Wafer mapping sensor mounting mechanism

Abstract

The present invention relates to the field of semiconductor auxiliary equipment, and provides a mounting mechanism for a wafer mapping sensor. The mounting mechanism includes: a bearing seat assembly, including a bearing seat plate and a linear slide rail provided under the bearing seat plate, and a pair of mounting holes; a push plate, the push plate is provided with an oblique groove extending along its length and inclined toward its width; a driving mechanism, the driving mechanism is connected to the push plate; a slider, fixed with a first connecting shaft and installed in the oblique groove, the slider is slidably connected to the linear slide rail, and the slider is provided with a pair of long slots; a pair of driving arm assemblies, including a driving arm, the driving arm is provided with a rotating end and a mounting end, the rotating end is fixed with a second connecting shaft, and the driving arm is installed in the long slot of the slider through the corresponding second connecting shaft; a pair of rotating shaft assemblies; a pair of mounting arms, the mounting arms are connected to the rotating shaft assembly and are used to install sensors. The present invention can avoid the problem of the rotating space intersecting with the space where the wafer is located, resulting in collision accidents with the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor accessory equipment, and in particular to a mounting mechanism for a wafer mapping sensor. Background Art

[0002] Currently, wafer loaders (loadports) used in semiconductor auxiliary equipment typically include a wafer mapping function. This function uses a pair of sensors to detect the number and status of wafers. Due to operational requirements, the sensor mounting mechanism must be able to switch between two different working positions, front and back, during operation. Currently, there are two main types of sensor mounting mechanisms. One involves the mounting mechanism directly moving the sensor forward or backward to achieve the desired working position; the other involves the mounting mechanism rotating the sensor to achieve the desired working position.

[0003] However, in solutions that require the sensor to move forward and backward to achieve the required working position change, the sensor mounting bracket is long, and the distance between the actuator and the driver is too large, resulting in poor rigidity of the entire mechanism. This can easily cause the sensor to vibrate during operation, leading to erroneous detection results. In solutions that require the sensor to rotate to achieve the required working position change, the sensor is usually mounted on a crossbar, and the crossbar is driven by two rotating arms to complete the rotation movement. The rotation space of the crossbar intersects with the space where the wafer is located, which can easily cause collision accidents with the wafer. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, an embodiment of the present invention provides a mounting mechanism for a wafer mapping sensor that can prevent the rotation space from intersecting with the space where the wafer is located, thereby preventing collision accidents with the wafer.

[0005] A mounting mechanism for a wafer mapping sensor according to an embodiment of the present invention includes:

[0006] The bearing seat assembly includes a bearing seat plate and a linear slide rail provided on the lower surface of the bearing seat plate along the width direction of the bearing seat plate, wherein the bearing seat plate is provided with a mounting hole on both sides of the linear slide rail;

[0007] A push plate, wherein the push plate is provided with an inclined groove extending along its length and inclined toward its width;

[0008] A driving mechanism connected to one end of the push plate in the length direction;

[0009] The slider is fixed with a first connecting shaft, and a first roller is provided at one end of the first connecting shaft away from the slider. The slider is installed in the inclined groove through the first roller. The slider is slidably connected to the linear slide rail, and the slider is provided with long slots extending along the length direction at both ends of the slider.

[0010] a pair of driving arm assemblies, each of the driving arm assemblies comprising a driving arm, the driving arm having a rotating end and a mounting end, the rotating end being fixedly provided with a second connecting shaft, an end of the second connecting shaft away from the driving arm being provided with a second roller, the driving arm being mounted in the long slot of the slider via the corresponding second roller;

[0011] a pair of rotating shaft assemblies;

[0012] A pair of mounting arms, each of the mounting arms includes a rotating end and a mounting end, the rotating end of the mounting arm is connected to the mounting end of the driving arm through the rotating shaft assembly, and the mounting end of the mounting arm is used to install a sensor.

