Dust-proof structure, microphone packaging structure and electronic device

Abstract

The present invention discloses a dust-proof structure, a microphone packaging structure, and an electronic device. The dust-proof structure includes a carrier and a grid portion; the carrier is a hollow structure, the carrier includes a plurality of support layers arranged in a stacked manner, the plurality of support layers are connected together, at least one of the support layers forms a stress relief portion, and the stress relief portion has a material or in-plane structure different from that of the other support layers except the support layer where it is located; the grid portion includes a grid structure and a fixing portion arranged around the grid structure, the fixing portion is connected to the carrier, and the grid structure faces the hollow structure.

Description

Technical Field

[0001] The present invention relates to the technical field of electroacoustic conversion, and more specifically, the present invention relates to a dust-proof structure, a microphone packaging structure, and an electronic device. Background Art

[0002] With the rapid development of electroacoustic technology, various electroacoustic products emerge in an endless stream. As a transducer that converts sound into an electrical signal, a microphone is one of the very important components in electroacoustic products. Nowadays, microphones have been widely used in various types of electronic products such as mobile phones, tablet computers, laptop computers, VR devices, AR devices, smart watches, and smart wearables. In recent years, for the microphone packaging structure, the design of its structure has become the focus and hotspot of research by those skilled in the art.

[0003] The existing microphone packaging structure is generally: including a housing having a receiving cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are received and fixed in the receiving cavity; and, a sound pickup hole is also provided on the housing. However, it has been found in long-term applications that external dust, impurities and other particulate matters and foreign objects are easily introduced into the receiving cavity of the microphone through the sound pickup hole, and these external particulate matters and foreign objects will cause certain damage to the components such as the chip assembly in the receiving cavity, and ultimately affect the acoustic performance and service life of the microphone.

[0004] In response to the above problems, the solutions currently adopted are usually to provide a corresponding isolation component on the sound pickup hole of the microphone packaging structure to block the entry of external particulate matters, foreign objects, etc. The existing isolation components, such as Figure 1 shown, include a carrier a2 and a screen a1. When using this isolation component, the isolation component is installed on the sound pickup hole. However, the carrier a2 and the screen a1 are usually manufactured on a flat substrate. The purpose is to maintain flatness to prevent the screen a1 from being damaged. After manufacturing, the isolation component is transferred to another substrate and / or flexible board. After manufacturing, the isolation component is separated from the wafer and assembled into a part of the microphone a4.

[0005] For example, the chip bonding process is adopted, and the adhesive a3 is cured at a high temperature. When the isolation component is heated, the expansion of the screen a1 and the carrier a2 will be different according to the CTE (coefficient of thermal expansion) of each material, usually resulting in warping and / or deformation of the carrier. Before the temperature returns to room temperature, the adhesive a3 has been cured and prevents the isolation component from returning to its original size, so the warping and / or deformation still exist. The remaining warping and / or deformation will cause wrinkles in the screen a1, and even cause the screen a1 to fail or be damaged. Summary of the Invention

[0006] An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone encapsulation structure, and an electronic device.

[0007] According to a first aspect of the present invention, there is provided a dust-proof structure. The dust-proof structure includes a carrier and a grid portion; the carrier is a hollow structure, the carrier includes a plurality of support layers stacked together, at least one of the support layers forms a stress relief portion, and the stress relief portion has a different material or in-plane structure from other support layers other than the support layer where it is located; the grid portion includes a grid structure and a fixing portion disposed around the grid structure, the fixing portion is connected to the carrier, and the grid structure faces the hollow structure.

[0008] Optionally, the plurality of support layers include a top support layer, a bottom support layer, and an intermediate support layer located between the top support layer and the bottom support layer, wherein at least one intermediate support layer has the stress relief portion.

[0009] Optionally, the stress relief portion has a different structure from other support layers other than the support layer where it is located. Among them, the support layer where the stress relief portion is located has grooves extending in the height direction, and at least one of the support layers is a solid structure.

