Substrate processing device and control method of substrate processing device

Abstract

The present invention relates to a substrate processing device and a control method for the substrate processing device. Usually, the second substrate conveying mechanism is set to convey the substrate from the substrate buffer to the front-opening wafer box placed on the opener. However, when the specified conditions are met, the second substrate conveying mechanism conveys the substrate from the front-opening wafer box to the substrate buffer. That is, the second substrate conveying mechanism performs an action different from the usual substrate conveying action. Thus, the second substrate conveying mechanism can make the specific front-opening wafer box stay at the loading position (opener) of the specific front-opening wafer box after all substrates are taken out from the specific front-opening wafer box until all processed substrates are stored in the specific front-opening wafer box. Thus, the front-opening wafer box conveying mechanism can convey front-opening wafer boxes other than the specific front-opening wafer box, so the conveying efficiency of the front-opening wafer box can be improved.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate and a control method for the substrate processing device. In addition, regarding the substrate, for example, a semiconductor substrate, a substrate for FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, and a substrate for a solar cell can be cited. Regarding FPD, for example, a liquid crystal display device, an organic EL (electroluminescence) display device, etc. can be cited. Background Art

[0002] Conventional substrate processing apparatuses include a loading block (loading device), a processing block, and a front-opening wafer box buffer device (stacker device). The processing block is connected to the rear surface of the loading block. The front-opening wafer box buffer device is connected to the front surface of the loading block (for example, see Japanese Patent Laid-Open No. 2012-209288, Japanese Patent Laid-Open No. 2013-157650, and Japanese Patent Laid-Open No. 2010-171314).

[0003] Two openers are arranged horizontally side by side on the outer wall of the front surface of the loading block. In addition, a substrate buffer is arranged between the loading block and the processing block, and the substrate buffer can carry multiple substrates in the up-down direction (vertical direction) (refer to Japanese Patent Publication No. 2012-209288).

[0004] Two substrate transport mechanisms are provided inside the loading block. The first substrate transport mechanism is configured to transport substrates between a front opening unified pod (FOUP) mounted on the first opener and a substrate buffer. In addition, the second substrate transport mechanism is configured to transport substrates between a front opening unified pod mounted on the second opener and a substrate buffer. That is, the first substrate transport mechanism transports substrates for the first opener, and the second substrate transport mechanism transports substrates for the second opener. Thus, substrates can be efficiently taken out from the front opening unified pod, and substrates can be efficiently stored in the front opening unified pod.

[0005] The front-opening wafer cassette buffer device comprises: a rack for placing the front-opening wafer cassette to store the front-opening wafer cassette; and a front-opening wafer cassette transfer mechanism for transferring the front-opening wafer cassette between the rack and two openers. Japanese Patent Laid-Open No. 2013-157650 discloses a front-opening wafer cassette transfer mechanism having two holding parts and a replacement operation (replacement operation) of the front-opening wafer cassette using the two holding parts.

[0006] Japanese Patent Publication No. 2010-171314 discloses a front-opening wafer box buffer device, which includes: an opener for taking out a substrate, an opener for storing a substrate, and a storage rack for storing an empty front-opening wafer box after the substrate is taken out. In addition, Japanese Patent Publication No. 2012-209288 and International Publication No. WO2013 / 069716 disclose a plurality of openers arranged in the vertical direction. Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] However, in the case of the conventional example with such a structure, there is the following problem. If the transfer efficiency of the front-opening wafer box is poor, there is a possibility that the substrate transfer mechanism of the loading block will be in a state of waiting for the front-opening wafer box. Therefore, in order to increase the processing capacity of substrate processing, it is desired to improve the transfer efficiency of the front-opening wafer box.

[0009] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus and a control method of the substrate processing apparatus that can improve the transfer efficiency of a front-opening cassette.

[0010] [Technical means to solve the problem]

[0011] In order to achieve the above object, the present invention adopts the following configuration.

[0012] That is, the substrate processing device of the present invention includes the following elements: a processing block, which performs prescribed processing on a substrate transported from a carrier capable of accommodating a plurality of substrates; two or more first carrier loading sections, each for loading the carrier; two or more second carrier loading sections, each for loading the carrier; a substrate buffer section, which is used to transport substrates to the processing block and to move substrates back from the processing block, and which is capable of loading a plurality of substrates; a substrate transport mechanism, which transports substrates; an empty carrier, which is used to load the empty carrier after all substrates are taken out; and a carrier transport mechanism, which transports the carrier; and the substrate transport mechanism is configured to transport substrates from the carriers loaded on each of the two or more first carrier loading sections to the substrate buffer section, and is configured to transfer substrates from the substrate buffer section to each of the two or more second carrier loading sections. The carrier carried thereon transfers a substrate; when the carrier is not carried on any of the more than two first carrier loading sections, when the carrier is not carried on at least any one of the more than two second carrier loading sections, and when the carrier is not carried on the empty carrier rack, the carrier transfer mechanism transfers a specific carrier to any one of the more than two second carrier loading sections; the substrate transfer mechanism transfers a substrate from the specific carrier to the substrate buffer section, and then transfers a processed substrate processed by the processing block from the substrate buffer section to the specific carrier; the carrier transfer mechanism keeps the specific carrier at the loading position of the specific carrier during the period from when all substrates are taken out from the specific carrier by the substrate transfer mechanism to when all processed substrates are stored in the specific carrier.

[0013] According to the substrate processing device of the present invention, usually, the substrate conveying mechanism is set to convey the substrate from the substrate buffer to the carrier mounted on the second carrier mounting portion. However, when the specified conditions are met, the substrate conveying mechanism conveys the substrate from the carrier to the substrate buffer. That is, the substrate conveying mechanism performs an action different from the usual substrate conveying action. Thus, the carrier conveying mechanism can make the specific carrier stay at the loading position of the specific carrier from the time when all substrates are taken out from the specific carrier to the time when all processed substrates are stored in the specific carrier. Thus, the carrier conveying mechanism can convey carriers other than the specific carrier, so the conveying efficiency of the carrier can be improved. As a result, the carrier conveying waiting time is reduced, so the processing capacity of the substrate processing can be increased.

[0014] In addition, an example of the substrate processing apparatus is that, when the carrier is not loaded on any of the two or more first carrier loading sections, when the carrier is not loaded on any of the two or more second carrier loading sections, and when the carrier is not loaded on the empty carrier rack, the carrier transport mechanism transports the specific carrier to any of the two or more second carrier loading sections. For example, there is a case where the carrier is not loaded on the specified second carrier loading section, but the carrier is loaded on the other second carrier loading section. Even in this case, the carrier transport mechanism can keep the specific carrier at the loading position of the specific carrier from the time when all substrates are taken out from the specific carrier to the time when all processed substrates are stored in the specific carrier.

[0015] In addition, in the substrate processing device, it is preferred that an upstream storage rack is further provided, the upstream storage rack is provided upstream of the first carrier loading section, the substrate conveying mechanism generates a first empty carrier after taking out all substrates from the carrier loaded on any one of the two or more first carrier loading sections, the carrier conveying mechanism includes two holding sections for holding the carrier, the carrier conveying mechanism performs a replacement operation by using the two holding sections, that is, replaces the first empty carrier loaded on any one of the two or more first carrier loading sections with the carrier loaded on the upstream storage rack, the carrier conveying mechanism starts a conveying operation of the carrier loaded on the upstream storage rack before a predetermined time point compared to a time point when the first empty carrier is predicted to be generated, so as to perform the replacement operation, the predetermined time being a time from the start of the conveying operation of the carrier loaded on the upstream storage rack to the time point when the carrier conveying mechanism becomes capable of conveying the first empty carrier.

[0016] In order to improve the efficiency of conveying the carrier, the carrier conveying mechanism performs a replacement operation. At this time, the carrier conveying mechanism starts conveying the carrier placed on the upstream storage rack at a preset time before the time point when the first empty carrier is predicted to be generated, so as to perform the replacement operation. As a result, at the time point when the first empty carrier is generated, the carrier conveying mechanism can be in a state where the first empty carrier can be conveyed. Therefore, when the empty carrier is generated, the empty carrier can be conveyed, so the conveying efficiency of the carrier can be further improved.

[0017] In addition, in the substrate processing device, it is preferred that the substrate conveying mechanism generates a processed substrate carrier after storing all substrates into a second empty carrier carried by any one of the more than two second carrier loading parts, the carrier conveying mechanism has two holding parts for holding the carrier, and the carrier conveying mechanism performs a replacement action by using the two holding parts, that is, the processed substrate carrier carried by any one of the more than two second carrier loading parts is replaced with a third empty carrier carried on the empty carrier rack, and the carrier conveying mechanism starts the conveying action of the third empty carrier carried on the empty carrier rack before a preset time compared to the time point when the processed substrate carrier is predicted to be generated, so as to perform the replacement action, and the preset time is the time from the start of the conveying action of the third empty carrier carried on the empty carrier rack to the time point when the carrier conveying mechanism becomes capable of conveying the processed substrate carrier.

[0018] In order to improve the carrier transport efficiency, the carrier transport mechanism performs a replacement action. At this time, the carrier transport mechanism starts transporting the third empty carrier placed on the empty carrier rack before a preset time compared to the time point when the processed substrate carrier is predicted to be generated, so as to perform the replacement action. At the time point when the processed substrate carrier is generated, the carrier transport mechanism can be in a state where the processed substrate carrier can be transported. Therefore, the processed substrate carrier can be transported when the processed substrate carrier is generated, so the carrier transport efficiency can be further improved.

[0019] In addition, in the substrate processing device, it is preferred that an upstream storage rack is further provided, wherein the upstream storage rack is provided upstream of the first carrier loading section, and the substrate conveying mechanism produces a first empty carrier after taking out all substrates from the carrier loaded on any one of the two or more first carrier loading sections, and produces a processed substrate carrier after storing all substrates in a second empty carrier loaded on any one of the two or more second carrier loading sections, and the carrier conveying mechanism has two holding sections for holding the carrier, and the carrier conveying mechanism performs a first replacement action by using the two holding sections, that is, the two carriers are replaced. The first empty carrier carried by any one of the above first carrier loading parts is replaced with the carrier carried on the upstream storage rack, and the carrier conveying mechanism performs a second replacement action by using the two holding parts after the first replacement action, that is, the third empty carrier carried on the empty carrier rack is replaced with the first empty carrier held by any one of the two holding parts, and the carrier conveying mechanism performs a third replacement action by using the two holding parts after the second replacement action, that is, the processed substrate carrier carried by any one of the above two or more second carrier loading parts The carrier conveying mechanism replaces the third empty carrier held by any one of the two holding portions, and when the time point at which the first empty carrier is predicted to be generated is later than the time point at which the processed substrate carrier is predicted to be generated, the carrier conveying mechanism starts the conveying action of the carrier placed on the upstream storage rack before a first time point that is preset compared to the time point at which the first empty carrier is predicted to be generated, so as to perform the first replacement action, and when the time point at which the processed substrate carrier is predicted to be generated is later than the time point at which the first empty carrier is predicted to be generated, the carrier conveying mechanism starts the conveying action of the carrier placed on the upstream storage rack before a first time point that is preset compared to the time point at which the first empty carrier is predicted to be generated, so as to perform the first replacement action. , before a preset second time compared to the time point when the processed substrate carrier is predicted to be generated, the conveying action of the carrier placed on the upstream side storage rack is started to perform the first replacement action, the preset first time is the time from the start of the conveying action of the carrier placed on the upstream side storage rack to the time point when the carrier conveying mechanism becomes capable of conveying the first empty carrier, and the preset second time is the time from the start of the conveying action of the carrier placed on the upstream side storage rack to the time point when the carrier conveying mechanism becomes capable of conveying the processed substrate carrier.

[0020] In order to improve the carrier conveying efficiency, the carrier conveying mechanism performs the first to third replacement actions. At this time, the carrier conveying mechanism starts conveying the carrier placed on the upstream storage rack before a preset time, whichever is later than the time point when the first empty carrier is predicted to be generated and the time point when the processed carrier is predicted to be generated, to perform the replacement action. For example, even if the carrier conveying is started based on the time point when the first empty carrier is predicted to be generated, when the carrier conveying mechanism becomes a state in which the processed substrate carrier can be conveyed, there is a situation in which the substrate conveying mechanism is in the process of storing the substrate in the second empty carrier. In this case, the carrier conveying mechanism generates a waiting time. According to the present invention, it is possible to become the following state: corresponding to the time point when the first empty carrier is generated or the time point when the processed substrate carrier is generated, the first empty carrier or the processed substrate carrier can be conveyed. Therefore, the waiting time for the carrier conveying when the carrier is continuously replaced can be reduced, and the carrier conveying efficiency can be further improved.

[0021] In addition, the present invention is a control method for a substrate processing device, the substrate processing device comprising: a processing block for performing prescribed processing on a substrate transported from a carrier capable of accommodating a plurality of substrates; two or more first carrier loading sections for respectively loading the carriers; two or more second carrier loading sections for respectively loading the carriers; a substrate buffer section for transporting substrates to the processing block and returning substrates from the processing block, and capable of loading a plurality of substrates; a substrate transport mechanism for transporting substrates; an empty carrier rack for loading the carrier that becomes empty after all substrates are taken out; and a carrier transport mechanism for transporting the carrier; the control method for the substrate processing device comprises the following elements: a step of setting the substrate transport mechanism in a manner of transporting substrates from the carriers respectively loaded on the two or more first carrier loading sections to the substrate buffer section; a step of setting the substrate transport mechanism in a manner of transporting substrates from the substrate buffer section to the substrate buffer section; a step of setting the substrate transport mechanism in a manner of transporting substrates from the substrate buffer section to the substrate buffer section The step of setting the substrate conveying mechanism in a manner in which the carrier conveys the substrate; the step of conveying a specific carrier to any one of the two or more second carrier loading sections by using the carrier conveying mechanism when none of the two or more first carrier loading sections carries the carrier, when at least any one of the two or more second carrier loading sections carries the carrier, and when an empty carrier rack does not carry the carrier; the step of conveying a substrate from the specific carrier to the substrate buffer by using the substrate conveying mechanism, and then conveying a processed substrate processed by the processing block from the substrate buffer to the specific carrier; the step of keeping the specific carrier at the loading position of the specific carrier by using the carrier conveying mechanism during the period from when all substrates are taken out from the specific carrier by the substrate conveying mechanism to when all processed substrates are stored in the specific carrier.

