Component crimping device and component crimping method

Abstract

Provided are a component crimping device and a component crimping method capable of suppressing a reduction in mounting accuracy. A component crimping device (100) is provided with: a placement section (12a) on which a substrate (2) on which a component (3) is disposed via an anisotropic conductive film (4) is placed, such that a main surface (3a) faces the substrate; a crimping part (21) provided with a crimping tool (33) having a pressing surface (33a) and a heater (35) for heating the crimping tool; a movement mechanism (12b) that moves the placement unit; and a control unit (310) that controls the movement mechanism (12b) and the crimping unit (21), the pressing surface (33a) having a fourth region (A4) and a fifth region (A5) for pressing the component (3) during thermocompression bonding, and a recess (33b) located between the fourth region and the fifth region, the control unit (310) causing the movement mechanism (12b) to move the placement unit (12a) such that the third region (A3) overlaps the recess (33b), and thereafter causing the crimping unit (21) to perform thermocompression bonding of the component (3) to the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a component press bonding apparatus and a component press bonding method for press bonding a component on a substrate. BACKGROUND

[0002] Conventionally, there is a component press bonding apparatus for press bonding a component such as a drive circuit on a substrate. In Patent Literature 1, there is disclosed a bonding method in which, when an IC (Integrated Circuit) component is mounted on an electrode provided in a flat panel display, in the case where an anisotropic conductive adhesive or film is used as a medium for bonding, after the temperature of the IC component, which is preliminarily heated, is sensed by a sensor and it is determined that the given temperature is reached, the IC component is mounted on the flat panel display.

[0003] PRIOR ART LITERATURE

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 8-330393 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In recent years, the number of bumps (bump electrodes) provided in a component such as an IC is larger than ever before. When the number of bumps provided in a component is large, in press bonding the component on a substrate, there is a case where the mounting accuracy is reduced due to the influence of the bumps provided in the component, such that the component is not mounted at a proper position in the substrate or the like.

[0008] The present application provides a component press bonding apparatus and the like capable of suppressing the reduction in mounting accuracy.

[0009] MEANS FOR SOLVING THE PROBLEMS

[0010] A component press bonding device according to an embodiment of the present application is a component press bonding device that thermally press-bonds a component having a main surface to a substrate via an anisotropic conductive film, the main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region between the first region and the second region in which no bump electrode is arranged, the component press bonding device including: a placement portion that places the substrate with the component arranged via the anisotropic conductive film such that the main surface faces the substrate; a press bonding portion that includes a press bonding tool having a press surface and a heater that heats the press bonding tool; a moving mechanism that moves the placement portion; and a control portion that controls the moving mechanism and the press bonding portion, the press surface including a fourth region and a fifth region that press the component in the thermal press bonding, and a recess between the fourth region and the fifth region, the control portion moving the placement portion such that the third region overlaps with the recess, and then causing the press bonding portion to perform the thermal press bonding of the component to the substrate.

[0011] A component press bonding method according to an embodiment of the present application is a component press bonding method performed by a component press bonding device that thermally press-bonds a component having a main surface to a substrate via an anisotropic conductive film, the main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region between the first region and the second region in which no bump electrode is arranged, the component press bonding device including: a placement portion that places the substrate with the component arranged via the anisotropic conductive film such that the main surface faces the substrate; a press bonding portion that includes a press bonding tool having a press surface and a heater that heats the press bonding tool; and a moving mechanism that moves the placement portion, the press surface including a fourth region and a fifth region that press the component in the thermal press bonding, and a recess between the fourth region and the fifth region, in the component press bonding method, the placement portion is moved such that the third region overlaps with the recess, and then the press bonding portion is caused to perform the thermal press bonding of the component to the substrate.

[0012] -Effects of Invention-

[0013] According to the present application, it is possible to provide a component press bonding device or the like that can suppress a decrease in mounting accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a block diagram showing the structure of a component press bonding device according to an embodiment.

[0015] Figure 2 is a perspective view showing a detailed structure of a thermal press bonding mechanism according to an embodiment.

[0016] Figure 3 is a side view showing a specific structure of a hot press bonding mechanism according to the embodiment.

[0017] Figure 4 is a view showing a component according to the embodiment.

[0018] Figure 5 is a view showing a press bonding tool according to the embodiment.

[0019] Figure 6 is a view for explaining a positional relationship between a component and a press bonding tool in a hot press bonding process of a component press bonding apparatus according to the embodiment.

[0020] Figure 7 is a view for explaining a hot press bonding process of a component press bonding apparatus according to the embodiment.

[0021] Figure 8 is a flowchart showing a component press bonding method according to the embodiment.

[0022] Figure 9 is a view for explaining a component press bonding method according to the embodiment.

[0023] Figure 10 is a side view showing a press bonding tool according to a modification.

