Transmissive white light device

Abstract

The present application provides a transmissive white light device, which relates to the technical field of white light devices. The transmissive white light device comprises: a packaging structure with an installation space inside, an optical lens, a heat sink, a conductive column, a laser diode chip and a fluorescent lens; one end of the packaging structure has an opening, and the end of the packaging structure away from the opening has a conductive through hole; the optical lens is installed in the packaging structure and closes the opening; the heat sink is installed in the installation space; the conductive column is installed in the installation space, and the conductive column and the heat sink are arranged at intervals, and the conductive column is electrically connected to the conductive through hole; the laser diode chip is installed on the heat sink and electrically connected to the conductive column; the fluorescent lens is used to convert the laser generated by the laser diode chip into white light, and the fluorescent lens is connected to the end of the heat sink away from the conductive through hole. The transmissive white light device has a good heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the technical field of white light devices, and in particular to a transmissive white light device. Background Art

[0002] At present, the technology of producing laser diodes is relatively mature, and laser diodes play a very significant role in many fields such as military, medicine, and industry. White light sources using laser diodes as excitation sources have the following advantages: 1) small size and high brightness, which provides a larger design space when designing the light distribution of the white light source; 2) relatively higher efficiency, and the light source is more green and energy-saving; 3) laser diodes do not have the "efficiency drop" phenomenon, and the light output intensity of a single chip can be enhanced to reduce the cost of the light source; therefore, white light sources based on laser diodes to excite fluorescent materials are a new generation of solid-state lighting sources with development potential and strong plasticity. However, existing white light devices usually have the problem of poor heat dissipation. Summary of the invention

[0003] The embodiment of the present application is to provide a transmissive white light device, which can improve the technical problem of poor heat dissipation effect.

[0004] The embodiment of the present application is implemented as follows:

[0005] The embodiment of the present application provides a transmissive white light device, comprising: a packaging structure with an installation space inside, an optical lens, a heat sink, a conductive column, a laser diode chip and a fluorescent lens; one end of the packaging structure has an opening, and the end of the packaging structure away from the opening has a conductive through hole; the optical lens is installed in the packaging structure and closes the opening; the heat sink is installed in the installation space; the conductive column is installed in the installation space, and the conductive column and the heat sink are spaced apart, and the conductive column is electrically connected to the conductive through hole; the laser diode chip is installed on the heat sink and electrically connected to the conductive column; the fluorescent lens is used to convert the laser generated by the laser diode chip into white light, and the fluorescent lens is connected to the end of the heat sink away from the conductive through hole.

[0006] In the above technical solution, the heat sink is installed in the installation space, the laser diode chip is installed on the heat sink and electrically connected to the conductive column, the conductive column is electrically connected to the conductive through hole, and the laser diode chip can emit laser light by introducing current through the conductive through hole. The fluorescent lens is used to convert the laser light generated by the laser diode chip into white light and emit it through the optical lens. When the laser irradiates the fluorescent lens, heat will be generated. The heat generated by the fluorescent lens can be transferred through the heat sink. The spacing between the conductive column and the heat sink is conducive to the dissipation of heat. Finally, the heat is dissipated through the conductive through hole and the packaging structure, which improves the heat dissipation effect of the transmission type white light device.

[0007] In a possible implementation, the packaging structure includes a substrate and a dam, the substrate has a conductive through hole, one end of the dam away from the opening is connected to the substrate, the heat sink and the conductive column are both installed on the substrate, and the substrate is a thermally conductive substrate.

[0008] In the above technical solution, the heat emitted by the laser diode chip when emitting laser can be transferred to the heat sink and the conductive column, and the heat generated when the laser irradiates the fluorescent lens can be transferred to the heat sink. The heat sink and the conductive column are both installed on the substrate, and the substrate is a thermally conductive substrate with good thermal conductivity. The heat transferred to the heat sink and the conductive column can be dissipated through the thermally conductive substrate, so that the heat dissipation effect is better.

[0009] In a possible implementation, the thermally conductive substrate is selected from any one of an aluminum nitride substrate, a silicon nitride substrate and an aluminum oxide substrate.

