A high voltage power distribution module

Abstract

The present invention provides a high-voltage power distribution module, including a PCB board, wherein the PCB board includes a high-current buried copper layer located in the middle layer, and a low-current buried copper layer located in the top layer and the bottom layer, and an insulating layer is provided between the high-current buried copper layer and the low-current buried copper layer. In the present invention, the PCB board has three layers of signal lines, two layers are used for low-current routing, and one layer is used for high-current routing, which can avoid the crossing of low-current routing and high-current routing, reduce the complexity of routing, and avoid mutual interference between strong and weak signals.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage power distribution, and in particular to a high-voltage power distribution module. Background Art

[0002] In the high-voltage power distribution module, the PCB board (printed circuit board) generally includes a signal layer, a protective layer, a silk-screen layer, an internal layer, etc. The signal layer is mainly used to place components or wiring, including high-current routing and low-current routing. At present, the signal layer on the PCB board is mainly divided into a high-current area and a low-current area. Although this processing method can effectively separate high current and low current, there are also some problems. That is, when high current and low current are routed on the same signal layer, there will be cross-lines, which will cause complex lines and affect the isolation effect of strong and weak signals. Summary of the invention

[0003] The problem solved by the present invention is that on a PCB board of a traditional high-voltage power distribution module, large current and weak current are routed on the same signal layer, resulting in complex circuits and affecting the isolation effect of strong and weak signals.

[0004] To solve the above problems, the present invention proposes a high-voltage power distribution module, including a PCB board, wherein the PCB board includes a high-current buried copper layer located in the middle layer, and a low-current buried copper layer located in the top and bottom layers, and an insulating layer is provided between the high-current buried copper layer and the low-current buried copper layer.

[0005] Optionally, a fuse is provided on the PCB board, and the fuse is screwed to the PCB board.

[0006] Optionally, a fixing plate is fixed on the PCB board, and fixing plates are connected to both ends of the fuse. Both the fixing plate and the fixing plate are provided with screw holes, and the screw holes on the fixing plate correspond to the screw holes on the fixing plate. Fasteners pass through the screw holes on the fixing plate and the screw holes on the fixing plate in sequence.

[0007] Optionally, the fixing plate is an arched plate, and an opening of the arched plate faces the PCB board.

[0008] Optionally, the surface of the fixing piece at one end of the fuse has a long strip-shaped protrusion, and the surface of the fixing piece at the other end of the fuse has a cross-shaped protrusion.

[0009] Optionally, a current sensor is provided on the PCB board, and the current sensor includes an in-plane magnetic field sensitive sensor chip and a shielding cover, the in-plane magnetic field sensitive sensor chip and the shielding cover are both fixed to the PCB board, and the in-plane magnetic field sensitive sensor chip is placed in the shielding cover.

[0010] Optionally, the in-plane magnetic field sensitive sensor chip is an MR type magnetic sensitive sensor chip.

[0011] Optionally, a sealed frame is provided on the PCB board, the sealed frame has a built-in relay, a wiring piece is embedded on the sealed frame, one end of the wiring piece inside the sealed frame is connected to the coil of the relay, and the other end of the wiring piece outside the sealed frame passes through the PCB board.

[0012] Compared with the prior art, the high-voltage power distribution module of the present invention has the following advantages:

[0013] (1) The PCB board of the high-voltage power distribution module of the present invention has three layers of signal lines, two layers for weak current routing, and one layer for high current routing, which can avoid the intersection of weak current routing and high current routing, reduce the complexity of routing, and avoid mutual interference between strong and weak signals;

[0014] (2) The fixing plate of the PCB board of the high-voltage power distribution module of the present invention is an arched plate, and both ends of the arched plate are fixed to the PCB board. Since the cross-sectional areas of the two ends of the arched plate are small, the area of ​​the PCB board occupied is small, which will not affect the utilization rate of the PCB board; and since the fixing plate is arched, the opening of the fixing plate faces the PCB board, and there is available space between the fixing plate and the PCB board, and the screws can pass through the fixing plate and be exposed in the available space, thereby enhancing the structural strength between the fuse and the fixing plate;

