Display device

Abstract

A display device is provided. The display device includes a base layer, a plurality of wavelength conversion regions provided on one surface of the base layer, a partition wall provided between adjacent ones of the plurality of wavelength conversion regions and having a first refractive index, a cover portion configured to cover the plurality of wavelength conversion regions and having a second refractive index greater than the first refractive index, and an image display portion provided on a surface provided by the partition wall and the cover portion.

Description

[0001] This patent application claims priority from Korean Patent Application No. 10-2018-0121956, filed on October 12, 2018, which is hereby incorporated by reference herein in its entirety. Technical Field

[0002] The present disclosure herein relates to a display device having improved display quality and light efficiency and a method of manufacturing the same. Background Art

[0003] Display devices may include wavelength conversion components to represent colors. The wavelength conversion components may include pigment particles containing a predetermined color or a light emitter that emits light of a predetermined color. When light provided from one pixel region is provided to an adjacent pixel region, color mixing occurs. Summary of the Invention

[0004] The embodiment provides a display device having improved display quality and light efficiency and a method of manufacturing the same.

[0005] An embodiment of the inventive concept provides a display device comprising: a base layer; a plurality of wavelength conversion regions disposed on a surface of the base layer; a partition wall disposed between adjacent wavelength conversion regions among the plurality of wavelength conversion regions and having a first refractive index; a covering portion configured to cover the plurality of wavelength conversion regions and having a second refractive index greater than the first refractive index; and an image display portion disposed on a surface provided by the partition wall and the covering portion.

[0006] In an embodiment, the surface is a flat surface, and the image display portion may contact the flat surface provided by the partition wall and the cover portion.

[0007] In an embodiment, the image display portion may include: a base substrate; a circuit layer disposed on the base substrate; a light emitting element layer disposed on the circuit layer; and an encapsulation layer covering the light emitting element layer and the circuit layer, wherein the encapsulation layer may directly contact the partition wall and the covering portion.

[0008] In an embodiment, the partition wall may have a rectangular shape in cross-section.

[0009] In an embodiment, the partition wall may have a trapezoidal shape in cross section.

[0010] In an embodiment, the partition wall may have a curvature in cross section.

[0011] In an embodiment, the partition wall may have a width gradually increasing from the base layer side toward the image display portion side.

[0012] In an embodiment, the partition wall may have a width gradually decreasing from the base layer side toward the image display portion side.

[0013] In an embodiment, the display device may further include a light blocking layer disposed between the base layer and the partition wall.

[0014] In an embodiment, a first sum of the thickness of the light blocking layer and the thickness of the partition wall may be substantially the same as the distance between the base layer and the image display portion, and the first sum may be substantially the same as a second sum of the thickness of one wavelength conversion portion among the multiple wavelength conversion portions and the thickness of the covering portion provided on the one wavelength conversion portion.

[0015] In an embodiment, the multiple wavelength conversion sections may include multiple first wavelength conversion sections and multiple second wavelength conversion sections, and the multiple first wavelength conversion sections may be arranged in a first direction, the multiple second wavelength conversion sections may be arranged in the first direction, and the multiple first wavelength conversion sections and the multiple second wavelength conversion sections may be alternately arranged in a second direction intersecting the first direction.

[0016] In an embodiment, the partition wall may be provided in plurality, each of the plurality of partition walls may extend in the first direction, and the plurality of partition walls may be provided to be spaced apart from each other in the second direction.

[0017] In an embodiment, the partition wall may be provided in plural, and the plural partition walls may be arranged in the first direction and the second direction.

[0018] In an embodiment, the difference between the first refractive index and the second refractive index may be 0.5 or greater.

[0019] In an embodiment, the partition wall may include one of polytetrafluoroethylene, magnesium fluoride, and polyvinylidene fluoride.

[0020] In an embodiment of the inventive concept, a display device includes: a base layer; a light blocking layer disposed on the base layer and defining a plurality of openings in the light blocking layer; wavelength conversion portions corresponding one-to-one to the plurality of openings to cover the plurality of openings; a partition wall disposed between the wavelength conversion portions, disposed on the light blocking layer, and having a first refractive index; and a covering portion configured to cover the wavelength conversion portion and having a second refractive index greater than the first refractive index, wherein the partition wall includes at least one of polytetrafluoroethylene, magnesium fluoride, and polyvinylidene fluoride.

[0021] In an embodiment of the inventive concept, a method for manufacturing a display device includes: preparing a base layer; forming a plurality of wavelength conversion sections on a surface of the base layer; forming an image display section; forming partition walls on the base layer or the image display section; forming a covering material between the partition walls; and bonding the image display section to the base layer, with the partition walls and the covering material arranged between the base layer and the image display section, wherein the image display section and the base layer are bonded to each other so that the partition walls overlap with areas adjacent to the plurality of wavelength conversion sections when viewed in a plan view.

[0022] In an embodiment, a partition wall may be formed on the base layer, wherein the partition wall may be formed after forming the plurality of wavelength conversion portions.

[0023] In an embodiment, a partition wall may be formed on the base layer, wherein the plurality of wavelength conversion portions may be formed after the partition wall is formed.

[0024] In embodiments, the formation of the partition walls may include a photolithography process or a printing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0026] Figure 1 is a perspective view of a display device according to an embodiment of the inventive concept;

[0027] Figure 2 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0028] Figure 3A is a cross-sectional view of an image display portion according to an embodiment of the inventive concept;

[0029] Figure 3B is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept;

[0030] Figure 3C is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept;

[0031] Figure 3D is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept;

[0032] Figure 4 is a cross-sectional view of an image display portion according to an embodiment of the inventive concept;

[0033] Figure 5 is a cross-sectional view of an image display portion according to an embodiment of the inventive concept;

[0034] Figure 6 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0035] Figure 7 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0036] Figure 8 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0037] Figure 9 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0038] Figure 10 is a plan view of a display device according to an embodiment of the inventive concept;

[0039] Figure 11 is a plan view of a display device according to an embodiment of the inventive concept;

[0040] Figure 12 is a plan view of a display device according to an embodiment of the inventive concept;

[0041] Figure 13A 、 Figure 13B 、 Figure 13C 、 Figure 13D and Figure 13E is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept;

[0042] Figure 14A and Figure 14B is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept; and

[0043] Figure 15A 、 Figure 15B 、 Figure 15C 、 Figure 15D and Figure 15E is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0044] In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being "on," "connected to," or "coupled to" another component, the component can be directly disposed on / directly connected to / directly coupled to the one component, or a third component may be present in between.

[0045] The same reference numerals refer to the same elements throughout. In addition, in the accompanying drawings, the thickness, proportion and size of components are exaggerated for clarity of explanation.

[0046] The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, a first element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise indicated, terms in the singular may include plural forms.

[0048] In addition, “under,” “below,” “above,” “upper,” etc. are used to explain the relationship between components shown in the drawings. Terms may be relative concepts and described based on the directions shown in the drawings.

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention pertains. In addition, terms (such as those defined in general dictionaries) will be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0050] The meaning of “include” or “comprising” refers to a property, a fixed number, a step, an operation, an element, a component or a combination thereof, but does not exclude other properties, fixed numbers, steps, operations, elements, components or a combination thereof.

