A current transformer

Abstract

The application provides a converter, which comprises a box body and electrical elements arranged in the box body. The electrical elements at least comprise a capacitor, the capacitor comprises a capacitor main body, a capacitor input busbar and a capacitor output busbar, the capacitor input busbar and the capacitor output busbar are respectively led out from different sides of the capacitor main body; the box body is provided with a heat dissipation cavity and an element cavity which are separated by a heat dissipation partition, the capacitor is located in the element cavity, and the capacitor is integrally packaged on the heat dissipation partition by a first heat-conducting insulating material; and an input power socket of the converter is arranged on the wall of the box body, and the capacitor input busbar is directly connected with the input power socket. By adopting the capacitor which is not packaged and is integrally packaged on the heat dissipation partition of the box body, the heat dissipation efficiency of the converter, especially the capacitor, can be effectively improved. In addition, the direct connection mode of the capacitor input busbar and the input power socket can effectively reduce the stray inductance.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of design of a converter, in particular to the heat dissipation design of electrical elements in the converter. BACKGROUND

[0002] With the increasing attention to environmental protection, the new energy industry has emerged as the times require. In the field of new energy vehicles, pure electric vehicles have attracted much attention. The core components of pure electric vehicles are drive motors and motor controllers for controlling the drive motors. The essence of the motor controller is a converter. The current or voltage output from the battery module is converted into a current or voltage for driving the motor through the core component IGBT module of the converter, such as rectification, phase change, etc.

[0003] The motor controller is widely used in the field of new energy vehicles, and its operating environment has a high temperature, and there are many internal heat generating components, which can affect the reliability of the internal components and the overall life of the motor controller. Therefore, it is necessary to dissipate heat from the motor controller to ensure the reliability of the motor controller.

[0004] The heat sources that cause the internal environmental temperature rise in the motor controller generally include IGBT modules, capacitors, busbars, control chips and other factors. The existing motor controller does not consider the heat dissipation of the internal components of the motor controller during design, or only considers the heat dissipation of the core component IGBT module, and ignores the capacitors and busbars which also generate a lot of heat, so that the motor controller does not have a heat dissipation effect or has a low heat dissipation efficiency, and is not comprehensive and efficient.

[0005] Therefore, there is an urgent need for a converter that can be used to control a motor, and has good heat dissipation performance without making too many structural changes to the existing converter. SUMMARY

[0006] The following gives a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all contemplated aspects, and neither is it intended to identify key or critical elements of all aspects nor to delineate the scope of any or all aspects. Its only purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description given later.

[0007] In order to provide a converter for controlling a motor with simple structure, good heat dissipation performance and low cost, the present application provides a converter, comprising a box body and electrical elements arranged in the box body, the electrical elements at least comprising a capacitor, the capacitor comprising a capacitor main body, a capacitor input busbar and a capacitor output busbar, the capacitor input busbar and the capacitor output busbar being respectively led out from different sides of the capacitor main body;

[0008] The box is provided with a heat dissipation cavity and a component cavity separated by a heat dissipation partition plate, the capacitor is located in the component cavity, and the capacitor is integrally packaged on the heat dissipation partition plate by the first heat-conducting and insulating material.

[0009] The box wall of the box is provided with an input power socket of the converter, and the capacitor input busbar is directly connected to the input power socket.

[0010] In the above embodiment, the converter provided by the application can effectively improve the heat dissipation efficiency of the capacitor in the converter by using the capacitor without packaging and integrally packaging the capacitor on the heat dissipation partition plate of the box through the heat-conducting and insulating material, so as to timely lead the heat generated by the capacitor to the heat dissipation cavity. In addition, by using the capacitor without packaging, the arrangement mode of the capacitor input busbar and the capacitor output busbar can be changed, and by leading the capacitor input busbar and the capacitor output busbar from the two side edges of the capacitor, the capacitor input busbar can be directly connected to the input power socket, thereby reducing the noise interference path between the capacitor input busbar and the input power socket, and further effectively reducing the stray inductance.

[0011] Optionally, the first heat-conducting and insulating material is glue, and the capacitor is integrally packaged on the heat dissipation partition plate by the glue.