[0015] (3) The current sensor of the high-voltage power distribution module described in the present invention includes an in-plane magnetic field sensitive sensor chip and a shielding cover, and the iron core of the traditional current sensor is removed. The application of the in-plane magnetic field sensitive sensor chip can make the design of the sensor structure flatter, which can greatly reduce the size of the sensor, and is conducive to the integration and miniaturization of the high-voltage power distribution module; when the iron core is removed, the influence of the residual magnetism of the iron core itself on the accuracy of the current sensor is also eliminated, and the sensor accuracy can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of a PCB board according to an embodiment of the present invention;

[0017] Figure 2 This is a structural schematic diagram of a high-voltage power distribution module according to an embodiment of the present invention;

[0018] Figure 3 It is a partial structural schematic diagram of the high-voltage power distribution module described in an embodiment of the present invention.

[0019] Description of reference numerals:

[0020] 10-PCB board; 101-high current buried copper layer; 102-weak current buried copper layer; 103-insulating layer; 20-fuse; 30-fixing plate; 40-fixing plate; 41-long strip protrusion; 42-cross protrusion; 50-sealing frame; 60-wiring piece; 70-shielding cover. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] like Figure 1 As shown, it is a structural schematic diagram of the high-voltage distribution module in this embodiment, the high-voltage distribution module includes a PCB board 10, the PCB board 10 includes a large current buried copper layer 101 located in the middle layer, and a weak current buried copper layer 102 located in the top and bottom layers, and an insulating layer 103 is provided between the large current buried copper layer and the weak current buried copper layer.

[0023] Among them, the insulating layer 103 between the large current buried copper layer 101 and the weak current buried copper layer 102 is used to isolate the large current routing and the weak current routing to avoid mutual interference between strong and weak signals. In this embodiment, the large current buried copper layer 101 is used for large current routing, including high voltage power lines, etc.; the weak current buried copper layer 102 is used for weak current routing, including control signal routing, etc. In this way, the PCB board 10 of the high voltage distribution module in this embodiment has three layers of signal lines, two layers are used for weak current routing, and one layer is used for large current routing, which can avoid the intersection of weak current routing and large current routing, reduce the complexity of routing, and avoid mutual interference between strong and weak signals.

[0024] Optional, such as Figure 2 As shown, a fuse 20 is disposed on the PCB board 10 , and the fuse 20 is screw-connected to the PCB board 10 .

[0025] Among them, the fuse 20 can be directly fixed to the PCB board 10 by screws, or a fixing structure can be first set on the PCB board 10, and then the fuse 20 can be fixed to the fixing structure by screws. Generally, in traditional high-voltage power distribution modules, the fuse 20 is usually welded on the PCB board 10. This fixing method is relatively direct and simple, but when replacing a new fuse 20 after the fuse 20 melts, it is necessary to first suck off the original solder, and then re-solder after replacing the new fuse 20. The above process is relatively cumbersome and it is very inconvenient to replace the fuse 20. In this embodiment, the fuse 20 is preferably connected to the PCB board 10 by screws. When replacing the fuse 20, it is only necessary to disassemble and assemble the screws, which is simple and convenient to operate.

[0026] Specifically, Figure 3As shown, in this embodiment, preferably, a fixing plate 30 is fixed on the PCB board 10, and fixing plates 40 are connected to both ends of the fuse 20. The fixing plates 40 and the fixing plates 30 are both provided with screw holes, and the screw holes on the fixing plates 40 correspond to the screw holes on the fixing plates 30. Fasteners pass through the screw holes on the fixing plates 40 and the screw holes on the fixing plates 30 in sequence.

[0027] The fasteners may be screws, binding wires or plugs, etc., preferably screws. The fixing sheet 40 is a rectangular sheet structure, and its extension direction is consistent with the extension direction of the fuse 20. The fixing sheet 40 has a screw hole at one end away from the fuse 20. Two fixing plates 30 are welded on the PCB board 10, and both fixing plates 30 have screw holes. The distance between the two screw holes on the two fixing plates 30 is the same as the distance between the two screw holes on the two fixing plates 40, and the shape and size of the screw holes on the fixing sheet 40 are the same as the shape and size of the screw holes on the fixing plates 30.