[0051] Hereinafter, exemplary embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0052] Figure 1 is a perspective view of a display device according to an embodiment of the inventive concept.

[0053] Reference Figure 1 , the display device DD can display images through the display area DA. Figure 1 An example is shown in which the display area DA is disposed on a flat surface defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1. However, a display area of ​​a display device according to another embodiment of the inventive concept may be disposed on a curved surface.

[0054] The thickness of the display device DD is indicated along the third direction DR3. The directions indicated as the first direction to the third directions DR1, DR2, and DR3 may be relative concepts and thus may be changed to different directions. In this specification, "when viewed in a plan view" may refer to a view along the third direction DR3. Furthermore, "thickness direction" may refer to the third direction DR3.

[0055] Figure 1An example in which the display device DD is a television is shown. However, the display device DD may be a large electronic device such as a monitor or an external billboard, as well as a small or medium-sized electronic device such as a personal computer, a notebook computer, a personal digital assistant, a car navigation system, a game console, a smartphone, a tablet, and a camera. The above devices are merely exemplary embodiments, and therefore, the display device DD may be applied to other electronic devices without departing from the spirit and scope of the inventive concept.

[0056] Figure 2 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0057] Reference Figure 2 , the display device DD may include a base layer BS, wavelength conversion parts CCF1 , CCF2 , and CCF3 , a light blocking layer BM, partition walls BR, a cover part CP, and an image display part IDP.

[0058] The base layer BS may be a plastic substrate, a glass substrate, an insulating film, or a laminate structure including a plurality of insulating layers.

[0059] The light-blocking layer BM may be disposed on one surface BSs of the base layer BS. The light-blocking layer BM may include a light-blocking material. For example, the light-blocking material may be a black pigment or a black dye. A plurality of openings OPAR, OPAG, and OPAB may be defined in the light-blocking layer BM. The plurality of openings OPAR, OPAG, and OPAB may be regions through which light is transmitted and may correspond one-to-one to the pixel regions.

[0060] The plurality of openings OPAR, OPAG, and OPAB may include a first opening OPAR, a second opening OPAG, and a third opening OPAB. Light passing through the first opening OPAR, the second opening OPAG, and the third opening OPAB may have different wavelengths from each other.

[0061] The wavelength conversion parts CCF1, CCF2, and CCF3 may be disposed on one surface BSs of the base layer BS. The wavelength conversion parts CCF1, CCF2, and CCF3 may include a first wavelength conversion part CCF1, a second wavelength conversion part CCF2, and a third wavelength conversion part CCF3.

[0062] The first wavelength conversion part CCF1 may cover the first opening OPAR, the second wavelength conversion part CCF2 may cover the second opening OPAG, and the third wavelength conversion part CCF3 may cover the third opening OPAB. Each of the first wavelength conversion part CCF1, the second wavelength conversion part CCF2, and the third wavelength conversion part CCF3 may completely cover the plurality of openings OPAR, OPAG, and OPAB in the light blocking layer BM and the opposite edges of the light blocking layer BM.

[0063] The first wavelength conversion part CCF1 may include a first color filter layer CF1 and a first wavelength conversion layer EF1, and the second wavelength conversion part CCF2 may include a second color filter layer CF2 and a second wavelength conversion layer EF2. The first wavelength conversion layer EF1 may include a first base body BN1 and a first light emitting body EP1, and the second wavelength conversion layer EF2 may include a second base body BN2 and a second light emitting body EP2.

[0064] The third wavelength converter CCF3 may include a third color filter layer CF3 and a light-transmitting layer EF3. The light-transmitting layer EF3 may include a third matrix BN3 and scattering particles SP. For example, the scattering particles SP may be TiO2 or silica-based nanoparticles. The third wavelength converter CCF3 may scatter blue light and provide the scattered blue light to the third color filter layer CF3. However, embodiments of the inventive concept are not limited thereto. For example, according to another embodiment of the inventive concept, the third wavelength converter CCF3 may not include a blue color filter, and the light-transmitting layer EF3 may further include a third luminescent body.

[0065] Although not shown, a protective layer may also be provided between the first color filter layer CF1 and the first wavelength conversion layer EF1, between the second color filter layer CF2 and the second wavelength conversion layer EF2, and between the third color filter layer CF3 and the light transmission layer EF3. The protective layer may cover the first color filter layer CF1, the second color filter layer CF2, and the third color filter layer CF3. The protective layer may include a transparent insulating layer such as silicon oxide, silicon nitride, and silicon oxynitride.

[0066] Each of the first to third bases BN1, BN2, and BN3 may be a transparent polymer resin, such as an acrylic resin, a urethane resin, a silicone resin, or an epoxy resin.

[0067] Each of the first and second light emitters EP1 and EP2 may include a material that absorbs predetermined light and converts the wavelength of the absorbed light to light having a wavelength different from the predetermined light. For example, each of the first and second light emitters EP1 and EP2 may be quantum dots. The first light emitter EP1 may absorb light and emit light of a first color, for example, red light. The second light emitter EP2 may absorb light and emit light of a second color, for example, green light.

[0068] The quantum dots may be selected from Group II-VI compounds, Group III-V compounds, Group IV-VI compounds, Group IV elements, Group IV compounds, and combinations thereof.

[0069] The II-VI compound may be selected from a binary element compound, a ternary element compound, and a quaternary element compound. The binary element compound is selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and combinations thereof. The ternary element compound is selected from the group consisting of AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe e, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and combinations thereof, and the quaternary element compound is selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and combinations thereof.

[0070] The III-V compound can be selected from a binary element compound, a ternary element compound and a quaternary element compound, the binary element compound being selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and combinations thereof, the ternary element compound being selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb and combinations thereof, and the quaternary element compound being selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and combinations thereof.

[0071] The IV-VI Group compound can be selected from a binary element compound, a ternary element compound and a quaternary element compound, the binary element compound being selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe and combinations thereof, the ternary element compound being selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and combinations thereof, and the quaternary element compound being selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe and combinations thereof.

[0072] The Group IV element may be selected from the group consisting of Si, Ge, and combinations thereof. The Group IV compound may be a binary element compound selected from the group consisting of SiC, SiGe, and combinations thereof. Here, the binary element compound, the ternary element compound, and the quaternary element compound may be present in the particle at a uniform concentration, or in a state where the concentration distribution is divided into locally different states.

[0073] The quantum dot may have a core-shell structure comprising a shell surrounding a core. Alternatively, the quantum dot may have a core / shell structure in which one quantum dot surrounds another quantum dot. The interface between the core and the shell may have a concentration gradient in which the element present in the shell has a concentration that gradually decreases toward the center.

[0074] Quantum dots can have particles with nanometer-scale dimensions. In addition, quantum dots can have shapes such as spherical shapes, conical shapes, multi-arm shapes, or shapes such as cubic nanoparticles, nanotubes, nanowires, nanofibers, nanoplate-like particles, etc. However, the embodiments of the inventive concept are not limited thereto. The light emitted by the quantum dots can be emitted in all directions (360 degrees) to improve the optical viewing angle.