[0022] According to the control method of the substrate processing device of the present invention, usually, the substrate conveying mechanism is set to convey the substrate from the substrate buffer to the carrier mounted on the second carrier mounting portion. However, when the specified conditions are met, the substrate conveying mechanism conveys the substrate from the carrier to the substrate buffer. That is, the substrate conveying mechanism performs an action different from the usual substrate conveying action. Thus, the carrier conveying mechanism can make the specific carrier stay at the loading position of the specific carrier from the time when all substrates are taken out from the specific carrier to the time when all processed substrates are stored in the specific carrier. Thus, the carrier conveying mechanism can convey carriers other than the specific carrier, so the conveying efficiency of the carrier can be improved. As a result, the carrier conveying waiting time is reduced, so the processing capacity of the substrate processing can be increased.

[0023] [Effects of the Invention]

[0024] According to the substrate processing apparatus and the control method of the substrate processing apparatus of the present invention, a front-opening cassette can be efficiently transported. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to illustrate the invention, several aspects currently considered to be preferred are shown in the drawings, but it should be understood that the invention is not limited to the structures and measures shown in the drawings.

[0026] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1.

[0027] Figure 2 is a cross-sectional view of the substrate processing apparatus of Example 1.

[0028] Figure 3A It is a front view showing the 4 openers of the loading block. Figure 3B This is a rear view of the four openers as viewed from the two substrate transport mechanisms.

[0029] Figure 4 It is a diagram showing a substrate transfer mechanism of a loading block.

[0030] Figure 5 It is a right side view of the processing block showing the arrangement of the coating processing section.

[0031] Figure 6 It is a left side view of a processing block showing the arrangement of a heat treatment section.

[0032] Fig. 7A 1 is a diagram showing a frame of a front-opening wafer box buffer device as viewed from a front-opening wafer box transfer mechanism. Figure 7B It is a front view showing four openers and a front-opening wafer box transport mechanism viewed from the rack.

[0033] Figures 8A to 8DThis is a diagram for explaining the operation of transferring a substrate from a front-opening cassette to a transport buffer using the first substrate transfer mechanism.

[0034] FIG. 9A to FIG. 9D This is a diagram for explaining the operation of transferring a substrate from the return buffer to the front-opening cassette using the second substrate transfer mechanism.

[0035] FIG. 10A to FIG. 10D This is a diagram for explaining the replacement operation of two front-opening wafer cassettes using the front-opening wafer cassette transfer mechanism.

[0036] Fig.11 This is a flowchart for explaining the transfer operation of the front-opening wafer box from the input port to the output port and the substrate transfer operation.

[0037] Fig.12 This is a diagram showing the operation priority order of the front-opening wafer cassette buffer device.

[0038] FIG. 13A to FIG. 13D This is a diagram for explaining the transport operation of a front-opening wafer cassette.

[0039] FIG. 14A to FIG. 14D It is used to explain the Fig.13D Figure 2 shows the transport action of the front-opening wafer box.

[0040] Figures 15A to 15D It is used to explain the Fig.14D Figure 2 shows the transport action of the front-opening wafer box.

[0041] Fig.16 It is used to explain the Fig.15D Figure 2 shows the transport action of the front-opening wafer box.

[0042] Figures 17A to 17C This is a diagram for explaining the transport operation of another front-opening wafer cassette.

[0043] Fig.18 This is a diagram for explaining the replacement operation of the front-opening wafer box in the substrate processing apparatus of the second embodiment.

[0044] Fig.19 This is a diagram for explaining the replacement operation of the front-opening wafer box in the substrate processing apparatus of the third embodiment.

[0045] Fig. 20A FIG. 1 is a diagram for explaining the replacement operation of the front-opening wafer box in the substrate processing apparatus of the fourth embodiment. Fig. 20B This is a diagram for explaining the front-opening wafer cassette transfer operation when the replacement operation is not performed using two holding parts.

[0046] Fig.21 is a cross-sectional view of a substrate processing apparatus according to a modified example.

[0047] Fig. 22 It is a longitudinal sectional view of a substrate processing apparatus according to a modification. DETAILED DESCRIPTION

[0048] [Example 1]

[0049] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings.

[0050] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1. Figure 2 is a cross-sectional view of the substrate processing apparatus of Example 1. Figure 3A is a front view showing the 4 openers of the loading block. Figure 3B This is a rear view of the four openers as viewed from the two substrate transport mechanisms.

[0051] Reference Figure 1 or Figure 2 The substrate processing device 1 is a device that forms a resist film or the like on a substrate W and develops the exposed substrate W. The substrate processing device 1 includes a loading block 2 (hereinafter appropriately referred to as "ID block 2"), a processing block 3, a front-opening wafer box buffer device 4 (stacker device) and an interface block IF. The interface block IF is connected to the rear surface of the processing block 3. The processing block 3 is connected to the rear surface of the ID block 2, and the front-opening wafer box buffer device 4 is connected to the front surface of the ID block 2.

[0052] [ID(Loading) Block 2]

[0053] The ID block 2 transfers and transports the substrate W to the carrier. The ID block 2 includes four openers 5A to 5D (see Figure 3A ), two substrate transfer mechanisms 6A, 6B and a substrate buffer section 7. Four openers 5A~5D are arranged on the wall 8 on the front surface of the ID block 2.

[0054] like Figure 3A As shown, the four openers 5A to 5D are divided into two groups, namely the first opener column 9 and the second opener column 10. The first opener column 9 has two openers 5A and 5B arranged in the vertical direction. The second opener column 10 has two openers 5C and 5D arranged in the vertical direction. In addition, the second opener column 10 and the first opener column 9 are arranged side by side in the horizontal direction (Y direction). In addition, Figure 3A In the embodiment, the first opener 5A is provided above the second opener 5B. The third opener 5C is provided above the fourth opener 5D.

[0055] The four openers 5A to 5D respectively carry carriers. The carrier uses, for example, a front-opening wafer box F (FOUP). In addition, as long as it is a carrier with a cover that can be opened and closed, the carrier is not limited to the front-opening wafer box F. Below, the carrier is explained by the front-opening wafer box F. The front-opening wafer box F can accommodate multiple (for example, 25) substrates W in a horizontal posture. The front-opening wafer box F has an opening for the substrate W to enter and exit, a front-opening wafer box body for accommodating the substrate W, and a cover covering the opening.

[0056] The four openers 5A to 5D respectively open and close the lid of the front-opening wafer box F. The four openers 5A to 5D respectively include a mounting table 12, an opening 14, a baffle 16 and a baffle driving unit (not shown). The front-opening wafer box F is mounted on the mounting table 12. The opening 14 is an opening for transferring the substrate W between the interior of the front-opening wafer box F and the interior of the ID block 2. The baffle 16 is used to cover the opening 14. In addition, the baffle 16 locks the lid to the front-opening wafer box body and releases the lock. In addition, the baffle 16 is configured to hold the lid. The baffle 16 holds the lid, for example, by vacuum adsorption. The baffle 16 moves in the up and down directions and the front and back directions by a baffle driving unit having an electric motor.

[0057] like Figure 2 As shown, the first substrate conveying mechanism 6A is arranged at a position opposite to the first opener row 9 (including the opener 5A). The second substrate conveying mechanism 6B is arranged at a position opposite to the second opener row 10 (including the opener 5C). The first substrate conveying mechanism 6A conveys the substrate W between the front-opening wafer box F on which the two openers 5A and 5B of the first opener row 9 are respectively placed and the substrate buffer 7. The second substrate conveying mechanism 6B conveys the substrate W between the front-opening wafer box F on which the two openers 5C and 5D of the second opener row 10 are respectively placed and the substrate buffer 7.

[0058] like Figure 3B , Figure 4 As shown, the two substrate conveying mechanisms 6A and 6B are respectively provided with two robots 21 (21A, 21B), an advance and retreat drive unit 23, and an elevation and rotation drive unit 25. The two robots 21A and 21B respectively hold substrates W. The two robots 21A and 21B can independently advance and retreat in the horizontal direction, for example, they can take out one substrate W or two substrates W from a front-opening wafer box F. The two robots 21A and 21B are respectively configured in a shape such as a Y-shaped or U-shaped shape with the front end divided into two. In addition, the two substrate conveying mechanisms 6A and 6B are respectively provided with two robots 21A and 21B, but may also be provided with three or more robots.

[0059] The advance / retract drive unit 23 supports the two manipulators 21A and 21B so that they can move, and moves the two manipulators 21A and 21B forward and backward. In order to drive the first manipulator 21A, the advance / retract drive unit 23 includes, for example, an electric motor, a linear screw shaft, a movable part having a hole that meshes with the screw shaft, and a guide part that guides the movable part. The first manipulator 21A is supported by the movable part. Similarly, in order to drive the second manipulator 21B, the advance / retract drive unit 23 includes, for example, an electric motor, a screw shaft, a movable part, and a guide part.

[0060] The lifting and rotating driving unit 25 lifts and rotates the two manipulators 21A and 21B by lifting and rotating the advancing and retreating driving unit 23. The lifting and rotating driving unit 25 includes a support portion 25A and a rotating portion 25B. The support portion 25A is provided in a manner extending in the up-down direction. The support portion 25A is fixed to the bottom of the ID block 2. Therefore, the support portion 25A, that is, the horizontal direction (especially the Y direction) of the lifting and rotating driving unit 25 does not move and is fixed.

[0061] The rotating part 25B is raised and lowered along the support part 25A. The support part 25A includes, for example, an electric motor (not shown), two pulleys 27, and a belt 28. The belt 28 is mounted on the two pulleys 27. The rotating part 25B is mounted on the belt 28. The rotation of the electric motor is transmitted to one of the two pulleys 27, so that the belt 28 moves. The rotating part 25B moves together with the movement of the belt 28.

[0062] The rotating unit 25B rotates the forward / backward driving unit 23 about the vertical axis AX1a or the vertical axis AX1b along the support 25A. This changes the orientation of the two manipulators 21A and 21B. The rotating unit 25B includes, for example, an electric motor, two pulleys, and a belt.

[0063] As described above, the horizontal position of the support portion 25A, i.e., the lifting and rotating driving portion 25, does not move but is fixed. Therefore, the horizontal position of the vertical axes AX1a, AX1b, i.e., the rotation center of the advance and retreat driving portion 23, is also fixed. In this way, the horizontal position of the lifting and rotating driving portion 25 is fixed. Thus, the first substrate conveying mechanism 6A can convey the substrate W between each front-opening wafer box F of the two openers 5A, 5B and the substrate buffer 7, but cannot convey the substrate between each front-opening wafer box F of the two openers 5C, 5D and the substrate buffer 7. Similarly, the second substrate conveying mechanism 6B can convey the substrate W between each front-opening wafer box F of the two openers 5C, 5D and the substrate buffer 7, but cannot convey the substrate W between each front-opening wafer box F of the two openers 5A, 5B and the substrate buffer 7.

[0064] Back to Figure 1 , Figure 2The substrate buffer 7 can hold a plurality of (for example, 52) substrates W. In the substrate buffer 7, each substrate W is supported in a horizontal position, and the plurality of substrates W are arranged in the vertical direction. Figure 2 As shown, the substrate buffer 7 includes a support 29A, a plurality of mounting plates 29B, and three support pins 29C. The support 29A extends in the vertical direction (Z direction). The plurality of mounting plates 29B are supported on the support 29A in a manner that they extend horizontally in the +X direction from the ID block 2 toward the processing block 3. The three support pins 29C are supported on the upper surface of the mounting plates 29B. The substrate W is supported on the support pins 29C. Figure 2 As shown, the substrate buffer 7 is disposed between the ID block 2 and the processing block 3 or in the vicinity thereof.

[0065] The two openers 5A and 5B correspond to the first carrier placement section, respectively. The two openers 5C and 5D correspond to the second carrier placement section, respectively. The first substrate transfer mechanism 6A and the second substrate transfer mechanism 6B correspond to the substrate transfer mechanism of the present invention.

[0066] [Processing Block 3]

[0067] like Figure 1 As shown, the processing block 3 includes a coating block 31 and a developing block 32. The coating block 31 and the developing block 32 are arranged in the horizontal direction (X direction) with respect to each other.

[0068] The coating block 31 includes two coating treatment layers 31A and 31B arranged in the vertical direction. The developing block 32 includes two developing treatment layers 32A and 32B arranged in the vertical direction. The two coating treatment layers 31A and 31B and the two developing treatment layers 32A and 32B are respectively provided with a third substrate conveying mechanism 33, a conveying space 34, a liquid processing unit SC, and a heat treatment unit 37.

[0069] In addition, the substrate buffer 7 includes two transport buffers SBF1 and SBF2 and two return buffers RBF1 and RBF2. The transport buffers SBF1 and SBF2 and the return buffers RBF1 and RBF2 each have 13 mounting plates 29B, which can mount 13 substrates W. For example, the transport buffer SBF1 and the return buffer RBF1 are used for the first coating treatment layer 31A, and the transport buffer SBF2 and the return buffer RBF2 are used for the second coating treatment layer 31B. In addition, the two substrate transport mechanisms 6A and 6B can transport substrates W to all the transport buffers SBF1 and SBF2 and the return buffers RBF1 and RBF2, respectively.

[0070] The third substrate transfer mechanism 33 transfers the substrate W between the four processing layers 31A, 31B, 32A, and 32B. The third substrate transfer mechanism 33 includes two robot arms 41 , an advance / retract drive unit 42 , a rotation drive unit 43 , a first moving mechanism 44 , and a second moving mechanism 45 .

[0071] The two manipulators 41 are each configured in a Y-shaped or U-shaped shape with the front end being split into two. The two manipulators 41 each hold a substrate W. The advance / retract drive unit 42 enables the two manipulators 41 to advance / retract respectively. The rotation drive unit 43 enables the advance / retract drive unit 42 to rotate around the vertical axis AX2. Thus, the orientation of the two manipulators 41 can be changed. The first moving mechanism 44 enables the rotation drive unit 43 to move in the direction of the substrate W. Figure 1 The second moving mechanism 45 moves the first moving mechanism 44 in the vertical direction (Z direction). Thus, the advance / retract drive unit 42 can be moved in the X direction. The second moving mechanism 45 moves the first moving mechanism 44 in the vertical direction (Z direction). Thus, the advance / retract drive unit 42 can be moved in the Z direction.

[0072] Furthermore, the forward / backward drive unit 42 , the rotation drive unit 43 , the first moving mechanism 44 , and the second moving mechanism 45 each include an electric motor.

