Integrated circuit board fixing and debonding device and use method

Abstract

The present invention discloses an integrated circuit board fixing and degumming device and a method of using the same, which mainly solves the problem in the prior art that the integrated circuit board is not fixed at the horizontal center and part of the glue is not removed at one time during degumming. The integrated circuit board fixing and degumming device comprises: a machine tool; a moving part, the moving part is installed above the machine tool; a fixing device, the fixing device is installed in the moving part, the fixing device has a support plate; a side plate, the side plates are arranged on both sides of the support plate; a bottom plate, the bottom plate is arranged at the bottom of the support plate; a moving plate, the moving plate is arranged at the rear of the support plate; a smearing device, the smearing device is installed at the rear of the machine tool; and a degumming device, the smearing device is installed at the rear of the machine tool. The present invention is an integrated circuit board fixing and degumming device, which can fix the integrated circuit board at the horizontal center, so that the degumming part at the horizontal center can remove the glue on the integrated circuit board at one time, thereby improving work efficiency.

Description

Technical Field

[0001] The invention relates to the field of integrated circuit boards, and in particular to an integrated circuit board fixing and debonding device and a use method thereof. Background Art

[0002] Integrated circuit boards are made using semiconductor manufacturing technology, with many transistors, resistors, capacitors and other components manufactured on a smaller single-crystal silicon wafer, and the components are combined into a complete electronic circuit using multi-layer wiring or tunnel wiring methods.

[0003] By recycling integrated circuit boards, useless integrated circuit boards can be rearranged and used in various electronic products. After recycling and removing the components on the integrated circuit boards, the glue on the integrated circuit boards needs to be removed.

[0004] In the prior art, manual debonding is not only inefficient but also wastes manpower. When debonding is performed by machine equipment, the integrated circuit board is usually fixed first, and then debonding is performed using a debonding sheet. However, since there is often a deviation in the position fixation when the integrated circuit board is manually fixed, and it is not in the middle, part of the glue is not removed during debonding, and the process has to be repeated, resulting in low debonding efficiency. Summary of the invention

[0005] The object of the present invention is to provide an integrated circuit board fixing and debonding device to solve the problem in the prior art that the integrated circuit board is not fixed in the middle position, resulting in part of the board not being removed during debonding.

[0006] To achieve the above objectives, the embodiment of the present invention adopts the following scheme:

[0007] An integrated circuit board fixing and debonding device, comprising:

[0008] machine tool;

[0009] A moving part, the moving part is installed above the machine tool;

[0010] A fixing device is installed in the moving part, and the fixing device has

[0011] stay board;

[0012] Side plates, the side plates are arranged on both sides of the support plate;

[0013] A bottom plate, the bottom plate being arranged at the bottom of the support plate;

[0014] A movable plate, the movable plate being arranged at the rear of the support plate;

[0015] a coating device, the coating device being mounted at the rear of the machine tool; and

[0016] The degumming device is installed at the rear of the machine tool.

[0017] The PLC controls the expansion and contraction of the air cushion to drive the moving part to move on the machine tool. The moving part has a containing space, which can effectively prevent the scraped glue from falling on the machine tool. The bottom plate is fixed in the moving part, the support plate supports the integrated circuit board, the side plates on both sides can adjust the position of the integrated circuit board, and the moving plate can fix the integrated circuit board.

[0018] Preferably, a roller is provided under the coating device, and solvent liquid can flow out through small holes provided on the roller to dissolve the glue on the integrated circuit board and reduce the viscosity of the glue.

[0019] Preferably, a scraper is provided under the glue removal device, and the glue on the integrated circuit board can be scraped off by the scraper.

[0020] Preferably, a seventh spring is provided on both sides of the roller and the scraper strip, so that the roller and the scraper strip can be reset by the seventh spring.

[0021] Preferably, a first inclined surface is obliquely arranged in front of the support plate. The first inclined surface can make it easier for the roller and the scraper strip to slide onto the integrated circuit board.

[0022] Furthermore, a stop bar is formed at the junction of the upper surface of the support plate and the first inclined surface, and the front part of the integrated circuit board can be stopped by the stop bar.

[0023] Preferably, second inclined surfaces are provided on both sides of the bottom of the support plate.

[0024] Preferably, column bars are provided around the bottom of the support plate.

[0025] Preferably, deep holes are provided on both sides of the rear end of the support plate.

[0026] Preferably, a fixing block is provided at the bottom of the support plate.

