Light emitting device, headlight for a vehicle, and vehicle comprising the same

Abstract

A light emitting device, a headlight for a vehicle, and a vehicle are provided. The light emitting device includes an emission array and a partition wall, the emission array including a plurality of light emitting elements. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor, and the second region is associated with a second emission factor different from the first emission factor.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2018-0083649, filed on July 18, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present inventive concept relates to a light emitting device, a headlight for a vehicle, and a vehicle including the same, and more particularly, to a light emitting device, a headlight for a vehicle, and a vehicle including the same that are optimized according to emission area and have reduced manufacturing cost and operating energy. Background Art

[0004] The lighting device may include a plurality of light emitting elements, each of which may be configured to perform various corresponding functions to meet various corresponding roles or purposes. Summary of the Invention

[0005] Some exemplary embodiments of the present inventive concept provide a light emitting device that can be optimized according to the purpose of an emission region and that reduces manufacturing costs and operating energy. The light emitting device can be optimized so that the light emitting elements of the light emitting device can have improved efficiency relative to the corresponding role or purpose that the light emitting elements are configured to meet.

[0006] Some exemplary embodiments of the present inventive concept provide a headlamp for a vehicle that can be optimized according to the purpose of the emission area and reduces manufacturing costs and operating energy. The headlamp can be optimized so that the light-emitting elements of the headlamp have improved efficiency relative to the corresponding role or purpose that the light-emitting elements are configured to meet.

[0007] Some exemplary embodiments of the present inventive concept provide a vehicle that can be optimized according to the purpose of an emission zone and reduce manufacturing costs and operating energy. The vehicle can be optimized so that the vehicle's light-emitting elements can have improved efficiency relative to the corresponding role or purpose that the light-emitting elements are configured to meet.

[0008] According to some aspects of the present inventive concept, a light emitting device may include an emission array and a partition wall. The emission array may include a plurality of light emitting elements. The emission array may include a first region and a second region. The first region and the second region may be adjacent to each other. The partition wall may be configured to separate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region may be associated with a first emission factor, and the second region may be associated with a second emission factor. The second emission factor may be different from the first emission factor.

[0009] According to some aspects of the present inventive concepts, a headlight for a vehicle may include a lighting device. The lighting device may include: a plurality of light-emitting elements and a plurality of emission regions separated from each other by one or more partition walls. At least two of the plurality of emission regions are associated with different emission factors.

[0010] According to some aspects of the present inventive concept, a headlight for a vehicle is provided, comprising a light-emitting device. The light-emitting device includes a plurality of light-emitting elements and a plurality of emission regions separated from each other by a partition wall. At least two of the plurality of emission regions have different emission factors.

[0011] According to some aspects of the present inventive concept, a light-emitting device may include an emission array, a partition wall, and a fluorescent layer. The emission array may include a plurality of light-emitting elements. The emission array may include a first region and a second region. The first region may include a first light-emitting element. The second region may include a second light-emitting element. The first region and the second region may be adjacent to each other. The partition wall may surround the first region and the second region. The fluorescent layer may be located in an open enclosure at least partially defined by the partition wall and the first and second light-emitting elements, such that a first portion of the fluorescent layer is in the first region and a second portion of the fluorescent layer is in the second region. The first region may be associated with a first emission factor, and the second region may be associated with a second emission factor, the second emission factor being different from the first emission factor. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Embodiments of the present inventive concept will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a plan view of a light emitting device according to some example embodiments;

[0014] Figure 2 is a cross-sectional view illustrating a case where each of the first region and the third region includes one light emitting element or a plurality of light emitting elements according to some example embodiments;

[0015] Figure 3A is a cross-sectional view illustrating a case where each of the second region and the fourth region includes one light emitting element according to some example embodiments;

[0016] Figure 3B According to some example embodiments Figure 3A a plan view of the plan shapes of the second and fourth zones;

[0017] Figure 4 is a cross-sectional view illustrating a case where one light emitting element is shared between two regions according to some example embodiments;

[0018] Figure 5 is a diagram of a light emitting device according to some example embodiments;

[0019] Figure 6A is a plan view of a light emitting device according to some example embodiments;

[0020] Figure 6B It is along Figure 6A a partial cross-sectional perspective view taken along line VIB-VIB';

[0021] Figure 7 is a perspective view of a vehicle according to some example embodiments;

[0022] Figure 8 According to some example embodiments, Figure 7 A front view of the headlight module in the headlight unit;

[0023] Figure 9A is a diagram illustrating a photometric grid defined in Electrical and Computer Engineering (ECE) Rule 112 (R112) according to some example embodiments;

[0024] Figure 9B is an illustration of a pair of headlight modules meeting the photometric grid conditions of ECE R112 according to some example embodiments;

[0025] Figure 10 is a cross-sectional view of a portion of a light emitting device in which the height of a partition wall is changed according to some example embodiments;

[0026] Figure 11 is a cross-sectional view of a portion of a light emitting device in which the shape of a free surface is changed according to some example embodiments;

[0027] Figure 12 is a cross-sectional view of a portion of a light emitting device having partition walls having various thicknesses according to some example embodiments;

[0028] Figure 13 is an exploded perspective view of a lighting apparatus including a light emitting device according to some example embodiments;

[0029] Figure 14 is an exploded perspective view of a pole-type lighting apparatus including a light emitting device according to some example embodiments;

[0030] Figure 15 is an exploded perspective view of a lighting apparatus including a light emitting device according to some example embodiments;

[0031] Figure 16 is a diagram for describing an indoor lighting control network system including light emitting devices according to some example embodiments;

[0032] Figure 17is a diagram for describing a network system including a light emitting device according to some example embodiments;

[0033] Figure 18A is a partial plan view of a headlight module according to some example embodiments;

[0034] Figure 18B According to some example embodiments, Figure 18A A sectional view taken along line BB';

[0035] Figure 18C is a diagram illustrating a method according to some example embodiments Figure 18A a timing diagram illustrating an example of the operation of each of the light emitting elements of the headlight module; and

[0036] Figures 19A to 19J are cross-sectional views illustrating a method of manufacturing a light emitting device according to a process order according to some example embodiments. DETAILED DESCRIPTION

[0037] Figure 1 is a plan view of a lighting device 10 according to some example embodiments. In some example embodiments, the lighting device 10 may be a headlight for a vehicle, as further described herein.

[0038] Reference Figure 1 , the light emitting device 10 may include an emission region 110, also interchangeably referred to herein as an "emission array." Figure 1 As shown, the emission region 110 of the light emitting device 10 may include a first region 110A and a second region 110B. Figure 1 As further shown in FIG, the emission region 110 of the light emitting device 10 may further include a third region 110C and a fourth region 110D.

[0039] At least Figure 1 As shown, the first region 110A and the second region 110B may be adjacent to each other. Figure 1 As shown, in some example embodiments, the first region 110A and the third region 110C may be adjacent to each other. Figure 1 As shown, in some example embodiments, the second region 110B and the third region 110C may be adjacent to each other. Figure 1As shown, in some example embodiments, the second zone 110B and the fourth zone 110D may be adjacent to each other. The first to fourth zones (110A, 110B, 110C, and 110D) may be divided from each other by partition walls 120. In other words, the light emitting device 10 may include one or more partition walls 120 configured to isolate one or more zones (e.g., the first zone 110A) from one or more other zones (e.g., the second zone 110B) from each other. The one or more partition walls 120 may surround each of the first to fourth zones (110A, 110B, 110C, and 110D). In other words, the term "zone" may be defined as a specific (or, alternatively, predetermined) area ("portion") of the emission zone 110 that is at least partially surrounded or divided by one or more partition walls 120 on the light emitting device 10. In other words, in some example embodiments, the one or more partition walls 120 may at least partially define one or more zones of the first to fourth zones 110A to 110D in the emission zone 110. One or more partition walls 120 may isolate one region (eg, the first region 110A) from another region (eg, the second region 110B) to at least partially define the region.

[0040] Each of the first to fourth regions (110A, 110B, 110C, and 110D) may include one light-emitting element or multiple light-emitting elements. In some cases, each of the first to fourth regions (110A, 110B, 110C, and 110D) may be part of a chip, or include one chip or multiple chips. Therefore, it should be understood that the emission region 110 of the light-emitting device 10 may be a region of the light-emitting device 10 that includes multiple light-emitting elements. In some example embodiments, separate regions of the emission region 110 (e.g., the first region 110A and the second region 110B) are separate regions of a single ("common") light-emitting element.

[0041] Terms such as "first" and "second" are used herein merely to describe various components, but the components are not limited by these terms. Such terms are used merely to distinguish one component from another. For example, a first region may be referred to as a second region, and vice versa, without departing from the scope of the present invention.

[0042] At least two of the first to fourth regions (110A, 110B, 110C, and 110D) may differ from each other in terms of emission factors. For example, the emission factor of a given region (of the first to fourth regions 110A, 110D) may be the emission characteristics of light generated in the given region by the application of power. For example, the emission factor may include luminous properties associated with the light that the given region is configured to emit, such as the brightness of the emitted light, the color temperature of the emitted light, the orientation angle of the emitted light, and the contrast of the emitted light. In some example embodiments, for example, the first zone 110A may be associated with a first emission factor, which is a luminous characteristic of light that the first zone 110A is constructed to emit (e.g., the brightness of light emitted by the first zone 110A, the color temperature of light emitted by the first zone 110A, the orientation angle of light emitted by the first zone 110A, the contrast of light emitted by the first zone 110A, a surface shape associated with the light emitted by the first zone 110A, a subcombination thereof, or a combination thereof), and the second zone 110B may be associated with a second emission factor, which is a luminous characteristic of light that the second zone 110B is constructed to emit (e.g., the brightness of light emitted by the second zone 110B, the color temperature of light emitted by the second zone 110B, the orientation angle of light emitted by the second zone 110B, the contrast of light emitted by the second zone 110B, the surface shape associated with light emitted by the second zone 110B, a subcombination thereof, or a combination thereof).