[0024] -Explanation of Symbols-

[0025] 2 substrate

[0026] 3 component

[0027] 3a main surface

[0028] 3b back surface

[0029] 4 anisotropic conductive film

[0030] 11 base

[0031] 12 substrate positioning portion

[0032] 12a placement portion

[0033] 12b moving mechanism

[0034] 13 door-shaped frame

[0035] 13a cross member

[0036] 14 support table

[0037] 16 touch panel

[0038] 21 press bonding portion

[0039] 22 protective sheet supply section

[0040] 23 unit support section

[0041] 31 lifting motor

[0042] 32 lifting base

[0043] 33a pressing surface

[0044] 33b recessed portion

[0045] 33 press contact tool

[0046] 34 pressurizing cylinder

[0047] 35 heater

[0048] 36 low-thermal-conductivity member

[0049] 41 housing

[0050] 42 supply reel

[0051] 43 protective sheet

[0052] 44 guide roller

[0053] 45 feed roller

[0054] 46 press roller

[0055] 46S force applying spring

[0056] 47 drive motor

[0057] 50 alignment camera

[0058] 100 component press contact device

[0059] 200 thermal press contact mechanism

[0060] 300 control device

[0061] 310 control section

[0062] 320 storage section

[0063] 500 first bump electrode

[0064] 501 second bump electrode

[0065] 510, 511 electrode section DETAILED DESCRIPTION

[0066] Hereinafter, embodiments of the present invention will be described in detail using the accompanying drawings. Furthermore, the embodiments described below represent specific examples of the present invention. Therefore, the numerical values, shapes, materials, structural elements, arrangements of structural elements, connection methods, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, structural elements in the following embodiments not described in the independent claims of the present invention are described as arbitrary structural elements.

[0067] Furthermore, these figures are schematic diagrams and may not be strictly representational. Therefore, for example, the scale may not be consistent across different figures. Also, substantially identical structures are given the same symbols across different figures, and repeated explanations are omitted or simplified.

[0068] Furthermore, in this specification and accompanying drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are mutually orthogonal and both orthogonal to the Z-axis. Additionally, in the following embodiments, the positive direction of the Z-axis may sometimes be described as "up" and the negative direction as "down".

[0069] Furthermore, in this specification, terms indicating relationships between elements such as parallelism or perpendicularity, terms indicating the shape of elements such as rectangles or lines, and numerical ranges do not merely represent strict meanings, but rather imply substantially equivalent ranges, including, for example, variations of a few percent. Additionally, the depth values ​​used in this embodiment are merely examples and could be other values.

[0070] (Implementation Method)

[0071] [structure]

[0072] First, the structure of the component crimping device involved in the embodiment will be described.

[0073] Figure 1 This is a block diagram illustrating the component crimping device 100 according to the embodiment. Figure 2 This is a perspective view showing the specific structure of the heat-pressing mechanism 200 according to the embodiment. Figure 3 This is a side view showing the specific structure of the heat-pressing mechanism 200 according to the embodiment.

[0074] The component pressing apparatus 100 is an apparatus for pressing (more specifically, heat-pressing) the component 3 onto the substrate 2. The component pressing apparatus 100 is, for example, part of a component mounting system used for producing display panels, etc. In this component mounting system, for example, the electrode portion 510 (see reference 510) provided on the substrate 2... Figure 7 ) Adhere anisotropic conductive films such as ACF (Anisotropic Conductive Film) 4 (refer toFigure 7 ), the component 3 is arranged (pre-press bonded) to the substrate 2 via the anisotropic conductive film 4, and the pre-press bonded substrate 2 and component 3 are thermally press-bonded. This mounting system, for example, is provided with: a tacking device that tacks the anisotropic conductive film 4 to the substrate 2; a pre-press bonding device that arranges (pre-press bonds) the component 3 to the substrate 2 via the anisotropic conductive film 4; and a final press bonding device that thermally press-bonds (final press bonds) the component 3 to the substrate 2. The component press bonding device 100 is, for example, the final press bonding device provided in this mounting system.

[0075] The component press bonding device 100, for example, final press bonds the substrate 2 and component 3 that have been carried out from an upstream device (e.g., a pre-press bonding device) to the placement section 12a by a substrate carrying device not shown. The substrate 2 to which the component 3 has been final press bonded is carried to a device on the downstream side (e.g., an unloader) by the substrate carrying device.

[0076] As the substrate 2, a flexible substrate including resin or the like is exemplified. In addition, the substrate 2 can also be a display panel using a glass substrate or the like.

[0077] As the component 3, a flexible component such as a TCP (Tape Carrier Package), an FPC (Flexible Printed Circuits), or an IC chip is exemplified.

[0078] Figure 4 is a view showing the component 3 according to the embodiment. Specifically, Figure 4 (a) of is a view showing the component 3 in a case where a plurality of first bump electrodes 500 and a plurality of second bump electrodes 501 are arranged in a main surface 3a of the component 3. Figure 4 (b) of is a view showing the component 3 in a side view. In addition, in Figure 4 In, although cross sections of the bump electrodes (specifically, the first bump electrodes 500 and the second bump electrodes 501) provided in the component 3 are not shown, they are shown with hatching for the purpose of explanation.

[0079] The component 3 has a main surface 3a that includes a first region Al in which a plurality of first bump electrodes 500 are arranged, a second region A2 in which a plurality of second bump electrodes 501 are arranged, and a third region A3 that is positioned between the first region Al and the second region A2 and in which no bump electrodes are arranged.

[0080] In addition, the number of bump electrodes arranged in the first region Al and the second region A2 is not particularly limited. In the present embodiment, the number of the first bump electrodes 500 arranged in the first region Al is greater than the number of the second bump electrodes 501 arranged in the second region A2.

[0081] Further, in the present embodiment, the plurality of first bump electrodes 500 are arranged in the first region Al in a manner of being arranged in four rows and staggered. On the other hand, in the present embodiment, the plurality of second bump electrodes 501 are arranged in the second region A2 in a manner of being arranged in one row. For example, the intervals of the first bump electrodes 500 from each other and the intervals of the second bump electrodes 501 from each other are configured to be different at least in part.