[0013] The mounting mechanism of the wafer mapping sensor in the embodiment of the present invention drives the push plate to move back and forth along the length direction of the push plate through the extension and retraction of the driving mechanism, and drives the slider to move along the width direction of the push plate on the linear slide rail through the inclined groove and the first roller on the slider. At this time, the sliding of the slider along the width direction of the push plate is converted into the rotation of the driving arm through the long slot hole on the slider and the second roller on the driving arm, and then converted into the rotation of the two mounting arms, which can meet the conversion requirements of the mounting mechanism of the wafer mapping sensor to the front and rear different working positions during operation. During the rotation of the mounting arm, the rotation area of ​​the mounting arm is separated from the area where the wafer is located, eliminating the hidden dangers of wafer collision accidents.

[0014] According to one embodiment of the present invention, the rotating shaft assembly includes a rotating shaft and a bearing fixedly sleeved on the rotating shaft, the upper end of the bearing is provided with a bearing end cover, the inner circumference of the bearing end cover is blocked at the outer ring of the bearing, and one end of the rotating shaft close to the bearing end cover is fixedly connected to the rotating end of the mounting arm; the end of the rotating shaft close to the bearing is fixedly connected to the mounting end of the driving rotating arm, and the outer ring of the bearing is fixed in the mounting hole of the bearing seat plate.

[0015] According to one embodiment of the present invention, a mounting seat is provided at the mounting end of the driving arm, and an end of the rotating shaft close to the bearing is fixedly inserted into the mounting seat.

[0016] According to one embodiment of the present invention, a limiting column for limiting the mounting arm is provided on one side of the bearing seat plate facing the area where the wafer is located.

[0017] According to one embodiment of the present invention, one end of the mounting arm for mounting the sensor is configured as a bent section bent toward the area where the wafer is located.

[0018] According to one embodiment of the present invention, the long slot hole on the slider is an open slot connected to the end of the driving arm, and the outer surface of the second roller is tangent to the inner wall surface of the open slot.

[0019] According to one embodiment of the present invention, both the first roller and the second roller are rolling bearings.

[0020] According to one embodiment of the present invention, the driving mechanism is installed on the lower surface of the bearing seat plate through a support seat, and the length direction of the driving mechanism is along the length direction of the bearing seat plate.

[0021] According to one embodiment of the present invention, the driving mechanism is a driving cylinder, and the outer cover of the driving cylinder is provided with a protective cover.

[0022] According to one embodiment of the present invention, the pair of mounting holes are centrally symmetrically arranged about the axis of the linear slide rail;

[0023] The push plate includes a horizontal plate and a vertical plate arranged on one side of the horizontal plate, the inclined groove is arranged on the horizontal plate, and the driving mechanism is connected to the vertical plate.

[0024] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 1 is a schematic structural diagram of the mounting mechanism of the wafer mapping sensor according to an embodiment of the present invention after overall installation;

[0027] Figure 2 yes Figure 1 Explosion diagram of

[0028] Figure 3 is a schematic cross-sectional view of a rotating shaft assembly in a mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention;

[0029] Figure 41 is a schematic diagram of a disassembled bearing seat assembly in the mounting mechanism of the wafer mapping sensor according to an embodiment of the present invention;

[0030] Figure 5 It is a structural schematic diagram of a driving arm assembly in the mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention.

[0031] Reference numerals:

[0032] 1: Bearing seat assembly; 2: First mounting arm; 3: Rotating shaft assembly; 4: Second mounting arm; 5: Driving arm assembly; 6: Slider; 7: First roller; 8: Push plate; 9: Support seat; 10: Driving mechanism; 11: Rotating shaft; 12: Bearing end cover; 13: Bearing; 14: Bearing seat plate; 15: Linear slide; 16: Limiting column; 17: Driving arm; 18: Mounting seat; 19: Wafer area; 20: Second roller. DETAILED DESCRIPTION

[0033] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0034] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0035] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; and direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on the specific circumstances.

