Load lock module and semiconductor manufacturing equipment including the same

Abstract

The present application provides a load lock module and a semiconductor manufacturing apparatus including the same. The semiconductor manufacturing apparatus includes: a load lock module including a load lock chamber in which a substrate container is accommodated, wherein the load lock module is configured to switch the internal pressure of the load lock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container accommodated in the load lock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the load lock module includes: a purge gas supply unit configured to supply a purge gas into the substrate container via a gas supply line connected to the substrate container; and an exhaust unit configured to exhaust gas in the substrate container via an exhaust line connected to the substrate container.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2018-0082204, filed on July 16, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The inventive concept relates to a load lock module and semiconductor manufacturing equipment including the same. Background Art

[0004] As semiconductor devices have become increasingly highly integrated and circuits have become increasingly miniaturized, semiconductor manufacturing equipment is required to maintain high cleanliness levels in order to prevent wafers from being contaminated by exposure to the external environment during semiconductor manufacturing processes, which can reduce the yield of semiconductor products. To meet this requirement, semiconductor manufacturing equipment generally includes: a load port on which a wafer carrier, called a front-opening unified pod (FOUP), is placed; an equipment front-end module (EFEM), which maintains high cleanliness levels; a loadlock module, which is configured to temporarily accommodate wafers and has an internal pressure adjustable between atmospheric pressure and vacuum; a transfer module, which is configured to transfer wafers; and a processing module, which is configured to perform semiconductor manufacturing processes on the wafers. Summary of the Invention

[0005] The present inventive concept provides a load lock module and semiconductor manufacturing equipment including the same.

[0006] According to one aspect of the present inventive concept, there is provided a semiconductor manufacturing apparatus, comprising: a load lock module including a load lock chamber in which a substrate container is accommodated, wherein the load lock module is configured to switch an internal pressure of the load lock chamber between atmospheric pressure and vacuum; and a transfer module configured to transfer a substrate between a substrate container accommodated in the load lock chamber and a processing module for performing a semiconductor manufacturing process on the substrate, wherein the load lock module comprises: a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to exhaust gas in the substrate container through an exhaust line connected to the substrate container.

[0007] According to another aspect of the present invention, there is provided a semiconductor manufacturing apparatus including: a load lock module including a load lock chamber in which a substrate container is accommodated, wherein the load lock module is configured to switch an internal pressure of the load lock chamber between atmospheric pressure and a vacuum; a transfer module configured to transfer a substrate between the substrate container accommodated in the load lock chamber and a processing module for performing a semiconductor manufacturing process on the substrate; and a buffer module connected to the transfer module, wherein the buffer module is configured to temporarily accommodate a substrate that has completed a semiconductor manufacturing process performed by the processing module and to purge the substrate in a vacuum.

[0008] According to another aspect of the inventive concept, a load lock module is provided, comprising: a chamber in which a substrate container configured to accommodate a plurality of substrates is accommodated; a platen disposed in the chamber, wherein the platen is configured to support the substrate container; a first purge gas supply unit configured to supply purge gas into the chamber; a first exhaust unit configured to exhaust gas in the chamber; a second purge gas supply unit configured to supply purge gas into the substrate container through a gas supply line connected to the substrate container; and a second exhaust unit configured to exhaust gas in the substrate container through an exhaust line connected to the substrate container. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Embodiments of the present inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 is a diagram showing a configuration of a semiconductor manufacturing apparatus according to an embodiment;

[0011] Figure 2A and Figure 2B is a cross-sectional view of a semiconductor manufacturing apparatus according to an embodiment;

[0012] Figure 3 is a cross-sectional view of a load lock module according to an embodiment;

[0013] Figures 4 to 7 is a diagram for describing a cap holder according to an embodiment;

[0014] Figure 8 is a diagram for describing a substrate aligner according to an embodiment;

[0015] Figure 9 and Figure 10 is a diagram for describing a platen according to an embodiment;

[0016] Figure 11 is a flowchart of a method for processing a substrate using a semiconductor manufacturing apparatus according to an embodiment; and

[0017] 12A to 12E are views sequentially illustrating a method of processing a substrate using a semiconductor manufacturing apparatus according to an embodiment. DETAILED DESCRIPTION

[0018] Now, the present inventive concept will be described more fully with reference to the accompanying drawings, in which embodiments of the present inventive concept are shown. In the drawings, like elements are denoted by like reference numerals, and thus repeated explanation thereof will not be provided.

[0019] Figure 1 is a diagram showing the configuration of a semiconductor manufacturing apparatus 1 according to the embodiment.

[0020] Reference Figure 1 The semiconductor manufacturing equipment 1 may include a load lock module 10, a transfer module 20, a processing module 30, and a buffer module 40. For example, the semiconductor manufacturing equipment 1 may be a multi-chamber substrate processing system, which includes the transfer module 20 (including the substrate transfer robot 220), the load lock module 10, the processing module 30, and the buffer module 40. The load lock module 10, the processing module 30, and the buffer module 40 may be arranged around the transfer module 20.

[0021] The load lock module 10 may include a load lock chamber 110 having an inner space therein accommodating the substrate container 60. The substrate container 60 may be directly loaded into the load lock chamber 110, may be held in the load lock module 10 while a semiconductor manufacturing process is performed on the substrate, and may be unloaded from the load lock module 10 after the substrate, on which the semiconductor manufacturing process has been completed, is accommodated in the substrate container 60.

[0022] The substrate container 60 is a container in which semiconductor substrates such as wafers are accommodated, and a sealed front opening unified pod (FOUP) may be used as the substrate container 60 to prevent the substrate from being contaminated by impurities or chemical contaminants in the air when the substrate is transferred. The substrate container 60 may include a cover 620 (see FIG. Figure 3 ), which is detachably mounted on the main body 610 of the substrate container 60 (see Figure 3 ) to open / close the opening for transferring the substrate.

