Antenna package and method of manufacturing the same

Abstract

An antenna package includes a patterned antenna structure and an encapsulant. The patterned antenna structure includes a first surface, a second surface opposite the first surface, and a third surface extending between the first surface and the second surface. The encapsulant is disposed on the first surface of the patterned antenna structure. The third surface of the patterned antenna structure includes a first portion covered by the encapsulant and a second portion exposed from the encapsulant.

Description

Technical Field

[0001] This invention generally relates to antenna packaging, and more specifically, to antenna packaging comprising a patterned antenna structure and a method of manufacturing the same. Background Technology

[0002] Chip antennas have become widely used as antenna structures for IC packaging. Currently, in the manufacture of chip antennas, electroplating or sputtering operations are typically used to form antenna patterns on a substrate, dielectric material, or molding compound. However, electroplating or sputtering operations may not be efficient in terms of time or cost in order to obtain antenna patterns with sufficient thickness for various applications. Summary of the Invention

[0003] In one aspect, according to some embodiments, the antenna package includes a patterned antenna structure and an encapsulation. The patterned antenna structure includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first and second surfaces. The encapsulation is disposed on the first surface of the patterned antenna structure. The third surface of the patterned antenna structure includes a first portion covered by the encapsulation and a second portion exposed from the encapsulation.

[0004] In another embodiment, according to some embodiments, a semiconductor package includes a substrate, a semiconductor die, and an antenna package. The semiconductor die is disposed on and electrically connected to the substrate. The antenna package is disposed on and electrically connected to the substrate. The antenna package includes an encapsulation and a patterned antenna structure. The patterned antenna structure is disposed on the encapsulation. The patterned antenna structure of the antenna package includes a metal extension extending between the encapsulation of the antenna package and the semiconductor die.

[0005] In another aspect, according to some embodiments, a method of manufacturing an antenna package includes: providing a metal plate having a first surface and a second surface opposite to the first surface; forming a first patterned recess on the first surface of the metal plate; forming an encapsulation on the first surface of the metal plate and into the first patterned recess; and forming a second patterned recess on the second surface of the metal plate and connecting it to the first patterned recess to define a first antenna pattern. The first antenna pattern extends into the encapsulation in a direction away from the second surface of the metal plate. Attached Figure Description

[0006] The various aspects of the invention are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that various features may not be drawn to scale, and the dimensions of features depicted in the drawings may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1A A cross-sectional view illustrating an antenna package according to some embodiments of the present invention is provided.

[0008] Figure 1B A cross-sectional view illustrating an antenna package according to some embodiments of the present invention is provided.

[0009] Figure 1C A cross-sectional view illustrating an antenna package according to some embodiments of the present invention is provided.

[0010] Figure 2A A cross-sectional view illustrating an antenna package according to some embodiments of the present invention is provided.

[0011] Figure 2B A cross-sectional view illustrating an antenna package according to some embodiments of the present invention is provided.

[0012] Figure 2C A perspective view illustrating an antenna package according to some embodiments of the present invention.

[0013] Figure 3A A cross-sectional view of a semiconductor package according to some embodiments of the present invention is shown.

[0014] Figure 3B A top view illustrating a semiconductor package according to some embodiments of the present invention.

[0015] Figure 4A A cross-sectional view of a semiconductor package according to some embodiments of the present invention is shown.

[0016] Figure 4B A top view illustrating a semiconductor package according to some embodiments of the present invention.

[0017] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Figure 5F , Figure 5G and Figure 5H This is a cross-sectional view of an antenna package manufactured at various stages according to some embodiments of the present invention.

[0018] Figure 6A , Figure 6B , Figure 6C , Figure 6D , Figure 6E and Figure 6F This is a cross-sectional view of an antenna package manufactured at various stages according to some embodiments of the present invention.

[0019] Figure 7A , Figure 7B , Figure 7C , Figure 7D and Figure 7E This is a cross-sectional view of a semiconductor package manufactured at various stages according to some embodiments of the present invention.

