A loading and unloading unit and method for crystalline silicon

Abstract

The present invention relates to a loading and unloading unit and a loading and unloading method for crystalline silicon, belonging to the technical field of crystalline silicon processing equipment. The loading and unloading unit for crystalline silicon is used in cooperation with a crystalline silicon slicing device, and it includes a base and a crystalline silicon storage mechanism located on the base. The crystalline silicon storage mechanism is divided into two levels along the axial direction of the crystalline silicon, and it is divided into a loading component and an unloading component. A conveying mechanism is located above the crystalline silicon storage mechanism. The crystalline silicon located on the loading component and the unloading component is fixed by a crystal carrier. The conveying mechanism is connected to the base through a support frame, and it includes a lifting component and a conveying component. The lifting component is fixedly connected to the support frame, and the conveying component generates relative movement with the lifting component through a support plate, which realizes the integration and automation of the loading and unloading of crystalline silicon slicing and has broad application prospects.

Description

Technical Field

[0001] The present invention belongs to the technical field of crystalline silicon processing equipment, and specifically relates to a loading and unloading unit and a loading and unloading method for crystalline silicon. Background Art

[0002] Before the crystalline silicon is cut into crystalline silicon wafers, the crystalline silicon that has been chamfered and ground needs to be transported to the crystalline silicon slicing device through a crystalline silicon conveying device. In the past, a separate transportation device was used to transport the crystalline silicon to the crystalline silicon slicing device, and then another unloading device was used to receive the sliced crystalline silicon. This loading and unloading method is time-consuming and laborious. Therefore, how to quickly and conveniently transport the crystalline silicon to the crystalline silicon slicing device is a problem that needs to be solved by us. Summary of the Invention

[0003] In view of the various deficiencies of the prior art, a device is now proposed that can quickly and conveniently transport the crystalline silicon to be cut to the crystalline silicon slicing device and can seamlessly connect with the crystalline silicon slicing device to achieve loading and unloading.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A loading and unloading unit for crystalline silicon, which is used in cooperation with a crystalline silicon slicing device, includes a base and a crystalline silicon storage mechanism located on the base. The crystalline silicon storage mechanism is divided into two levels along the axial direction of the crystalline silicon, and is divided into a loading component and an unloading component. A conveying mechanism is located above the crystalline silicon storage mechanism;

[0006] The crystalline silicon located on the loading component and the unloading component is fixed by a crystal carrier;

[0007] The conveying mechanism is connected to the base through a support frame, and includes a vertically arranged lifting component and a horizontally arranged conveying component. The lifting component is fixedly connected to the support frame, and the conveying component moves relative to the lifting component through a support plate.

[0008] Further, the conveying component includes a conveying part and a driving part. The conveying part includes two conveying slide rails arranged along the axial direction of the crystalline silicon and conveying sliders that cooperate with the conveying slide rails. The support plate is arranged in the vertical direction, one side of which is perpendicularly fixedly connected to the conveying slide rail, and two slide rail grooves are arranged in parallel on the other side. The driving part includes a conveying motor and a rack. The output end of the conveying motor is fixedly connected to a gear, and the gear is used to cooperate with the rack to drive the conveying slider to slide along the conveying slide rail. A rack fixing block is fixedly arranged on the inner side of the conveying slider along the length direction of the conveying slide rail. The rack is fixed on the rack fixing block, and a push-pull fixing block is arranged at one end of the rack fixing block away from the lifting component;

[0009] The outer side of the conveying slider is provided with lapping teeth that cooperate with the crystal carrier at intervals. The longitudinal section of the lapping teeth is L-shaped, and one end of the lapping teeth is fixedly connected to the conveying slider.

[0010] Furthermore, baffles for preventing the crystal carrier from slipping off are fixedly provided at both ends of the L-shaped right angle.

[0011] Furthermore, the lifting assembly includes a lifting plate and a lifting drive assembly. The lifting plate is located inside the support frame, one side of the lifting plate is fixedly connected to the lifting drive assembly, and two horizontal slide rails are arranged in parallel on the other side of the lifting plate to cooperate with the slide rail grooves.