[0010] In the above technical solution, aluminum nitride, silicon nitride and aluminum oxide are all good thermal conductive materials, and the aluminum nitride substrate, silicon nitride substrate and aluminum oxide substrate made of these three materials can achieve good heat dissipation effects.

[0011] In one possible implementation, the dam is a thermally conductive dam.

[0012] In the above technical solution, the dam has a heat conducting effect and can play a certain role in heat dissipation, which is beneficial to dissipate the heat in the installation space and improve the heat dissipation effect of the transmission type white light device.

[0013] In a possible implementation, the transmissive white light device further includes an electrode pad, the electrode pad is connected to a side of the substrate away from the installation space, and the electrode pad is electrically connected to the conductive through hole.

[0014] In the above technical solution, the electrode pad is connected to the side of the substrate away from the installation space, which can more conveniently introduce current and enable the laser diode chip to excite laser.

[0015] In a possible implementation, the surface of the fluorescent lens includes a plane and a convex spherical surface, the circumferential edge of the convex spherical surface is connected to the edge of the plane, and the plane of the fluorescent lens is connected to an end of the heat sink away from the substrate.

[0016] In the above technical solution, the surface of the fluorescent lens includes a plane and a convex spherical surface. The plane of the fluorescent lens is connected to the end of the heat sink away from the substrate. When the laser diode chip emits laser, it enters the fluorescent lens from the plane to stimulate the fluorescent lens to produce fluorescence, so that the fluorescent lens has a higher light input rate; the fluorescence and the laser are mixed to form white light, and the circumferential edge of the convex spherical surface is connected to the edge of the plane, so that the white light emitted by the convex spherical surface is more focused, thereby improving the transmission efficiency.

[0017] In a possible implementation, a plurality of conductive pillars are provided, a plurality of laser diode chips are provided, the conductive pillars correspond to the laser diode chips one by one, and the plurality of conductive pillars and the plurality of laser diode chips are alternately distributed along the circumference of the heat sink.

[0018] In the above technical solution, multiple laser diode chips simultaneously emit lasers, which can help excite the fluorescent lens to produce fluorescence and mix with the laser into white light. By arranging the conductive columns and the laser diode chips in a one-to-one correspondence, the heat generated by each laser diode chip can be transferred through the heat sink and the corresponding conductive columns. The multiple conductive columns and the multiple laser diode chips are alternately distributed along the circumference of the heat sink, which is beneficial for the heat sink and the multiple conductive columns to dissipate heat from the substrate, thereby improving the heat dissipation effect of the transmission white light device.

[0019] In one possible implementation, the fluorescent lens is in contact with the conductive post.

[0020] In the above technical solution, the conductive column can provide partial support for the fluorescent lens, making the fluorescent lens more stable in the installation space. In addition, the conductive column can also transfer the heat generated by the fluorescent lens, which is more conducive to heat dissipation.

[0021] In a possible implementation, the fluorescent lens is a YAG fluorescent lens, and the laser diode chip is a blue laser diode chip.

[0022] In the above technical solution, the blue laser diode chip emits blue light to illuminate the YAG fluorescent lens, and the excited light is mixed with the blue light to form white light. The YAG fluorescent lens has good heat resistance and fluorescence conversion efficiency under the condition of color change and heating, which increases the service life of the transmissive white light device.

[0023] In one possible embodiment, the molecular formula of the fluorescent material of the fluorescent lens is 8Y 3 Al 5 O 12 :xCe 3+ , where x≤0.05.

[0024] In the above technical solution, the molecular formula of 8Y with x≤0.05 is adopted 3 Al 5 O 12 :xCe 3+ The fluorescent material is used as the fluorescent material of the fluorescent lens, which can maintain a stable fluorescence conversion efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a transmissive white light device provided in an embodiment of the present application;

[0027] Figure 2 An internal structure diagram of a transmissive white light device provided in an embodiment of the present application;

[0028] Figure 3 A cross-sectional view of a transmissive white light device provided in an embodiment of the present application;

[0029] Figure 4 An exploded view of a transmissive white light device provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of the structure of a fluorescent lens provided in an embodiment of the present application;

[0031] Figure 6 Performance test diagram of the fluorescent lens provided in the embodiments of the present application and a conventional fluorescent lens.