[0020] Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8E This is a cross-sectional view of a semiconductor package manufactured at various stages according to some embodiments of the present invention.

[0021] Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar elements. The invention will be readily understood from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation

[0022] According to some embodiments of the present invention relating to the manufacture of antenna packages, by forming a molding compound on a lead frame or metal structure on which an antenna pattern is formed, the thickness of the antenna pattern exposed from the molding compound can be well controlled to improve signal transmission, and the manufacture of the antenna package can be more efficient and cost-effective.

[0023] Figure 1A A cross-sectional view of an antenna package 1a according to some embodiments of the present invention is shown. The antenna package 1a includes a patterned antenna structure 10, an encapsulation 20, a conductive layer 30, a shielding layer 40, electrical contacts 50, and conductive elements 60 and 70.

[0024] The patterned antenna structure 10 includes a surface 101, a surface 102 opposite to surface 101, and a surface 103 extending between surface 101 and surface 102. In some embodiments, surface 103 includes a portion 1031 and a portion 1032 connected to portion 1031. In some embodiments, portions 1031 and 1032 of surface 103 are not coplanar. For example, portions 1031 and 1032 define an angle of less than 180 degrees. The patterned antenna structure 10 may comprise a metal plate, may be a metal plate, or may be made of a metal plate. The patterned antenna structure 10 may comprise, for example, aluminum (Al), copper (Cu), chromium (Cr), tin (Sn), gold (Au), silver (Ag), nickel (Ni), or stainless steel, or mixtures, alloys, or other combinations thereof.

[0025] Conductive elements 60 and 70 are disposed on the surface 101 of the patterned antenna structure 10. Conductive elements 60 and / or 70 may comprise Al, Cu, Cr, Sn, Au, Ag, Ni, or stainless steel, or mixtures, alloys, or other combinations thereof. In some embodiments, conductive element 60 may be a conductive wire and may have a bump portion 61 that contacts the patterned antenna structure 10. In some embodiments, conductive element 70 may have a pin or post structure.

[0026] Electrical contacts 50 are disposed on conductive elements 60 and 70. Electrical contacts 50 are electrically connected to the patterned antenna structure 10 via conductive elements 60 and 70. Electrical contacts 50 may contain solder. Electrical contacts 50 provide electrical connections for the patterned antenna structure 10 to external devices.

[0027] Encapsulation 20 is disposed on the surface 101 of the patterned antenna structure 10. Encapsulation 20 covers a portion of the surface 101 of the patterned antenna structure 10, conductive elements 60 and 70, and electrical contacts 50. In some embodiments, encapsulation 20 covers a portion 1031 of the surface 103 of the patterned antenna structure 10 and exposes a portion 1032 of the surface 103 of the patterned antenna structure 10. Encapsulation 20 may comprise an epoxy resin with filler, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material having silicone dispersed therein, or a combination thereof.

[0028] A space 15 is defined by the surface 103 of the patterned antenna structure 10. A portion of the encapsulation 20 is exposed through the space 15. For example, a portion of the bottom surface of the encapsulation 20 is exposed from the space 15. The encapsulation 20 is disposed within a portion of the space 15. In some embodiments, the ratio of the width W of the space 15 to the thickness T of the patterned antenna structure 10 is less than 1. This ratio configuration during the manufacture of the antenna package 1a can facilitate some patterning operations, such as etching operations. The ratio configuration during the manufacture of the antenna package 1a can reduce deformation of the patterned antenna structure 10.

[0029] Space 15 includes portions 151 and 152. Portion 151 is defined by portion 1031 of the surface 103 of the patterned antenna structure 10. Portion 152 is defined by portion 1032 of the surface 103 of the patterned antenna structure 10. Portions 151 and 152 may have a gradually narrowing shape. Portion 151 of space 15 gradually narrows in the direction from the surface 102 of the patterned antenna structure 10 to the patterned antenna structure 10. Portion 152 of space 15 gradually narrows in the direction from the surface 101 of the patterned antenna structure 10 to the patterned antenna structure 10. In some embodiments, the depth D1 of portion 151 of space 15 is less than the depth D2 of portion 152 of space 15. In some embodiments, the ratio of the depth D1 of portion 151 of space 15 to the thickness T of the patterned antenna structure 10 is greater than 0 and less than about 0.5. Depth configuration may increase the portion (or depth) of the patterned antenna structure 10 exposed from the encapsulation 20. Deep configuration can increase the radiation efficiency (e.g., radiation in the lateral direction) of the antenna package.

