Lead frame, bracket and manufacturing method thereof, light emitting device and light emitting device

Abstract

The present invention provides a lead frame, a bracket and a manufacturing method thereof, a light-emitting device, and a light-emitting apparatus. The lead frame manufacturing method includes first preparing an insulating substrate having at least one set of lead-filled through-hole pairs; the lead-filled through-hole pairs include positive / negative lead-filled through-holes that are isolated and arranged on the insulating substrate; and the lead-filled through-hole pairs are respectively filled with conductors to form positive / negative leads, and the sides of the positive / negative leads are covered in the insulating substrate. The lead frame of the present invention forms lead pairs by centering the lead-filled through-hole pairs arranged on the insulating substrate, which reduces the area occupied by a single bracket molding area on the lead frame, improves the utilization rate of the lead frame, and thus improves the output and production efficiency of LED products on a single lead frame; in addition, in the LED bracket of the present invention, the sides of the leads are covered inside, so that the leads are not exposed on the sides of the LED bracket, and the airtightness of the LED bracket is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED (Light Emitting Diode), and in particular to a lead frame, a bracket and a manufacturing method thereof, a light emitting device and a light emitting apparatus. Background Art

[0002] In recent years, LED has been playing an important role in the display field of mobile terminals due to its unique advantages such as low price, low power consumption, high brightness and long life, and there is still considerable room for development in the future. In the existing LED production process, the lead frame used is a lead frame with a hollow bracket forming area. The single bracket forming area on this lead frame occupies a large space, so the number of LED brackets formed on the lead frame per unit area is relatively limited, and the output of LED light-emitting devices made on each lead frame is low. Summary of the invention

[0003] The lead frame, bracket and manufacturing method thereof, light-emitting device and light-emitting apparatus provided in the embodiments of the present invention mainly solve the technical problem that the single bracket molding area on the existing lead frame occupies a large space, resulting in low output when manufacturing LED light-emitting devices on the lead frame.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides a lead frame manufacturing method, the lead frame manufacturing method comprising:

[0005] An insulating substrate having at least one set of lead-filled through-hole pairs is prepared; the lead-filled through-hole pairs include a positive lead-filled through-hole and a negative lead-filled through-hole that are isolated and arranged on the insulating substrate;

[0006] Conductors are filled in the lead filling through holes to form positive and negative leads; the position between the positive lead and the negative lead corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive lead and the negative lead are covered by the insulating substrate on the LED bracket obtained after cutting.

[0007] Preferably, the step of preparing an insulating substrate having at least one set of lead-filled through-hole pairs comprises:

[0008] The material corresponding to the preset lead-filled through-hole pair setting position on the complete insulating substrate is removed to form an insulating substrate having at least one group of lead-filled through-hole pairs.

[0009] Preferably, the conductor is made of copper or a copper alloy.

[0010] Preferably, after the lead filling through-hole pairs are filled with conductors to form positive electrode leads and negative electrode leads, the method further comprises:

[0011] The surfaces of the positive electrode lead and the negative electrode lead are covered with a reflective layer.

[0012] Preferably, a copper foil layer is further provided between the reflective layer and the positive electrode lead and the negative electrode lead.

[0013] Preferably, the step of filling the lead-filling through-hole pairs with conductors to form the positive electrode lead and the negative electrode lead comprises:

[0014] Filling the lead filling through holes with conductors in a molten state respectively, and forming a positive electrode lead and a negative electrode lead after the conductors are cooled;

[0015] Alternatively, the positive electrode lead and the negative electrode lead are formed by respectively filling the conductors in the lead filling through holes in an interference fit manner.

[0016] In order to solve the above technical problems, an embodiment of the present invention further provides a method for manufacturing an LED bracket, and the method for manufacturing an LED bracket includes:

[0017] Forming a lead frame by the lead frame manufacturing method described above;

[0018] The lead frame is clamped in a mold to inject molding material, and at least one dam is formed on the lead frame; the dam has a groove for encapsulating the LED chip, and the top surface of the positive lead and the negative lead of the lead frame is at least partially exposed from the bottom surface of the groove;

[0019] The dam is cut along a position corresponding to between the positive electrode lead and the negative electrode lead so that the insulating substrate of the lead frame after the side surfaces of the positive electrode lead and the negative electrode lead are cut off is covered therein.