[0010] Optionally, there are two support layers.

[0011] Optionally, there are three support layers, wherein the middle support layer has the through hole, and the other two support layers are solid structures.

[0012] Optionally, the through holes are multiple and are evenly distributed on the support layer where the stress relief portion is located.

[0013] Optionally, the cross-sectional shape of the through hole is circular, rectangular, arc-shaped, elliptical or triangular.

[0014] Optionally, the stress relief portion has a different material from other support layers other than the support layer where it is located. Among them, the support layer where the stress relief portion is located has a smaller Young's modulus than other support layers.

[0015] Optionally, the material of the grid portion is metal, and the carrier is metal or dry film resist.

[0016] According to a second aspect of the present disclosure, there is provided a microphone encapsulation structure. The encapsulation structure includes a housing having an accommodation cavity, and a sound pickup hole is provided on the housing; it further includes the above-mentioned dust-proof structure, and the dust-proof structure faces the sound pickup hole.

[0017] Optionally, the dust-proof structure is located outside the housing.

[0018] Optionally, the housing includes a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodation cavity;

[0019] The dust-proof structure is received in the accommodation cavity.

[0020] Optionally, the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.

[0021] Optionally, the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate.

[0022] Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged at a position corresponding to the sound pickup hole on the substrate.

[0023] Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged at a position corresponding to the sound pickup hole on the substrate, and the MEMS chip is arranged on the dust-proof structure.

[0024] According to a third aspect of the present disclosure, an electronic device is provided. The electronic device includes the above-mentioned microphone packaging structure.

[0025] According to an embodiment of the present disclosure, the dust-proof structure has the characteristics of small deformation and stable structure.

[0026] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings incorporated in and constituting a part of this specification illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0028] Figure 1 is a side view of an existing isolation component.

[0029] Figure 2 is a cross-sectional view of a dust-proof structure according to an embodiment of the present disclosure.

[0030] Figure 3 is a cross-sectional view of a second dust-proof structure according to an embodiment of the present disclosure.

[0031] Figure 4 is a cross-sectional view of a third dust-proof structure according to an embodiment of the present disclosure.

[0032] Figures 5 - 7 is a process flow chart of the preparation of a dust-proof structure according to an embodiment of the present disclosure.

[0033] Figure 8It is a schematic diagram of a microphone packaging structure according to an embodiment of the present disclosure.

[0034] Figure 9 It is a schematic diagram of another microphone packaging structure according to an embodiment of the present disclosure.

[0035] Figure 10 It is a schematic diagram of a third microphone packaging structure according to an embodiment of the present disclosure.

[0036] Figure 11 It is a top view of a support layer according to an embodiment of the present disclosure.

[0037] Figure 12 It is a cross-sectional view of a fourth dust-proof structure according to an embodiment of the present disclosure.

[0038] Figure 13 It is a schematic diagram of a fourth microphone packaging structure according to an embodiment of the present disclosure.

[0039] Figure 14 It is a schematic diagram of a fifth microphone packaging structure according to an embodiment of the present disclosure. Detailed implementation manners

[0040] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention.

[0041] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0042] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0043] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0044] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0045] According to an embodiment of the present disclosure, a dust-proof structure is provided. The dust-proof structure can be applied to, for example, a microphone packaging structure. The dust-proof structure can effectively block external particulate matters and foreign objects from entering the inside of the microphone packaging structure through the sound pickup holes on the microphone packaging structure, thereby effectively protecting each component inside the microphone and avoiding affecting the acoustic performance and service life of the MEMS microphone chip.

[0046] As Figures 2 - 4 shown, the dust-proof structure includes a carrier 1 and a grid portion 2.

[0047] Among them, the carrier 11 is a hollow structure 104, and an air flow channel is formed inside the hollow structure 104 for vibrating air flow to pass through. The carrier 1 includes a plurality of support layers arranged in a stacked manner. For example, the support layers are annular, such as circular, rectangular annular, racetrack-shaped or other annular structures. The plurality of support layers are connected together to form a stacked structure.