[0073] like Figure 2 As shown in FIG. 1 , the third substrate transfer mechanism 33 is disposed in a transfer space 34. The transfer space 34 is configured to extend linearly in the horizontal direction (X direction). Figure 2 As shown, the transfer space 34 is a rectangular space when viewed from above the substrate processing apparatus 1. The liquid processing section SC and the heat processing section 37 are arranged so as to sandwich the transfer space 34.

[0074] Figure 5 The right side of the processing block 3 shows the configuration of the liquid processing unit SC. The four processing layers 31A, 31B, 32A, and 32B each have four liquid processing units SC. The four liquid processing units SC are arranged in 2 rows in the horizontal direction and 2 rows in the vertical direction. The four liquid processing units SC in the coating processing layer 31A (31B) are two coating units BARC and two coating units RESIST. In addition, the four liquid processing units SC in the development processing layer 32A (32B) are four development units DEV.

[0075] The coating unit BARC forms an antireflection film on the substrate W. The coating unit RESIST forms a resist film such as a photoresist on the substrate W. The developing unit DEV develops the exposed substrate W.

[0076] like Figure 2As shown in FIG. 1 , the liquid processing unit SC includes a holding and rotating unit 47, a nozzle 48, and a nozzle moving mechanism 49. The holding and rotating unit 47 holds the substrate W by vacuum adsorption, for example, and rotates the held substrate W around a vertical axis (Z direction). The nozzle 48 supplies a coating liquid (for example, an anti-reflection film forming liquid or a photoresist liquid) or a developing liquid to the substrate W. The nozzle moving mechanism 49 moves the nozzle 48.

[0077] Figure 6 3 is a left side surface of the processing block 3 showing the arrangement of the heat treatment unit 37. The four processing layers 31A, 31B, 32A, and 32B are provided with the heat treatment unit 37. The heat treatment unit 37 performs heat treatment and is provided with a plate 51 (see FIG. 5 ) on which the substrate W is placed. Figure 2 ). The heat treatment section 37 is configured to be arranged in 3 columns × 5 sections. The coating treatment layer 31A (31B) includes 14 heat treatment sections 37. That is, the coating treatment layer 31A (31B) includes 3 adhesion strengthening treatment sections PAHP, 2 cooling sections CP, and 9 heating and cooling sections PHP. In addition, the development treatment layer 32A (32B) includes 2 cooling sections CP and 7 heating and cooling sections PHP. In addition, the number of units such as the liquid treatment section SC and the heat treatment section 37 (for example, the edge exposure section EEW) can be appropriately changed.

[0078] The adhesion enhancing treatment section PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion enhancing agent such as hexamethyldisilazane (HMDS) to the substrate W and heating the substrate W. The adhesion enhancing treatment section PAHP also has the function of cooling the substrate W after heating. The cooling section CP cools the substrate W. The heating and cooling section PHP performs heating and cooling processes in sequence.

[0079] In addition, if Figure 1 As shown, for example, the transfer of the substrate W from the coating treatment layer 31A to the development treatment layer 32A is performed via the substrate loading unit PS1. The transfer of the substrate W from the development treatment layer 32A to the interface block IF is performed via the substrate loading unit PS2. The transfer of the substrate W from the interface block IF to the development treatment layer 32A is performed via the substrate loading unit PS4. The transfer of the substrate W from the development treatment layer 32A to the coating treatment layer 31A is performed via the substrate loading unit PS5. In addition, the five substrate loading units PS1 to PS5 including the substrate loading unit PS3 described below can be used to load one or more substrates W.

[0080] [Interface block IF]

[0081] The interface block IF is adjacent to an external exposure machine EXP which is an independent entity from the substrate processing apparatus 1. The interface block IF sends out a substrate W having a resist film formed thereon to the exposure machine EXP, and receives an exposed substrate W from the exposure machine EXP.

[0082] The interface block IF has three substrate transport mechanisms TC4, TC5, TD, a loading and cooling unit P-CP, a substrate loading unit PS3, a conveying buffer unit SBF3, a return buffer unit RBF3, an edge exposure unit EEW, a heating and cooling unit PHP, a pre-exposure cleaning unit 53, and a post-exposure cleaning unit 55. The three substrate transport mechanisms TC4, TC5, TD are configured to be Figure 4 The first substrate transfer mechanism 6A shown is the same, so the detailed description thereof is omitted.

[0083] The placement and cooling unit P-CP is a substrate placement table with a cooling function for taking a substrate W from the exposure machine EXP and sending the substrate W to the exposure machine EXP. The transport buffer SBF3 and the return buffer RBF3 can be used to place a plurality of substrates W. The edge exposure unit EEW exposes the peripheral portion of the substrate W. The heating and cooling unit PHP performs a post-exposure bake (PEB) process in the block IF. The pre-exposure cleaning unit 53 cleans and dries the substrate W before the exposure process. The post-exposure cleaning unit 55 cleans the substrate W after the exposure process.

[0084] [Operation example of processing block 3 and interface block IF]

[0085] Here, an operation example of the processing block 3 and the interface block IF is described. In the coating processing layer 31A, the third substrate transport mechanism 33 receives the substrate W from the transport buffer SBF1. The third substrate transport mechanism 33 sequentially transports the received substrate W to the Figure 5 , Figure 6 The third substrate transport mechanism 33 transports the substrate W with the anti-reflection film formed in the coating unit BARC to the heating and cooling part PHP, the cooling part CP, the coating unit RESIST, and the heating and cooling part PHP in sequence. The third substrate transport mechanism 33 transports the substrate W with the anti-etching film formed in the coating unit RESIST to the substrate loading part PS1.

[0086] In the development processing layer 32A, the third substrate transfer mechanism 33 transfers the substrate W from the substrate mounting portion PS1 to the substrate mounting portion PS2.

[0087] In the interface block IF, the fourth substrate transport mechanism TC4 obtains a substrate W from the substrate loading section PS2, and sequentially transports the obtained substrate W to the edge exposure section EEW, the pre-exposure cleaning unit 53, and the loading and cooling section P-CP. The sixth substrate transport mechanism TD transports the substrate W from the loading and cooling section P-CP to the exposure machine EXP. In addition, the sixth substrate transport mechanism TD transports the substrate W exposed by the exposure machine EXP from the exposure machine EXP to the substrate loading section PS3. The fifth substrate transport mechanism TC5 obtains a substrate W from the substrate loading section PS3, and transports the obtained substrate W to the post-exposure cleaning unit 55, the heating and cooling unit PHP, and the substrate loading section PS4.

[0088] In the development processing layer 32A, the third substrate transfer mechanism 33 receives the substrate W from the substrate placement portion PS4, and sequentially transfers the received substrate W to the cooling portion CP, the developing unit DEV, the heating and cooling unit PHP, and the substrate placement portion PS5.

[0089] In the coating processing layer 31A, the third substrate transport mechanism 33 transports the developed substrate W from the substrate placement portion PS5 to the return buffer portion RBF2.

[0090] [Front-opening wafer box buffer device 4]

[0091] like Figure 1 , Figure 2 As shown, the front opening pod buffer device 4 includes a plurality of (eg, twelve) racks 61 and a front opening pod transfer mechanism 62 for transferring the front opening pod F.

[0092] Multiple racks 61 and two opener rows 9, 10 (e.g. Figure 1 The two openers 5C and 5D shown in the figure are arranged opposite to each other. The front-opening wafer box conveying mechanism 62 is arranged between the two opener rows 9 and 10 and the plurality of racks 61. In addition, the front-opening wafer box conveying mechanism 62 is arranged on the side opposite to the two substrate conveying mechanisms 6A and 6B across the two opener rows 9 and 10.

[0093] also, Fig. 7A 1 is a diagram showing the rack 61 of the front-opening pod buffer device 4 as viewed from the front-opening pod transfer mechanism 62 . Figure 7B It is a front view showing the four openers 5A to 5D and the front-opening cassette transfer mechanism 62 as viewed from the rack 61 .

[0094] The rack 61 is used to carry the front-opening wafer box F. The rack 61 is arranged at Figure 1 The wall portion 64 on the left side (front side) of the front-opening wafer box buffer device 4 is shown. Fig. 7AAs shown, the rack 61 includes, for example, two input ports IP1 and IP2 (also referred to as input load ports), two output ports OP1 and OP2 (also referred to as output load ports), two unprocessed substrate front-opening cassette racks IB1 and IB2, two processed substrate front-opening cassette racks OB1 and OB2, and four empty front-opening cassette racks EB1 to EB4. In addition, the number and function of the rack 61 are set as needed.

[0095] The two input ports IP1 and IP2 are used to obtain the front-opening wafer box F from the external transport mechanism OHT (Overhead Hoist Transport) that transports the front-opening wafer box F in the factory. The two output ports OP1 and OP2 are used to transfer the front-opening wafer box F containing the processed substrate W to the external transport mechanism OHT. The two input ports IP1 and IP2 and the two output ports OP1 and OP2 are set at the uppermost section of the rack 61. In order to carry out the handover between the external transport mechanism OHT and the front-opening wafer box F, the top wall of the front-opening wafer box buffer device 4 is partially opened.

[0096] For example, when the two openers 5A and 5B are set to be used for taking out (transporting) the substrate W, the two unprocessed substrate front-opening cassette racks IB1 and IB2 are used to store the front-opening cassette F that cannot be transferred to the two openers 5A and 5B. In addition, for example, when the two openers 5C and 5D are set to be used for storing (returning) the substrate W, the processed substrate front-opening cassette racks OB1 and OB2 are used to store the front-opening cassette F that cannot be transferred from the two openers 5C and 5D to the output ports OP1 and OP2. The four empty front-opening cassette racks EB1 to EB4 are used to store the empty front-opening cassette F after the substrate W is taken out.

[0097] like Figure 7B As shown, the front-opening wafer box conveying mechanism 62 includes two holding parts 65A, 65B, two multi-joint arms 66A, 66B, a lifting drive part 67 and a horizontal drive part 68. The two holding parts 65A, 65B are respectively configured to hold the front-opening wafer box F. Specifically, the two holding parts 65A, 65B are respectively configured to hold the protrusion 69 provided on the upper part of the front-opening wafer box F. The first holding part 65A is mounted on the first end of the first multi-joint arm 66A in a manner that allows rotation around the vertical axis AX3a. In addition, the second holding part 65B is mounted on the first end of the second multi-joint arm 66B in a manner that allows rotation around the vertical axis AX4a.

[0098] The two multi-joint arms 66A and 66B are respectively configured in a scalar type, for example. The first multi-joint arm 66A moves the holding portion 65A to a specified position in the horizontal direction by rotating the support components connected to each of the two vertical axes AX3b and AX3c. In addition, the first multi-joint arm 66A adjusts the orientation of the front-opening wafer box F by rotating the first holding portion 65A around the vertical axis AX3a. Similarly, the second multi-joint arm 66B moves the holding portion 65B to a specified position in the horizontal direction by rotating the support components connected to each of the two vertical axes AX4b and AX4c. In addition, the second multi-joint arm 66B adjusts the orientation of the front-opening wafer box F by rotating the second holding portion 65B around the vertical axis AX4a. The two multi-joint arms 66A and 66B are respectively mounted on the lifting drive unit 67.

[0099] like Figure 1 As shown, the lifting drive unit 67 includes two drive units 67A and 67B. The first drive unit 67A lifts the first multi-joint arm 66A in the vertical direction, and the second drive unit 67B lifts the second multi-joint arm 66B in the vertical direction. In other words, the two holding parts 65A and 65B are lifted and lowered independently of each other. The two drive units 67A and 67B are arranged side by side in the horizontal direction (for example, the X direction).

[0100] The first holding portion 65A and the first multi-joint arm 66A are arranged above the second holding portion 65B and the second multi-joint arm 66B. In other words, the first holding portion 65A and the first multi-joint arm 66A are configured so as not to be able to move below the second holding portion 65B and the second multi-joint arm 66B in order to prevent collision. In addition, in this regard, the lifting drive portion 67 may also be configured so as to enable the holding portion 65A to move above and below the holding portion 65B.

[0101] The horizontal drive unit 68 moves the lifting drive unit 67 in the horizontal direction (Y direction). As a result, the two holding units 65A and 65B can approach the front-opening wafer box F that cannot be reached within the horizontal movable range of the two multi-jointed arms 66A and 66B. Figure 7B In the embodiment, the two holding parts 65A and 65B can respectively transport the front-opening wafer cassettes F to all the racks 61 and the four openers 5A to 5D.

[0102] In addition, the two holding parts 65A, 65B, the two multi-joint arms 66A, 66B, the lifting drive part 67 (two drive parts 67A, 67B) and the horizontal drive part 68 are respectively equipped with electric motors. In addition, the two drive parts 67A, 67B may also be equipped with, for example, two pulleys and belts. In addition, the holding parts and multi-joint arms may be other than two groups as needed.

[0103] like Figure 1As shown, the substrate processing device 1 includes one or more control units 71 and an operation unit 73. The control unit 71 includes, for example, a central processing unit (CPU). The control unit 71 controls each component of the substrate processing device 1. The operation unit 73 includes a display unit (for example, a liquid crystal monitor), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touch panel, and various buttons. The storage unit stores various conditions for substrate processing and the action program required for controlling the substrate processing device 1.

[0104] <Operation of substrate processing apparatus 1>

[0105] Next, the operation of the substrate processing apparatus 1 will be described. First, the operation of the two substrate transfer mechanisms 6A and 6B of the substrate processing apparatus 1 will be described.

[0106] exist Figure 2 In the embodiment, the front-opening wafer box transfer mechanism 62 transfers the front-opening wafer box F to the opener 5A. The shutter 16 of the opener 5A releases the lock of the cover of the front-opening wafer box F placed on the mounting table 12 of the opener 5A while holding the cover. Thereafter, the cover is removed from the front-opening wafer box F while sliding downward, thereby opening the opening 14 (see FIG. Figure 3B ) open. Two openers 5A, 5B (refer to Figure 3B ) and the first substrate transfer mechanism 6A are pre-set to be used for taking out (delivering out) the substrate W as a normal operation. Therefore, the first substrate transfer mechanism 6A starts taking out the substrate W from, for example, the front-opening wafer box F placed on the opener 5A. The substrate W taken out from the front-opening wafer box F is transferred to the substrate buffer 7.

[0107] [Operation of Removing Substrate W by First Substrate Transport Mechanism 6A]

[0108] exist Fig. 8A In the embodiment, the advance and retreat drive unit 23 of the first substrate transfer mechanism 6A advances the two robots 21 (21A, 21B) so that the two robots 21 enter the front-opening wafer box F. After entering, the lifting and rotating drive unit 25 (see Figure 4 ) The two robots 21 are slightly raised. Thus, the two substrates W are lifted up and held by the two robots 21. After the two substrates W are lifted up, the advance / retract drive unit 23 moves the two robots 21 backward while holding the two substrates W.

