Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure includes a carrier and a mesh portion; the mesh portion includes a filter and a fixing portion arranged around the filter; the carrier is a hollow structure, and a pore structure extending along the thickness direction of the carrier is arranged on the carrier; the mesh portion is arranged at one end of the carrier and covers the hollow structure, the filter is opposite to the hollow structure, and the fixing portion is connected to the carrier. One technical effect of the present invention is that the filter on the mesh portion can maintain a flat state, and the mesh portion can effectively block external particles and foreign matter from entering the interior of the microphone packaging structure.

Description

Technical Field

[0001] The present invention relates to the technical field of electro-acoustic conversion, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] With the rapid development of electroacoustic technology, various electroacoustic products emerge in an endless stream. Microphone, as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products. Nowadays, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, smart watches, and smart wearables. In recent years, for microphone packaging structures, the design of their structures has become the focus and hotspot of research for technicians in this field.

[0003] The existing microphone packaging structure is usually composed of a housing with a housing cavity, in which components such as chip components (for example, MEMS chips and ASIC chips) are fixed; and a sound pickup hole is also provided on the housing. However, it is found in long-term applications that dust, impurities and other particles and foreign objects are easily introduced into the microphone's housing cavity through the sound pickup hole, and these particles and foreign objects will cause certain damage to components such as chip components in the housing cavity, which will eventually affect the acoustic performance and service life of the microphone.

[0004] In view of the above problems, the current solution is usually to set an isolation component on the pickup hole of the microphone packaging structure to prevent the entry of external particles, foreign objects, etc. Figure 1 and Figure 2 As shown, it includes a support part 101 and an isolation mesh 102. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, in the existing isolation component, due to the differences in size, material, structure, etc. between the support part 101 and the isolation mesh 102, a certain internal stress difference is likely to be generated at the connection position between the two, which will cause the mesh 103 on the isolation mesh 102 to have folds or wrinkles, and the mesh 103 cannot be guaranteed to be in a flat state, which will cause the quality of the product to decline and even affect the airflow at the mesh 103. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure, comprising a carrier and a mesh portion;

[0007] The mesh portion includes a filter screen and a fixing portion arranged around the filter screen;

[0008] The carrier is a hollow structure, and a pore structure extending along the thickness direction of the carrier is provided on the carrier;

[0009] The mesh portion is arranged at one end of the carrier and covers the hollow structure, the filter mesh is opposite to the hollow structure, and the fixing portion is connected to the carrier.

[0010] Optionally, the channel structure includes a plurality of first channels, and the plurality of first channels are distributed on an edge portion of the carrier.

[0011] Optionally, the first hole is a through hole or a blind hole.

[0012] Optionally, the first channel extends out along the thickness direction of the carrier and to the fixing portion of the mesh portion.

[0013] Optionally, the cross section of the first channel is circular, and the pore size of the first channel is 5-300 μm.

[0014] Optionally, the channel structure further includes a plurality of second channels, the plurality of second channels are close to the hollow structure, and the plurality of second channels are arranged around the edge of the hollow structure.

[0015] Optionally, the second channel is a through hole or a blind hole.

[0016] Optionally, the second channel extends along the thickness direction of the carrier and to the fixing portion of the mesh portion.

[0017] Optionally, the cross section of the second channel is in the shape of a long strip or an arc;

[0018] The width of the second channel is 25-50 μm, and the length of the second channel is 300-600 μm.

[0019] According to a second aspect of the present invention, there is provided a microphone packaging structure, wherein the microphone packaging structure comprises a housing having a receiving cavity, wherein a sound pickup hole is provided on the housing, and the sound pickup hole is used to connect the inside and the outside of the housing;

[0020] Also included is a microphone device, which is fixedly disposed in the accommodating cavity;

[0021] It also includes a dustproof structure as described in any one of the above items, and the dustproof structure is arranged on the sound pickup hole.

[0022] Optionally, the dustproof structure is located outside the housing.

[0023] Optionally, the housing comprises a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodating cavity;

[0024] The dustproof structure is accommodated in the accommodating cavity;

[0025] The microphone device includes a MEMS chip and a signal amplifier.

[0026] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

[0027] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

[0028] Optionally, the sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole.

[0029] Optionally, the sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

[0030] According to a third aspect of the present invention, an electronic device is provided, wherein the electronic device comprises a microphone packaging structure as described in any one of the above.