[0048] For example, the cross-sections of the plurality of support layers are the same to form a carrier 1 with a uniform wall thickness.

[0049] For example, the cross-sections of the plurality of support layers are different as long as they can be stacked together to form the hollow structure 104.

[0050] At least one of the support layers forms a stress relief portion, and the stress relief portion has a different material or in-plane structure from other support layers except the support layer where it is located. The in-plane structure refers to the structure inside the support layer. Different in-plane structures are, for example, forming a groove 102a structure inside the surface of the support layer. The groove 102a is a through hole or a non-through hole along the height direction. Different materials are, for example, different elastic moduli of the support layer and other support layers.

[0051] In the embodiment of the present disclosure, by setting the stress relief portion, the warping and / or deformation of the carrier 1 can be effectively absorbed, thereby reducing or even avoiding the generation of wrinkles or breakage of the grid portion 2.

[0052] The material of the carrier 1 can be, but is not limited to, organic materials, inorganic non-metallic materials or metallic materials. For example, organic materials include plastics, etc. Inorganic non-metallic materials include silicon, silicon oxide, silicon nitride, etc. Metallic materials include stainless steel, copper alloy, aluminum alloy, gold, silver, etc.

[0053] Of course, the material of the carrier 1 is not limited to the above embodiments, and those skilled in the art can set it according to actual needs.

[0054] The cross-section of the carrier 1 is rectangular, circular, oval, hexagonal, etc. For example, in this example, the cross-section of the carrier 1 is square, and its side length is 800 μm - 1500 μm. The side lengths of the square are equal, and the deformation is small.

[0055] The cross-section of the hollow structure 104 is circular, elliptical, triangular, rectangular, hexagonal, racetrack-shaped, etc. For example, the cross-section of the hollow structure 104 is circular, and its diameter is 500 μm - 1200 μm.

[0056] The grid part 2 is arranged at one end of the carrier 1 and covers the hollow structure 104. The grid part 2 includes a grid structure and an edge part 110 arranged around the grid structure. The grid structure 21 faces the hollow structure 104. The grid structure is formed with a sieve. The sieve has a set mesh number, so as to be able to filter out external impurities, dust, particles, etc. Those skilled in the art can set the mesh number of the sieve according to actual needs.

[0057] The edge part 110 is connected to the carrier 1. For example, the fixing part 22 is connected to the edge part 110 of the carrier 1 by means of an adhesive or bonding.

[0058] In one example, as Figure 2 shown, the support layer is two layers, such as the first support layer 101 and the second support layer 102. The two support layers 101, 102 are connected together. The structure of the carrier 1 is simple. A stress relief part is provided in one of the support layers (for example, the second support layer 102); the other support layer (for example, the first support layer 101) is a solid structure.

[0059] In one example, as Figure 3 shown, the multiple support layers include a top support layer (for example, the first support layer 101), a bottom support layer (for example, the third support layer 103), and an intermediate support layer (for example, the second support layer 102) located between the top support layer and the bottom support layer. For example, the multiple support layers 101, 102, 103 are all rectangular ring structures, and the cross-section of the hollow structure 104 is circular. For example, the intermediate support layer (for example, the second support layer 102) is one or more. Among them, at least one intermediate support layer (for example, the second support layer 102) has the stress relief part.

[0060] Of course, the setting method of the multiple support layers is not limited to the above embodiments, and those skilled in the art can set it according to actual needs.

[0061] In one example, as Figures 2 - 3 shown, the stress relief part has a different structure from other support layers except the support layer where it is located. Among them, the support layer where the stress relief part is located has grooves 102a extending in the height direction, and at least one of the support layers is a solid structure. The setting of the grooves 102a can effectively absorb the deformation of the carrier 1 and prevent the grid part 2 from wrinkling.

[0062] The cross-sectional shape of the groove 102a is circular, rectangular, arc-shaped, elliptical, triangular or other shapes. All of the above grooves 102a can absorb deformation.

