. Therefore, it can be considered that the side satisfying condition 1 is unlikely to produce film blurring. Furthermore, compared to the case where the evaporation source 413 is moved in a transverse manner perpendicular to the long side direction 311 of the opening 311, moving the evaporation source 413 along the long side direction 311 of the opening 311 allows for a constant film thickness. From this perspective, the side satisfying condition 1 is also unlikely to produce film blurring.

[0098] <<Condition 2>>

[0099] Reference Figure 15 The results of the investigation show the effect of the relationship between the long side direction D1 of the rectangular opening 311 and the long side direction D3 of the elongated mask 310 on the suppression effect of film blurring. Figure 15 This is an explanatory diagram showing the relationship between the long side direction of the opening and the long side direction of the strip-shaped mask.

[0100] As described in the mask positioning mechanism above, the elongated mask 310, when stretched along its long side, has its two ends fixed to the mask frame 320 by welding or the like. Therefore, the tensile force can also affect the multiple openings 311 formed on the elongated mask 310. Even when a tensile force is applied to the rectangular openings 311 along the long side, the openings 311 are difficult to deform; in contrast, when a tensile force is applied along the short side, the openings 311 are easily deformed.

[0101] Based on the above, it is preferable to make the long side direction D1 of the rectangular opening 311 coincide with the long side direction D3 of the strip-shaped mask 310 (this case is set as "condition 2"). Figure 15 (a) represents the case where condition 2 is satisfied. Figure 15 (b) indicates the case where condition 2 is not satisfied (the case where the long side direction D1 of the rectangular opening 311 is orthogonal to the long side direction D3 of the strip-shaped mask 310). Figure 15 In (b), as shown in the enlarged figure of a portion of the opening 311, if condition 2 is not met, the opening 311 may deform considerably. Therefore, it can be considered that the side that meets condition 2 is less likely to produce membrane blurring.

[0102] <<Condition 3>>

[0103] Reference Figure 16 The results of the investigation show the influence of the relationship between the long side direction D3 and the vertical direction of the elongated mask 310 on the effect of suppressing film blurring. Figure 16 This is an explanatory diagram showing the relationship between the direction of the long side of a strip-shaped mask and the vertical direction.

[0104] The elongated mask 310 may deform due to its own weight. Therefore, it is preferable to make the long side direction D3 of the elongated mask 310 coincide with the vertical direction (this case is designated as "condition 3"). Figure 16 (a) represents the case where condition 3 is satisfied. Figure 16 (b) indicates the case where condition 3 is not met (the case where the long side direction D3 of the strip mask 310 is consistent with the horizontal direction).

[0105] When condition 3 is met, the elongated mask 310 deforms little due to its own weight. Conversely, when condition 3 is not met, the elongated mask 310 deforms such that its central area protrudes downwards in the vertical direction due to its own weight (refer to arrow G). As a result, the opening 311 formed in the elongated mask 310 also deforms, and therefore is considered to be prone to film blurring. Therefore, it can be considered that the side that meets condition 3 is less likely to produce film blurring.

[0106] <<Condition 4>>

[0107] Reference Figure 17 The results of the investigation show the effect of the relationship between the long side direction D3 of the elongated mask 310 and the moving direction D2 of the evaporation source 413 on the suppression effect of film blurring. Figure 17 This is an explanatory diagram showing the relationship between the direction of the long side of the elongated mask and the direction of movement of the evaporation source.

[0108] Because the evaporation source 413 generates heat, the elongated mask 310 is heated by the evaporation source 413. Therefore, if a portion of the elongated mask 310 is locally heated, the elongated mask 310 will deform in a bending manner, which can easily lead to film blurring. Therefore, it is considered preferable to make the long side direction D3 of the elongated mask 310 perpendicular to the moving direction D2 of the evaporation source 413 (this case is set as "condition 4"). That is, it is considered preferable to perform film formation while moving the evaporation source unit 410 (a plurality of evaporation sources 413 are arranged in a column on the long side direction D3 of the elongated mask 310) in a direction parallel to the main surface of the substrate 200 and perpendicular to the long side direction D3 of the elongated mask 310.

[0109] Therefore, the entire long side direction D3 of the elongated mask 310 is uniformly heated by the evaporation source 413, thus suppressing the possibility of localized heating of a portion of the elongated mask 310. This prevents the elongated mask 310 from deforming in a bending manner. Conversely, if the long side direction D3 of the elongated mask 310 is aligned with the moving direction D2 of the evaporation source 413, the portion of the elongated mask 310 heated by the evaporation source 413 moves from one end to the other. This could lead to localized heating of a portion of the elongated mask 310, potentially causing it to deform in a bending manner. Therefore, it can be considered that the condition satisfying condition 4 is less likely to cause film blurring.