[0043] For example, other emission factors may be power supply characteristics (such as drive voltage, drive current, drive duty cycle) and the planar shape associated with the corresponding region.

[0044] To reiterate the above, in some example embodiments, the first to fourth zones (110A, 110B, 110C, and 110D) may be associated with corresponding emission factors, where, for example, the first zone 110A is associated with a first emission factor, the second zone 110B is associated with a second emission factor, the third zone 110C is associated with a third emission factor, and the fourth zone 110D is associated with a fourth emission factor, and where, for example, the first emission factor is different from the second emission factor. For example, the first zone 110A may be associated with a first emission factor, the first emission factor being a first voltage of power, and the lighting device 10 is configured to supply the first voltage of power to the first zone 110A, and the second zone 110B may be associated with a second emission factor, the second emission factor being a second voltage of power, and the lighting device 10 is configured to supply the second voltage of power to the second zone, where, for example, the second voltage may be different from the first voltage (e.g., the second voltage is greater than the first voltage).

[0045] In some embodiments, the first through fourth zones (110A, 110B, 110C, and 110D) may have different planar areas and / or volumes. In some embodiments, at least two of the first through fourth zones (110A, 110B, 110C, and 110D) may have different planar areas and / or volumes. Thus, the first through fourth zones 110A through 110D may be associated with separate corresponding emission factors, where each corresponding emission factor is the planar area and / or volume of the corresponding zone associated with the corresponding emission factor. Thus, for example, the first zone 110A may be associated with a first emission factor that is the planar area and / or volume of the first zone 110A, and the second zone 110B may be associated with a second emission factor that is the planar area and / or volume of the second zone 110B.

[0046] For example, in some example embodiments, the first emission factor of the first region 110A may be greater than the second emission factor of the second region 110B, so that the planar area of ​​the first region 110A is greater than the planar area of ​​the second region 110B, the volume of the first region 110A is greater than the volume of the second region 110B, or the planar area and volume of the first region 110A are respectively greater than the planar area and volume of the second region 110B. In some example embodiments, one or more of the first to fourth regions 110A to 110D may include a single light emitting element. For example, Figures 1 to 2 As shown, the first region 110A may include a single light emitting element PX1. In some example embodiments, each of the plurality of regions (eg, each of the first region 110A and the second region 110B) includes a plurality of light emitting elements.

[0047] Here, the term "plane area" refers to the projected area of ​​the light emitting surface of each region. In addition, the term "volume" refers to the volume obtained by multiplying the plane area by the distance between the top surface of the fluorescent layer 74 described below and the buried insulating layer 36 described below.

[0048] In some embodiments, at least two of the first to fourth regions (110A, 110B, 110C, and 110D) may have different planar shapes. In some embodiments, at least one of the first to fourth regions (110A, 110B, 110C, and 110D) may have a planar shape other than a quadrilateral. In some embodiments, at least one of the first to fourth regions (110A, 110B, 110C, and 110D) may have a polygonal planar shape having an interior angle other than 90°. In some embodiments, at least one of the first to fourth regions (110A, 110B, 110C, and 110D) may have a planar shape of a parallelogram or a trapezoid having an interior angle other than 90°.

[0049] Figure 2is a cross-sectional view showing a case where each of the first region 110A and the third region 110C includes one light emitting element or a plurality of light emitting elements.

[0050] Reference Figure 2 , the first region 110A may include one ("single") light emitting element PX1, and the third region 110C may include two light emitting elements PX2 and PX3. Those skilled in the art will appreciate that the third region 110C may include more than two light emitting elements.

[0051] For example, each of the light emitting elements PX1, PX2, and PX3 may have a width of about 10 μm to several mm in the first direction (X direction) or the second direction (Y direction), but the present inventive concept is not limited thereto. Figure 2 An example is shown in which light-emitting elements PX1, PX2, and PX3 have the same width or substantially the same width (e.g., the same width within manufacturing tolerance and / or material tolerance) in the second direction, but those skilled in the art should understand that the light-emitting elements PX1, PX2, and PX3 have different widths in the second direction.

[0052] Light emitting element structures 20U corresponding to the light emitting elements PX1, PX2, and PX3, respectively, may be arranged in the first region 110A and the third region 110C. Partition walls 120 may be located on the light emitting element structures 20U and surround one or more light emitting element structures 20U.

[0053] The partition wall 120 may have a width of about 10 μm to about 100 μm, but the present invention is not limited thereto. For example, the width of the partition wall 120 may not necessarily be constant, but may be smaller or larger depending on the location where the partition wall 120 is required. For example, the partition wall 120 located at the outermost portion of the light-emitting device 10 may be formed to have a width of about 10 μm to about 1 mm, thereby improving structural stability. In some embodiments, even when the light-emitting device 10 is used as a headlight of a vehicle and subjected to repeated vibrations and shocks, the reliability of the light-emitting device 10 can be improved by the excellent structural stability of the light-emitting element structure 20U and the fluorescent layer 74 located in the partition wall 120.

[0054] The light emitting stack 20 may include a first conductive semiconductor layer 22, an active layer 24, and a second conductive semiconductor layer 26. The plurality of light emitting element structures 20U may be isolated from each other by the device isolation openings IAH in the first region 110A and the third region 110C. In the process according to some example embodiments, the device isolation openings IAH may be formed by removing portions of the light emitting stack 20, so that the plurality of light emitting element structures 20U may be formed on the first region 110A and the third region 110C.

[0055] The plurality of light emitting element structures 20U may include a first conductive semiconductor layer 22 , an active layer 24 and a second conductive semiconductor layer 26 , and a first insulating layer 32 , a first electrode 42A, a second electrode 42B, a first connection electrode 44A and a second connection electrode 44B may also be located on the plurality of light emitting element structures 20U.

[0056] The first conductive semiconductor layer 22 may have an n-type In x Al y Ga (1-x-y) The first conductive semiconductor layer 22 may include a nitride semiconductor having a composition of N (where 0≤x<1, 0≤y<1, and 0≤x+y<1). For example, the n-type impurity may be silicon (Si). For example, the first conductive semiconductor layer 22 may include GaN containing n-type impurities.

[0057] In some example embodiments, the first conductive semiconductor layer 22 may include a first conductive semiconductor contact layer and a current diffusion layer. The impurity concentration of the first conductive semiconductor contact layer may be in the range of 2×10 18 cm -3 to 9×10 19 cm -3 The thickness of the first conductive semiconductor contact layer may be about 1 μm to about 5 μm. The current diffusion layer may have a structure in which a plurality of In layers having different compositions or different impurity contents are formed. x Al y Ga (1-x-y) N layers (where 0≤x, y≤1, and 0≤x+y≤1) are alternately stacked. For example, the current diffusion layer may have an n-type superlattice structure in which n-type GaN layers and / or Al layers each having a thickness of about 1 nm to about 500 nm are stacked alternately. x In y Ga z N layers (where 0≤x, y, z≤1, and x+y+z≠0) are alternately stacked. The impurity concentration of the current diffusion layer can be between 2×10 18 cm -3 to 9×10 19 cm -3 within the range.

[0058] The active layer 24 may be located between the first conductive semiconductor layer 22 and the second conductive semiconductor layer 26, and may release light having some energy through the recombination of electrons and holes. The active layer 24 may have a multi-quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, each of the quantum well layers and each of the quantum barrier layers may include In having different compositions. x Al y Ga (1-x-y) N layers (where 0≤x, y≤1, and 0≤x+y≤1). For example, the quantum well layer may include In xGa 1-x N (where 0≤x≤1), and the quantum barrier layer may include GaN or AlGaN. The thickness of the quantum well layer and the quantum barrier layer may be in the range of about 1 nm to about 50 nm. The active layer 24 is not limited to having an MQW structure and may have a single quantum well structure.

[0059] The second conductive semiconductor layer 26 may include p-type In x Al y Ga (1-x-y) A nitride semiconductor layer having a composition of N (where 0≤x<1, 0≤y<1, and 0≤x+y<1). For example, the p-type impurity may be magnesium (Mg).

[0060] In example embodiments, the second conductive semiconductor layer 26 may include an electron blocking layer, a low-concentration p-type GaN layer, and a high-concentration p-type GaN layer provided as a contact layer. For example, the electron blocking layer may have a structure in which a plurality of In layers having a thickness of about 5 nm to about 100 nm and having different compositions or different impurity contents are provided. x Al y Ga (1-x-y) N layers (where 0≤x, y≤1, and 0≤x+y≤1) are alternately stacked, or may have a structure including Al y Ga (1-y) The energy band gap of the electron blocking layer may decrease as the distance from the active layer 24 increases. For example, the aluminum (Al) content in the electron blocking layer decreases as the distance from the active layer 24 increases.

[0061] The first conductive semiconductor layer 22, the active layer 24, and the second conductive semiconductor layer 26 may be stacked in sequence in the vertical direction. Here, the upper surface of the first conductive semiconductor layer 22 is referred to as the first surface 20F1 of the plurality of light emitting element structures 20U, and the bottom surface of the second conductive semiconductor layer 26 is referred to as the second surface 20F2 of the plurality of light emitting element structures 20U.

