A circuit board structure with flip chip

Abstract

The invention discloses a circuit board structure with a flip chip, including a ceramic substrate and a flip chip, wherein the ceramic substrate is provided with a light-emitting area, a dam is provided at the edge of the light-emitting area, a plurality of grooves are provided in the light-emitting area, a pad is provided inside the groove, and a negative copper foil and a positive copper foil are provided on the pad; a plurality of flip chips are provided, which are arranged on the groove and correspond to each other, and the flip chip covers the negative copper foil and the positive copper foil; wherein a circuit is provided on the ceramic substrate, the negative copper foil is electrically connected to the negative electrode of the power supply through the circuit, the positive copper foil is electrically connected to the positive electrode of the power supply through the circuit, the flip chip is electrically connected to the negative copper foil and the positive copper foil through solder paste, and the groove is also filled with glue, and the glue is filled at the edge of the flip chip. The glue is only filled in the groove instead of covering all the flip chips, which reduces heat accumulation, greatly improves the heat resistance of the entire circuit board, and improves the service life of the circuit board.

Description

Technical Field

[0001] The invention relates to the field of circuit boards, in particular to a circuit board structure with a flip chip. Background Art

[0002] At present, SMD lamp beads are generally installed in the light-emitting area of ​​the circuit board of the ceramic substrate, and the entire light-emitting area is filled with yellow glue to form a complete light-emitting surface. However, since multiple SMD lamp beads are installed in this circuit board structure, and the SMD lamp beads are hidden in the glue of the whole piece, the SMD lamp beads, which have insufficient heat resistance, will be more easily damaged due to overheating, thereby reducing the service life of the entire circuit board. Summary of the invention

[0003] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a circuit board structure with a flip chip, which can improve the heat resistance and extend the service life of the circuit board.

[0004] The technical solution adopted by the present invention to solve the technical problem is:

[0005] According to a first aspect of the present invention, there is provided a circuit board structure with a flip chip, comprising:

[0006] Ceramic substrate: a light-emitting area is provided, a dam is provided at the edge of the light-emitting area, a plurality of grooves are provided in the light-emitting area, a pad is provided inside the groove, and a negative copper foil and a positive copper foil are provided on the pad;

[0007] Flip chips: a plurality of flip chips are provided, which are arranged on the grooves and correspond to each other one by one, and the flip chips cover the negative electrode copper foil and the positive electrode copper foil;

[0008] Among them, a circuit is arranged on the ceramic substrate, the negative copper foil is electrically connected to the negative electrode of the power supply through the circuit, the positive copper foil is electrically connected to the positive electrode of the power supply through the circuit, the flip chip is electrically connected to the negative copper foil and the positive copper foil through solder paste, the groove is also filled with glue, and the glue is filled at the edge of the flip chip.

[0009] The beneficial effect of the present invention is that the flip chip itself has heat-resistant properties, and cooperates with the groove and glue to achieve large-scale luminescence. In addition, the glue is only filled in the groove instead of covering all the flip chips, which reduces heat accumulation, greatly improves the heat resistance of the entire circuit board, and increases the service life of the circuit board.

[0010] According to the first aspect of the present invention, in a circuit board structure with a flip chip, the groove is wide at the top and narrow at the bottom, and the surface of the groove is covered with a reflective material. The cup-shaped groove is combined with the reflective material to further enhance the light effect.

[0011] According to the circuit board structure with flip chip of the first aspect of the present invention, a plurality of the positive electrode copper foils and a plurality of the negative electrode copper foils are fixed in the groove by welding and are electrically connected to the circuit.

[0012] According to the first aspect of the present invention, in a circuit board structure with a flip chip, the dam is covered with a reflective material. After the light is emitted from the groove, the dam is used to reflect the light multiple times, thereby improving the light efficiency and expanding the light output angle and the illumination range.

