Assembly equipment and system

Abstract

The present application provides an assembly device and system, which includes: a base, which is used for placing a device to be pressed thereon, and the device to be pressed includes a first component placed on the base, a pressure sensor arranged on the first component, a hot melt arranged on the first component and wrapping the pressure sensor, and a second component arranged on the hot melt; a heating and pressing mechanism, which is arranged above the base and is used to heat the second component and apply pressure toward the base; a controller, which is electrically connected to the heating and pressing mechanism and the pressure sensor, respectively, and is used to control the pressure value applied to the second component by the heating and pressing mechanism according to the detection parameters of the pressure sensor.

Description

Technical Field

[0001] The present application relates to the field of device assembly, and in particular, to an assembly device and system. Background Art

[0002] The traditional way to assemble sensors in the middle of parts is to fix the sensors with hot melt adhesive by setting pressure and temperature. However, the pressure and displacement changes of existing micro pressure sensors are very small, and the rheology of hot melt adhesive is complex during hot pressing. Simply relying on the setting of pressure and temperature has the problem of low sensor installation accuracy. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide an assembly device and system to solve the problem of low sensor installation accuracy in the traditional method of relying solely on pressure and temperature settings.

[0004] In a first aspect, an embodiment provides an assembly device, comprising: a base, which is used for placing a device to be pressed thereon, the device to be pressed comprising a first component placed on the base, a pressure sensor arranged on the first component, a hot melt arranged on the first component and wrapping the pressure sensor, and a second component arranged on the hot melt; a heating and pressing mechanism, which is arranged above the base and is used to heat the second component and apply pressure toward the base; a controller, which is electrically connected to the heating and pressing mechanism and the pressure sensor, respectively, and is used to control the pressure value applied by the heating and pressing mechanism to the second part to be assembled according to the detection parameters of the pressure sensor.

[0005] In the assembly equipment designed as above, during the pressure sensor assembly process, the force parameters of the pressure sensor to be assembled are used as a controller to control the force factor of the heating and pressing device, so that the controller continuously changes the pressure value of the heating and pressing mechanism, thereby making the force applied by the heating and pressing mechanism to the pressure sensor to be assembled reach the expected value, thereby achieving precise control of the assembly of the sensor to be assembled, solving the problem of low sensor installation accuracy in the traditional method of relying solely on pressure and temperature settings, and improving the assembly accuracy of the pressure sensor in the parts.

[0006] In an optional implementation of the present embodiment, the heating and pressing mechanism includes a frame, a cylinder, a cylinder push rod and a pressing plate, one end of the cylinder is arranged on the frame, the other end of the cylinder is connected to one end of the cylinder push rod, the other end of the cylinder push rod is connected to the pressing plate, and the cylinder is electrically connected to the controller.

[0007] In an optional implementation of this embodiment, the heating and pressing mechanism further includes a first heating unit, which is disposed on the opposite side of the pressing plate and the cylinder push rod, and the first heating unit is electrically connected to the controller for heating the second component.

[0008] In an optional implementation of this embodiment, the first heating unit includes a PTC heater.

[0009] In an optional implementation of the present embodiment, the heating and pressing mechanism also includes a temperature sensor, which is arranged on the first heating unit. The temperature sensor is electrically connected to the controller and is used to collect temperature parameters of the first heating unit and transmit the temperature parameters to the controller, so that the controller monitors whether the temperature of the first heating unit meets the requirements based on the temperature parameters.

[0010] In an optional implementation manner of this embodiment, the base includes a placement table and a limiting mechanism, and the limiting mechanism is arranged on the contact surface between the placement table and the device to be pressed, and is used to limit the hot melt in the device to be pressed.

[0011] In an optional implementation manner of this embodiment, the assembly equipment further includes a second heating unit, which is disposed on a contact surface between the placement table and the device to be pressed, and is used to heat the hot melt in the device to be pressed.

[0012] In an optional implementation of this embodiment, the controller is also used to receive the pressure detection value of the pressure sensor, determine whether the pressure detection value of the pressure sensor is the same as a preset pressure detection value, and if they are the same, control the heating and pressing mechanism to stop applying pressure to the second component.

[0013] In an optional implementation manner of this embodiment, the hot melt is hot melt adhesive.

[0014] In a second aspect, the present application provides an assembly system, which includes an input device and an assembly device as in any optional embodiment of the first aspect, wherein the input device is electrically connected to a controller in the assembly device.

