Method for manufacturing a shingle assembly and shingle assembly

Abstract

The present application relates to a kind of method for manufacturing shingle assembly and shingle assembly.Method includes the following steps: solar cell piece and conductive sheet are arranged in the form of shingle in multiple cell strings on the top surface of bottom side encapsulation structure along second direction, make conductive sheet be located at the end of cell string, each cell string is arranged along the first direction perpendicular to second direction and forms cell piece array;First bus bar and second bus bar are arranged on the top side or bottom side of cell piece array, so that first bus bar is in electrical contact with the main grid line of the solar cell piece of the head end of each cell string, and second bus bar is in electrical contact with the conductive sheet of each cell string;The combination structure of top side encapsulation structure, cell piece array and bottom side encapsulation structure is laminated.The method provided by the present application can combine layout process and laminating process into one, directly laminates and arranges cell piece on bottom side encapsulation material, and such mode is lower in cost, higher in efficiency, easy to operate.

Description

Technical Field

[0001] This invention relates to the energy field, and more particularly to a method for manufacturing a shingled module and a shingled module. Background Technology

[0002] With the accelerating depletion of conventional fossil fuels such as coal, oil, and natural gas globally, the ecological environment is deteriorating, particularly due to increasingly severe global climate change caused by greenhouse gas emissions, posing a serious threat to the sustainable development of human society. Countries around the world have formulated their own energy development strategies to address the finite nature of conventional fossil fuel resources and the environmental problems arising from their development and utilization. Solar energy, with its reliability, safety, widespread availability, longevity, environmental friendliness, and abundant resources, has become one of the most important renewable energy sources and is expected to become a major pillar of future global electricity supply.

[0003] In the new round of energy transformation, my country's photovoltaic (PV) industry has grown into a strategic emerging industry with international competitive advantages. However, the development of the PV industry still faces many problems and challenges. Conversion efficiency and reliability are the biggest technical obstacles restricting the development of the PV industry, while cost control and economies of scale pose economic constraints. As the core component of PV power generation, improving the conversion efficiency of PV modules and developing high-efficiency modules is an inevitable trend. Currently, various high-efficiency modules are emerging on the market, such as shingled, half-cell, multi-busbar, and bifacial modules. As the application sites and regions of PV modules become more and more widespread, the requirements for their reliability are becoming increasingly stringent, especially in areas with severe or extreme weather conditions where high-efficiency and high-reliability PV modules are needed.

[0004] Against the backdrop of vigorously promoting and using solar green energy, shingled modules utilize the electrical principle of low current and low loss (the power loss of a photovoltaic module is directly proportional to the square of the operating current), thus significantly reducing module power loss. Secondly, by fully utilizing the spacing between cells within the module for power generation, the energy density per unit area is high. Furthermore, conductive adhesives with elastomer properties are now used instead of conventional photovoltaic metal solder ribbons. Because photovoltaic metal solder ribbons exhibit higher series resistance within the entire cell, while the current loop of the conductive adhesive is much shorter than that of solder ribbons, shingled modules ultimately become high-efficiency modules. At the same time, their reliability in outdoor applications is superior to conventional photovoltaic modules because shingled modules avoid stress damage to cell-to-cell interconnection points and other current-carrying areas caused by metal solder ribbons. Especially in dynamic environments with alternating high and low temperatures (due to natural loads such as wind and snow), the failure probability of conventional modules with metal solder ribbon interconnection is far higher than that of shingled modules with interconnected crystalline silicon cell chips using elastomer-based conductive adhesives.

[0005] The current mainstream process for shingled solar modules uses conductive adhesives to interconnect the cut solar cells. The conductive adhesive mainly consists of a conductive phase and a binder phase. The conductive phase is primarily composed of precious metals, such as pure silver particles or silver-coated copper, nickel, or glass particles, used to conduct electricity between the solar cells. The particle shape and distribution are designed to optimize electrical conductivity; currently, sheet-like or near-spherical combinations of silver powder with a D50 < 10µm are most commonly used. The binder phase mainly consists of weather-resistant polymer resins, typically selected based on bonding strength and weather resistance stability, such as acrylic resin, silicone resin, epoxy resin, or polyurethane. To achieve low contact resistance, low volume resistivity, high adhesion, and long-term excellent weather resistance, conductive adhesive manufacturers design specific formulations for both the conductive and binder phases. This ensures the stability of the shingled module's performance during initial environmental corrosion testing and long-term outdoor applications.

[0006] For battery components connected via conductive adhesive, after encapsulation, they are subject to environmental corrosion during outdoor use. For example, alternating high and low temperatures and thermal expansion and contraction cause relative displacement between the conductive adhesive particles. The most serious consequence is intermittent current connection or even open circuit, primarily due to weak inter-material bonding. This weak bonding is mainly manifested in the fact that the conductive adhesive application process requires a specific operational window, which is relatively narrow in actual production and highly susceptible to environmental factors. These factors, such as the temperature and humidity of the work area and the duration of exposure to air after application, can cause the conductive adhesive to lose its activity. Furthermore, uneven application and missing parts are easily caused by variations in the adhesive's properties during dispensing, spraying, or printing processes, posing a significant threat to product reliability. Secondly, conductive adhesives are mainly composed of polymer resins and a large amount of precious metal powder, resulting in high costs and some environmental damage (the production and processing of precious metals cause significant pollution). Thirdly, conductive adhesives are paste-like substances with a certain degree of fluidity during application or stacking, making them prone to overflow and causing short circuits between the positive and negative terminals of the shingled interconnect battery strings.

[0007] In other words, most shingled modules made using conductive adhesive bonding have problems such as weak interconnection strength, high environmental requirements for the manufacturing process, easy glue overflow and short circuits during the process, high cost, and low production efficiency.

[0008] Furthermore, existing shingled modules require solder strips at both ends of the cell string before layout and busbar welding. In this traditional approach, stacking the cells first and then laying them out is inefficient and costly. The separation of the stacking and layout processes makes it difficult to change the layout, and the solder strips cause power loss in the cells, affecting conversion efficiency.