[0013] According to a circuit board structure with a flip chip according to the first aspect of the present invention, the flip chip is fixed to the upper part of the negative electrode copper foil and the positive electrode copper foil by the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0015] Figure 1 It is a schematic diagram of the structure of the present invention;

[0016] Figure 2 It is a structural schematic diagram of the light-emitting area of ​​the present invention;

[0017] Figure 3 It is a structural schematic diagram of a light emitting area according to another embodiment of the present invention. DETAILED DESCRIPTION

[0018] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0022] Reference Figure 1 A circuit board structure with a flip chip 20 includes a ceramic substrate 10 and a flip chip 20. The ceramic substrate 10 is provided with a light-emitting area 11 and the circuit setting is completed during production. The flip chip 20 is installed in the light-emitting area 11 for emitting light. The edge of the light-emitting area 11 is provided with a dam 12. The light-emitting area 11 is provided with a plurality of grooves 14. Figure 2 The inside of the groove 14 is provided with a soldering pad 142, and the soldering pad 142 is provided with a negative copper foil 143 and a positive copper foil 144; a plurality of flip chips 20 are provided, which are arranged on the groove 14 and correspond to each other, and the flip chips 20 cover the negative copper foil 143 and the positive copper foil 144; the negative copper foil 143 is electrically connected to the negative electrode of the power supply through the circuit. Preferably, in this embodiment, a plurality of the positive copper foils 144 and a plurality of the negative copper foils 143 are welded together. They are respectively fixed in several of the grooves 14 and electrically connected to the circuit. The positive copper foil 144 is electrically connected to the positive electrode of the power supply through the circuit. The flip chip 20 is electrically connected to the negative copper foil 143 and the positive copper foil 144 through solder paste. It should be mentioned that the solder paste in this embodiment not only provides electrical connection, but also fixes the negative copper foil 143 and the positive copper foil 144 to prevent them from falling off. The grooves 14 are also filled with glue 13, and the glue 13 is filled at the edge of the flip chip 20.

[0023] It should be mentioned that the glue 13 mentioned above adopts a glue 13 with high transparency to improve the light emitting effect.

[0024] In actual use, the flip chip 20 cooperates with the groove 14 and the glue 13 to achieve large-scale luminescence. In addition, more importantly, the flip chip 20 itself has heat-resistant properties, replacing the SMD lamp beads with insufficient heat resistance. At the same time, the glue 13 is only filled in the groove 14 instead of covering all the flip chips 20, which reduces heat accumulation, greatly improves the heat resistance of the entire circuit board, and increases the service life of the circuit board.

[0025] In certain embodiments, reference Figure 2 , Figure 3 The groove 14 is wide at the top and narrow at the bottom, and the surface of the groove 14 is covered with a reflective material 141. The cup-shaped groove 14 cooperates with the reflective material 141 to further enhance the light effect.

[0026] In some embodiments, the dam 12 is covered with a reflective material 141. After the light is emitted from the groove 14, the dam 12 is used to reflect the light multiple times, thereby improving the light efficiency and expanding the light output angle and the illumination range.

[0027] The above specific structures and dimensional data are specific descriptions of the preferred embodiments of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent deformations or substitutions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A circuit board structure with a flip chip, characterized in that: include: Ceramic substrate: a light-emitting area is provided, a dam is provided at the edge of the light-emitting area, a plurality of grooves are provided in the light-emitting area, a pad is provided inside the groove, and a negative copper foil and a positive copper foil are provided on the pad; Flip chips: a plurality of flip chips are provided, which are arranged on the grooves and correspond to each other one by one, and the flip chips cover the negative electrode copper foil and the positive electrode copper foil; Among them, a circuit is arranged on the ceramic substrate, the negative copper foil is electrically connected to the negative electrode of the power supply through the circuit, the positive copper foil is electrically connected to the positive electrode of the power supply through the circuit, the flip chip is electrically connected to the negative copper foil and the positive copper foil through solder paste, the groove is also filled with glue, the glue is filled at the edge of the flip chip, the groove is wide at the top and narrow at the bottom, the surface of the groove is covered with reflective material, and the dam is covered with the reflective material.

2. A circuit board structure with a flip chip according to claim 1, characterized in that: A plurality of the positive electrode copper foils and a plurality of the negative electrode copper foils are respectively fixed in a plurality of the grooves by welding and are electrically connected to the circuit.

3. A circuit board structure with a flip chip according to claim 1, characterized in that: The flip chip is fixed on the upper part of the negative electrode copper foil and the positive electrode copper foil through the solder paste.

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