[0082] The component 3 is arranged on the substrate 2 so that the main surface 3a faces the substrate 2. At the time of thermocompression bonding of the component 3 to the substrate 2, the back surface 3b facing away from the main surface 3a, that is, the surface on the opposite side of the main surface 3a, is pressed against the bonding portion 21 (specifically, the bonding tool 33 provided to the bonding portion 21).

[0083] The component bonding apparatus 100 is provided with a thermocompression bonding mechanism 200 and a control apparatus 300.

[0084] The thermocompression bonding mechanism 200 is a mechanism portion that thermocompression bonds the substrate 2 and the component 3. For example, the thermocompression bonding mechanism 200 is controlled by the control apparatus 300 (specifically, the control portion 310) to thermocompression bond the component 3 to the substrate 2. In the present embodiment, the thermocompression bonding mechanism 200 is provided with the base 11, the substrate positioning portion 12, the door-type frame 13, the support stage 14, the touch panel 16, the bonding portion 21, the protective sheet material supply portion 22, the unit support portion 23, and the alignment camera 50. Further, the substrate positioning portion 12 is provided with the placement portion 12a and the moving mechanism 12b. The bonding portion 21 is provided with the lift motor 31, the lift base 32, the bonding tool 33, the pressure cylinder 34, and the heater 35. The protective sheet material supply portion 22 is provided with the housing 41, the supply reel 42, the guide roller 44, the feed roller 45, the pinch roller 46, the urging spring 46S, and the drive motor 47.

[0085] The thermocompression bonding mechanism 200 is provided with the substrate positioning portion 12 on the Y-axis negative direction side of the base 11, and is provided with the door-type frame 13 and the support stage 14 on the Y-axis negative direction side of the substrate positioning portion 12. Further, the alignment camera 50 for positioning the substrate 2 at a given position is arranged on the base 11. On the Y-axis positive direction side of the base 11, the touch panel 16 as an input / output device used by an operator is arranged.

[0086] The substrate positioning portion 12 is a mechanism that positions the substrate 2 on which the component 3 is mounted in advance at a given position, and is provided with the placement portion 12a that holds the substrate 2 in a horizontal attitude, and the moving mechanism 12b that moves the placement portion 12a in three dimensions in a state of holding the horizontal attitude.

[0087] The placement section 12a is a stage (a work table) on which the substrate 2 is placed. Specifically, the substrate 2 on which the component 3 is disposed with the anisotropic conductive film 4 so that the main surface 3a opposes the substrate 2 is placed on the placement section 12a. In the placement section 12a, the substrate 2 carried by the substrate carrying device described above is placed, for example, in a state in which the end portion of the component 3 exposed is placed. In this way, the placement section 12a has a holding surface on which the substrate 2 is placed in a state in which the end portion of the substrate 2 as an outer edge portion of the substrate 2 is exposed from the placement section 12a (more specifically, a state in which the end portion does not overlap the placement section 12a in plan view). When the component 3 is press-bonded to the substrate 2, the end portion of the substrate 2 is supported by the support stage 14.

[0088] Further, the placement section 12a can be provided with a suction mechanism that suctions the substrate 2 on the holding surface. For example, an opening (for example, a through-hole) is formed in the holding surface, and the placement section 12a suctions the substrate 2 on the holding surface and holds it. The opening can be connected to a suction device that suctions the substrate 2 to the holding surface by sucking air through the opening, for example, and the substrate 2 is suctioned and held on the holding surface by the suction device sucking air. The suction mechanism has a vacuum pump that sucks air, a vacuum pipe that connects the vacuum pump and the opening, and a valve that controls suction, for example.

[0089] The control section 310 described later switches whether the holding surface is given a suction force by the suction mechanism, that is, whether the end portion of the substrate 2 is suctioned by the suction mechanism, by controlling the valve.

[0090] Further, the valve of the suction mechanism can be a solenoid valve that switches the opening and closing of air suction, for example, or a pressure adjusting valve (so-called pressure regulator) that switches the suction force (suction force).

[0091] Alternatively, the placement section 12a can simply place the substrate 2 on the holding surface 111 without having the opening or the like described above, and thereby hold the substrate 2 by the holding surface.

[0092] The placement section 12a is provided to be movable by a moving mechanism 12b, for example.

[0093] The moving mechanism 12b is a mechanism for moving the placement section 12a. For example, a 3-axis stage is configured by the placement section 12a and the moving mechanism 12b. The moving mechanism 12b is realized by a conveyor configured to arbitrarily move the placement section 12a in the XY plane and configured to be raised and lowered in the Z-axis direction, for example.

[0094] The moving mechanism 12b moves the end portion of the substrate 2 to above (more specifically, directly above) the support stage 14 by moving the placement section 12a on which the substrate 2 is placed.

[0095] The gate-shaped frame 13 has a crossbar portion 13a extending in the X-axis direction above the central portion of the base 11. A press portion 21 is provided on the lower surface side of the crossbar portion 13a. A support table 14 is provided extending in the X-axis direction below the press portion 21. A protective sheet supply portion 22 is provided between the press portion 21 and the support table 14. The protective sheet supply portion 22 is configured to be attached to and detached from a unit support portion 23 provided on the base 11.

