Bonding device and bonding method

Abstract

The present application relates to a bonding device and a bonding method. The bonding device includes: an anisotropic conductive film ("ACF") attaching unit that attaches a first ACF and a second ACF to a display panel assembly; a compression unit that compresses a first chip on film ("COF") on the first ACF and a second COF on the second ACF; and a buffer unit that rotates the display panel assembly on which the first ACF and the first COF are compressed on a plane.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2018-0134621, filed on November 5, 2018, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure generally relates to bonding apparatus and bonding methods. Background Art

[0004] Typically, a display device includes a drive circuit connected to a signal line for providing a signal. The drive circuit is typically implemented by an integrated circuit ("IC") chip. The IC chip may include or be configured with a chip on film ("COF"), in which a plurality of conductive leads are formed on an insulating film such as polyimide. The COF may be referred to as a tape carrier package ("TCP"). The COF may be attached to a display panel assembly by a tape automated bonding ("TAB") process. The drive circuit attached as described above is electrically connected to the signal lines of the display panel assembly via the leads of the COF.

[0005] The leads of the COF may include a plurality of output side leads and a plurality of input side leads connected to the output and input ends of the IC chip, respectively. The signal lines of the display panel assembly may include a plurality of connection pads located near the edge of the display panel assembly. The output side leads of the COF may be mechanically and electrically connected to the connection pads of the display panel assembly, and the input side leads of the COF may be connected to a printed circuit board ("PCB") for transmitting a plurality of signals to the driver IC by welding, etc. The output end of the COF and the connection pads of the display panel assembly may be attached to each other by an anisotropic conductive film ("ACF"). Summary of the invention

[0006] Embodiments provide a bonding apparatus and a bonding method, which simplifies the layout of process equipment through conveyance and rotation during a tape automated bonding ("TAB") process of a chip on film ("COF").

[0007] According to an embodiment of the present disclosure, a bonding device includes: an anisotropic conductive film ("ACF") attaching unit that attaches a first ACF and a second ACF to a display panel assembly; a compression unit that compresses a first COF on the first ACF and a second COF on the second ACF; and a buffer unit that rotates the display panel assembly on which the first ACF and the first COF are compressed.

[0008] In an embodiment, each of the ACF attaching unit, the compression unit, and the buffer unit may include a conveyor that transfers the display panel assembly in a first direction from the ACF attaching unit toward the compression unit and in a second direction from the compression unit toward the ACF attaching unit.

[0009] In an embodiment, the buffer unit may be disposed before the ACF attaching unit, and rotate the display panel assembly transferred from the ACF attaching unit by about 180 degrees, and then transfer the rotated display panel assembly to the ACF attaching unit.

[0010] In an embodiment, the ACF attaching unit may transfer the display panel assembly to which the first ACF is attached to the compression unit, and attach the second ACF to the display panel assembly rotated by the buffer unit.

[0011] In an embodiment, the compression unit may transfer the display panel assembly having the first COF compressed thereon to the ACF attaching unit, and transfer the display panel assembly having the second COF compressed thereon to the outside.

[0012] In an embodiment, the buffer unit may be disposed behind the compression unit, and rotate the display panel assembly transferred from the compression unit by about 180 degrees, and then transfer the rotated display panel assembly to the compression unit.

[0013] In an embodiment, the ACF attaching unit may transfer the display panel assembly to which the first ACF is attached to the compression unit, and attach the second ACF to the display panel assembly transferred from the compression unit.

[0014] In an embodiment, the compression unit may transfer the display panel assembly on which the first COF and the second COF are compressed to the buffer unit, and deliver the display panel assembly rotated in the buffer unit to the ACF attaching unit.

[0015] In an embodiment, the bonding apparatus may further include: a first ACF transfer unit disposed at one side of the ACF attachment unit, wherein the first ACF transfer unit may provide a first ACF; and a second ACF transfer unit disposed at an opposite side of the ACF attachment unit, wherein the second ACF transfer unit may provide a second ACF.