[0062] The first electrode 42A may be connected to the first conductive semiconductor layer 22 in the opening E extending through the active layer 24 and the second conductive semiconductor layer 26. The second electrode 42B may be located on the bottom surface (i.e., the second surface 20F2) of the second conductive semiconductor layer 26. The first insulating layer 32 may be located on the inner wall of the opening E and electrically insulate the first electrode 42A from the active layer 24 and the second conductive semiconductor layer 26. The first insulating layer 32 may be located between the first electrode 42A and the second electrode 42B on the bottom surface of the second conductive semiconductor layer 26 and electrically insulate the first electrode 42A from the second electrode 42B. Each of the first electrode 42A and the second electrode 42B may include silver (Ag), aluminum (Al), nickel (Ni), chromium (Cr), gold (Au), platinum (Pt), rhodium (Pd), tin (Sn), tungsten (W), rhodium (Rh), iridium (Ir), ruthenium (Ru), magnesium (Mg), zinc (Zn), or a combination thereof. Each of the first electrode 42A and the second electrode 42B may include a metal material having high reflectivity.

[0063] The first connection electrode 44A may be located on the first electrode 42A and the first insulating layer 32, and the second connection electrode 44B may be located on the second electrode 42B and the first insulating layer 32. The first connection electrode 44A and the second connection electrode 44B may be electrically connected to the first electrode 42A and the second electrode 42B, respectively. Each of the first connection electrode 44A and the second connection electrode 44B may include Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, or a combination thereof.

[0064] The plurality of light emitting element structures 20U may be spaced apart from each other using the device isolation opening IAH therebetween. For example, the device isolation opening IAH may include a sidewall inclined at an angle of about 60° to about 90° relative to the first surface 20F1 of the plurality of light emitting element structures 20U.

[0065] The insulating liner 34 may be formed on the inner wall of the device isolation opening IAH and may be conformally arranged to cover the first and second connection electrodes 44A and 44B on the side surfaces and second surface 20F2 of each of the plurality of light-emitting element structures 20U. The upper surface of the insulating liner 34 may be at the same level or substantially the same level (e.g., at the same level within manufacturing tolerances and / or material tolerances) as the first surfaces 20F1 of the plurality of light-emitting element structures 20U. In example embodiments, the insulating liner 34 may include silicon oxide or silicon nitride.

[0066] The buried insulating layer 36 may be located on the insulating liner 34. The buried insulating layer 36 may contact the insulating liner 34 within the device isolation opening IAH and may fill the remaining space of the device isolation opening IAH. The buried insulating layer 36 may be any insulator and may be formed using, for example, silicone resin, epoxy resin, or acrylic resin, but is not limited thereto.

[0067] Support substrate 54 may be located on buried insulating layer 36, with adhesive layer 52 located between support substrate 54 and buried insulating layer 36. In some example embodiments, adhesive layer 52 may include an electrically insulating material, such as silicon oxide, silicon nitride, a polymeric material such as an ultraviolet (UV) curable material, or a resin. In some embodiments, adhesive layer 52 may include the same material as buried insulating layer 36, and the boundary between adhesive layer 52 and buried insulating layer 36 may not be discernible. In some example embodiments, adhesive layer 52 may include a eutectic adhesive material such as AuSn or NiSi. Support substrate 54 may include, but is not limited to, a sapphire substrate, a glass substrate, a transparent conductive substrate, a silicon substrate, or a silicon carbide substrate, but is not limited thereto.

[0068] As described above, the partition wall 120 may be located on the first surface 20F1 of the plurality of light emitting element structures 20U. The partition wall 120 may include silicon (Si), silicon carbide (SiC), sapphire, and / or gallium nitride (GaN).

[0069] The partition walls 120 may be arranged in a rectangular form in a plan view, and a plurality of pixel spaces PXU may be defined by the partition walls 120. The partition walls 120 may vertically overlap the device isolation openings IAH, and the bottom surfaces of the partition walls 120 may contact the upper surface of the insulating liner 34. Therefore, the first surfaces 20F1 of the plurality of light emitting element structures 20U may be exposed to the bottoms of the plurality of pixel spaces PXU.

[0070] The reflective layer 72 may be located on the sidewalls of the partition wall 120. The reflective layer 72 may reflect light emitted from the plurality of light emitting element structures 20U. The reflective layer 72 may be formed on the sidewalls of the partition wall 120, so that the sidewalls of the plurality of pixel spaces PXU may be covered by the reflective layer 72.

[0071] In example embodiments, the reflective layer 72 may include a metal layer including Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, or a combination thereof. In other embodiments, the reflective layer 72 may include a resin layer such as polyphthalamide (PPA) containing a metal oxide such as titanium oxide or aluminum oxide. In other embodiments, the reflective layer 72 may include a distributed Bragg reflector layer. For example, the distributed Bragg reflector layer may have a structure in which a plurality of insulating films having different refractive indices are repeatedly stacked several to several hundred times. Each of the insulating films in the distributed Bragg reflector layer may include an oxide, a nitride, or a combination thereof, such as SiO2, SiN, SiO x N y , TiO2, Si3N4, Al2O3, TiN, AlN, ZrO2, TiAlN or TiSiN.

[0072] The fluorescent layer 74 may be located in a plurality of pixel spaces PXU on the first surface 20F1 of the plurality of light emitting element structures 20U. Figure 2 As shown, the fluorescent layer 74 may substantially fill the entire space of the plurality of pixel spaces PXU, the lower surface level of the fluorescent layer 74 may be equal to the lower surface level LV1 of the partition wall 120, which may be the surface level of the first surface 20F1 of the plurality of light-emitting element structures 20U, and the upper surface level of the fluorescent layer 74 may be equal to the upper surface level LV2 of the partition wall 120. The fluorescent layer 74 may have a substantially flat upper surface.

[0073] The fluorescent layer 74 may include a single material capable of converting the color of light emitted from the light-emitting element structure 20U into a desired color. That is, fluorescent layers 74 associated with the same color may be located in multiple pixel spaces PXU. However, the present invention is not limited thereto. For example, the color of the fluorescent layer 74 located in some pixel spaces PUX among the multiple pixel spaces PXU may be different from the color of the fluorescent layer 74 located in the remaining pixel spaces PXU.

[0074] The fluorescent layer 74 may include a resin containing a fluorescent material dispersed therein, or may include a film containing the fluorescent material. For example, the fluorescent layer 74 may include a fluorescent material film in which fluorescent material particles are uniformly dispersed at a specific concentration. The fluorescent material particles may be wavelength conversion materials that change the wavelength of light emitted from the plurality of light-emitting element structures 20U. The fluorescent layer 74 may include two or more types of fluorescent material particles having different particle size distributions to increase the density of the fluorescent material particles and improve color uniformity.

[0075] In some example embodiments, the fluorescent material of the fluorescent layer 74 may have various colors and various compositions, such as oxide-based compositions, silicate-based compositions, nitride-based compositions, and fluoride-based compositions. For example, β-SiAlON:Eu 2+ (green), (Ca, Sr)AlSiN3:Eu 2+ (red), La3Si6N 11 :Ce 3+ (yellow), K2SiF6:Mn4 + (red), SrLiAl3N4:Eu(red), Ln 4-x (Eu z M 1-z ) x Si 12-y Al y O 3+x+y N 18-x-y (0.5≤x≤3, 0<z<0.3, 0<y≤4)(red), K2TiF6:Mn4 + (red), NaYF4:Mn4 + (red), NaGdF4:Mn4 + (red) etc. can be used as the fluorescent material. However, the type of the fluorescent material is not limited thereto.

[0076] In some example embodiments, a wavelength conversion material such as quantum dots may be further disposed on the fluorescent layer 74. The quantum dots may have a core-shell structure using a III-V or II-VI compound semiconductor. For example, the quantum dots may have a core such as CdSe and InP and a shell such as ZnS and ZnSe. In addition, the quantum dots may include a ligand for stabilizing the core and shell.

[0077] In some embodiments, Figure 2 Unlike the example shown in FIG, the reflective layer 72 may not be formed on the sidewall of the partition wall 120. In this case, the sidewall of the partition wall 120 may be in contact with the fluorescent layer 74.

[0078] Figure 3A is a cross-sectional view showing a case where each of the second region 110B and the fourth region 110D includes one light emitting element. Figure 3B 1 is a plan view of the planar shapes of the second region 110B and the fourth region 110D. Specifically, Figure 3A It is along Figure 3B A cross-sectional view taken along line IIIA-IIIA'.

[0079] include Figure 3A and Figure 3B Some of the exemplary embodiments shown are generally similar to Figure 2The example embodiments shown are similar, except that each region includes one light-emitting element and the planar area and / or volume of the light-emitting elements of the fourth region 110D is larger than the planar area and / or volume of the light-emitting elements of the second region 110B, which is different from the fourth region 110D. Therefore, for the sake of brevity, repeated description will be omitted.

[0080] Reference Figure 3A and Figure 3B , the second region 110B may include one light-emitting element PX4, and the fourth region 110D may include one light-emitting element PX5. The fourth region 110D may have a larger planar area and / or volume than the second region 110B, and the light-emitting element PX5 may have a larger planar area and / or volume than the light-emitting element PX4.

[0081] When a region having a relatively large area (i.e., the fourth region 110D) uses only one light-emitting element having a relatively large size instead of multiple light-emitting elements, the number ("quantity") of driver chips used for driving operations can be reduced. Therefore, power consumption can be reduced to increase economic efficiency.

[0082] The first connection electrode 44A may pass through the insulating liner 34 and be electrically connected to the first pad 48A through the first wiring pattern 46A. The second connection electrode 44B may pass through the insulating liner 34 and be electrically connected to the second pad 48B through the second wiring pattern 46B.

[0083] Those skilled in the art will understand from the cross-sectional views of the accompanying drawings that the cross-sectional views in which the first wiring pattern 46A and the second wiring pattern 46B are not shown are cross-sectional views taken along lines that do not pass through the first wiring pattern 46A and the second wiring pattern 46B, and do not mean that a specific light-emitting element has no wiring pattern.

[0084] Figure 4 110A and 110A′ are cross-sectional views showing a case where one light emitting element is shared between two regions 110A and 110A′, whereby the two regions 110A and 110A′ are separate regions of a single light emitting element PX1.