[0063] For example, as Figure 2 shown, the support layer (for example, the first support layer 101) connected to the grid part 2 is a solid structure, and the support layer (for example, the second support layer 102) located below the support layer (for example, the first support layer 101) has the groove 102a. In this example, the second support layer 102 can effectively absorb the deformation of the carrier 1.

[0064] In addition, the first support layer 101 can cooperate with the taking and placing of the dust-proof structure. For example, the dust-proof structure is transferred by means of grasping or vacuum suction. The clamping jaws or suction nozzles of the transfer device apply force to the first support layer 101. Since the first support layer 101 is a solid structure, it has a high structural strength. Compared with the second support layer 102, the first support layer 101 is less likely to be damaged by the clamping jaws or suction nozzles, so that the integrity of the dust-proof structure can be maintained during the taking and placing process.

[0065] Of course, in other examples, the positions of the first support layer 101 and the second support layer 102 are interchanged, and the dust-proof structure can be taken and placed by means of vacuum suction.

[0066] In one example, as Figure 11 shown, there are a plurality of the grooves 102a, and they are evenly distributed on the support layer where the stress relief part is located. For example, a plurality of grooves 102a are formed on the second support layer 102. The plurality of grooves 102a are distributed at different parts on the end face of the second support layer 102. In this way, the plurality of grooves 102a can absorb the deformation of the carrier 1 from different directions.

[0067] For example, a plurality of grooves 102a are evenly distributed around the hollow structure 104. In this way, the carrier 1 has a stronger ability to absorb deformation.

[0068] In one example, as Figure 11 shown, the through hole includes a plurality of arc-shaped grooves 102a arranged concentrically. A connecting part 112 is formed between adjacent arc-shaped grooves 102a. For example, the cross section of the hollow structure 104 is circular. A plurality of arc-shaped grooves 102a are arranged around the hollow structure 104. The arc-shaped grooves 102a are concentrically arranged with respect to the center of the hollow structure 104. The arc-shaped grooves 102a can effectively absorb the deformation of the edge part 110.

[0069] For example, as Figure 11As shown, there are four arc-shaped grooves 102a, which respectively cover the four corners of the square carrier 1 and are symmetrically structured with respect to the diagonal connection line, or cover the four sides and are symmetrically structured with respect to the perpendicular bisector of the side where they are located. This setting method makes the absorption and deformation ability of the elastic structure more balanced.

[0070] In one example, as Figure 11 shown, multiple layers of the arc-shaped grooves 102a are arranged radially on the carrier 1. For example, multiple layers of arc-shaped grooves 102a are arranged radially. Each layer is provided with a plurality of the arc-shaped grooves 102a. The multiple layers of arc-shaped grooves 102a can more effectively absorb the deformation of the carrier 1 and reduce stress concentration.

[0071] In addition, the connection parts 112 between multiple layers and each layer together form a framework structure, which has a greater elastic restoring force and makes the restoring deformation ability of the carrier 1 stronger.

[0072] For example, the number of layers of the arc-shaped grooves 102a is less than 5 layers. This makes the structural strength and anti-deformation ability of the carrier 1 stronger. Figure 11 In [reference], the arc-shaped grooves 102a are 2 layers, so that the structure of the carrier 1 becomes simple.

[0073] In one example, as Figure 11 shown, the connection parts 112 of adjacent two layers are arranged staggeredly. That is to say, the two connection parts 112 are not located on the same diameter direction. In this way, the connection parts 112 and the parts between each layer can form a grid connection. In this way, as long as a local deformation of the carrier 1 occurs, then this deformation will spread to other parts through the grid connection, and the deformation will be dispersed at each part of the grid connection. This makes the absorption and deformation ability of the elastic structure more balanced in all directions with respect to the hollow structure 104.

[0074] It can also be that the connection parts 112 of multiple layers are connected together to form a radial shape. In this example, the arc-shaped grooves 102a corresponding to the positions of multiple layers are distributed within the same sector structure. The radial connection structure makes the strength of the elastic structure greater.