[0016] In an embodiment, the bonding apparatus may further include: a first COF transfer unit disposed at one side of the compression unit, wherein the first COF transfer unit may provide a first COF; and a second COF transfer unit disposed at an opposite side of the compression unit, wherein the second COF transfer unit may provide a second COF.

[0017] In an embodiment, the connection pads on the display panel assembly may be aligned adjacent to the first ACF transfer unit, and when the display panel assembly is rotated by the buffer unit, the connection pads on the display panel assembly may be aligned adjacent to the second ACF transfer unit.

[0018] In an embodiment, the first COF may be electrically connected to a first connection pad on the display panel assembly, and the second COF may be electrically connected to a second connection pad on the display panel assembly.

[0019] In an embodiment, the first and second connection pads may be connected to the first and second sub-pixels, respectively.

[0020] In an implementation, the first COF and the second COF may be misaligned with each other in an extending direction of the gate line.

[0021] In an embodiment, the compression unit may include: a preliminary compression unit that preliminarily compresses the first COF on the first ACF and preliminarily compresses the second COF on the second ACF; and a main compression unit that mainly compresses the preliminarily compressed first COF and the preliminarily compressed second COF.

[0022] According to another embodiment of the present disclosure, the bonding method includes: a first TAB process, including attaching a first ACF and a first COF to a display panel assembly while transferring the display panel assembly in a first direction; a re-transfer process, including conveying the display panel assembly in a second direction opposite to the first direction and rotating the display panel assembly on a plane; and a second TAB process, including attaching a second ACF and a second COF to the display panel assembly while transferring the rotated display panel assembly in the first direction.

[0023] In an embodiment, the first TAB process, the re-transfer process, and the second TAB process may be performed by a bonding apparatus including a conveyor conveying the display panel assembly in a first direction and a second direction.

[0024] In an embodiment, the re-transfer process may include: re-transferring the display panel assembly transferred in the first direction in the second direction; and rotating the re-transferred display panel assembly by about 180 degrees.

[0025] In an embodiment, the re-transfer process may include: rotating the display panel assembly transferred in the first direction; and re-transferring the display panel assembly in the second direction.

[0026] According to another embodiment of the present disclosure, the bonding method includes: a first TAB process, including attaching a first ACF to a display panel assembly in an ACF attaching unit, and compressing a first COF on the first ACF in a compression unit while transferring the display panel assembly in a first direction; a re-transfer process, including re-transferring the display panel assembly in a second direction opposite to the first direction, and rotating the display panel assembly on a plane; and a second TAB process, including attaching a second ACF to the display panel assembly in the ACF attaching unit, and compressing a second COF on the second ACF in the compression unit while transferring the rotated display panel assembly in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other features of the present invention will become more apparent by further describing exemplary embodiments of the present invention in detail with reference to the accompanying drawings, in which:

[0028] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure;

[0029] Figure 2 yes Figure 1 an enlarged plan view of a portion A of the

[0030] Figure 3 yes Figure 1 a side view of a portion A of;

[0031] Figure 4 is a block diagram showing the structure of a bonding device according to an embodiment of the present disclosure;

[0032] Figure 5 is a block diagram showing the structure of a bonding apparatus according to an alternative embodiment of the present disclosure; and

[0033] Figures 6 to 9 is a plan view illustrating a bonding method according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] The present invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure is comprehensive and complete, and will fully convey the scope of the present invention to those skilled in the art. Throughout the specification, the same reference numerals represent the same elements.

[0035] In the accompanying drawings, for clarity, the thickness of some lines, layers, components, elements or features may be magnified. It should be understood that although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the "first" element discussed below can be referred to as the "second" element. As used herein, the singular form is intended to also include the plural form, unless the context clearly states otherwise.

[0036] It will be further understood that when used in this specification, the terms "includes" and / or "including" specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence and / or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In addition, the expression that an element such as a layer, region, substrate or plate is placed "on" or "above" another element not only indicates that the element is "directly" placed "on" or "just" placed "above" another element, but also indicates that another element is inserted between the element and the other element. On the contrary, when an element is referred to as "directly on" another element, there is no intervening element. On the contrary, the expression that an element such as a layer, region, substrate or plate is placed "below" or "below" another element not only indicates that the element is "directly" placed "below" or "just" placed "below" another element, but also indicates that another element is inserted between the element and the other element.