[0085] include Figure 4 Some of the exemplary embodiments shown are generally similar to Figure 2 The exemplary embodiment shown is similar except that one light emitting element is shared between the two regions. Therefore, for the sake of brevity, repeated descriptions will be omitted.

[0086] Reference Figure 4, one light-emitting element PX1 may be shared between the two regions 110A and 110A'. In this case, the planar area and / or volume of one region 110A or 110A' may be smaller than the planar area / volume of one light-emitting element PX1. In this case, the partition wall 120 may be provided in the upper portion of the light-emitting element PX1 across the light-emitting element PX1. The partition wall 120 provided across the light-emitting element PX1 may be the partition wall 120 that separates the two regions 110A and 110A' from each other.

[0087] Figure 5 is a diagram of a light emitting device 10A according to some example embodiments.

[0088] The lighting device 10A may include at least two zones configured to serve different functions. For example, the lighting device 10A may include a high-beam zone HBZ, a low-beam zone LBZ, and corner zones CZ1 and CZ2. Because the corresponding zones serve different functions, these zones can be driven in different ways. Consequently, the drive signals or electrical characteristics of the drive elements (e.g., driver chips) used to drive each zone can differ.

[0089] For example, since the light-emitting elements in the low beam zone LBZ require a relatively small number of on / off operations and high light intensity, the light-emitting elements in the low beam zone LBZ can use drive signals with a relatively low frequency and relatively high drive voltage and current, and employ a driver element IC1 that can meet these requirements. Meanwhile, since the light-emitting elements in the high beam zone HBZ involve relatively high-frequency on / off operations, the light-emitting elements in the high beam zone HBZ can use drive signals with a high frequency and relatively low drive voltage and current, and employ a driver element IC2 that can sensitively respond to appropriate control signals.

[0090] Figure 5 The illustrated drive signals and drive elements IC1 and IC2 are merely examples, and the differences in electrical characteristics between the drive elements may be differences in various aspects such as drive voltage, drive current, drive duty cycle, and frequency characteristics. For example, the first region 110A may be driven in response to a first drive signal, and the second region 110B may be driven in response to a second drive signal separate from the first drive signal, where the first drive signal differs from the second drive signal in drive voltage, drive current, drive duty cycle, a subcombination thereof, or a combination thereof.

[0091] Although Figure 5 The differences between the driving elements of the high beam area HBZ and the driving elements of the low beam area LBZ are shown, but there may be differences in electrical characteristics between the driving elements of the high beam area HBZ and the driving elements of the corner areas CZ1 and CZ2, and there may be differences in electrical characteristics between the driving elements of the low beam area LBZ and the driving elements of the corner areas CZ1 and CZ2.

[0092] Each of the low beam zone LBZ, the high beam zone HBZ, the corner zone CZ1, and the corner zone CZ2 may include at least two light emitting elements (refer to Figure 2 3 ), and different drive signals (information) can be used for individual light emitting elements in the same zone. For example, in the high beam zone HBZ, only a specific local zone can be turned off, and other zones can be turned on. In this case, when the high beam zone HBZ is controlled by a multi-channel drive element, different drive signals (information) can be sent to the corresponding channels, so that only a part of the high beam zone HBZ can be controlled to be dimmed. In other words, for example, referring to Figure 5 In the low beam zone LBZ, the first zone 110A may be configured to be driven in response to a first driving signal, and the second zone 110B may be configured to be driven in response to a second driving signal separate from the first driving signal.

[0093] The difference in electrical characteristics of the driving elements according to regions may ultimately lead to a difference in light emitted according to regions. However, the difference in light emitted according to regions may not only depend on the electrical characteristics of the driving elements.

[0094] Figure 18A is a partial plan view of a headlight module 2022B according to some example embodiments. Figure 18B It is along Figure 18A A cross-sectional view taken along line XVIIIB-XVIIIB'. Figure 18C It shows Figure 18A 2022B is a timing chart illustrating an operation example of each of the light emitting elements PX2, PX3, and PX7 of the headlight module 2022B.

[0095] Reference 18A to 18C , three light emitting elements PX1 may be arranged adjacent to each other in the second zone 110B. Light emitting elements PX2, PX3, and PX7 having the same size or substantially the same size (e.g., having the same size within manufacturing tolerances and / or material tolerances) may be provided in the fourth zone 110D. Specifically, the light emitting element PX7 may be provided at the outermost portion of the headlight module 2022B. Although the light emitting elements PX2, PX3, and PX7 are shown as having substantially the same planar area (e.g., having the same planar area within manufacturing tolerances and / or material tolerances), the light emitting elements PX2, PX3, and PX7 may have different sizes, just like the light emitting elements PX5 and PX6. In the area including 18A to 18BIn some example embodiments of the illustrated example embodiments, each of the first region and the second region (e.g., the first region 110A and the second region 110B) may include a plurality of light-emitting elements, wherein the light-emitting elements of the first region have substantially the same size (e.g., the same size within manufacturing tolerances and / or material tolerances) as the plurality of light-emitting elements of the second region.

[0096] In some embodiments, light-emitting element PX2, located relatively inward within corner zone CZ2 of headlight module 2022B, can be controlled to turn on and continuously emit light at time 't0'. Additionally, light-emitting elements PX3 and PX7, located relatively outward within corner zone CZ2 of headlight module 2022B, can be turned on at time 't0' and then temporarily turned off between times 't1' and 't2'. While light-emitting elements PX3 and PX7 are turned off, light emitted by light-emitting element PX2 is scattered and diffused even above light-emitting elements PX3 and PX7, thereby achieving a natural, gradually dimming effect. Light emission can be abruptly blocked at the edge of headlight module 2022B, which has improved straightness, thereby reducing the perception of heterogeneity and visual disturbance caused by the abrupt contrast between illuminated and unilluminated areas. In other words, by turning off some light-emitting elements, such as light-emitting elements PX3 and PX7, when necessary, a natural field of view can be maintained at the boundary area illuminated by the grading effect.

[0097] In some embodiments, the light emitting elements PX3 and PX7 may be omitted while maintaining Figure 18B In this case, the boundary area illuminated by the light emitted from the headlight module 2022B can obtain a permanent grading effect. Figure 18B As shown in , in some example embodiments, each separate emission region (e.g., the second region 110B and the fourth region 110D) includes a separate fluorescent layer 74 among a plurality of fluorescent layers 74, wherein the plurality of fluorescent layers 74 are isolated from each other in adjacent emission regions by one or more partition walls 120. For example, Figure 10 As shown, in adjacent emission areas of the low beam zone LBZ of the lighting device 10 , a plurality of fluorescent layers 74 may be isolated from each other by one or more partition walls 120 .

[0098] In the fourth zone 110D located in the corner zone CZ2 of the headlight module 2022B, the area within the fourth zone 110D having a permanent or temporary grading effect can be defined as a grading area. The grading area can be an area having a temporary grading effect (such as the aforementioned light-emitting elements PX3 and PX7) or an area having a permanent grading effect (such as an area where the phosphor layer 74 is present but no light-emitting elements are present below the phosphor layer 74). Therefore, the fourth zone 110D can include a grading area.

[0099] In some embodiments, the percentage of the planar area of ​​the grading region to the planar area of ​​the fourth zone 110D may be in a range of approximately 50% to approximately 90%. In other words, the planar area of ​​the grading region of the fourth zone 110D may be between approximately 50% and approximately 90% of the planar area of ​​the fourth zone 110D. If the percentage of the planar area of ​​the grading region is too low, the grading effect may be insufficient. If the percentage of the planar area of ​​the grading region is too high, the fourth zone 110D may not be sufficiently bright, and the headlight module 2022B may not have the desired brightness.

[0100] When the term "about" or "approximately" is used in conjunction with a numerical value in this specification, it is intended that the associated numerical value include a tolerance of ±10% around the listed numerical value. When a range is specified, the range includes all values ​​therebetween (such as increments of 0.1%).

[0101] Figure 6A is a plan view of a light emitting device 10B according to some example embodiments. Figure 6B It is along Figure 6A A partial sectional perspective view taken along line VIB-VIB'.

[0102] Reference Figure 6A , the region included in the light emitting device 10B may have a planar shape other than a rectangular or square shape. For example, Figure 6A Some regions of the illustrated light-emitting device 10B may have a polygonal shape including at least one non-90° internal angle. In some embodiments, some regions of the light-emitting device 10B may have a quadrilateral shape including at least one non-90° internal angle. In some embodiments, some regions of the light-emitting device 10B may have a parallelogram or trapezoidal shape including at least one non-90° internal angle. For example, in some example embodiments, at least one of the first region 110A and the second region 110B has a rectangular planar shape, and at least one other of the first region 110A and the second region 110B has a polygonal planar shape including at least one non-90° internal angle.

[0103] When the light emitting device 10B includes an area having a planar shape other than a square or rectangle, the brightness distribution of the area to be illuminated by the light emitting device 10B can be more accurately controlled with relatively low power, as will be described in further detail below.

[0104] Figure 6B It is from Figure 6A In the area along Figure 6A VIB-VIB' is a partial cross-sectional perspective view obtained by cutting the two areas indicated by 10S.

[0105] Refer to it together Figure 6A and Figure 6B , the two regions indicated by 10S may have internal angles α and β other than 90°, respectively. Figure 6B As shown, each of the two zones indicated by 10S may be surrounded by a partition wall 120 .

[0106] like Figure 6B As shown, the specific structure of the cross section can be Figures 2 to 4 The planar shape of the light emitting device 10B may be implemented in a shape other than a quadrangular shape or a rectangular shape while maintaining the above-described configuration.

[0107] Although Figure 6B Only the two regions indicated by 10S are shown separately in FIG, but this does not mean that the two regions indicated by 10S are more similar to each other than other regions. Figure 6A The area surrounded by the partition wall 120 shown in FIG. Figures 1 to 4 The descriptions are the same as each other, or different from each other.