[0075] In one example, a closed annular wall portion is formed inside the buffer portion. The annular wall portion can form a barrier to the elastic structure and improve the durability of the elastic structure.

[0076] In one example, as Figure 12As shown, the grid part 2 includes a grid structure, a stress buffer area 23 disposed around the grid structure, and a fixing part 22 disposed around the stress buffer area 23. Among them, the grid structure 21 and the stress buffer area 23 are suspended. Among them, the fixing part 22 can be used to connect the grid part 2 to the carrier 1. For example, the fixing part 22 is connected to the edge part so that the grid part 2 can stably cover the carrier 1. The stress buffer area 23 is an area where no mesh holes are provided and which is not connected to the edge part. The stress buffer area 23 can further reduce the influence of the deformation of the carrier on the grid structure.

[0077] In one example, as Figure 12 shown, the stress buffer area 23 is an annular structure with a predetermined width α. It should be noted that the stress buffer area 23 can be, for example, a circular ring structure with a predetermined width α, or a square ring structure with a predetermined width α, or other annular structures with a predetermined width α. Those skilled in the art can flexibly adjust according to specific situations, and the present disclosure does not limit this.

[0078] Figure 3 is a cross-sectional view of a dust-proof structure according to another embodiment of the present disclosure. In this example, the carrier further includes a third support layer 103. The third support layer 103 is a solid structure and is connected to the lower end surface of the second support layer 102. In this example, the third support layer 103 plays a role in strengthening the structure and can prevent the groove 102a from being exposed, which makes the structure of the carrier stronger.

[0079] In one example, the material of the grid part is metal. The carrier is metal or dry film resist. The above materials are easy to form a dust-proof structure.

[0080] Figures 5 - 7 is a flowchart of a method for manufacturing a dust-proof structure according to an embodiment of the present disclosure.

[0081] This manufacturing method is used to manufacture a dust-proof structure as Figure 3 shown. This manufacturing method includes:

[0082] S1. Dispose a sacrificial layer 108 on the wafer 107;

[0083] S2. Deposit a metal layer on the sacrificial layer 108;

[0084] S3. Form a sieve on the metal layer by etching and form a plurality of grid parts 2;

[0085] S4. Form a first support layer 101 on the grid portion. The first support layer 101 is made of a metal material. When preparing the first support layer 101, a dry film resist (DFR) is used to form a set pattern.

[0086] S5. Laminate and form a second support layer 102 on the first support layer 101. When preparing the second support layer 102, a dry film resist (DFR) is used to form a set pattern. The second support layer 102 includes an arc-shaped groove 102a.

[0087] S6. Form a third support layer 103 on the second support layer 102. When preparing the third support layer 103, a dry film resist (DFR) is used to form a set pattern.

[0088] S7. Cut the wafer 107 and etch away the sacrificial layer 108 to form a dust-proof structure.

[0089] This preparation method is simple, easy to operate, and has a high yield of the dust-proof structure.

[0090] In one example, as Figure 4 shown, the stress relief portion has a different material from other support layers except the support layer where it is located. Among them, the support layer where the stress relief portion is located has a smaller Young's modulus than other support layers. For example, the first support layer 101 is the stress relief portion. The first support layer 101 has a smaller Young's modulus than the second support layer 102. Due to the smaller Young's modulus, the first support layer 101 can absorb the deformation of the second support layer 102 through its own elastic deformation, so that the deformation will not be transmitted to the grid portion. In this way, the grid portion will not form wrinkles or breakages.

[0091] For example, the material of the first support layer 101 is an organic substance or a metal material, and the material of the second support layer 102 is an inorganic non-metallic material. The second support layer 102 is bonded to the PCB 105 through an adhesive 106.

[0092] Of course, the materials of each support layer are not limited to the above embodiments, and those skilled in the art can select according to actual needs.