[0110] <<Comprehensive Investigation Results>>

[0111] Reference Figure 18 The results of the comprehensive investigation will be explained. Figure 18 This is a table summarizing whether the long side direction D1 of the rectangular opening 311, the moving direction D2 of the evaporation source 413, and the long side direction D3 of the elongated mask 310 are vertical or horizontal, and whether conditions 1 to 4 are satisfied. It should be noted that examples that meet the conditions are marked with ○, and examples that do not meet the conditions are marked with ×. Furthermore, for examples 1 to 8, the priority is weighted according to the order of conditions 1, 2, and 3, and arranged in descending order of priority. Regarding the judgment, examples that meet two or more of conditions 1 to 4 are marked as OK. As a result, examples 7 and 8 are unacceptable (NG).

Claims

1. A vapor deposition method comprising positioning a substrate in an upright state, and arranging a mask composed of a plurality of elongated masks in a vertically upright state on the main surface side of the substrate, wherein the plurality of elongated masks are fixed at both ends in a stretched state along their long side direction, and are arranged in a direction perpendicular to the long side direction in a manner aligned and adjacent to each other, and wherein a film is deposited on the main surface of the substrate through a plurality of openings respectively formed in the plurality of elongated masks by an evaporation source moving relative to the substrate and the masks, characterized in that, Each of the aforementioned openings is composed of a rectangular opening. During film formation, the evaporation source is moved in a direction consistent with the long side direction of the opening.

2. A vapor deposition method comprising positioning a substrate in an upright state, and arranging a mask composed of a plurality of elongated masks in a vertically upright state on the main surface side of the substrate, wherein the plurality of elongated masks are fixed at both ends in a stretched state along their long sides, and are arranged in a direction perpendicular to the long sides such that they are aligned and adjacent to each other in the long side direction, and performing film deposition on the main surface of the substrate through a plurality of openings respectively formed in the plurality of elongated masks by an evaporation source that moves relative to the substrate and the masks, characterized in that, A plurality of evaporation sources are arranged in a column along the long side of the elongated mask, and film formation is performed while moving the plurality of evaporation sources in a direction parallel to the main surface of the substrate and perpendicular to the long side of the elongated mask.

3. The vapor deposition method according to claim 1 or 2, characterized in that, Each of the openings is a rectangular opening, and a film is formed by using an elongated mask in which the long side direction of these openings is aligned with the long side direction of the elongated mask.

4. The vapor deposition method according to claim 1 or 2, characterized in that, With multiple elongated masks positioned such that the long side of the elongated mask is aligned with the vertical direction, film formation is performed through the evaporation source.

5. A method for manufacturing an electronic device, characterized in that, have: The process of transferring the substrate and mask into a chamber equipped with an evaporation source; and The process of forming an organic film on the substrate using the vapor deposition method according to claim 1 or 2.

6. The method for manufacturing an electronic device according to claim 5, characterized in that, After the process of forming an organic film on the substrate, there is a process of vapor-depositing a metal film.

7. A vapor deposition apparatus, comprising: A substrate positioning mechanism that positions the substrate in an upright position. A mask positioning mechanism, wherein a mask composed of multiple elongated masks is arranged vertically on the main surface side of a substrate positioned by the substrate positioning mechanism, wherein the multiple elongated masks are fixed at both ends in a stretched state along their long sides, and are arranged in a direction perpendicular to the long side direction in a manner aligned and adjacent to each other along the long side direction; and An evaporation source moving mechanism that moves the evaporation source parallel and linearly to the main surface of the substrate positioned by the substrate positioning mechanism. The vapor deposition apparatus moves the evaporation source via the evaporation source moving mechanism while depositing a film on the main surface of the substrate through multiple openings formed in the multiple elongated masks, characterized in that... Each of the aforementioned openings is composed of a rectangular opening, and, The direction of movement of the evaporation source based on the evaporation source moving mechanism is consistent with the direction of the long side of the opening.

8. A vapor deposition apparatus, comprising: A substrate positioning mechanism that positions the substrate in an upright position. A mask positioning mechanism, wherein a mask composed of multiple elongated masks is arranged vertically on the main surface side of a substrate positioned by the substrate positioning mechanism, wherein the multiple elongated masks are fixed at both ends in a stretched state along their long sides, and are arranged in a direction perpendicular to the long side direction in a manner aligned and adjacent to each other along the long side direction; and An evaporation source moving mechanism that moves the evaporation source parallel and linearly to the main surface of the substrate positioned by the substrate positioning mechanism. The vapor deposition apparatus moves the evaporation source via the evaporation source moving mechanism while depositing a film on the main surface of the substrate through multiple openings formed in the multiple elongated masks, characterized in that... The evaporation sources are arranged in multiple columns along the long side of the elongated mask, and... The direction in which the plurality of evaporation sources move via the evaporation source moving mechanism is perpendicular to the long side of the elongated mask.

9. The vapor deposition apparatus according to claim 7 or 8, characterized in that, Each of the openings is a rectangular opening, and the long side of these openings is aligned with the long side of the elongated mask.

10. The vapor deposition apparatus according to claim 7 or 8, characterized in that, In the plurality of elongated masks configured by the mask positioning mechanism, the long side of each elongated mask is aligned with the vertical direction.

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