[0009] Therefore, there is a need to provide a method for manufacturing shingled components and shingled components in order to at least partially solve the above problems. Summary of the Invention

[0010] The purpose of this invention is to provide a method for manufacturing shingled modules and a shingled module itself. The method provided by this invention combines the layout process and the stacking process into one, directly stacking and arranging the battery cells on the bottom encapsulation material. This method is low-cost, highly efficient, and easy to operate.

[0011] On the other hand, in the shingled assembly provided by the present invention, the busbar can play a busing role, and the adhesive can play a fixing role, eliminating the need for additional solder strips and conductive adhesive. This arrangement can avoid a series of problems that may arise due to the use of solder strips and conductive adhesive.

[0012] According to one aspect of the present invention, a method for manufacturing a shingled module is provided, the shingled module comprising a bottom-side encapsulation structure, a top-side encapsulation structure, and a cell array fixed between the bottom-side encapsulation structure and the top-side encapsulation structure, the method comprising the following steps:

[0013] Solar cells and conductive sheets are arranged in a shingled manner on the top surface of the bottom-side encapsulation structure along a second direction to form multiple battery strings, with the conductive sheets located at the ends of the battery strings. The individual solar cells are electrically connected through the contact between the main grid lines. The conductive sheet is in contact with the main grid lines of the adjacent solar cells. The individual solar cells and the conductive sheets are fixed relative to each other by an adhesive. The battery strings are arranged along a first direction perpendicular to the second direction to form a battery array.

[0014] A first busbar and a second busbar are provided on the top side of the cell array, or on the bottom side of the cell array, such that the first busbar is in electrical contact with the main grid line of the solar cell at the beginning of each cell string, and the second busbar is in electrical contact with the conductive sheet of each cell string. Both busbars are continuous strip structures and are capable of collecting current from the cell array and discharging current outward.

[0015] The combined structure of the top-side encapsulation structure, the battery cell array, and the bottom-side encapsulation structure is laminated.

[0016] In one embodiment, the method further includes the following steps:

[0017] A first conductive bonding structure is provided on the top surface of the solar cell at the first end of each of the battery strings, so that the first conductive bonding structure and the main grid line of the solar cell at the first end are in direct contact.

[0018] A second conductive bonding structure is provided on the top surface of each of the conductive sheets.

[0019] In this configuration, the corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction.

[0020] Furthermore, the top-side encapsulation structure includes a top plate, on which the first busbar and the second busbar are applied to the bottom surface of the top plate, such that the first busbar and the second busbar are aligned with their respective conductive bonding structures in a direction perpendicular to the cell array, so that the busbar can simultaneously contact the corresponding conductive bonding structures of all the cell strings.

[0021] In one embodiment, the top-side encapsulation structure further includes a top-side flexible film disposed between the top plate and the battery cell array, and the method further includes: providing a hole on the top-side flexible film corresponding to the conductive bonding structure, so that the conductive bonding structure can contact the busbar through the hole.

[0022] In one embodiment, the steps of applying the first conductive adhesive structure and the second conductive adhesive structure occur after the top-side flexible film is applied to the cell array. The steps of applying the first conductive adhesive structure and the second conductive adhesive structure are as follows: applying a conductive adhesive material to the top-side conductive film so that the conductive adhesive flows through the holes to the top surface of the cell array and solidifies therein to form the first conductive adhesive structure and the second conductive adhesive structure.

[0023] In one embodiment, the conductive adhesive structure is applied by one of the following methods: dispensing, smearing, spraying, or printing.

[0024] In one embodiment, the first busbar and the second busbar are disposed on the cell array, wherein the first busbar is disposed on the top surface of the solar cells at the beginning of all the cell strings and connects the main grid lines of each solar cell in contact with it, and the connection method can be a conductive bonding structure or welding; the second busbar is disposed on the top surface of each conductive sheet and connects each conductive sheet, and the connection method can be a conductive bonding structure or welding.

[0025] In one embodiment, the method includes the step of applying an adhesive, the step of applying the adhesive comprising: applying the adhesive to each of the solar cell and the conductive sheet such that the adhesive is located between each pair of adjacent solar cells and conductive sheets when the solar cells are arranged in a cell string.

[0026] In one embodiment, the method further includes the following steps: detecting the quality of the adhesive application using a camera while applying the adhesive, and rejecting solar cells for which the adhesive was not applied correctly based on the detection results.

[0027] In one embodiment, the detection step is performed simultaneously with the adhesive application step, and the detection step is capable of providing closed-loop feedback on the adhesive application step.

[0028] In one embodiment, the method includes the following steps:

[0029] Set up a whole solar cell;

[0030] Laser grooves are etched onto the entire solar cell and an adhesive is applied.

[0031] The solar cell is split into multiple solar cells.

[0032] In one embodiment, the method includes the following steps:

[0033] Set up a whole solar cell;

[0034] Laser grooving is performed on the entire solar cell.

[0035] The solar cell is split into multiple solar cells;

[0036] An adhesive is applied to each of the solar cells.

[0037] In one embodiment, heat and / or pressure are applied to the overlapping portions between the solar cells during the stacking of the solar cells into a battery string, thereby curing the adhesive thereon.

[0038] In one embodiment, the bottom-side encapsulation structure includes a base plate and a bottom-side flexible film located between the base plate and the cell array, and the method further includes the step of applying an adhesive to the top surface of the bottom-side flexible film before arranging the solar cells in the bottom-side encapsulation structure.

[0039] In one embodiment, the step of applying the adhesive includes: applying multiple sets of dot-shaped adhesives to the top surface of the bottom flexible film, such that each set of dot-shaped adhesives corresponds to one of the battery strings, each set of dot-shaped adhesives includes one or more rows of dot-shaped structures, and the dot-shaped adhesives are arranged sequentially along the second direction and used to bond to the bottom surface of each of the solar cells in the battery string respectively.