[0023] The load lock module 10 can adjust the pressure (i.e., the internal pressure) in the load lock chamber 110. For example, the load lock module 10 can adjust the internal pressure of the load lock chamber 110 between atmospheric pressure and vacuum. It should be understood that "vacuum" can describe a pressure that is less than atmospheric pressure (approximately 760 Torr) (in some embodiments, much less than atmospheric pressure). According to example embodiments, vacuum can describe, for example, 10 Torr or less, 10 -1 Torr or smaller or 10 -3 Torr or less.

[0024] For example, while loading or unloading the substrate container 60 into or from the load lock chamber 110, the load lock module 10 may adjust the internal pressure of the load lock chamber 110 to the atmospheric pressure so that the internal pressure of the load lock chamber 110 is balanced with the external pressure. The load lock chamber 110 may be opened or closed at the opening 113 (see FIG. Figure 2A ) of the door 115 (see Figure 2A ) before opening the load lock chamber 110, thereby preventing external air from suddenly flowing into the interior space 111 of the load lock chamber 110 when the door 115 is opened (see Figure 2A )middle.

[0025] In addition, when transferring a substrate between the transfer module 20 and the substrate container 60 accommodated in the load lock chamber 110 , the load lock module 10 may adjust the internal pressure of the load lock chamber 110 to vacuum.

[0026] An entry door 81 for opening / closing a passage through which the transfer arm 221 holding the substrate passes can be provided between the load lock module 10 and the transfer module 20. The entry door 81 can connect or separate the interior of the load lock chamber 110 and the interior of the transfer chamber 210 of the transfer module 20. Before the entry door 81 is opened, the load lock module 10 can adjust the internal pressure of the load lock chamber 110 to a vacuum. In this case, the internal pressure (i.e., vacuum) in the load lock chamber 110 can be adjusted to be close to the internal pressure of the transfer chamber 210 of the transfer module 20. Since the internal pressure of the load lock chamber 110 is adjusted to be close to the internal pressure of the transfer chamber 210, the pressure state of the transfer chamber 210 can be prevented from changing when the entry door 81 is opened.

[0027] The transfer module 20 may transfer substrates between the buffer module 40, the process module 30, and the substrate container 60 accommodated in the load lock module 10. The transfer module 20 may be a vacuum transfer module for transferring substrates in vacuum.

[0028] The transfer module 20 may include a transfer chamber 210 having a vacuum state therein and a substrate transfer robot 220 disposed in the transfer chamber 210, wherein the transfer module 20 is configured to transfer a substrate. The substrate transfer robot 220 may include a transfer arm 221 for holding a substrate. For example, when the access door 81 disposed between the transfer module 20 and the load lock module 10 is opened, the transfer arm 221 of the substrate transfer robot 220 may enter the substrate container 60 and may remove a substrate from the substrate container 60, or may load a substrate into the substrate container 60.

[0029] The process module 30 can perform semiconductor manufacturing processes on the substrate. An access door 83 for opening / closing a passage through which the transfer arm 221 holding the substrate can pass can be provided between the process module 30 and the transfer module 20. The process module 30 can include a plurality of process chambers 310 arranged on the sidewalls of the transfer module 20. The process module 30 can be, but is not limited to, a dry etching apparatus, a chemical vapor deposition (CVD) apparatus, a thermal furnace, a developing apparatus, or a cleaning apparatus.

[0030] The buffer module 40 can temporarily accommodate substrates that have completed semiconductor manufacturing processes performed by the process module 30 and can also purify the substrates. The buffer module 40 may include a buffer chamber 410 and a buffer stage 420 on which substrates that have completed semiconductor manufacturing processes are placed. An entry door 85 for opening and closing a passage through which the transfer arm 221 holding the substrates can pass may be provided between the transfer module 20 and the buffer module 40. However, in some embodiments, the entry door 85 may be omitted.

[0031] In addition, the buffer module 40 may include an exhaust device for exhausting gas in the internal space of the buffer chamber 410 to form a vacuum in the buffer chamber 410. Due to the exhaust device, a vacuum can be formed in the buffer chamber 410. The buffer module 40 can remove gas exhausted by outgassing from substrates that have completed semiconductor manufacturing processes by forming a vacuum in the buffer chamber 410. In addition, since a vacuum is formed in the buffer chamber 410, the substrate can be prevented from being contaminated by dirt generated when gas remaining on the substrate mixes with water vapor or impurities are adsorbed on the substrate.

[0032] In an embodiment, the buffer stage 420 may include a storage portion in which a plurality of substrates may be loaded simultaneously.

[0033] In an embodiment, the buffer module 40 may be configured to inject a purge gas into the substrate disposed on the buffer stage 420 .

[0034] In an embodiment, the buffer module 40 may adjust the internal pressure of the buffer chamber 410 so that the internal pressure of the buffer chamber 410 is lower than the internal pressure of the transfer chamber 210. Since the internal pressure of the buffer chamber 410 is lower than the internal pressure of the transfer chamber 210, a gas flow may be formed from the transfer chamber 210 toward the buffer chamber 410. Since the gas flow is formed from the transfer chamber 210 toward the buffer chamber 410, contaminants such as gas generated by outgassing from the substrate accommodated in the buffer chamber 410 may be discharged to the outside without flowing into the transfer chamber 210.

[0035] In addition, the semiconductor manufacturing equipment 1 may include a controller 50 (see Figure 3), which is used to control operations of the load lock module 10, the transfer module 20, the processing module 30, and the buffer module 40. Examples of the controller 50 may include a general-purpose personal computer (PC), a workstation, and a supercomputer.

[0036] In the semiconductor manufacturing apparatus 1 of the present inventive concept, since the substrate container 60 can be directly loaded in the load lock module 10 , the footprint of the semiconductor manufacturing apparatus 1 can be greatly reduced and productivity can be improved.