[0075] The light emitted from quantum dots can vary in color depending on the particle size of the quantum dots. Therefore, the first luminescent element EP1 can have a particle size that is different from the particle size of the second luminescent element EP2. For example, the first luminescent element EP1 can have a particle size that is larger than the particle size of the second luminescent element EP2. In this case, the first luminescent element EP1 can emit light having a wavelength greater than the wavelength of the light emitted by the second luminescent element EP2.

[0076] The first color filter layer CF1 can absorb light that has passed through the first wavelength conversion layer EF1 but has not been converted by the first luminescent element EP1, and the second color filter layer CF2 can absorb light that has passed through the second wavelength conversion layer EF2 but has not been converted by the second luminescent element EP2. Furthermore, the first to third color filter layers CF1, CF2, and CF3 can prevent external light from entering the first and second wavelength conversion layers EF1 and EF2, respectively, and the light-transmitting layer EF3. The first color filter layer CF1 can be a red filter layer, the second color filter layer CF2 can be a green filter layer, and the third color filter layer CF3 can be a blue filter layer. According to another embodiment of the inventive concept, each of the first and second color filter layers CF1 and CF2 can be a yellow filter. According to another embodiment of the inventive concept, at least one of the first to third color filter layers CF1, CF2, and CF3 can be omitted.

[0077] The partition wall BR may be disposed between adjacent wavelength conversion sections among the first, second, and third wavelength conversion sections CCF1, CCF2, and CCF3, so as to overlap the light-blocking layer BM. For example, the partition wall BR may be disposed between the first and second wavelength conversion sections CCF1, between the second and third wavelength conversion sections CCF2, and between the third and first wavelength conversion sections CCF3. The partition wall BR may have a square cross-section. For example, the partition wall BR may have a rectangular cross-section. The cross-section may be a plane parallel to the second and third directions DR2 and DR3.

[0078] The first to third wavelength conversion parts CCF1 , CCF2 , and CCF3 may be covered by the cover part CP. The cover part CP may fill a space between the first to third wavelength conversion parts CCF1 , CCF2 , and CCF3 and the adjacent partition wall BR.

[0079] The partition wall BR may have a first refractive index, and the cover portion CP may have a second refractive index. The first refractive index may be smaller than the second refractive index.

[0080] Light incident on the partition wall BR may vary at a critical angle due to differences in refractive index. Light incident at the critical angle or greater may be totally reflected by the boundary between the cover portion CP and the partition wall BR. When the difference between the first and second refractive indices is approximately 0.7, the critical angle may be approximately 36 degrees, and when the difference between the first and second refractive indices is approximately 0.6, the critical angle may be approximately 40.3 degrees. When the difference between the first and second refractive indices is approximately 0.5, the critical angle may be approximately 44.9 degrees, and when the difference between the first and second refractive indices is approximately 0.4, the critical angle may be approximately 49.9 degrees. When the difference between the first and second refractive indices is approximately 0.3, the critical angle may be approximately 55.4 degrees, when the difference between the first and second refractive indices is approximately 0.2, the critical angle may be approximately 61.9 degrees, and when the difference between the first and second refractive indices is approximately 0.1, the critical angle may be approximately 70.3 degrees. The measured critical angle may be a critical angle measured according to a change in the refractive index of the partition wall BR when the cover portion CP has a refractive index of about 1.7.

[0081] The difference between the first refractive index and the second refractive index may be equal to or greater than about 0.1 and may be equal to or less than about 2.0. For example, the difference in refractive index may be equal to or greater than about 0.1 and may be equal to or less than about 0.7. In particular, the difference in refractive index may be from about 0.5 to about 0.7.

[0082] A portion of the light LT incident on the area overlapping the second opening OPAG can travel to the partition wall BR. In a case where the difference between the first and second refractive indices is approximately 0.5, when the incident angle AG of the light LT is approximately 44.9 degrees or greater (the angle formed between a line perpendicular to the surface of the partition wall BR and the portion of the light LT incident on the surface of the partition wall BR), the light LT can be totally reflected and then enter the second wavelength converter CCF2. Therefore, the partition wall BR, which has a lower refractive index than the cover portion CP, can prevent color mixing, where colors mix between adjacent pixels. As a result, display quality can be improved. Furthermore, since the partition wall BR prevents color mixing, where colors mix between adjacent pixels, the width WDT of the light blocking layer BM can be reduced, thereby increasing the aperture ratio of the display device DD. Furthermore, the light totally reflected by the partition wall BR can again enter the corresponding wavelength converter, thereby improving light efficiency by preventing light loss.

[0083] The partition wall BR may be made of a material having a refractive index greater than about 1.0 and equal to or less than about 1.6. For example, the partition wall BR may include at least one of polytetrafluoroethylene, magnesium fluoride, and polyvinylidene fluoride. In addition to the above materials, the partition wall BR may include at least one of polyethylene terephthalate (PET), polycarbonate, polymethyl methacrylate (PMMA), silicone oil, ethylene tetrafluoroethylene, polydimethylsiloxane, and polylactic acid.

[0084] The material that can be used for the cover CP is not particularly limited as long as the material has a refractive index greater than that of the partition wall BR. The cover CP can be made of a resin such as a silicone polymer, an epoxy resin, or an acrylic resin. In addition, when the partition wall BR includes polytetrafluoroethylene, the cover CP can include polycarbonate or polyethylene terephthalate having a refractive index greater than that of polytetrafluoroethylene, which is an example of a material for the partition wall BR.

[0085] The partition wall BR and the cover portion CP may provide a flat surface PS. The image display portion IDP may be disposed on the flat surface PS provided by the partition wall BR and the cover portion CP. The flat surface PS and the image display portion IDP may be in direct contact with each other. For example, the image display portion IDP may contact each of the partition wall BR and the cover portion CP.

[0086] The image display part IDP may include a plurality of pixels (not shown). Each of the plurality of pixels (not shown) may include a pixel circuit and a light emitting element, and may correspond one-to-one to the plurality of openings OPAR, OPAG, and OPAB.

[0087] A partition wall BR may be provided between the image display portion IDP and the light blocking layer BM provided on the base layer BS to serve as a spacer. When the distance between the image display portion IDP and the base layer BS is uneven, the distance between the wavelength conversion portions CCF1, CCF2, and CCF3 and the image display portion IDP may be uneven, so that the brightness varies depending on the position within the display device DD, or the color coordinates vary depending on the position within the display device DD. According to an embodiment of the inventive concept, the distance between the image display portion IDP and the base layer BS may be uniformly maintained by the partition wall BR. Therefore, the brightness may vary depending on the position within the display device DD (see FIG. 1 ). Figure 1 ) occurs when a brightness change or a color coordinate change occurs at a position within the .