[0040] In one embodiment, the method includes the step of applying an adhesive after arranging the solar cells into a battery string on the bottom-side encapsulation structure, the step of applying the adhesive including: applying a strip of adhesive in a second direction to each of the battery strings so that the strip of adhesive spans across the battery string.

[0041] In one embodiment, the steps of arranging the solar cells into a battery string and arranging the battery strings into a battery cell array are accomplished by electrostatic or vacuum adsorption methods.

[0042] In one embodiment, the stacking quality is detected by a camera during the process of arranging the solar cells into a battery string, and the detection results are fed back to the monitoring platform in real time.

[0043] In one embodiment, the manufacturing system further includes a control device associated with the detection mechanism, which is capable of controlling the stacking operation mechanism based on the detection results of the detection mechanism.

[0044] In one embodiment, EL electroluminescence or PL photoluminescence is used to detect defects in the part to be laminated before the lamination step. If the detection fails, the defect detection is repeated after the part to be laminated is repaired.

[0045] In one embodiment, the method includes the steps of setting a top-side encapsulation structure and a bottom-side encapsulation structure, wherein the step of setting the top-side encapsulation structure includes:

[0046] Set the base plate;

[0047] A flexible membrane is disposed between the substrate and the cell array using EVA, POE, or silicone; the step of setting the top-side encapsulation structure includes:

[0048] A flexible membrane is disposed between the top plate and the cell array using EVA, POE, or silicone.

[0049] Install a top plate.

[0050] In one embodiment, the adhesive is non-conductive.

[0051] In one embodiment, the method does not include the step of setting the solder strip.

[0052] According to another aspect of the present invention, a shingled assembly is provided, the shingled assembly comprising a bottom-side encapsulation structure, a transparent top-side encapsulation structure, and a cell array disposed between the bottom-side encapsulation structure and the top-side encapsulation structure, the cell array comprising at least two cell strings, each of the cell strings being sequentially arranged to form the cell array along a first direction.

[0053] The feature is that each battery string includes multiple solar cells and a conductive sheet located at the end of the multiple solar cells. The multiple solar cells and the conductive sheet are arranged in a shingled manner along a second direction perpendicular to the first direction and are fixed relative to each other by an adhesive. The individual solar cells are electrically connected through contacts between main grid lines, and the conductive sheet contacts the main grid line of its adjacent solar cell.

[0054] The shingled assembly is provided with a first busbar and a second busbar located together on the top or bottom side of the cell array. The first busbar is configured to make electrical contact with the main grid line of the solar cell at the beginning of each cell string, and the second busbar is configured to make electrical contact with the conductive sheet of each cell string. Both busbars are continuous strip structures and are capable of collecting current from the cell array and discharging the current outward.

[0055] In one embodiment, a conductive bonding structure is provided on the top surface of the solar cell at the first end of each battery string, which is in direct contact with its main grid line. A second conductive bonding structure is provided on the top surface of the conductive sheet. The corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction. The top-side encapsulation structure includes a top plate. The busbar is formed on the bottom surface of the top plate and aligned with the corresponding conductive bonding structure in a direction perpendicular to the battery cell array, so that the busbar simultaneously contacts the corresponding conductive bonding structures of all battery strings.

[0056] In one embodiment, the top-side encapsulation structure further includes a top-side flexible film disposed between the top plate and the battery cell array, the top-side flexible film having holes corresponding to the conductive bonding structure, the conductive bonding structure being able to contact the busbar through the holes.

[0057] In one embodiment, each segment of the conductive adhesive structure is a dot-like structure or a strip-like structure extending along the first direction.

[0058] In one embodiment, the busbars are formed on the cell array, the first busbars connect the main grid lines at the beginning of each cell string, and the second busbars connect the conductive sheets of each cell string.

[0059] In one embodiment, the top-side encapsulation structure is non-conductive.

[0060] In one embodiment, the adhesive is disposed between each pair of adjacent solar cells in each of the battery strings.

[0061] In one embodiment, the adhesive is disposed between each of the solar cells and the bottom-side encapsulation structure to fix all the solar cells relative to the bottom-side encapsulation structure.

[0062] In one embodiment, the bottom-side encapsulation structure includes a base plate and a bottom-side flexible film located between the base plate and the cell array, the adhesive being applied to the top surface of the bottom-side flexible film.

[0063] In one embodiment, the adhesive is a plurality of sets of dot-shaped adhesives pre-disposed on the top surface of the bottom flexible film, each set of the dot-shaped adhesives corresponding to one of the battery strings, each set of the dot-shaped adhesives including one or more rows of dot-shaped adhesives, the dot-shaped adhesives being arranged sequentially along the second direction and used to bond to the bottom surface of each of the solar cells in the battery string respectively.

[0064] In one embodiment, each of the battery strings is provided with an adhesive, the adhesive being a strip-shaped structure extending along the second direction and spanning across the battery string.

[0065] In one embodiment, the bottom-side encapsulation structure includes a base plate and a flexible film located between the base plate and the cell array, wherein the flexible film is an EVA monolithic film structure, a POE monolithic film structure, or a silicone monolithic film structure. The top-side encapsulation structure includes a top plate and a flexible film located between the top plate and the cell array, wherein the flexible film is an EVA monolithic film structure, a POE monolithic film structure, or a silicone monolithic film structure.

[0066] In one embodiment, the adhesive is non-conductive.

[0067] In one embodiment, the shingled assembly does not have solder strips.

[0068] According to the method provided by the present invention, the layout process and the stacking process can be combined into one, and the battery cells can be stacked and arranged directly on the bottom encapsulation material. This method is low-cost, highly efficient, and easy to operate. On the other hand, in the shingled assembly provided by the present invention, the busbar can play a converging role, and the adhesive can play a fixing role, eliminating the need for additional solder ribbons and conductive adhesives. This arrangement can avoid power loss of the battery cells and also avoid a series of problems that may arise due to the use of conductive adhesives. Attached Figure Description

[0069] To better understand the above and other objects, features, advantages, and functions of the present invention, reference can be made to the preferred embodiments shown in the accompanying drawings. The same reference numerals in the drawings refer to the same parts. Those skilled in the art should understand that the drawings are intended to schematically illustrate preferred embodiments of the invention and do not limit the scope of the invention in any way; the parts in the drawings are not drawn to scale.