[0108] Figure 7 is a perspective view of a vehicle 2000 , according to some example embodiments.

[0109] Although Figure 7 A car is shown as the vehicle 2000, but the vehicle 2000 is not limited thereto. The vehicle 2000 may be a land vehicle such as a bicycle, a tricycle, a car, a tractor, a train, or a tram; a water vehicle such as a ship, a boat, or a submarine; or an air vehicle such as an airplane or a helicopter, but is not limited thereto.

[0110] Reference Figure 7 , headlight modules 2020A and 2020B (headlight modules are interchangeably referred to herein as "headlights") may be mounted in headlight unit 2010 of vehicle 2000. Side mirror light module 2040 may be mounted in outside mirror unit 2030, and taillight module 2060 may be mounted in taillight unit 2050. At least one of headlight modules 2020A and 2020B, side mirror light module 2040, and taillight module 2060 may be a light source module including the above-described light emitting devices 10, 10A, and 10B.

[0111] The power supply device 2003 built into the vehicle 2000 can supply power to each of the headlight modules 2020A and 2020B, the side mirror lamp module 2040, and the taillight module 2060. In addition, the controller 2001 built into the vehicle 2000 can be configured to control various operations including on / off operations of the headlight modules 2020A and 2020B, the side mirror lamp module 2040, and the taillight module 2060, thereby being configured to control the headlight modules 2020A and 2020B, the side mirror lamp module 2040, and the taillight module 2060.

[0112] Figure 8Is set in Figure 7 A front view of the headlight modules 2020A and 2020B in the headlight unit 2010.

[0113] Reference Figure 8 , the headlight modules 2020A and 2020B may include high beam zones HBZ1 and HBZ2, low beam zones LBZ1 and LBZ2, and corner zones CZ1 and CZ2, respectively. In some embodiments, the high beam zones HBZ1 and HBZ2, the low beam zones LBZ1 and LBZ2, and the corner zones CZ1 and CZ2 may be arranged symmetrically about the centerline of the vehicle 2000. In other words, as Figure 8 As shown, headlight modules 2020A and 2020B may include separate, corresponding multiple emission areas that are symmetrically arranged relative to each other about the centerline of vehicle 2000. Figure 8 As shown in FIG, corner zones CZ1 and CZ2 may extend on at least one of the side surfaces of the high beam zones HBZ1 and HBZ2 and at least one of the side surfaces of the low beam zones LBZ1 and LBZ2, respectively.

[0114] The plane area and / or volume of the emission zones of the angular zones CZ1 and CZ2 may be substantially larger than the plane area and / or volume of the emission zones of the high beam zones HBZ1 and HBZ2 or the low beam zones LBZ1 and LBZ2, respectively. The emission zones of the angular zones CZ1 and CZ2 may primarily contribute to illuminating the front sides, and the emission zones of the angular zones CZ1 and CZ2 may not necessarily be finely controlled in conjunction with vehicles approaching head-on from the front. Specifically, in some cases, the emission zones of the angular zones CZ1 and CZ2 may be used solely for redirection. Therefore, since the angular zones CZ1 and CZ2 have a low control burden, manufacturing costs and operating energy can be reduced by increasing the size of the emission zones and reducing the number of drive elements.

[0115] Specifically, the average area of ​​the emission zones of angular zones CZ1 and CZ2 can be larger than the average area of ​​the emission zones of high beam zones HBZ1 and HBZ2 and the average area of ​​the emission zones of low beam zones LBZ1 and LBZ2. In some embodiments, angular zones CZ1 and CZ2 can employ light-emitting elements having relatively large areas. In this case, the average area of ​​the light-emitting elements of angular zones CZ1 and CZ2 can be larger than the average area of ​​the light-emitting elements of high beam zones HBZ1 and HBZ2, the average area of ​​the light-emitting elements of low beam zones LBZ1 and LBZ2, a subset thereof, or a combination thereof.

[0116] Furthermore, as described above, the emission areas of angular zones CZ1 and CZ2 can be proportionally increased, thereby reducing the number of driving elements. The number ("amount") of driving elements (e.g., driver chips) configured to control the light-emitting elements in angular zones CZ1 and CZ2 can be equal to or less than half (1 / 2) the number of driving elements configured to control the light-emitting elements in either of the high-beam zones HBZ1 and HBZ2 and the low-beam zones LBZ1 and LBZ2.

[0117] Each of the high beam zones HBZ1 and HBZ2, the low beam zones LBZ1 and LBZ2, and the corner zones CZ1 and CZ2 may include a plurality of emission areas (eg, referring to Figure 1 and Figure 2 110A and second region 110B are described. Although emission regions included in the same region generally operate in the same manner, emission regions included in the same region may operate in different manners as needed. In addition, emission regions included in the same region may not necessarily have the same planar shape or configuration.

[0118] The headlight modules 2020A and 2020B may be modified differently in consideration of user's needs, laws and regulations established regarding the vehicle 2000 , and safety.

[0119] Figure 9A is a diagram showing a photometric grid defined in Electrical and Computer Engineering (ECE) Rule 112 (R112), and Figure 9B is a diagram of a pair ("two") of headlight modules 2021A and 2021B that satisfy the photometric grid conditions of ECER 112, according to some example embodiments.

[0120] Reference Figure 9A and Figure 9B When operating the headlight modules 2021A and 2021B, each region and each specific point may have a constant value to meet 25 meters ahead. Specifically, a local cutaway area may be defined in the oblique direction in region III, and the local cutaway area will be referred to as the oblique portion SL hereinafter.

[0121] In the prior art, to implement the slanted portion SL of the cut-off line, the size of the light-emitting element is reduced, and the number of light-emitting elements along the slanted portion SL is increased. As a result, structures designed to finely control the number of light-emitting elements to implement the slanted portion SL have been attempted. However, as the number of light-emitting elements to be controlled increases, the number of driving elements may also increase, and power consumption may also increase. In some example embodiments, an emission region having a shape corresponding to the slanted portion SL or a portion of the slanted portion SL is implemented using a single light-emitting element.

[0122] On the contrary, in the embodiment, the emission area corresponding to the inclined portion SL or a portion of the inclined portion SL can be designed to have an inclined unit. Therefore, since it is not necessary to reduce the size of the light emitting element and increase the number of driving elements, power consumption can be reduced. That is, Figure 9A A portion of the inclined portion SL (or Figure 9A The part indicated by ΔSL in Figure 9B An emission area of ​​the headlight module 2021B (by Figure 9B As a result, the size of the emission area of ​​the headlight module 2021B can be increased as needed, the number of driving elements does not need to be increased, and power consumption can be reduced.

[0123] Although only ECE R112 is described, those skilled in the art will appreciate that the same techniques can be applied to photometric grids defined in ECE R98, ECE R112, ECE R113, ECE R123, Federal Motor Vehicle Safety Standards (FMVSS), a subcombination thereof, or a combination thereof. In other words, the emission area can have a shape corresponding to the slanted portion SL of the photometric grid defined in ECE R98, ECE R112, ECE R113, ECE R123, Federal Motor Vehicle Safety Standards (FMVSS), a subcombination thereof, or a combination thereof, or a portion of the slanted portion of the photometric grid.

[0124] Figure 10 is a cross-sectional view of a portion of a light emitting device in which the height of a partition wall is changed according to some example embodiments.

[0125] Reference Figure 10 , the height, thickness, or height and thickness of some of the plurality of partition walls 120 and 120a (e.g., 120a) may be different from the height, thickness, or height and thickness of other partition walls ("the rest of the plurality of partition walls") (e.g., 120). The some of the partition walls (e.g., 120a) may facilitate the difference in emission factors between the separated zones (e.g., 110A and 110B). In this case, the fluorescent layers 74 of two adjacent zones with the partition wall 120a located therebetween may be connected to each other on one or more partition walls 120a between adjacent emission zones (e.g., between adjacent emission zones in the high beam area). In this case, since the partition wall 120 between the light emitting element PX1 and the two adjacent light emitting elements PX2 and PX3 remains high, the contrast between them may remain high. At the same time, since the partition wall 120a between the two adjacent light emitting elements PX2 and PX3 is relatively low, the optical interaction between them may act, and thus the contrast may be lower, but the light emission may be increased. In some example embodiments (wherein, as Figure 10 The first zone 110A and the third zone 110C shown are in the high beam area of ​​the light emitting device 10 ), similar to the partition wall 120a, the fluorescent layers 74 of the adjacent zones 110A and 110C with the partition wall 120 located therebetween can be connected to each other on the partition wall 120 so that the connected fluorescent layers 74 cover the partition wall 120.

[0126] For example, the emission area of ​​the low beam zone LBZ may be used to emit light to display ("output", "provide", etc.) relevant information for vehicle driving ("relevant information associated with the driving of the vehicle 2000") on the front sides of the above-mentioned headlight modules 2020A and 2020B. In this case, the emission area of ​​the low beam zone LBZ may require high contrast. The top end of the partition wall 120 may be in the same or substantially the same plane as the top end of the fluorescent layer 74 (for example, in the same plane within manufacturing tolerances and / or material tolerances), so that relevant information for vehicle driving can be clearly displayed on the front sides of the above-mentioned headlight modules 2020A and 2020B.

[0127] Figure 11 is a cross-sectional view of a portion of a light emitting device that changes the shape of a free surface according to some example embodiments. As described herein, a "free surface" may be understood as a surface that is exposed ("open") to the exterior of the light emitting device (e.g., a surface through which emitted light passes to exit the light emitting device and illuminate at least a portion of the external environment).