[0096] The press portion 21 is provided with a lifting base 32 that is lifted by the operation of a lifting motor 31. In the lifting base 32, a plurality of (four in the present embodiment) press tools 33 are arranged in the X-axis direction. Each of the press tools 33 is located directly above the support table 14 and is individually lifted by a pressurizing cylinder 34 provided corresponding to each of the press tools 33. A heater 35 is built into each of the press tools 33.

[0097] The heater 35 is a heater for heating the press tool 33. The press tool 33 is heated by the heater 35, and the component 3 is pressed against the substrate 2 by the press tool 33, whereby the component 3 is thermocompression-bonded to the substrate 2. The heater 35 is implemented by, for example, an electric heating wire or a Peltier element.

[0098] Figure 5 FIG. 1 is a view showing a press tool 33 according to the present embodiment.

[0099] Specifically, Figure 5 (a) of FIG. 1 is a view showing the press tool 33 in a case where a pressing surface 33a that faces the component 3 (more specifically, a protective sheet 43) when thermocompression-bonding is arranged. Figure 5 (b) of FIG. 1 is a view showing the press tool 33 in a side view.

[0100] The press tool 33 is provided with the pressing surface 33a for pressing the component 3. The pressing surface 33a is a surface (facing surface) that faces the component 3 when thermocompression-bonding. In addition, the pressing surface 33a has a fourth region A4 and a fifth region A5 that press the component 3 in thermocompression-bonding, and a recessed portion 33b that is located between the fourth region A4 and the fifth region A5 (sixth region A6).

[0101] The recessed portion 33b is a groove portion provided in the pressing surface 33a. With the recessed portion 33b, the pressing surface 33a is provided with a step in the fourth region A4 and the fifth region A5 and the sixth region A6. Thus, for example, in thermocompression-bonding, when the component 3 is pressed, the fourth region A4 and the fifth region A5 come into contact with the component 3 (more specifically, the protective sheet 43), but the sixth region A6 with the recessed portion 33b does not come into contact with the component 3 (more specifically, the protective sheet 43).

[0102] Furthermore, the depth of the recess 33b can be arbitrary and is not particularly limited. For example, the depth of the recess 33b is approximately 10 μm to 50 μm.

[0103] The protective sheet supply unit 22 is a mechanism that supplies the protective sheet 43 between the crimping tool 33 and the component 3 during hot pressing. The protective sheet supply unit 22 has multiple (in this embodiment, four, corresponding to the number of crimping tools 33) supply reels 42 within a housing 41 forming the outer contour. Each supply reel 42 holds the protective sheet 43 in a wound state. Inside the housing 41, the rotation shafts are arranged along the X-axis direction. Multiple guide rollers 44 are provided at the center of the housing 41 in the Y-axis direction. Additionally, one feed roller 45 and multiple (in this embodiment, four, corresponding to the number of supply reels 42) pressing rollers 46 are provided on the positive Y-axis side inside the housing 41.

[0104] Multiple guide rollers 44 guide the protective sheet 43 drawn from each supply reel 42 in the positive Y-axis direction, so that the central portion within the housing 41 is in a generally horizontal position. The portion of this central portion, located directly below the crimping tool 33, becomes the portion through which the crimping tool 33 presses the component 3 across the protective sheet 43 when the component 3 is pressed by the crimping tool 33 (described later).

[0105] The feed roller 45 is positioned with its rotation axis facing the X-axis direction and contacts the portion of the protective sheet 43 that is further from the positive Y-axis direction than the guide roller 44 located on the side closest to the positive Y-axis direction.

[0106] Four pressure rollers 46 are arranged on the positive Y-axis side of the feed roller 45, with their rotation axes facing the X-axis. In addition, each pressure roller 46 applies force to the positive Y-axis side by a force-applying spring 46S, thereby pressing the protective sheet 43 against the feed roller 45 and making it tightly sealed.

[0107] Outside the housing 41, a drive motor 47 is provided as a roller drive unit that rotates the feed roller 45. When the feed roller 45 is rotated around the X-axis by the drive motor 47 ( Figure 3 As shown by arrow A), the protective sheet 43 is stretched in the positive Y-axis direction by the feed roller 45, drawn out from the supply reel 42, and fed in the positive Y-axis direction. The protective sheet 43 that has passed through the feed roller 45 will not be wound by the feed roller 45, and is guided to the area below the feed roller 45 and discharged to the area below the housing 41.

[0108] In the pressing operation of component 3 based on the heat pressing mechanism 200, firstly, the feed roller 45 is rotated by the drive motor 47 controlled by the control unit 310, so that the pressing part based on the pressing tool 33 in the protective sheet 43 drawn from each supply roll 42 becomes an unused part.

[0109] Next, the lift motor 31 controlled by the control section 310 is operated to lift the lift base 32, and each of the press tools 33 is positioned at an initial position above the protective sheet 43. If each of the press tools 33 is positioned at the initial position, the control section 310 moves the placement section 12a holding the substrate 2 by the moving mechanism 12b, and positions the substrate 2 so as to be positioned below the press tool 33 corresponding to the component 3 pre-mounted on the substrate 2 via the anisotropic conductive film 4 (in other words, above the support stage 14).