[0070] Figure 1 This is an exploded view of a shingled assembly in the manufacturing process according to a first embodiment of the present invention;

[0071] Figure 2A For along Figure 1 A sectional view taken along line AA in the diagram. Figure 2B For along Figure 1 A sectional view of BB cut out;

[0072] Figure 3 This is an exploded view of a shingled assembly in the manufacturing process according to a second embodiment of the present invention;

[0073] Figure 4 This is an exploded view of a shingled assembly in the manufacturing process according to a third embodiment of the present invention;

[0074] Figure 5 This is an exploded view of the shingled assembly in the manufacturing process according to the fourth embodiment of the present invention. Detailed Implementation

[0075] Now, with reference to the accompanying drawings, specific embodiments of the present invention will be described in detail. The embodiments described herein are merely preferred embodiments of the invention; those skilled in the art can conceive of other ways to implement the invention based on these preferred embodiments, and such other ways also fall within the scope of the invention.

[0076] This invention provides a shingled assembly and a method for manufacturing the shingled assembly. Figures 1 to 5 Several preferred embodiments of the present invention are illustrated. Each embodiment will now be described in conjunction with the accompanying drawings.

[0077] First Implementation Method

[0078] Figure 1 , Figure 2A and Figure 2B A shingled assembly 1 according to a first embodiment of the present invention is shown. It can be understood that... Figure 1 The shingled assembly 1 shown is in the process of being manufactured, and therefore the components are disassembled. Once fully manufactured, it should be a single, encapsulated structure. For example... Figure 1As shown, the shingled module 1 includes a bottom-side encapsulation structure 145, a transparent top-side encapsulation structure 123, and a cell array 11 that can be fixed between the bottom-side encapsulation structure 145 and the top-side encapsulation structure 123.

[0079] The cell array 11 can be roughly understood as an array of solar cells 112, which are arranged in a shingled manner to form cell strings, and multiple cell strings are then arranged to form the cell array 11. The top conductive structure includes a top plate 12 and a top flexible film 13 located between the top plate 12 and the cell array 11, and the bottom conductive structure includes a bottom plate 15 and a bottom flexible film 14 located between the bottom plate 15 and the cell array 11. The top plate 12 and the bottom plate 15 can be rigid plates such as tempered glass, or the top plate 12 can be a polymer backsheet, and the top flexible film 13 and the bottom flexible film 14 can be flexible film structures made of EVA, POE, or silicone.

[0080] Specifically, each battery string includes multiple solar cells 112 arranged in a shingled manner along the second direction D2 and a conductive sheet 113 located at the end of the multiple solar cells 112. A positive electrode 17 is provided on the top surface of the solar cell 112 and a back electrode 18 is provided on the bottom surface. The conductive sheet 113 is made of conductive material.

[0081] For example, if each solar cell 112 in the battery string is Figure 2A and Figure 2B As shown, for two adjacent solar cells 112, the back electrode 18 of the first solar cell 112 contacts the positive electrode 17 of the second solar cell 112. Therefore, the positive electrode 17 of the first solar cell 112 in the battery string is exposed, while the back electrode 18 of the last solar cell 112 in the battery string is exposed. To form a circuit, a busbar is needed to simultaneously contact both the exposed positive electrode 17 and the back electrode 18 of the battery string. A conductive sheet 113 is placed at the end of the battery string so that the busbar 121, positioned on the top surface of the battery string, can also contact the back electrode 18. Specifically, the conductive sheet 113 can be constructed with a structure similar in shape to a regular solar cell 112 and arranged in a shingled manner at the end of the battery string. Thus, the conductive sheet 113 can contact the back electrode 18 of the last solar cell 112 in the battery string. If the busbar 121 makes conductive contact with the top surface of the conductive sheet 113, it is also in conductive contact with the back electrode 18 of the last solar cell 112. In this embodiment, the conductive sheet 113 and the busbar 121 are electrically connected by a conductive bonding structure 16.

[0082] Turn back Figure 1A first conductive bonding structure 16a is disposed on the top surface of the solar cell 112 at the first end of the battery string and is in direct contact with the positive electrode 17 of the solar cell 112. A second conductive bonding structure 16b is disposed on the top surface of the conductive sheet 113. The corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction D1. Each segment of the first conductive bonding structure 16a and the second conductive bonding structure 16b can be a dot-like structure or a strip-like structure extending in the first direction D1. In this embodiment, the individual solar cells 112 are conductively connected through direct contact of the main grid lines. However, in other embodiments not shown, the solar cells 112 can also be conductively connected through conductive adhesive.

[0083] Busbars are formed on the bottom surface of the top plate 12, and their positions are schematically shown by dashed lines on the top plate 12 in the figure. The busbars include a first busbar 121a and a second busbar 121b. The first busbar 121a is aligned with the first conductive bonding structure 16a in a direction perpendicular to the cell array 11, and the second busbar 121b is aligned with the second conductive bonding structure 16b in a direction perpendicular to the cell array 11, so that the busbars can simultaneously contact the corresponding conductive bonding structures of all cell strings.

[0084] Furthermore, the top flexible membrane 13 is provided with holes 131 corresponding to the first conductive bonding structure 16a and the second conductive bonding structure 16b, and the conductive bonding structure can pass through the holes 131 to contact the busbar.

[0085] In this embodiment, the individual solar cells 112 are fixed relative to each other by an adhesive disposed between them. For example, the adhesive can be applied to each solar cell 112 so that it bonds the two solar cells 112 when they are shingled together. Alternatively, a transparent adhesive can be disposed on each cell string, and the adhesive can be a strip structure extending along the second direction D2 and spanning the cell string. Preferably, the adhesive can only have an adhesive function and not a conductive function.