[0012] In the above embodiment, by using the packaging glue, the capacitor without packaging is integrally packaged on the heat dissipation partition plate, thereby fixing the capacitor. In addition, the packaging glue is a heat-conducting and insulating material, which can have both heat-conducting and insulating properties.

[0013] Optionally, the capacitor input busbar and the capacitor output busbar are low-inductance busbars.

[0014] In the above embodiment, in order to reduce the stray inductance of the converter, the capacitor input busbar and the capacitor output busbar are low-inductance busbars.

[0015] Optionally, the electrical components further include an IGBT module, the IGBT module is located in the component cavity and is attached to the heat dissipation partition plate by a second heat-conducting and insulating material, and the first heat-conducting and insulating material is different from the second heat-conducting and insulating material.

[0016] The capacitor output busbar is directly connected to the input end of the IGBT module.

[0017] In the above embodiment, the core component IGBT module of the converter can dissipate heat in time to the heat dissipation cavity through the heat-conducting insulating material. Furthermore, since the capacitor input busbar and the capacitor output busbar are led out from different sides of the capacitor, the capacitor output busbar can be directly connected to the input end of the IGBT module, so as to effectively reduce the noise interference path between the capacitor output busbar and the IGBT module, and further effectively reduce the stray inductance.

[0018] Optionally, the box wall of the box body is provided with an output three-phase socket of the converter, and the IGBT module and the output three-phase socket are connected through an output busbar.

[0019] Optionally, the output busbar is a low-inductance busbar, and the output busbar is attached to the heat dissipation partition plate through the second heat-conducting insulating material.

[0020] In the above embodiment, by setting the output busbar as a low-inductance busbar, the stray inductance possibly existing in the converter can be effectively reduced. Furthermore, by attaching the output busbar to the heat dissipation partition plate through the heat-conducting insulating material, the heat generated due to the output busbar can be effectively led out to the heat dissipation cavity, so as to improve the heat dissipation efficiency of the converter.

[0021] Optionally, the electrical element further comprises a control module, the control module is located in the element cavity, and a chip area of the control module is attached to the heat dissipation partition plate through the second heat-conducting insulating material.

[0022] In the above embodiment, the chip area of the control module is the main heat source of the control module. By attaching the chip area to the heat dissipation partition plate through the heat-conducting insulating material, the heat generated due to the chip area can be effectively led out to the heat dissipation cavity, so as to improve the heat dissipation efficiency of the converter.

[0023] Optionally, other areas of the control module are between the IGBT module and the heat dissipation partition plate.

[0024] As mentioned above, since the main heat source of the control module is the chip area of the control module, and the other areas of the control module do not generate heat in the use process. Therefore, the other areas of the control module can be arranged above the IGBT module, and the heat-generating chip area is still attached to the heat dissipation partition plate through the heat-conducting insulating material, so as to make the structure inside the converter compact and reduce the manufacturing cost of the converter without sacrificing the heat dissipation efficiency.

[0025] Optionally, the control module at least comprises a driving unit, a control unit and a power supply unit; and

[0026] The aforementioned drive unit, control unit, and power supply unit are coupled to form the aforementioned control module; or the aforementioned drive unit, control unit, and power supply unit are independent units.

[0027] In the above embodiments, the control module may include independent drive units, control units, and power supply units to realize the power conversion of the converter. Furthermore, the control module may employ a coupled three-in-one board comprising the drive unit, control unit, and power supply unit, thereby achieving the effect of compact internal components of the converter.

[0028] Optionally, the converter described above is used to control the motor.

[0029] In summary, the converter provided by this invention, by using unencapsulated capacitors and integrally encapsulating them with thermally conductive insulating material on the heat dissipation partition of the housing, effectively improves the heat dissipation efficiency of the capacitors in the converter. Furthermore, by using unencapsulated capacitors, the arrangement of the capacitor's input and output buses can be modified. By leading the capacitor's input and output buses out from the sides of the capacitor, the capacitor's input bus can be directly connected to the input power socket, thereby reducing the noise interference path between the capacitor's input bus and the input power socket, and thus effectively reducing stray inductance. Attached Figure Description

[0030] Figure 1 A side view of an embodiment of the converter provided by the present invention is shown.