[0020] In order to solve the above technical problems, an embodiment of the present invention also provides a lead frame, including: an insulating substrate, a positive lead and a negative lead; at least one group of lead filling through-hole pairs is arranged on the insulating substrate, and the lead filling through-hole pairs include a positive lead filling through-hole and a negative lead filling through-hole that are isolated and arranged on the insulating substrate, and the positive lead filling through-hole and the negative lead filling through-hole are respectively provided with the positive lead and the negative lead formed by filling a conductor; the position between the positive lead and the negative lead corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive lead and the negative lead are covered by the insulating substrate on the LED bracket obtained after cutting.

[0021] Preferably, the conductor is made of copper or a copper alloy.

[0022] Preferably, the surfaces of the positive electrode lead and the negative electrode lead are also covered with a reflective layer.

[0023] Preferably, a copper foil layer is further provided between the reflective layer and the positive electrode lead and the negative electrode lead.

[0024] In order to solve the above technical problems, an embodiment of the present invention further provides an LED bracket, comprising: an insulated and isolated positive lead and a negative lead, and a dam formed on the positive lead and the negative lead, the positive lead and the negative lead are obtained by filling an insulating substrate provided with a pair of lead filling through holes with a conductor, the side surfaces of the positive lead and the negative lead are covered by the insulating substrate, the dam has a groove for encapsulating an LED chip, and the top surfaces of the positive lead and the negative lead are at least partially exposed from the bottom surface of the groove.

[0025] In order to solve the above technical problems, an embodiment of the present invention further provides an LED light-emitting device, comprising: the above LED bracket and at least one LED chip encapsulated in the dam of the LED bracket.

[0026] To solve the above technical problems, an embodiment of the present invention further provides a light-emitting device, comprising: the above-mentioned light-emitting device, wherein the light-emitting device is a lighting device, a light signal indicating device, a fill light device or a backlight device.

[0027] The beneficial effects of the present invention are:

[0028] According to the lead frame, bracket and its manufacturing method, light-emitting device and light-emitting device provided by the embodiment of the present invention, the lead frame manufacturing method includes: first preparing an insulating substrate with at least one group of lead filling through-hole pairs; the lead filling through-hole pairs include positive lead filling through-holes and negative lead filling through-holes that are isolated and arranged on the insulating substrate; filling the lead filling through-hole pairs with conductors to form positive leads and negative leads respectively; the position between the positive lead and the negative lead corresponds to the cutting position after the LED bracket is formed, so that the sides of the positive lead and the negative lead are covered by the insulating substrate on the LED bracket obtained after cutting. The lead frame of the present invention forms the lead pair by centering the lead filling through-hole pairs arranged on the insulating substrate, which reduces the area occupied by a single bracket forming area on the lead frame, improves the utilization rate of the lead frame, thereby improving the output and production efficiency of LED products on a single lead frame, and can effectively reduce production costs.

[0029] Furthermore, in the LED bracket made by the lead frame of the present invention, the side surfaces of the leads are covered inside, so that the leads are not exposed on the side surfaces of the LED bracket, thereby improving the air tightness of the LED bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic structural diagram of a lead frame provided in Embodiment 1 of the present invention;

[0031] Figure 2 A schematic structural diagram of an insulating substrate provided in Embodiment 1 of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the LED bracket before being singulated provided in the first embodiment of the present invention;

[0033] Figure 4 A schematic diagram of the structure of an LED light emitting device provided in Embodiment 1 of the present invention;

[0034] Figure 5 A flow chart of a lead frame manufacturing method provided in Embodiment 2 of the present invention;

[0035] Figure 6 This is a flow chart of a method for manufacturing an LED bracket provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] Embodiment 1:

[0038] In view of the problem in the prior art that a single bracket forming area on a lead frame occupies a large space, resulting in a low yield when manufacturing LED light-emitting devices on the lead frame, the present invention provides a lead frame. Figure 1 The lead frame 10 includes: an insulating substrate 11, a positive lead 12 and a negative lead 13; at least one group of lead filling through-hole pairs is arranged on the insulating substrate 11, and the lead filling through-hole pairs include a positive lead filling through-hole 111 and a negative lead filling through-hole 112 that are isolated and arranged on the insulating substrate 11, and the positive lead filling through-hole 111 and the negative lead filling through-hole 112 are respectively provided with a positive lead 12 and a negative lead 13 formed by filling a conductor; the position between the positive lead 12 and the negative lead 13 corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive lead 12 and the negative lead 13 are covered by the insulating substrate 11 on the LED bracket obtained after cutting.