[0037] The terms used herein are used only for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an", and "the" are intended to include plural forms, including "at least one". "Or" means "and / or". "At least one of A and B" means "A and / or B". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0038] As used herein, "about" or "approximately" includes the stated value and the average within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0039] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0040] Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0041] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0042] refer to Figure 1 , an embodiment of the display device 1000 includes a display panel 900 and a driver 300. The display panel 900 may include a thin film transistor ("TFT") substrate 100 and an opposing substrate 200. The display panel 900 may include a display area DA in which the TFT substrate 100 and the opposing substrate 200 overlap each other and a peripheral area PA in which the TFT substrate 100 and the opposing substrate 200 do not overlap each other when viewed from a plan view in a thickness direction of the display panel 900.

[0043] The TFT substrate 100 may include gate lines GL1 to GLn, source lines SL1 to SLm, and sub-pixels (or pixels) PX connected to the gate lines GL1 to GLn and the source lines SL1 to SLm.

[0044] The driver 300 includes a source driving circuit 320 and a gate driving circuit 310. The driver 300 is disposed in the peripheral area PA to provide gate signals and source signals provided from a printed circuit board ("PCB") 2000 to the gate lines GL1 to GLn and the source lines SL1 to SLm, respectively.

[0045] The driver 300 is disposed on or adhered to the peripheral area PA of the display panel 900 . Figure 1 An embodiment is shown in which the gate driving circuit 310 is disposed or formed only at one side of the display area DA. Alternatively, the gate driving circuit 310 may be disposed at one side or both sides of the display area DA to be connected to the gate lines GL1 to GLn. The source driving circuit 320 may be disposed or formed at the upper side of the display area DA to be connected to one end of the source lines SL1 to SLm.

[0046] In an embodiment, if Figure 1As shown in FIG. 3 , three source driving circuits 320 and three gate driving circuits 310 may be provided, but the present disclosure is not limited thereto.

[0047] Figure 2 yes Figure 1 An enlarged plan view of portion A of FIG. Figure 3 yes Figure 1 Side view of portion A of FIG.

[0048] refer to Figures 1 to 3 , an embodiment of a display device 1000 includes a display panel assembly 110 , source connection pads SP1 and SP2 , and source driving circuits 321 and 322 .

[0049] The display panel assembly 110 may include a TFT substrate 100 in which at least one sub-pixel PX1 and PX2 is disposed, and an opposite substrate 200. The opposite substrate 200 may be disposed in a display area DA on the TFT substrate 100.

[0050] A plurality of sub-pixels PX1 and PX2 are defined or formed in the display area DA. The sub-pixels PX1 and PX2 may be connected to source lines SL1 and SL2, respectively. Figure 2 As shown in FIG. 1 , the first subpixel PX1 and the second subpixel PX2 are arranged on different rows that do not overlap each other in the horizontal direction.

[0051] Source connection pads SP1 and SP2 extending from source lines SL1 and SL2, respectively, may be disposed or formed in the peripheral area PA on the TFT substrate 100. Figure 2 As shown in , the first source connection pad SP1 extends from the first source line SL1 connected to the first sub-pixel PX1, and the second source connection pad SP2 extends from the second source line SL2 connected to the second sub-pixel PX2. In such an embodiment, the first source connection pad SP1 and the second source connection pad SP2 may be arranged on different rows that do not overlap each other in the horizontal direction. In this context, the horizontal direction may be when the first source connection pad SP1 is connected to the first sub-pixel PX1. Figure 2 The direction is perpendicular to the extending direction of the source lines SL1 and SL2 when viewed in the plan view shown in .

[0052] The source driver circuits 321 and 322 may be formed using a chip on film ("COF") including a substrate film (not shown) and a plurality of conductive leads (not shown) formed on the substrate film. The substrate film may be an insulating film including or made of polyimide or the like. The conductive leads may include or be made of a conductive material such as copper (Cu), nickel (Ni), or gold (Au).