[0093] According to another embodiment of the present disclosure, a microphone packaging structure is provided. The microphone packaging structure can be applied to various types of electronic products such as mobile phones, laptop computers, tablet computers, game consoles, walkie-talkies, VR devices, and smart wearable devices.

[0094] This microphone packaging structure can effectively avoid the phenomenon that internal chip components and other components are damaged by external dust, impurities and other particulate matters and foreign objects, can extend the service life of the MEMS microphone chip, and can also keep the MEMS microphone chip in excellent acoustic performance.

[0095] The specific structure of the microphone packaging structure provided by the embodiments of the present disclosure will be further described below.

[0096] As Figures 8 - 10 , and Figures 13 - 14 shown, the microphone packaging structure provided by the embodiments of the present disclosure includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is provided on the housing 3. The microphone packaging structure provided by the present disclosure further includes the dustproof structure as described above, and the dustproof structure is fixedly installed on the sound pickup hole 2. The dustproof structure can effectively protect the components inside the microphone packaging structure.

[0097] In one example, the shape of the sound pickup hole can be, for example, circular, square, triangular, oval, etc. The sound pickup hole can be provided as one or more according to needs. The specific setting position of the sound pickup hole can also be flexibly adjusted according to the specific situation of the microphone packaging structure, and the present disclosure does not limit this.

[0098] In one example, as Figure 8 shown, the dustproof structure can be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, installing the dustproof structure outside the microphone packaging structure does not occupy the internal space of the microphone packaging structure. When installing the dustproof structure, the position of the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned with the sound pickup hole 4, thereby preventing external particulate matter and foreign objects from entering the microphone packaging structure through the sound pickup hole 4.

[0099] Of course, in the present disclosure, it is not limited to setting the dustproof structure outside the housing 3, and the dustproof structure can also be provided in the receiving cavity of the housing 3. Those skilled in the art can flexibly adjust the setting position of the dustproof structure according to specific needs.

[0100] In one example, for the microphone packaging structure, the structure of its housing 3 is: including a substrate 32 and a packaging cover 31, and the receiving cavity is enclosed by the substrate 32 and the packaging cover 31 together. The dustproof structure is received in the receiving cavity of the housing 3.

[0101] In one example, as Figure 9 shown, the sound pickup hole is located on the packaging cover 31, and the dustproof structure is fixedly connected to the packaging cover. The position of the dustproof structure corresponds to the sound pickup hole 4, which can prevent external particulate matter and foreign objects from entering the microphone packaging structure through the sound pickup hole 4.

[0102] In one example, as Figure 10As shown, the sound pickup hole is located on the packaging cover 31, and the dustproof structure is fixedly connected to the position of the substrate 32 corresponding to the sound pickup hole 4. At this time, the dustproof structure can effectively protect the chip in the microphone packaging structure.

[0103] In the present invention, the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, but can also be opened on the substrate 32. Figure 13 As shown, the sound pickup hole 4 is located on the substrate 32, and the dustproof structure is fixedly arranged on the substrate 32 at a position corresponding to the sound pickup hole 4. Figure 14 As shown, the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly arranged at a position corresponding to the sound pickup hole 4 on the substrate 32, and the MEMS chip 5 is arranged on the dustproof structure. It should be noted that when the sound pickup hole 4 is opened on the substrate 32, those skilled in the art can adjust the installation position of the dustproof structure according to specific circumstances, as long as it can prevent external particles and foreign objects from entering or can protect the internal chip, and there is no limitation on this.

[0104] The packaging cover 31 is a dish-shaped structure with an open end. The material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board. The shape of the packaging cover 31 can be, for example, a cylindrical shape, a rectangular parallelepiped shape, etc. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

[0105] The substrate 32 may be a circuit board known in the art, such as a PCB, etc., without limitation. The packaging cover 31 and the substrate 32 may be fixed together, for example, by bonding with an adhesive or soldering with solder paste, and those skilled in the art may flexibly select the desired one, without limitation.