[0039] Specifically, Figure 2The figure shows a schematic diagram of the structure of the insulating substrate provided in the present embodiment. The base material of the lead frame 10 in the present embodiment is an insulating substrate 11, on which a pair of positive lead filling through holes 111 and negative lead filling through holes 112 are provided. The positive lead filling through holes 111 and the negative lead filling through holes 112 are separated by an insulating material therebetween. The through holes are used to fill conductors to form functional areas for subsequently mounting LED chips and leads for electrical connection with the outside. In addition, when it is necessary to subsequently connect the LED chip mounted thereon to the outside through leads, in the present embodiment, the bottom surface of the leads is used as a welding area for electrical connection with the outside. It should be understood that the insulating substrate prepared in advance in this embodiment can be a complete plate-shaped insulating substrate, and then the material located at the lead pattern on the insulating substrate is removed according to the pre-set lead pattern, so as to form a through hole corresponding to the position where the material is removed. In practical applications, stamping or etching can be used to remove the material located at the lead pattern on the insulating substrate to form the desired lead-filled through hole pair; of course, in other embodiments, the lead-filled through hole pair on the insulating substrate is ready-made, that is, the through hole has been formed during the insulating substrate molding process, and it is not necessary to open the insulating substrate again during actual use to form the lead-filled through hole pair. It should also be noted that the side of the lead pair in this embodiment is covered in the insulating substrate, and the position between the positive lead and the negative lead in this embodiment (that is, located on the insulating substrate) corresponds to the cutting position after the LED bracket is formed on the lead frame, so that after cutting, the side of the lead pair will not be exposed.

[0040] It should be noted that the specific material type used for the insulating substrate in this embodiment can be any suitable material with insulating properties, for example, it may include but not be limited to epoxy resin (EP, Epoxide resin), high temperature resistant nylon (PPA plastic), polyphthalamide (PPA, Polyphthalamide), poly 1,4-cyclohexylene dimethylene terephthalate (PCT, Poly1,4-cyclohexylene dimethylene terephthalate), liquid crystal polymer (LCP, Liquid Crystal Polymer), sheet molding compound (SMC, Sheet molding compound), epoxy molding compound (EMC, Epoxy molding compound), unsaturated polyester (UP) resin, polyester resin (PET, Polyethyleneterephthalate), polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon 66), glass fiber board (FR4), which is not specifically limited here and can be flexibly selected according to production requirements in actual use.

[0041] Please refer again Figure 1 In this embodiment, the positive lead filling through hole 111 and the negative lead filling through hole 112 are respectively used to fill the conductor to form the positive lead 12 and the negative lead 13. The conductor here can be various metals or metal alloy materials, including but not limited to copper, aluminum, iron, silver, and of course, it can also be a mixed material containing conductive materials, such as conductive rubber, etc. The conductor in this embodiment is preferably made of copper or copper alloy, which can ensure good conductivity and heat dissipation. It should be understood that the lead formed by the conductor is not limited to a single-layer structure, and in some embodiments it can also be a composite layer structure composed of multiple layers of conductors.

[0042] In practical applications, in order to improve the reflectivity of light emitted by the LED chip carried in the functional area composed of the lead pair, the surface of the lead can also be coated with a reflective layer. The reflective layer here can be silver, aluminum, copper, gold, etc. The coating method of the reflective layer can preferably be electroplating. It should be noted that the reflective layer coating treatment here can be the treatment of the entire lead frame before the LED bracket is formed, or it can be the reflective layer coating treatment only for the leads in the functional area for carrying the LED chip after the LED bracket is formed. In addition, further, a copper foil layer is also provided between the reflective layer and the lead. Usually, the flatness of the lead surface is not high. Now the copper foil layer is coated on the lead surface to improve the surface flatness, and then the reflective layer is coated on the surface of the copper foil layer to form a smooth surface, which further improves the reflectivity of the lead surface.

[0043] In this embodiment, the positive electrode lead and the negative electrode lead are formed by filling the lead filling through-hole pairs with conductive bodies respectively, including but not limited to the following two methods:

[0044] Method 1: Fill the lead filling through-hole pairs with conductors in a molten state, and form positive and negative leads after the conductors are cooled. That is, the conductive material in a molten state is poured into the filling through-holes on the insulating substrate through the pouring channel, and then the conductive material is cooled and formed. It should be understood that the melting point of the material used for the insulating substrate in this embodiment should be sufficient so that the conductor will not be burned by high temperature when poured inside. In addition, the inner wall of the filling through-hole in this embodiment can preferably adopt an uneven shape, so as to improve the adhesion of the formed lead inside it, so that it is not easy to fall off in actual production.