[0027] Preferably, the fixing device further comprises:

[0028] A circular shaft, wherein the circular shaft passes through the fixed block;

[0029] A first spring, wherein the first spring is sleeved on the circular shaft; and

[0030] A first clamping piece is sleeved on the circular shaft and abuts against one end of the first spring.

[0031] Preferably, a first sliding groove is provided at the bottom of the side plate. The cross section of the side plate is "L" shaped.

[0032] Preferably, a third inclined surface is provided at the lower end of the side plate.

[0033] Preferably, the fixing device further comprises:

[0034] A flat plate connected to the upper part of the side plate; and

[0035] A second spring is arranged at a connection between the flat plate and the side plate.

[0036] The position of the integrated circuit board can be adjusted to the horizontal center by pressing the two sides of the integrated circuit board with a flat plate.

[0037] Preferably, a long groove is provided in the movable plate.

[0038] Preferably, a second sliding groove is provided below the movable plate.

[0039] Preferably, a fourth inclined surface is obliquely arranged at the top end of the movable plate.

[0040] Preferably, long columns are provided on the front two sides of the movable plate.

[0041] Furthermore, a third spring is sleeved on the long column.

[0042] Preferably, slide rails are provided on both sides of the bottom plate.

[0043] Preferably, hollow columns are arranged around the bottom plate.

[0044] Furthermore, a fifth spring is sleeved on the hollow column.

[0045] Preferably, a receiving block is provided in the middle of the bottom plate. The receiving block contains a receiving space in which a triangular block is provided for engaging the first clamping member.

[0046] Furthermore, a convex hole is provided at the rear of the accommodating block.

[0047] Furthermore, the fixing device further comprises:

[0048] A long rod, one end of which is inserted into the convex hole; and

[0049] A fourth spring is sleeved on the long rod.

[0050] Furthermore, support bars are provided on both sides of the accommodation block.

[0051] Furthermore, a sixth spring is sleeved on the support bar.

[0052] Preferably, a deep groove is provided at the rear of the bottom plate.

[0053] Furthermore, a second clamping member is provided in the deep groove.

[0054] The embodiment of the present invention also discloses a method for using the integrated circuit board fixing and debonding device, comprising the following steps:

[0055] Place the integrated circuit board flat on the support plate, then place the front end of the integrated circuit board against the support bar, and start to press the support plate downward to bring the side panels closer to the middle. Use the flat plates on the side panels to squeeze both sides of the integrated circuit board and adjust the integrated circuit board to the horizontal center.

[0056] Push the movable plate forward to abut against the rear end of the integrated circuit board, and then slide the second clamp to the right to fix the position of the movable plate and the integrated circuit board.

[0057] The moving part is started and moved forward, passing through the roller, and the dissolving liquid flowing out of the roller is rolled on the glue of the integrated circuit board, and then passing through the scraper bar, and the glue on the integrated circuit board is scraped off by the scraper bar.

[0058] After removing the glue on the integrated circuit board, slide the second clamp to the left to release the fixation of the movable plate, and then push the long rod inward to make the side plates slide to both sides to release the squeezing of the integrated circuit board. At this time, the integrated circuit board after the glue removal can be taken down, and finally the coating device and the glue removal device are raised by the lifting cylinder, and the movable part moves backward to return to its original position.

[0059] Beneficial effects of the present invention:

[0060] The flat plate squeezes both sides of the integrated circuit board and adjusts the position to the horizontal center so that the scraper at the horizontal center can fully cover the integrated circuit board when scraping glue. The scraping operation can be completed at one time without the need for secondary scraping, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 It is a three-dimensional schematic diagram of the present invention.

[0062] Figure 2 Schematic diagram of the fixing device of the present invention.

[0063] Figure 3 It is a side view of the support plate of the present invention.

[0064] Figure 4 It is a three-dimensional schematic diagram of the support plate of the present invention.

[0065] Figure 5 It is a schematic diagram of the support plate assembly of the present invention.

[0066] Figure 6 It is a schematic diagram of the side panel assembly of the present invention.

[0067] Figure 7 It is a three-dimensional schematic diagram of the movable plate of the present invention.

[0068] Figure 8 It is a three-dimensional schematic diagram of the base plate of the present invention.

[0069] Fig. 9 It is an exploded schematic diagram of the fixing device of the present invention.

[0070] Fig.10 It is a rear view of the fixing device of the present invention.

[0071] Fig.11 It is a cross-sectional view of the fixing device of the present invention.

[0072] Fig.12 For the present invention Fig.11 sectional view of .

[0073] Fig.13 For the present invention Fig.11 Further movement diagram.