[0053] When the base film is attached to the source connection pads SP1 and SP2, some of the conductive leads (e.g., input side leads) may be electrically connected to the source lines SL1 and SL2 through the source connection pads SP1 and SP2. In an embodiment, the conductive leads of the first source driver circuit 321 may be electrically connected to the first source connection pads SP1. In addition, the conductive leads of the second source driver circuit 322 may be electrically connected to the second source connection pads SP2.

[0054] like Figure 3 As shown in , in an embodiment, the second source driving circuit 322 may have an area larger than that of the first source driving circuit 321 to be electrically connected to the second source connection pads SP2 disposed on a row different from the row of the first source connection pads SP1.

[0055] The source driving circuits 321 and 322 extend to the outside of the TFT substrate 100 to be adhered to the PCB 2000. Some conductive leads (eg, output side leads) disposed at extended portions of the conductive leads of the source driving circuits 321 and 322 may be electrically connected to the PCB 2000.

[0056] The source driving circuits 321 and 322 may be attached to the source connection pads SP1 and SP2 through an anisotropic conductive film ACF using a tape automated bonding (“TAB”) process.

[0057] The anisotropic conductive film ACF may include a polymer resin PL cured by heating and conductive particles CP dispersed in the polymer resin PL. When heat and pressure are applied to the anisotropic conductive film ACF, the polymer resin PL may melt, and the conductive particles CP may electrically connect the conductive lead to the source connection pads SP1 and SP2. Therefore, the anisotropic conductive film ACF has both conductive properties and adhesive properties. The conductive particles CP may include metals such as carbon fibers, nickel (Ni) and platinum (Pt) or compounds thereof. In such an embodiment, the polymer resin PL may include styrene-butadiene rubber, polyethylene, butylene, epoxy resin, polyurethane or acrylic resin.

[0058] An anisotropic conductive film ACF is interposed between the source driving circuits 321 and 322 and the source connection pads SP1 and SP2 to electrically and physically connect the source driving circuits 321 and 322 to the source connection pads SP1 and SP2.

[0059] In the embodiment, although not shown in the drawings, Figure 1 The gate driving circuit 310 may be attached to the display panel assembly 110 using a method that is the same as or similar to the method used to attach the source driving circuit 320 .

[0060] Hereinafter, embodiments of a bonding device and a bonding method for attaching the source driving circuits 321 and 322 to the display panel assembly 110 will be described in detail.

[0061] Figure 4 is a block diagram showing the structure of a bonding apparatus according to an embodiment of the present disclosure. Figure 5 is a block diagram showing the structure of a bonding device according to an alternative embodiment of the present disclosure. Figure 4 and Figure 5 , an embodiment of the bonding apparatus according to the present disclosure includes a COF bonding process unit 10 and a PCB bonding process unit 20 .

[0062] The gate bonding unit 11 performs a process of bonding or connecting the gate driving circuit 310 to the gate connection pad formed on the display panel assembly 110. The bonding of the gate driving circuit 310 may be performed using a method that is the same as or similar to the method for bonding the source driving circuit 320, but the detailed process method is not particularly limited. Alternatively, the gate bonding unit 11 may be omitted.

[0063] The source bonding unit 12 may include an ACF attaching unit 121 , a preliminary compression unit 122 , a main compression unit 123 , a buffer unit 124 , a first ACF transfer unit 125 , a second ACF transfer unit 126 , a first COF transfer unit 127 , and a second COF transfer unit 128 .

[0064] The ACF attaching unit 121 attaches the ACF to the source connection pads SP1 and SP2 disposed or formed on the display panel assembly 110. In an embodiment of the present disclosure, the ACF attaching unit 121 may receive the ACF transferred from the first ACF transfer unit 125 or the second ACF transfer unit 126, and attach the transferred ACF to the source connection pads SP1 and SP2 of the display panel assembly 110. In one embodiment, for example, the ACF attaching unit 121 may attach the first ACF transferred from the first ACF transfer unit 125 to the source connection pads SP1 and SP2 during a first TAB process to be described later, and attach the second ACF transferred from the second ACF transfer unit 126 to the source connection pads SP1 and SP2 during a second TAB process to be described later.