[0028] In the method of screw connection between the fuse 20 and the PCB board 10, the fuse 20 can be directly fixed to the PCB board 10 by screws. This direct connection method requires opening screw holes on the PCB board 10. If the fuse 20 is replaced many times, the screw holes on the PCB board 10 may be screwed, affecting the installation of the fuse 20. In this embodiment, a fixing plate 30 is first set on the PCB board 10, and the fixing plate 30 can be welded to the PCB board 10. The PCB board 10 and the fuse 20 are indirectly screwed through the fixing plate 30, and there is no need to open screw holes on the PCB board 10. After the screw holes of the fixing plate 30 are screwed, a new fixing plate 30 can be replaced, which will not affect the installation of the fuse 20. The possibility of screw hole screwing is much lower than the possibility of replacing the fuse 20, and the convenience of replacing the fuse 20 will not be reduced due to the high frequency of replacing the fixing plate 30.

[0029] Optional, such as Figure 3 As shown, the fixing plate 30 is an arched plate, and the opening of the arched plate faces the PCB board 10 .

[0030] Specifically, both ends of the fixing plate 30 are fixed on the PCB board 10. Generally, the selection of the fixing plate 30 can also consider a flat plate. The only way to fix the flat plate on the PCB board 10 is to lay it flat. This fixing method will occupy a large amount of space for installing components on the PCB board 10, reduce the utilization rate of the PCB board 10, and in order to avoid the screws from impacting the PCB board 10, the screws can only enter the fixing plate 30 but cannot pass through it, which may cause the connection between the fuse 20 and the fixing plate 30 to be not stable enough. In this embodiment, the fixing plate 30 is an arched plate, and both ends of the arched plate are fixed on the PCB board 10. Since the cross-sectional areas of the two ends of the arched plate are small, the area of ​​the PCB board 10 occupied is small, which will not affect the utilization rate of the PCB board 10; and since the fixing plate 30 is arched, the opening of the fixing plate 30 faces the PCB board 10, and there is an available space between the fixing plate 30 and the PCB board 10, and the screws can pass through the fixing plate 30 and be exposed in the available space, thereby enhancing the structural strength between the fuse 20 and the fixing plate 30.

[0031] Optional, such as Figure 3 As shown, the surface of the fixing piece 40 at one end of the fuse 20 has a long strip protrusion 41, and the surface of the fixing piece 40 at the other end of the fuse 20 has a cross-shaped protrusion 42. Among them, the long strip protrusion 41 represents the negative pole of the fuse 20, and the cross-shaped protrusion 42 represents the positive pole of the fuse 20. Generally, the shapes of the two ends of the fuse 20 are basically the same. When installing the fuse 20, it is impossible to directly judge the positive and negative poles by its shape. In this embodiment, two protrusions of different shapes are respectively arranged on the surface of the fixing pieces 40 at the two ends of the fuse 20, which can be used to identify the positive and negative poles of the fuse 20 to avoid reverse connection.

[0032] Optional, such as Figure 2 As shown, a current sensor is provided on the PCB board 10, and the current sensor includes an in-plane magnetic field sensitive sensor chip (not shown) and a shielding cover 70. The in-plane magnetic field sensitive sensor chip and the shielding cover 70 are both fixed to the PCB board 10, and the in-plane magnetic field sensitive sensor chip is placed in the shielding cover 70.

[0033] In high-voltage power distribution modules, the Hall current sensors currently used generally require the use of iron cores, whose main functions are as follows: magnetic gathering function, which gathers the magnetic field generated by the current around the primary conductor near the sensor chip, increases the signal magnetic field, and improves the signal-to-noise ratio; shielding function, the interference magnetic field outside the primary conductor will be shielded by the iron core, so that the sensor chip will not be disturbed by the external magnetic field; magnetic field homogenization function, the magnetic field generated by the primary conductor itself is a gradient field, and the air gap end face of the iron core is designed to be very flat, which can optimize the uniformity of the magnetic field. Considering the need to meet the saturation magnetic field under large currents, the size of the iron core is significantly larger, which has become the main factor limiting the size of the current sensor and a major obstacle to the further integration and miniaturization of high-voltage power distribution modules.