[0088] According to an embodiment of the inventive concept, a first sum of the thickness Tk1 of the light blocking layer BM and the thickness Tk2 of the partition wall BR may be substantially the same as the distance DST between the base layer BS and the image display portion IDP. Furthermore, the first sum may be substantially the same as, for example, a second sum of the thickness Tk3 of the first wavelength conversion portion CCF1 and the thickness Tk4 of the cover portion CP on the first wavelength conversion portion CCF1 among the wavelength conversion portions CCF1, CCF2, and CCF3. Here, the thickness Tk4 of the cover portion CP may be the thickness of a region overlapping the first wavelength conversion portion CCF1 in a cross-sectional view.

[0089] Figure 3A is a cross-sectional view of an image display portion according to an embodiment of the inventive concept.

[0090] Reference Figure 3A The image display part IDP may be an organic light emitting display panel. The image display part IDP may include a base substrate BP, a circuit layer ML, a light emitting element layer OEL, and an encapsulation layer ENCL.

[0091] The base substrate BP may be a plastic substrate, a glass substrate, an insulating film, or a laminate structure including a plurality of insulating layers.

[0092] The buffer layer BFL may be disposed on the base substrate BP. The circuit layer ML may be disposed on the buffer layer BFL. The circuit layer ML may include a transistor TR and insulating layers L1, L2, L3, and L4.

[0093] The transistor TR may be disposed on the buffer layer BFL. The transistor TR may include a control electrode CE, an input electrode IE, an output electrode OE, and a semiconductor pattern SCP.

[0094] The semiconductor pattern SCP may be disposed on a buffer layer BFL. The buffer layer BFL may provide a modified surface on the semiconductor pattern SCP. In this case, the semiconductor pattern SCP may have greater adhesion to the buffer layer BFL than to the base substrate BP. Alternatively, the buffer layer BFL may be a barrier layer that protects the bottom surface of the semiconductor pattern SCP. In this case, the buffer layer BFL may prevent contaminants or moisture introduced from the outside through the base substrate BP into the circuit layer ML and the light-emitting element layer OEL, or from the base substrate BP into the circuit layer ML and the light-emitting element layer OEL, from penetrating into the semiconductor pattern SCP.

[0095] The first insulating layer L1 may be disposed on the buffer layer BFL to cover the semiconductor pattern SCP. The first insulating layer L1 may include an inorganic material. For example, the inorganic material may be silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide, but is not limited thereto.

[0096] The control electrode CE may be disposed on the first insulating layer L1. The second insulating layer L2 may be disposed on the first insulating layer L1 to cover the control electrode CE. The second insulating layer L2 may include an inorganic material.

[0097] The third insulating layer L3 may be disposed on the second insulating layer L2. The input electrode IE and the output electrode OE may be disposed on the third insulating layer L3. The input electrode IE and the output electrode OE may be connected to the semiconductor pattern SCP through vias passing through the first insulating layer to the third insulating layer L1, L2, and L3.

[0098] The fourth insulating layer L4 may be disposed on the third insulating layer L3 to cover the input electrode IE and the output electrode OE. The fourth insulating layer L4 may be a single layer or multiple layers. The fourth insulating layer L4 may include organic material and / or inorganic material.

[0099] A light emitting element layer OEL (hereinafter referred to as an organic light emitting element) may be provided on the fourth insulating layer L4. The organic light emitting element OEL may include a first electrode layer EL1, a light emitting unit LU, and a second electrode layer EL2.

[0100] The first electrode layer EL1 may be disposed on the fourth insulating layer L4 and electrically connected to the output electrode OE via a through-hole passing through the fourth insulating layer L4. The first electrode layer EL1 may be a pixel electrode layer or an anode electrode layer. The first electrode layer EL1 may be made of a material having a high work function to facilitate hole injection.

[0101] The pixel defining layer PDL is disposed on the fourth insulating layer L4 and the first electrode layer EL1. The pixel defining layer PDL exposes a portion of the first electrode layer EL1. The exposed region of the first electrode layer EL1 may be defined as a pixel region PXA. The pixel region PXA may correspond to the reference pixel region PXA. Figure 2 One of the multiple openings described as OPAR, OPAG and OPAB.

[0102] The image display part IDP may include a plurality of pixels (not shown). Each of the plurality of pixels may include a pixel circuit and a pixel electrode. The pixel circuit may include a plurality of transistors TR and at least one capacitor. Figure 3A One of the plurality of transistors TR is shown in FIG. The pixel electrode may be the first electrode layer EL1.

[0103] The second electrode layer EL2 is disposed on the first electrode layer EL1. The second electrode layer EL2 can be a common electrode layer or a cathode electrode layer. The second electrode layer EL2 faces the first electrode layer EL1. For example, when the first electrode layer EL1 is an anode electrode layer, the second electrode layer EL2 can be a cathode electrode layer. The second electrode layer EL2 can be made of a material with a low work function to facilitate electron injection.

[0104] The light emitting unit LU may be provided between the first electrode layer EL1 and the second electrode layer EL2 to generate blue light. For example, the light emitting unit LU may provide blue light to the plurality of openings OPAR, OPAG, and OPAB (see Figure 2 ).

[0105] The first wavelength conversion layer EF1 can convert blue light into red light to provide the red light to the first color filter layer CF1, the second wavelength conversion layer EF2 can convert blue light into green light to provide the green light to the second color filter layer CF2, and the light transmission layer EF3 can scatter blue light to provide the scattered blue light to the third color filter layer CF3.

[0106] The first color filter layer CF1 can transmit light having a red wavelength band and absorb light other than the red wavelength band. The second color filter layer CF2 can transmit light having a green wavelength band and absorb light other than the green wavelength band. The third color filter layer CF3 can transmit light having a blue wavelength band and absorb light other than the blue wavelength band. The light emitting unit LU can have a tandem structure or a single-layer structure.

[0107] According to another embodiment of the inventive concept, the light emitting unit LU may generate light having a white color, light having a red color, or light having a green color. However, embodiments of the inventive concept are not limited thereto.

[0108] The encapsulation layer ENCL may be disposed on the organic light-emitting element OEL to cover the organic light-emitting element OEL and the circuit layer ML. The encapsulation layer ENCL may seal the organic light-emitting element OEL. For example, the encapsulation layer ENCL may protect the organic light-emitting element OEL from foreign matter such as moisture / oxygen or dust particles. The encapsulation layer ENCL may be a laminated structure or a substrate. For example, the laminated structure may include at least one organic encapsulation layer and at least one inorganic encapsulation layer alternately laminated. The substrate may be a glass substrate or a plastic substrate.

[0109] Figure 3B is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept.

[0110] Reference Figure 3B The organic light-emitting element OEL may include a first electrode layer EL1, a light-emitting unit LU, and a second electrode layer EL2. The light-emitting unit LU may include a hole control layer HCL, a light-emitting layer EML, and an electron control layer ECL. The hole control layer HCL may be disposed between the light-emitting layer EML and the first electrode layer EL1, and the electron control layer ECL may be disposed between the light-emitting layer EML and the second electrode layer EL2.

[0111] The hole control layer HCL may include a hole injection layer, a hole transport layer, a buffer layer, and an electron blocking layer. The hole control layer HCL may have a single layer made of a single material, a single layer made of different materials, or a multilayer structure including multiple layers made of different materials. The hole control layer HCL may be made of at least one of a hole injection material and a hole transport material. Each of the hole injection material and the hole transport material may be a well-known material.