[0037] Figure 2A and Figure 2B is a cross-sectional view of a semiconductor manufacturing apparatus 1 according to the embodiment. Figure 2A A state is shown in which the opening 113 of the load lock chamber 110 is closed by the door 115 . Figure 2B A state is shown in which the opening 113 of the load lock chamber 110 is opened.

[0038] Reference Figure 2A and Figure 2B The load lock chamber 110 may include a door 115 configured to open / close an opening 113 for transferring the substrate container 60. The door 115 may open the opening 113 of the load lock chamber 110 so that the substrate container 60 can pass through the opening 113 when loading or unloading the substrate container 60. In addition, the door 115 may close the opening 113 of the load lock chamber 110 to isolate the inner space 111 of the load lock chamber 110 from the outside.

[0039] like Figure 2B As shown, the substrate container 60 can be loaded onto or unloaded from the load lock chamber 110 by a transfer mechanism 70 such as an overhead hoist transport system. That is, the transfer mechanism 70 can hold the substrate container 60 and can load the substrate container 60 into or out of the load lock chamber 110.

[0040] In detail, to load the substrate container 60, the door 115 may open the opening 113 of the load lock chamber 110, and the transfer mechanism 70 may lower the substrate container 60 and may release the substrate container 60 so that the substrate container 60 is placed on the platen 120 in the load lock chamber 110. In addition, to unload the substrate container 60, the door 115 may open the opening 113 of the load lock chamber 110, and the transfer mechanism 70 may hold the substrate container 60 on the platen 120 in the load lock chamber 110 and may lift the substrate container 60 to remove the substrate container 60 from the load lock chamber 110.

[0041] Figure 3 is a cross-sectional view of a load lock module 10 according to an embodiment.

[0042] Reference Figure 3 The load lock module 10 may include a load lock chamber 110 , a platen 120 , a substrate aligner 150 , a lid holder 160 , a first purge gas supply unit 131 , a first exhaust unit 133 , a second purge gas supply unit 141 , and a second exhaust unit 143 .

[0043] The load lock chamber 110 may include an inner space 111 in which a substrate container 60 for accommodating a plurality of substrates may be accommodated. In an embodiment, a protective layer may be provided on the inner surface of the load lock chamber 110 to prevent impurities such as particles from adhering to the inner surface of the load lock chamber 110. In addition, the load lock chamber 110 may include a heating unit configured to heat a chamber wall to remove impurities adhering to the chamber wall.

[0044] The platen 120 may be disposed in the load lock chamber 110 and may support the substrate container 60 accommodated in the load lock chamber 110. The platen 120 may be configured to fix the substrate container 60 and move the substrate container 60 in the load lock chamber 110.

[0045] The platen 120 may be connected to a platen driver 121 and may be moved by the platen driver 121 to move the substrate container 60 in the load lock chamber 110. The platen 120 may be configured to be moved horizontally (e.g., in the X direction or the Y direction), vertically (e.g., in the Z direction), and / or rotated (e.g., about the Z axis) in the load lock chamber 110 by the platen driver 121.

[0046] The substrate aligner 150 may be disposed in the load lock chamber 110 and may align substrates. The substrate aligner 150 may align the substrate so that it is positioned in a predetermined orientation before being transferred to the processing module. Specifically, the substrate aligner 150 may detect the crystal orientation of the substrate and align the substrate so that the detected crystal orientation is in a predetermined orientation. Furthermore, the substrate aligner 150 may inspect the substrate for defects.

[0047] Typically, if an aligner for aligning substrates is provided in the transfer module 20, when the aligner is damaged or malfunctions, the transfer module 20, a common component of the equipment, needs to be stopped to maintain the aligner, and thus the entire equipment needs to be stopped. However, in the embodiment, since the substrate aligner 150 is provided in the load lock chamber 110, maintenance of the substrate aligner 150 can be performed by simply stopping the load lock chamber 110 in which the substrate aligner 150 to be repaired is provided, without stopping the entire equipment.

[0048] In an embodiment, the substrate aligner 150 may be disposed between the platen 120 supporting the substrate container 60 and the side surface of the load lock chamber 110 that contacts the transfer module 20. For example, the substrate aligner 150 may be located between the entry door 81 and the platen 120. When an aligner for aligning substrates is provided in an additional chamber provided on one side of the transfer module 20, the transfer path of substrates from the load lock module 10 to the process module 30 may be increased. However, in an embodiment, since the substrate aligner 150 is located between the entry door 81 and the platen 120, the transfer path of substrates from the load lock module 10 to the process module 30 may be further reduced.

[0049] The lid holder 160 may separate the lid 620 of the substrate container 60 from the body 610 of the substrate container 60, or may mount the lid 620 of the substrate container 60 on the body 610. In addition, the lid holder 160 may support the lid 620 separated from the body 610 of the substrate container 60. In an embodiment, the lid holder 160 may mechanically fix the lid 620 of the substrate container 60.

[0050] For example, a process in which the cover holder 160 separates the cover 620 from the body 610 of the substrate container 60 will now be described.

[0051] First, when the cover 620 of the substrate container 60 is tightly attached to the cover holder 160 by moving the platen 120, the cover holder 160 is locked using a latch key 161 (see FIG. Figure 4 ) drives the lid locking device of the substrate container 60 so that the lid 620 is in an unlocked state in which the lid 620 can be separated from the body 610. The lid holder 160 can fix the unlocked lid 620. Since the unlocked lid 620 is fixed to the lid holder 160, as the body 610 of the substrate container 60 is moved away from the lid holder 160 by the platen 120, the lid 620 can be separated from the body 610 of the substrate container 60.

[0052] In addition, for example, a process in which the cover holder 160 mounts the cover 620 on the main body 610 will now be described.