[0109] After taking out two substrates W from the front-opening wafer box F, the taken out two substrates W are transported to the transport buffer SBF1 of the substrate buffer 7. The specific operations are described in sequence. The lifting and rotating drive unit 25 causes the two manipulators 21 and the forward and backward drive unit 23 to rise and fall along the vertical axis AX1a ( Figure 8B The two robots 21 and the advance / retreat drive unit 23 are rotated about the vertical axis AX1a. Thus, the two robots 21 are moved to a predetermined height position of the transport buffer SBF1 where the two substrates W are placed and held, and the two robots 21 are directed toward the transport buffer SBF1.

[0110] exist Figure 8C In the embodiment, the advance / retreat drive unit 23 advances the two robots 21 holding the two substrates W, and causes the two robots 21 to enter the area of ​​the transport buffer SBF1. After entering, the lifting and rotating drive unit 25 slightly lowers the two robots 21. Thus, the two robots 21 place the two substrates W on the support pins 29C. After placing the two substrates W, the advance / retreat drive unit 23 retreats the two robots 21 that are not holding the substrates W.

[0111] After the two substrates W are transferred to the transport buffer SBF1, one or two substrates W are taken out from the front-opening cassette F again. Fig.8D In the embodiment, the lifting and rotating driving unit 25 causes the two manipulators 21 and the advancing and retreating driving unit 23 to be lifted and lowered along the vertical axis AX1a ( Fig.8D The two robots 21 and the advance / retract drive unit 23 are rotated around the vertical axis AX1a. Thus, the two robots 21 are moved to a position opposite to the next one or two substrates W to be taken out, and the two robots 21 are directed toward the one or two substrates W. Then, one or two substrates W are taken out from the front-opening wafer box F.

[0112] In addition, repeat Figures 8A to 8D The operation is continued until all substrates W are taken out from the front-opening wafer box F. At this time, Figure 1 The two coating processing layers 31A and 31B of the processing block 3 shown in the figure are processed synchronously. Therefore, when two substrates W taken out from the front-opening wafer box F are transferred to the transport buffer SBF1, the next two substrates W taken out are transferred to the transport buffer SBF2. The next two substrates W taken out are transferred to the transport buffer SBF1 again.

[0113] Substrates W are alternately allocated to the "transport buffer SBF1" and the "transport buffer SBF2". Figure 8A to Figure 8C As shown, the first substrate transfer mechanism 6A sequentially takes out substrates W from the lower stage 86 of the front-opening cassette F and sequentially places them on the mounting plate 29B of the transport buffer SBF1 from below.

[0114] In addition, Fig.8D In the process, the third substrate transfer mechanism 33 of the first coating treatment layer 31A takes in one substrate W placed on the placement plate 29B of the transport buffer SBF1. The taken-in substrate W is subjected to a predetermined process in the first coating treatment layer 31A.

[0115] [Accommodation (Return) Operation of Substrate W by Second Substrate Transport Mechanism 6B]

[0116] exist Fig. 9A In the figure, three substrates W are placed on the placing plates 29B at the first to third stages from the bottom of the return buffer RBF1. The three substrates W are substrates W conveyed by the third substrate conveying mechanism 33 and are substrates W that have been subjected to a predetermined process by the first coating treatment layer 31A. The advance / retract drive unit 23 of the second substrate conveying mechanism 6B causes the two robots 21 to advance so that the two robots 21 enter the area of ​​the return buffer RBF1. After entering, the two robots 21 pick up and hold the two substrates W. After picking up the two substrates W, the advance / retract drive unit 23 moves the two robots 21 backward while holding the two substrates W.

[0117] After the two substrates W are obtained from the return buffer RBF1, for example, the two substrates W are stored in the front-opening wafer box F placed on the opener 5C. The specific operations are described in sequence. The lifting and rotating drive unit 25 causes the two manipulators 21 and the forward and backward drive unit 23 to rise and fall along the vertical axis AX1b ( Fig. 9B The two robots 21 and the advance / retract drive unit 23 are rotated around the vertical axis AX1b, thereby moving the two robots 21 to a position opposite to the third and fourth storage spaces from below the front-opening wafer box F of the transfer target, and directing the two robots 21 toward the storage spaces.

[0118] exist Fig. 9C In the embodiment, the advance / retreat driving unit 23 advances the two robots 21 holding the two substrates, thereby causing the two robots 21 to enter the front-opening cassette F. After entering, the two robots 21 place the two substrates W at the third and fourth stages from the bottom in the front-opening cassette F. After placing the two substrates W, the advance / retreat driving unit 23 causes the two robots 21 not holding the substrates W to retreat.

[0119] After the two processed substrates W are stored in the front-opening wafer box F, one or two substrates W are taken out again from the return buffer RBF2 other than the return buffer RBF1. That is, the two robots 21 are moved to a position opposite to the one or two substrates W to be taken out next, and the two robots 21 are directed toward the one or two substrates W. Then, one or two substrates W are taken out.

[0120] By repeating the FIG. 9A to FIG. 9D The substrate W is stored in the front-opening wafer box F. Figure 1 The two coating processing layers 31A and 31B of the processing block 3 shown in the figure are processed simultaneously. Therefore, after two substrates W are transferred from the return buffer RBF1 to the front open wafer box F, two substrates W are transferred from the return buffer RBF2 to the front open wafer box F. After that, two substrates W are transferred from the return buffer RBF1 to the front open wafer box F again.

[0121] In this way, the substrate W is alternately moved back to the front-opening wafer box F from the "return buffer RBF1" and the "return buffer RBF2". Figures 9A to 9C As shown, the second substrate transfer mechanism 6B sequentially takes in substrates W from below the return buffer SFB1 and sequentially stores them in the lower stage 86 of the front-opening cassette F.

[0122] When all the substrates W are stored in the front-opening cassette F, the shutter 16 of the opener 5C attaches the cover to the front-opening cassette body and closes the opening 14. Then, the shutter 16 of the opener 5C locks the cover of the front-opening cassette F placed on the mounting table 12 of the opener 5C and releases the cover. Then, the front-opening cassette transport mechanism 62 transports the front-opening cassette F from the opener 5C. In addition, the phrase "all the substrates W are stored in the front-opening cassette F" means that, when 24 substrates W are stored in the front-opening cassette F, 24 substrates W are stored.

[0123] exist Fig.9D In the process, the third substrate transfer mechanism 33 of the first coating treatment layer 31A places one processed substrate W on the placing plate 29B of the return buffer RBF1.

[0124] [Substrate Transfer Operation for Two Openers 5A and 5B]

[0125] Next, the operation of the first substrate transfer mechanism 6A with respect to the two front-opening pods FA and FB placed on the two openers 5A and 5B will be described.

[0126] The two openers 5A and 5B and the first substrate transfer mechanism 6A are preset to perform an operation of taking out (carrying out) a substrate W from the front-opening cassette F as a normal operation. Figure 3B The first substrate transfer mechanism 6A takes out the substrate W from the front-opening wafer box FA placed on the opener 5A. The taken-out substrate W is transferred to the substrate buffer 7. Then, the first substrate transfer mechanism 6A takes out all the substrates W from the front-opening wafer box FA. Here, it is assumed that no Figure 3BIn this case, the first substrate transfer mechanism 6A is in a standby state until the empty front opening cassette FA of the opener 5A is replaced with another front opening cassette F by the front opening cassette transfer mechanism 62. Therefore, the substrate W cannot be supplied to the processing block 3.

[0127] However, the front-opening wafer box buffer device 4 is also equipped with an opener 5B in addition to the opener 5A. Therefore, the first substrate conveying mechanism 6A can start to take out the substrates W from the front-opening wafer box FB of the opener 5B after taking out all the substrates W from the front-opening wafer box FA of the opener 5A. Thus, the standby time of the first substrate conveying mechanism 6A can be reduced. In addition, the two openers 5A and 5B are arranged in the up-down direction along the lifting path of the two robots 21 and the advance-retract drive unit 23 of the first substrate conveying mechanism 6A. Therefore, it is also possible not to move the two robots 21 and the advance-retract drive unit 23 in the Y direction, so it is possible to prevent the conveying efficiency of the substrate W from being reduced, and to move the two robots 21 of the first substrate conveying mechanism 6A.

[0128] Furthermore, after all the substrates W are taken out from the front-opening cassette FB of the opener 5B, the first substrate transport mechanism 6A starts taking out the substrates W from the third front-opening cassette F mounted on the opener 5A instead of the front-opening cassette FA. That is, the first substrate transport mechanism 6A is configured to alternately take out the substrates W in front-opening cassette units for the front-opening cassette F mounted on the opener 5A and the front-opening cassette F mounted on the opener 5B.

[0129] [Substrate Transfer Operation for Two Openers 5C and 5D]

[0130] Next, the operation of the second substrate transfer mechanism 6B with respect to the two front-opening cassettes FC and FD placed on the two openers 5C and 5D will be described.

[0131] The two openers 5C and 5D and the second substrate transfer mechanism 6B are preset to perform an operation of storing (returning) the substrate W to the front-opening cassette F as a normal operation. Figure 3B The second substrate transfer mechanism 6B stores all the substrates W received from the substrate buffer 7 in the front-opening cassette FC placed on the opener 5C. Figure 3B In this case, the second substrate transfer mechanism 6B is in a standby state before the front-opening cassette FC (containing all processed substrates W) placed on the opener 5C is replaced with another front-opening cassette F by the front-opening cassette transfer mechanism 62. Therefore, the substrates W processed in the processing block 3 cannot be stored in the front-opening cassette F.

[0132] However, the front-opening wafer box buffer device 4 is also equipped with an opener 5D in addition to the opener 5C. Therefore, the second substrate conveying mechanism 6B can start to store the substrates W in the front-opening wafer box FD of the opener 5D after all the processed substrates W are stored in the front-opening wafer box FC of the opener 5C. In this way, the standby time of the second substrate conveying mechanism 6B can be reduced. In addition, the two openers 5C and 5D are arranged in the up and down direction along the lifting path of the two robots 21 and the advance and retreat drive unit 23 of the second substrate conveying mechanism 6B. Therefore, it is also possible not to move the two robots 21 and the advance and retreat drive unit 23 in the Y direction, so it is possible to prevent the conveying efficiency of the substrate W from being reduced, and move the two robots 21 of the second substrate conveying mechanism 6B.

[0133] Furthermore, after all the substrates W are stored in the front-opening cassette FD of the opener 5D, the second substrate transfer mechanism 6B starts storing the substrates W in the third front-opening cassette F placed on the opener 5C. That is, the second substrate transfer mechanism 6B is configured to store the substrates W alternately in front-opening cassette units for the front-opening cassette F placed on the opener 5C and the front-opening cassette F placed on the opener 5D.

[0134] [Operation of Exchanging Two Front-Opening Pods F by Front-Opening Pod Transfer Mechanism 62]

[0135] Next, the replacement action of the two front-opening wafer boxes F performed by the two holding parts 65A and 65B of the front-opening wafer box conveying mechanism 62 is described. The front-opening wafer boxes F respectively placed on the four openers 5A to 5D are replaced with other front-opening wafer boxes F. In this case, in order to achieve efficiency in the conveying of the front-opening wafer boxes, the two holding parts 65A and 65B of the front-opening wafer box conveying mechanism 62 are used to perform the replacement action. In addition, conveying other than the four openers 5A to 5D, for example, conveying of the front-opening wafer box from the input port IP1 to the unprocessed substrate front-opening wafer box rack IB1 is performed using one of the two holding parts 65A and 65B.

[0136] exist Fig. 10A In the figure, the front-opening wafer box conveying mechanism 62 holds the unprocessed front-opening wafer box F6 (indicated by oblique lines) placed on the unprocessed substrate front-opening wafer box rack IB2 through the upper holding portion 65A. Then, the front-opening wafer box conveying mechanism 62 moves the held unprocessed front-opening wafer box F6 to the conveying space between the unprocessed substrate front-opening wafer box rack IB2 (rack 61) and the four openers 5A to 5D through the multi-jointed arm 66A and the driving portion 67A.

[0137] exist Fig. 10BIn the embodiment, the front-opening cassette transfer mechanism 62 holds the empty front-opening cassette F4 placed on the opener 5B by the lower holding portion 65B. Then, the front-opening cassette transfer mechanism 62 moves the held empty front-opening cassette F4 from the opener 5B to the transfer space by the multi-jointed arm 66B and the driving portion 67B. In addition, the upper holding portion 65A moves to a position where the unprocessed front-opening cassette F6 does not collide with the lower holding portion 65B and the like.

[0138] exist Fig. 10C In the embodiment, the front-opening wafer box conveying mechanism 62 places the unprocessed front-opening wafer box F6 held by the upper holding part 65A on the opener 5B instead of the empty front-opening wafer box F4. Then, the front-opening wafer box conveying mechanism 62 releases the holding by the upper holding part 65A. The upper holding part 65A moves to the conveying space. In addition, the lower holding part 65B moves to a position that does not collide with the front-opening wafer box F6 held by the upper holding part 65A.

[0139] exist Fig. 10D In the embodiment, the front-opening wafer box conveying mechanism 62 places the empty front-opening wafer box F4 held by the holding part 65B on the lower side on, for example, an empty front-opening wafer box rack EB2. Then, the front-opening wafer box conveying mechanism 62 releases the holding by the holding part 65B on the lower side. In this way, by performing the replacement action, the front-opening wafer box F can be efficiently conveyed. In addition, in this description, the unprocessed front-opening wafer box F6 is held by the holding part 65A on the upper side, and the empty front-opening wafer box F4 is held by the holding part 65B on the lower side, but the holding can also be reversed. In other words, the unprocessed front-opening wafer box F6 can also be held by the holding part 65B on the lower side, and the empty front-opening wafer box F4 can be held by the holding part 65A on the upper side.

[0140] [Operation Example 1 of the Front-Opening Pod Buffer Device 4]

[0141] Next, according to Fig.11 The flowchart shown in the figure explains the operation of the front-opening cassette buffer device 4 . Fig.11 This is a flowchart for explaining the conveying action of the front-opening wafer box F1 from the input port to the output port and the substrate conveying action. The so-called "front-opening wafer box F1" refers to a specified front-opening wafer box F. In other words, focusing on the "front-opening wafer box F1", the "front-opening wafer box F1" is used as an example to explain the conveying of the front-opening wafer box. When the front-opening wafer box is not limited to the specified front-opening wafer box F1, it is expressed as "front-opening wafer box F". Fig.12 1 is a diagram showing the operation priority order of the front-opening pod buffer device 4 .