[0110] When the substrate 2 is positioned, the control section 310 presses each of the press tools 33 from the initial position by controlling the pressurizing cylinders 34. By this, the press tool 33 is lowered from above the protective sheet 43, and presses the component 3 on the substrate 2 together with the protective sheet 43. At this pressing, the component 3 is pushed to the support stage 14 together with the substrate 2, and the anisotropic conductive film 4 is heated by the heater 35 built in the press tool 33 through the component 3. By this, the component 3 is thermally pressed (formally pressed) on the substrate 2. At the pressing of the component 3 on the substrate 2 by the press tool 33, the protective sheet 43 is interposed between the press tool 33 and the component 3, and therefore the press tool 33 does not contact the anisotropic conductive film 4, and a part of the anisotropic conductive film 4 is not attached to the press tool 33.

[0111] When the component 3 is pressed on the substrate 2 by the press tool 33, the control section 310 raises the press tool 33 to the initial position by controlling the pressurizing cylinders 34. And, if the press tool 33 is positioned at the initial position, the control section 310 rotates and drives the feed roller 45 by controlling the drive motor 47, and performs a renewal action of the protective sheet 43 by drawing a given amount (length) of the protective sheet 43 from the supply reel 42. In the renewal action, the control section 310 rotates the feed roller 45 by a pre-set rotation angle by controlling the protective sheet supply section 22, so that a part of the protective sheet 43 pressed by the press tool 33 at the last pressing action becomes a used part, and an unused part of the protective sheet 43 becomes a new pressing part. If the renewal action of the protective sheet 43 is completed, the positioning of the substrate 2 and the pressing of the component 3 by the press tool 33 are repeatedly performed as described above.

[0112] The control device 300 is a computer that controls the moving mechanism 12b, the press section 21, the protective sheet supply section 22, and the like provided in the thermally pressing mechanism 200.

[0113] The control device 300 is implemented by a communication interface for communicating with the mechanisms provided in the thermal compression bonding mechanism 200, such as the moving mechanism 12b, the compression bonding portion 21, and the protective sheet supply portion 22, a nonvolatile memory that stores programs, a volatile memory as a temporary storage area for executing programs, an input / output port for transmitting and receiving signals, and a processor that executes programs, and the like. The communication interface can be implemented by, for example, an antenna and a wireless communication circuit or the like to enable wireless communication, or by a connector or the like connected to a communication line to enable wired communication.

[0114] The control device 300 includes a control portion 310 and a storage portion 320.

[0115] The control portion 310 is a processing portion that controls the mechanisms provided in the thermal compression bonding mechanism 200, such as the moving mechanism 12b, the compression bonding portion 21, and the protective sheet supply portion 22. The control portion 310 includes, for example, a processor such as a CPU (Central Processing Unit), and a memory that stores a control program executed by the processor.

[0116] For example, the control portion 310 moves the moving mechanism 12b to the placement portion 12a so that the third region A3 overlaps with the recessed portion 33b, and then causes the compression bonding portion 21 to perform thermal compression bonding of the component 3 to the substrate 2. Specifically, the control portion 310 first controls the moving mechanism 12b, thereby moving the moving mechanism 12b to the placement portion 12a so that the third region A3 overlaps with the recessed portion 33b. For example, the control portion 310 controls the moving mechanism 12b based on the imaging result of the alignment camera 50, thereby moving the moving mechanism 12b to the placement portion 12a so that the third region A3 overlaps with the recessed portion 33b in plan view. Further, the control portion 310 supplies the protective sheet 43 between the component 3 and the compression tool 33 by controlling the protective sheet supply portion 22. Further, the control portion 310 causes the compression bonding portion 21 to perform thermal compression bonding of the component 3 to the substrate 2 by causing the compression tool 33 to press the component 3 with the protective sheet 43 interposed therebetween.

[0117] Further, the control portion 310 can cause the compression tool 33 to press the component 3 without the protective sheet 43 interposed therebetween, thereby causing the compression bonding portion 21 to perform thermal compression bonding of the component 3 to the substrate 2. In this case, the component compression bonding device 100 can not include the protective sheet supply portion 22.

[0118] Figure 6 is a view for explaining the positional relationship between the component 3 and the compression tool 33 in thermal compression bonding performed by the component compression bonding device 100 according to the embodiment. Figure 7 is a view for explaining thermal compression bonding performed by the component compression bonding device 100 according to the embodiment.

[0119] AsFigure 6 and Figure 7 As shown in FIG. 6, for example, the control section 310 moves the placement section 12a by controlling the moving mechanism 12b so that the first region Al overlaps the fourth region A4, the second region A2 overlaps the fifth region A5, and the third region A3 overlaps the sixth region A6 in a plan view.

[0120] Further, the so-called overlapping of regions in a plan view includes, of course, a case where the positions of the regions coincide completely in a plan view, and also includes, for example, a case where there is a position which does not overlap in a plan view by several percent or so, such as 5%, with respect to the size (for example, area) of the regions. In addition, the size and shape of each region can be the same or different, and, for example, in a case where the size and shape of each region are different, it is sufficient that one region contains another region in a plan view.

[0121] When the placement section 12a is moved so that the first region Al overlaps the fourth region A4, the second region A2 overlaps the fifth region A5, and the third region A3 overlaps the sixth region A6 in a plan view, for example, the first bump electrode 500 provided in the component 3 and the electrode section 510 provided in the substrate 2 are arranged to face each other. In addition, the second bump electrode 501 provided in the component 3 and the electrode section 511 provided in the substrate 2 are arranged to face each other. Thus, the component 3 and the substrate 2 are thermocompression-bonded by the component compression-bonding apparatus 100, whereby the first bump electrode 500 and the electrode section 510 are electrically connected directly or via the conductive particles included in the anisotropic conductive film 4, and the second bump electrode 501 and the electrode section 511 are electrically connected directly or via the conductive particles included in the anisotropic conductive film 4.