[0112] The electron control layer ECL may include an electron injection layer, an electron transport layer, and a hole blocking layer. The electron control layer ECL may have a single-layer structure made of a single material, a single-layer structure made of different materials, or a multilayer structure including multiple layers made of different materials. The electron control layer ECL may include at least one of an electron transport material and an electron injection material. Each of the electron injection material and the electron transport material may be a well-known material.

[0113] The light-emitting layer (EML) may include a host material and a dopant material. The light-emitting layer (EML) may be formed by using a phosphorescent or fluorescent light-emitting material as a dopant in the host material. The light-emitting layer (EML) may emit light of a predetermined color. For example, the light-emitting layer (EML) may emit blue light.

[0114] Figure 3C is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept.

[0115] Reference Figure 3CThe organic light-emitting element OEL-1 may include a first electrode layer EL1, a light-emitting unit LU-1, and a second electrode layer EL2. The light-emitting unit LU-1 may include a first hole control layer HCL1, a first light-emitting layer EML1, a first electron control layer ECL1, a charge generation layer CGL, a second hole control layer HCL2, a second light-emitting layer EML2, and a second electron control layer ECL2.

[0116] The charge generation layer CGL may be disposed between the first and second emission layers EML 1 and EML 2. When a voltage is applied to the charge generation layer CGL, a complex may be generated through an oxidation-reduction reaction to generate charges.

[0117] Electrons generated in the charge generation layer CGL may reach the first emission layer EML1 via the first electron control layer ECL1, and holes generated in the charge generation layer CGL may reach the second emission layer EML2 via the second hole control layer HCL2.

[0118] In this embodiment, each of the first and second light emitting layers EML1 and EML2 may generate light having a wavelength band of blue light.The first and second light emitting layers EML1 and EML2 may include the same material or materials different from each other.

[0119] The first light-emitting layer EML1 generates first light. The second light-emitting layer EML2 generates second light. Each of the first light and the second light may be light having a wavelength band of blue light. The first light and the second light may have the same spectrum or different spectrums. For example, the first light may be one of dark blue light, light blue light, and blue light, and the second light may be one of dark blue light, light blue light, and blue light.

[0120] However, the above description may be merely an example. The first and second light emitting layers EML1 and EML2 according to embodiments of the inventive concept may be designed to generate light having various colors and may not be limited to any one embodiment.

[0121] Figure 3D is a cross-sectional view of an organic light emitting element according to an embodiment of the inventive concept.

[0122] Reference Figure 3D The organic light-emitting element OEL-2 may include a first electrode layer EL1, a light-emitting unit LU-2, and a second electrode layer EL2. The light-emitting unit LU-2 may include a first hole control layer HCL1, a first light-emitting layer EML1, a first electron control layer ECL1, a first charge generation layer CGL1, a second hole control layer HCL2, a second light-emitting layer EML2, a second electron control layer ECL2, a second charge generation layer CGL2, a third hole control layer HCL3, a third light-emitting layer EML3, and a third electron control layer ECL3.

[0123] The third light emitting layer EML3 may be provided between the first light emitting layer EML1 and the second light emitting layer EML2. The first light emitting layer EML1 and the second light emitting layer EML2 may correspond to Figure 3C The third light-emitting layer EML3 may include a material different from that of each of the first light-emitting layer EML1 and the second light-emitting layer EML2. According to an embodiment of the inventive concept, the third light-emitting layer EML3 may include the same material as that of at least one of the first light-emitting layer EML1 and the second light-emitting layer EML2.

[0124] The third light generated in the third light emitting layer EML3 may be light having a wavelength band of blue light, for example, the third light may be one of deep blue light, light blue light, and blue light.

[0125] However, the above description may be merely an example. The third light emitting layer EML3 may be designed to generate light having various colors, but is not limited to a specific embodiment.

[0126] The first charge generation layer CGL1 is disposed between the first light emitting layer EML1 and the third light emitting layer EML3. Electrons generated in the first charge generation layer CGL1 can reach the first light emitting layer EML1 via the first electron control layer ECL1, and holes generated in the first charge generation layer CGL1 can reach the third light emitting layer EML3 via the third hole control layer HCL3.

[0127] The second charge generation layer CGL2 is disposed between the second light emitting layer EML2 and the third light emitting layer EML3. Holes generated in the second charge generation layer CGL2 can reach the second light emitting layer EML2 via the second hole control layer HCL2, and electrons generated in the second charge generation layer CGL2 can reach the third light emitting layer EML3 via the third electron control layer ECL3. Figure 3D The detailed description of other layers can be found in the Figure 3C The detailed description of the above-mentioned layers corresponds to that of the above-mentioned layers, and therefore, the detailed description thereof will be omitted.

[0128] Figure 4 is a cross-sectional view of an image display portion according to an embodiment of the inventive concept.

[0129] Reference Figure 4 , the image display part IDP-1 may be a micro LED display panel. The image display part IDP-1 may include a base substrate BP, a circuit layer ML, and a light emitting element ED. The same reference numerals are used for Figure 3A The description of the components that are the same as those of FIG. 1 will be omitted.

[0130] The connection electrode CNE may be disposed on the fourth insulating layer L4 and may be connected to the output electrode OE.

[0131] The fifth insulating layer L5 may be disposed on the fourth insulating layer L4 to cover the connection electrode CNE. The fifth insulating layer L5 may include an organic material. The fifth insulating layer L5 may cover the circuit layer ML disposed therebelow and provide a flat surface.

[0132] The first partition wall BR1 and the second partition wall BR2 are disposed on the fifth insulating layer L5. Each of the first partition wall BR1 and the second partition wall BR2 may extend in the first direction DR1. The second partition wall BR2 may be spaced apart from the first partition wall BR1 in the second direction DR2.

[0133] The first electrode E1 may be disposed on the first partition wall BR1, and the second electrode E2 may be disposed on the second partition wall BR2. The first electrode E1 may extend in the first direction DR1 to cover the first partition wall BR1, and the second electrode E2 may extend in the first direction DR1 to cover the second partition wall BR2. That is, the first partition wall BR1 may be disposed between the first electrode E1 and the fifth insulating layer L5, and the second partition wall BR2 may be disposed between the second electrode E2 and the fifth insulating layer L5.

[0134] A through hole may be defined in the fifth insulating layer L5, and the connection electrode CNE may be exposed through the through hole. The first electrode E1 may be electrically connected to the exposed connection electrode CNE via the through hole. The second electrode E2 may be electrically connected to the power line, and a power voltage may be applied to the second electrode E2.

[0135] The first electrode E1 may include a first reflective electrode RFE1 and a first cover electrode CPE1 , and the second electrode E2 may include a second reflective electrode RFE2 and a second cover electrode CPE2 .

[0136] Each of the first reflective electrode RFE1 and the second reflective electrode RFE2 may include a reflective material. Each of the first reflective electrode RFE1 and the second reflective electrode RFE2 may have a single-layer structure or a multi-layer structure. For example, each of the first reflective electrode RFE1 and the second reflective electrode RFE2 may have a structure in which indium tin oxide (ITO), silver (Ag), and indium tin oxide (ITO) are sequentially stacked.