[0036] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0037] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0038] It should be noted that a wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. The starting material for a wafer is silicon, and silicon dioxide is an inexhaustible source on the Earth's surface. Silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon. Wafer fabrication plants then melt this polycrystalline silicon, seeding the melt with a seed crystal, which is then slowly pulled out to form a cylindrical single-crystal silicon ingot. Because the silicon ingot is gradually grown from a seed crystal with a defined crystal plane orientation in the molten silicon feedstock, this process is called "crystal growth." The silicon ingot is then segmented, tumbled, sliced, chamfered, polished, laser-engraved, and packaged to become the basic raw material for integrated circuit factories—silicon wafers, or "wafers."

[0039] The mounting mechanism of the wafer mapping sensor provided by the embodiment of the present invention is as follows: Figures 1 to 5 As shown, it includes a bearing seat assembly 1, a push plate 8, a driving mechanism 10, a slider 6, a pair of driving arm assemblies 5, a pair of shaft assemblies 3 and a pair of mounting arms. Specifically:

[0040] The bearing seat assembly 1 includes a bearing seat plate 14 and a linear slide rail 15 provided on the lower surface of the bearing seat plate 14 along the width direction of the bearing seat plate 14, and the bearing seat plate 14 is provided with a mounting hole on both sides of the linear slide rail 15. Specifically, in order to adapt to the compact space outside the wafer area 19, in this embodiment, the bearing seat plate 14 is long and narrow, and the length of the bearing seat plate 14 can be adapted to the diameter of the wafer area 19. Here, the adaptation can be that the length of the bearing seat plate 14 is greater than the diameter of the wafer area 19, or the length of the bearing seat plate 14 is less than the diameter of the wafer area 19; in order to make the structure of the bearing seat plate 14 more optimized, it is preferred to arrange the linear slide rail 15 in the middle of the lower surface of the bearing seat plate 14. Of course, the linear slide rail 15 can also be arranged at other positions on the lower surface of the bearing seat plate 14; a pair of mounting holes can be staggered at the position of the linear slide rail 15 to avoid interference between the mounting components in the mounting holes and the linear slide rail 15; in this embodiment, a pair of mounting holes are arranged on both sides of the sliding direction of the linear slide rail 15.

[0041] The push plate 8 is provided with an inclined groove extending along its length direction and inclined toward its width direction. The inclined groove passes through the push plate 8 to form an oblong hole on the push plate 8. Of course, it can also be a rectangular hole. There is no limitation on the specific shape of the hole. By providing the inclined inclined groove on the push plate 8, when the push plate 8 moves along the length direction, it can generate displacement along the width direction of the push plate 8 through the inclined groove.

[0042] The driving mechanism 10 is connected to one end of the push plate 8 in the length direction, and the driving mechanism 10 drives the push plate 8 to move back and forth along the length direction.

[0043] The slider 6 is fixed with a first connecting shaft, and the axial direction of the first connecting shaft is perpendicular to the surface of the slider 6. For example, when the slider 6 is set horizontally, the first connecting shaft is set vertically. A first roller 7 is provided at the end of the first connecting shaft away from the slider 6. The slider 6 is installed in the inclined groove through the first roller 7. When the push plate 8 moves, the first roller 7 rolls in the inclined groove along the direction of the inclined groove and drives the slider 6 to slide along the linear slide rail 15. By providing the first roller 7, the friction between the slider 6 and the inclined groove can be reduced, ensuring that the sliding of the slider 6 is smoother. The slider 6 is slidably connected to the linear slide rail 15, and the slider 6 is provided with long slots extending along its length at both ends of its length direction.

[0044] Each drive arm assembly 5 includes a drive arm 17, which can be shaped like a bar or a block. The drive arm 17 has a rotating end and a mounting end. The rotating end has a rotation axis perpendicular to the surface of the drive arm 17. A second connecting shaft is fixed to the rotating end, and the axis of the second connecting shaft is coaxial with the rotation axis of the rotating end. A second roller 20 is provided at the end of the second connecting shaft away from the drive arm 17. The drive arm 17 is mounted in the slotted hole of the slider 6 via the corresponding second roller 20. The second roller 20 is connected to the slider 6. The movement of the slider 6 drives the second roller 20 to roll along the slotted hole. During the rolling process, the second roller 20 moves, applying thrust to the drive arm 17, thereby driving the drive arm 17 to rotate along the slider 6. Furthermore, the rolling of the second roller 20 along the slotted hole can reduce friction. Furthermore, it should be noted that the length of the slotted hole needs to be greater than the outer diameter of the second roller 20 to ensure that the second roller 20 has room to move within the slotted hole and avoid interference.