[0142] In addition, in this description, an opener for taking out the substrate W is referred to as a "transport opener", and an opener for storing the substrate W is referred to as a "return opener".

[0143] The front opening pod F1 is transported to, for example, the input port IP1 by the external transport mechanism OHT (step S01 ). The substrate processing apparatus 1 receives an instruction and processes the substrate W received in the front opening pod F1 from the host computer of the factory (step S02 ).

[0144] The control unit 71 of the substrate processing device 1 determines whether to transport the front-opening wafer box F1 of the input port IP1 to one of the two conveying openers 5A and 5B (step S03). In this determination, whether the front-opening wafer box F is placed on each opener 5A and 5B is based on the current position of the front-opening wafer box F managed by the scheduler management software (scheduler), or based on information such as an optical sensor provided on the mounting table 12 of each of the conveying openers 5A and 5B. This determination method is also the same in the case of the two return openers 5C and 5D and the rack 61. The scheduler management software is executed by the control unit 71 of the substrate processing device 1.

[0145] If the result of determination is that the material can be conveyed to any one of the two conveying openers 5A and 5B, the process proceeds to step S04 . If the material cannot be conveyed, the process proceeds to step S05 .

[0146] In step S04, the control unit 71 further determines whether all of the following conditions are satisfied: no front-opening cassette F is configured in both the transport openers 5A and 5B, no front-opening cassette F is configured in at least one of the return openers 5C and 5D, and no front-opening cassette F (including an empty front-opening cassette) is placed in any of the four empty front-opening cassette racks EB1 to EB4. When the determination result is that all of the above conditions are satisfied (for example, refer to the following Fig.13A , Fig. 13B and Fig. 17C ), the front-opening pod transfer mechanism 62 transfers the front-opening pod F1 from the input port IP1 to a return opener (e.g., 5C) that is not loaded with the front-opening pod F, instead of the transport openers 5A and 5B (step S06). In addition, the scheduler of the substrate processing apparatus 1 and the action priority of the front-opening pod buffer device 4 are determined by the following steps (see step S07). Fig.12 ) is pre-set to transport the front-opening wafer box F1 to the transfer opener 5A (5B), and after taking out all the substrates W, transport them to the return opener 5C (5D).

[0147] When the result of determination in step S04 is that at least one condition is not satisfied, the front opening pod transfer mechanism 62 transfers the front opening pod F1 from the input port IP1 to one of the transport openers 5A and 5B that can transfer the front opening pod F1 (step S07 ).

[0148] On the other hand, in step S03, when other front-opening wafer boxes F are placed on both the transport openers 5A and 5B and the front-opening wafer box F1 cannot be transported, the control unit 71 determines whether to transport the front-opening wafer box F1 to one of the two unprocessed substrate front-opening wafer box racks IB1 and IB2, and whether to transport the front-opening wafer box F1 (step S05). When other front-opening wafer boxes F are placed on both the two unprocessed substrate front-opening wafer box racks IB1 and IB2, so the front-opening wafer box F1 cannot be transported to any of the racks IB1 and IB2, the front-opening wafer box F1 is placed on standby at the input port IP1. In addition, when the control unit 71 determines that the transport is not to be performed, the front-opening wafer box F1 is also placed on standby at the input port IP1. If the transfer is possible and the control unit 71 determines to carry out the transfer, the front opening pod transfer mechanism 62 transfers the front opening pod F1 to one of the two unprocessed substrate front opening pod racks IB1 and IB2 (step S08 ).

[0149] When the front-opening wafer box F1 is placed on one of the return openers 5C and 5D, in step S09A, the substrate W is taken out from the front-opening wafer box F1 and the taken-out substrate W is transferred to the substrate buffer 7. Usually, the two return openers 5C and 5D are used to store the substrate W in the front-opening wafer box F. However, when the substrate W can be transferred without stopping (when the condition of the step S04 is satisfied), the substrate W before processing is taken out from the unprocessed substrate front-opening wafer box F placed on one of the return openers 5C and 5D. Thus, during the period until all the processed substrates W are stored, for example, the front-opening wafer box F1 placed on the opener 5C can be placed directly without moving (step S10). Therefore, the front-opening wafer box transfer mechanism 62 can transfer other front-opening wafer boxes F, so the transfer efficiency of the front-opening wafer box F can be improved.

[0150] On the other hand, when the front-opening wafer box F1 is placed on one of the transport openers 5A and 5B, in step S09B, the substrate W is taken out from the front-opening wafer box F1 and the taken-out substrate W is transferred to the substrate buffer 7. After the first substrate transfer mechanism 6A takes out all the substrates W from the front-opening wafer box F1, the empty front-opening wafer box F1 is transferred from the transport opener 5A to any one of the four empty front-opening wafer box racks EB1 to EB4 (step S11). For example, at the moment when the first substrate W processed by the processing block 3 is returned to the substrate buffer 7, the front-opening wafer box F1 is transferred from any one of the four empty front-opening wafer box racks EB1 to EB4 to one of the two return openers 5C and 5D that can be transferred (step S12). Furthermore, the front opening pod F1 that has become empty in step S09B may be directly transferred to one of the return openers 5C and 5D without passing through the four empty front opening pod shelves EB1 to EB4.

[0151] In step S13, the second substrate transfer mechanism 6B stores the processed substrates W in, for example, an empty front-opening cassette F1 placed on the return opener 5C. That is, the processed substrates W returned to the substrate buffer 7 are transferred to the empty front-opening cassette F1. When all the substrates W are stored in the empty front-opening cassette F1, in the case where an output instruction is received in advance from the host computer (in the case where the FIFO (first-in first-out) action priority order is changed), the front-opening cassette F1 storing the processed substrates W is transferred to one of the two output ports OP1 and OP2 (steps S14 and S15).

[0152] In the case where no output instruction is received from the host computer, the control unit 71 determines whether the front-opening wafer box F1 can be transported to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates, and whether the front-opening wafer box F1 is transported (step S16). When it is impossible to transport, or when the control unit 71 determines that it is not to be transported, the front-opening wafer box F1 is made to wait in the return opener 5C. When it is possible to transport and the control unit 71 determines that it is to be transported, the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F1 from the return opener 5C to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates (step S17).

[0153] The front-opening wafer cassette F1 transported to the processed substrate front-opening wafer cassette rack OB1 (OB2) is transported to one of the two output ports OP1 and OP2 according to the action priority of FIFO (step S15). The front-opening wafer cassette F1 transported to the output port OP1 (OP2) is transported from the output port OP1 (OP2) to the next device through the external transport mechanism OHT.

[0154] Fig.12 4 is a diagram showing the operation priority of the front-opening wafer box buffer device 4. Fig.12 As shown, the return action on the downstream side takes precedence over the delivery action on the upstream side. Fig.11 The symbols P1 to P6 shown are Fig.12 Priority 1 to priority 6 are shown as corresponding. The order (priority) of starting the processing of the front-opening wafer box F and the output order from the device 1 are carried out according to the instructions of the host computer, basically according to FIFO (first-in first-out). Fig.12 The action priority order shown is applicable to the case where the front-opening wafer box transfer mechanism 62 has only a single holding part, or the case where the front-opening wafer box transfer mechanism 62 has multiple holding parts but does not perform the replacement action using the two holding parts 65A and 65B and only uses one holding part to transfer the front-opening wafer box F. Therefore, in the case of the replacement action of the four openers 5A to 5D shown in this embodiment, for example, the priority order is reversed and does not apply. Fig.12 The actions are prioritized as shown.

[0155] [Operation Example 2 of the Front-Opening Pod Buffer Device 4]

[0156] Next, an example of the operation when a plurality of front-opening wafer boxes F are transported will be described. Fig.11 The operations of the flowchart shown in FIG. Fig.12 The actions are prioritized as shown.

[0157] The external transport mechanism OHT supplies multiple front-opening wafer boxes F in sequence. The external transport mechanism OHT transports the front-opening wafer boxes F to one of the two input ports IP1 and IP2, except when it cannot transport the wafer to any of the two input ports IP1 and IP2. In addition, the order in which the front-opening wafer boxes F are transported from the external transport mechanism OHT to one of the input ports IP1 and IP2 is numbered. For example, the second front-opening wafer box F is represented as "F2", and the fifth front-opening wafer box F is represented as "F5". Figures 13A to 13D In the figures, for convenience of illustration, for example, the front-opening wafer box F1 is represented as "1".

[0158] exist Fig.13A In the process, the front opening pod F1 is transferred to the input port IP1, and the front opening pod F2 is transferred to the input port IP2. The front opening pod transfer mechanism 62 transfers the front opening pod F1 from the input port IP1 to the return opener 5C (priority 5).

[0159] exist Fig. 13B, the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F2 (priority 5) from the input port IP2 to the return opener 5D. The input port IP1 obtains the front-opening wafer box F3 from the external transport mechanism OHT. The second substrate transport mechanism 6B starts to take out the substrate W from the front-opening wafer box F1 placed on the return opener 5C. The transport of the substrate W is synchronized with the transport of the front-opening wafer box F.

[0160] exist Fig. 13C , the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F3 (priority 5) from the input port IP1 to the transport opener 5A. The input port IP2 obtains the front-opening wafer box F4 from the external transport mechanism OHT. The second substrate transport mechanism 6B continues to take out the substrate W from the front-opening wafer box F1 placed on the return opener 5C. In addition, because the second substrate transport mechanism 6B is in the middle of taking out the substrate W from the front-opening wafer box F1, the front-opening wafer box F2 is in the take-out waiting state.

[0161] exist Fig.13D , the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F4 (priority 5) from the input port IP2 to the conveying opener 5B. The input port IP1 obtains the front-opening wafer box F5 from the external transport mechanism OHT. The second substrate transport mechanism 6B completes the removal of all substrates W from the front-opening wafer box F1 mounted on the return opener 5C. After that, the second substrate transport mechanism 6B starts the removal of substrates W from the front-opening wafer box F2 mounted on the return opener 5D. The substrates W stored in the front-opening wafer box F1 mounted on the return opener 5C are first moved back to the substrate buffer 7 after being processed by the processing block 3, which can be known (calculated) by the scheduling program management software executed by the control unit 71. Therefore, the empty front-opening wafer box F1 after all the substrates W are taken out is directly placed on the return opener 5C.

[0162] Furthermore, the processing using the processing block 3 is scheduled to be performed in the order of "front-opening wafer box F1", "front-opening wafer box F2", "front-opening wafer box F3", and "front-opening wafer box F4", and the second substrate transfer mechanism 6B is in the process of taking out the substrate W from the front-opening wafer box F2. Therefore, the front-opening wafer box F3 is in the take-out waiting state.

[0163] exist Fig.14AIn the embodiment, because the four openers 5A to 5D are covered by the four front-opening wafer boxes F1 to F4, the front-opening wafer box conveying mechanism 62 conveys the front-opening wafer box F5 from the input port IP1 to the unprocessed substrate front-opening wafer box rack IB1 (priority 6). For the same reason, after the input port IP2 obtains the front-opening wafer box F6 from the external conveying mechanism OHT, the front-opening wafer box conveying mechanism 62 conveys the front-opening wafer box F6 from the input port IP2 to the unprocessed substrate front-opening wafer box rack IB2 (priority 6).

[0164] exist Fig. 14B In the embodiment, the two input ports IP1 and IP2 obtain the front-opening wafer boxes F7 and F8 from the external transport mechanism OHT. The four openers 5A to 5D and the two unprocessed substrate front-opening wafer box racks IB1 and IB2 are blocked by the six front-opening wafer boxes F1 to F6. Therefore, the front-opening wafer box buffer device 4 cannot receive other front-opening wafer boxes F. As a result, the external transport mechanism OHT stops the supply of the front-opening wafer boxes F until one of the two input ports IP1 and IP2 becomes capable of transporting.

[0165] The second substrate transfer mechanism 6B completes the removal of all substrates W from the front-opening cassette F2 placed on the return opener 5D. After that, the first substrate transfer mechanism 6A starts the removal of substrates W from the front-opening cassette F3 placed on the transport opener 5A. The substrates W stored in the front-opening cassette F2 placed on the return opener 5D are returned to the substrate buffer 7 secondly through the front-opening cassette unit after being processed in the processing block 3, which can be known by the scheduler management software executed by the control unit 71. Therefore, the empty front-opening cassette F2 after all the substrates W are taken out is directly placed on the return opener 5D.

[0166] exist Fig. 14C In the process, the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening wafer box F3 placed on the transport opener 5A. After that, the first substrate transport mechanism 6A starts to remove the substrate W from the front-opening wafer box F4 placed on the transport opener 5B. In order to continue the processing, the substrate processing apparatus 1 transports the empty front-opening wafer box F3 from the transport opener 5A to the empty front-opening wafer box shelf EB1, and transports the front-opening wafer box F5 placed on the unprocessed substrate front-opening wafer box shelf IB1 to the transport opener 5A.

[0167] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F5 of the front-opening wafer box rack IB1 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F5 from the front-opening wafer box rack IB1 of the unprocessed substrate. The holding portion 65B on the lower side is in a state of not holding the front-opening wafer box F. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F3 with the front-opening wafer box F5 in the conveying opener 5A. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F3 of the conveying opener 5A through the holding portion 65B on the lower side, and moves the front-opening wafer box F3 from the conveying opener 5A. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F5 on the conveying opener 5A through the holding portion 65A on the upper side. After the front opening pod F5 is placed, the front opening pod transfer mechanism 62 places the empty front opening pod F3 on the empty front opening pod shelf EB1 through the lower holding portion 65B.

[0168] exist Fig.14D In the example, since the two transport openers 5A and 5B are blocked by the two front opening pods F5 and F4, the front opening pod transfer mechanism 62 transfers the front opening pod F7 from the input port IP1 to the unprocessed substrate front opening pod rack IB1 (priority 6).

[0169] exist Fig.15A In the process, the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening wafer box F4 placed on the transport opener 5B. After that, the first substrate transport mechanism 6A starts to remove the substrate W from the front-opening wafer box F5 placed on the transport opener 5A. In order to continue the processing, the substrate processing apparatus 1 transports the empty front-opening wafer box F4 from the transport opener 5B to the empty front-opening wafer box rack EB2, and transports the front-opening wafer box F6 placed on the unprocessed substrate front-opening wafer box rack IB2 to the opener 5B.