[0074] Fig.14 A schematic diagram of coating the integrated circuit board of the present invention.

[0075] Fig.15 For the present invention Fig.14 A partial enlarged schematic diagram of .

[0076] Fig.16 Schematic diagram of scraping glue on the integrated circuit board of the present invention

[0077] 100, machine tool 200, moving part 300, fixing device

[0078] 400, coating device 500, degumming device 401, roller

[0079] 501, scraper strip 310, support plate 3101, first inclined surface

[0080] 3102, support bar 3103, column bar 3104, fixed block

[0081] 3105, second inclined surface 3106, deep hole 311, round shaft

[0082] 312, first spring 313, first clamp 320, side plate

[0083] 3201, first slide groove 3202, third inclined surface 321, flat plate

[0084] 322, second spring 330, moving plate 3301, long groove

[0085] 3302, second slide groove 3303, long column 3304, fourth inclined surface

[0086] 331, third spring 332, long rod 333, second clamp

[0087] 334, fourth spring 340, bottom plate 341, fifth spring

[0088] 342, sixth spring 3401, accommodation block 3402, support bar

[0089] 3403, hollow column 3404, convex hole 3405, slide rail

[0090] 3406, deep groove 600, seventh spring DETAILED DESCRIPTION

[0091] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0092] In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0093] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0094] For the purpose of simplicity and illustration, the principles of the embodiments are described mainly by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious. For those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments may be used in combination with each other.

[0095] The present invention provides an integrated circuit board debonding device, such as Figure 1 As shown, a moving part 200 is provided on the machine tool 100, and a fixing device 300 is provided in the moving part 200. An integrated circuit board can be fixedly installed on the fixing device 300. A coating device 400 and a degumming device 500 are provided at the rear of the machine tool 100. The degumming device 500 is on the left side of the coating device 400. A roller 401 is installed under the coating device 400, and a scraper 501 is installed under the degumming device 500. The moving part 200 is driven to move on the machine tool 100 by the PLC-controlled air cushion telescopic drive, and the integrated circuit board on the fixing device 300 is coated by the roller 401. The roller 401 is provided with small holes, and solvent liquid can flow out of the small holes to dissolve the glue on the integrated circuit board to reduce the viscosity of the glue, and then the glue on the integrated circuit board is scraped off by the scraper 501. The bottom connecting ends of the coating device 400 and the degumming device 500 are provided with lifting cylinders, which can be raised when the moving part 200 returns to its original position, so as to cyclically degumming the integrated circuit board.

[0096] like Figure 2 As shown, the fixing device 300 includes a bottom plate 340 fixed in the moving part 200 , a support plate 310 is provided on the bottom plate 340 , side plates 320 are provided on both sides of the bottom plate 340 , and a moving plate 330 is provided at the rear of the bottom plate 340 .

[0097] like Figure 3 As shown, a first inclined surface 3101 is provided in front of the support plate 310, and the roller 401 and the scraper strip 501 can slide onto the integrated circuit board better through the first inclined surface 3101. A stop bar 3102 is formed at the junction of the upper end of the first inclined surface 3101 and the upper surface of the support plate 310. The stop bar 3102 has the same thickness as the integrated circuit board, and the front end of the integrated circuit board can be stopped through the stop bar 3102.

[0098] like Figures 4 to 5 As shown, column bars 3103 are provided around the bottom of the support plate 310, and second inclined surfaces 3105 are provided on both sides close to the column bars 3103. Deep holes 3106 are provided on both sides of the rear of the support plate 310, and a circular fixed block 3104 is provided in the middle of the bottom. A round shaft 311 can pass through the fixed block 3104, and a first spring 312 is also sleeved on the round shaft 311. The round shaft 311 also passes through a first clamp 313, and a triangle obliquely upward is provided on the first clamp 313. One end of the first spring 312 abuts against the fixed block 3104, and the other end abuts against the first clamp 313.

[0099] like Figure 6 As shown, the side plate 320 has an L-shaped cross section, with a third inclined surface 3202 inclined upward at the lower end, the upper end of the side plate 320 is connected to the flat plate 321, a second spring 322 is provided at the connection, and a first slide groove 3201 is provided at the bottom of the side plate 320.

[0100] like Figure 7As shown, long columns 3303 are provided on both sides of the upper front of the movable plate 330, a hollow long groove 3301 is provided in the middle, a second slide groove 3302 is provided below the long groove 3301, and a fourth inclined surface 3304 is provided on the top surface of the movable plate 330. By setting the fourth inclined surface 3304, the roller 401 and the scraper 501 can slide out of the integrated circuit board more easily.