[0045] Each mounting arm is provided with a rotating end and a mounting end. The rotating end of the mounting arm is connected to the mounting end of the driving arm 17 via the rotating shaft assembly 3. The mounting end of the mounting arm is used to mount a sensor. The rotating end of the mounting arm is fixedly connected to the mounting end of the driving arm 17. Therefore, when the driving arm 17 rotates, the mounting arm rotates synchronously therewith, causing the mounting arm to rotate toward or away from the wafer area 19. By selecting the length parameters of the driving arm 17, the rotation range of the driving arm 17 is determined, ensuring that the mounting arm will not interfere with the wafer area 19 when rotating toward or near the wafer area 19. A pair of mounting arms are respectively a first mounting arm 2 and a second mounting arm 4.

[0046] The mounting mechanism of the wafer mapping sensor in the embodiment of the present invention drives the push plate 8 to move back and forth along the length direction of the push plate 8 through the extension and retraction of the driving mechanism 10, and drives the slider 6 to move along the width direction of the push plate 8 on the linear slide rail 15 through the inclined groove and the first roller 7 on the slider 6. At this time, the sliding of the slider 6 along the width direction of the push plate 8 is converted into the rotation of the driving arm 17 through the long slot hole on the slider 6 and the second roller 20 on the driving arm 17, and then converted into the rotation of the two mounting arms, which can meet the conversion requirements of the mounting mechanism of the wafer mapping sensor between the front and rear different working positions during operation. During the rotation of the mounting arm, the rotation area of ​​the mounting arm is separated from the area 19 where the wafer is located, eliminating the hidden dangers of wafer collision accidents.

[0047] According to one embodiment of the present invention, the rotating shaft assembly 3 specifically includes a rotating shaft 11 and a bearing 13 fixedly sleeved on the rotating shaft 11. The bearing 13 can be a rolling bearing. The upper end of the bearing 13 is provided with a bearing end cover 12. The arrangement of the bearing end cover 12 facilitates the positioning of the bearing 13. The inner circumference of the bearing end cover 12 is blocked at the outer ring of the bearing 13. The end of the rotating shaft 11 close to the bearing end cover 12 is fixedly connected to the rotating end of the mounting arm; the end of the rotating shaft 11 close to the bearing 13 is fixedly connected to the mounting end of the driving rotating arm 17, and the outer ring of the bearing 13 is fixed in the mounting hole of the bearing seat plate 14, thereby fixing the rotating shaft assembly 3 to the bearing seat plate 14 without affecting the rotation of the rotating shaft assembly 3. Specifically, the outer ring of the bearing 13 is fixed in the mounting hole, so that its position is fixed relative to the mounting hole. The inner ring of the bearing 13 is fixedly sleeved on the rotating shaft 11. Therefore, when the rotating shaft 11 rotates, the inner ring of the bearing 13 rotates with the rotating shaft 11.

[0048] In order to facilitate installation, according to one embodiment of the present invention, a mounting seat 18 is provided at the mounting end of the driving arm 17, and a socket is provided on the mounting seat 18. The end of the rotating shaft 11 close to the bearing 13 is fixedly inserted into the socket of the mounting seat 18, so that the rotating shaft 11 is fixedly connected to the mounting seat 18. Of course, other fixing structures can also be provided on the mounting seat 18 to facilitate the fixation of the rotating shaft 11.

[0049] In order to limit the rotation limit position of the mounting arm and ensure that the mounting arm will not intersect with the area 19 where the wafer is located, according to one embodiment of the present invention, the side of the bearing seat plate 14 facing the area 19 where the wafer is located is respectively provided with a limit column 16 for limiting the mounting arm. The limit column 16 can be formed by a protrusion extending upward from the bearing seat plate 14, or it can be formed by fixing the protrusion on the bearing seat plate 14 by welding, bonding, or other fixing methods.