[0045] Method 2: The conductors are filled in the lead filling through-holes by interference fit to form positive and negative leads. Different from the above method 1, the conductors in this embodiment are finished conductors that can be directly filled. In actual use, they only need to be installed in the filling through-holes. In order to improve the stability of the conductors after they are filled on the insulating substrate, the conductors are installed by interference fit in this embodiment to prevent the conductors serving as positive and negative leads from accidentally falling off during the production process of LED products.

[0046] Based on the above lead frame, this embodiment also provides an LED bracket 20, specifically as follows Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the LED bracket before it is monolithic. Figure 3 The dotted box in the middle shows a schematic diagram of the structure of a single-chip LED bracket. The LED bracket 20 includes: an insulated and isolated positive lead 12 and negative lead 13, and a dam 21 formed on the positive lead 12 and negative lead 13. The positive lead 12 and negative lead 13 are obtained by filling an insulating substrate 11 with a lead filling through hole pair with a conductor. The side surfaces of the positive lead 12 and negative lead 13 are covered by the insulating substrate 11. The dam 21 has a groove 22 for encapsulating the LED chip. The top surfaces of the positive lead 12 and negative lead 13 are at least partially exposed to the bottom surface of the groove 22.

[0047] In practical applications, the LED bracket is formed by clamping the lead frame in a mold and then injecting a molding material into the bracket molding area of ​​the lead frame. A groove is formed on the dam of the formed LED bracket as the packaging area of ​​the LED chip, wherein at least a portion of the top surface of the lead of the lead frame can be exposed to the bottom surface of the groove, thereby serving as a functional area for carrying the LED chip. In addition, when it is necessary to conduct the LED chip to the outside through the lead, the bottom surface of the lead is used as a welding area to be electrically connected to the outside in this embodiment. In practical applications, the LED chip can be placed on the positive lead, and then the LED chip is electrically connected to the positive lead through a metal wire, and then the LED chip is connected to the negative lead through a metal wire. Of course, in practical applications, if the LED chip is flipped, the metal wire connecting the LED chip and the lead may not be required. The groove opens to the top of the dam, so that the sealing material can be encapsulated inside the groove from the opening. It should be understood that the material used to form the dam in this embodiment may include resin or ceramic, etc., which is not limited here. It should be noted that in this embodiment, when the single-piece LED bracket after resin molding is cut, the cutting position corresponds to the position between the positive lead and the negative lead (that is, located on the insulating substrate), so that after the cutting is completed, the side surfaces of the positive lead and the negative lead are covered by the insulating substrate and are not exposed.

[0048] like Figure 4 As shown, this embodiment further provides an LED light-emitting device 100 made by using the above-mentioned LED bracket 20 , which includes the above-mentioned LED bracket 20 and at least one LED chip 30 packaged in the dam 21 of the LED bracket 20 .

[0049] Please refer again Figure 4 In this embodiment, on the single LED light-emitting device 100 formed after cutting the LED bracket 20, the sides of the positive lead 12 and the negative lead 13 of the LED bracket 20 are preferably covered inside the LED bracket, so that the sides of the lead pair will not be exposed, which can improve the airtightness of the LED light-emitting device.

[0050] The color of the light emitted by the LED light-emitting device provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED light-emitting device and presented can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED light-emitting device is provided with a light-emitting conversion layer, and the type of the light-emitting conversion layer provided when the LED light-emitting device is provided with a light-emitting conversion layer.

[0051] In one example of this embodiment, the LED light-emitting device may also include a lens adhesive layer or a diffusion adhesive layer arranged on the LED chip (when a luminescence conversion adhesive layer is arranged on the LED chip, it is arranged on the luminescence conversion adhesive layer); of course, in some examples, a transparent adhesive layer may also be arranged on the LED chip.

[0052] It should be understood that, in one example, the luminescence conversion adhesive layer can be a fluorescent adhesive layer containing fluorescent powder, or a colloid containing quantum dot photosensitive material, or other luminescence conversion adhesive or film that can achieve luminescence conversion, and can also include diffusion powder or silicon powder, etc. as needed; in this embodiment, the methods of forming a luminescence conversion adhesive layer, a lens adhesive layer or a diffusion adhesive layer on the LED chip include but are not limited to dispensing, molding, spraying, pasting, etc.