[0086] As can be seen, since the adhesive can fix each solar cell 112 relative to each other, and after lamination, the top encapsulation structure 123, the bottom encapsulation structure 145 and the solar cell 112 can also be fixed together, the shingled assembly 1 of this embodiment does not need to be provided with solder strips.

[0087] This embodiment also provides preparation Figure 1 The method for the shingled assembly 1 shown includes a stacking step, a busbar setting step, and a lamination step.

[0088] In the stacking process, solar cells 112 and conductive sheets 113 are arranged in a shingled manner on the top surface of the bottom flexible film 14 along the second direction D2 to form multiple cell strings, with the conductive sheets 113 located at the ends of the cell strings. The solar cells 112 are electrically connected through direct contact between their main grid lines. The conductive sheets 113 are in direct contact with the main grid lines of their adjacent solar cells 112. The cell strings are arranged along a first direction D1 perpendicular to the second direction D2 to form a cell array 11. The solar cells 112 and conductive sheets 113 are fixed relative to each other using an adhesive. This stacking process can be achieved by electrostatically or vacuum-adsorbing the solar cells 112 onto the bottom flexible film 14.

[0089] As can be seen, this step combines the layout and stacking steps into one, directly stacking the cells on the bottom encapsulation material and fixing each cell relative to the others, thus completing the layout simultaneously with the stacking. This method is low-cost, highly efficient, and easy to operate.

[0090] The step of applying the adhesive may include applying adhesive to each solar cell 112 and conductive sheet 113, such that when the solar cells 112 are arranged in a cell string, the adhesive is located between each pair of adjacent solar cells 112 and conductive sheets 113. Further, the quality of adhesive application is detected by a camera during adhesive application, and solar cells 112 with incorrect adhesive application are discarded based on the detection results. More preferably, the detection step is performed simultaneously with the adhesive application step, and the detection step provides closed-loop feedback for the adhesive application step.

[0091] The steps of applying the busbars include: setting a first busbar 121a and a second busbar 121b on the top side of the cell array 11, or setting a first busbar 121a and a second busbar 121b on the bottom side of the cell array 11, so that the first busbar 121a is in electrical contact with the main grid line of the solar cell 112 at the beginning of each cell string, and the second busbar 121b is in electrical contact with the conductive sheet 113 of each cell string. Both busbars are continuous strip structures and can collect current from the cell array 11 and conduct current outward.

[0092] Specifically, in combination Figure 1The shingled assembly 1 shown in this embodiment has its busbars applied to the bottom surface of the top flexible film 13. The method in this embodiment also includes the step of setting a conductive bonding structure. The step of setting the conductive bonding structure is as follows: a first conductive bonding structure 16a is set on the top surface of the solar cell 112 at the beginning of each battery string, so that the first conductive bonding structure 16a and the main grid line (positive electrode 17 in this embodiment) of the solar cell 112 at the beginning are in direct contact; a second conductive bonding structure 16b is also set on the top surface of each conductive sheet 113, wherein the corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction D1.

[0093] Furthermore, the top-side encapsulation structure 123 includes a top plate 12 and a top-side flexible film 13. Two busbars 121 are respectively applied to both sides of the bottom surface of the top plate 12, and the two busbars are aligned with the corresponding conductive bonding structures in a direction perpendicular to the cell array 11, so that the busbars can simultaneously contact the corresponding conductive bonding structures of all cell strings.

[0094] Furthermore, the above method also includes: providing a hole 131 on the top flexible membrane 13 corresponding to the conductive bonding structure, so that the conductive bonding structure can contact the busbar through the hole 131.

[0095] Preferably, the steps of applying the first conductive adhesive structure 16a and the second conductive adhesive structure 16b occur after the top-side flexible film 13 is formed on the cell array 11. The steps of applying the first conductive adhesive structure 16a and the second conductive adhesive structure 16b are as follows: conductive adhesive material is applied to both sides of the top-side conductive film, allowing the conductive adhesive to flow through the holes 131 to the top surface of the cell array 11 and solidify therein to form the first conductive adhesive structure 16a and the second conductive adhesive structure 16b. Further, the conductive adhesive structures can be applied by one of the following methods: dispensing, smearing, spraying, or printing.

[0096] Typically, the solar cell 112 is formed by splitting a whole solar cell sheet. The step of applying the adhesive can be set before or after splitting. For example, grooves can be laser-cut on the whole solar cell sheet and adhesive can be applied first, and then the whole solar cell sheet can be split into multiple solar cell sheets 112; or, grooves can be laser-cut on the whole solar cell sheet, and then the whole solar cell sheet can be split into multiple solar cell sheets 112, and then adhesive can be applied to each solar cell sheet 112.

[0097] Preferably, the stacking step of the solar cell 112 and the application of adhesive can be performed simultaneously. For example, heat and / or pressure can be applied to the overlapping parts between the solar cell 112 during the process of stacking the solar cell 112 into a battery string, or the adhesive at this point can be cured by air drying, ultraviolet curing or moisture.

[0098] Preferably, during the process of arranging the solar cells 112 into a battery string, the stacking quality is detected by a detection device, such as a camera, and the detection results are fed back to the monitoring platform in real time. More preferably, the manufacturing system also includes a control device, which is associated with the detection mechanism and is capable of performing closed-loop control of the detection mechanism.

[0099] The final step in the manufacturing process is a lamination step. The lamination step presses together the top-side encapsulation structure 123, the cell array 11, and the bottom-side encapsulation structure 145. Before the lamination step, EL electroluminescence or PL photoluminescence is used to inspect the laminate for defects. If the inspection fails, the defect inspection is repeated after the laminate is repaired.

[0100] Since the above-mentioned processes have already achieved the encapsulation and fixation of the shingled module 1 and the conductive connection between the solar cells 112 and the conduction of current, the above method does not require the step of applying solder strips.

[0101] Second Implementation Method

[0102] Figure 3 The shingled assembly 2 according to the second embodiment of the present invention is shown. For the parts that are the same as or similar to those in the first embodiment, the description will not be repeated or the description will be simplified.