[0050] In order to facilitate the sensor to be closer to the area 19 where the wafer is located, thereby making it more convenient to collect data, according to one embodiment of the present invention, one end of the mounting arm used to mount the sensor is set as a bending section that bends toward the area 19 where the wafer is located. The specific bending angle of the bending section needs to be set according to specific needs, and the angle is preferably greater than 90 degrees and less than 180 degrees.

[0051] In order to facilitate the installation of the second roller 20 of the driving arm 17 on the slider 6 from the side of the slider 6, according to one embodiment of the present invention, the long slot hole on the slider 6 can be an open slot connected to the end of the driving arm 17, and the second roller 20 of the driving arm 17 is installed into the open slot from the opening of the open slot, which is more convenient for installation. Of course, it should be noted that the long slot hole can also be not provided with an opening, and the outer surface of the second roller 20 is tangent to the inner wall surface of the open slot, so that the second roller 20 can remain stable when rolling along the open slot without shaking.

[0052] According to one embodiment of the present invention, both the first roller 7 and the second roller 20 may be rolling bearings, which are convenient to install.

[0053] In another embodiment of the present invention, the first connecting shaft and the first roller 7 can be replaced by roller bearings, and the second connecting shaft and the second roller 20 can also be replaced by roller bearings. The roller bearing has its own shaft with a bearing fixed on the shaft. The shaft of the roller bearing can serve as the first connecting shaft or the second connecting shaft.

[0054] To facilitate installation of the drive mechanism 10, according to one embodiment of the present invention, the drive mechanism 10 is mounted on the lower surface of the bearing seat plate 14 via a support base 9. Furthermore, the length of the drive mechanism 10 is aligned with the length of the bearing seat plate 14. This arrangement helps reduce the width of the bearing seat plate 14, facilitates a more compact design, and relaxes the size restrictions of the drive mechanism 10.

[0055] According to one embodiment of the present invention, the driving mechanism 10 can be a driving cylinder, and a clean cylinder that meets the requirements can be used. The outer cover of the driving cylinder is provided with a protective cover. By placing the installation position of the driving cylinder in a closed space, the risk of gas leakage polluting the clean environment can be reduced.

[0056] Of course, it is understandable that the driving mechanism 10 includes but is not limited to a driving cylinder, and other driving mechanisms 10 such as a motor, an electric push rod, etc. are all within the protection scope of the present invention.

[0057] In order to keep the two mounting arms balanced on the bearing seat plate 14, according to one embodiment of the present invention, a pair of mounting holes are centrally symmetrically arranged about the axis of the linear guide rail 15. Specifically, the linear guide rail 15 is arranged in the middle of the lower surface of the bearing seat plate.

[0058] The push plate 8 includes a horizontal plate and a vertical plate arranged on one side of the horizontal plate, forming an L shape. The inclined groove is arranged on the horizontal plate to facilitate the connection of the slider 6 located thereon with the inclined groove. The driving mechanism 10 is connected to the vertical plate to facilitate the connection with the driving mechanism 10.

[0059] The working principle of the present invention: Figure 1 and Figure 2 As shown, the driving cylinder is extended and retracted to drive the push plate 8 to move left and right, and drives the slider 6 to move forward and backward on the linear slide 15 through the inclined groove and the roller bearing on the slider 6. At this time, the forward and backward sliding of the slider 6 is converted into the rotation of the driving arm assembly 5 through the long slot hole on the slider 6 and the roller bearing on the driving arm assembly 5, and then converted into the rotation of the two mounting arms, which can meet the conversion requirements of the installation mechanism of the wafer mapping sensor in the front and rear different working positions during operation. During the action, the limit column 16 on the bearing seat assembly 1 can ensure the positioning accuracy of the sensor in this working position; after the overall installation is completed, the driving cylinder part below the bearing seat assembly 1 can be sealed by a protective cover and other mechanisms to isolate the driving cylinder from the working space and avoid gas pollution to the working area.