[0031] The dustproof structure provided in the embodiment of the present invention has specially designed channels on the carrier. When the mesh portion is fixed on the carrier, it can absorb the deformation of the carrier and relieve the stress difference, so that the filter on the mesh portion can remain flat and avoid the phenomenon of folds or wrinkles on the filter. The dustproof structure provided in the embodiment of the present invention can effectively protect the pickup hole of the microphone packaging structure, and the mesh portion can block external particles and foreign matter from entering the interior of the microphone packaging structure, thereby effectively protecting the various components inside the microphone to avoid affecting the acoustic performance and service life of the microphone. The technical tasks to be achieved or the technical problems to be solved by the present invention are never thought of or anticipated by those skilled in the art, so the present invention is a new technical solution.

[0032] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0034] Figure 1 is a side view of an existing isolation assembly.

[0035] Figure 2 is a side view of a dustproof structure provided according to an embodiment of the present invention.

[0036] Figure 3 It is a schematic diagram of the structure of a carrier provided according to an embodiment of the present invention.

[0037] Figure 4 is a schematic structural diagram of a carrier provided according to another embodiment of the present invention.

[0038] Figure 5 is a structural schematic diagram of a microphone packaging structure provided according to a first embodiment of the present invention.

[0039] Figure 6 is a schematic structural diagram of a microphone packaging structure provided according to a second embodiment of the present invention.

[0040] Figure 7 is a structural schematic diagram of a microphone packaging structure provided according to a third embodiment of the present invention.

[0041] Figure 8 4 is a schematic diagram of the structure of a microphone packaging structure provided according to the fourth embodiment of the present invention.

[0042] Fig. 9 is a schematic structural diagram of a microphone packaging structure provided according to a fifth embodiment of the present invention.

[0043] Description of reference numerals:

[0044] 101-supporting part, 102-isolation mesh, 103-membrane;

[0045] 1-carrier, 11-pore structure, 111-first pore, 112-second pore, 2-grid portion, 12-hollow structure, 13-edge portion, 21-filter, 22-fixing portion, 3-housing, 31-packaging cover, 32-substrate, 4-pickup hole, 5-MEMS chip, 6-signal amplifier. DETAILED DESCRIPTION

[0046] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0047] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0048] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0049] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0050] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0051] According to an embodiment of the present invention, a dustproof structure is provided. The dustproof structure can be applied to, for example, a microphone packaging structure. The dustproof structure can effectively prevent external particles and foreign objects from entering the interior of the microphone packaging structure through the sound pickup hole on the microphone packaging structure, thereby effectively protecting the components inside the microphone to avoid affecting the acoustic performance and service life of the microphone.

[0052] The specific structure of the dustproof structure provided by the embodiment of the present invention is further described below. The dustproof structure provided by the embodiment of the present invention is as follows: Figure 2 As shown, it includes a carrier 1 and a mesh portion 2. The mesh portion 2 includes a filter screen 21 and a fixing portion 22 arranged around the filter screen 21. The carrier 1 is a hollow structure, and a pore structure 11 extending along the thickness direction of the carrier 1 is arranged on the carrier 1. The mesh portion 2 is arranged at one end of the carrier 1 and covers the hollow structure 12, the filter screen 21 is opposite to the hollow structure 12, and the fixing portion 22 is connected to the carrier 1.

[0053] The dustproof structure provided in the embodiment of the present invention improves the structure of the carrier 1. Specifically, a pore structure 11 capable of absorbing the deformation of the carrier 1 and relieving the stress difference is provided on the edge portion 13 of the carrier 1. When the mesh portion 2 is fixedly connected to the carrier 1, the pore structure 11 on the carrier 1 can keep the filter 21 on the mesh portion 2 flat, avoiding the phenomenon of wrinkles or folds on the filter 21.

[0054] The dustproof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure. The mesh portion 2 is provided with a filter 21, which allows airflow to pass through, and the filter 21 can also effectively block external particles and foreign matter (for example, dust and impurities) from entering the interior of the microphone packaging structure, thereby effectively protecting the various components inside the microphone packaging structure to avoid affecting the acoustic performance and service life of the microphone. In addition, since the filter 21 on the mesh portion 2 can be in a flat state, it is also conducive to the smooth flow of air here, and will not have an adverse effect on the movement of the airflow.