[0053] For example, the luminescent conversion adhesive layer may include a phosphor adhesive layer, a fluorescent film, or a quantum dot QD film; the phosphor adhesive layer and the fluorescent film may be made of inorganic phosphors, which may be inorganic phosphors doped with rare earth elements, wherein the inorganic phosphors include but are not limited to at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.

[0054] For another example, the quantum dot QD film can be made of quantum dot phosphors; the quantum dot phosphors include but are not limited to at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, and CsPbI3.

[0055] In this embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a luminescence conversion layer can be set on the LED chip to convert the invisible light to visible light, so that the light emitted by the LED light-emitting device is visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if the LED light-emitting device is to present white light visible to the user, the luminescence conversion layer can be made by mixing red, green, and blue phosphors.

[0056] The lead frame provided by the embodiment of the present invention includes: an insulating substrate, a positive lead and a negative lead; at least one group of lead filling through-hole pairs are arranged on the insulating substrate, and the lead filling through-hole pairs include a positive lead filling through-hole and a negative lead filling through-hole that are isolated and arranged on the insulating substrate, and the positive lead filling through-hole and the negative lead filling through-hole are respectively provided with a positive lead and a negative lead formed by filling a conductor; the position between the positive lead and the negative lead corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive lead and the negative lead are covered by the insulating substrate on the LED bracket obtained after cutting. Lead pairs are formed by centering the lead-filled through holes provided on the insulating substrate, thereby reducing the area occupied by a single bracket molding region on the lead frame, improving the utilization rate of the lead frame, thereby increasing the output and production efficiency of LED products on a single lead frame, and effectively reducing production costs; in addition, in the LED bracket made by the lead frame of the present invention, the side surfaces of the leads are covered inside, so that the leads are not exposed on the side surfaces of the LED bracket, thereby improving the airtightness of the LED bracket.

[0057] Embodiment 2:

[0058] In order to facilitate a comprehensive understanding of the present invention, this embodiment illustrates an example of a manufacturing process of a lead frame provided by the present invention.

[0059] See also Figure 5 , Figure 5The flowchart of the lead frame manufacturing method provided in this embodiment, when manufacturing the lead frame, the specific implementation steps include:

[0060] S501, preparing an insulating substrate having at least one set of lead-filled through-hole pairs; the lead-filled through-hole pairs include a positive electrode lead-filled through-hole and a negative electrode lead-filled through-hole that are isolated and arranged on the insulating substrate.

[0061] In this embodiment, the insulating substrate has at least one pair of lead-filled through-hole pairs, wherein each pair of lead-filled through-hole pairs is insulated and separated from each other, and the positive lead-filled through-hole and the negative lead-filled through-hole in the lead-filled through-hole pairs are also insulated and isolated from each other.

[0062] In one implementation, preparing an insulating substrate having at least one set of lead-filled through-hole pairs includes: removing the material at the lead pattern on the complete insulating substrate according to a preset lead pattern, thereby forming an insulating substrate having at least one set of lead-filled through-hole pairs. That is, the insulating substrate prepared in advance in this embodiment is a complete plate-shaped insulating substrate, and then the material at the lead pattern is removed from the complete insulating substrate according to the preset lead pattern, so as to form through holes corresponding to the positions where the material is removed. In actual applications, stamping or etching can be used to remove the material at the lead pattern on the insulating substrate to form the desired lead-filled through-hole pairs; of course, in other embodiments, the lead-filled through-hole pairs on the insulating substrate are ready-made, that is, the through holes are formed during the insulating substrate molding process, and there is no need to open holes in the insulating substrate to form the lead-filled through-hole pairs during actual use.

[0063] S502, filling conductors in the lead filling through-hole pairs respectively to form positive and negative leads; the position between the positive and negative leads corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive and negative leads are covered by the insulating substrate on the LED bracket obtained after cutting.

[0064] The lead-filled through-hole pair in this embodiment is used to fill the conductor to form a functional area for mounting the LED chip and a positive lead and a negative lead for conducting with the outside. In this embodiment, copper or a copper alloy is preferably used to make the conductor to ensure good conductivity and heat dissipation. It should also be noted that the side of the lead pair in this embodiment is covered in the insulating substrate, and the position between the positive lead and the negative lead in this embodiment (that is, located on the insulating substrate) corresponds to the cutting position after the resin molding is completed on the lead frame, so that after cutting, the side of the lead pair will not be exposed.