[0122] The storage section 320 is a storage device which stores various kinds of information. For example, threshold information such as a thermocompression-bonding time used when the component 3 is thermocompression-bonded to the substrate 2 is stored in the storage section 320. The storage section 320 is realized by, for example, an HDD (Hard Disk Drive) or a semiconductor memory, or the like.

[0123] [Processing]

[0124] Next, the processing of the component compression-bonding apparatus 100 according to the embodiment will be described. The component compression-bonding apparatus 100, for example, executes the component compression-bonding method shown below.

[0125] Figure 8 is a flowchart showing the component compression-bonding method according to the embodiment. Figure 9 is a diagram for explaining the component compression-bonding method according to the embodiment.

[0126] First, the control section 310 accepts the substrate 2 on which the component 3 is disposed with the anisotropic conductive film 4 so that the main surface 3a opposes the substrate 2 from an upstream device (for example, a pre-pressing device) by controlling a substrate conveyance device (not shown), and places the accepted substrate 2 on the placement section 12a (S110 and Figure 9 (a) of FIG. 1. Further, the step S110 can also be executed by a device and a control device of a mounting system that is provided with the component press device 100. The substrate conveyance device can be provided in the component press device 100, or in the mounting system.

[0127] Next, the control section 310 causes the movement mechanism 12b to move the placement section 12a so that the third region A3 overlaps the recessed portion 33b by controlling the movement mechanism 12b (S120 and Figure 9 (b) of FIG. 1. For example, the control section 310 causes the alignment camera 50 to take an image of an alignment mark (not shown) provided on the substrate 2, determines the position of the substrate 2 based on the image taken, and causes the placement section 12a to move based on the determined position of the substrate 2 so that at least a portion of the third region A3 and the recessed portion 33b overlap when viewed from above.

[0128] Next, the control section 310 causes the press section 21 (specifically, the press tool 33) to perform thermal pressing of the component 3 to the substrate 2 by controlling the press section 21 (S130). Specifically, the control section 310 causes the press tool 33 to be heated to a given temperature by controlling the heater 35, and causes the press tool 33 to press the back surface 3b of the component 3 through the protective sheet 43, thereby causing the press tool 33 to perform thermal pressing of the component 3 to the substrate 2.

[0129] The control section 310 controls the protective sheet supply section 22 so that the position of the protective sheet 43 is slightly moved so that the protective sheet 43 comes into contact with the press tool 33 at a position where the protective sheet 43 is not in contact with the press tool 33 at the time of thermal pressing, for example, every time the step S130 is executed.

[0130] Further, the timing at which the control section 310 causes the press tool 33 to be heated by controlling the heater 35 can be arbitrary and is not particularly limited. The control section 310 can control the heater 35 so that the press tool 33 is at a given temperature at the time of causing the press tool 33 to perform thermal pressing of the component 3 to the substrate 2 in the step S130. Alternatively, the control section 310 can control the heater 35 so that the temperature of the press tool 33 is maintained at a given temperature, or can control the heater 35 so that the temperature of the press tool 33 is lowered, for example, by stopping the heater 35, every time thermal pressing of the component 3 to the substrate 2 is performed.

[0131] Further, the given temperature can be arbitrarily determined and is not particularly limited.

[0132] The substrate 2 with the component 3 thermocompression-bonded thereto is carried to a device (e.g., an unloader) on the downstream side by a substrate carrying device, for example.

[0133] [Modified Example]

[0134] Figure 10 is a side view showing the compression tool 33 according to the modified example.

[0135] The recess 33b provided in the pressing surface 33a of the compression tool 33 according to the modified example is provided with a low-thermal-conductivity member 36.

[0136] The low-thermal-conductivity member 36 is provided in the recess 33b and has a thermal conductivity lower than that of the fourth region A4 and the fifth region A5.

[0137] The compression tool 33 is formed of a metal material such as SUS (Steel Use Stainless). The low-thermal-conductivity member 36 is formed of a ceramic material such as Si, for example. Furthermore, the low-thermal-conductivity member 36 is a member having a lower thermal conductivity than that of the fourth region A4 and the fifth region A5, and the materials of the low-thermal-conductivity member 36 and the compression tool 33 can be arbitrary.

[0138] As shown in Figure 10 , the low-thermal-conductivity member 36 is configured to be flush with the pressing surface at the fourth region A4 and the fifth region A5, for example.

[0139] Furthermore, the low-thermal-conductivity member 36 can not be configured to be flush with the pressing surface 33a at the fourth region A4 and the fifth region A5, for example. For example, the low-thermal-conductivity member 36 can be provided in the recess 33b so as to be recessed more than the pressing surface 33a at the fourth region A4 and the fifth region A5 in the pressing surface 33a of the compression tool 33. That is, the low-thermal-conductivity member 36 can be provided so as not to be in contact with the component 3 at the sixth region A6 where the recess 33b is provided at the time of thermocompression bonding.

[0140] [Effects and the Like]

[0141] Hereinafter, a technology according to the disclosure of the present specification will be exemplified, and effects and the like according to the exemplified technology will be described.