[0031] Figure 2 A front view of an embodiment of the converter provided by the present invention is shown.

[0032] Figure 2A It shows Figure 2 A sectional view of section AA.

[0033] Figure 2B It shows Figure 2 A sectional view of section BB.

[0034] Figure 2C It shows Figure 2 A sectional view of the CC section.

[0035] Figure Labels

[0036] 1: Capacitor

[0037] 2: Capacitor output busbar

[0038] 3: IGBT module

[0039] 4: Capacitor Input Busbar

[0040] 5: Control Module

[0041] 510: Chip Area

[0042] 6: Output busbar

[0043] 7: Input power socket

[0044] 8: Low-voltage communication socket

[0045] 9: Heat dissipation medium connector

[0046] 10: Three-phase output socket

[0047] 11: Box

[0048] 1101: Heat dissipation baffle

[0049] 1102: Heat dissipation cavity

[0050] 12: Thermally conductive insulating pad

[0051] 13: Thermally conductive insulating film Detailed Implementation

[0052] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0053] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0054] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0055] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0056] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0057] As described above, the present invention provides a converter for controlling motors that has a simple structure, good heat dissipation performance, and low cost.

[0058] The aforementioned converter includes a housing 11 and electrical components housed within the housing 11. As previously described, a converter is an electrical component that performs various transformations, such as rectification and phase conversion, on the input current or voltage through internal components and then outputs the current or voltage. Please refer to... Figure 1 , Figure 1 A side view of the converter provided by the present invention, showing a side with various input ports and output ports, is shown. For example... Figure 1 The converter housing 11 provided in this invention may be equipped with an input power socket 7, a low-voltage communication socket 8, a heat dissipation medium connector 9, and an output three-phase socket 10.

[0059] The input power socket 7 is used to connect the current or voltage to be transformed. The low-voltage communication socket 8 is used to connect to the communication and control module to set the power conversion parameters of the converter. The heat dissipation medium interface 9 is used to input / output the heat dissipation medium. The three-phase output socket 10 is used to lead the transformed voltage or current to the required location. In one embodiment, the converter is used to control a motor; therefore, the three-phase output socket 10 is connected to the input port of the motor.

[0060] like Figure 1 The converter provided by the present invention has a housing 11 covered by a heat dissipation partition 1101. Figure 1 The section marked with a dashed line is divided into a heat dissipation cavity and a component cavity. Several electrical components of the converter are located in the component cavity, while the heat dissipation cavity is connected to the heat dissipation medium through the heat dissipation medium connector 9.

[0061] Those skilled in the art will understand that the aforementioned input power socket 7, low-voltage communication socket 8, heat dissipation medium connector 9, output three-phase socket 10, and heat dissipation medium can be implemented using existing or future technologies, and will not be elaborated further here. The aforementioned enclosure 11 can be made of metal to provide the converter with superior heat dissipation. The enclosure 11 can also be made of other materials existing or future in the art for manufacturing converter enclosures, and is not limited to metal.

[0062] like Figure 1 As shown, the converter provided by this invention has a very simple external structure and controllable manufacturing cost. The input and output ports of the converter housing are simplified, which is beneficial for connection with preceding and following devices.

[0063] Please combine further Figure 2 , Figure 2 A front view of the converter provided by the present invention is shown. In particular, Figure 2 This mainly illustrates the various electrical components and their connections within the component cavity of the converter provided by this invention. For example... Figure 2 The electrical components of one embodiment of the converter provided by the present invention may include a capacitor 1, an IGBT module 3, a control module 5, and an output busbar 6.

[0064] like Figure 2 As shown, capacitor 1 further includes a capacitor body, a capacitor input busbar 4, and a capacitor output busbar 2. The capacitor 1 used in this invention is an unpackaged capacitor; therefore, the capacitor input busbar 4 and capacitor output busbar 2 can be designed to extend from opposite sides of the capacitor body. In the above embodiment, since the capacitor input busbar 4 and capacitor output busbar 2 are located on different sides, the capacitor input busbar 4 can be directly connected to the input power socket 7, and the capacitor output busbar 2 can be directly connected to the input pin of the IGBT module 3. It is particularly important to note that "direct connection" here refers to the connection between the two ports only through a lead wire, without any other electrical components; moreover, "direct connection" here refers more to a direct connection between the two ports via pins.