[0065] The preliminary compression unit 122 may preliminarily compress the COF defining the source driver circuits 321 and 322 on the ACF. In an embodiment of the present disclosure, the preliminary compression unit 122 may preliminarily compress the first COF for forming the first source driver circuit 321 and transferred from the first COF transfer unit 127 on the first ACF, and preliminarily compress the second COF for forming the second source driver circuit 322 and transferred from the second COF transfer unit 128 on the second ACF.

[0066] The main compression unit 123 may mainly compress the preliminarily compressed COF. In an embodiment of the present disclosure, the main compression unit 123 may mainly compress the preliminarily compressed first COF on the first ACF, and may mainly compress the preliminarily compressed second COF on the second ACF.

[0067] In an embodiment of the present disclosure, the preliminary compression unit 122 and the main compression unit 123 may include a compression head and a compression tip, wherein a heat source is installed in the compression head and the compression tip is attached to one end of the compression head to compress the COF on the ACF. The heat source of the compression head may be, for example, a heating coil, and the heat generated from the heat source is applied to the ACF so that bonding can be performed more efficiently or more easily through the conductive particles in the ACF. The compression tip may compress the COF toward the ACF while rising and falling through a tip lifter that may include or be configured with a cylinder or a motor.

[0068] In such an embodiment, the configuration of the preliminary compression unit 122 and the main compression unit 123 is not limited to the above configuration. In an embodiment, the preliminary compression unit 122 and the main compression unit 123 may not include some of the above components, or may further include other components.

[0069] The buffer unit 124 rotates the display panel assembly 110 by about 180 degrees during the re-transfer process between the first TAB process and the second TAB process, which will be described later. In an embodiment, the buffer unit 124 may include an ascending / descending member for allowing the display panel assembly 110 to ascend / descend and a rotating member for rotating the display panel assembly 110. In one embodiment, for example, the ascending / descending member may hold the display panel assembly 110 and allow the display panel assembly 110 held by the pressure of a cylinder or the rotational power of a motor to ascend or descend. In an embodiment, the rotating member may include, for example, a motor for rotating the display panel assembly 110 interlocked with the ascending / descending member by about 180 degrees, etc.

[0070] However, the configuration of the buffer unit 124 is not limited thereto, and the buffer unit 124 may have any component capable of rotating the display panel assembly 110 180 degrees such that the upper and lower sides of the display panel assembly 110 are reversed.

[0071] In an embodiment, each of the ACF attaching unit 121, the preliminary compression unit 122, the main compression unit 123, and the buffer unit 124 may include or be configured with a conveyor that accommodates the display panel assembly 110 and is capable of transferring in two directions. Each of the conveyors in the ACF attaching unit 121, the preliminary compression unit 122, the main compression unit 123, and the buffer unit 124 transfers (primarily transfers) the display panel assembly 110 in the first direction (i.e., the direction from the gate bonding unit 11 to the PCB bonding process unit 20) during the first TAB process and the second TAB process. In an embodiment, each of the conveyors in the ACF attaching unit 121, the preliminary compression unit 122, the main compression unit 123, and the buffer unit 124 re-transfers (secondarily transfers) the display panel assembly 110 in the second direction (i.e., the direction from the PCB bonding process unit 20 to the gate bonding unit 11) during the conveying process between the first TAB process and the second TAB process.

[0072] In an embodiment, if Figure 4 As shown in , the buffer unit 124 may be disposed between the gate bonding unit 11 and the ACF attaching unit 121, but the present disclosure is not limited thereto. Figure 5 As shown in FIG. 1 , the buffer unit 124 may be disposed between the main compression unit 123 and the PCB bonding process unit 20 .

[0073] In an embodiment, when the buffer unit 124 is disposed between the gate bonding unit 11 and the ACF attaching unit 121, the display panel assembly 110 is transferred to the buffer unit 124 to be transferred via the main compression unit 123, the preliminary compression unit 122, and the ACF attaching unit 121 during the above-mentioned re-transfer process. The buffer unit 124 may rotate the re-transferred display panel assembly 110.