[0128] like Figure 11 As shown, the fluorescent layer 74 may be formed to fill a plurality of pixel spaces PXU, wherein each pixel space PXU may be an open enclosure at least partially defined by one or more light emitting elements PX1 to PX3 and one or more partition walls 120, such that the fluorescent layer 74 includes separate portions 74-1, 74-2, 74-3 in different regions. For example, as Figure 11 As shown, a first portion 74-1 of the phosphor layer 74 is within a first open enclosure defined by the first light emitting element PX1 and one or more partition walls 120, a second portion 74-2 of the phosphor layer 74 is within a second open enclosure defined by the second light emitting element PX2 and one or more partition walls 120, and a third portion 74-3 of the phosphor layer 74 is within a third open enclosure defined by the third light emitting element PX3 and one or more partition walls. Figure 11 As shown, each separate portion 74-1 to 74-3 of phosphor layer 74 can have a separate free surface S1 to S3. Each free surface of a portion of phosphor layer 74 located over a given light emitting element can be referred to herein as a free surface of the given light emitting element.

[0129] Reference Figure 11The free surfaces S1, S2 and S3 of the light emitting elements PX1, PX2 and PX3 can have various shapes so that different areas have different free surface characteristics. Figure 11 As shown, in some example embodiments, each of the free surface S1, S2, and S3 of the first portion 74-1 of the fluorescent layer 74 (in the first region 110A), the free surface S2 of the second portion 74-2 of the fluorescent layer 74 (in the separated third region 110C), and the free surface S3 of the third portion 74-3 of the fluorescent layer 74 (in the third region 110C) has any one of free surface characteristics of a flat surface, a concave surface (e.g., free surface S2), a convex surface (e.g., free surface S1), and a rough surface (e.g., free surface S3). Thus, for example, Figure 11 As shown, one zone (e.g., the first zone 110A) may have different free surface properties from another zone (e.g., the third zone 110C) by virtue of including free surfaces having different free surface properties (e.g., the free surface S1 in the first zone 110A has a convex surface, while the free surfaces S2 and S3 in the third zone 110C have a concave surface and a rough surface, respectively).

[0130] For example, in some embodiments, the light emitting element PX1 may have an outward convex surface S1. In this case, the light emitting element PX1 may easily emit light, and the emitted light may be widely distributed.

[0131] In some embodiments, the light emitting element PX2 may have an outwardly concave surface S2 , which may improve the collimation of light emitted by the light emitting element PX2 .

[0132] In some embodiments, the light emitting element PX3 may have a rough surface S3. In this case, light emitted by the light emitting element PX3 may be scattered, but there is an advantage in light extraction. The surface S3 may be regularly or irregularly roughened.

[0133] Figure 12 is a cross-sectional view of a portion of a light emitting device having partition walls having various thicknesses according to some example embodiments.

[0134] Reference Figure 12 The thickness t1 of the partition wall surrounding the light-emitting element PX1 may be greater than the thickness t2 of the other partition wall. A partition wall having a thickness t1 greater than t2 may be primarily provided for the surrounding emission region located at the outermost portion of the light-emitting device. The emission region located at the outermost portion of the light-emitting device may be surrounded by a relatively thick partition wall to ensure improved structural stability.

[0135] In a light emitting device according to some example embodiments, an emission area may be optimized according to a given purpose, and manufacturing costs and operating energy may be reduced.

[0136] Figure 13 is an exploded perspective view of a lighting apparatus 2200 including a light emitting device according to some example embodiments.

[0137] Reference Figure 13 , the lighting device 2200 may include a socket 2210, a power supply 2220, a heat sink 2230, a light source module 2240, and an optical unit 2250. According to some example embodiments, the light source module 2240 may include a light emitting element array, and the power supply 2220 may include a light emitting element driver.

[0138] The socket 2210 can be configured to be replaced by an existing lighting device. Power can be supplied to the lighting device 2200 through the socket 2210. Figure 13 As shown, the power supply 2220 can be decomposed into a first power supply 2221 and a second power supply 2222. The heat sink 2230 may include an internal heat sink 2231 and an external heat sink 2232. The internal heat sink 2231 may be directly connected to the light source module 2240 and / or the power supply 2220 and transfer heat to the external heat sink 2232. The optical unit 2250 may include an internal optical unit (not shown) and an external optical unit (not shown). The optical unit 2250 may be configured to uniformly disperse the light emitted by the light source module 2240.

[0139] The light source module 2240 may receive power from the power supply 2220 and emit light to the optical unit 2250. The light source module 2240 may include one or more light-emitting device packages 2241, a circuit board 2242, and a controller 2243. The controller 2243 may store driving information of the light-emitting device packages 2241. The light-emitting device package 2241 may include at least one of the light-emitting devices 10, 10A, and 10B described above.

[0140] Figure 14 is an exploded perspective view of a pole-type lighting apparatus 2400 including a light emitting device according to some example embodiments.

[0141] Reference Figure 14 The pole-type lighting device 2400 may include a heat sink member 2401, a cover 2427, a light source module 2421, a first socket 2405, and a second socket 2423. A plurality of concave / convex heat sink fins 2450 and 2409 may be formed on the inner and / or outer surfaces of the heat sink member 2401. The heat sink fins 2450 and 2409 may be designed to have various shapes and spacings. A protruding support member 2413 may be formed within the heat sink member 2401. The light source module 2421 may be fixed to the support member 2413. Locking protrusions 2411 may be formed on both ends of the heat sink member 2401.

[0142] A locking groove 2429 may be formed in the cover 2427. The locking protrusion 2411 of the heat sink member 2401 may be coupled to the locking groove 2429. The position of the locking groove 2429 may be exchanged with the position of the locking protrusion 2411.

[0143] Light source module 2421 may include an array of light-emitting devices. Light source module 2421 may include a printed circuit board (PCB) 2419, a light source 2417, and a controller 2415. Controller 2415 may store driving information for light source 2417. Circuit wiring may be formed on PCB 2419 to operate light source 2417. Furthermore, light source module 2421 may include components for operating light source 2417. Light source 2417 may include at least one of the aforementioned light-emitting devices 10, 10A, and 10B.

[0144] The first socket 2405 and the second socket 2423 can be provided as a pair of sockets and can be connected to both ends of a cylindrical cover unit including the heat sink member 2401 and the cover 2427. For example, the first socket 2405 can include the electrode terminal 2403 and the power supply 2407, and the second socket 2423 can include the dummy terminal 2425. In addition, an optical sensor module and / or a communication module can be embedded in the first socket 2405 or the second socket 2423. For example, the optical sensor module and / or the communication module can be embedded in the second socket 2423 including the dummy terminal 2425. In another example, the optical sensor module and / or the communication module can be embedded in the first socket 2405 including the electrode terminal 2403.

[0145] Figure 15 is an exploded perspective view of a lighting apparatus 2500 including a light emitting device according to some example embodiments.

[0146] Figure 15 2500 lighting equipment with Figure 13 The lighting device 2200 is different in that the reflective plate 2310 and the communication module 2320 are provided in the light source module 2240. The reflective plate 2310 may uniformly scatter light from the light source in lateral and rear directions to reduce glare.

[0147] Communication module 2320 can be mounted on reflective plate 2310 and can be used to perform home network communication. For example, communication module 2320 can be a wireless communication module utilizing ZigBee, WiFi, or LiFi, and can be used to control indoor or outdoor lighting devices, such as turning them on and off or adjusting their brightness, via a smartphone or wireless controller. Furthermore, communication module 2320 can control indoor or outdoor appliances and vehicle systems, such as TVs, refrigerators, air conditioners, door locks, and vehicles, by utilizing LiFi communication modules that utilize visible light wavelengths for indoor or outdoor lighting devices. Reflective plate 2310 and communication module 2320 can be covered by a cover 2330.

[0148] Figure 16 is a diagram for describing an indoor lighting control network system 3000 including light emitting devices according to some example embodiments.

[0149] Specifically, the indoor lighting control network system (hereinafter referred to as the network system) 3000 can be a composite intelligent lighting network system that integrates lighting technology using light-emitting devices (e.g., light-emitting diodes (LEDs)), Internet of Things (IoT) technology, and wireless communication technology. Network system 3000 can be implemented using various lighting devices and wired / wireless communication devices. Network system 3000 can be implemented using sensors, controllers, communication units, and software for network control and maintenance.

[0150] The network system 3000 can be applied not only to closed spaces within buildings such as homes or offices but also to open spaces such as parks or streets. The network system 3000 can be implemented based on an IoT environment to collect, process, and provide various information to users.

[0151] The LED lamp 3200 included in the network system 3000 can receive information about the surrounding environment from the gateway 3100 and control the lighting of the LED lamp 3200 itself. In addition, the LED lamp 3200 can check and control the operating status of other devices (e.g., 3300 to 3800) included in the IoT environment based on the visible light communication function of the LED lamp 3200. The LED lamp 3200 may include at least one of the above-mentioned light-emitting devices 10, 10A, and 10B.

[0152] Network system 3000 may include: a gateway 3100 configured to process transmitted and received data according to various communication protocols; an LED lamp 3200 communicatively connected to gateway 3100 and including an LED; and a plurality of devices (e.g., 3300 to 3800) communicatively connected to gateway 3100 using various wireless communication methods. Each of LED lamp 3200 and devices (e.g., 3300 to 3800) may include at least one communication module. LED lamp 3200 may be communicatively connected to gateway 3100 using a wireless communication protocol such as WiFi, ZigBee, or LiFi. To this end, LED lamp 3200 may include at least one lamp communication module 3210.

[0153] In the case where the network system 3000 is applied to a home, multiple devices (e.g., 3300 to 3800) may include: electrical appliances 3300 (e.g., TV 3310 and / or refrigerator 3320), digital door locks 3400, warehouse door locks 3500, wall-mounted lighting switches 3600, routers 3700 for relaying wireless communication networks, and mobile devices 3800 such as smart phones, tablets, or laptop computers.