[0170] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F6 of the front-opening wafer box rack IB2 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F6 from the front-opening wafer box rack IB2 of the unprocessed substrate. The holding portion 65B on the lower side is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F4 with the front-opening wafer box F6 in the conveying opener 5B. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F4 of the conveying opener 5B through the holding portion 65B on the lower side, and moves the front-opening wafer box F4 from the conveying opener 5B. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F6 on the conveying opener 5B through the holding portion 65A on the upper side. After the front opening pod F6 is placed, the front opening pod transfer mechanism 62 places the empty front opening pod F4 on the empty front opening pod shelf EB2 via the lower holding portion 65B.

[0171] exist Fig. 15B In the figure, because the two transport openers 5A and 5B are blocked by the two front-opening cassettes F5 and F6, the front-opening cassette transfer mechanism 62 transfers the front-opening cassette F8 from the input port IP2 to the unprocessed substrate front-opening cassette rack IB2 (priority 6).

[0172] exist Fig. 15C , the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening cassette F5 placed on the transport opener 5A. Thereafter, the first substrate transport mechanism 6A starts the removal of substrates W from the front-opening cassette F6 placed on the transport opener 5B. In addition, the front-opening cassette transport mechanism 62 transports the empty front-opening cassette F5 to the empty front-opening cassette shelf EB3.

[0173] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F7 of the front-opening wafer box rack IB1 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F7 from the front-opening wafer box rack IB1 of the unprocessed substrate. The holding portion 65B on the lower side is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F5 with the front-opening wafer box F7 in the conveying opener 5A. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F5 of the conveying opener 5A through the holding portion 65B on the lower side, and moves the front-opening wafer box F5 from the conveying opener 5A. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F7 on the conveying opener 5A through the holding portion 65A on the upper side. After placing the front opening pod F7, the front opening pod transfer mechanism 62 places the empty front opening pod F5 on the empty front opening pod shelf EB3 through the lower holding portion 65B. The input port IP2 obtains the front opening pod F10 from the external transfer mechanism OHT.

[0174] In addition, Fig.13D In the process, all substrates W are taken out from the front-opening wafer box F1. The taken-out substrates W are sent to the processing block 3 via the substrate buffer 7. The processing block 3 performs a predetermined process on the substrate W. The processed substrates W that have been subjected to the predetermined process in the processing block 3 are moved back to the substrate buffer 7 by the third substrate transfer mechanism 33. The second substrate transfer mechanism 6B stores the substrates W that have been moved back to the substrate buffer 7 in the front-opening wafer box F1.

[0175] exist Fig.15D In the embodiment, the second substrate transport mechanism 6B stores all processed substrates W in the front-opening cassette F1 mounted on the return opener 5C. Thereafter, the second substrate transport mechanism 6B starts storing substrates W in the front-opening cassette F2 mounted on the return opener 5D. Thereafter, assuming that all processed substrates W are stored in the front-opening cassette F2 mounted on the return opener 5D, the second substrate transport mechanism 6B starts storing processed substrates W in the front-opening cassette F3 mounted on the return opener 5C.

[0176] The front-opening wafer box conveying mechanism 62 conveys the processed front-opening wafer box F1 to the output port OP1. The front-opening wafer box conveying mechanism 62 first holds the empty front-opening wafer box F3 placed on the empty front-opening wafer box rack EB1 through the upper holding portion 65A, and moves the empty front-opening wafer box F3 from the empty front-opening wafer box rack EB1. The lower holding portion 65B is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the front-opening wafer box F1 containing the processed substrate W with the empty front-opening wafer box F3 in the return opener 5C. Specifically, the front-opening wafer box conveying mechanism 62 holds the front-opening wafer box F1 of the return opener 5C through the lower holding portion 65B, and moves the front-opening wafer box F1 from the return opener 5C. Afterwards, the front-opening cassette transfer mechanism 62 places the empty front-opening cassette F3 on the return opener 5C through the upper holding portion 65A. After placing the empty front-opening cassette F3, the front-opening cassette transfer mechanism 62 places the processed front-opening cassette F1 on the output port OP1 through the lower holding portion 65B.

[0177] Furthermore, since the two transport openers 5A and 5B are blocked by the two front opening pods F7 and F6, the front opening pod transfer mechanism 62 transfers the front opening pod F9 from the input port IP1 to the unprocessed substrate front opening pod shelf IB1 (priority 6).

[0178] exist Fig.16 In the embodiment, the front opening cassette F1 placed on the output port OP1 is transferred from the output port OP1 by the external transfer mechanism OHT.

[0179] In addition, Fig.16 After the status shown Fig.17A In the embodiment, when the front-opening wafer box F4 containing the processed substrate W cannot be transferred to any one of the two output ports OP1 and OP2, the front-opening wafer box transfer mechanism 62 transfers the front-opening wafer box F4 from the return opener 5D to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates (for example, symbol OB1). In addition, in order to improve the efficiency of the front-opening wafer box transfer at this time, the front-opening wafer box transfer mechanism 62 replaces the front-opening wafer box F4 with an empty front-opening wafer box F6 using two holding parts 65A and 65B in the return opener 5D.

[0180] Moreover, in Fig.17A After the status shown Fig. 17BIn the process, when the front opening cassette F6 storing the processed substrate W cannot be transported to any of the two output ports OP1, OP2 and the two processed substrate front opening cassette racks OB1, OB2, it cannot be transported any more. Therefore, the front opening cassette F6 waits in the return opener 5D until one of the two processed substrate front opening cassette racks OB1, OB2 becomes empty or one of the two output ports OP1, OP2 becomes empty and takes precedence over the front opening cassettes F4, F5.

[0181] Moreover, from Fig. 17B As time passes, when the input port IP1 acquires the front opening cassette F16, if the front opening cassette F16 is transferred to the return opener 5D instead of the transport openers 5A and 5B, the front opening cassette transfer efficiency is improved. Fig. 17C As shown, when all the conditions are satisfied that the front-opening wafer box F is not placed on both of the two transport openers 5A and 5B, the front-opening wafer box F is not placed on any of the two return openers 5C and 5D, and the front-opening wafer box F is not placed on any of the four empty front-opening wafer box racks EB1 to EB4, the front-opening wafer box transfer mechanism 62 moves to one of the two return openers 5C and 5D on which the front-opening wafer box F is not placed ( Fig. 17C In this case, for example, after all processed substrates W are stored in the front-opening cassette F15 placed on the return opener 5C, the substrates W are taken out from the return opener 5D.

[0182] According to the present embodiment, the first substrate transport mechanism 6A is configured to transport substrates W from front-opening wafer boxes F placed on the two transport openers 5A and 5B to the substrate buffer 7. The second substrate transport mechanism 6B is configured to transport substrates W from the substrate buffer 7 to front-opening wafer boxes F placed on the two return openers 5C and 5D. When all the conditions are satisfied, that the front-opening wafer boxes F are not placed on the two transport openers 5A and 5B, that the front-opening wafer boxes F are not placed on at least one of the two return openers 5C and 5D, and that the front-opening wafer boxes F are not placed on the four empty front-opening wafer box racks EB1 to EB4, the front-opening wafer box transport mechanism 62 transports a specific front-opening wafer box F to any one of the two return openers 5C and 5D. Here, the specific front-opening wafer boxes F include, for example: Fig.13A Front-opening wafer box F1, Fig. 13B Front-opening wafer box F2, and Fig. 17CThe front-opening wafer box F16 in the wafer box. The second substrate transfer mechanism 6B is set to transfer the substrate W from the substrate buffer 7 to the front-opening wafer box F. However, the second substrate transfer mechanism 6B transfers the substrate W from the specific front-opening wafer box F to the substrate buffer 7, and then transfers the processed substrate W processed in the processing block 3 from the substrate buffer 7 to the specific front-opening wafer box F. The front-opening wafer box transfer mechanism 62 keeps the specific front-opening wafer box F at the loading position of the specific front-opening wafer box F (for example, the conveying opener 5C in the case of the front-opening wafer box F1) during the period from when all the substrates W are taken out from the specific front-opening wafer box F by the second substrate transfer mechanism 6B to when all the processed substrates W are stored in the specific front-opening wafer box F.

[0183] Normally, the second substrate transport mechanism 6B is set to transport the substrate W from the substrate buffer 7 to the front-opening wafer box F placed on the opener 5C (5D). However, when the specified conditions are met, the second substrate transport mechanism 6B transports the substrate W from the front-opening wafer box F to the substrate buffer 7. That is, the second substrate transport mechanism 6B performs an action different from the usual substrate transport action. Thus, the second substrate transport mechanism 6B can keep the specific front-opening wafer box F at the loading position (opener 5C (5D)) of the specific front-opening wafer box F after all substrates W are taken out from the specific front-opening wafer box F until all processed substrates W are stored in the specific front-opening wafer box F. Thus, the front-opening wafer box transport mechanism 62 can transport front-opening wafer boxes F other than the specific front-opening wafer box F, so the transport efficiency of the front-opening wafer box F can be improved. As a result, the waiting time for the transfer of the front-opening cassette F is reduced, so the throughput of substrate processing can be improved.

[0184] In addition, when the front-opening wafer cassette F is not placed on either of the two transport openers 5A and 5B, when the front-opening wafer cassette F is placed on any of the two return openers 5C and 5D, and when the empty front-opening wafer cassette rack EB1 (EB2 to EB4) does not place the front-opening wafer cassette F, the front-opening wafer cassette conveying mechanism 62 conveys a specific front-opening wafer cassette F to any of the two return openers 5C and 5D. Here, the specific front-opening wafer cassette F includes, for example: Fig. 13B Front-opening wafer box F2, and Fig. 17CFor example, there is a case where a front-opening wafer box F is not placed on a specified return opener (e.g., opener 5C), but a front-opening wafer box F is placed on another return opener (e.g., opener 5D). Even in this case, the front-opening wafer box transfer mechanism 62 can keep the specific front-opening wafer box F at the placement position (e.g., opener 5C) of the specific front-opening wafer box F2 (F16) from the time when all substrates W are taken out from the specific front-opening wafer box F2 (F16) to the time when all processed substrates W are stored in the specific front-opening wafer box F2 (F16).

[0185] In addition, in the substrate processing apparatus 1, the first substrate conveying mechanism 6A and the second substrate conveying mechanism 6B respectively convey substrates W of the front-opening wafer box F, and the front-opening wafer box F is respectively placed on two openers 5A and 5B arranged in the vertical direction, for example, instead of two openers 5A and 5C arranged in the horizontal direction. Therefore, even in the case of adding openers, since the robot 21 that can move forward and backward does not slide in the horizontal direction, but conveys the substrate W by lifting and rotating, the substrate W can be simply conveyed. Therefore, the standby time for substrate conveying can be reduced, and the substrate conveying efficiency can be prevented from being reduced. As a result, the processing throughput of substrate processing can be increased.

[0186] In addition, after taking out all substrates from the front-opening cassettes F of, for example, the opener 5A mounted on the first opener row 9, the first substrate transport mechanism 6A takes out substrates W from other front-opening cassettes F mounted on the opener 5B of the first opener row 9. After storing all substrates in the front-opening cassettes F of the opener 5C mounted on the second opener row 10, the second substrate transport mechanism 6B stores F substrates W in other front-opening cassettes mounted on the opener 5D of the second opener row 10.

[0187] Thus, the first substrate transfer mechanism 6A can take out substrates W from other front-loading pods F after taking out all substrates W from the front-loading pods F. Also, the second substrate transfer mechanism 6B can store substrates W in other front-loading pods F after storing all substrates W in the front-loading pods F.

[0188] [Example 2]

[0189] Next, Embodiment 2 of the present invention will be described with reference to the drawings. In addition, descriptions overlapping with Embodiment 1 will be omitted. Fig.18 It is a diagram for explaining the replacement operation of the front-opening wafer cassette in the substrate processing apparatus 1 of the second embodiment.

[0190] In Example 1, for example FIG. 10A to FIG. 10D and Fig.15AAs shown, the replacement operation of replacing (changing) the front-opening cassette F4 placed on the transport opener 5B with the front-opening cassette F6 placed on the unprocessed substrate front-opening cassette rack IB2 is described. Fig.15D As shown in FIG. 1 , the description is given of the replacement operation of replacing the front opening cassette F1 placed on the return opener 5C with the empty front opening cassette F3 placed on the empty front opening cassette shelf EB1 .

[0191] However, if the transfer efficiency of the front-opening cassette F is poor, the first substrate transfer mechanism 6A (second substrate transfer mechanism 6B) may be in a state of waiting for the front-opening cassette. Therefore, in the second embodiment, the transfer efficiency of the front-opening cassette F is also improved.

[0192] exist Fig.18 In the process, the front-opening wafer box F24 placed on the conveying opener 5A is replaced by another front-opening wafer box F25 placed on the front-opening wafer box rack IB1 for unprocessed substrates. Here, if the front-opening wafer box conveying mechanism 62 starts conveying the front-opening wafer box F25 placed on the front-opening wafer box rack IB1 for unprocessed substrates before the end time point of taking out all substrates W from the front-opening wafer box F24 or before the time point near the end time point of taking out all substrates W (tracing back to the end time point of taking out all substrates W or before the time point near the end time point of taking out all substrates W), the front-opening wafer box F24 placed on the opener 5A can be smoothly conveyed.

[0193] The first substrate transport mechanism 6A takes out all the substrates W from the front opening pod F24 placed on any one of the two transport openers 5A and 5B. As a result, the first substrate transport mechanism 6A generates an empty front opening pod F24.

[0194] Then, the front-opening wafer box conveying mechanism 62 performs a replacement action by using the two holding parts 65A and 65B, that is, the first empty front-opening wafer box F24 placed on any one of the two openers 5A and 5B is replaced with the front-opening wafer box F25 placed on the unprocessed substrate front-opening wafer box rack IB1. At this time, the front-opening wafer box conveying mechanism 62 starts the conveying action of the front-opening wafer box F25 placed on the unprocessed substrate front-opening wafer box rack IB1 before the time point t3 predicted to generate the first empty front-opening wafer box F24 by a preset time TL1, so as to perform the replacement action. When performing the replacement action, for example, the front-opening wafer box F25 is held by the upper holding part 65A, and the front-opening wafer box F24 is held by the lower holding part 65B.

[0195] The time point predicted to be the time point t3 is predicted by calculation of the control unit 71 based on information from the scheduler management software or the optical sensor that detects that the substrate W is placed on the placement plate 29B of the substrate buffer unit 7 .