[0015] In the assembly system designed as above, during the pressure sensor assembly process, the force parameters of the pressure sensor to be assembled are used as a controller to control the force factor of the heating and pressing device, so that the controller continuously changes the pressure value of the heating and pressing mechanism, thereby making the force applied by the heating and pressing mechanism to the pressure sensor to be assembled reach the expected value, thereby achieving precise control of the assembly of the sensor to be assembled, solving the problem of low sensor installation accuracy that exists in the traditional method of relying solely on pressure and temperature settings, and improving the assembly accuracy of the pressure sensor in the parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A first structural schematic diagram of an assembly device provided in an embodiment of the present application;

[0018] Figure 2 A second structural schematic diagram of the assembly equipment provided in an embodiment of the present application;

[0019] Figure 3 A third structural schematic diagram of the assembly equipment provided in an embodiment of the present application;

[0020] Figure 4 This is a fourth structural schematic diagram of the assembly equipment provided in an embodiment of the present application.

[0021] Icons: 10-base; 101-placing table; 102-limiting mechanism; 103-second heating unit; 20-heating and pressing mechanism; 30-controller; 201-frame; 202-cylinder; 203-cylinder push rod; 204-pressing plate; 205-first heating unit; 206-temperature sensor; A-first component; B-hot melt; C-pressure sensor; D-second component. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0023] First embodiment

[0024] like Figure 1 As shown, an embodiment of the present application provides an assembly device, which includes a base 10, a heating and pressing mechanism 20 and a controller 30. A device to be pressed is placed on the base 10, and the device to be pressed includes a first component A, a hot melt B, a pressure sensor C and a second component D. The hot melt B is placed on the first component A, and the hot melt B wraps the pressure sensor C to be assembled. The second component D is placed on the upper part of the pressure sensor C to be assembled and the hot melt B, and the heating and pressing mechanism 20 is arranged above the second component D. The heating and pressing mechanism 20 and the pressure sensor C to be assembled are electrically connected to the controller 30.

[0025] When the assembly device of the above design is assembled, the controller 30 will obtain the initial displacement signal, temperature signal and force feedback signal transmitted by the pressure sensor C to be assembled, the initial displacement signal indicates the control of the heating and pressing mechanism 20 to perform initial displacement and the degree of initial displacement, so that the heating and pressing mechanism 20 applies force to the second component D; the temperature signal indicates the control of the heating and pressing mechanism 20 to heat and reach the temperature value corresponding to the temperature signal, so as to heat the second component D and the hot melt B; the force feedback signal transmitted by the pressure sensor C to be assembled indicates the detection parameter of the pressure sensor, the detection parameter may include the electrical signal converted by the pressure sensor C under pressure, the size of the electrical signal is related to the pressure under pressure, for example, in the initial stage, the pressure sensor to be assembled is not subjected to the extrusion force from the first component A and the second component D, then the pressure under it is zero, the corresponding resistance is in the maximum state, and the converted current signal is in the minimum state. In the above manner, the controller 30 can control the pressure value applied to the second component by the heating and pressing mechanism according to the detection parameter of the pressure sensor C.

[0026] Specifically, after the heating and pressing mechanism 20 generates corresponding displacement according to the pressure value and temperature controlled by the controller and heats to the corresponding temperature, the heating and pressing mechanism 20 will apply pressure to the second component D. The second component D will apply pressure to the hot melt B under the pressure and the temperature after heating will make the hot melt B molten, thereby causing the hot melt B to deform. At the same time, it will generate an extrusion force on the pressure sensor C to be assembled. In this process, the assembled pressure sensor C will convert the pressure received into a corresponding electrical signal (such as a current signal), and then transmit the electrical signal (such as a current signal) to the controller 30. The controller 30 will detect the size of the electrical signal transmitted by the pressure sensor C in real time, and compare it with the preset value of the pre-stored electrical signal. When the size of the electrical signal does not reach the preset value, When the pressure value reaches the preset value, the controller 30 will add a preset pressure value on the basis of the original pressure value to increase the pressure applied by the heating and pressing mechanism 20 to the second component D, thereby increasing the pressure on the pressure sensor C to be assembled to increase the size of the electrical signal converted by it; through such continuous feedback adjustment, the pressure value controlled by the controller 30 and the force applied by the heating and pressing mechanism 20 are continuously increased, the second component D is getting closer and closer to the first component A, and the pressure on the pressure sensor C to be assembled will also be greater and greater. When the controller 30 compares that the size of the electrical signal reaches the pre-stored preset value, the pressure value is stopped from being increased, so that the heating and pressing mechanism 20 no longer continues to apply pressure to the second component D. In this way, the accurate installation of the first component A, the second component D and the pressure sensor C to be assembled therebetween is completed.