[0055] In the present invention, Figure 2As shown, the mesh portion 2 includes a filter screen 21 and a fixing portion 22 arranged around the filter screen 21. The fixing portion 22 can be used to connect the mesh portion 2 with the carrier 1 so that the mesh portion 2 can cover the carrier 1. It should be noted that when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion 13 of the carrier 1. Specifically, the fixing portion 22 of the mesh portion 2 and the edge portion 13 of the carrier 1 can be connected together, for example, by adhesive bonding. Of course, the two can also be connected together by fasteners or welding. Those skilled in the art can flexibly choose according to specific needs, and the present invention does not limit this.

[0056] The filter 21 may be made of a metal mesh with a mesh size of no more than 10 μm, so that the airflow can pass smoothly, and at the same time, it can effectively block the entry of dust, impurities and other particles from the outside. The metal filter has the characteristics of good durability, does not need to be frequently replaced, and has a long service life. Of course, the filter 21 may also be made of mesh with other aperture sizes and other materials. In addition, the shape of the mesh holes on the filter 21 may be, for example, circular, square, triangular, etc. Those skilled in the art can flexibly adjust according to specific needs, and there is no limitation on this.

[0057] In addition, it should be noted that, on the mesh portion 2, the shape of the filter 21 itself can be, for example, a regular shape such as a circle, a square, an ellipse, etc., and of course the filter 21 can also be other irregular shapes. Those skilled in the art can flexibly adjust according to actual needs, and the present invention does not limit this.

[0058] In the present invention, the pore structure 11 is disposed on the edge portion 13 of the carrier 1 , wherein the pore structure 11 has various forms.

[0059] In one example of the present invention, Figure 3 As shown, the pore structure 11 includes a plurality of first pores 111, and the plurality of first pores 111 are distributed on the edge portion 13 of the carrier 1. Preferably, the plurality of first pores 111 are evenly distributed on the edge portion 13 of the carrier 1 to better absorb the plane deformation of the carrier 1.

[0060] The first channel 111 may be, for example, a through hole that penetrates the entire carrier 1. Of course, the first channel 111 may also be a blind hole opened on the carrier 1. In addition, the first channel 111 may also extend out of the carrier 1 along the thickness direction of the carrier 1 and extend to the fixing portion 22 of the mesh portion 2. Those skilled in the art may flexibly select according to specific circumstances, and there is no limitation to this.

[0061] like Figure 3 As shown, the cross section of the first channel 111 can be, for example, circular. At this time, the pore size of the first channel 111 can range from 5 μm to 300 μm. It should be noted that the cross section of the first channel 111 is not limited to a circle, but can also be other shapes such as a square, an ellipse, a triangle, a trapezoid, etc., and those skilled in the art can flexibly adjust it according to the specific situation, and there is no limitation on this.

[0062] In another example of the present invention, Figure 4 As shown, the channel structure 11 includes a plurality of first channels 111 and a plurality of second channels 112, and the shapes and structures of the first channels 111 and the second channels 112 are different. The cross section of the first channel 111 can be circular, for example, and the pore size of the first channel 111 ranges from 5 μm to 300 μm. The cross section of the second channel 112 can be long or arc-shaped, for example, and the width of the second channel ranges from 25 μm to 50 μm, and the length of the second channel ranges from 300 μm to 600 μm. Figure 4 As shown, the plurality of second channels 112 are all close to the hollow structure 12 of the carrier 1, and the plurality of second channels 112 are arranged around the edge of the hollow structure 12, so that the hollow structure 12 and the plurality of second channels 112 can form a concentric annular structure. At this time, a plurality of first channels 111 are arranged on the edge portion 13 of the carrier 1 where the second channels 112 are not arranged. Among them, the plurality of first channels 111 are preferably evenly distributed. In this example, two types of channels are arranged on the carrier 1, and in particular, the plurality of second channels 112 are arranged close to the outer edge of the hollow structure 12 of the carrier 1, forming a concentric annular structure with the hollow structure 12, so that the plane deformation of the carrier 1 can be better absorbed. In this way, when the mesh part 2 is fixedly connected to the carrier 1, deformation at the connection position between the two can be avoided to affect the flatness of the filter screen 21 on the mesh part 2, and the filter screen 21 can be kept flat without wrinkles on it.

[0063] The first channel 111 may be, for example, a through hole that runs through the entire carrier 1. Of course, the first channel 111 may also be a blind hole opened on the carrier 1. Similarly, the second channel 112 may be, for example, a through hole that runs through the entire carrier 1. Of course, the second channel 111 may also be a blind hole opened on the carrier 1.