[0065] In addition, in practical applications, in order to improve the reflectivity of light emitted by the LED chip carried by the functional area composed of the lead pair, the surface of the lead can also be coated with a reflective layer, where the reflective layer can be silver, aluminum, copper, gold, etc., and the coating method of the reflective layer can preferably be electroplating. In addition, further, a copper foil layer is also provided between the reflective layer and the lead. Usually, the surface flatness of the lead is not high. Now the surface of the lead is coated with a copper foil layer to improve the surface flatness, and then the reflective layer is coated on the surface of the copper foil layer to form a smooth surface, which further improves the reflectivity of the lead surface.

[0066] It should also be noted that, in practical applications, the positive electrode lead and the negative electrode lead are formed by filling the lead-filling through-hole pairs with conductive bodies respectively, but not limited to the following two methods:

[0067] Method 1: Fill the lead filling through-holes with molten conductors, and form positive and negative leads after the conductors cool. That is, the molten conductive material is poured into the filling through-holes on the insulating substrate through the pouring channel, and then the conductive material is cooled and formed.

[0068] Method 2: Fill the lead filling through-holes with conductors to form positive and negative leads. The conductors in this embodiment are finished conductors that can be directly filled. In actual use, they only need to be installed in the filling through-holes by interference fit.

[0069] Furthermore, this embodiment also illustrates the process of manufacturing an LED bracket using the lead frame manufactured through the above manufacturing process.

[0070] See also Figure 6 , Figure 6 The flowchart of the LED bracket manufacturing method provided in this embodiment, when manufacturing the LED bracket, the specific implementation steps include:

[0071] S601, preparing a lead frame; the lead frame includes an insulating substrate and a positive electrode lead and a negative electrode lead filled in a pair of lead filling through holes on the insulating substrate.

[0072] S602, clamping the lead frame in a mold to inject molding material, and forming at least one dam on the lead frame; the dam has a groove for encapsulating the LED chip, and the top surfaces of the positive lead and the negative lead of the lead frame are at least partially exposed from the bottom surface of the groove.

[0073] S603, cutting the dam along a position corresponding to between the positive electrode lead and the negative electrode lead, so that the insulating substrate of the lead frame after the side surfaces of the positive electrode lead and the negative electrode lead are cut off is covered therein.

[0074] In actual application, the LED bracket is formed by clamping the lead frame in a mold, and then injecting molding material on the bracket molding area of ​​the lead frame. A groove is formed on the dam of the formed LED bracket as the packaging area of ​​the LED chip, wherein at least a part of the top surface of the lead of the lead frame can be exposed to the bottom surface of the groove, thereby serving as a functional area for carrying the LED chip. In addition, when it is necessary to conduct the LED chip to the outside through the lead, the bottom surface of the lead is used as a welding area to electrically connect to the outside in this embodiment. It should be noted that in this embodiment, when the single-piece LED bracket after resin molding is cut, the cutting position corresponds to the position between the positive lead and the negative lead (that is, located on the insulating substrate), so that after the cutting is completed, the side surfaces of the positive lead and the negative lead are covered by the insulating substrate and are not exposed.

[0075] The lead frame manufacturing method provided by the embodiment of the present invention includes: preparing an insulating substrate having at least one set of lead filling through-hole pairs; the lead filling through-hole pairs include positive lead filling through-holes and negative lead filling through-holes that are isolated and arranged on the insulating substrate; filling the lead filling through-hole pairs with conductors to form positive leads and negative leads respectively; the position between the positive lead and the negative lead corresponds to the cutting position after the LED bracket is formed, so that the sides of the positive lead and the negative lead are covered by the insulating substrate on the LED bracket obtained after cutting. By forming the lead pair by centering the lead filling through-hole pairs arranged on the insulating substrate, the area occupied by the single bracket forming area on the lead frame is reduced, the utilization rate of the lead frame is improved, thereby improving the output and production efficiency of the LED products on the single lead frame, and effectively reducing the production cost.