[0106] The microphone packaging structure provided by the present invention has a microphone device fixedly accommodated in the accommodating cavity of the housing 3. Specifically, Figures 8 - 10 , and as shown in 13-14, the microphone device may include a MEMS chip 5 and a signal amplifier 6, for example.

[0107] Wherein, the MEMS chip 5 includes a substrate and a sensing film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitor element, a piezoresistive element, etc. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the receiving cavity, the MEMS chip 5 can be mounted on the substrate 32. Of course, the MEMS chip 5 can also be mounted on the packaging cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 to the packaging cover 31. The MEMS chip 5 can also be turned on by the circuit layout in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art and will not be described in detail in the present invention.

[0108] The signal amplifier 6 can be mounted on the package cover 31, and can also be mounted on the substrate 32. The signal amplifier 6 can be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, and processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.

[0109] In addition, the MEMS chip 5 and / or the signal amplifier 6 may also be buried in the substrate 32, or half buried in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductor is, for example, a metallized through hole provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through the conductor. The design of burying the MEMS chip 5 and the signal amplifier 6 in the substrate 32 helps to achieve miniaturization of the microphone.

[0110] It should be noted that when the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer is required to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to optical noise.

[0111] The embodiment of the present disclosure also provides an electronic device, wherein the electronic device comprises the microphone packaging structure as described above.

[0112] The electronic device may be a mobile phone, a laptop computer, a tablet computer, a VR device, a smart wearable device, etc., and the present disclosure does not limit this.

[0113] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dust-proof structure, characterized in that: it includes a carrier and a grid part; the carrier is a hollow structure, the carrier includes a plurality of support layers arranged in a stacked manner, the plurality of support layers are connected together, and one of the plurality of support layers forms a stress relief part; the grid part includes a grid structure and a fixing part arranged around the grid structure, the fixing part is connected to the carrier, and the grid structure faces the hollow structure; the stress relief part has an in-plane structure different from that of other support layers except the support layer where it is located. Among them, the support layer where the stress relief part is located has grooves extending in the height direction, and at least one of the support layers is a solid structure, and the support layer where the solid structure is located is made of a metal material.

2. The dust-proof structure according to claim 1, characterized in that: the plurality of support layers include a top support layer, a bottom support layer, and an intermediate support layer located between the top support layer and the bottom support layer, wherein the intermediate support layer has the stress relief part.

3. The dust-proof structure according to claim 1, characterized in that: there are two support layers.

4. The dust-proof structure according to claim 1, characterized in that: there are three support layers, wherein the intermediate support layer has the grooves, and the other two support layers are solid structures.

5. The dust-proof structure according to claim 1, characterized in that: there are a plurality of the grooves, and they are evenly distributed on the support layer where the stress relief part is located.

6. The dust-proof structure according to claim 1, characterized in that: the cross-sectional shape of the groove is circular, rectangular, arc-shaped, elliptical or triangular.

7. A microphone packaging structure, characterized in that: it includes a housing having an accommodation cavity, and a sound pickup hole is provided on the housing; it further includes the dust-proof structure according to any one of claims 1-6, and the dust-proof structure faces the sound pickup hole.

8. The microphone packaging structure according to claim 7, characterized in that: the dust-proof structure is located outside the housing.

9. The microphone packaging structure according to claim 7, characterized in that: the housing includes a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodation cavity; the dust-proof structure is received in the accommodation cavity.

10. The microphone packaging structure according to claim 7, characterized in that: the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.

11. The microphone packaging structure according to claim 9, characterized in that: the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate.

12. The microphone packaging structure according to claim 9, characterized in that: the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly provided at a position corresponding to the sound pickup hole on the substrate.

13. The microphone packaging structure according to claim 9, characterized in that: the sound pickup hole is located on the substrate, the dust-proof structure is fixedly provided at a position corresponding to the sound pickup hole on the substrate, and the MEMS chip is arranged on the dust-proof structure.

14. An electronic device, characterized in that: Comprising a microphone packaging structure as described in any one of claims 7-13.

Images