[0012] Furthermore, the loading assembly includes a loading fixed table. The loading fixed table is fixedly connected to the base through loading support columns. A groove that cooperates with the crystalline silicon and a loading detection device are arranged on the loading fixed table.

[0013] Furthermore, the unloading assembly includes two parallel unloading fixed plates and an unloading tray. The unloading tray is fixedly connected to the base. The unloading fixed plates are arranged in parallel along the axial direction of the crystalline silicon and are fixedly connected to the unloading tray. A plurality of unloading guardrails are arranged on both sides of the two unloading fixed plates. A fixing opening for accommodating the crystal carrier is formed in the upper part of the unloading guardrails. Fixing blocks are fixedly provided at the fixing opening. The fixing blocks span both sides of the fixing opening and are arranged along the horizontal direction and are perpendicular to the axial direction of the crystalline silicon.

[0014] Furthermore, the crystal carrier includes a fixed table arranged along the axial direction of the crystalline silicon. Two handles are arranged at intervals on the upper surface of the fixed table to cooperate with the push-pull fixing blocks to push the crystal carrier into and out of the crystalline silicon slicing device. A fixing groove is fixedly provided between the two handles. The fixing groove is an integral structure with the fixed table and is arranged along the direction of the fixed table. At least two fixing rods are symmetrically and fixedly provided on both sides of the fixing groove. The fixing rods are used in cooperation with the lapping teeth to lift the crystal carrier, and the fixing rods are arranged in parallel with the fixing blocks;

[0015] Both ends of the fixed table extend outwards to form convex platforms. The convex platforms are lapped on the fixing blocks to support the crystal carrier and the crystalline silicon fixed below it.

[0016] Furthermore, a slide rail shield is arranged above the conveying slide rail to protect the conveying assembly. Induction devices are respectively arranged on both sides of the support frame corresponding to the slide rail.

[0017] Furthermore, the base is fixed on an AGV trolley.

[0018] In addition, the present invention also provides a loading and unloading method for a loading and unloading unit for crystalline silicon, including the following steps:

[0019] Step 1: The AGV cart runs to the workbench where the silicon wafers to be cut are placed. The loading detection device checks whether there are silicon wafers to be cut on the workbench. If there are no silicon wafers to be cut on the workbench, the AGV cart executes Step 2; if there are silicon wafers to be cut on the workbench, an operator or a manipulator places the crystal carrier with the silicon wafers to be cut fixed on the loading component.

[0020] Step 2: The AGV cart runs to the slicing equipment. The push-pull fixing block pulls out the cut silicon wafers together with the crystal carrier in the slicing equipment and places them into the unloading component through the lifting component.

[0021] Step 3: The lifting component slides horizontally to the loading component. The overlapping teeth overlap with the crystal carrier. The lifting component rises vertically, and the conveying slider slides towards the direction close to the silicon wafer slicing device, conveying the crystal carrier into the silicon wafer slicing device for slicing operation.

[0022] Step 4: The AGV cart runs to the slicing storage area, removes the cut silicon wafers from the unloading component and repeats the above steps.

[0023] The beneficial effects of the present invention are as follows:

[0024] 1. The positive rotation of the motor drives the conveying slider to move along the slide rail, conveying the crystal carrier into the silicon wafer slicing device; one end of the rack fixing block is provided with a push-pull fixing block. At the same time, handles are provided at both ends of the fixed table. The push-pull fixing block is engaged with the handle. When the motor rotates reversely, the sliced silicon wafers are conveyed back into the conveying mechanism, realizing the automation of the conveying process before and after silicon wafer cutting.

[0025] 2. The loading component and the unloading component are arranged on the base, and a conveying mechanism is arranged above the loading component and the unloading component. Loading and unloading are realized on the same base, improving the equipment utilization rate and greatly saving costs.

[0026] 3. Convex platforms are provided at both ends of the crystal carrier, which are effectively overlapped and matched with the fixed support blocks in the unloading component, realizing the effective fixation of the cut silicon wafers during unloading, solving the problem of fixing the cut silicon wafers. At the same time, the silicon wafers are fixed by the crystal carrier, providing technical support for the automatic loading and unloading of the conveying mechanism.