[0027] In addition, in many cases, it is necessary to assemble multiple pressure sensors C between the first component A and the second component D, and the pre-pressure, accuracy and sensitivity of these multiple pressure sensors C need to be consistent. If the existing method is used, the force conditions of the pressure sensors C at different positions may be inconsistent, resulting in inconsistent pre-pressure and sensitivity. However, through the idea of ​​the solution of the present application, a solution for assembling multiple pressure sensors C can be designed. Multiple heating and pressing mechanisms can be used, corresponding to the pressure sensors C at different positions, respectively, and the multiple pressure sensors C are electrically connected to the controller 30, and then the pressurization is stopped when the multiple pressure values ​​meet the same expected value, so that the pre-pressure and sensitivity of each sensor are consistent.

[0028] In the assembly equipment designed as above, during the pressure sensor assembly process, the force parameters of the pressure sensor to be assembled are used as a controller to control the force factor of the heating and pressing device, so that the controller continuously changes the pressure value of the heating and pressing mechanism, thereby making the force applied by the heating and pressing mechanism to the pressure sensor to be assembled reach the expected value, thereby achieving precise control of the assembly of the sensor to be assembled, solving the problem of low sensor installation accuracy in the traditional method of relying solely on pressure and temperature settings, and improving the assembly accuracy of the pressure sensor in the parts.

[0029] In an optional implementation of this embodiment, if Figure 2 As shown, the heating and pressing mechanism 20 includes a frame 201, a cylinder 202, a cylinder push rod 203 and a pressing plate 204, one end of the cylinder 202 is set on the frame 201, the other end of the cylinder 202 is connected to one end of the cylinder push rod 203, the other end of the cylinder push rod 203 is connected to the pressing plate 204, and the cylinder 202 is electrically connected to the controller 30.

[0030] During the implementation of the heating and pressing mechanism 20 designed above, the controller 30 controls the power of the cylinder 202 according to the pressure parameters, so that the cylinder pushes the cylinder push rod 203 to move. After moving, the cylinder push rod 203 drives its pressing plate 204 to move, so that the pressing plate 204 moves and applies pressure to the second component D. In this process, the controller 30 can control the power of the cylinder according to the pressure value, control the movement of the cylinder push rod 203, so that the displacement of the pressing plate 204 is within the control range, and thus the pressure applied by the pressing plate 204 to the second component D corresponds to the pressure parameter of the controller.

[0031] In an optional implementation of this embodiment, based on the previous embodiment, the heating pressing mechanism may further include a cylinder electric valve (not shown in the figure), which is electrically connected to the controller and is arranged between the cylinder 202 and the frame 201. The controller 30 can control the force of the cylinder by controlling the opening of the cylinder electric valve, thereby accurately controlling the displacement of the pressing plate 204.

[0032] In an optional implementation of this embodiment, if Figure 3 As shown, the heating and pressing mechanism 20 may also include a first heating unit 205, which may include a PTC heater. The PTC heater has a constant temperature heating characteristic. The principle is that after the PTC heating plate is powered on, it will self-heat and increase the resistance value to enter the transition zone. The surface temperature of the PTC heating plate will remain constant. This temperature is only related to the Curie temperature and the external voltage of the PTC heating plate, and is basically unrelated to the ambient temperature. The constant temperature state can be maintained, and the temperature control is convenient.

[0033] In an optional implementation of this embodiment, the first heating unit 205 can be arranged on the opposite surface of the connection surface between the pressing plate 204 and the cylinder push rod 203. The first heating unit 205 is electrically connected to the controller 30 for heating the second component D and the hot melt B.

[0034] In an optional implementation of this embodiment, if Figure 3 As shown, the heating and pressing mechanism 20 can also include a temperature sensor 206, which can be set on the first heating unit 205. The temperature sensor 206 is electrically connected to the controller 30. The temperature sensor 206 collects temperature parameters of the first heating unit 205 and transmits the temperature parameters to the controller 30, so that the controller 30 can determine whether the temperature of the first heating unit 205 has reached the specified temperature based on the temperature parameters transmitted by the temperature sensor 206. If not, the controller 30 continues to send a temperature increase signal to the first heating unit 205. If it has reached the specified temperature, the first heating unit 205 is controlled to maintain the corresponding temperature.

[0035] In an optional implementation of this embodiment, if Figure 4 As shown, the base 10 includes a placement table 101 and a limiting mechanism 102, wherein the placement table 101 is used to place the device to be pressed, and the limiting mechanism 102 is used to limit the hot melt in the device to be pressed. This is because when the heating pressing mechanism 20 presses the device to be pressed, the hot melt B is in a liquid state due to temperature reasons, which may cause the hot melt to flow randomly, and the limiting mechanism 102 can be used to limit the hot melt so that the hot melt can be cooled and solidified within a fixed range.