[0137] The first cover electrode CPE1 may cover the first reflective electrode RFE1, and the second cover electrode CPE2 may cover the second reflective electrode RFE2. For example, each of the first cover electrode CPE1 and the second cover electrode CPE2 may include at least one of indium zinc oxide (IZO), indium tin oxide (ITO), indium gallium oxide (IGO), indium zinc gallium oxide (IGZO), and mixtures / compounds thereof.

[0138] The light emitting element ED may be provided on the fifth insulating layer L5. The light emitting element ED may be provided in plurality. The plurality of light emitting elements ED may be connected in parallel to each other. The light emitting element ED may be electrically connected to the first electrode E1 and the second electrode E2.

[0139] The light-emitting element ED may be a microLED element. The microLED element may have a length ranging from a few nanometers to several hundred micrometers. However, the length of the microLED element is merely an example. For example, the length of the microLED element is not limited to the above-mentioned length range.

[0140] Light emitted from the light emitting element ED may be reflected by the first electrode E1 covering the first partition wall BR1 and the second electrode E2 covering the second partition wall BR2, and then emitted to the outside of the image display part IDP-1. The pixel area PXA may be defined as a region corresponding to one end of each of the first partition wall BR1 and the second partition wall BR2. The pixel area PXA may correspond to the reference Figure 2 One of the multiple openings described as OPAR, OPAG and OPAB.

[0141] A sixth insulating layer L6 (or insulating pattern) may be disposed on the light emitting element ED. The sixth insulating layer L6 may cover at least a portion of a top surface of the light emitting element ED.

[0142] The light emitting element ED may be electrically connected to the first electrode E1 through the first connection electrode CNE1 and electrically connected to the second electrode E2 through the second connection electrode CNE2 .

[0143] The second connection electrode CNE2 may be disposed on the light-emitting element ED and the second electrode E2. The seventh insulating layer L7 may be disposed on the second connection electrode CNE2. The first connection electrode CNE1 may be disposed on the light-emitting element ED and the first electrode E1. Even if the light-emitting element ED has a length of several hundred micrometers, the second connection electrode CNE2 and the first connection electrode CNE1 may not be in direct contact with each other because the seventh insulating layer L7 may cover the second connection electrode CNE2. However, this is merely an example. According to another embodiment of the inventive concept, the first connection electrode CNE1 and the second connection electrode CNE2 may be formed simultaneously using the same process. In this embodiment, the seventh insulating layer L7 may be omitted.

[0144] Each of the first connection electrode CNE1 and the second connection electrode CNE2 may include a conductive material. For example, the conductive material may include at least one of indium zinc oxide (IZO), indium tin oxide (ITO), indium gallium oxide (IGO), indium zinc gallium oxide (IGZO), and mixtures / compounds thereof. However, embodiments of the inventive concept are not limited thereto. For example, the conductive material may be a metal material. For example, the metal material may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof.

[0145] The eighth insulating layer L8 may be disposed on the first connection electrode CNE1 and the seventh insulating layer L7. The eighth insulating layer L8 may be an encapsulation layer. According to another embodiment, a ninth insulating layer L9 may be disposed on the eighth insulating layer L8. The ninth insulating layer L9 may be a planarization layer. The ninth insulating layer L9 may be a contact Figure 2 The flat surface of the PS surface.

[0146] Figure 5 is a cross-sectional view of an image display portion according to an embodiment of the inventive concept.

[0147] Reference Figure 5 The image display part IDP-2 may be a liquid crystal display panel. The image display part IDP-2 may include a first base substrate BP1, a second base substrate BP2, a circuit layer ML, a liquid crystal layer LCL, a pixel electrode PE, and a common electrode CME. The same reference numerals are used for Figure 3A The components are the same as those of , and their description will be omitted.

[0148] Each of the first base substrate BP1 and the second base substrate BP2 may be a silicon substrate, a plastic substrate, an insulating film, or a laminate structure including a plurality of insulating layers. The second base substrate BP2 may have a contact Figure 2 The top surface of the flat surface PS.

[0149] The pixel electrode PE may be disposed on the fourth insulating layer L4. The pixel electrode PE may be electrically connected to the output electrode OE. The liquid crystal layer LCL may be disposed on the pixel electrode PE. The common electrode CME may be disposed on the liquid crystal layer LCL. The common electrode CME may be disposed on one surface of the second base substrate BP2.

[0150] The area on which the pixel electrode PE may be defined is defined as a pixel area PXA. The pixel area PXA may correspond to a reference area. Figure 2 One of the multiple openings described as OPAR, OPAG and OPAB.

[0151] Despite Figure 5The liquid crystal layer LCL is disposed between the common electrode CME and the pixel electrode PE, but embodiments of the inventive concept are not limited thereto. For example, according to another embodiment of the inventive concept, the liquid crystal layer LCL may be disposed on the common electrode CME and the pixel electrode PE. In this case, the common electrode CME and the pixel electrode PE may be disposed on the first base substrate BP1.

[0152] The liquid crystal layer LCL may include a plurality of liquid crystal molecules LC, and the arrangement of the liquid crystal molecules LC may be changed according to an electric field generated between the common electrode CME and the pixel electrode PE.

[0153] Figure 6 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0154] Figure 6 The display device DD-1 is different from the display device DD-1 in the shape of the partition wall BR-1. Figure 2 For example, the partition wall BR-1 may have a trapezoidal shape in a cross-sectional view.

[0155] The partition wall BR-1 may have a width WDT-1 that gradually increases from the base layer BS side toward the image display portion IDP side. Therefore, the partition wall BR-1 may have a width wider on the image display portion IDP side than on the base layer BS side. The width WDT-1 of the partition wall BR-1 may indicate a width in the second direction DR2.

[0156] Figure 6 FIG. 1 shows light LT-1 provided from the pixel region. The light LT-1 may be light from the image display portion IDP along the Figure 2 Therefore, the angle between the light LT and the top surface of the image display part IDP may be the same as the angle between the light LT-1 and the top surface of the image display part IDP.

[0157] The light LT-1 incident on the partition wall BR-1 may have a Figure 2 The incident angle of the light LT is large, and the incident angle AG-1 is large. According to an embodiment of the inventive concept, since the partition wall BR-1 has a trapezoidal shape, the possibility of total reflection of the light incident on the partition wall BR-1 is increased. Therefore, the color mixing phenomenon in which colors are mixed with each other between adjacent pixels can be more effectively prevented by the partition wall BR-1. In addition, the light totally reflected by the boundary between the cover portion CP and the partition wall BR-1 can be incident on the corresponding wavelength conversion portion (for example, the second wavelength conversion portion CCF2) again to prevent light loss, thereby improving light efficiency.

[0158] Figure 7 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0159] Reference Figure 7 , the display device DD-2 is different from the Figure 2 For example, the partition wall BR-2 may have an inverted trapezoidal shape in a cross-sectional view.

[0160] The partition wall BR-2 may have a width WDT-2 gradually decreasing from the base layer BS side toward the image display part IDP side. Therefore, the partition wall BR-2 may have a width narrower on the image display part IDP side than on the base layer BS side.