[0030] exist Figure 1AIn the patterned antenna structure 10, an extension 17 is included. The extension 17 may contain an antenna pattern. The antenna pattern on the extension 17 can be used to adjust the overall radiation pattern for the antenna package 1a.

[0031] A conductive layer 30 is disposed on the surface 102 of the patterned antenna structure 10. In some embodiments, the conductivity of the conductive layer 30 is greater than the conductivity of the patterned antenna structure 10. The conductive layer 30 may comprise Ni, Au, or an alloy thereof. The configuration of the conductive layer 30 can improve the conductivity, radiation, or transmission efficiency of the antenna package 1a. The configuration of the conductive layer 30 can produce a better skin effect for the antenna package 1a, which improves the performance of the antenna package 1a.

[0032] A shielding layer 40 is disposed on the encapsulation 20. The shielding layer 40 may be conformally disposed on the encapsulation 20. The shielding layer 40 covers the encapsulation 20. The shielding layer 40 is insulated from the electrical contacts 50. In some embodiments, the shielding layer 40 is a conductive film and may contain, for example, Al, Cu, Cr, Sn, Au, Ag, Ni, or stainless steel, or mixtures, alloys, or other combinations thereof. The shielding layer 40 can be used to reduce or eliminate electromagnetic interference (EMI) between the antenna package 1a and other devices.

[0033] Figure 1B A cross-sectional view of antenna package 1b according to some embodiments of the present invention is illustrated. Antenna package 1b is similar to... Figure 1A The antenna package 1a in the text has some differences as described below.

[0034] The patterned antenna structure 10 of antenna package 1b does not have an extension 17. The end 10e of the patterned antenna structure 10 is coplanar with the sidewall 20s of the encapsulation 20 or with the sidewall 40s of the shielding layer 40. The surface 103 of the patterned antenna structure 10 is fully exposed from the encapsulation 20. The encapsulation 20 is not placed in the space 15. The portion (or depth) of the patterned antenna structure 10 exposed from the encapsulation 20 in antenna package 1b can be greater than the portion (or depth) of the patterned antenna structure 10 exposed from the encapsulation 20 in antenna package 1a. Antenna package 1b may have better radiation efficiency (e.g., in the lateral direction) compared to antenna package 1a.

[0035] Figure 1C This illustration shows a cross-sectional view of an antenna package 1c according to some embodiments of the present invention. The antenna package 1c is similar to... Figure 1A The antenna package 1a in the text has some differences as described below.

[0036] The extension 17 of the patterned antenna structure 10 is tilted or bent toward the encapsulation 20. The extension 17 may contact the encapsulation 20 or the shielding layer 40. Figure 1C In the embodiment shown, the extension 17 extends along the sidewall 20s of the encapsulation 20. The end 10e of the patterned antenna structure 10 may be coplanar with the top surface of the encapsulation 20 or with the top surface of the shielding layer 40. In some embodiments, the extension 17 functions as a 3D antenna. In some embodiments, the extension 17 comprises a metal plate and may reduce or eliminate EMI between the antenna package 1c and other devices.

[0037] Figure 2A A cross-sectional view of an antenna package 2a according to some embodiments of the present invention is shown. The antenna package 2a includes a substrate 80, an encapsulation 20, electrical contacts 50, and conductive elements 60 and 70. In some embodiments, the antenna package 2a is similar to... Figure 1A The antenna package 1a in the above is different in that the conductive layer 30 and the shielding layer 40 of the antenna package 1a are omitted, and the patterned antenna structure 10 of the antenna package 1a is replaced by the substrate 80.