[0064] In addition, it should be noted that when the channel structure 11 includes the first channel 111 and the second channel 112, the first channel 111 and the second channel 112 can be through holes at the same time or blind holes at the same time. Alternatively, the first channel 111 is a through hole and the second channel 112 is a blind hole. Alternatively, the first channel 111 is a blind hole and the second channel 112 is a through hole. Those skilled in the art can flexibly adjust according to specific circumstances and there is no limitation on this. In addition, some of the multiple first channels 111 can be through holes and another part of the channels can be blind holes. Similarly, some of the multiple second channels 112 can be through holes and another part of the channels can be blind holes.

[0065] It should be noted that when the fixing portion 22 of the grid portion 2 is connected to the carrier 1, for example, bonding, welding or fastener connection can be adopted. Those skilled in the art can flexibly adjust according to specific needs and there is no limitation on this.

[0066] In addition, in the present invention, the thickness of the mesh portion 2 may be, for example, 0.5 μm. The height of the carrier 1 may be, for example, 40 μm. This size is suitable for most microphone packaging structures. Of course, those skilled in the art may also appropriately adjust the size according to specific assembly requirements, without limitation.

[0067] According to another embodiment of the present invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various types of electronic products such as mobile phones, laptops, iPads, VR devices, and smart wearable devices, and its application is relatively wide. The microphone packaging structure provided in the embodiment of the present invention can effectively prevent the internal chip components and other components from being damaged by external dust, impurities and other particles and foreign matter, which can extend the service life of the microphone and enable the microphone to maintain excellent acoustic performance.

[0068] The specific structure of the microphone packaging structure provided in the embodiment of the present invention is further described below.

[0069] like Figure 5-Figure 9 As shown, the microphone packaging structure provided by an embodiment of the present invention includes a shell 3 having a accommodating cavity, and a sound pickup hole 4 is arranged on the shell 3. The sound pickup hole 4 is used to connect the inside and outside of the shell 3. A microphone device is accommodated and fixed in the accommodating cavity of the shell 3. The microphone packaging structure provided by the present invention also includes the dustproof structure as described above, and the dustproof structure is fixedly mounted on the sound pickup hole 4. The dustproof structure can effectively protect the components inside the microphone packaging structure.

[0070] In the present invention, the shape of the sound pickup hole 4 can be, for example, circular, square, triangular, elliptical, etc. The sound pickup hole 4 can be set to one or more as needed. The specific setting position of the sound pickup hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, and the present invention does not limit this.

[0071] In an optional example of the present invention, Figure 5 As shown, the dustproof structure can be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dustproof structure is installed outside the microphone packaging structure to cover the sound pickup hole 4, and does not occupy the space inside the microphone packaging structure. When installing the dustproof structure, the position of the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned with the sound pickup hole 4, thereby preventing external particles and foreign matter from being introduced into the microphone packaging structure through the sound pickup hole 4.

[0072] Of course, the present invention is not limited to setting the dustproof structure outside the housing 3, and the dustproof structure may also be set in the accommodating cavity of the housing 3. Those skilled in the art may flexibly adjust the setting position of the dustproof structure according to specific needs.

[0073] The microphone packaging structure of the present invention has a shell 3 structured as follows: comprising a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dustproof structure is accommodated in the accommodating cavity of the shell 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.

[0074] In an optional example of the present invention, Figure 6 As shown, the sound pickup hole 4 is located on the packaging cover 31, and the dustproof structure is fixedly connected to the packaging cover 32. The position of the dustproof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.

[0075] In an optional example of the present invention, Figure 7 As shown, the sound pickup hole 4 is located on the packaging cover 31, and the dustproof structure is fixedly connected to the position of the substrate 32 corresponding to the sound pickup hole 4. At the same time, the dustproof structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.

[0076] In the present invention, the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, but can also be opened on the substrate 32. Figure 8 As shown, the sound pickup hole 4 is located on the substrate 32, and the dustproof structure is fixedly arranged on the substrate 32 at a position corresponding to the sound pickup hole 4. Fig. 9As shown, the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly arranged at a position corresponding to the sound pickup hole 4 on the substrate 32, and the MEMS chip 5 is arranged on the dustproof structure. It should be noted that when the sound pickup hole 4 is opened on the substrate 32, those skilled in the art can adjust the installation position of the dustproof structure according to specific circumstances, as long as it can prevent external particles and foreign objects from entering or can protect the internal chip, and there is no limitation on this.