[0053] First, the platen 120 moves the main body 610 so that the main body 610 of the substrate container 60 contacts the lid 620 fixed to the lid holder 160. When the main body 610 contacts the lid 620 fixed to the lid holder 160, the lid holder 160 releases the lid 620 so that the lid 620 can be separated from the lid holder 160. When the lid 620 can be separated from the lid holder 160, the lid holder 160 can drive the lid locking device of the substrate container 60 through the latch key 161, so that the lid 620 is in a locked state in which the lid 620 is mounted on the main body 610.

[0054] The first purge gas supply unit 131 may supply purge gas into the load lock chamber 110. The first purge gas supply unit 131 may adjust the internal pressure of the load lock chamber 110 by supplying the purge gas into the load lock chamber 110. For example, the first purge gas supply unit 131 may adjust the internal pressure of the load lock chamber 110 so that the internal pressure of the load lock chamber 110 is balanced with the pressure outside the load lock chamber 110 (e.g., atmospheric pressure).

[0055] For example, the first purge gas supply unit 131 may supply nitrogen gas, inert gas, and / or clean dry air into the load lock chamber 110 .

[0056] The first purge gas supply unit 131 may include a first purge gas supply source 1311 and a first gas supply line 1313. The first gas supply line 1313 may extend between the first purge gas supply source 1311 and the load lock chamber 110 and may supply the purge gas from the first purge gas supply source 1311 to the load lock chamber 110. A diffuser 1315 connected to one end of the first gas supply line 1313 may be provided in the load lock chamber 110 and may diffuse the purge gas into the load lock chamber 110.

[0057] The first exhaust unit 133 can exhaust gas from the load lock chamber 110. The first exhaust unit 133 can adjust the internal pressure of the load lock chamber 110 by exhausting the gas from the load lock chamber 110. For example, the first exhaust unit 133 can purge the gas from the load lock chamber 110 so that the internal pressure of the load lock chamber 110 becomes a vacuum. The first exhaust unit 133 can adjust the internal pressure of the load lock chamber 110 so that the internal pressure of the load lock chamber 110 reaches equilibrium with the internal pressure of the transfer chamber 210.

[0058] For example, the first exhaust unit 133 may reduce the internal pressure of the load lock chamber 110 to 10 Torr or less, 10 -1 Torr or smaller or 10 -3 or smaller.

[0059] The first exhaust unit 133 may exhaust particles in the load lock chamber 110 to the outside by exhausting the gas in the load lock chamber 110. For example, the first exhaust unit 133 may exhaust the gas in the load lock chamber 110 through the exhaust port 117 formed at the bottom of the load lock chamber 110. In this case, the purge gas diffused by the diffuser 1315 may flow downward toward the exhaust port 117, and impurities such as particles in the load lock chamber 110 may move together with the purge gas and be exhausted to the outside through the exhaust port 117.

[0060] For example, the first exhaust unit 133 may include a first vacuum pump 1331 and a first exhaust line 1333. The first exhaust line 1333 may extend between the first vacuum pump 1331 and the exhaust port 117 of the load lock chamber 110.

[0061] The second purge gas supply unit 141 may supply purge gas to the substrate container 60 placed on the platen 120. The second purge gas supply unit 141 may adjust the internal pressure of the substrate container 60 by supplying the purge gas to the substrate container 60. For example, when the internal pressure of the load lock chamber 110 is switched from vacuum to atmospheric pressure, the second purge gas supply unit 141 may adjust the internal pressure of the substrate container 60 so that the internal pressure of the substrate container 60 is balanced with the internal pressure of the load lock chamber 110.

[0062] For example, the second purge gas supply unit 141 may supply nitrogen gas, inert gas, and / or clean dry air into the substrate container 60 .

[0063] For example, the second purge gas supply unit 141 may include a second purge gas supply source 1411 and a second gas supply line 1413. The second gas supply line 1413 may extend between the second purge gas supply source 1411 and the substrate container 60 and may be connected to a gas inlet hole of the substrate container 60. In an embodiment, the second gas supply line 1413 may be disposed on the platen 120 so as to pass through the platen 120 and communicate with the gas inlet hole of the substrate container 60 disposed on the platen 120.

[0064] The second discharge unit 143 may discharge gas from the substrate container 60. The second discharge unit 143 may adjust the internal pressure of the substrate container 60 by discharging the gas from the substrate container 60. For example, the second discharge unit 143 may purge the gas from the substrate container 60 so that the internal pressure of the substrate container 60 becomes a vacuum. For example, the second discharge unit 143 may adjust the internal pressure of the substrate container 60 so that the internal pressure of the substrate container 60 is balanced with the internal pressure of the load lock chamber 110.

[0065] For example, the second discharge unit 143 may reduce the internal pressure of the substrate container 60 to 10 Torr or less, 10 -1 Torr or smaller or 10 -3 or smaller.

[0066] In addition, the second discharge unit 143 may discharge particles in the substrate container 60 to the outside by discharging the gas in the substrate container 60. For example, the second discharge unit 143 may discharge gas exhausted by degassing a substrate that has completed a semiconductor manufacturing process to the outside.

[0067] For example, the second exhaust unit 143 may include a second vacuum pump 1431 and a second exhaust line 1433. The second exhaust line 1433 may extend between the second vacuum pump 1431 and the substrate container 60 and may be connected to a gas exhaust hole of the substrate container 60. In an embodiment, the second exhaust line 1433 may be installed in the platen 120 to pass through the platen 120 and communicate with the gas exhaust hole of the substrate container 60 placed on the platen 120.

[0068] In an embodiment, the steps of adjusting the internal pressure of the substrate container 60 by the second purge gas supply unit 141 and adjusting the internal pressure of the substrate container 60 by the second exhaust unit 143 may be performed in a state in which the lid 620 of the substrate container 60 is mounted on the body 610. That is, the internal pressure of the substrate container 60 may be adjusted in a state in which the internal space of the substrate container 60 is separated from the internal space 111 of the load lock chamber 110.