[0060] The above embodiments are intended to illustrate the present invention only and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be encompassed by the scope of the claims of the present invention.

Claims

1. A mounting mechanism for a wafer mapping sensor, characterized in that: include: A bearing seat assembly includes a bearing seat plate and a linear slide rail provided on the lower surface of the bearing seat plate along the width direction of the bearing seat plate, wherein the bearing seat plate is in an elongated strip shape and the length thereof is adapted to the diameter of the area where the wafer is located, and the bearing seat plate is provided with a mounting hole on each side of the linear slide rail, wherein a pair of the mounting holes are staggered with respect to the position of the linear slide rail; A push plate, wherein the push plate is provided with an inclined groove extending along the length direction thereof and inclined toward the width direction thereof, wherein the inclined groove passes through the push plate; A driving mechanism connected to one end of the push plate in the length direction; The slider is fixed with a first connecting shaft, and a first roller is provided at one end of the first connecting shaft away from the slider. The slider is installed in the inclined groove through the first roller. The slider is slidably connected to the linear slide rail, and the slider is provided with long slots extending along the length direction at both ends of the slider. A pair of driving arm assemblies, each of the driving arm assemblies includes a driving arm, the driving arm is provided with a rotating end and a mounting end, the rotating end is fixed with a second connecting shaft, the second connecting shaft is provided with a second roller at one end away from the driving arm, and the driving arm is installed in the long slot hole of the slider through the corresponding second roller. The length of the long slot is greater than the outer diameter of the second roller; a pair of rotating shaft assemblies; a pair of mounting arms, each of the mounting arms comprising a rotating end and a mounting end, the rotating end of the mounting arm being connected to the mounting end of the driving arm via the rotating shaft assembly, and the mounting end of the mounting arm being used for mounting a sensor; The side of the bearing seat plate facing the area where the wafer is located is respectively provided with a limiting column for limiting the mounting arm.

2. The wafer mapping sensor mounting mechanism according to claim 1, wherein: The rotating shaft assembly includes a rotating shaft and a bearing fixedly sleeved on the rotating shaft, a bearing end cover is provided at the upper end of the bearing, the inner circumference of the bearing end cover is blocked at the outer ring of the bearing, and one end of the rotating shaft close to the bearing end cover is fixedly connected to the rotating end of the mounting arm; one end of the rotating shaft close to the bearing is fixedly connected to the mounting end of the driving rotating arm, and the outer ring of the bearing is fixed in the mounting hole of the bearing seat plate.

3. The mounting mechanism of the wafer mapping sensor according to claim 2, wherein: A mounting seat is provided at the mounting end of the driving rotating arm, and one end of the rotating shaft close to the bearing is fixedly inserted into the mounting seat.

4. The mounting mechanism of the wafer mapping sensor according to claim 1, wherein: One end of the mounting arm for mounting the sensor is configured as a bent section bent toward the area where the wafer is located.

5. The mounting mechanism of the wafer mapping sensor according to claim 1, wherein: The long slot hole on the sliding block is an open slot connected to the end of the driving rotating arm, and the outer surface of the second roller is tangent to the inner wall surface of the open slot.

6. The mounting mechanism of the wafer mapping sensor according to claim 1, wherein: The first roller and the second roller are both rolling bearings.

7. The mounting mechanism of the wafer mapping sensor according to claim 2, wherein: The driving mechanism is installed on the lower surface of the bearing seat plate through a support seat, and the length direction of the driving mechanism is along the length direction of the bearing seat plate.

8. The mounting mechanism of the wafer mapping sensor according to claim 7, wherein: The driving mechanism is a driving cylinder, and the outer cover of the driving cylinder is provided with a protective cover.

9. The mounting mechanism of the wafer mapping sensor according to claim 1, wherein: The pair of mounting holes are centrally symmetrically arranged about the axis of the linear slide rail; The push plate includes a horizontal plate and a vertical plate arranged on one side of the horizontal plate, the inclined groove is arranged on the horizontal plate, and the driving mechanism is connected to the vertical plate.

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