[0032] Icons: 10-transmissive white light device; 11-packaging structure; 110-installation space; 111-substrate; 1111-conductive through hole; 112-dam; 12-optical lens; 13-heat sink; 14-conductive column; 15-laser diode chip; 16-fluorescent lens; 161-plane; 162-convex spherical surface; 17-electrode pad; 18-solderable layer; 19-conductive wire. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0035] In the description of this application, it should be noted that the orientation or positional relationship indicated by the term "inside" is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0036] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] The present application embodiment provides a transmissive white light device 10, please refer to Figure 1-Figure 3 , Figure 1 shows a schematic structural diagram of a transmissive white light device 10, Figure 2 1 shows the internal structure of the transmissive white light device 10. Figure 3 A cross-sectional view of a transmissive white light device 10 is shown.

[0038] Please refer to Figure 1-Figure 4 The transmissive white light device 10 includes a packaging structure 11 having an installation space 110 therein, an optical lens 12 , a heat sink 13 , a conductive column 14 , a laser diode chip 15 and a fluorescent lens 16 .

[0039] One end of the package structure 11 has an opening, and the end of the package structure 11 away from the opening has a conductive through hole 1111. Exemplarily, the package structure 11 includes a substrate 111 and a dam 112, the dam 112 is a cylindrical structure, the conductive through hole 1111 is provided on the substrate 111, one end of the dam 112 has an opening, and the end of the dam 112 away from the opening is connected to the substrate 111. It should be noted that the substrate 111 and the dam 112 can be an integral structure, or they can be formed separately and then connected.

[0040] Please refer to Figure 2 and Figure 3, the heat sink 13 and the conductive column 14 are both installed in the installation space 110, the conductive column 14 is electrically connected to the conductive through-hole 1111, and the laser diode chip 15 is installed on the heat sink 13 and electrically connected to the conductive column 14. Then, the current introduced through the conductive through-hole 1111 and conducted through the conductive column 14 can enable the laser diode chip 15 to emit laser. Exemplarily, the laser diode chip 15 is electrically connected to the conductive column 14 through a conductive wire 19, and optionally, the conductive wire 19 is a conductive gold wire or a conductive copper wire. It is understandable that the laser diode chip 15 can also be electrically connected to the conductive column 14 by means of a conductive sheet or the like. The embodiment of the present application does not limit the specific method of electrically connecting the laser diode chip 15 and the conductive column 14, as long as the two can be electrically connected.

[0041] Exemplarily, the heat sink 13 and the conductive column 14 are both mounted on the substrate 111. It is understandable that the heat sink 13 may be mounted on the substrate 111, and the conductive column 14 may be mounted on the dam 112. Optionally, the dam 112 is made of insulating material to avoid leakage.

[0042] The fluorescent lens 16 is used to convert the laser light generated by the laser diode chip 15 into white light. The fluorescent lens 16 is connected to one end of the heat sink 13 away from the conductive through hole 1111 (refer to Figure 3 ). The laser light generated by the laser diode chip 15 is converted into white light by the fluorescent lens 16 and then emitted through the optical lens 12. Please refer to Figure 1 and Figure 3 Exemplarily, the optical lens 12 is a convex lens, which has a focusing effect, can improve the gathering effect of white light, and improve the transmission efficiency.

[0043] When the laser irradiates the fluorescent lens 16, heat will be generated. The heat generated by the fluorescent lens 16 can be transferred through the heat sink 13. The conductive column 14 and the heat sink 13 are arranged at intervals to facilitate the heat dissipation. Finally, the heat is dissipated through the substrate 111 and the conductive through hole 1111, thereby improving the heat dissipation effect of the transmission type white light device 10. Optionally, the fluorescent lens 16 is in contact with the conductive column 14, and the conductive column 14 can provide partial support for the fluorescent lens 16, so that the fluorescent lens 16 is more stable in the installation space 110; in addition, the conductive column 14 can also transfer the heat generated by the fluorescent lens 16, thereby being more conducive to heat dissipation.