[0069] Since the internal pressure of the substrate container 60 is adjusted in a state where the internal space of the substrate container 60 is separated from the internal space 111 of the load lock chamber 110, the internal pressure of the substrate container 60 can be independently adjusted by the second purge gas supply unit 141 and the second exhaust unit 143. That is, the first purge gas supply unit 131 and the first exhaust unit 133 can adjust the internal pressure of the load lock chamber 110, and the second purge gas supply unit 141 and the second exhaust unit 143 can adjust the internal pressure of the substrate container 60.

[0070] The controller 50 may detect the internal pressure of the load lock chamber 110 and the internal pressure of the substrate container 60. The controller 50 may control the first purge gas supply unit 131 and / or the first exhaust unit 133 to adjust the internal pressure of the load lock chamber 110, and may control the second purge gas supply unit 141 and / or the second exhaust unit 143 to adjust the internal pressure of the substrate container 60.

[0071] In an embodiment, while the internal pressure of the load lock chamber 110 is switched from vacuum to atmospheric pressure, the controller 50 may control the second purge gas supply unit 141 to balance the internal pressure of the substrate container 60 with the internal pressure of the load lock chamber 110. In addition, while the internal pressure of the load lock chamber 110 is switched from atmospheric pressure to vacuum, the controller 50 may control the second exhaust unit 143 to balance the internal pressure of the substrate container 60 with the internal pressure of the load lock chamber 110.

[0072] Since the internal pressure of the substrate container 60 is changed to be balanced with the internal pressure of the load lock chamber 110, the pressure difference between the internal pressure of the substrate container 60 and the internal pressure of the load lock chamber 110 can be small. Therefore, the substrate container 60 can be prevented from being deformed due to the pressure difference between the internal pressure of the substrate container 60 and the internal pressure of the load lock chamber 110.

[0073] Figures 4 to 7 1 is a diagram for describing a cap holder 160 according to an embodiment. Figure 4 1 is a diagram illustrating a state in which the cover 620 of the substrate container 60 is detachable from the cover holder 160 . Figure 5 It shows Figure 4 An enlarged view of a portion of . Figure 6 1 is a diagram illustrating a state in which the cover 620 of the substrate container 60 is fixed to the cover holder 160 . Figure 7 It shows Figure 6 An enlarged view of a portion of .

[0074] Reference Figures 4 to 7 The cover holder 160 may include a latch key 161 for driving a cover locking device of the substrate container 60 and a support member 163 for supporting the substrate container 60 .

[0075] The latch key 161 may be inserted into a key hole 623 formed in the lid 620 of the substrate container 60. Since the latch key 161 rotates in a state in which the latch key 161 is inserted into the key hole 623, the latch key 161 may drive the lid locking device of the substrate container 60 between a locked state in which the lid 620 is mounted on the body 610 and an unlocked state in which the lid 620 is detachable from the body 610.

[0076] The support member 163 may include a post 1631 inserted into a groove 621 formed in the lid 620 of the substrate container 60 and a fixed pad 1633 mounted on the post 1631. The fixed pad 1633 may be configured to expand or contract. For example, the fixed pad 1633 may have a space into which air can be injected, and the volume of the fixed pad 1633 may be increased by injecting air and reduced by exhausting air.

[0077] like Figure 4 and Figure 5 As shown, the lid holder 160 can cause the fixing piece 1633 to retract so that the lid 620 of the substrate container 60 can be separated from the lid holder 160. As the fixing piece 1633 retracts, the fixing piece 1633 can be separated from the groove 621 of the lid 620, and the lid 620 mounted on the body 610 of the substrate container 60 can move freely without being fixed to the support member 163.

[0078] like Figure 6and Figure 7 As shown, the lid holder 160 can expand the fixing piece 1633 to fix the lid 620 of the substrate container 60 to the lid holder 160. As the fixing piece 1633 expands, the fixing piece 1633 can be tightly attached to the groove 621 of the lid 620, and the lid 620 of the substrate container 60 can be fixed to the support 163. As the platen 120 moves the body 610 of the substrate container 60 away from the lid holder 160, the lid 620 of the substrate container 60 can be separated from the body 610, and the lid 620 can be fixed to the lid holder 160.

[0079] Figure 8 is a diagram for describing a substrate aligner 150 according to an embodiment.

[0080] Reference Figure 8 The substrate aligner 150 may include a substrate chuck 151 for fixing the substrate S and a chuck driver 153 for rotating the substrate chuck 151 .

[0081] The substrate chuck 151 may mechanically fix the substrate S. In an embodiment, the substrate chuck 151 may include a bottom 1511 on which the substrate S is placed and a substrate clamp 1513 for supporting the substrate S on the bottom 1511 .

[0082] For example, the process of aligning a substrate S by the substrate aligner 150 will now be described. First, the substrate transfer robot 220 of the transfer module 20 transfers the substrate S from the substrate container 60 to the bottom 1511. When the substrate S is placed on the bottom 1511 by the substrate transfer robot 220, the substrate clamp 1513 contacts and supports the substrate S. While the substrate S is secured by the substrate clamp 1513, the substrate aligner 150 detects the crystal orientation of the substrate S and rotates the substrate chuck 151 to adjust the detected crystal orientation to a predetermined orientation. When the step of aligning the substrate S is completed, the substrate clamp 1513 releases the substrate S, and the substrate transfer robot 220 transfers the aligned substrate S to the processing module 30.

[0083] In an embodiment, the substrate S may be aligned by the substrate aligner 150 in the load lock chamber 110 containing a vacuum. In this case, it may be difficult to fix the substrate S by using a vacuum adsorption method in a vacuum. However, in an embodiment, since the substrate aligner 150 can mechanically fix the substrate S, the substrate aligner 150 can stably fix the substrate S even in a vacuum.

[0084] Figure 9 and Figure 10 is a diagram for describing the platen 120 according to the embodiment.