[0101] like Figure 8 As shown, a receiving block 3401 is provided in the middle of the upper surface of the bottom plate 340, and the receiving block 3401 can accommodate the first clamping member 313. Support bars 3402 are provided on both sides of the receiving block 3401, and a convex hole 3404 is provided at the rear end. A row of slide rails 3405 are provided on each side of the upper surface of the bottom plate 340, and the slide rails 3405 cooperate with the first slide groove 3201 to enable the side plate 320 to slide left and right on the bottom plate 340. Empty columns 3403 are also provided around the receiving block 3401, and the column bars 3103 can be inserted into the empty columns 3403 to enable the support plate 310 to move up and down stably. A deep groove 3406 is also provided at the rear end of the bottom plate 340.

[0102] like Fig. 9 As shown, the fifth spring 341 is sleeved on the hollow column 3403 and fits with the bottom of the support plate 310 to reset the support plate 310; the sixth spring 342 is sleeved on the support bar 3402 and fits with the side plate 320 to reset the side plate 320; the third spring 331 is sleeved on the long column bar 3303 and fits with the front of the moving plate 330 and the rear of the support plate 310 to reset the moving plate 330; the long rod 332 passes through the moving plate 330 The long groove 3301 on the top is inserted into the convex hole 3404; the fourth spring 334 is sleeved on the long rod 332, one end of which fits the convex hole 3404, and the other end fits the round block welded on the long rod 332, so that the long rod 332 is pressed against the movable plate 330; the second clamping member 333 passes through the second slide groove 3302 and is inserted into the deep groove 3406. The second clamping member 333 can slide on the second slide groove 3302 to fix the movable plate 330.

[0103] like Fig.10 As shown, by pressing the support plate 310 downward, the second inclined surface 3105 and the third inclined surface 3202 contact and slide, so that the side plate 320 is moved inward, the flat plate 321 touches the side of the integrated circuit board, and the position of the integrated circuit board is adjusted to the horizontal center. The second spring 322 is set to buffer the squeezing, which is not easy to damage the integrated circuit board.

[0104] like Fig.11 As shown, when the support plate 310 is pressed down, the first clamp 313 at the bottom of the support plate 310 drops into the receiving block 3401, and a triangular block is provided in the receiving block 3401, so that the triangular block on the first clamp 313 is against the triangular block in the receiving block 3401, and the support plate 310 is fixed; Fig.12As shown, the movable plate 330 pushes the rear end of the integrated circuit board forward and slides the second clamping member 333 to the right so that the second clamping member 333 is clamped in the deep groove 3406 in the bottom plate 340. At this time, the movable plate 330 is fixed, and the integrated circuit board is fixed at the horizontal center. The roller 401 and the scraper 501 can complete the glue removal operation on the integrated circuit board at the horizontal center at one time, and part of the glue will not be left unremoved, thereby improving work efficiency.

[0105] like Fig.12 As shown, the long rod 332 is pushed inward to touch the second clamping member 333, so that the second clamping member 333 slides forward and disengages from the accommodation block 3401, and the support plate 310 can be reset; Fig.15 As shown, a seventh spring 600 is provided at the connection between the coating device 400 and the roller 401, and a seventh spring 600 is also provided at the connection between the degumming device 500 and the scraper 501. The seventh spring 600 can make the roller 401 and the scraper 501 return to their original position after bending.

[0106] Based on the above integrated circuit board debonding device, the present invention also provides a method for using the integrated circuit board debonding device, comprising the following steps:

[0107] Place the integrated circuit board flat on the support plate 310, then place the front end of the integrated circuit board against the support bar 3102, and start pressing the support plate 310 downward to move the side plates 320 toward the middle, squeeze both sides of the integrated circuit board through the flat plate 321 on the side plates 320, and adjust the integrated circuit board to the horizontal center.

[0108] The movable plate 330 is pushed forward to abut against the rear end of the integrated circuit board, and then the second clamping member 333 is slid to the right to fix the position of the movable plate 330 and the integrated circuit board.

[0109] like Fig.14 and Fig.16 As shown, the moving part 200 is started and moved forward, passing through the roller 401, and the dissolving liquid flowing out of the roller 401 is rolled on the glue of the integrated circuit board, and then passing through the scraper 501, and the scraper 501 is used to scrape off the glue on the integrated circuit board.