[0077] The packaging cover 31 is a dish-shaped structure with an open end. The material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board. The shape of the packaging cover 31 can be, for example, a cylindrical shape, a rectangular parallelepiped shape, etc. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

[0078] The substrate 32 may be a circuit board known in the art, such as a PCB, etc., without limitation. The packaging cover 31 and the substrate 32 may be fixed together, for example, by bonding with an adhesive or soldering with solder paste, and those skilled in the art may flexibly select the desired one, without limitation.

[0079] The microphone packaging structure provided by the present invention has a microphone device fixedly accommodated in the accommodating cavity of the housing 3. Specifically, Figure 5-Figure 9 As shown, the microphone device may include a MEMS chip 5 and a signal amplifier 6 , for example.

[0080] Wherein, the MEMS chip 5 includes a substrate and a sensing film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitor element, a piezoresistive element, etc. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the receiving cavity, the MEMS chip 5 can be mounted on the substrate 32. Of course, the MEMS chip 5 can also be mounted on the packaging cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 to the packaging cover 31. The MEMS chip 5 can also be turned on by the circuit layout in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art and will not be described in detail in the present invention.

[0081] The signal amplifier 6 can be mounted on the package cover 31, and can also be mounted on the substrate 32. The signal amplifier 6 can be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, and processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.

[0082] In addition, the MEMS chip 5 and / or the signal amplifier 6 may also be buried in the substrate 32, or half buried in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductor is, for example, a metallized through hole provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through the conductor. The design of burying the MEMS chip 5 and the signal amplifier 6 in the substrate 32 helps to achieve miniaturization of the microphone.

[0083] It should be noted that when the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer is required to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to optical noise.

[0084] In another aspect, the present invention further provides an electronic device, wherein the electronic device comprises the microphone packaging structure as described above.

[0085] The electronic device may be a mobile phone, a laptop computer, a tablet computer, a VR device, a smart wearable device, etc., and the present invention is not limited thereto.

[0086] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: including a carrier and a mesh portion; The mesh portion includes a filter screen and a fixing portion arranged around the filter screen; The carrier is a hollow structure, and a pore structure extending along the thickness direction of the carrier is provided on the carrier; The mesh part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the carrier; The pore structure comprises a plurality of first pores, the plurality of first pores are evenly distributed on the edge of the carrier, and the cross section of the first pore is circular; The channel structure further includes a plurality of second channels, the plurality of second channels are close to the hollow structure, the plurality of second channels are arranged around the edge of the hollow structure, and the cross section of the second channels is arc-shaped.

2. The dustproof structure according to claim 1, characterized in that: The first hole is a through hole or a blind hole.

3. The dustproof structure according to claim 1, characterized in that: The first channel extends along the thickness direction of the carrier and reaches the fixing portion of the mesh portion.

4. The dustproof structure according to any one of claims 1, characterized in that: The pore size of the first channel is 5-300 μm.

5. The dustproof structure according to claim 1, characterized in that: The second hole is a through hole or a blind hole.

6. The dustproof structure according to claim 1, characterized in that: The second channel extends along the thickness direction of the carrier and reaches the fixing portion of the mesh portion.

7. The dustproof structure according to any one of claims 1, characterized in that: The width of the second channel is 25-50 μm, and the length of the second channel is 300-600 μm.

8. A microphone packaging structure, characterized in that: A housing having a receiving cavity is provided on the housing, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to connect the inside and the outside of the housing; Also included is a microphone device, which is fixedly disposed in the accommodating cavity; It also includes a dustproof structure as described in any one of claims 1 to 7, wherein the dustproof structure is arranged on the sound pickup hole.

9. The microphone packaging structure according to claim 8, characterized in that: The dustproof structure is located outside the housing.

10. The microphone packaging structure according to claim 8, characterized in that: The housing comprises a substrate and a packaging cover, wherein the substrate and the packaging cover enclose the accommodating cavity; The dustproof structure is accommodated in the accommodating cavity; The microphone device includes a MEMS chip and a signal amplifier.

11. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

12. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

13. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole.

14. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

15. An electronic device, characterized in that: Comprising a microphone packaging structure as described in any one of claims 8-14.

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