[0044] Further, in a possible implementation, a plurality of conductive pillars 14 are provided, a plurality of laser diode chips 15 are provided, the conductive pillars 14 correspond to the laser diode chips 15 one by one, and the plurality of conductive pillars 14 and the plurality of laser diode chips 15 are alternately distributed along the circumference of the heat sink 13. The simultaneous emission of lasers by the plurality of laser diode chips 15 can help excite the fluorescent lens 16 to generate fluorescence and mix with the laser to form white light. By providing the conductive pillars 14 and the laser diode chips 15 in one-to-one correspondence, the heat generated by each laser diode chip 15 can be transferred through the heat sink 13 and the corresponding conductive pillars 14. The plurality of conductive pillars 14 and the plurality of laser diode chips 15 are alternately distributed along the circumference of the heat sink 13, which is beneficial for the heat sink 13 and the plurality of conductive pillars 14 to dissipate heat from the substrate 111, thereby improving the heat dissipation effect of the transmission-type white light device 10.

[0045] For example, Figure 2 As shown, the heat sink 13 is in the shape of a square column, four laser diode chips 15 are respectively connected to the four surfaces of the square column, four conductive columns 14 are respectively arranged at the four corners of the square column, and the four conductive columns 14 and the four laser diode chips 15 are alternately distributed along the circumference of the heat sink 13. The four laser diode chips 15 are respectively connected to the four surfaces of the square column, and the heat generated by each laser diode chip 15 is transferred to the heat sink 13 through one of the surfaces, which is beneficial for the heat sink 13 to dissipate the heat and can avoid the heat concentrated on one surface to cause damage to the heat sink 13. The four conductive columns 14 are respectively arranged at the four corners of the square column, so that the distance between the conductive columns 14 and the heat sink 13 is appropriate, which is beneficial to heat dissipation. In addition, such a setting method makes the overall structural layout reasonable, while ensuring good heat dissipation, reducing the overall volume of the transmission-type white light device 10.

[0046] In order to improve the heat dissipation effect of the transmissive white light device 10, the dam 112 may be a heat conductive dam, that is, the dam 112 is made of a heat conductive material. The dam 112 has a heat conductive effect and can play a certain heat dissipation role, which is conducive to dissipating the heat in the installation space 110 and improving the heat dissipation effect of the transmissive white light device 10. At the same time, in order to satisfy that the dam 112 has both a heat conductive effect and an insulating effect, illustratively, the material of the dam 112 is any one of aluminum nitride, silicon nitride and aluminum oxide.

[0047] In addition, the substrate 111 may be a heat-conducting substrate. The heat emitted by the laser diode chip 15 when emitting laser light can be transferred to the heat sink 13 and the conductive column 14, and the heat generated when the laser irradiates the fluorescent lens 16 can be transferred to the heat sink 13. The heat sink 13 and the conductive column 14 are both mounted on the substrate 111, and the substrate 111 is a heat-conducting substrate. The substrate 111 has good heat-conducting function, and the heat transferred to the heat sink 13 and the conductive column 14 can be dissipated through the heat-conducting substrate, so that the heat dissipation effect is better.

[0048] Exemplarily, the thermally conductive substrate is selected from any one of an aluminum nitride substrate, a silicon nitride substrate and an aluminum oxide substrate. Aluminum nitride, silicon nitride and aluminum oxide are all good thermally conductive materials, and the aluminum nitride substrate, silicon nitride substrate and aluminum oxide substrate made of these three materials can achieve good heat dissipation effects. It should be noted that in this setting, the conductive through hole 1111 is filled with a conductive material, such as copper paste or silver paste, and the conductive material in the conductive through hole 1111 is electrically connected to the conductive column 14.

[0049] Exemplarily, the thermally conductive substrate may also be a metal substrate having an insulating layer, wherein the insulating layer is disposed on a side of the metal substrate away from the installation space 110. Exemplarily, the metal substrate is an aluminum substrate or a copper substrate. It should be noted that in this configuration, the conductive through hole 1111 located in the insulating layer is filled with a conductive material, such as copper paste or silver paste, and is electrically connected to the conductive column 14 through the conductive material in the conductive through hole 1111.

[0050] Exemplarily, the conductive pillars 14 are installed corresponding to the conductive through holes 1111 and cover the conductive through holes 1111 to better achieve electrical connection between the conductive through holes 1111 and the conductive pillars 14 .