[0074] In such an embodiment, when the buffer unit 124 is disposed between the main compression unit 123 and the PCB bonding process unit 20, the buffer unit 124 rotates the display panel assembly 110 during the above-mentioned re-transfer process, and then re-transfers the rotated display panel assembly 110 to the main compression unit 123. Then, the rotated display panel assembly 110 is conveyed via the main compression unit 123, the preliminary compression unit 122, and the ACF attaching unit 121.

[0075] The PCB bonding process unit 20 performs a process allowing the PCB to be adhered to the first COF and the second COF, wherein the first COF and the second COF are attached to the display panel assembly 110 transferred from the COF bonding process unit 10. The bonding of the PCB may be performed using a method that is the same as or similar to the method for bonding the source driving circuit 320, but the specific processing method is not particularly limited.

[0076] Figures 6 to 9 is a plan view illustrating a bonding method according to an embodiment of the present disclosure.

[0077] refer to Figures 1 to 9 , an embodiment of the bonding method may include a first TAB process, a re-transfer process, and a second TAB process. During the first TAB process and the second TAB process, the display panel assembly 110 is transferred in a first direction (i.e., a direction from the gate bonding unit 11 to the PCB bonding process unit 20), and during the re-transfer process, the display panel assembly 110 is transferred in a second direction (i.e., a direction from the PCB bonding process unit 20 to the gate bonding unit 11).

[0078] like Figure 6 As shown in FIG. 1 , during the first TAB process, the display panel assembly 110 is transferred to the ACF attaching unit 121 in a state where the gate driving circuit 310 is attached by the gate adhesive unit 11. In an embodiment, as shown in FIG. Figure 6 As shown in FIG. 1 , the gate driving circuit 310 is attached to both sides of the display panel assembly 110 , but is not limited thereto. Alternatively, the gate driving circuit 310 may be attached to only one side of the display panel assembly 110 .

[0079] The display panel assembly 110 is transferred in a state where the side surface formed with the source connection pads SP1 and SP2 is aligned adjacent to the first ACF transfer unit 125. In an embodiment, when the buffer unit 124 is located between the gate bonding unit 11 and the ACF attaching unit 121, the display panel assembly 110 may be transferred to the ACF attaching unit 121 via the buffer unit 124.

[0080] During the first TAB process, the ACF attaching unit 121 attaches the first ACF transferred from the first ACF transferring unit 125 to the first source connection pad SP1 on the display panel assembly 110 .

[0081] The preliminary compression unit 122 preliminarily compresses the first COF transferred from the first COF transfer unit 127 on the first ACF, and the main compression unit 123 mainly compresses the first COF. The first COF is used to form the first source driving circuit 321, and may include a conductive wire to be electrically connected to the first source connection pad SP1. Figure 7 , a first COF attached to the display panel assembly 110 through such a process is shown in FIG.

[0082] The re-transfer process is performed after the first TAB process. During the re-transfer process, the display panel assembly 110 is rotated and re-transferred.

[0083] In an embodiment, if Figure 4 As shown in FIG, after the first COF is primarily compressed, the display panel assembly 110 is transported from the primary compression unit 123 to the buffer unit 124 via the preliminary compression unit 122 and the ACF attaching unit 121. The buffer unit 124 rotates the re-transferred display panel assembly 110 by 180 degrees, and then transfers the rotated display panel assembly 110 to the ACF attaching unit 121.

[0084] In an alternative embodiment, if Figure 5 As shown in FIG. 1 , after the first COF is primarily compressed, the display panel assembly 110 is transferred to the buffer unit 124. The buffer unit 124 rotates the conveyed display panel assembly 110 by 180 degrees. Subsequently, the rotated display panel assembly 110 is re-transferred from the buffer unit 124 to the ACF attaching unit 121 via the primary compression unit 123 and the preliminary compression unit 122.