[0027] 4. The entire loading and unloading unit is fixed on the AGV cart. The AGV cart travels along the specified route according to the specified program, transporting the silicon wafers to the specified position, realizing unmanned and automated production in the workshop, and having broad development prospects. Description of the Drawings

[0028] Figure 1 is the overall structural schematic diagram of the present invention;

[0029] Figure 2 is the structural schematic diagram of the conveying mechanism;

[0030] Figure 3 is Figure 2 Partial structural schematic diagram at position A in

[0031] Figure 4 is the structural schematic diagram of the conveying part and the crystal carrier;

[0032] Figure 5 is the structural schematic diagram of the conveying part (excluding one side conveying slider) and the crystal carrier;

[0033] Figure 6 is the structural schematic diagram of the loading component;

[0034] Figure 7 is the structural schematic diagram of the unloading component;

[0035] Figure 8 is the structural schematic diagram of the crystal carrier.

[0036] In the attached drawings:

[0037] 1 - Base,

[0038] 2 - Loading component, 201 - Loading fixed table, 202 - Loading support column, 203 - Groove, 204 - Loading detection device;

[0039] 3 - Unloading component, 301 - Unloading fixed plate, 302 - Unloading tray, 303 - Unloading guardrail, 304 - Fixed support block;

[0040] 4 - Conveying mechanism;

[0041] 5 - Crystal carrier, 501 - Fixed table, 502 - Handle, 503 - Fixed groove, 504 - Fixed rod, 505 - Boss;

[0042] 6 - Support frame;

[0043] 7 - Lifting component, 701 - Lifting plate, 702 - Slide rail, 703 - Chain;

[0044] 8 - Conveying component, 801 - Conveying part, 8011 - Conveying slide rail, 8012 - Conveying slider, 8013 - Rack, 8014 - Rack fixing block, 8015 - Push - pull fixing block, 8016 - Lapping tooth, 8017 - Baffle;

[0045] 9 - Support plate, 901 - Slide rail groove;

[0046] 10 - Slide rail shield, 11 - Induction device, 12 - AGV cart. Specific implementation method

[0047] To enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. In addition, the directional terms mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only with reference to the direction of the accompanying drawings. Therefore, the directional terms used are for illustration rather than limitation of the present invention.

[0048] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0049] Embodiment 1

[0050] Refer to Figure 1 , a loading and unloading unit for crystalline silicon, including a base 1 and a crystalline silicon storage mechanism located on the base 1. The crystalline silicon storage mechanism is divided into two levels along the axis of the crystalline silicon, specifically divided into a loading component 2 and an unloading component 3. A conveying mechanism 4 is located above the crystalline silicon storage mechanism. The crystalline silicon located on the loading component 2 and the unloading component 3 is fixed to a crystal carrier 5. The conveying mechanism 4 is connected to the base 1 through a support frame 6, and includes a vertically arranged lifting component 7 and a horizontally arranged conveying component 8. The lifting component 7 is fixedly connected to the support frame 6, and the conveying component 8 moves relative to the lifting component 7 through a support plate 9. The conveying component 8 clamps the crystalline silicon located on the loading component 2 and lifts it to the required height through the lifting component 7, and then conveys the crystalline silicon to the crystalline silicon slicing device to complete the loading operation of the crystalline silicon. After cutting, the crystalline silicon is fixed by the conveying component 8 and then lowered through the lifting component 7 and placed on the unloading component 3.

[0051] Embodiment 2

[0052] Refer to Figures 2 - 5 , the conveying component 8 includes a conveying part 801 and a driving part. The conveying part 801 includes two conveying slide rails 8011 arranged along the axis of the crystalline silicon and conveying sliders 8012 cooperating with the conveying slide rails 8011. Specifically, the support plate 9 is arranged vertically, one side of which is perpendicularly fixed to one end of the conveying slide rail 8011, and two slide rail grooves 901 are arranged in parallel on the other side; the driving part includes a conveying motor and a rack 8013. The output end of the conveying motor is fixedly connected to a gear, and the conveying slider 8012 is driven to slide along the conveying slide rail 8011 through the cooperation of the gear and the rack 8013. At the same time, a rack fixing block 8014 is fixedly arranged along the length direction of the conveying slide rail 8011 on the inner side of the conveying slider 8012, and the rack 8013 is fixed on the rack fixing block 8014. At the same time, a push-pull fixing block 8015 is arranged at one end of the rack fixing block 8014 away from the lifting component 7.