[0036] In an optional implementation of this embodiment, if Figure 4 As shown, the base 10 may further include a second heating unit 103, which is disposed on the contact surface between the placement platform and the device to be pressed, and is used to heat the hot melt in the device to be pressed.

[0037] In an optional implementation manner of this embodiment, the hot melt may be a hot melt adhesive, which is in a molten state when the temperature reaches a certain value, and is in a solid state when the temperature is cooled to a certain temperature to fix the pressure sensor to be assembled.

[0038] In an optional implementation of this embodiment, the first component A and the second component D mentioned in the aforementioned implementation may be a mobile phone screen and a mobile phone frame, and the pressure sensor to be assembled may be a miniature pressure sensor. That is to say, the actual application scenario of this solution can be specifically a solution of assembling a miniature pressure sensor under a mobile phone screen.

[0039] Second embodiment

[0040] The present application provides an assembly system, which includes an input device and the assembly device described in any optional implementation manner in the first embodiment, the assembly device includes a base, a heating and pressing mechanism, and a controller, the input device is electrically connected to the controller, the input device can be used to receive operations from staff to input initial temperature parameters into the controller, etc., its specific functions and effects are consistent with those described in the first embodiment, and will not be repeated here.

[0041] In the assembly system designed as above, during the pressure sensor assembly process, the force parameters of the pressure sensor to be assembled are used as a controller to control the force factor of the heating and pressing device, so that the controller continuously changes the pressure value of the heating and pressing mechanism, thereby making the force applied by the heating and pressing mechanism to the pressure sensor to be assembled reach the expected value, thereby achieving precise control of the assembly of the sensor to be assembled, solving the problem of low sensor installation accuracy that exists in the traditional method of relying solely on pressure and temperature settings, and improving the assembly accuracy of the pressure sensor in the parts.

[0042] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0043] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0044] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0045] It should be noted that if the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM) random access memory (RAM), disk or optical disk, and other media that can store program codes.

[0046] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0047] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An assembly device, characterized in that: The assembly equipment comprises: A base, which is used for placing a device to be pressed on it, wherein the device to be pressed includes a first component placed on the base, a pressure sensor arranged on the first component, a hot melt arranged on the first component and wrapping the pressure sensor, and a second component arranged on the hot melt; a heating and pressing mechanism, which is disposed above the base and is used to heat the second component and apply pressure toward the base; a controller, which is electrically connected to the heating and pressing mechanism and the pressure sensor, and is used to control the pressure value applied by the heating and pressing mechanism to the second component according to the detection parameters of the pressure sensor; The heating pressing mechanism comprises a frame, a cylinder, a cylinder push rod and a pressing plate, one end of the cylinder is mounted on the frame, the other end of the cylinder is connected to one end of the cylinder push rod, the other end of the cylinder push rod is connected to the pressing plate, and the cylinder is electrically connected to the controller; The heating and pressing mechanism further includes a first heating unit, which is arranged on a surface opposite to the connection surface between the pressing plate and the cylinder push rod, and the first heating unit is electrically connected to the controller for heating the second component; The base includes a placement table and a limiting mechanism, wherein the limiting mechanism is arranged on the contact surface between the placement table and the device to be pressed, and is used to limit the hot melt in the device to be pressed; The controller is also used to receive the pressure detection value of the pressure sensor, determine whether the pressure detection value of the pressure sensor is the same as a preset pressure detection value, and if they are the same, control the heating and pressing mechanism to stop applying pressure to the second component.

2. The assembly device according to claim 1, characterized in that: The first heating unit includes a PTC heater.

3. The assembly equipment according to claim 1, characterized in that: The heating and pressing mechanism also includes a temperature sensor, which is arranged on the first heating unit. The temperature sensor is electrically connected to the controller and is used to collect temperature parameters of the first heating unit and transmit the temperature parameters to the controller, so that the controller monitors whether the temperature of the first heating unit meets the requirements based on the temperature parameters.

4. The assembly device according to claim 1, characterized in that: The base further includes a second heating unit, which is disposed on a contact surface between the placement platform and the device to be pressed, and the second heating unit is electrically connected to the controller for heating the hot melt in the device to be pressed.

5. The assembly device according to claim 1, characterized in that: The hot melt is hot melt adhesive.

6. An assembly system, characterized in that: The assembly system comprises an input device and the assembly device according to any one of claims 1 to 5, wherein the input device is electrically connected to the controller.

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