[0161] Figure 8 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0162] Reference Figure 8 , the display device DD-3 is different from the Figure 2 For example, the partition wall BR-3 may have a curvature in a cross-sectional view. The partition wall BR-3 may have a width WDT-3 that gradually decreases from the base layer BS side toward the image display portion IDP side.

[0163] Figure 9 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0164] Reference Figure 9 , the display device DD-4 is different from the Figure 2 For example, the partition wall BR-4 may have a curvature in a cross-sectional view. The partition wall BR-4 may have a width WDT-4 that gradually increases from the base layer BS side toward the image display portion IDP side.

[0165] Figure 10 is a plan view of a display device according to an embodiment of the inventive concept.

[0166] Reference Figure 10 , showing first to third wavelength conversion parts CCF1 , CCF2 , and CCF3 , first to third openings OPAR, OPAG, and OPAB, and first to third partition walls BRA, BRB, and BRC.

[0167] Each of the first to third wavelength conversion parts CCF1, CCF2, and CCF3 is provided in plurality. The plurality of first wavelength conversion parts CCF1, the plurality of second wavelength conversion parts CCF2, and the plurality of third wavelength conversion parts CCF3 may be arranged along the first direction DR1. For example, the plurality of first wavelength conversion parts CCF1 may be arranged in the first direction DR1, the plurality of second wavelength conversion parts CCF2 may be arranged in the first direction DR1, and the plurality of third wavelength conversion parts CCF3 may be arranged in the first direction DR1. The plurality of first wavelength conversion parts CCF1, the plurality of second wavelength conversion parts CCF2, and the plurality of third wavelength conversion parts CCF3 may be arranged alternately in the second direction DR2.

[0168] Each of the first to third partition walls BRA, BRB, and BRC may have a Figure 2 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 The cross section of one of the partition walls BR, BR-1, BR-2, BR-3 and BR-4 described is the same cross section.

[0169] The first to third partition walls BRA, BRB, and BRC may extend in the first direction DR1 and be spaced apart from each other in the second direction DR2. For example, the first partition wall BRA may be disposed between the first wavelength conversion part CCF1 and the second wavelength conversion part CCF2, the second partition wall BRB may be disposed between the second wavelength conversion part CCF2 and the third wavelength conversion part CCF3, and the third partition wall BRC may be disposed between the third wavelength conversion part CCF3 and the first wavelength conversion part CCF1.

[0170] In addition, according to another embodiment of the inventive concept, the display device may further include additional partition walls (not shown) extending in the second direction DR2. For example, the additional partition walls may be provided between the first wavelength conversion parts CCF1, the second wavelength conversion parts CCF2, and the third wavelength conversion parts CCF3.

[0171] Figure 11 is a plan view of a display device according to an embodiment of the inventive concept.

[0172] Reference Figure 11 , each of the partition walls BR-11, BR-12, BR-13, BR-21 and BR-31 may have a Figure 2 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 The cross section of one of the partition walls BR, BR-1, BR-2, BR-3 and BR-4 described is the same cross section.

[0173] The partition walls BR-11, BR-12, BR-13, BR-21, and BR-31 may be arranged in the first direction DR1 and the second direction DR2. Each of the partition walls BR-11, BR-12, BR-13, BR-21, and BR-31 may extend in the first direction DR1.

[0174] The lengths of the partition walls BR-11, BR-12, BR-13, BR-21, and BR-31 in the first direction DR1 may be less than Figure 10 A length of each of the first to third partition walls BRA, BRB, and BRC in the first direction DR1 is φ(L).

[0175] Figure 12 is a plan view of a display device according to an embodiment of the inventive concept.

[0176] Figure 12 The first to third openings OPARa, OPAGa, and OPABa may be arranged in a Pentile structure.

[0177] The first wavelength conversion parts CCF1a overlapping the first openings OPARa and the third wavelength conversion parts CCF3a overlapping the third openings OPABa may be alternately arranged in the first direction DR1 and the second direction DR2.

[0178] The second wavelength conversion portion CCF2a overlapping the second opening OPAGa may be disposed to be spaced apart from the first wavelength conversion portion CCF1a in the fourth direction DR4 or the fifth direction DR5. The fourth direction DR4 may be defined as a direction between the first direction DR1 and the second direction DR2, and the fifth direction DR5 may be defined as a direction substantially perpendicular to the fourth direction DR4.

[0179] The first to third openings OPARa, OPAGa, and OPABa may have different areas from one another. Each area may represent an area when viewed in a plan view. For example, the third opening OPABa providing blue light may have the largest area, and the first opening OPARa providing red light may have the second largest area. The second opening OPAGa providing green light may have the smallest area.

[0180] When viewed in a plan view, the partition walls BRm1 and BRm2 may not overlap with the first to third wavelength conversion parts CCF1a, CCF2a, and CCF3a. For example, the partition walls BRm1 and BRm2 may be provided to overlap with a region adjacent to a region on which the first to third wavelength conversion parts CCF1a, CCF2a, and CCF3a are provided.

[0181] The partition walls BRm1 may extend in the fifth direction DR5 and be spaced apart from each other in the fourth direction DR4, and the partition walls BRm2 may extend in the fourth direction DR4 and be spaced apart from each other in the fifth direction DR5. Each of the partition walls BRm1 and BRm2 may have the same width as the reference width. Figure 2 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 The cross section of one of the partition walls BR, BR-1, BR-2, BR-3 and BR-4 described is the same cross section.

[0182] 13A to 13E is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept.

[0183] Reference Figure 13A , forming a base layer BS. Although not shown separately, the base layer BS may be provided on a working substrate (not shown) during the manufacturing process. After the display device is manufactured, the working substrate may be removed from the base layer BS.

[0184] Reference Figure 13B A light blocking layer BM is formed on one surface BSs of the base layer BS. A plurality of first to third openings OPAR, OPAG, and OPAB may be formed in the light blocking layer BM.

[0185] The first to third wavelength conversion portions CCF1, CCF2, and CCF3 may be formed on one surface BSs of the base layer BS. The first to third wavelength conversion portions CCF1, CCF2, and CCF3 may correspond one-to-one to the first to third openings OPAR, OPAG, and OPAB to cover the first to third openings OPAR, OPAG, and OPAB. The first to third wavelength conversion portions CCF1, CCF2, and CCF3 may be formed to completely cover the first to third openings OPAR, OPAG, and OPAB and partially cover the opposite edges of the light blocking layer BM.

[0186] Reference Figure 13C , partition walls BRs are formed on one surface BSs of the base layer BS. Partition walls BRs may be provided between the first to third wavelength conversion parts CCF1, CCF2, and CCF3. For example, partition walls BRs may be formed on the light blocking layer BM. In this embodiment, the first to third wavelength conversion parts CCF1, CCF2, and CCF3 may be formed, and then the partition walls BRs may be formed. The upper surface of the partition walls BRs may be higher than the upper surfaces of the first to third wavelength conversion parts CCF1, CCF2, and CCF3.