[0053] The outer side of the conveying slider 8012 is provided with overlapping teeth 8016 at intervals. The overlapping teeth 8016 are used in cooperation with the crystal carrier 5. Specifically, the longitudinal section of the overlapping teeth 8016 is L-shaped. One end of the overlapping teeth 8016 is fixedly connected to the conveying slider 8012, and baffles 8017 are fixedly provided at both ends of the L-shaped right angle, effectively preventing the crystal carrier from slipping off. Preferably, two overlapping teeth 8016 are provided on each of the two conveying sliders 8012.

[0054] Embodiment Three

[0055] Reference Figure 1 、 Figure 2 The lifting assembly 7 includes a lifting plate 701 and a lifting drive assembly. The lifting plate 701 is located within the support frame 6. One side of the lifting plate 701 is fixedly connected to the lifting drive assembly, and two horizontal slide rails 702 are provided in parallel on the other side. The slide rails 702 are used in cooperation with the slide rail grooves 901. The lifting drive assembly includes a lifting motor, a speed reducer, a chain 703, and bearings. Sprockets are provided at both ends of the bearings. The chain 703 is engaged with the sprockets, and at the same time, the chain 703 is fixedly connected to the lifting plate 701. The lifting and lowering of the conveying assembly 8 are controlled by the lifting assembly 7 to lift and place the crystalline silicon.

[0056] Embodiment Four

[0057] Reference Figure 6 The feeding assembly 2 includes a feeding fixed table 201. The feeding fixed table 201 is fixedly connected to the base 1 through a feeding support column 202. At the same time, in order to facilitate the placement of the crystalline silicon and prevent its displacement, a groove 203 matching the crystalline silicon is provided on the feeding fixed table 201. In addition, a feeding detection device 204 is provided on the crystalline silicon feeding workbench 201. The feeding detection device 204 is fixedly connected to the feeding workbench 201 through a detection support. In order not to interfere with the feeding and discharging of the crystalline silicon, the feeding detection device 204 is provided on the side away from the discharging assembly 3.

[0058] Embodiment Five

[0059] Reference Figure 1 、 Figure 7 and Figure 8, the blanking assembly 3 includes two blanking fixing plates 301 and a blanking tray 302 arranged in parallel. The blanking tray 302 is fixedly connected to the base 1 through blanking support columns. The two blanking fixing plates 301 are arranged at intervals along the axial direction of the silicon wafer and are fixed on the blanking tray 302. At the same time, a plurality of blanking guardrails 303 are arranged on both sides of the two blanking fixing plates 301. An accommodating opening for the crystal tray 5 is provided at the upper part of the blanking fixing plate 301, and a fixing block 304 is arranged at the accommodating opening. Specifically, the fixing block 304 straddles both sides of the accommodating opening, and is arranged along the horizontal direction and perpendicular to the axial direction of the silicon wafer. In this embodiment, two blanking guardrails 303 are arranged on each side.

[0060] Embodiment Six

[0061] Reference Figure 1 、 Figure 5 、 Figure 7 and Figure 8 , the crystal tray 5 includes a fixing table 501. The fixing table 501 is arranged along the axial direction of the silicon wafer. Two handles 502 are arranged at intervals on the upper surface of the fixing table 501. The handles 502 are engaged with the push-pull fixing block 8015 to push the crystal tray 5 into and out of the silicon wafer slicing device. A fixing groove 503 is fixedly arranged between the two handles 502. The fixing groove 503 is of an integral structure with the fixing table 501 and is arranged along the direction of the fixing table 501. At least two fixing rods 504 are fixed on both sides of the fixing groove 503. The fixing rods 504 are used in cooperation with the overlapping teeth 8016 to lift the crystal tray 5. The fixing rods 504 on both sides are symmetrically arranged, and the fixing rods 504 are parallel to the fixing block 304. In this embodiment, two fixing rods 504 and overlapping teeth 8016 are arranged on each side.

[0062] Both ends of the fixing table 501 extend outwards to form convex platforms 505. The convex platforms 505 are lapped on the fixing block 304 for supporting the crystal tray 5 and the silicon wafer fixed below it.