[0038] The substrate 80 may be or may contain printed circuitry, such as a flexible printed circuit (FPC). The substrate 80 includes an antenna array (or antenna pattern) 82 and a shielding layer 84. The antenna array 82 is disposed on a surface 802 of the substrate 80. The antenna array 82 may have [missing information - likely related to antenna design or shielding]. Figure 1A The patterned antenna structure 10 in the antenna package 1a has the same or similar characteristics or functions as the antenna package 1a. Figure 1A The antenna package 1a contains a patterned antenna structure 10. The antenna array 82 can be electrically connected to the electrical contact 50 via conductors 86 and conductive elements 60 and 70 within the substrate 80. A shielding layer 84 is disposed on the surface 801 of the substrate 80. The shielding layer 84 may have a shape similar to... Figure 1A The shielding layer 40 of the antenna package 1a has the same or similar characteristics or acts as... Figure 1A The antenna package 1a has a shielding layer 40. The shielding layer 84 can reduce or eliminate EMI between the antenna array 82 and other electrical components inside or outside the antenna package 2a.

[0039] Figure 2B A cross-sectional view of the antenna package 2b according to some embodiments of the present invention is illustrated. The antenna package 2b is similar to... Figure 2A The antenna package 2a in the text has some differences as described below.

[0040] An extension 805 of the substrate 80 is inclined or bent toward the encapsulation 20. The extension 805 may contact the sidewall 20s of the encapsulation 20. The extension 805 includes an antenna array 822. The antenna array 822 can function as a 3D antenna.

[0041] Figure 2CThis illustration shows a perspective view of an antenna package 2c according to some embodiments of the present invention. The antenna package 2c is similar to... Figure 2B Antenna package 2b in the example. (e.g.) Figure 2C As shown, antenna array 82 is disposed on surface 802 of substrate (e.g., FPC) 80. Antenna array 822 is disposed on the lateral side of antenna package 2c.

[0042] Figure 3A A cross-sectional view of a semiconductor package 3a according to some embodiments of the present invention is shown. The semiconductor package 3a includes a substrate 300, a semiconductor die 400, a package body 500, and an antenna package 1c.

[0043] The substrate 300 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. The substrate 300 may include interconnect structures, such as a redistribution layer (RDL) or a grounding element.

[0044] Semiconductor die 400 is disposed on and electrically connected to substrate 300. Semiconductor die 400 can be mounted on substrate 300 by die bonding, flip-chip bonding, or any suitable operation. Semiconductor die 400 may be a chip or die containing a semiconductor substrate, one or more integrated circuit devices, and one or more overlay interconnect structures. Integrated circuit devices may include active devices such as transistors and / or passive devices such as resistors, capacitors, inductors, or combinations thereof.

[0045] A package body 500 is disposed on a substrate 300. The package body 500 covers the substrate 300. The package body 500 covers a semiconductor die 400. The semiconductor die 400 is embedded in the package body 500. In some embodiments, the package body 500 comprises an epoxy resin having a filler, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material having silicone dispersed therein, or a combination thereof.

[0046] Antenna package 1c and Figure 1C The antenna package 1c described herein is the same as or similar to that described elsewhere, and includes a patterned antenna structure 10, an encapsulation 20, and electrical contacts 50. The patterned antenna structure 10 is disposed on the encapsulation 20. The antenna package 1c is disposed on and electrically connected to the substrate 300. Figure 3A In the embodiment shown, the antenna package 1c is electrically connected to the substrate 300 via a connection between the electrical contacts 50 of the antenna package 1c and the conductive element 600. The conductive element 600 is surrounded or covered by the package body 500 and is electrically connected to the substrate 300.

[0047] The patterned antenna structure 10 of the antenna package 1c includes an extension 17, which may be a metallic extension. The extension 17 extends between the encapsulation 20 of the antenna package 1c and the semiconductor die 400. The extension 17 may include a shielding layer. The extension 17 may reduce or eliminate EMI between the antenna package 1c and the semiconductor die 400.