[0065] In the above embodiments, since the capacitor input busbar 4 is directly connected to the input power socket 7, the noise interference path between the capacitor input busbar 4 and the input power socket 7 is reduced, thereby effectively reducing stray inductance. Similarly, since the capacitor output busbar 2 is directly connected to the input pin of the IGBT module 3, the noise interference path between the capacitor output busbar 2 and the IGBT module 3 is effectively reduced, thereby effectively reducing stray inductance. This results in the converter having superior electrical characteristics.

[0066] Preferably, both the capacitor input busbar 4 and capacitor output busbar 2 are configured using low-inductance busbars. This reduces potential stray inductance and improves the electrical performance of the converter. Those skilled in the art should understand that the aforementioned low-inductance busbar (Lamination Busbar, also known as composite busbar or multilayer busbar) is an intermediate component used in high-power power electronic converters to integrate various devices. It is called a low-inductance busbar because of its very low mutual inductance between parallel lines, and it is widely used in converters and inverters. A low-inductance busbar mainly consists of a conductor (generally copper or aluminum plate), an insulator (0.1–0.3 mm insulating film), a supporting structure (insulating materials such as epoxy resin board), and connecting bolts. Those skilled in the art should understand that low-inductance busbars can also be implemented using existing or future means, and are not limited to the above.

[0067] Furthermore, in the above embodiment, the capacitor 1 used is an unencapsulated capacitor. Therefore, by encapsulating the capacitor 1 integrally with the housing 11 using potting compound, the capacitor 1 is fixed to the housing 11. Figure 2 As shown, the capacitor 1 body can be connected to the box wall of the housing 11 by potting compound. The potting compound has both thermal conductivity and insulation properties. Therefore, the main body of the capacitor can conduct the generated heat to the box wall of the housing 11 through the potting compound, while also achieving an insulation effect.

[0068] For further details, please refer to... Figure 2C , Figure 2C Enlarged as Figure 2 The cross-sectional view of the CC section shown is from... Figure 2C As can be seen, the main body of capacitor 1 is integrally encapsulated with the heat dissipation partition 1101 of the housing 11 by potting glue. As mentioned above, the potting glue material has both thermal conductivity and insulation properties. Therefore, the main body of the capacitor can conduct the generated heat to the heat dissipation partition 1101 through the potting glue material, and further conduct it to the heat dissipation medium in the heat dissipation cavity 1102.

[0069] Therefore, the converter provided by the present invention can effectively improve the heat dissipation efficiency of the capacitor in the converter.

[0070] like Figure 2 As shown, the IGBT module 3 is attached to the heat dissipation plate 1101 via a thermally conductive insulating material, allowing the core component of the converter, the IGBT module 3, to dissipate heat to the heat dissipation cavity in a timely manner through the thermally conductive insulating material. The control module 5 is located above the IGBT module 3, therefore... Figure 2 The IGBT module 3 mentioned above is shown in dashed line form.

[0071] The control module 5 includes at least a drive unit, a control unit, and a power supply unit. The control module 5 is connected to the low-voltage communication socket 8 to communicate with the outside world, receive the transformer parameters of the converter, and control and integrate other electrical components so that the converter operates according to the received transformer parameters.

[0072] In one embodiment, the drive unit, control unit, and power supply unit included in the control module 5 can be a coupled three-in-one board. By coupling the drive unit, control unit, and power supply unit together, the structure of the control module 5 can be made more compact, thereby reducing the internal space occupied by the converter and reducing the manufacturing cost of the converter.

[0073] Those skilled in the art should know that the drive unit, control unit and power supply unit included in the above control module 5 can also be provided in other forms, and are not limited to the above-described coupling form of the three-in-one board.