[0085] Reference Figure 9 and Figure 10The platen 120 may include a plate 122 on which the substrate container 60 is placed, and a locking lever 123 mounted on the plate 122. The locking lever 123 for fixing the substrate container 60 may be configured to switch between a fixed position for fixing the substrate container 60 and a released position for releasing the substrate container 60. For example, the locking lever 123 may be configured to fix the substrate container 60 by engaging with a protrusion 613 of the substrate container 60.

[0086] In an embodiment, the plate 122 may include an upper plate 1223 on which the substrate container 60 is arranged and a lower plate 1221 located below the upper plate 1223, and the locking lever 123 may include a first link 1231 pivotally mounted on the lower plate 1221 and a second link 1233 pivotally mounted on the upper plate 1223. The second link 1233 may be connected to the first link 1231 and may be configured to pivot when the first link 1231 pivots.

[0087] The distance between the upper plate 1223 and the lower plate 1221 may be adjustable. For example, the upper plate 1223 may be configured to be raised and / or lowered relative to the lower plate 1221, or the lower plate 1221 may be configured to be raised and / or lowered relative to the upper plate 1223. Alternatively, the raising and / or lowering of the upper plate 1223 and the raising and / or lowering of the lower plate 1221 may be performed together. In this case, as Figure 9 and Figure 10 As shown, as the distance between the upper plate 1223 and the lower plate 1221 is adjusted, the locking lever 123 may be configured to switch between a fixed position and a released position.

[0088] Now refer to Figure 9 and Figure 10 The process of securing the substrate container 60 to the platen 120 will be described. First, as the distance between the lower plate 1221 and the upper plate 1223 decreases, the first link 1231 may pivot in a first pivot direction (e.g., counterclockwise). As the first link 1231 pivots, the second link 1233 may pivot about a pivot shaft 1235 coupled to the upper plate 1223 in a second pivot direction (e.g., clockwise) opposite to the first pivot direction. The second link 1233 may pivot to a fixed position for securing the substrate container 60, and the upper portion of the second link 1233 may engage with the protrusion 613 to secure the substrate container 60. The upper portion of the second link 1233 that engages with the protrusion 613 of the substrate container 60 may have a shape suitable for engaging with the protrusion 613. For example, the upper portion of the second link 1233 may include a hook structure 1237 that engages with the protrusion 613.

[0089] In addition, the process of releasing the substrate container 600 will now be described. First, as the distance between the lower plate 1221 and the upper plate 1223 increases, the first link 1231 may pivot in the second pivot direction. When the first link 1231 pivots, the second link 1233 may pivot in the first pivot direction about the pivot shaft 1235 coupled to the upper plate 1223. The second link 1233 may pivot from the fixed position to the release position, and the upper portion of the second link 1233 may separate from the protrusion 613 to release the substrate container 60.

[0090] Figure 11 is a flowchart of a method for processing a substrate using the semiconductor manufacturing apparatus 1 according to the embodiment. 12A to 12E The diagrams sequentially illustrate a method of processing a substrate using the semiconductor manufacturing apparatus 1 according to the embodiment. Figure 11 and 12A to 12E A method of processing a substrate using the semiconductor manufacturing apparatus 1 is described.

[0091] Reference Figure 11 In operation S110 , a substrate container 60 accommodating a plurality of substrates therein is loaded on the load lock module 10 .

[0092] like Figure 2B As shown, the door 115 can open the opening 113 of the load lock chamber 110, and the substrate container 60 can be placed on the platen 120 in the load lock chamber 110 by the transfer mechanism 70 such as the overhead transport system. The substrate container 60 can be aligned with a preset position on the platen 120 and can be fixed to the platen 120. When the substrate container 60 is loaded on the load lock module 10, the door 115 can close the opening 113 to separate the interior space 111 of the load lock chamber 110 from the outside of the load lock chamber 110.

[0093] Reference Figure 11 and Figure 12A In operation S120, the gas in the substrate container 60 and the gas in the load lock chamber 110 are exhausted so that each of the internal pressure of the substrate container 60 and the internal pressure of the load lock chamber 110 becomes vacuum.

[0094] Specifically, the first discharge unit 133 discharges gas from the load lock chamber 110 so that the internal pressure of the load lock chamber 110 switches from atmospheric pressure to vacuum, and the second discharge unit 143 discharges gas from the substrate container 60 so that the internal pressure of the substrate container 60 switches from atmospheric pressure to vacuum. In this case, the controller 50 can detect the internal pressures of the load lock chamber 110 and the internal pressures of the substrate container 60 so that the internal pressures of the load lock chamber 110 and the internal pressures of the substrate container 60 are balanced with each other, and based on the detected information, the discharge speed and / or discharge amount can be adjusted by the first discharge unit 133 and the discharge speed and / or discharge amount can be controlled by the second discharge unit 143.

[0095] Reference Figure 11 、 Figure 12B and Figure 12C In operation S130 , when the internal pressures of the load lock chamber 110 and the substrate container 60 reach equilibrium with a preset pressure of vacuum, the cover 620 of the substrate container 60 is separated from the body 610 .

[0096] In detail, Figure 12B As shown, the platen 120 can move the substrate container 60 so that the lid 620 of the substrate container 60 contacts the lid holder 160. In this case, the platen 120 can rotate so that the lid 620 of the substrate container 60 faces the inner surface of the load lock chamber 110 in which the lid holder 160 is provided, and can move vertically and horizontally so that the lid 620 contacts the lid holder 160. Figure 7 As shown, when the lid 620 of the substrate container 60 contacts the lid holder 160 due to the movement of the platen 120, the latch key 161 can drive the lid locking device of the substrate container 60 to put the lid 620 in an unlocked state, and the fixing piece 1633 can expand to be fixed to the groove 621 of the lid 620. Figure 12C As shown, when the body 610 is moved away from the cover holder 160 by the platen 120 , the cover 620 may be separated from the body 610 and may be fixed to the cover holder 160 , and the opening 611 of the substrate container 60 may be opened.