[0196] In addition, the time point t3 at which the first empty front-opening cassette F24 is generated is, for example, the time point at which all substrates W are taken out from the front-opening cassette F or a time point near this time point. The time point t3 may be, for example, the time point at which the robot 21 of the first substrate transfer mechanism 6A takes out the last substrate W from the front-opening cassette F, the time point at which the empty front-opening cassette F is covered by the baffle 16, or the time point at which the front-opening cassette F is slid away from the wall portion 8 by the sliding mechanism (driven by an electric motor) of the mounting table 12.

[0197] In addition, the preset time TL1 (time point t1 to time point t2) is set based on, for example, experimental results. The preset time TL1 is the time from the start t1 (start time point) of the transfer action of the front-opening wafer box F placed on the unprocessed substrate front-opening wafer box shelf IB1 to the time point t2 when the front-opening wafer box transfer mechanism 62 becomes capable of transferring the first empty front-opening wafer box F24.

[0198] In addition, the so-called start time t1 (start time point) of the conveying action of the front-opening wafer box F placed on the front-opening wafer box rack IB1 for unprocessed substrates is, for example, the time point when at least one of the two holding parts 65A, 65B, the two multi-joint arms 66A, 66B, the lifting drive part 67 and the horizontal drive part 68 of the front-opening wafer box conveying mechanism 62 starts to move from the stationary state of the front-opening wafer box conveying mechanism 62, or a time point near this time point.

[0199] In addition, the time point t2 at which the front-opening cassette transport mechanism 62 becomes capable of transporting the first empty front-opening cassette F24, for example, means the time point at which the holding portion 65A (65B) becomes opposed to the front-opening cassette F24 by at least one of the multi-jointed arm 66A (66B), the lifting drive unit 67, and the horizontal drive unit 68 of the front-opening cassette transport mechanism 62, or a time point near this time point. At this time, the holding portion 65A (65B) opposed to the front-opening cassette F24 is in a state of not holding the front-opening cassette F.

[0200] According to the present embodiment, in order to improve the conveying efficiency of the front-opening wafer box F, the front-opening wafer box conveying mechanism 62 performs a replacement action. At this time, the front-opening wafer box conveying mechanism 62 starts conveying the front-opening wafer box F25 placed on the front-opening wafer box rack IB1 of the unprocessed substrate before the time point t3 predicted to generate the first empty front-opening wafer box F24, so as to perform the replacement action. Thus, at the time point t3 when the first empty front-opening wafer box F24 is generated, the front-opening wafer box conveying mechanism 62 can be in a state capable of conveying the first empty front-opening wafer box F24 (time point t2 and its vicinity). Therefore, corresponding to the time when the empty front-opening wafer box F24 is generated (time point t3), the empty front-opening wafer box F24 can be conveyed, so the conveying efficiency of the front-opening wafer box F can be further improved.

[0201] In addition, in this description, the front-opening wafer cassette F24 placed on the transport opener 5A (5B) is replaced with a front-opening wafer cassette F25 placed on the unprocessed substrate front-opening wafer cassette rack IB1 (IB2). Fig.18 As shown by the dotted line, the front-opening wafer box F24 placed on the transport opener 5A (5B) can also be replaced by a front-opening wafer box F placed on the input port IP1 (1P2). The unprocessed substrate front-opening wafer box rack IB1 (IB2) and the input port IP1 (1P2) are equivalent to the upstream storage rack of the present invention.

[0202] [Example 3]

[0203] Next, Embodiment 3 of the present invention will be described with reference to the drawings. In addition, descriptions overlapping with Embodiments 1 and 2 will be omitted. Fig.19 It is a diagram for explaining the replacement operation of the front-opening wafer cassette F in the substrate processing apparatus 1 of the third embodiment.

[0204] In Embodiment 2, the replacement operation of the empty front opening pod F24 placed on the transport opener 5A (5B) is described. In this embodiment, the replacement operation of the processed substrate front opening pod F22 placed on the return opener 5C (5D) is described.

[0205] exist Fig.19 In the process, the front opening cassette F22 placed on the return opener 5C is replaced by another empty front opening cassette F23 placed on the empty front opening cassette shelf EB1. Here, if the front opening cassette transfer mechanism 62 starts to transfer the empty front opening cassette F23 placed on the empty front opening cassette shelf EB1 before or near the end time point of storing all the substrates W processed by the processing block 3 into the front opening cassette F22, the front opening cassette F22 placed on the return opener 5C can be smoothly transferred.

[0206] The second substrate transfer mechanism 6B stores all processed substrates W in the second empty front-opening cassette F22 placed on the return opener 5C. As a result, the second substrate transfer mechanism 6B produces a processed substrate front-opening cassette F22.

[0207] Then, the front-opening wafer box conveying mechanism 62 performs a replacement action by using the two holding parts 65A and 65B, that is, the processed substrate front-opening wafer box F22 placed on the return opener 5C is replaced with the third empty front-opening wafer box F23 placed on the empty front-opening wafer box rack EB1. At this time, the front-opening wafer box conveying mechanism 62 starts conveying the third empty front-opening wafer box F23 placed on the empty front-opening wafer box rack EB1 before the time t8 predicted to generate the processed substrate front-opening wafer box F22 by a preset time TL2, so as to perform the replacement action. When performing the replacement action, for example, the upper holding part 65A is used to hold the front-opening wafer box F25, and the lower holding part 65B is used to hold the front-opening wafer box F22.

[0208] In addition, the time point t8 at which the processed substrate front opening cassette F22 is generated is, for example, the time point at which all the processed substrates W are stored in the second empty front opening cassette F22 or a time point near the time point. The time point t8 may be, for example, the time point at which the robot 21 of the second substrate transfer mechanism 6B stores the last substrate W in the front opening cassette F22, the time point at which the processed substrate front opening cassette F22 is covered by the baffle 16, or the time point at which the processed substrate front opening cassette F22 is slid away from the wall portion 8 by the sliding mechanism of the stage 12.

[0209] In addition, the preset time TL2 (time point t6 to time point t7) is set based on, for example, experimental results. The preset time TL2 is the time from the start t6 (start time point) of the action of transporting the third empty front-opening wafer box 23 placed on the empty front-opening wafer box shelf EB1 to the time point t7 when the front-opening wafer box transport mechanism 62 becomes capable of transporting the processed substrate front-opening wafer box 22.

[0210] In addition, the so-called action start t6 of conveying the third empty front-opening wafer box 23 loaded on the empty front-opening wafer box rack EB1 is, for example, a time point at which at least one of the two holding parts 65A, 65B, the two multi-joint arms 66A, 66B, the lifting drive part 67 and the horizontal drive part 68 of the front-opening wafer box conveying mechanism 62 starts to move from the stationary state of the front-opening wafer box conveying mechanism 62 or a time point near this time point.

[0211] In addition, the time point t7 at which the front-opening cassette transport mechanism 62 becomes capable of transporting the third empty front-opening cassette F is, for example, the time point at which the holding portion 65A (65B) becomes opposed to the front-opening cassette F22 for processed substrates by at least one of the multi-jointed arm 66A (66B), the lifting drive unit 67, and the horizontal drive unit 68 of the front-opening cassette transport mechanism 62, or a time point near this time point. At this time, the holding portion 65A (65B) opposed to the unprocessed front-opening cassette F22 is in a state of not holding the front-opening cassette F.

[0212] According to the present embodiment, in order to improve the conveying efficiency of the front-opening wafer box F, the front-opening wafer box conveying mechanism 62 performs a replacement action. At this time, the front-opening wafer box conveying mechanism 62 starts conveying the third empty front-opening wafer box F23 placed on the empty front-opening wafer box rack EB1 (EB2 to EB4) before the time TL2 that is predicted to be the time point t8 when the processed substrate front-opening wafer box F is generated, so as to perform the replacement action. At the time point t8 when the processed substrate front-opening wafer box F22 is generated, the front-opening wafer box conveying mechanism 62 can be set to a state in which the processed substrate front-opening wafer box F22 can be conveyed (time point t7 and its vicinity). Therefore, corresponding to the time when the processed substrate front-opening wafer box F22 is generated, the processed substrate front-opening wafer box F22 can be conveyed, so the conveying efficiency of the front-opening wafer box F can be further improved.

[0213] [Example 4]

[0214] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted. Fig. 20A It is a diagram for explaining the replacement operation of the front-opening wafer box F in the substrate processing apparatus of the fourth embodiment. Fig. 20B This is a diagram for explaining the front-opening cassette transfer operation when the replacement operation is not performed using the two holding portions 65A and 65B.

[0215] In the second embodiment, the replacement operation of the empty front-opening wafer box F24 placed on the conveying opener 5A (5B) is described. In addition, in the third embodiment, the replacement operation of the processed substrate front-opening wafer box F22 placed on the conveying opener 5C (5D) is described. In contrast to these, in this embodiment, the case of performing multiple replacement operations continuously is described.

[0216] exist Fig. 20AIn the embodiment, through five consecutive replacement actions (DISP1 to DISP5), six front-opening wafer cassettes F21 to 26 from the input port IP1 (IP2) to the front-opening wafer cassette rack OB1 (OB2) for processed substrates are moved from the front-opening wafer cassette rack IB1 (IB2) for unprocessed substrates to the output port OP1 (OP2). Each front-opening wafer cassette F21 to 26 is transferred from the front-opening wafer cassette rack OB1 (OB2) to the output port OP1 (OP2). Fig. 20A Starting from the left end, hold them in sequence and perform replacement actions in the order of symbol DISP1, symbol DISP2, symbol DISP3, symbol DISP4, and symbol DISP5.

[0217] Furthermore, when performing the replacement operation, for example, the front-opening wafer box F26 is held by the upper holding portion 65A, and the front-opening wafer box F25 is held by the lower holding portion 65B. The front-opening wafer box F24 is held by the upper holding portion 65A, and the front-opening wafer box F23 is held by the lower holding portion 65B. The front-opening wafer box F22 is held by the upper holding portion 65A, and the front-opening wafer box F21 is held by the lower holding portion 65B.

[0218] The replacement action of this embodiment is specifically described. The first substrate conveying mechanism 6A takes out all substrates W from the front-opening wafer box F24 mounted on the conveying opener 5A. As a result, the first substrate conveying mechanism 6A produces the first empty front-opening wafer box F24. The second substrate conveying mechanism 6B stores all processed substrates W in the second empty front-opening wafer box F22 mounted on the return opener 5C. As a result, the second substrate conveying mechanism 6B produces the processed substrate front-opening wafer box F22. The removal of substrates W by the first substrate conveying mechanism 6A and the storage of substrates W by the second substrate conveying mechanism 6B are performed simultaneously.

[0219] Then, for example, the front-opening wafer box conveying mechanism 62 performs a replacement operation by using the two holding parts 65A and 65B, that is, the first empty front-opening wafer box F24 placed on the conveying opener 5A (5B) is replaced with the front-opening wafer box F25 placed on the unprocessed substrate front-opening wafer box rack IB1 (IB2). After that, the front-opening wafer box conveying mechanism 62 performs a replacement operation by using the two holding parts 65A and 65B, that is, the third empty front-opening wafer box F23 placed on the empty front-opening wafer box rack EB1 (EB2 to EB4) is replaced with, for example, the first empty front-opening wafer box F24 held by the upper holding part 65A. Afterwards, the front-opening wafer box transport mechanism 62 performs a replacement operation by using two holding parts 65A and 65B, that is, the front-opening wafer box F22 with a processed substrate placed on the return opener 5C (5D) is replaced with the third empty front-opening wafer box F23 held by the holding part 65B on the lower side.

[0220] The start of these representative replacement actions is performed based on any later time point. That is, when the time point t3 predicted to generate the first empty front-opening wafer box F24 is later than the time point t8 predicted to generate the processed substrate front-opening wafer box F, the front-opening wafer box conveying mechanism 62 starts conveying the front-opening wafer box F26 placed on the unprocessed substrate front-opening wafer box rack IB1 before a preset time TL3 from the time point t3 predicted to generate the first empty front-opening wafer box F, so as to perform the replacement action.

[0221] In addition, when the time point t8 predicted for producing the processed substrate front-opening wafer box F22 is later than the time point t3 predicted for producing the first empty front-opening wafer box F24, the front-opening wafer box conveying mechanism 62 starts conveying the third empty front-opening wafer box F23 placed on the empty front-opening wafer box rack EB1 before a predetermined time TL4 compared to the time point t8 predicted for producing the processed substrate front-opening wafer box F22 to perform a replacement action.

[0222] In addition, the time point t3 at which the first empty front-opening pod F24 is generated is, for example, the time point at which all substrates W are taken out of the front-opening pod F24 or a time point near this time point (see Example 2). The time point t8 at which the processed substrate front-opening pod F22 is generated is, for example, the time point at which all processed substrates W are stored in the second empty front-opening pod F22 or a time point near this time point (see Example 3).

[0223] In addition, the pre-set time TL3 (time point t11 ​​to time point t12) and time TL4 (time point t11 ​​to time point t13) are set based on experimental results, for example. Time TL3 is the time from the start t11 ​​(start time point) of the action of conveying the front-opening wafer box F26 loaded on the input port IP1 to the time point t12 when the front-opening wafer box conveying mechanism 62 becomes capable of conveying the first empty front-opening wafer box F24. Time TL4 (time point t11 ​​to time point t13) is the time from the start t11 ​​(start time point) of the action of conveying the front-opening wafer box F26 loaded on the input port IP1 to the time point t13 when the front-opening wafer box conveying mechanism 62 becomes capable of conveying the processed substrate front-opening wafer box F22.

[0224] The operation of transferring the front opening pod F26 placed on the input port IP1 starts at t11, which is the same as that in the second and third embodiments, and thus the description thereof is omitted.

[0225] In addition, the time point t12 at which the front-opening cassette transport mechanism 62 becomes capable of transporting the first empty front-opening cassette F24 is the same as that in the second embodiment, so its description is omitted. In addition, the time point t13 at which the front-opening cassette transport mechanism 62 becomes capable of transporting the processed substrate front-opening cassette F22 is the same as that in the third embodiment, so its description is omitted.