[0074] The main heat source for control module 5 is the chip area, while other areas of the control module generate virtually no heat during use. Therefore, in situations where... Figure 2 In the illustrated embodiment, the other area of ​​the control module is located above the IGBT module 3, while the heat-generating chip area (corresponding to...) Figure 2 The AA part is still attached to the heat dissipation baffle 1101 by thermally conductive insulating material, so that the internal structure of the converter can be compact and the manufacturing cost of the converter can be reduced without sacrificing heat dissipation efficiency.

[0075] Figure 2A Further shown Figure 2 A sectional view of section AA. (e.g.) Figure 2A As shown, the chip area 510 of the control module 5 is attached to the heat dissipation partition 1101 of the housing 11 through the thermally conductive insulating pad 12, so that the heat generated during use can be effectively conducted to the heat dissipation cavity 1102 through the thermally conductive insulating pad 12, thereby improving the heat dissipation effect of the converter.

[0076] like Figure 2As shown, the output port of IGBT module 3 is connected to the three-phase output socket 10 of the converter via output busbar 6. Preferably, a low-inductance busbar is used for the output busbar 6, thereby reducing stray inductance and improving the converter's electrical performance. Those skilled in the art should understand that the aforementioned low-inductance busbar (Lamination Busbar, also known as composite busbar or laminated busbar) is an intermediate component used in high-power power electronic converters to integrate various devices. It is called a low-inductance busbar because of its very low mutual inductance between parallel lines, and it is widely used in converters and inverters. The low-inductance busbar mainly consists of a conductor (generally copper or aluminum plate), an insulator (0.1–0.3 mm insulating film), a supporting structure (epoxy resin board or other insulating materials), and connecting bolts. Those skilled in the art should understand that low-inductance busbars can also be implemented using existing or future means, and are not limited to the above.

[0077] In the above embodiment, the output busbar 6 is attached to the heat dissipation partition by a thermally conductive insulating material. Figure 2B Further shown Figure 2 Cross-sectional view of section BB in the middle.

[0078] like Figure 2B As shown, the output busbars 6 include multiple layers of parallel conductive bodies, which are separated by a thermally conductive insulating film 13. The output busbars 6 are attached to the heat dissipation baffle 1101 of the housing 11 by thermally conductive insulating pads 12, thereby effectively conducting the heat generated by the output busbars 6 during use to the heat dissipation cavity 1102 through the thermally conductive insulating pads 12, thereby improving the heat dissipation effect of the converter.

[0079] Both the thermally conductive insulating pad 12 and the thermally conductive insulating film 13 described above can be thermally conductive insulating materials. These thermally conductive insulating materials may include a phase change material (PCM). A PCM is a substance whose physical properties change with temperature and can provide latent heat. The process of changing physical properties is called a phase change process, during which the PCM absorbs or releases a large amount of latent heat. Once this material is widely used in human life, it will become the best green and environmentally friendly carrier for energy conservation. PCM has the ability to change its physical state within a certain temperature range. Taking solid-liquid phase change as an example, when heated to the melting temperature, a phase change occurs from a solid state to a liquid state. During the melting process, the PCM absorbs and stores a large amount of latent heat; when the PCM cools, the stored heat dissipates into the environment within a certain temperature range, undergoing a reverse phase change from liquid to solid. The energy stored or released during these two phase change processes is called the latent heat of phase change. When the physical state changes, the temperature of the material itself remains almost constant before the phase transition is complete, forming a wide temperature plateau. Although the temperature remains constant, the latent heat absorbed or released is quite large.

[0080] The aforementioned phase change materials may include paraffin wax undergoing a solid-liquid phase change or composite materials comprising paraffin wax. Those skilled in the art will understand that the aforementioned phase change materials can be provided using other existing or future materials, and are not limited to paraffin wax.

[0081] By employing phase change materials to bond the chip areas 4 of the IGBT module 3 and control module 5, as well as the output busbar 6 of the converter, to the heat dissipation plate 1101, a large amount of heat generated during operation by these components can be absorbed by the phase change material. Furthermore, since most of the heat absorbed by the phase change material during the phase change process is used for the phase change itself, and only a small portion for temperature increase, the temperature rise of the phase change material during phase change is relatively small. This results in a slower overall temperature rise in the converter, allowing the heat dissipation cavity more time to dissipate heat, thereby improving the converter's heat dissipation performance.