[0048] like Figure 3A As shown, the antenna package 1c is exposed from the package body 500. The antenna package 1c is disposed in a recess that is recessed from the surface 501 of the package body 500. The patterned antenna structure 10 can be disposed above the surface 501 of the package body 500.

[0049] Figure 3B A top view of a semiconductor package 3b according to some embodiments of the present invention is shown. An example of a patterned antenna structure 10 of an antenna package 1c is shown.

[0050] Figure 4A A cross-sectional view of a semiconductor package 4a according to some embodiments of the present invention is illustrated. The semiconductor package 4a is similar to... Figure 3A The semiconductor package 3a in the text has some differences as described below.

[0051] Antenna package 1c is disposed on surface 501 of package body 500. Antenna package 1c may be completely above surface 501 of package body 500. Extension 17 may contain antenna pattern. Extension 17 may function as a 3D antenna.

[0052] Figure 4B A top view of a semiconductor package 4b ​​according to some embodiments of the present invention is shown. An example of a patterned antenna structure 10 of an antenna package 1c is shown.

[0053] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Figure 5F , Figure 5G and Figure 5H This is a cross-sectional view of an antenna package 5h manufactured at various stages according to some embodiments of the present invention. The figures have been simplified for a better understanding of the various aspects of the invention.

[0054] refer to Figure 5AA metal plate (which may be a lead frame or a portion thereof) 510 is provided. The metal plate 510 has a surface 511 and a surface 512 opposite to the surface 511. A patterned recess R1 is formed on the surface 511 of the metal plate 510. The patterned recess R1 can be formed by an etching operation, for example, a half-etching operation. In some embodiments, the depth of the patterned recess R1 is less than half the thickness of the metal plate 510. A conductive layer 30 may be formed on the surface 512 of the metal plate 510. The conductive layer 30 has an opening O1 exposing a portion of the surface 512 corresponding to the patterned recess R1. The conductivity of the conductive layer 30 may be greater than the conductivity of the metal plate 510.

[0055] refer to Figure 5B Conductive elements 60 and 70 are formed on the surface 511 of the metal plate 510. Conductive element 60 can be a conductive wire and can be formed by wire bonding operation. Conductive element 70 can be a conductive post or conductive pin (e.g., a copper post or copper pin) and can be connected to the metal plate 510 by solder.

[0056] refer to Figure 5C Encapsulant 20 is formed on surface 511 of metal plate 510. Encapsulant 20 is formed in a patterned recess R1. A portion 517 of metal plate 510 is not covered by encapsulant 20. Encapsulant 20 can be formed by any suitable operation, such as selective molding or dispensing.

[0057] refer to Figure 5D A patterned recess R2 is formed on the surface 512 of the metal plate 510. The patterned recess R2 corresponds to the patterned recess R1. The patterned recess R2 is formed to connect to the patterned recess R1 to define a patterned antenna structure 10 including a surface 103. The surface 103 includes a portion 1031 covered by an encapsulant 20 and a portion 1032 exposed from the encapsulant 20. The patterned antenna structure 10 extends into the encapsulant 20. The patterned recess R2 can be formed by an etching operation. During the etching operation, the conductive layer 30 can be used as a stop layer.

[0058] refer to Figure 5E A shielding layer 40 is formed on the encapsulant 20. The shielding layer 40 is formed to cover the encapsulant 20. The shielding layer 40 can be formed by electroplating or sputtering.

[0059] refer to Figure 5F A through-hole (or die through-hole, TMV) V1 is formed through the shielding layer 40 and into the encapsulation 20 to expose the conductive elements 60 and 70. The through-hole V1 can be formed by any suitable operation, such as drilling or etching.

[0060] refer to Figure 5GElectrical contact 50 is formed in through hole V1. Electrical contact 50 is formed to be electrically connected to conductive elements 60 and 70. Electrical contact 50 may be formed to be electrically insulated from shielding layer 40. Electrical contact 50 may contain solder and can be formed by any suitable operation, such as ball mounting operation.