[0110] After removing the glue on the integrated circuit board, slide the second clamp 333 to the left to release the fixation of the movable plate 330, and then push the long rod 332 inward to make the side plates 320 slide to both sides to release the squeezing of the integrated circuit board. At this time, the integrated circuit board after the glue removal can be taken down, and finally the coating device 400 and the glue removal device 500 are raised by the lifting cylinder, and the movable part 200 moves backward to return to its original position.

[0111] Although the above describes the illustrative specific embodiments of the present invention so that those skilled in the art can understand the present invention, the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the attached claims, all inventions and creations using the concepts of the present invention are protected.

Claims

1. An integrated circuit board fixing and debonding device, comprising: machine tool; A moving part, the moving part is installed above the machine tool; A coating device, the coating device being mounted on one side of the machine tool; and A degumming device, the degumming device being mounted on one side of the machine tool; A fixing device, the fixing device is installed in the moving part, and the fixing device has a support plate; side plates, the side plates are arranged on both sides of the support plate; a bottom plate, the bottom plate is arranged at the bottom of the support plate; and a moving plate, the moving plate is arranged at the rear of the support plate; A deep groove is provided at the rear of the bottom plate, and the cross section of the deep groove is "L" shaped; a second clamp is provided in the deep groove; A first inclined surface is obliquely arranged in front of the support plate; a stop bar is formed at the junction of the upper surface of the support plate and the first inclined surface; The bottom of the support plate is provided with a second inclined surface on both sides; the bottom of the support plate is provided with column bars around; the rear end of the support plate is provided with deep holes on both sides; the bottom of the support plate is provided with a fixing block; The bottom of the side plate is provided with a first slide groove; the cross section of the side plate is "L" shaped, and one end thereof is provided with a third inclined surface; The movable plate is provided with a long groove; a second sliding groove is provided below the movable plate; a fourth inclined surface is obliquely provided at the top of the movable plate; long columns are provided at the front two sides of the movable plate; a third spring is sleeved on the long column; Slide rails are arranged on both sides of the bottom plate; hollow columns are arranged around the bottom plate, and the column bar can be inserted into the hollow columns; the hollow columns are sleeved with a fifth spring; a receiving block is arranged in the middle of the bottom plate; a convex hole is arranged at the rear of the receiving block; support bars are arranged on both sides of the receiving block; the support bars are sleeved with a sixth spring; The fixing device also includes: A circular shaft, wherein the circular shaft passes through the fixed block; A first spring, wherein the first spring is sleeved on the circular shaft; and A first clamping piece, wherein the first clamping piece is sleeved on the circular shaft and abuts against one end of the first spring; A flat plate connected to the upper part of the side plate; and a second spring, the second spring being arranged at a connection between the flat plate and the side plate; A long rod, one end of which is inserted into the convex hole; and A fourth spring is sleeved on the long rod, one end of the fourth spring is in contact with the convex hole, and the other end is in contact with the round block welded on the long rod.

2. The integrated circuit board fixing and debonding device according to claim 1, wherein: A roller is arranged under the coating device.

3. The integrated circuit board fixing and debonding device according to claim 2, wherein: A scraper is provided under the degumming device.

4. The integrated circuit board fixing and debonding device according to claim 3, wherein: A seventh spring is provided on both sides of the roller and the scraper strip.

5. A method for using an integrated circuit board fixing and debonding device, the method for using the integrated circuit board fixing and debonding device is based on the integrated circuit board fixing and debonding device in claim 4, comprising: Place the integrated circuit board flatly on the support plate, then place the front end of the integrated circuit board against the support bar, start to press the support plate downward to bring the side plates closer to the middle, squeeze the two sides of the integrated circuit board through the flat plate on the side plates, and adjust the integrated circuit board to the horizontal center; Push the movable plate forward to abut against the rear end of the integrated circuit board, and then slide the second clamp to the right to fix the position of the movable plate and the integrated circuit board; The moving part is started and moved forward, passing through the roller, the dissolving liquid flowing out of the roller is rolled on the glue of the integrated circuit board, and then passing through the scraper bar, and the glue on the integrated circuit board is scraped off by the scraper bar; After removing the glue on the integrated circuit board, slide the second clamp to the left to release the fixing of the movable plate, and then push the long rod inward to make the side plates slide to both sides to release the squeezing of the integrated circuit board. At this time, the integrated circuit board after the glue removal can be taken down, and finally the coating device and the glue removal device are raised by the lifting cylinder, and the movable part moves backward to return to the original position; The roller is arranged under the coating device; the dissolving liquid can flow out from the small holes arranged on the roller to dissolve the glue on the integrated circuit board and reduce the viscosity of the glue.

Images