[0103] The shingled module 2 includes a cell array 21, a top-side encapsulation structure 223 and a bottom-side encapsulation structure 245. The top-side encapsulation structure 223 includes a top plate 22 and a top-side flexible film 23, and the bottom-side encapsulation structure 245 includes a bottom plate 25 and a bottom-side flexible film 24.

[0104] In this embodiment, all busbars are disposed on the solar cell array 21. Specifically, the first busbar 26a is disposed on the top surface of the solar cells at the beginning of all cell strings and connects the positive electrodes of each solar cell in contact with it. The connection method can be a conductive bonding structure or welding. The second busbar 26b is disposed on the top surface of each conductive sheet and connects the conductive sheets. The connection method can be a conductive bonding structure or welding.

[0105] The top plate 22 itself can be made of a non-conductive transparent or opaque material, and there is no need to set a conductive mechanism similar to a busbar on the top plate 22.

[0106] Third Implementation Method

[0107] Figure 4 The shingled assembly 3 according to the third embodiment of the present invention is shown. For the parts that are the same as or similar to those in the first embodiment, the description will not be repeated or the description will be simplified.

[0108] The shingled module 3 includes a top-side encapsulation structure 323, a bottom-side encapsulation structure, and a cell array 31. The top-side encapsulation structure 323 includes a top plate 32 and a top-side flexible film 33, and the bottom-side encapsulation structure includes a bottom plate 35 and a bottom-side flexible film 34. A first busbar 321a and a second busbar 132b are provided on the lower surface of the top plate 32, and a hole 331 is provided on the top-side flexible film 33. The first conductive bonding structure 36a and the second conductive bonding structure 36b on the cell array 31 can make conductive contact with the corresponding busbar through the hole 331.

[0109] In this embodiment, adhesive 341 is applied to the top surface of the bottom flexible film 34. When solar cells are stacked on the top surface of the bottom flexible film 34, each solar cell can be fixed relative to the bottom flexible film 34 by adhesive 341, thereby fixing each solar cell relative to each other.

[0110] Preferably, from Figure 4 As can be seen, the adhesive 341 consists of multiple sets of dot-shaped adhesives 341 pre-set on the top surface of the bottom flexible film 34. Each set of dot-shaped adhesives 341 corresponds to a battery string. Each set of dot-shaped adhesives 341 includes one or more rows. The adhesives 341 are arranged sequentially along the second direction and are used to bond to the bottom surface of the solar cell of each of the battery strings.

[0111] Correspondingly, the method of manufacturing adhesive 341 includes the step of applying adhesive 341 to the top surface of the bottom flexible film 34 before arranging the solar cells on the bottom encapsulation structure. The step of applying adhesive 341 includes: applying multiple sets of dot-shaped adhesive 341 to the top surface of the bottom flexible film 34, such that each set of dot-shaped adhesive 341 corresponds to a cell string, each set of dot-shaped adhesive 341 includes one or more rows of dot-shaped structures, and the dot-shaped adhesive 341 are arranged sequentially along a second direction and used to bond to the bottom surface of each solar cell in the cell string respectively.

[0112] Fourth Implementation Method

[0113] Figure 5 A shingled assembly according to a fourth embodiment of the present invention is shown. For parts in this embodiment that are the same as or similar to those in the first embodiment, the description will not be repeated or the description will be simplified.

[0114] The shingled module 4 includes a cell array 41, a top-side encapsulation structure 423 and a bottom-side encapsulation structure 445. The top-side encapsulation structure 423 includes a top plate 42 and a top-side flexible film 43, and the bottom-side encapsulation structure 445 includes a bottom plate 45 and a bottom-side flexible film 44.

[0115] In this embodiment, both the first busbar 46a and the second busbar 46b are disposed on the cell array 41. The first busbar 46a is disposed on the top surface of the solar cells at the beginning of all cell strings and connects the positive electrodes of each solar cell in contact with it. The connection method can be a conductive bonding structure or welding. The second busbar 46b is disposed on the top surface of each conductive sheet and connects the conductive sheets. The connection method can also be a conductive bonding structure or welding.

[0116] The top plate 42 itself can be made of a non-conductive transparent or opaque material, and there is no need to set a conductive mechanism similar to a busbar on the top plate 42.

[0117] In this embodiment, adhesive 441 is applied to the top surface of the bottom flexible film 44. When solar cells are stacked on the top surface of the bottom flexible film 44, each solar cell can be fixed relative to the bottom flexible film 44 by adhesive 441, thereby fixing each solar cell relative to each other.

[0118] Preferably, from Figure 4 As can be seen, the adhesive 441 consists of multiple sets of dot-shaped adhesives 441 pre-set on the top surface of the bottom flexible film 44. Each set of dot-shaped adhesives 441 corresponds to a battery string. Each set of dot-shaped adhesives 441 includes one or more rows. The adhesives 441 are arranged sequentially along the second direction and are used to bond to the bottom surface of the solar cell of each of the battery strings.

[0119] The above-described embodiments provide examples of the methods and structures of the present invention. The method provided by the present invention combines the layout and stacking processes into one, directly stacking and arranging the battery cells on the bottom encapsulation material. This method is low-cost, highly efficient, and easy to operate. Furthermore, in the shingled assembly provided by the present invention, the busbars serve a confluence function, and the adhesive serves a fixing function, eliminating the need for additional solder ribbons and conductive adhesives. This arrangement avoids power loss from the battery cells and also avoids a series of problems that may arise from the use of conductive adhesives.

[0120] The above description of various embodiments of the present invention is provided for illustrative purposes to a person of ordinary skill in the art. It is not intended to exclude or limit the invention to a single disclosed embodiment. As described above, those of ordinary skill in the art will understand various alternatives and variations of the invention. Therefore, although some alternative embodiments have been specifically described, those of ordinary skill in the art will understand or relatively easily develop other embodiments. The present invention is intended to include all alternatives, modifications, and variations of the invention described herein, as well as other embodiments falling within the spirit and scope of the invention described above.