[0142] Technology 1 is a component press bonding device 100 that thermally press-bonds a component 3 having a main surface 3a including a first region Al in which a plurality of first bump electrodes 500 are arranged, a second region A2 in which a plurality of second bump electrodes 501 are arranged, and a third region A3 between the first region Al and the second region A2 in which no bump electrode is arranged, to a substrate 2 via an anisotropic conductive film 4, the component press bonding device 100 including: a placement section 12a that places the substrate 2 with the component 3 arranged thereon via the anisotropic conductive film 4 so that the main surface 3a faces the substrate 2; a press bonding section 21 including a press bonding tool 33 having a press surface 33a and a heater 35 that heats the press bonding tool 33; a moving mechanism 12b that moves the placement section 12a; and a control section 310 that controls the moving mechanism 12b and the press bonding section 21, the press surface 33a having a fourth region A4 and a fifth region A5 that press the component 3 during thermal press bonding, and a recess 33b between the fourth region A4 and the fifth region A5, the control section 310 moving the placement section 12a so that the third region A3 overlaps the recess 33b, and then causing the press bonding section 21 to perform thermal press bonding of the component 3 to the substrate 2.

[0143] In recent years, components 3 such as ICs are being developed, and the number of bump electrodes that the components 3 have is increasing. The plurality of bump electrodes are arranged, for example, in multiple rows, or in a staggered arrangement, or the like.

[0144] Here, the present inventors have focused on the phenomenon that as the number of bump electrodes increases, the mounting accuracy of the component 3 to the substrate 2 after thermal press bonding becomes unstable.

[0145] During thermal press bonding, conductive particles included in the anisotropic conductive film 4 flow. During thermal press bonding, when the component 3 is pressed by the press bonding tool 33, the anisotropic conductive film 4 is pressed against the component 3, and the conductive particles as a whole flow outwardly and expand. Here, at a portion between the bump electrodes that is narrow, the flow of the conductive particles deteriorates, and the conductive particles press against the bump electrodes. Therefore, it is considered that a problem arises in which the mounting accuracy becomes unstable.

[0146] In particular, among the components 3 that are pressed during thermal press bonding, for example, when the number of bump electrodes arranged in the first region Al and the second region A2, the interval of each bump electrode, and / or the method of arrangement of the bump electrodes are different, for example, the conductive particles located near the central portion of the component 3 when viewed from above press against the bump electrodes at a portion between the bump electrodes that is narrow, that is, the force with which the conductive particles press against the component 3 differs on the first region Al side and the second region A2 side when pressing against the bump electrodes outwardly. As a result, the component 3 deviates from the desired position. Since there is also a demand for miniaturization of the component 3, it is desirable to be able to suppress a decrease in mounting accuracy without widening the interval of the bump electrodes of the component 3.

[0147] To this end, the present inventors found that, at the time of thermal compression bonding that affects the flow of the conductive particles, the member 3 is not heated all at once, but is heated with a time lag, for example. Specifically, in the member compression bonding device 100, the recess 33b is provided in the pressing surface 33a. The portion of the pressing surface 33a other than the recess 33b is in direct contact with the member 3 at the time of thermal compression bonding (specifically, through the protective sheet 43). On the other hand, the portion of the pressing surface 33a in which the recess 33b is provided (the sixth region A6) is not in direct contact with the member 3 at the time of thermal compression bonding (specifically, through the protective sheet 43). Therefore, at the time of thermal compression bonding, the sixth region A6 of the pressing surface 33a in which the recess 33b is provided becomes a temperature rise delay region, and the temperature rise of the member 3 is suppressed compared to the portion of the pressing surface 33a other than the recess 33b. Thus, it is considered that, at the time of thermal compression bonding, the flow of the plurality of conductive particles contained in the anisotropic conductive film 4 can be suppressed all at once. Therefore, it is considered that, by providing the recess 33b in the pressing surface 33a, the force with which the conductive particles press the bump electrode at the time of thermal compression bonding can be suppressed compared to the case where the recess 33b is not provided in the pressing surface 33a.

[0148] As described above, according to the member compression bonding device 100, at the time of thermal compression bonding in which the member 3 is pressed against the substrate 2 by the compression tool 33, the temperature rise at the third region A3 based on the heater 35 can be delayed compared to the temperature rise of the first region A1 and the second region A2. Therefore, according to the member compression bonding device 100, the reduction in mounting accuracy can be suppressed. In other words, according to the member compression bonding device 100, the mounting quality of the member 3 can be improved and the productivity can be improved.

[0149] Technology 2 is the member compression bonding device 100 described in Technology 1, further comprising: a low-thermal-conductivity member 36 disposed in the recess 33b, having a lower thermal conductivity than the fourth region A4 and the fifth region A5.

[0150] Accordingly, at the time of heating of the compression tool 33 by the heater 35, the low-thermal-conductivity member 36 can delay the temperature rise compared to the fourth region A4 and the fifth region A5. Therefore, by performing thermal compression bonding at an appropriate timing from the start of heating of the compression tool 33 by the heater 35, the temperature rise at the third region A3 can be delayed compared to the temperature rise of the first region A1 and the second region A2. Therefore, according to the member compression bonding device 100, the reduction in mounting accuracy can be suppressed.

[0151] Technology 3 is the component press bonding device 100 according to technology 1 or 2, wherein the component press bonding device 100 further comprises a protective sheet supply section 22 that supplies a protective sheet 43 between the press bonding tool 33 and the component 3, and the control section 310 causes the press bonding section 21 to perform the heat press bonding of the component 3 to the substrate 2 by causing the press bonding tool 33 to press the component 3 through the protective sheet 43.