[0034] In this embodiment, the current sensor includes an in-plane magnetic field sensitive sensor chip and a shielding cover 70, and the iron core of the traditional current sensor is removed. The application of the in-plane magnetic field sensitive sensor chip can make the design of the sensor structure flatter, which can greatly reduce the size of the sensor, and is conducive to the integration and miniaturization of the high-voltage distribution module. When the iron core is removed, this embodiment provides a new sensing structure to cope with the loss of the iron core function: for magnetic concentration, a sensor chip with higher sensitivity, that is, an in-plane magnetic field sensitive sensor chip, is selected; for shielding, a shielding cover 70 is introduced to eliminate the interference of the external magnetic field; for magnetic field homogenization, a magnetic sensitive sensor chip that is sensitive to the in-plane magnetic field, that is, an in-plane magnetic field sensitive sensor chip, is used to reduce the need for a uniform field. And after the iron core is removed, an additional advantage is that the influence of the residual magnetism of the iron core itself on the accuracy of the current sensor is also eliminated, and the sensor accuracy can be further improved. The optional in-plane magnetic field sensitive sensor chips are available in two types: planar Hall type and MR type.

[0035] Optionally, the in-plane magnetic field sensitive sensor chip is an MR type magnetic sensitive sensor chip.

[0036] Since the planar Hall sensor chip is insufficient in accuracy and temperature drift, the present embodiment preferably uses an MR magnetic sensor chip, which has higher sensitivity and resolution.

[0037] Optionally, a sealed frame 50 is provided on the PCB board 10, and the sealed frame 50 has a built-in relay. A wiring piece 60 is embedded in the sealed frame 50, and one end of the wiring piece 60 inside the sealed frame 50 is connected to the coil of the relay, and the other end of the wiring piece 60 outside the sealed frame 50 passes through the PCB board 10.

[0038] In the traditional high-voltage power distribution module, the coil of the relay is directly welded on the PCB board 10. This flexible connection method has low stability, is prone to poor line contact or direct disconnection due to jitter, and increases the complexity of the line. In this embodiment, the relay is integrated into the sealed frame 50 to form a modular relay structure. The coil of the relay is connected to the wiring piece 60 inside the sealed frame 50. The entire relay is rigidly connected to the PCB board 10 through the wiring piece 60, which enhances the reliability and stability of the relay wiring, reduces the number of wiring on the PCB, and further reduces the complexity of the wiring.

[0039] Although the disclosure is disclosed as above, the protection scope of the disclosure is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. A high voltage power distribution module, comprising a PCB board (10), characterized in that: The PCB board (10) comprises a high-current buried copper layer (101) located in the middle layer, and low-current buried copper layers (102) located in the top layer and the bottom layer, and an insulating layer (103) is provided between the high-current buried copper layer and the low-current buried copper layer; A fuse (20) is provided on the PCB board (10), and the fuse (20) is screw-connected to the PCB board (10); A sealed frame (50) is provided on the PCB board (10), the sealed frame (50) has a built-in relay, a wiring piece (60) is embedded in the sealed frame (50), one end of the wiring piece (60) located inside the sealed frame (50) is connected to the coil of the relay, and one end of the wiring piece (60) located outside the sealed frame (50) passes through the PCB board (10); A fixing plate (30) is fixed on the PCB (10), and fixing plates (40) are connected to both ends of the fuse (20), and screw holes are provided on the fixing plate (40) and the fixing plate (30), and the screw holes on the fixing plate (40) correspond to the screw holes on the fixing plate (30), and fasteners pass through the screw holes on the fixing plate (40) and the screw holes on the fixing plate (30) in sequence; the fixing plate (30) is an arched plate, and the opening of the arched plate faces the PCB (10); The PCB board (10) is provided with a current sensor, the current sensor comprising an in-plane magnetic field sensitive sensor chip and a shielding cover (70), the in-plane magnetic field sensitive sensor chip and the shielding cover (70) are both fixed to the PCB board (10), and the in-plane magnetic field sensitive sensor chip is placed in the shielding cover (70); the in-plane magnetic field sensitive sensor chip is an MR type magnetic sensitive sensor chip.

2. The high voltage power distribution module according to claim 1, characterized in that: The surface of the fixing piece (40) at one end of the fuse (20) has a long strip-shaped protrusion (41), and the surface of the fixing piece (40) at the other end of the fuse (20) has a cross-shaped protrusion (42).

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