[0121] Figure label:

[0122] Shingled modules 1, 2, 3, 4

[0123] Cell arrays 11, 21, 31, 41

[0124] Top-side package structures 123, 223, 323, 423

[0125] Bottom-side packaging structures 145, 245, 345, 445

[0126] Top plate 12, 22, 32, 42

[0127] Top side flexible membrane 13, 23, 33, 43

[0128] Base plate sizes 15, 25, 35, 45

[0129] Bottom-side flexible membrane 14, 24, 34, 44

[0130] First busbars 121a, 26a, 321a, 46a

[0131] Second busbars 121b, 26b, 321b, 46b

[0132] First conductive bonding structures 16a, 36a

[0133] Second conductive bonding structures 16b, 36b

[0134] Hole 131, 331

[0135] Adhesives 341, 441

[0136] Solar cell 112

[0137] Conductive sheet 113

[0138] Positive electrode 17

[0139] Back electrode 18

[0140] First direction D1

[0141] Second direction D2

Claims

1. A method for manufacturing a shingled module, the shingled module comprising a bottom-side encapsulation structure, a top-side encapsulation structure, and a cell array fixed between the bottom-side encapsulation structure and the top-side encapsulation structure, characterized in that, The method includes the following steps: Solar cells and conductive sheets are arranged in a shingled manner on the top surface of the bottom-side encapsulation structure along a second direction to form multiple battery strings, with the conductive sheets located at the ends of the battery strings. The individual solar cells are electrically connected through the contact between the main grid lines. The conductive sheet is in contact with the main grid lines of the adjacent solar cells. The individual solar cells and the conductive sheets are fixed relative to each other by an adhesive. The battery strings are arranged along a first direction perpendicular to the second direction to form a battery array. A first busbar and a second busbar are provided on the top side of the cell array, or on the bottom side of the cell array, such that the first busbar is in electrical contact with the main grid line of the solar cell at the beginning of each cell string, and the second busbar is in electrical contact with the conductive sheet of each cell string. Both busbars are continuous strip structures and are capable of collecting current from the cell array and discharging current outward. The combined structure of the top-side encapsulation structure, the battery cell array, and the bottom-side encapsulation structure is laminated; The conductive sheet is configured to have a structure similar in shape to the solar cell and can be arranged at the end of the battery string in the same shingled manner as the solar cell.

2. The method according to claim 1, characterized in that, The method further includes the following steps: A first conductive bonding structure is provided on the top surface of the solar cell at the first end of each of the battery strings, so that the first conductive bonding structure and the main grid line of the solar cell at the first end are in direct contact. A second conductive bonding structure is provided on the top surface of each of the conductive sheets. In this configuration, the corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction. Furthermore, the top-side encapsulation structure includes a top plate, on which the first busbar and the second busbar are applied to the bottom surface of the top plate, such that the first busbar and the second busbar are aligned with their respective conductive bonding structures in a direction perpendicular to the cell array, so that the busbar can simultaneously contact the corresponding conductive bonding structures of all the cell strings.

3. The method according to claim 2, characterized in that, The top-side encapsulation structure further includes a top-side flexible film disposed between the top plate and the battery cell array. The method further includes: providing a hole on the top-side flexible film corresponding to the conductive bonding structure, so that the conductive bonding structure can contact the busbar through the hole.

4. The method according to claim 3, characterized in that, The steps of applying the first conductive adhesive structure and the second conductive adhesive structure occur after the top-side flexible film is applied to the cell array. The steps of applying the first conductive adhesive structure and the second conductive adhesive structure are as follows: applying conductive adhesive material to the top-side conductive film so that the conductive adhesive flows through the hole to the top surface of the cell array and solidifies therein to form the first conductive adhesive structure and the second conductive adhesive structure.

5. The method according to claim 2, characterized in that, The conductive adhesive structure is applied by one of the following methods: dispensing, smearing, spraying, or printing.

6. The method according to claim 1, characterized in that, The first busbar and the second busbar are disposed on the cell array. The first busbar is disposed on the top surface of the solar cell at the beginning of all the cell strings and connects the main grid lines of each solar cell in contact with it. The connection method is a conductive bonding structure or welding. The second busbar is disposed on the top surface of each conductive sheet and connects each conductive sheet. The connection method is a conductive bonding structure or welding.

7. The method according to claim 1, characterized in that, The method includes the step of applying an adhesive, which includes applying an adhesive to each of the solar cells and the conductive sheet such that the adhesive is located between each pair of adjacent solar cells and conductive sheets when the solar cells are arranged in a cell string.

8. The method according to claim 7, characterized in that, The method further includes the following steps: when applying the adhesive, the quality of the adhesive application is detected by a camera, and solar cells that have not been properly adhesiveed are rejected based on the detection results.

9. The method according to claim 8, characterized in that, The detection step is performed simultaneously with the adhesive application step, and the detection step can provide closed-loop feedback for the adhesive application step.

10. The method according to claim 7, characterized in that, The method includes the following steps: Set up a whole solar cell; Laser grooves are etched onto the entire solar cell and an adhesive is applied. The solar cell is split into multiple solar cells.

11. The method according to claim 7, characterized in that, The method includes the following steps: Set up a whole solar cell; Laser grooving is performed on the entire solar cell. The solar cell is split into multiple solar cells; An adhesive is applied to each of the solar cells.

12. The method according to claim 7, characterized in that, During the process of stacking the solar cells into a battery string, heat and / or pressure are applied to the overlapping areas between the solar cells to cure the adhesive thereon.

13. The method according to claim 1, characterized in that, The bottom-side encapsulation structure includes a base plate and a bottom-side flexible film located between the base plate and the cell array. The method further includes the step of applying an adhesive to the top surface of the bottom-side flexible film before arranging the solar cells in the bottom-side encapsulation structure.

14. The method according to claim 13, characterized in that, The step of applying the adhesive includes: applying multiple sets of dot-shaped adhesives to the top surface of the bottom flexible film, such that each set of dot-shaped adhesives corresponds to one of the battery strings, each set of dot-shaped adhesives includes one or more rows of dot-shaped structures, and the dot-shaped adhesives are arranged sequentially along the second direction and used to bond to the bottom surface of each of the solar cells in the battery string respectively.