[0061] refer to Figure 5H , not by Figure 5G A portion 17 of the patterned antenna structure 10, covered by the encapsulation 20, bends toward the encapsulation 20. The portion 17 can be bent to contact the sidewalls 20s of the encapsulation 20. In some embodiments, the antenna pattern can be... Figure 5A Etching operations in Figure 5D The etching operation or other operations are performed on part 17 to form the antenna package 5h. The antenna package 5h can be combined with... Figure 1C The antenna package is the same as or similar to that in 1c.

[0062] Figure 6A , Figure 6B , Figure 6C , Figure 6D , Figure 6E and Figure 6F This is a cross-sectional view of the antenna package 6f manufactured at various stages according to some embodiments of the present invention. The figures have been simplified for a better understanding of the various aspects of the invention.

[0063] refer to Figure 6A An FPC 80 is provided. The FPC 80 includes an antenna array 82, a shielding layer 84, and a conductor 86. The FPC 80 may have features similar to those found in... Figure 2A or Figure 2B The properties of substrate 80 described herein are similar to those of substrate 80.

[0064] refer to Figure 6B Conductive elements 60 and 70 are formed on conductor 86 of FPC 80. Conductive element 60 can be a conductive wire and can be formed by wire bonding operation. Conductive element 70 can be a conductive post or conductive pin (e.g., a copper post or copper pin) and can be connected to conductor 86 by solder.

[0065] refer to Figure 6C Encapsulation 20 is formed on FPC 80. Encapsulation 20 is formed to cover shielding layer 84 and conductive elements 60 and 70. A portion 805 of FPC 80 is not covered by encapsulation 20. Encapsulation 20 can be formed by any suitable operation, such as selective molding or dispensing.

[0066] refer to Figure 6DA through-hole (or die through-hole, TMV) V1 is formed in the encapsulation 20 to expose conductive elements 60 and 70. The through-hole V1 can be formed by any suitable operation, such as drilling or etching.

[0067] refer to Figure 6E Electrical contact 50 is formed in through hole V1. Electrical contact 50 is formed to be electrically connected to conductive elements 60 and 70. Electrical contact 50 may contain solder and can be formed by any suitable operation, such as ball mounting.

[0068] refer to Figure 6F A portion 805 of the FPC 80 bends toward the encapsulation 20. The portion 805 can be bent to contact the sidewall 20s of the encapsulation 20. An antenna pattern can be formed on the portion 805, forming an antenna package 6f. The antenna package 6f can be coupled with... Figure 2B The antenna package 2b is the same as or similar to that in the previous version.

[0069] Figure 7A , Figure 7B , Figure 7C , Figure 7D and Figure 7E This is a cross-sectional view of a semiconductor package 7e manufactured at various stages according to some embodiments of the present invention. The figures have been simplified for a better understanding of the various aspects of the invention.

[0070] refer to Figure 7A A substrate 300 is provided. A semiconductor die 400 is mounted on the substrate 300. The semiconductor die 400 can be mounted via flip-chip bonding, die bonding, or die-attach film (DAF) bonding. A conductive element 600 is disposed on the substrate 300 for electrical connection to the substrate 300. The conductive element 600 may contain solder and can be disposed via ball mounting.

[0071] refer to Figure 7B The package body 500 is formed on the substrate 300 to cover the semiconductor die 400 and the conductive element 600. The package body 500 can be formed by molding.

[0072] refer to Figure 7C A portion of the package body 500 is removed to form a recess that is recessed into the surface 501 of the package body 500. The removal operation can be performed by a half-cutting operation, a drilling operation, or an etching operation.

[0073] refer to Figure 7D A through-hole (or die through-hole, TMV) V2 is formed to expose the conductive element 600. The through-hole V2 can be formed by any suitable operation, such as drilling or etching.

[0074] refer to Figure 7EThe antenna package 1c is mounted on the conductive element 600. The antenna package 1c and... Figure 3A The antenna package 1c described herein is the same as or similar to that described herein. The antenna package 1c can be mounted using surface mount technology (SMT) to form a semiconductor package 7e. The semiconductor package 7e can be... Figure 3A The semiconductor package 3a is the same as or similar to that in the example.