[0063] A slide rail shield 10 is arranged above the conveying slide rail 8011 for protecting the conveying assembly 8. Induction devices 11 are respectively arranged on both sides of the support frame 6 corresponding to the slide rail 702. In this embodiment, the induction device 11 is a detection probe.

[0064] To facilitate the movement of the loading and unloading unit, the base 1 is fixed on the AGV cart 12, which is convenient for the transportation of materials and greatly saves manpower.

[0065] The specific working process is as follows:

[0066] Step 1: The AGV cart 12 runs to the workbench for placing the silicon wafers to be cut. The loading detection device 204 detects whether there are silicon wafers to be cut on the workbench. If there are no silicon wafers to be cut on the workbench, the AGV cart 12 executes Step 2. If there are silicon wafers to be cut on the workbench, an operator or a manipulator places the crystal holder 5 with the silicon wafers to be cut fixed thereon onto the loading assembly 2;

[0067] Step 2: The AGV cart 12 transports the silicon wafers to the silicon wafer slicing device along the specified route. The push-pull fixing block 8015 pulls out the silicon wafers that have been cut in the slicing equipment together with the crystal holder 5 and places them into the unloading assembly 3 through the lifting assembly 7;

[0068] Step 3: The lifting assembly 7 slides horizontally to the loading assembly 2. The overlapping teeth 8016 overlap with the fixed rod 504. The lifting assembly 7 rises, lifting the crystal holder 5 with the silicon wafers fixed thereon to a height that matches the silicon wafer slicing device. The motor rotates forward to drive the conveying slider 8012 to slide in the direction close to the silicon wafer slicing device until the crystal holder 5 and the silicon wafers fixed below it are conveyed into the silicon wafer slicing device for slicing the silicon wafers;

[0069] Step 4: The AGV cart 12 runs to the slicing storage area, removes the cut silicon wafers from the unloading assembly 3 and repeats the above steps.

[0070] The above has described the present invention in detail. The above description is only a preferred embodiment of the present invention and cannot limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of this application should still fall within the scope covered by the present invention.

Claims

1. An upper and lower material unit for crystalline silicon, which is used in cooperation with a crystalline silicon slicing device, and comprises a base (1) and a crystalline silicon storage mechanism located on the base (1), and is characterized in that, The crystalline silicon storage mechanism is divided into two levels along the axial direction of the crystalline silicon, and is divided into a feeding component (2) and a discharging component (3). The conveying mechanism (4) is located above the crystalline silicon storage mechanism; The crystalline silicon located on the feeding component (2) and the discharging component (3) is fixed by a crystal carrier (5); The conveying mechanism (4) is connected to the base (1) through a support frame (6), and includes a vertically arranged lifting component (7) and a horizontally arranged conveying component (8). The lifting component (7) is fixedly connected to the support frame (6), and the conveying component (8) generates relative movement with the lifting component (7) through a support plate (9); The conveying component (8) includes a conveying part (801) and a driving part. The conveying part (801) includes two conveying slide rails (8011) arranged along the axial direction of the crystalline silicon and conveying sliders (8012) matched with the conveying slide rails (8011). The support plate (9) is arranged in the vertical direction, one side of which is perpendicularly and fixedly connected to the conveying slide rail (8011), and two slide rail grooves (901) are arranged in parallel on the other side. The driving part includes a conveying motor and a rack (8013). The output end of the conveying motor is fixedly connected to a gear, and the conveying slider (8012) is driven to slide along the conveying slide rail (8011) through the cooperation of the gear and the rack (8013). A rack fixing block (8014) is fixedly arranged on the inner side of the conveying slider (8012) along the length direction of the conveying slide rail (8011), and the rack (8013) is fixed on the rack fixing block (8014). A push-pull fixing block (8015) is arranged at one end of the rack fixing block (8014) away from the lifting component (7); Lap teeth (8016) matched with the crystal carrier (5) are arranged at intervals on the outer side of the conveying slider (8012). The longitudinal section of the lap teeth (8016) is L-shaped, and one end of which is fixedly connected to the conveying slider (8012); The crystal carrier (5) includes a fixing table (501) arranged along the axial direction of the crystalline silicon. Two handles (502) are arranged at intervals on the upper surface of the fixing table (501) and are matched with the push-pull fixing block (8015) to push the crystal carrier (5) into and out of the crystalline silicon slicing device. A fixing groove (503) is fixedly arranged between the two handles (502). The fixing groove (503) is integrally formed with the fixing table (501) and is arranged along the direction of the fixing table (501). At least two fixing rods (504) are symmetrically fixedly arranged on both sides of the fixing groove (503). The fixing rods (504) are used in cooperation with the lap teeth (8016) to lift the crystal carrier (5), and the fixing rods (504) are arranged in parallel with the fixing support block (304); Both ends of the fixing table (501) extend outwards to form convex platforms (505), and the convex platforms (505) are lapped on the fixing support blocks (304) to support the crystal carrier (5) and the crystalline silicon fixed below it.