[0154] In the network system 3000, the LED lamp 3200 can check the operating status of various devices (e.g., 3300 to 3800) according to the surrounding environment and conditions or automatically control the lighting of the LED lamp 3200 itself by utilizing a wireless communication network (e.g., ZigBee, WiFi, LiFi, etc.) installed in the home. In addition, the LED lamp 3200 can control the devices (e.g., 3300 to 3800) included in the network system 3000 through LiFi communication using visible light emitted by the LED lamp 3200.

[0155] Initially, the LED lamp 3200 can automatically control its lighting based on information about the surrounding environment transmitted from the gateway 3100 via the lamp communication module 3210 or collected from sensors installed on the LED lamp 3200. For example, the brightness of the LED lamp 3200 can be automatically adjusted based on the type of TV program being played on the TV 3310 or the screen brightness of the TV 3310. To this end, the LED lamp 3200 can receive operating information of the TV 3310 from the lamp communication module 3210 connected to the gateway 3100. The lamp communication module 3210 can be modularized integrally with the sensors and / or controller included in the LED lamp 3200.

[0156] For example, after a certain (or alternatively, predetermined) time has passed since the digital door lock 3400 was locked when no one was at home, the LED light 3200 that was turned on can be turned off to avoid wasting power. Alternatively, if a security mode is set via the mobile device 3800 or the like, the LED light 3200 can remain on when the digital door lock 3400 is locked when no one is at home.

[0157] The operation of LED lights 3200 can be controlled based on information about the surrounding environment collected by various sensors connected to network system 3000. For example, if network system 3000 is implemented in a building, lighting fixtures, location sensors, and a communication module can be combined to turn lighting on and off, or to provide collected information in real time. This allows for efficient equipment management or the effective utilization of unused space. Since lighting fixtures such as LED lights 3200 are typically located in nearly every space on every floor of a building, sensors integrated with LED lights 3200 can be used to collect various building information and use it for facility management or the utilization of unused space.

[0158] Figure 17 is a diagram for describing a network system 4000 including light emitting devices according to some example embodiments.

[0159] Specifically, Figure 17 A network system 4000 applied to an open space according to some example embodiments is shown. Network system 4000 may include: a communication connection device 4100; a plurality of lighting devices 4120 and 4150 installed at specific (or alternatively, predetermined) intervals and communicatively connected to communication connection device 4100; a server 4160; a computer 4170 configured to manage server 4160; a communication base station 4180; a communication network 4190 configured to connect various communicable devices; and a mobile device 4200.

[0160] Multiple lighting devices 4120 and 4150 installed in an open outdoor space, such as a street or park, may include smart engines 4130 and 4140, respectively. Each of smart engines 4130 and 4140 may include a light-emitting device configured to emit light, a driver configured to drive the light-emitting device, a sensor configured to collect information about the surrounding environment, and a communication module. The light-emitting device included in smart engines 4130 and 4140 may include at least one of the light-emitting devices 10, 10A, and 10B described above.

[0161] The communication module enables the intelligent engines 4130 and 4140 to communicate with other peripheral devices using a communication protocol such as WiFi, ZigBee, or LiFi. One intelligent engine 4130 can be communicatively connected to another intelligent engine 4140. In this case, a WiFi network can be used for communication between the intelligent engines 4130 and 4140. At least one intelligent engine 4130 can be connected to a communication connection device 4100 connected to a communication network 4190 via wired / wireless communication.

[0162] The communication connection device 4100 may be an access point (AP) capable of performing wired / wireless communication and may relay communications between the communication network 4190 and other devices. The communication connection device 4100 may be connected to the communication network 4190 via at least one wired / wireless communication scheme. For example, the communication connection device 4100 may be mechanically housed in one of the lighting devices 4120 and 4150.

[0163] The communication connection device 4100 can be connected to the mobile device 4200 via a communication protocol such as WiFi. The user of the mobile device 4200 can receive information about the surrounding environment collected by multiple intelligence engines 4130 and 4140 by connecting to the communication connection device of the intelligence engine 4130 adjacent to the lighting device 4120. The information about the surrounding environment may include nearby traffic information, weather information, etc. The mobile device 4200 can be connected to the communication network 4190 through the communication base station 4180 via a wireless cellular communication solution such as a 3G or 4G communication solution.

[0164] The server 4160 connected to the communication network 4190 can receive information collected by the intelligent engines 4130 and 4140 installed on the lighting devices 4120 and 4150, respectively, and can monitor the operating status of the lighting devices 4120 and 4150. The server 4160 can be connected to a computer 4170 that provides a management system, and the computer 4170 can execute software capable of monitoring and managing the operating status of the intelligent engines 4130 and 4140.

[0165] Figures 19A to 19J is a cross-sectional view illustrating a method of manufacturing a light emitting device according to a process order according to some example embodiments. Figures 19A to 19J In the Figure 2 The same elements as the elements in .

[0166] Reference Figure 19A The light emitting stack 20 may be formed on a substrate 1000. In example embodiments, the substrate 1000 may include a silicon (Si) substrate, a silicon carbide (SiC) substrate, a sapphire substrate, a gallium nitride (GaN) substrate, etc. The substrate 1000 may include a first region 110A and a third region 110C.

[0167] The light emitting stack 20 may include a first conductive semiconductor layer 22 , an active layer 24 , and a second conductive semiconductor layer 26 sequentially formed on the first surface 10F 1 of the substrate 1000 .

[0168] Reference Figure 19B A mask pattern (not shown) may be formed on the light emitting stack 20, and a portion of the light emitting stack 20 may be removed using the mask pattern as an etching mask, thereby forming an opening E. The opening E may expose the upper surface of the first conductive semiconductor layer 22. The opening E may expose the first conductive semiconductor layer 22.

[0169] Reference Figure 19C , a first insulating layer 32 may be formed on the light emitting stack 20 to conformally cover the opening E. The first insulating layer 32 may be formed on both the first region 110A and the third region 110C.

[0170] Then, a portion of the first insulating layer 32 in the opening E and a portion of the first insulating layer 32 on the second conductive semiconductor layer 26 may be removed, thereby exposing upper surfaces of the first and second conductive semiconductor layers 22 and 26 .

[0171] The first electrode 42A and the second electrode 42B may be respectively formed on the exposed upper surface of the first conductive semiconductor layer 22 and the exposed upper surface of the second conductive semiconductor layer 26. A first contact layer (not shown) including a conductive ohmic material may also be formed between the first electrode 42A and the first conductive semiconductor layer 22, and a second contact layer (not shown) including a conductive ohmic material may also be formed between the second electrode 42B and the second conductive semiconductor layer 26.

[0172] Reference Figure 19D , first and second connection electrodes 44A and 44B electrically connected to the first and second electrodes 42A and 42B, respectively, may be formed on the first insulating layer 32. In example embodiments, a conductive layer (not shown) may be formed on the first and second electrodes 42A and 42B, and the first insulating layer 32, and the conductive layer may be patterned to form the first and second connection electrodes 44A and 44B, respectively, connected to the first and second electrodes 42A and 42B. In other embodiments, the first and second connection electrodes 44A and 44B may be formed by an electroplating process.

[0173] Reference Figure 19E , a portion of the light emitting stack 20 may be removed, so that device isolation openings IAH may be formed in the light emitting stack 20 in the first region 110A and the third region 110C, respectively. The device isolation openings IAH may completely pass through the light emitting stack 20, so that the first surface 10F1 of the substrate 1000 may be exposed at the bottom of the device isolation openings IAH.

[0174] In the first region 110A and the third region 110C, the light emitting stack 20 may be divided into a plurality of light emitting element structures 20U by the device isolation openings IAH.

[0175] In example embodiments, the process of forming the device isolation opening IAH may be performed by a blade, but is not limited thereto. Figure 19E As shown, the cross-sectional shape of each of the plurality of light emitting element structures 20U obtained by forming the device isolation opening IAH may be a trapezoid with a different upper width from a lower width. However, the present inventive concept is not limited thereto.

[0176] Then, an insulating liner 34 may be formed on the upper surfaces and sidewalls of the plurality of light emitting element structures 20U and the light emitting stack 20. The insulating liner 34 may be conformally formed on the inner wall of the device isolation opening IAH and may contact the first surface 10F1 of the substrate 1000 exposed at the bottom of the device isolation opening IAH.

[0177] Since one light emitting element structure 20U is physically and electrically separated from the adjacent light emitting element structure 120U by the device isolation opening IAH and the insulating pad 34, the light emitted from the light emitting element structure 20U may not be absorbed or penetrate into the adjacent light emitting element structure 120U, and therefore, the contrast characteristics of the light emitting element may be improved.

[0178] Then, although Figure 19E Although not shown, a portion of the insulating liner 34 may be removed to expose upper surfaces of the first and second connection electrodes 44A and 44B, and a wiring pattern (not shown) for electrical connection may be formed.

[0179] Reference Figure 19F A buried insulating layer 36 may be formed on the insulating liner 34 and the wiring pattern. The buried insulating layer 36 may fill the remaining space of the device isolation opening IAH.

[0180] Then, adhesive layer 52 may be formed on buried insulating layer 36 , and support substrate 54 may be attached on adhesive layer 52 .

[0181] Reference Figure 19G , the light emitting stack 20 attached to the support substrate 54 may be inverted so that the second surface 10F2 opposite to the first surface 10F1 of the substrate 1000 faces upward. Then, the upper portion of the substrate 1000 may be removed from the second surface 10F2 of the substrate 1000 by a grinding process, and thus the level of the second surface 10F2 of the substrate 1000 may be lowered.