[0082] Based on this, the present invention provides a converter in which the housing and capacitor are manufactured as a single unit. The heat generated by the capacitor can be completely directed to the housing wall and heat dissipation cavity, saving costs, improving the heat dissipation efficiency of the capacitor, and thus improving the heat dissipation efficiency of the converter.

[0083] The capacitor input busbar is directly connected to the input power socket, reducing intermediate transmission paths, lowering costs, and effectively reducing stray inductance.

[0084] The optimal control module is a three-in-one board, and the heat-generating chip of the three-in-one board is attached to the heat dissipation cavity with a thermally conductive insulating pad to improve the heat dissipation efficiency of the chip, thereby improving the heat dissipation efficiency of the converter.

[0085] The output busbar adopts a low-inductance busbar, which effectively reduces stray inductance. Furthermore, the output busbar and the heat dissipation cavity are bonded together by thermally conductive insulating pads, which improves the heat dissipation efficiency of the busbar and thus improves the heat dissipation efficiency of the converter.

[0086] In summary, the converter provided by this invention can effectively reduce the internal temperature rise of the converter and improve its reliability. Furthermore, the converter provided by this invention is simple to manufacture, low in cost, has good heat dissipation performance, can effectively control the operating environment temperature, and is easy to implement.

[0087] Furthermore, the converter provided by this invention can be applied to various required scenarios. More specifically, it can be used to control motors. Those skilled in the art should understand that the above-described application for controlling motors is merely an example of the converter's application scenarios, and not a limitation on the application scenarios of the converter provided by this invention.

[0088] Those skilled in the art will understand that the transformer parameters described in the above embodiments can be stored or transmitted as one or more instructions or codes on a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium can be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then such coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0089] Furthermore, the drive unit, control unit, and power supply unit described in the above embodiments can be implemented or performed using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor can be a microprocessor, but in alternatives, it can be any conventional processor, controller, microcontroller, or state machine. The processor can also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration.

[0090] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power converter comprising a housing and electrical components disposed within the housing, characterized in that, The electrical element at least includes a capacitor, the capacitor includes a capacitor main body, a capacitor input busbar and a capacitor output busbar, the capacitor input busbar and the capacitor output busbar are respectively led out from different sides of the capacitor main body; The box is internally provided with a heat dissipation cavity and an element cavity which are separated by a heat dissipation partition plate, the capacitor is located in the element cavity, and the capacitor is integrally packaged on the heat dissipation partition plate by a first heat-conducting insulation material; And The box wall of the box is provided with an input power socket of the converter, the capacitor input busbar is directly connected with the input power socket; The electrical element further includes an IGBT module, the IGBT module is located in the element cavity and is attached to the heat dissipation partition plate by a second heat-conducting insulation material, and the first heat-conducting insulation material is different from the second heat-conducting insulation material; And The capacitor output busbar is directly connected with an input end of the IGBT module; The first heat-conducting insulation material is glue, and the capacitor is integrally packaged on the heat dissipation partition plate by the glue; the capacitor input busbar and the capacitor output busbar are low-inductance busbars.

2. The current transformer of claim 1, wherein, The box wall of the box is provided with an output three-phase socket of the converter, and the IGBT module and the output three-phase socket are connected by an output busbar.

3. The current transformer of claim 2, wherein, The output busbar is a low-inductance busbar, and the output busbar is attached to the heat dissipation partition plate by the second heat-conducting insulation material.

4. The current transformer of claim 1, wherein, The electrical element further includes a control module, the control module is located in the element cavity, and a chip area of the control module is attached to the heat dissipation partition plate by the second heat-conducting insulation material.

5. The current transformer of claim 4, wherein, Other areas of the control module are between the heat dissipation partition plate and the IGBT module.

6. The current transformer of claim 4, wherein, The control module at least includes a driving unit, a control unit and a power unit; and The driving unit, the control unit and the power unit are coupled as the control module; or the driving unit, the control unit and the power unit are independent units.

7. A current transformer according to any one of claims 1-6, characterised in that The converter is used to control a motor.

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