[0085] like Figure 8 As shown in , the upper and lower sides of the display panel assembly 110 are reversed by rotation so that the side surface where the source connection pads SP1 and SP2 are formed is aligned adjacent to the second ACF transfer unit 126 .

[0086] The second TAB process is performed after the re-transfer process. During the second TAB process, the ACF attaching unit 121 attaches the second ACF transferred from the second ACF transfer unit 126 to the second source connection pad SP2 on the display panel assembly 110. The first ACF and the first COF attached in the first TAB process are interposed between the second ACF and the second source connection pad SP2.

[0087] The preliminary compression unit 122 preliminarily compresses the second COF transferred from the second COF transfer unit 128 on the second ACF, and the main compression unit 123 mainly compresses the preliminarily compressed second COF. The second COF is used to form the second source driving circuit 322, and may include a conductive lead to be electrically connected to the second source connection pad SP2. Fig. 9 , a second COF attached to the display panel assembly 110 through such a process is shown in FIG.

[0088] As described above, after the source driving circuits 321 and 322 are adhered to the display panel assembly 110 , the display panel assembly 110 may be transferred to the PCB bonding process unit 20 .

[0089] As described above, according to the embodiments of the present disclosure, a bonding process can be efficiently performed through two TAB processes and a re-transfer process provided between the two TAB processes without increasing the layout of bonding process equipment.

[0090] In this article, the bonding process of the source driver circuit is described in detail. However, without departing from the technical spirit and scope of the present disclosure, this bonding process can be applied to the gate driver circuit and PCB bonding.

[0091] In the embodiments of the bonding apparatus and the bonding method according to the present disclosure, the layout of process equipment can be reduced in the TAB process of COF.

[0092] Exemplary embodiments of the present invention have been disclosed herein, and although specific terms are employed, the specific terms are used and interpreted only in a general and descriptive sense and not for the purpose of limitation. In some cases, as will be apparent to one of ordinary skill in the art at the time of filing this application, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly noted. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present invention as set forth in the appended claims.

Claims

1. A bonding device, comprising: an anisotropic conductive film attaching unit, attaching the first anisotropic conductive film and the second anisotropic conductive film to the thin film transistor substrate of the display panel assembly; a compression unit that compresses a first chip-on-film onto the first anisotropic conductive film, and compresses a second chip-on-film having an area larger than that of the first chip-on-film onto the second anisotropic conductive film; as well as The buffer unit rotates the display panel assembly on which the first anisotropic conductive film and the first chip-on-film are compressed by 180 degrees, Wherein, the first chip on film and the second chip on film partially overlap.

2. The bonding device according to claim 1, wherein: Each of the anisotropic conductive film attaching unit, the compression unit, and the buffer unit includes a conveyor that transfers the display panel assembly in a first direction from the anisotropic conductive film attaching unit toward the compression unit and transfers the display panel assembly in a second direction from the compression unit toward the anisotropic conductive film attaching unit.

3. The bonding device according to claim 1, wherein: The buffer unit is disposed before the anisotropic conductive film attaching unit, and rotates the display panel assembly transferred from the anisotropic conductive film attaching unit by 180 degrees, and then transfers the rotated display panel assembly to the anisotropic conductive film attaching unit, and The anisotropic conductive film attaching unit transfers the display panel assembly to which the first anisotropic conductive film is attached to the compression unit, and attaches the second anisotropic conductive film to the display panel assembly rotated in the buffer unit.

4. The bonding device according to claim 1, wherein: The buffer unit is disposed before the anisotropic conductive film attaching unit, and rotates the display panel assembly transferred from the anisotropic conductive film attaching unit by 180 degrees, and then transfers the rotated display panel assembly to the anisotropic conductive film attaching unit, and The compression unit transfers the display panel assembly on which the first chip on film is compressed to the anisotropic conductive film attaching unit, and transfers the display panel assembly on which the second chip on film is compressed to the outside.