[0075] Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8E This is a cross-sectional view of a semiconductor package 8e manufactured at various stages according to some embodiments of the present invention. The figures have been simplified for a better understanding of the various aspects of the invention.

[0076] refer to Figure 8A A substrate 300 is provided. A semiconductor die 400 is mounted on the substrate 300. The semiconductor die 400 can be mounted via flip-chip bonding, die bonding, or DAF bonding. A conductive element 600 is disposed on the substrate 300 for electrical connection to the substrate 300. The conductive element 600 may contain solder and can be disposed via ball mounting.

[0077] refer to Figure 8B The package body 500 is formed on the substrate 300 to cover the semiconductor die 400 and the conductive element 600. The package body 500 can be formed by molding.

[0078] refer to Figure 8C A through-hole (or die via, TMV) V3 is formed in the package body 500 to expose the conductive element 600. The through-hole V3 can be formed by any suitable operation, such as drilling or etching.

[0079] refer to Figure 8D The through-hole V3 is filled with a conductive element 600. The filling operation can be performed via a pre-soldering operation. The filling operation may include a reflow operation. The surface 601 of the conductive element 600 may be coplanar with the surface 501 of the package body 500.

[0080] refer to Figure 8E The antenna package 1c is mounted on the conductive element 600. The antenna package 1c and... Figure 3A or Figure 4A The antenna package 1c described herein is the same as or similar to that described herein. The antenna package 1c can be mounted via SMT operations to form a semiconductor package 8e. The semiconductor package 8e can be... Figure 4A The semiconductor package 4a is the same as or similar to that in the example.

[0081] As used herein, the terms “approximately,” “substantially,” “substantially,” and “about” are used to describe and explain small variations. When used in conjunction with an event or situation, the terms may refer to examples of events or situations that occurred precisely and examples of events or situations that occurred very approximately. For example, when used in conjunction with numerical values, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" or "approximately" the same. For example, "substantially" parallel can refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “basically” vertical can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0082] If the displacement between two surfaces is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar. If the difference between the highest and lowest points of a surface is no more than 5 μm, 2 μm, 1 μm, or 0.5 μm, then the surface can be considered planar or substantially planar.

[0083] As used herein, unless the context clearly indicates otherwise, the singular terms “a / an” and “the” may include plural indicators. In the description of some embodiments, a component provided “on” or “above” another component may cover the case where the preceding component is directly on the following component (e.g., in physical contact with the following component), and the case where one or more intermediate components are located between the preceding and following components.

[0084] Although the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of the invention. It will be readily understood by those skilled in the art that various changes may be made and equivalent components may be substituted within embodiments without departing from the true spirit and scope of the invention as defined by the appended claims. The illustrations may not be drawn to scale. Artistic representations of the invention may differ from actual devices due to variables in the manufacturing process, etc. Other embodiments of the invention may exist that are not specifically described. This specification and the drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.

Claims

1. A semiconductor package comprising: a substrate; a semiconductor die on and electrically connected to the substrate; and an antenna package disposed on and electrically connected to the substrate, the antenna package comprising: an encapsulant; and a patterned antenna structure on the encapsulant, wherein the patterned antenna structure of the antenna package comprises a metal extension that extends between the encapsulant of the antenna package and the semiconductor die.

2. The semiconductor package of claim 1, further comprising a conductive element that electrically connects the antenna package and the substrate.

3. The semiconductor package of claim 1, further comprising a package body on the substrate and covering the semiconductor die.

4. The semiconductor package of claim 3, wherein the patterned antenna structure of the antenna package is exposed from the package body.

5. The semiconductor package of claim 3, wherein the antenna package is disposed in a recess that is recessed from a surface of the package body, the surface of the package body faces away from the substrate, and the metal extension comprises a shield layer.

6. The semiconductor package of claim 3, wherein the antenna package is disposed on a surface of the package body, the surface of the package body faces away from the substrate, and the metal extension comprises an antenna pattern. ​ ​

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