[0076] Embodiment three:

[0077] This embodiment provides a light-emitting device, which includes the LED light-emitting device exemplified in the above-mentioned embodiment 1 or embodiment 2. The light-emitting device in this embodiment can be a lighting device, a light signal indicating device, a fill light device or a backlight device. When it is a lighting device, it can be a lighting device used in various fields, such as table lamps, fluorescent lamps, ceiling lamps, downlights, street lamps, projection lamps, etc. in daily life, and high beams, low beams, atmosphere lamps, etc. in cars, and surgical lamps, low electromagnetic lighting lamps, and lighting lamps for various medical instruments in medicine, and various colored lights, landscape lighting lamps, advertising lamps, etc. in the field of decoration lighting; when it is a light signal indicating device, it can be a light signal indicating device used in various fields, such as signal indicator lights in the field of traffic, and various signal status indicator lights on communication equipment in the field of communication; when it is a fill light device, it can be a fill light in the field of photography, such as a flash light, a fill light, and it can also be a plant fill light for plant fill light in the field of agriculture; when it is a backlight device, it can be a backlight module used in various backlight fields, such as a display, a television, a mobile terminal such as a mobile phone, an advertising machine, and other equipment.

[0078] It should be understood that the above applications are merely several applications exemplified in this embodiment, and it should be understood that the application of LED light-emitting devices is not limited to the several fields exemplified above.

[0079] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A method for manufacturing an LED bracket, characterized in that: The following steps are involved: An insulating substrate having at least one set of lead-filled through-hole pairs is prepared; the lead-filled through-hole pairs include a positive lead-filled through-hole and a negative lead-filled through-hole that are isolated and arranged on the insulating substrate; Filling the lead-filling through-holes with conductive materials to form positive and negative leads; the position between the positive and negative leads corresponds to the cutting position after the LED bracket is formed, so that the side surfaces of the positive and negative leads are covered by the insulating substrate on the LED bracket obtained after cutting, so as to obtain a lead frame; The lead frame is clamped in a mold to inject molding material, and at least one dam is formed on the lead frame; the dam has a groove for encapsulating the LED chip, and the top surface of the positive lead and the negative lead of the lead frame is at least partially exposed from the bottom surface of the groove; The dam is cut along a position corresponding to between the positive electrode lead and the negative electrode lead so that the insulating substrate of the lead frame after the side surfaces of the positive electrode lead and the negative electrode lead are cut off is covered therein.

2. The method for manufacturing an LED bracket according to claim 1, characterized in that: The method of preparing an insulating substrate having at least one set of lead-filled through-hole pairs comprises: The material corresponding to the preset lead-filled through-hole pair setting position on the complete insulating substrate is removed to form an insulating substrate having at least one group of lead-filled through-hole pairs.

3. The method for manufacturing an LED bracket according to claim 1, characterized in that: The electrical conductor is made of copper or a copper alloy.

4. The method for manufacturing an LED bracket according to claim 1, characterized in that: After the conductors are respectively filled in the lead filling through holes to form the positive electrode lead and the negative electrode lead, the method further includes: The surfaces of the positive electrode lead and the negative electrode lead are covered with a reflective layer.

5. The method for manufacturing an LED bracket according to claim 1, characterized in that: A copper foil layer is also provided between the reflective layer and the positive electrode lead and the negative electrode lead.

6. The method for manufacturing an LED bracket according to any one of claims 1 to 5, characterized in that: The forming of the positive electrode lead and the negative electrode lead by respectively filling the conductors in the lead filling through holes comprises: Filling the lead filling through holes with conductors in a molten state respectively, and forming a positive electrode lead and a negative electrode lead after the conductors are cooled; Alternatively, the positive electrode lead and the negative electrode lead are formed by respectively filling the conductors in the lead filling through holes in an interference fit manner.

7. An LED bracket, characterized in that: include: An insulated and isolated positive lead and a negative lead, and a dam formed on the positive lead and the negative lead, wherein the positive lead and the negative lead are obtained by filling an insulating substrate provided with a pair of lead filling through holes with a conductor, all sides of the positive lead and the negative lead are covered by the insulating substrate, the dam has a groove for encapsulating an LED chip, and the top surfaces of the positive lead and the negative lead are at least partially exposed from the bottom surface of the groove.

8. An LED light emitting device, characterized in that: It comprises the LED bracket as claimed in claim 7 and at least one LED chip encapsulated in the dam of the LED bracket.

9. A light emitting device, characterized in that: It comprises the LED light-emitting device as claimed in claim 8, wherein the light-emitting device is a lighting device, a light signal indicating device, a fill light device or a backlight device.

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