[0182] Reference Figure 19HA mask pattern (not shown) may be formed on the second surface 10F2 of the substrate 1000, and a portion of the substrate 1000 may be removed using the mask pattern as an etching mask. As a result, a plurality of pixel spaces PXU may be formed in the first and third regions 110A and 110C of the substrate 1000, wherein each pixel space PXU may be an open enclosure at least partially defined by one or more light-emitting elements PX1 to PX3 and one or more partition walls 120. A portion of the substrate 1000 remaining between the plurality of pixel spaces PXU in the first and third regions 110A and 110C may be referred to as a first partition wall layer 120.

[0183] The first partition wall layer 120 may be arranged to vertically overlap the device isolation opening IAH, and the plurality of light-emitting element structures 20U may be respectively located in the plurality of pixel spaces PXU. At the bottom of the plurality of pixel spaces PXU, the upper surface of the first conductive semiconductor layer 22 (i.e., the first surface 20F1 of the plurality of light-emitting element structures 20U) may be exposed.

[0184] Reference Figure 19I A conductive layer (not shown) may be formed on the upper surface of the substrate 1000 and the inner walls of the plurality of pixel spaces PXU, and an anisotropic etching process may be performed on the conductive layer to form a reflective layer 72 on the sidewalls of the plurality of pixel spaces PXU (or the sidewalls of the first partition wall layer 120).

[0185] Reference Figure 19J , the fluorescent layer 74 may be formed to fill the plurality of pixel spaces PXU such that the fluorescent layer 74 includes separate portions in separate regions (eg, as shown in FIG. 1 ). Figure 19J As shown, a first portion 74-1 of the fluorescent layer 74 in a first open fence defined by the first light-emitting element PX1 and one or more partition walls 120 and a second portion 74-2 of the fluorescent layer 74 in a second open fence defined by the light-emitting elements PX2 and PX3 and one or more partition walls 120).

[0186] In example embodiments, the fluorescent layer 74 may be formed by applying or dispensing a resin containing fluorescent material particles dispersed therein into the plurality of pixel spaces PXU, such that the fluorescent layer 74 fills the plurality of pixel spaces PXU at least partially defined by the one or more partition walls 120 and the plurality of light emitting elements PX1 to PX3. The fluorescent layer 74 may include two or more fluorescent material particles having different particle size distributions, so that the fluorescent material particles may be uniformly dispersed in each of the plurality of pixel spaces PXU.

[0187] The foregoing description and accompanying drawings disclose exemplary embodiments of the present inventive concept. Although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation. It will be understood by those skilled in the art that various changes in form and detail may be made to the disclosed embodiments without departing from the spirit and scope of the present inventive concept as defined in the appended claims.

Claims

1. A light-emitting device, comprising: a supporting substrate; an adhesive layer disposed on the support substrate; an insulating layer located on the adhesive layer; a plurality of light emitting elements located in the insulating layer, wherein the plurality of light emitting elements are separated by device isolation openings and the device isolation openings are filled with the insulating layer, and each of the plurality of light emitting elements sequentially includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an emission array, the emission array including the plurality of light emitting elements, the emission array including a first region and a second region, the first region and the second region being adjacent to each other; and a partition wall configured to at least partially isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array, wherein a lower surface of the partition wall is coplanar with an upper surface of the first conductive semiconductor layer, wherein the first zone is associated with a first emission factor, and the second zone is associated with a second emission factor, the second emission factor being different from the first emission factor, wherein the plane area and / or volume of the first region is greater than the plane area and / or volume of the second region, and wherein the first region and the second region each include a fluorescent layer directly located on the first conductive semiconductor layer, and wherein the first emission factor is a luminous characteristic of the first region, and the second emission factor is a luminous characteristic of the second region, wherein: The luminescent characteristics of the first region include at least one of: brightness of light emitted by the first region, orientation angle of light emitted by the first region, contrast of light emitted by the first region, and surface shape associated with light emitted by the first region, and The luminescent characteristics of the second region include at least one of the following: brightness of light emitted by the second region, orientation angle of light emitted by the second region, contrast of light emitted by the second region, and surface shape associated with light emitted by the second region.

2. The light emitting device according to claim 1, wherein The first region is configured to be driven in response to a first driving signal, and The second region is configured to be driven in response to a second drive signal that is separate from the first drive signal.

3. The light emitting device according to claim 2, wherein: The first emission factor is a first voltage of power, the light emitting device is configured to supply the first voltage of power to the first area, the second emission factor is a second voltage of power, the light emitting device is configured to supply the second voltage of power to the second area, and The second voltage is greater than the first voltage.

4. The light emitting device according to claim 2, wherein: At least one of the first region and the second region has a rectangular planar shape, and At least the other of the first region and the second region has a polygonal plan shape having one or more internal angles that are not 90°. The light emitting device according to claim 1 , wherein: The single light emitting element of the first region and the two or more light emitting elements of the second region have substantially common dimensions. The light emitting device according to claim 1 , wherein: The second zone comprises a graded area, and The plan area of ​​the grading region is between 50% and 90% of the plan area of ​​the second zone.

7. A headlight for a vehicle, comprising: A light-emitting device, comprising: a supporting substrate; an adhesive layer disposed on the support substrate; an insulating layer located on the adhesive layer; a plurality of light emitting elements located in the insulating layer, wherein the plurality of light emitting elements are separated by device isolation openings and the device isolation openings are filled with the insulating layer, and each of the plurality of light emitting elements sequentially includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an emission array, the emission array including the plurality of light emitting elements, the emission array including a first region and a second region, the first region and the second region being adjacent to each other; and a partition wall configured to at least partially isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array, wherein a lower surface of the partition wall is coplanar with an upper surface of the first conductive semiconductor layer, wherein the first zone is associated with a first emission factor, and the second zone is associated with a second emission factor, the second emission factor being different from the first emission factor, wherein the plane area and / or volume of the first region is greater than the plane area and / or volume of the second region, and wherein the first region and the second region each include a fluorescent layer directly located on the first conductive semiconductor layer, and wherein the first emission factor is a luminous characteristic of the first region, and the second emission factor is a luminous characteristic of the second region, wherein: The luminescent characteristics of the first region include at least one of: brightness of light emitted by the first region, orientation angle of light emitted by the first region, contrast of light emitted by the first region, and surface shape associated with light emitted by the first region, and The luminescent characteristics of the second region include at least one of the following: brightness of light emitted by the second region, orientation angle of light emitted by the second region, contrast of light emitted by the second region, and surface shape associated with light emitted by the second region.

8. The headlamp according to claim 7, wherein: The lighting device includes a high-beam area and a low-beam area, the high-beam area and the low-beam area being configured to be driven according to separate corresponding driving signals having different electrical characteristics, and The high beam area includes at least one emission area having a polygonal planar shape having at least one internal angle that is not 90°.

9. The headlamp according to claim 8, wherein: The shape of the at least one emission region corresponds to: An inclined portion of a photometric grid defined in at least one of ECE R98, ECE R112, ECE R113, ECE R123, the Federal Motor Vehicle Safety Standard (FMVSS), or A portion of the inclined portion of the photometric grid.

10. The headlamp according to claim 9, wherein: A shape corresponding to the inclined portion of the luminosity grid or a portion of the inclined portion of the luminosity grid is implemented by a single light-emitting element in the first zone.

11. The headlamp according to claim 8, wherein: Each of the plurality of emission regions includes a separate phosphor layer from the plurality of phosphor layers, and The plurality of fluorescent layers are isolated from each other by the one or more partition walls in adjacent emission areas of the low beam region.

12. The headlamp according to claim 11, wherein: The adjacent emission area of ​​the low beam region is configured to emit light to display relevant information associated with driving of the vehicle.

13. The headlamp according to claim 8, wherein: Each of the plurality of emission regions includes a fluorescent layer, and The high beam region includes a fluorescent layer connected over partition walls between adjacent emission areas.

14. The headlamp according to claim 8, wherein: The light emitting device further comprises a corner region comprising a plurality of separated light emitting elements, and The corner area extends on one side surface of the high beam area and one side surface of the low beam area.

15. The headlamp according to claim 14, wherein: The average area of ​​the light emitting elements in the corner area is greater than the average area of ​​the light emitting elements in the low beam area.

16. The headlamp according to claim 14, wherein: The number of driving elements configured to control the light emitting elements of the angular area is equal to or less than half the number of driving elements configured to control the light emitting elements of any one of the high beam area and the low beam area.

17. A means of transport comprising: Power supply unit; The headlight according to claim 7, wherein the headlight is configured to receive power from the power supply device; as well as A controller is configured to control the headlights.

18. The vehicle according to claim 17, wherein: The vehicle includes two headlights, and Each of the two headlights includes a separate plurality of emission areas, and the separate plurality of emission areas of the two headlights are arranged symmetrically with respect to one another about a centerline of the vehicle.

19. A light emitting device comprising: a supporting substrate; an adhesive layer disposed on the support substrate; an insulating layer located on the adhesive layer; a plurality of light emitting elements located in the insulating layer, wherein the plurality of light emitting elements are separated by device isolation openings and the device isolation openings are filled with the insulating layer, and each of the plurality of light emitting elements sequentially includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an emission array, the emission array including the plurality of light-emitting elements, the emission array including a first area and a second area, the first area including a first light-emitting element, the second area including a second light-emitting element, the first area and the second area being adjacent to each other; a partition wall surrounding the first region and the second region, wherein a lower surface of the partition wall is coplanar with an upper surface of the first conductive semiconductor layer; and a fluorescent layer positioned in an open enclosure at least partially defined by the partition wall and the first and second light-emitting elements, such that a first portion of the fluorescent layer directly contacts the first conductive semiconductor layer in the first region and a second portion of the fluorescent layer directly contacts the first conductive semiconductor layer in the second region, wherein the first zone is associated with a first emission factor, and the second zone is associated with a second emission factor, the second emission factor being different from the first emission factor, The plane area and / or volume of the first zone is greater than the plane area and / or volume of the second zone.

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