[0152] Accordingly, in the heat press bonding, the anisotropic conductive film 4 is not attached to the press bonding tool 33.

[0153] Technology 4 is a component press bonding method that is performed by the component press bonding device 100 that heat-presses a component 3 having a main surface 3a to a substrate 2 via an anisotropic conductive film 4, the main surface 3a including a first region Al in which a plurality of first bump electrodes 500 are arranged, a second region A2 in which a plurality of second bump electrodes 501 are arranged, and a third region A3 between the first region Al and the second region A2 in which no bump electrode is arranged, the component press bonding device 100 including: a placement section 12a that places the substrate 2 having the component 3 arranged thereon via the anisotropic conductive film 4 so that the main surface 3a faces the substrate 2; a press bonding section 21 including a press bonding tool 33 having a press surface 33a and a heater 35 that heats the press bonding tool 33; and a moving mechanism 12b that moves the placement section 12a, the press surface 33a including a fourth region A4 and a fifth region A5 that press the component 3 in the heat press bonding, and a recessed portion 33b between the fourth region A4 and the fifth region A5, wherein in the component press bonding method, the moving mechanism 12b is caused to move the placement section 12a so that the third region A3 overlaps with the recessed portion 33b (S120), and then the press bonding section 21 is caused to perform the heat press bonding of the component 3 to the substrate 2 (S130).

[0154] Accordingly, the same effects as those of the component press bonding device 100 according to technology 1 are obtained.

[0155] Furthermore, these general or specific aspects can be achieved by a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a CD-ROM, or any combination of the system, the method, the integrated circuit, the computer program, and the recording medium.

[0156] (Other Embodiments)

[0157] The above-described embodiments relate to a component press bonding device and the like, but the present application is not limited to the above-described embodiments.

[0158] For example, the control device 300 can be a computer dedicated to controlling each device provided in the component press-contact device 100, or can be a computer that also controls each device provided in a mounting system provided with the component press-contact device 100.

[0159] In addition, for example, in the above-described embodiments, all or a part of the structural elements of the control device 300 can be constituted by a dedicated hardware, or can be realized by executing a software program suitable for each structural element. Each structural element can also be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded in a recording medium such as an HDD or a semiconductor memory.

[0160] In addition, the structural elements of the control device 300 can also be constituted by one or a plurality of electronic circuits. The one or a plurality of electronic circuits can each be a general-purpose circuit, or can be a dedicated circuit.

[0161] In the one or a plurality of electronic circuits, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration) or the like can be included. The IC or the LSI can be integrated in one chip, or can be integrated in a plurality of chips. Here, it is referred to as an IC or an LSI, but depending on the degree of integration, the manner of calling will change, and it can be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). In addition, a FPGA (Field Programmable Gate Array) programmable after the manufacture of the LSI can also be used with the same purpose.

[0162] Furthermore, modes obtained by various modifications thought of by those skilled in the art with respect to each of the embodiments, modes obtained by arbitrarily combining the structural elements and functions in each of the embodiments within a range not departing from the gist of the present application, and the like are also included in the present application.

[0163] Industrial Applicability

[0164] The component press-contact device according to the present application can be used for a component press-contact device that press-contacts a component to a substrate.

Claims

1. A component press bonding apparatus that thermally press-bonds a component having a principal surface to a substrate via an anisotropic conductive film, the principal surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region between the first region and the second region in which no bump electrode is arranged, the component press bonding apparatus comprising: a placement portion that places the substrate with the component arranged thereon via the anisotropic conductive film such that the principal surface faces the substrate; a press bonding portion that includes a press bonding tool having a press surface and a heater that heats the press bonding tool; a moving mechanism that moves the placement portion; and a control portion that controls the moving mechanism and the press bonding portion, wherein the press surface has a fourth region and a fifth region that press the component in the thermal press-bonding, and a recess between the fourth region and the fifth region, the control portion moves the placement portion such that the third region overlaps with the recess, and thereafter, the control portion causes the press bonding portion to perform the thermal press-bonding of the component to the substrate.

2. The component press bonding apparatus according to claim 1, wherein the component press bonding apparatus further comprises a low thermal conductivity member arranged in the recess, the low thermal conductivity member having a lower thermal conductivity than the fourth region and the fifth region.

3. The component press bonding apparatus according to claim 1 or 2, wherein the component press bonding apparatus further comprises a protective sheet supply portion that supplies a protective sheet between the press bonding tool and the component, and the control portion causes the press bonding portion to perform the thermal press-bonding of the component to the substrate by causing the press bonding tool to press the component with the protective sheet interposed therebetween.

4. A component press bonding method that is performed by a component press bonding apparatus that thermally press-bonds a component having a principal surface to a substrate via an anisotropic conductive film, the principal surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region between the first region and the second region in which no bump electrode is arranged, the component press bonding apparatus comprising: a placement portion that places the substrate with the component arranged thereon via the anisotropic conductive film such that the principal surface faces the substrate; a press bonding portion that includes a press bonding tool having a press surface and a heater that heats the press bonding tool; and a moving mechanism that moves the placement portion, wherein the press surface has a fourth region and a fifth region that press the component in the thermal press-bonding, and a recess between the fourth region and the fifth region, and in the component press bonding method, the moving mechanism is caused to move the placement portion such that the third region overlaps with the recess, and thereafter, the press bonding portion is caused to perform the thermal press-bonding of the component to the substrate. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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