[0051] For further information, please refer to Figure 1 and Figure 4 The transmissive white light device 10 further includes an electrode pad 17, which is connected to a side of the substrate 111 away from the installation space 110, and is electrically connected to the conductive through hole 1111. Connecting the electrode pad 17 to a side of the substrate 111 away from the installation space 110 can more conveniently introduce current, so that the laser diode chip 15 can excite laser light.

[0052] The fluorescent lens 16 is specifically introduced below:

[0053] Please refer to Figure 5In a possible implementation, the surface of the fluorescent lens 16 includes a plane 161 and a convex spherical surface 162, the circumferential edge of the convex spherical surface 162 is connected to the edge of the plane 161, and the plane 161 of the fluorescent lens 16 is connected to an end of the heat sink 13 away from the substrate 111. Exemplarily, the plane 161 of the fluorescent lens 16 is connected to the heat sink 13 through the solderable layer 18.

[0054] When the laser diode chip 15 emits laser light, it enters the fluorescent lens 16 from the plane 161 of the fluorescent lens 16 to form white light, so that the fluorescent lens 16 has a higher light entry rate; the circumferential edge of the convex spherical surface 162 is connected to the edge of the plane 161, so that the white light emitted by the convex spherical surface 162 is more focused, thereby improving the transmission efficiency. It should be noted that the shape of the fluorescent lens 16 in the embodiment of the present application can be selected according to needs.

[0055] Exemplarily, the laser diode chip 15 is a blue laser diode chip 15, and the fluorescent material of the fluorescent lens 16 can be a yellow fluorescent substance. The blue laser diode chip 15 emits blue light to excite the yellow fluorescent substance of the fluorescent lens 16, and the yellow fluorescent substance emits yellow light under the excitation of the blue light, which mixes with part of the blue light transmitted from the fluorescent lens 16 to form white light. It should be noted that the embodiment of the present application does not specifically limit the types of the fluorescent lens 16 and the laser diode chip 15, as long as the light emitted by the laser diode chip 15 and the light emitted by the fluorescent lens 16 can be mixed to form white light.

[0056] In a possible implementation, the laser diode chip 15 is a blue laser diode chip 15, and the fluorescent lens 16 is a YAG fluorescent lens 16, that is, the main component of the YAG fluorescent lens 16 is Y 3 Al 5 O 12 The blue laser diode chip emits blue light to illuminate the YAG fluorescent lens 16, and the excited light is mixed with the blue light to form white light. The YAG fluorescent lens 16 has good heat resistance under the condition of color change and heating, which increases the service life of the transmissive white light device 10. Exemplarily, the thickness of the fluorescent lens 16 is 0.1-5 mm, for example, any one of 0.1, 0.3, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4 and 5, or a range between any two of them.

[0057] Furthermore, the molecular formula of the fluorescent material of the fluorescent lens 16 is 8Y 3 Al 5 O 12 :xCe 3+ , wherein x≤0.05, illustratively, x is 0.01, 0.02, 0.03, 0.04 or 0.05. The molecular formula with x≤0.05 is 8Y 3 Al5 O 12 :xCe 3+ The fluorescent material is used as the fluorescent material of the fluorescent lens 16, and the fluorescent lens 16 has good heat resistance and good stability.

[0058] The inventors have found that in the thermal quenching test, the quantum efficiency of conventional fluorescent materials at a temperature of 150°C is less than 80% of its quantum efficiency at a temperature of 25°C, while the molecular formula of 8Y provided in the embodiment of the present application is 3 Al 5 O 12 :3Ce 3+ The quantum efficiency of the YAG fluorescent lens 16 at a temperature of 150° C. can be maintained at about 99.5% of the quantum efficiency at a temperature of 25° C. (refer to Figure 6 , Figure 6 The YAG ceramics in the present invention represent the molecular formula of 8Y 3 Al 5 O 12 :3Ce 3+ The YAG fluorescent lens 16 of the embodiment of the present application has a higher conversion efficiency than conventional fluorescent materials under the condition of absorption excitation conversion at 150° C., and can maintain a stable fluorescence conversion efficiency. The fluorescent lens 16 has good heat resistance, stability and fluorescence conversion efficiency.