[0097] Reference Figure 11 and Figure 12D , in operation S140, the cover 620 of the substrate container 60 is separated from the body 610, and then a semiconductor manufacturing process is performed on the substrate.

[0098] In detail, the transfer module 20 may perform a first transfer operation T1 of transporting a substrate from the substrate container 60 placed on the platen 120 to the substrate aligner 150 , and the substrate aligner 150 may align the substrate in a preset direction.

[0099] When the alignment step of the substrate is completed, the transfer module 20 performs a second transfer operation T2 of transferring the substrate from the substrate aligner 150 to the process module 30. The process module 30 may perform a semiconductor manufacturing process, for example, an etching process, a deposition process, or a cleaning process, on the substrate.

[0100] When the semiconductor manufacturing process performed by the process module 30 is completed, the transfer module 20 performs a third transfer operation T3 of transferring the substrate from the process module 30 to the buffer module 40. The buffer module 40 may remove gas discharged by outgassing from the substrate by forming a vacuum in the buffer chamber 410.

[0101] Next, the process module 30 may perform a fourth transfer operation T4 of transferring the substrate from the buffer module 40 to the substrate container 60 in the load lock chamber 110 .

[0102] In operation S150 , when the semiconductor manufacturing process is completed for the substrates and all the substrates are accommodated in the substrate container 60 , the cover 620 of the substrate container 60 is mounted on the body 610 to close the opening of the substrate container 60 .

[0103] In detail, the platen 120 may move the substrate container 60 so that the body 610 of the substrate container 60 contacts the lid 620 supported on the lid holder 160. Figure 5 As shown, the latch key 161 can drive the lid locking device of the substrate container 60 so that the lid 620 is in a locked state in which the lid 620 is mounted on the body 610, and the fixing piece 1633 can be retracted so that the lid 620 can be separated from the lid holder 160. Then, as the platen 120 moves away from the lid holder 160, the lid 620 mounted on the body 610 can move together with the platen 120 and can be separated from the lid holder 160.

[0104] Reference Figure 11 and Figure 12E In operation S160 , after the cover 620 of the substrate container 60 is mounted on the body 610 , a purge gas is filled in the substrate container 60 and the load lock chamber 110 .

[0105] Specifically, the first purge gas supply unit 131 supplies purge gas into the load lock chamber 110 so that the internal pressure of the load lock chamber 110 is switched from vacuum to atmospheric pressure, and the second purge gas supply unit 141 supplies purge gas into the substrate container 60 so that the internal pressure of the substrate container 60 is switched from vacuum to atmospheric pressure. In this case, the controller 50 can detect the internal pressures of the load lock chamber 110 and the internal pressures of the substrate container 60 so that the internal pressures of the load lock chamber 110 and the internal pressures of the substrate container 60 are balanced with each other, and based on the detected information, the supply amount and / or supply speed can be adjusted by the first purge gas supply unit 131 and the supply amount and / or supply speed can be controlled by the second purge gas supply unit 141.

[0106] In operation S170, when each of the internal pressure of the substrate container 60 and the internal pressure of the load lock chamber 110 is switched to the atmospheric pressure, the substrate container 60 is unloaded from the load lock module 10. Figure 2B As shown, the door 115 may open the opening 113 of the load lock chamber 110 , and the transfer mechanism 70 may hold the substrate container 60 on the platen 120 and may remove the substrate container 60 from the load lock chamber 110 .

[0107] Although the present invention has been specifically illustrated and described with reference to the embodiments of the present invention using specific terms, the embodiments and terms are intended only to explain the present invention and should not be construed as limiting the scope of the present invention as defined in the claims. It should be understood by one of ordinary skill in the art that various modifications and equivalent embodiments may be made from the present invention. Therefore, the true technical scope of the present invention is defined by the technical spirit of the claims.

Claims

1. A semiconductor manufacturing device comprising: a load lock module comprising a load lock chamber in which a substrate container is received, wherein the load lock module is configured to switch an internal pressure of the load lock chamber between atmospheric pressure and a vacuum; as well as a transfer module configured to transfer a substrate between the substrate container accommodated in the load lock chamber and a process module for performing a semiconductor manufacturing process on the substrate, Wherein, the loading lock module includes: a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to exhaust gas in the substrate container through an exhaust line connected to the substrate container, wherein the load lock module further comprises a platen configured to support the substrate container, and The platen includes a plate on which the substrate container is placed and a locking lever pivotally mounted on the plate. wherein the locking lever is configured to pivot between a fixed position in which the locking lever engages with a protrusion of the substrate container to secure the substrate container and a release position in which the locking lever disengages from the protrusion of the substrate container to release the substrate container. wherein the plate comprises an upper plate and a lower plate located below the upper plate, wherein the distance between the upper plate and the lower plate is adjustable, and The locking lever includes a first link pivotally mounted on the lower plate and a second link pivotally mounted on the upper plate, and The first link is configured to pivot while adjusting a distance between the upper plate and the lower plate, and the second link is configured to pivot between the fixing position and the releasing position while the first link pivots.

2. The semiconductor manufacturing equipment according to claim 1, wherein The substrate container includes a main body and a cover detachably mounted on the main body. The exhaust unit is further configured to exhaust gas in the substrate container when the internal pressure of the load lock chamber is switched from atmospheric pressure to vacuum, so that the internal pressure of the substrate container is switched from atmospheric pressure to vacuum.

3. The semiconductor manufacturing equipment according to claim 1, wherein The substrate container includes a main body and a cover detachably mounted on the main body. The purge gas supply unit is further configured to supply the purge gas into the substrate container when the internal pressure of the load lock chamber is switched from vacuum to atmospheric pressure, so that the internal pressure of the substrate container is switched from vacuum to atmospheric pressure.

4. The semiconductor manufacturing equipment according to claim 1, wherein The substrate container includes a main body and a cover detachably mounted on the main body. The load lock module further includes a cover holder configured to separate the cover from the main body and support the cover.