2. The loading and unloading unit for crystalline silicon according to claim 1, characterized in that, Baffles (8017) for preventing the crystal carrier (5) from slipping off are fixedly arranged at both ends of the L-shaped right angle.

3. The loading and unloading unit for crystalline silicon according to claim 2, wherein, The lifting assembly (7) includes a lifting plate (701) and a lifting drive assembly. The lifting plate (701) is located within the support frame (6), with one side fixedly connected to the lifting drive assembly, and two horizontal slide rails (702) are arranged in parallel on the other side to cooperate with the slide rail groove (901).

4. The loading and unloading unit for crystalline silicon according to claim 3, wherein, The feeding assembly (2) includes a feeding fixed table (201). The feeding fixed table (201) is fixedly connected to the base (1) through feeding support columns (202). A groove (203) and a feeding detection device (204) that cooperate with the crystalline silicon are provided on the feeding fixed table (201).

5. The loading and unloading unit for crystalline silicon according to claim 4, characterized in that, The discharging assembly (3) includes two discharging fixed plates (301) arranged in parallel and a discharging tray (302). The discharging tray (302) is fixedly connected to the base (1). The discharging fixed plates (301) are arranged parallel to the axial direction of the crystalline silicon and are fixedly connected to the discharging tray (302). A plurality of discharging guardrails (303) are provided on both sides of the two discharging fixed plates (301). A fixing opening for accommodating the crystal tray (5) is provided at the upper part, and a fixing support block (304) is fixedly provided at the fixing opening. The fixing support block (304) straddles both sides of the fixing opening and is arranged horizontally and perpendicular to the axial direction of the crystalline silicon.

6. The loading and unloading unit for crystalline silicon according to claim 5, wherein, A slide rail shield (10) is provided above the conveying slide rail (8011) to protect the conveying assembly (8). Induction devices (11) are respectively provided on both sides of the support frame (6) corresponding to the slide rails (702).

7. The loading and unloading unit for crystalline silicon according to claim 6, wherein, The base (1) is fixed on the AGV cart (12).

8. A loading and unloading method for a loading and unloading unit for crystalline silicon as described in claim 7, characterized in that, Including the following steps: Step 1: The AGV cart (12) runs to the workbench where the crystalline silicon to be cut is placed. The feeding detection device (204) detects whether there is crystalline silicon to be cut on the workbench. If there is no crystalline silicon to be cut on the workbench, the AGV cart (12) executes Step 2. If there is crystalline silicon to be cut on the workbench, a worker or a manipulator places the crystal tray (5) with the crystalline silicon to be cut fixed thereon onto the feeding assembly (2). Step 2: The AGV cart (12) runs to the slicing device. The pushing and pulling fixed block (8015) pulls out the already cut crystalline silicon together with the crystal tray (5) located inside the slicing device and places it into the discharging assembly (3) through the lifting assembly (7). Step 3: The lifting assembly (7) slides horizontally to the feeding assembly (2), the overlapping teeth (8016) overlap with the crystal tray (5), the lifting assembly (7) rises vertically, and the conveying slider (8012) slides in the direction close to the crystalline silicon slicing device to convey the crystal tray (5) into the crystalline silicon slicing device for slicing operation. Step 4: The AGV cart (12) runs to the slicing storage area, removes the already cut crystalline silicon from the discharging assembly (3) and repeats the above steps.

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