[0226] According to the present embodiment, in order to improve the conveying efficiency of the front-opening wafer box F, the front-opening wafer box conveying mechanism 62 performs the first to fifth replacement actions. At this time, the front-opening wafer box conveying mechanism 62 starts conveying the front-opening wafer box F26 placed on the input port IP1 (IP2) to perform the replacement action before the later of the time point t3 when the first empty front-opening wafer box F24 is predicted to be generated and the time point t8 when the processed front-opening wafer box F22 is predicted to be generated, whichever is later by a predetermined time (time TL3 or time TL4). For example, even if the conveying of the front-opening wafer box F is started based on the time point t3 when the first empty front-opening wafer box F24 is predicted to be generated, when the front-opening wafer box conveying mechanism 62 becomes a state capable of conveying the front-opening wafer box F22, there is a case where the second substrate conveying mechanism 6B is in the process of storing the substrate W in the second empty front-opening wafer box F22. In this case, the front-opening cassette transfer mechanism 62 generates a waiting time. According to the present invention, the following state can be achieved: corresponding to the time point t3 when the first empty front-opening cassette F24 is generated or the time point t8 when the processed substrate front-opening cassette F22 is generated, the first empty front-opening cassette F24 or the processed substrate front-opening cassette F22 can be transferred. Therefore, the waiting time of the front-opening cassette transfer when the front-opening cassette F is continuously replaced can be reduced, and the transfer efficiency of the front-opening cassette F can be further improved.

[0227] Fig. 20B FIG. 1 is a diagram showing the front-opening wafer cassette transfer operation when no replacement operation is performed. Fig. 20B In the process, the front-opening wafer box F21 is transferred from the processed substrate front-opening wafer box OB1 (OB2) to the output port OP1 (OP2) (reference symbol TR1). Thereafter, the holding portion is moved to the return opener 5C (5D) (reference symbol MV1). Thereafter, the front-opening wafer box F22 is transferred from the return opener 5C (5D) to the processed substrate front-opening wafer box OB1 (OB2) (reference symbol TR2). Thereafter, the holding portion is moved to the empty front-opening wafer box rack EB1 (EB2 to EB4) (reference symbol MV2). In this way, when the two holding portions 65A and 65B are not used for the replacement operation, the front-opening wafer boxes F must be transferred one by one.

[0228] like Fig. 20AAs shown, the more replacement actions are performed, the higher the conveying efficiency of the front-opening wafer box can be. Moreover, the front-opening wafer box conveying mechanism 62 starts conveying the front-opening wafer box 26 based on the later of the time point t3 predicted to generate the first empty front-opening wafer box F24 and the time point t8 predicted to generate the processed front-opening wafer box F22. It can be in the following state: corresponding to the time point t3 when the first empty front-opening wafer box F24 is generated or the time point t8 when the processed substrate front-opening wafer box F22 is generated, the first empty front-opening wafer box F24 or the processed substrate front-opening wafer box F22 can be conveyed. Therefore, the conveying efficiency of the front-opening wafer box F can be further improved.

[0229] In addition, in this embodiment, the replacement action is 5 times. Fig. 20A As shown, the replacement action can also be 4 times (symbols DISP2 to DISP5). In addition, the replacement action can also be 3 times (symbols DISP2 to DISP4). In addition, the first empty front-opening wafer box F24 of the transport opener 5A (5B) can also be replaced by the front-opening wafer box 26 of the input port IP1 (IP2).

[0230] The present invention is not limited to the above-described embodiment, and can be modified as described below.

[0231] (1) In each of the above embodiments, the first opener column 9 includes two openers 5A and 5B, and the second opener column 10 includes two openers 5C and 5D. In this regard, the first opener column 9 and the second opener column 10 may each include three or more openers. In this case, the baffle 16 may be moved in the left-right direction (Y direction) instead of in the up-down direction. Thus, even if three or more openers are arranged in the up-down direction, the height of the ID block can be suppressed.

[0232] For example, the first opener row 9 includes three openers 5A, 5B, and 5E. In this case, the first substrate transport mechanism 6A may take out substrates W in front-opening cassette units by cycling through the order of “opener 5A,” “opener 5B,” and “opener 5E.”

[0233] (2) In each of the above embodiments and variation (1), two openers 5A and 5B are used as transport openers, and two openers 5C and 5D are used as return openers, but the functions may be reversed. In other words, two openers 5C and 5D may be used as transport openers, and two openers 5A and 5B may be used as return openers. In this case, Fig.13A , Fig. 13B In the process, the front opening cassettes F1 and F2 are respectively transported to the return openers 5A and 5B, and the substrates W are taken out in sequence.

[0234] (3) In the above-described embodiment and various variations, Fig.11 In the process, after the determination of step S03, the determination of step S04 is performed. In this respect, the determination of step S03 may be performed after the determination of step S04. At this time, if all the conditions are satisfied in the determination of step S04 (yes (YES)), the process proceeds to step S06, and if not all the conditions are satisfied (no (NO)), the process proceeds to step S03. Then, if it is determined in the determination of step S03 that it can be transported (yes), the process proceeds to step S07, and if it is determined that it cannot be transported (no), the process proceeds to step S05. In addition, in the case of this variation, in order to determine the order of steps S04 and S03, the arrow returning from step S08 may also return to the state before step S04.

[0235] (4) In the above-described embodiment and each variation, the ID block 2 includes two substrate transfer mechanisms 6A and 6B. In this regard, the ID block 2 may include a seventh substrate transfer mechanism 91 that can move in the Y direction instead of the two substrate transfer mechanisms 6A and 6B (see Fig.21 In this case, the seventh substrate transport mechanism 91 includes a horizontal moving mechanism 93 for moving the two robots 21A, 21B and the advance / retract drive unit 23 in the Y direction. The horizontal moving mechanism 93 includes an electric motor. Fig.21 As shown, the four openers 95A to 95D may be arranged in parallel in the horizontal direction (Y direction).

[0236] (5) In the above-described embodiment and each variation, the processing block 3 includes a coating block 31 and a developing block 32 which are arranged in the horizontal direction (Y direction) with respect to each other. Fig. 22 Although a single block is shown, it may also include four coating treatment layers 97A to 97D arranged in the vertical direction. In this case, for example, the four coating treatment layers 97A to 97D may each include a third substrate conveying mechanism, a 5-row×3-stage heat treatment unit, and a 4-row×1-stage coating unit SC.

[0237] (6) In each of the above embodiments and variations, the action can also be replaced in the following manner: Fig.11 In step S04, when the front-opening cassette F is not mounted on any of the four openers 5A to 5D and the empty front-opening cassette racks EB1 to EB4 (see Fig.13A ), the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F to both of the two return openers 5C and 5D, and then transports the front-opening wafer box F to either of the two transport openers 5A and 5B (refer to Figures 13A to 13C ).

[0238] The present invention can be implemented in other specific forms without departing from the spirit or essence of the present invention. Therefore, the scope of the invention should be determined not by the above description but by reference to the appended claims.

Claims

1. A substrate processing device for processing a substrate, comprising the following elements: a processing block for processing a substrate transferred from a carrier capable of accommodating a plurality of substrates; Two or more first carrier loading sections, for loading the carriers respectively; Two or more second carrier loading sections, for loading the carriers respectively; A substrate buffer, used to send substrates to the processing block and move substrates back from the processing block, and capable of carrying a plurality of substrates; A substrate transporting mechanism for transporting the substrate; An empty carrier rack for holding the empty carrier after all substrates are taken out; as well as A carrier transport mechanism transports the carrier; and The substrate transfer mechanism is set to perform a normal substrate transfer operation to transfer a substrate from the carriers placed on the two or more first carrier placement units to the substrate buffer unit, and is set to perform a normal substrate return operation to transfer a substrate from the substrate buffer unit to the carriers placed on the two or more second carrier placement units; Determining whether all of the following conditions are satisfied: a condition in which the carrier is not loaded on any of the two or more first carrier loading sections, a condition in which the carrier is not loaded on at least any one of the two or more second carrier loading sections, and a condition in which the carrier is not loaded on the empty carrier rack, and when all of the above conditions are satisfied, the carrier transport mechanism transports the specific carrier to any one of the two or more second carrier loading sections; The substrate transfer mechanism transfers the substrate from the specific carrier to the substrate buffer as an action different from the normal substrate return action, and then transfers the processed substrate processed by the processing block from the substrate buffer to the specific carrier; The carrier transfer mechanism keeps the specific carrier at the specific carrier placement position during a period from when all substrates are taken out from the specific carrier by the substrate transfer mechanism to when all processed substrates are stored in the specific carrier.

2. The substrate processing apparatus according to claim 1, wherein Determine whether all of the following conditions are satisfied: the carrier is not loaded on any of the two or more first carrier loading sections, the carrier is not loaded on any of the two or more second carrier loading sections, and the carrier is not loaded on the empty carrier rack, and when all of the above conditions are satisfied, the carrier conveying mechanism conveys the specific carrier to any of the two or more second carrier loading sections.

3. The substrate processing device according to claim 1 or 2, wherein The method further comprises an upstream storage rack, wherein the upstream storage rack is provided upstream of the first carrier loading portion. The substrate transfer mechanism generates a first empty carrier after taking out all substrates from the carrier placed on any one of the two or more first carrier placement parts. The carrier transport mechanism includes two holding parts for holding the carrier. The carrier transport mechanism performs a replacement operation by using the two holding parts, that is, replaces the first empty carrier carried by any one of the two or more first carrier carrying parts with the carrier carried by the upstream storage rack. The carrier transport mechanism starts a transport operation of the carrier placed on the upstream storage rack to perform the replacement operation at a preset time before a time point when the first empty carrier is predicted to be generated, The preset time is the time from the start of the conveying operation of the carrier placed on the upstream storage rack to the time point when the carrier conveying mechanism becomes capable of conveying the first empty carrier.

4. The substrate processing apparatus according to claim 1 or 2, wherein The substrate transfer mechanism generates a processed substrate carrier after storing all substrates in a second empty carrier placed on any one of the two or more second carrier placing parts. The carrier transport mechanism includes two holding parts for holding the carrier. The carrier transport mechanism uses the two holding parts. Performing a replacement operation, that is, replacing the processed substrate carrier carried by any one of the two or more second carrier carrying parts with a third empty carrier carried by the empty carrier rack, The carrier transport mechanism starts the transport action of the third empty carrier placed on the empty carrier rack before a predetermined time when the processed substrate carrier is predicted to be generated, so as to perform the replacement action. The preset time is the time from the start of the conveying operation of the third empty carrier mounted on the empty carrier rack to the time point when the carrier conveying mechanism becomes capable of conveying the processed substrate carrier.

5. The substrate processing apparatus according to claim 1 or 2, wherein The method further comprises an upstream storage rack, wherein the upstream storage rack is provided upstream of the first carrier loading portion. The substrate transfer mechanism generates a first empty carrier after taking out all substrates from the carrier carried by any one of the two or more first carrier carrying parts, and generates a processed substrate carrier after storing all substrates in a second empty carrier carried by any one of the two or more second carrier carrying parts. The carrier transport mechanism includes two holding parts for holding the carrier. The carrier transport mechanism performs a first replacement operation by using the two holding parts, that is, replaces the first empty carrier carried by any one of the two or more first carrier loading parts with the carrier carried by the upstream storage rack. After the first replacement action, the carrier transport mechanism performs a second replacement action by using the two holding parts, that is, replacing the third empty carrier placed on the empty carrier rack with the first empty carrier held by any one of the two holding parts. After the second replacement action, the carrier transport mechanism performs a third replacement action by using the two holding parts, that is, replacing the processed substrate carrier carried by any one of the two or more second carrier loading parts with the third empty carrier held by any one of the two holding parts, When the time point at which the first empty carrier is predicted to be generated is later than the time point at which the processed substrate carrier is predicted to be generated, the carrier transport mechanism starts the transport operation of the carrier placed on the upstream storage rack before a first time point that is preset compared to the time point at which the first empty carrier is predicted to be generated, so as to perform the first replacement operation. When the time point at which the processed substrate carrier is predicted to be generated is later than the time point at which the first empty carrier is predicted to be generated, the carrier transport mechanism starts the transport action of the carrier placed on the upstream storage rack before a second time set in advance compared to the time point at which the processed substrate carrier is predicted to be generated, so as to perform the first replacement action. The first preset time is the time from the start of the conveying operation of the carrier placed on the upstream storage rack to the time when the carrier conveying mechanism becomes capable of conveying the first empty carrier. The preset second time is a time from the start of the conveying operation of the carrier placed on the upstream storage rack to the time point when the carrier conveying mechanism becomes capable of conveying the processed substrate carrier.

6. A method for controlling a substrate processing device, the substrate processing device comprising: a processing block for processing a substrate transferred from a carrier capable of accommodating a plurality of substrates; Two or more first carrier loading sections, for loading the carriers respectively; Two or more second carrier loading sections, for loading the carriers respectively; A substrate buffer, used to send substrates to the processing block and move substrates back from the processing block, and capable of carrying a plurality of substrates; A substrate transporting mechanism for transporting the substrate; an empty carrier rack for holding the empty carrier after all substrates are taken out; and A carrier transport mechanism transports the carrier; and a control method of the substrate processing device includes the following elements: A first setting step of setting a normal substrate conveying operation of the substrate conveying mechanism in a manner of conveying a substrate from the carriers respectively placed on the two or more first carrier placing sections to the substrate buffer section; a second setting step of setting a normal substrate return operation of the substrate transfer mechanism in such a manner that the substrate is transferred from the substrate buffer portion to the carriers respectively placed on the two or more second carrier placement portions; A determination step of determining whether all of the following conditions are satisfied: a condition that the carrier is not loaded on any of the two or more first carrier loading sections, a condition that the carrier is not loaded on at least one of the two or more second carrier loading sections, and a condition that the carrier is not loaded on an empty carrier rack; a specific carrier conveying step, in which, when all the above conditions are met, the specific carrier is conveyed to any one of the two or more second carrier loading portions by the carrier conveying mechanism; A substrate transfer step, using the substrate transfer mechanism to transfer a substrate from the specific carrier to the substrate buffer as an action different from the normal substrate return action, and then transferring the processed substrate processed by the processing block from the substrate buffer to the specific carrier; The step of stopping the specific carrier utilizes the carrier transfer mechanism to stop the specific carrier at the loading position of the specific carrier during the period from when all substrates are taken out from the specific carrier by the substrate transfer mechanism to when all processed substrates are stored in the specific carrier.

7. The control method of a substrate processing apparatus according to claim 6, wherein In the determination step, it is determined whether all of the following conditions are satisfied: the case where the carrier is not loaded on any of the two or more first carrier loading sections, the case where the carrier is not loaded on any of the two or more second carrier loading sections, and the case where the carrier is not loaded on the empty carrier rack.

Images