5. The semiconductor manufacturing equipment according to claim 4, wherein The cover holder includes a post inserted into a groove of the cover and a fixing piece mounted on the post, wherein the fixing piece is configured to expand or contract, Wherein, the cover holder is further constructed as follows: expanding the fixing piece so that the fixing piece is fixed to the groove of the cover, or The fixing piece is contracted to make the fixing piece separable from the groove of the cover.

6. The semiconductor manufacturing equipment according to claim 1, wherein The load lock module further includes a substrate aligner disposed in the load lock chamber.

7. The semiconductor manufacturing equipment according to claim 6, wherein: The substrate aligner includes a substrate chuck configured to mechanically secure the substrate.

8. The semiconductor manufacturing equipment according to claim 1, further comprising a buffer module connected to the transfer module, in, The buffer module is configured to temporarily accommodate the substrate that has completed the semiconductor manufacturing process and to purify the substrate in a vacuum.

9. The semiconductor manufacturing equipment according to claim 8, wherein The buffer module includes a buffer chamber in which a first vacuum is formed, and The transfer module includes a transfer chamber in which a second vacuum is formed, The first vacuum of the buffer chamber is lower than the second vacuum of the transfer chamber.

10. A semiconductor manufacturing apparatus comprising: a load lock module comprising a load lock chamber in which a substrate container is received, wherein the load lock module is configured to switch an internal pressure of the load lock chamber between atmospheric pressure and a vacuum; a transfer module configured to transfer a substrate between the substrate container accommodated in the load lock chamber and a process module for performing a semiconductor manufacturing process on the substrate; and a buffer module connected to the transfer module, wherein the buffer module is configured to temporarily accommodate the substrate that has completed the semiconductor manufacturing process performed by the process module and to purge the substrate in a vacuum, wherein the load lock module further comprises a platen configured to support the substrate container, and The platen includes a plate on which the substrate container is placed and a locking lever pivotally mounted on the plate, and wherein the locking lever is configured to pivot between a fixed position in which the locking lever engages with a protrusion of the substrate container to secure the substrate container and a release position in which the locking lever disengages from the protrusion of the substrate container to release the substrate container. wherein the plate comprises an upper plate and a lower plate located below the upper plate, wherein the distance between the upper plate and the lower plate is adjustable, and The locking lever includes a first link pivotally mounted on the lower plate and a second link pivotally mounted on the upper plate, and The first link is configured to pivot while adjusting a distance between the upper plate and the lower plate, and the second link is configured to pivot between the fixing position and the releasing position while the first link pivots.

11. The semiconductor manufacturing equipment according to claim 10, wherein: The load lock module is further configured to adjust the internal pressure of the substrate container while switching the internal pressure of the load lock chamber so that the internal pressure of the substrate container is balanced with the internal pressure of the load lock chamber.

12. The semiconductor manufacturing equipment according to claim 10, wherein The substrate container includes a main body and a cover detachably mounted on the main body. The load lock module is further configured to adjust an internal pressure of the substrate container in a state in which the cover is mounted on the main body.

13. The semiconductor manufacturing equipment according to claim 10, wherein The substrate container includes a main body and a cover detachably mounted on the main body. The load lock module further includes: a cover holder configured to separate the cover from the substrate container and support the cover; and a substrate aligner configured to align the substrate.

14. The semiconductor manufacturing equipment according to claim 13, wherein The transfer module is further configured to sequentially perform a first transfer operation of transferring the substrate from the substrate container accommodated in the load lock chamber to the substrate aligner, a second transfer operation of transferring the substrate from the substrate aligner to the process module, a third transfer operation of transferring the substrate from the process module to the buffer module, and a fourth transfer operation of transferring the substrate from the buffer module to the substrate container accommodated in the load lock chamber.

15. A load lock module comprising: a chamber housing therein a substrate container configured to hold a plurality of substrates; a platen disposed in the chamber, wherein the platen is configured to support the substrate container; a first purge gas supply unit configured to supply a purge gas into the chamber; a first exhaust unit configured to exhaust the gas in the chamber; a second purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; a second exhaust unit configured to exhaust gas in the substrate container through an exhaust line connected to the substrate container, wherein the platen comprises a plate on which the substrate container is placed and a locking lever pivotally mounted on the plate, wherein the locking lever is configured to pivot between a fixed position in which the locking lever engages with a protrusion of the substrate container to secure the substrate container and a release position in which the locking lever disengages from the protrusion of the substrate container to release the substrate container. wherein the plate comprises an upper plate and a lower plate located below the upper plate, wherein the distance between the upper plate and the lower plate is adjustable, and The locking lever includes a first link pivotally mounted on the lower plate and a second link pivotally mounted on the upper plate, and The first link is configured to pivot while adjusting a distance between the upper plate and the lower plate, and the second link is configured to pivot between the fixing position and the releasing position while the first link pivots.

16. The load lock module of claim 15, wherein: The substrate container includes a main body and a cover detachably mounted on the main body. The load lock module is configured to adjust an internal pressure of the substrate container when the cover is mounted on the main body so that the internal pressure of the substrate container is balanced with the internal pressure of the chamber.

17. The load lock module of claim 16, wherein: The first purge gas supply unit is further configured to supply purge gas into the chamber so that the internal pressure of the chamber is switched from vacuum to atmospheric pressure, and The second purge gas supply unit is further configured to supply purge gas into the substrate container so that the internal pressure of the substrate container is switched from vacuum to atmospheric pressure while the internal pressure of the chamber is switched by the first purge gas supply unit.

18. The load lock module of claim 17, wherein: The first exhaust unit is further configured to exhaust the gas in the chamber so that the internal pressure of the chamber is switched from atmospheric pressure to vacuum, and The second exhaust unit is further configured to exhaust gas in the substrate container simultaneously with switching the internal pressure of the chamber by the first exhaust unit so that the internal pressure of the substrate container is switched from atmospheric pressure to vacuum.

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