5. The bonding device according to claim 1, wherein: The buffer unit is disposed behind the compression unit, and rotates the display panel assembly transferred from the compression unit by 180 degrees, and then transfers the rotated display panel assembly to the compression unit, and The anisotropic conductive film attaching unit transfers the display panel assembly to which the first anisotropic conductive film is attached to the compression unit, and attaches the second anisotropic conductive film to the display panel assembly transferred from the compression unit.

6. The bonding device according to claim 1, wherein: The buffer unit is disposed behind the compression unit, and rotates the display panel assembly transferred from the compression unit by 180 degrees, and then transfers the rotated display panel assembly to the compression unit, and The compression unit transfers the display panel assembly on which the first chip on film and the second chip on film are compressed to the buffer unit, and conveys the display panel assembly rotated in the buffer unit to the anisotropic conductive film attaching unit.

7. The bonding device according to claim 2, further comprising: a first anisotropic conductive film transfer unit disposed at one side of the anisotropic conductive film attachment unit, wherein the first anisotropic conductive film transfer unit provides the first anisotropic conductive film; and A second anisotropic conductive film transfer unit is disposed at an opposite side of the anisotropic conductive film attachment unit, wherein the second anisotropic conductive film transfer unit provides the second anisotropic conductive film.

8. The bonding device according to claim 7, further comprising: a first chip-on-film transfer unit disposed at one side of the compression unit, wherein the first chip-on-film transfer unit provides the first chip-on-film; and A second chip-on-film transfer unit is disposed at an opposite side of the compression unit, wherein the second chip-on-film transfer unit provides the second chip-on-film.

9. The bonding device according to claim 8, wherein: The connection pads on the display panel assembly are aligned adjacent to the first anisotropic conductive film transfer unit, and when the display panel assembly is rotated by the buffer unit, the connection pads on the display panel assembly are aligned adjacent to the second anisotropic conductive film transfer unit.

10. The bonding device according to claim 1, wherein: The first chip on film is electrically connected to a first connection pad on the display panel assembly, and The second chip on film is electrically connected to a second connection pad on the display panel assembly, The first connection pad and the second connection pad are connected to the first sub-pixel and the second sub-pixel respectively.

11. Bonding methods, including: A first tape automated bonding process includes attaching a first anisotropic conductive film and a first chip-on-film to a thin film transistor substrate of a display panel assembly while transferring the display panel assembly in a first direction; a re-transfer process, comprising conveying the display panel assembly in a second direction opposite to the first direction and rotating the display panel assembly 180 degrees on a plane; as well as a second tape automated bonding process, comprising attaching a second anisotropic conductive film and a second chip-on-film having an area larger than that of the first chip-on-film to the thin film transistor substrate of the display panel assembly while transferring the rotated display panel assembly in the first direction, Wherein, the first chip on film and the second chip on film partially overlap.

12. The bonding method according to claim 11, wherein: The first TABB process, the re-transfer process, and the second TABB process are performed by a bonding apparatus including a conveyor conveying the display panel assembly in the first direction and the second direction.

13. The bonding method according to claim 11, wherein: The re-transfer process includes: re-transferring the display panel assembly transferred in the first direction in the second direction; and The re-transferred display panel assembly is rotated 180 degrees.

14. The bonding method according to claim 11, wherein: The re-transfer process includes: rotating the display panel assembly translated in the first direction; and The display panel assembly is re-transferred in the second direction.

15. Bonding methods, including: a first tape automated bonding process, comprising attaching a first anisotropic conductive film to a thin film transistor substrate of a display panel assembly in an anisotropic conductive film attaching unit, and compressing a first chip on film on the first anisotropic conductive film in a compressing unit while transferring the display panel assembly in a first direction; a re-transferring process, comprising re-transferring the display panel assembly in a second direction opposite to the first direction and rotating the display panel assembly 180 degrees on a plane; as well as a second tape automated bonding process, comprising attaching a second anisotropic conductive film to the thin film transistor substrate of the display panel assembly in the anisotropic conductive film attaching unit, and compressing a second chip on film having an area larger than that of the first chip on film on the second anisotropic conductive film in the compressing unit while transferring the rotated display panel assembly in the first direction, Wherein, the first chip on film and the second chip on film partially overlap.

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