[0187] The partition walls BRs may be formed by a photolithography process or a printing process. For example, in the photolithography process, the partition walls BRs may include a photosensitive material. After applying the photosensitive material, an exposure process and a development process may be performed to form the partition walls BRs. The printing process may include, for example, an inkjet printing process, a screen printing process, an imprint printing process, or a dispenser printing process.

[0188] Reference Figure 13D , a cover material CPM is provided between the partition walls BRs. Each partition wall BRs may function as a dam. The cover material CPM may be a material having a refractive index greater than that of each partition wall BRs.

[0189] Reference Figure 13E , the image display part IDP and the base layer BS on which the wavelength conversion parts CCF1, CCF2 and CCF3 are formed are bonded to each other. After the image display part IDP and the base layer BS are bonded to each other, the covering material CPM may be cured to form the covering part CP. Partition walls BRs may be provided between the image display part IDP and the base layer BS to serve as spacers. The partition walls BRs may uniformly maintain the distance between the image display part IDP and the base layer BS. Therefore, it is possible to prevent the occurrence of a situation in which the brightness varies depending on the display device DD (see Figure 1 ) or the color coordinates change.

[0190] Figure 14A and Figure 14B is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept.

[0191] Reference Figure 14A and Figure 14B , partition walls BRs are formed on the light blocking layer BM. After the partition walls BRs are formed, first to third wavelength conversion parts CCF1, CCF2, and CCF3 may be formed between the partition walls BRs. 13A to 13E The above-described method for manufacturing a display device is different from the method for manufacturing a display device according to this embodiment in the formation order of the partition walls BRs and the first to third wavelength converters CCF1 , CCF2 , and CCF3 .

[0192] When the partition walls BRs are formed first, the partition walls BRs can be used to define the area on which the first to third wavelength conversion parts CCF1, CCF2, and CCF3 will be formed. In addition, when the partition walls BRs are formed, the possibility of damage to the first to third wavelength conversion parts CCF1, CCF2, and CCF3 can be eliminated.

[0193] Figures 15A to 15Eis a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept.

[0194] Reference Figure 15A and Figure 15B , forming the image display part IDP. Forming the partition walls BRs on the image display part IDP. The partition walls BRs may be formed directly on the image display part IDP.

[0195] Reference Figure 15C A covering material CPM is provided between the partition walls BRs. The covering material CPM may have fluidity. The amount of the covering material CPM may be adjusted taking into account the volume of each of the first to third wavelength conversion parts CCF1, CCF2, and CCF3. For example, the covering material CPM may have a height less than the height of each upper surface of the partition walls BRs.

[0196] Reference Figure 15D The base layer BS on which the light blocking layer BM and the first to third wavelength converters CCF1, CCF2, and CCF3 are formed is aligned above the image display portion IDP on which the partition walls BRs and the cover material CPM are provided. For example, the base layer BS and the image display portion IDP may be aligned with each other so that the partition walls BRs overlap with a region on which the light blocking layer BM is provided, which is adjacent to the first to third wavelength converters CCF1, CCF2, and CCF3.

[0197] Reference Figure 15E , the image display part IDP and the base layer BS are bonded to the partition walls BRs, and the covering material CPM is disposed therebetween. After the image display part IDP and the base layer BS are combined with each other, the covering material CPM may be cured to form the covering part CP.

[0198] According to an embodiment of the inventive concept, light emitted from a pixel area to a wavelength conversion unit adjacent to a wavelength conversion unit corresponding to the pixel area can be totally reflected by the partition wall and incident on the wavelength conversion unit corresponding to the pixel area. Therefore, the partition wall can be used to prevent color mixing, in which colors are mixed between adjacent pixels, to improve display quality. In addition, since the totally reflected light is incident on the corresponding pixel area and the corresponding wavelength conversion unit, light loss can be prevented to improve light efficiency. In addition, the partition wall can be used as a spacer. Therefore, the distance between the image display unit and the base layer on which the wavelength conversion unit is provided can be constantly maintained.

[0199] It will be apparent to those skilled in the art that various modifications and variations can be made in the inventive concept. Therefore, this disclosure is intended to cover modifications and variations of the inventive concept as long as they fall within the scope of the appended claims and their equivalents. Therefore, the actual scope of protection of the inventive concept should be determined by the technical scope of the appended claims.

Claims

1. A display device, comprising: base layer; a plurality of wavelength conversion portions, disposed on one surface of the base layer; a partition wall provided between adjacent wavelength conversion sections among the plurality of wavelength conversion sections and having a first refractive index; a covering portion configured to cover the plurality of wavelength conversion portions and having a second refractive index greater than the first refractive index; as well as an image display portion provided on a surface provided by the partition wall and the cover portion, wherein the covering portion fills the space between the partition wall and the plurality of wavelength conversion portions, wherein the surface is a flat surface, and the image display portion contacts the flat surface provided by the partition wall and the cover portion, and Here, an upper surface of the image display portion is flat, and the upper surface of the image display portion contacts the flat surface provided by the partition wall and the cover portion.

2. The display device according to claim 1, wherein The image display unit includes: base substrate; A circuit layer is provided on the base substrate; a light-emitting element layer, disposed on the circuit layer; and an encapsulation layer, covering the light emitting element layer and the circuit layer, The encapsulation layer directly contacts the partition wall and the cover.

3. The display device according to claim 1, wherein The partition wall has a rectangular shape in cross section.

4. The display device according to claim 1, wherein The partition wall has a trapezoidal shape in cross section.

5. The display device according to claim 1, wherein The partition wall has a curvature in cross section. The display device according to claim 1 , wherein: The partition wall has a width that gradually increases from the base layer side toward the image display portion side.

7. The display device according to claim 1, wherein: The partition wall has a width gradually decreasing from the base layer side toward the image display portion side. 8 . The display device according to claim 1 , further comprising a light blocking layer provided between the base layer and the partition wall.

9. The display device according to claim 8, wherein: A first sum of the thickness of the light blocking layer and the thickness of the partition wall is the same as the distance between the base layer and the image display portion, and The first sum is the same as a second sum of a thickness of one wavelength converting portion among the plurality of wavelength converting portions and a thickness of the covering portion provided on the one wavelength converting portion.

10. The display device according to claim 1, wherein The plurality of wavelength conversion portions include a plurality of first wavelength conversion portions and a plurality of second wavelength conversion portions, and The plurality of first wavelength conversion portions are arranged in a first direction, the plurality of second wavelength conversion portions are arranged in the first direction, and the plurality of first wavelength conversion portions and the plurality of second wavelength conversion portions are alternately arranged in a second direction crossing the first direction.

11. The display device according to claim 10, wherein: The partition wall is provided in plurality. Each of the plurality of partition walls extends in the first direction, and The plurality of partition walls are provided to be spaced apart from each other in the second direction.

12. The display device according to claim 10, wherein: The partition wall is provided in plurality, and The plurality of partition walls are arranged in the first direction and the second direction.

13. The display device according to claim 1, wherein A difference between the first refractive index and the second refractive index is 0.5 or more.

14. The display device according to claim 1, wherein The partition wall includes one of polytetrafluoroethylene, magnesium fluoride, and polyvinylidene fluoride.

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