15. The method according to claim 1, characterized in that, The method includes the step of applying an adhesive after arranging the solar cells into a battery string on the bottom-side encapsulation structure, the step of applying the adhesive including: applying a strip adhesive in a second direction to each of the battery strings so that the strip adhesive spans across the battery string.

16. The method according to claim 1, characterized in that, The steps of arranging the solar cells into battery strings and arranging the battery strings into a solar cell array are completed by electrostatic or vacuum adsorption methods.

17. The method according to claim 1, characterized in that, During the process of arranging the solar cells into a battery string, the stacking quality is detected by a camera, and the detection results are fed back to the monitoring platform in real time.

18. The method according to claim 17, characterized in that, The manufacturing system also includes a control device associated with the inspection mechanism, which enables the stacking operation mechanism to be controlled based on the inspection results of the inspection mechanism.

19. The method according to claim 1, characterized in that, Before the lamination step, EL electroluminescence or PL photoluminescence is used to detect defects in the parts to be laminated. If the detection fails, the defect detection will be repeated after the parts to be laminated are repaired.

20. The method according to claim 1, characterized in that, The method includes the steps of setting a top-side encapsulation structure and a bottom-side encapsulation structure, wherein the step of setting the bottom-side encapsulation structure includes: Set the base plate; The step of setting the top-side encapsulation structure includes using EVA, POE, or silicone to create a flexible membrane between the rigid plate and the cell array. A flexible membrane is disposed between the top plate and the cell array using EVA, POE, or silicone. Install a top plate.

21. The method according to any one of claims 1-20, characterized in that, The adhesive is non-conductive.

22. The method according to any one of claims 1-20, characterized in that, The method does not include the step of setting the solder strip.

23. A shingled module, the shingled module comprising a bottom-side encapsulation structure, a transparent top-side encapsulation structure, and a cell array disposed between the bottom-side encapsulation structure and the top-side encapsulation structure, the cell array comprising at least two cell strings, each of the cell strings being sequentially arranged along a first direction to form the cell array. Its features are, Each battery string includes multiple solar cells and a conductive sheet located at the end of the multiple solar cells. The multiple solar cells and the conductive sheet are arranged in a shingled manner along a second direction perpendicular to the first direction and are fixed relative to each other with an adhesive. The individual solar cells are electrically connected through contacts between main grid lines. The conductive sheet contacts the main grid line of its adjacent solar cell. The shingled assembly includes a first busbar and a second busbar located together on the top or bottom side of the cell array. The first busbar is configured to make electrical contact with the main grid line of the solar cell at the beginning of each cell string, and the second busbar is configured to make electrical contact with the conductive sheet of each cell string. Both busbars are continuous strip structures capable of collecting current from the cell array and discharging it outwards. The conductive sheet is configured to have a structure similar in shape to the solar cell and can be arranged at the end of the battery string in the same shingled manner as the solar cell.

24. The shingled assembly according to claim 23, characterized in that, Each of the battery strings has a first conductive bonding structure on the top surface of the solar cell at the first end, which is in direct contact with its main grid line. The top surface of the conductive sheet has a second conductive bonding structure. The corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction. The top-side encapsulation structure includes a top plate. The busbar is formed on the bottom surface of the top plate and aligned with each corresponding conductive bonding structure in a direction perpendicular to the battery cell array, so that the busbar simultaneously contacts the corresponding conductive bonding structures of all battery strings.

25. The shingled assembly according to claim 24, characterized in that, The top-side encapsulation structure also includes a top-side flexible film disposed between the top plate and the battery cell array. The top-side flexible film has holes corresponding to the conductive bonding structure, and the conductive bonding structure can contact the busbar through the holes.

26. The shingled assembly according to claim 24, characterized in that, Each segment of the conductive adhesive structure is a dot-like structure or a strip-like structure extending along the first direction.

27. The shingled assembly according to claim 23, characterized in that, The busbars are formed on the cell array. The first busbar connects the main grid lines at the beginning of each cell string, and the second busbar connects the conductive sheets of each cell string.

28. The shingled assembly according to claim 27, characterized in that, The top-side encapsulation structure is non-conductive.

29. The shingled assembly according to claim 23, characterized in that, The adhesive is applied between each pair of adjacent solar cells in each of the battery strings.

30. The shingled assembly according to claim 23, characterized in that, The adhesive is disposed between each of the solar cells and the bottom encapsulation structure so that all the solar cells are fixed relative to the bottom encapsulation structure.

31. The shingled assembly according to claim 30, characterized in that, The bottom-side encapsulation structure includes a base plate and a bottom-side flexible film located between the base plate and the cell array, with the adhesive applied to the top surface of the bottom-side flexible film.

32. The shingled assembly according to claim 31, characterized in that, The adhesive is a plurality of sets of dot-shaped adhesives pre-set on the top surface of the bottom flexible film. Each set of dot-shaped adhesives corresponds to one of the battery strings. Each set of dot-shaped adhesives includes one or more rows of dot-shaped adhesives. The dot-shaped adhesives are arranged sequentially along the second direction and are used to bond to the bottom surface of each solar cell in the battery string.

33. The shingled assembly according to claim 23, characterized in that, Each of the battery strings is provided with an adhesive, which is a strip structure extending along the second direction and spanning the battery string.

34. The shingled assembly according to claim 23, characterized in that, The bottom-side encapsulation structure includes a base plate and a flexible film located between the base plate and the cell array. The flexible film is an EVA monolithic film structure, a POE monolithic film structure, or a silicone monolithic film structure. The top-side encapsulation structure includes a top plate and a flexible film located between the top plate and the cell array. The flexible film is an EVA monolithic film structure, a POE monolithic film structure, or a silicone monolithic film structure.

35. The shingled assembly according to any one of claims 23-34, characterized in that, The adhesive is non-conductive.

36. The shingled assembly according to any one of claims 23-34, characterized in that, The shingled assembly does not have solder strips.

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