[0059] Exemplarily, the method for preparing the fluorescent lens 16 includes the following steps:

[0060] The ceramic powder is vacuum sintered at 1730-1800℃ for 5-30 hours, kept at 1200-1500℃ for 5-40 hours and then cooled. The ceramic powder includes Y 2 O 3 、Al 2 O 3 and CeO 2 For example, the vacuum degree of the vacuum sintering step is 10 -3 -10 -5 Pa.

[0061] Optionally, the preparation method further comprises: mixing the ceramic powder and a sintering aid and then performing vacuum sintering, wherein the sintering aid comprises MgO and SiO 2 Exemplarily, the mass ratio of the sintering aid to the ceramic powder is less than 1%, for example, 1%.

[0062] The working principle of the transmissive white light device 10 of the present embodiment is as follows:

[0063] The heat sink 13 is installed in the installation space 110, the laser diode chip 15 is installed on the heat sink 13 and electrically connected to the conductive column 14, the conductive column 14 is electrically connected to the conductive through hole 1111, and the laser diode chip 15 can emit laser light by introducing current through the conductive through hole 1111. The fluorescent lens 16 is used to convert the laser light generated by the laser diode chip 15 into white light and emit it through the optical lens 12. When the laser irradiates the fluorescent lens 16, heat will also be generated. Since the heat sink 13 supports the fluorescent lens 16 away from the substrate 111, the heat can be effectively dissipated in the installation space 110. The spacing between the conductive column 14 and the heat sink 13 is conducive to the dissipation of heat. Finally, the heat is dissipated from the installation space 110 through the conductive through hole 1111, which improves the heat dissipation effect of the transmission type white light device 10.

[0064] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A transmissive white light device, characterized in that: include: A packaging structure having an installation space inside, one end of the packaging structure having an opening, and an end of the packaging structure away from the opening having a conductive through hole; an optical lens, the optical lens being mounted on the packaging structure and closing the opening; A heat sink, the heat sink being installed in the installation space; A conductive column, wherein the conductive column is installed in the installation space, the conductive column is spaced apart from the heat sink, and the conductive column is electrically connected to the conductive through hole; a laser diode chip, the laser diode chip being mounted on the heat sink and electrically connected to the conductive column; and A fluorescent lens, used for converting the laser light generated by the laser diode chip into white light, wherein the fluorescent lens is connected to an end of the heat sink away from the conductive through hole; the fluorescent lens is in contact with the conductive column; The packaging structure comprises a substrate and a dam, the substrate has the conductive through hole, one end of the dam away from the opening is connected to the substrate, the heat sink and the conductive column are both mounted on the substrate, and the substrate is a heat-conducting substrate; The transmissive white light device further includes an electrode pad connected to a side of the substrate away from the installation space, and the electrode pad is electrically connected to the conductive through hole.

2. The transmissive white light device according to claim 1, characterized in that: The thermally conductive substrate is selected from any one of an aluminum nitride substrate, a silicon nitride substrate and an aluminum oxide substrate.

3. The transmissive white light device according to claim 1, wherein: The dam is a heat-conducting dam.

4. The transmissive white light device according to any one of claims 1 to 3, characterized in that: The surface of the fluorescent lens includes a plane and a convex spherical surface, the circumferential edge of the convex spherical surface is connected with the edge of the plane, and the plane of the fluorescent lens is connected to an end of the heat sink away from the substrate.

5. The transmissive white light device according to any one of claims 1 to 3, characterized in that: There are a plurality of the conductive pillars and a plurality of the laser diode chips, the conductive pillars correspond to the laser diode chips one by one, and the conductive pillars and the laser diode chips are alternately distributed along the circumference of the heat sink.

6. The transmissive white light device according to any one of claims 1 to 3, characterized in that: The fluorescent lens is a YAG fluorescent lens, and the laser diode chip is a blue laser diode chip.

7. The transmissive white light device according to any one of claims 1 to 3, characterized in that: The molecular formula of the fluorescent material of the fluorescent lens is 8Y3Al5O 12 :xCe 3+ , where x≤0.05.

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