Manufacturing Method of Overlap Shingle Component and Overlap Shingle Component
By fixing the solar cell by using the heating and melting characteristics of the bottom and/or the top and bottom films, the problems of weak connection capacity and high cost of tiled components are solved, and efficient and reliable component manufacturing and performance improvement are achieved.
Patent Information
- Application Number
- CN202010076454.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-01-23
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2040-01-23
AI Technical Summary
When used outdoors, existing stacked tiles are weak in conducting glue connection and are easily affected by environmental factors, resulting in false current connection or circuit breaker, and are costly and low production efficiency, and have problems such as spilling glue short circuit.
The solar cell is fixed to it by the heating and melting characteristics of the bottom side film and/or the top side film, and is laminated and arranged directly on the bottom side packaging material, avoiding the use of conductive glue and adhesive.
It realizes efficient and reliable connection of stacked tiles, reduces cost and production time, improves the outdoor application performance of the components, and avoids environmental pollution of conductive adhesives.
Smart Images

Figure CN111261741B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of energy, and particularly to a manufacturing method and a laminated shingle component of a laminated shingle component. Background Art
[0002] With the accelerating consumption rate of conventional fossil energy such as coal, oil, and natural gas globally, the ecological environment has been deteriorating continuously. Especially, greenhouse gas emissions have led to increasingly severe global climate change, and the sustainable development of human society has been seriously threatened. Countries around the world have successively formulated their respective energy development strategies to address the limitations of conventional fossil energy resources and the environmental problems brought about by their development and utilization. Solar energy has become one of the most important renewable energy sources due to its reliability, safety, universality, long lifespan, environmental friendliness, and abundance of resources, and is expected to become the main pillar of future global power supply.
[0003] In the process of a new round of energy transformation, China's photovoltaic industry has grown into a strategic emerging industry with international competitive advantages. However, the development of the photovoltaic industry still faces many problems and challenges. Conversion efficiency and reliability are the biggest technical obstacles restricting the development of the photovoltaic industry, while cost control and large-scale production pose economic constraints. As the core component of photovoltaic power generation, it is an inevitable trend to improve its conversion efficiency and develop high-efficiency components. Currently, various high-efficiency components have emerged in the market, such as laminated shingles, half-cells, multi-busbar, and bifacial components. As the application scenarios and regions of photovoltaic components become more and more extensive, the requirements for their reliability are getting higher and higher. Especially in some areas with frequent severe or extreme weather, high-efficiency and highly reliable photovoltaic components are needed.
[0004] Under the background of vigorously promoting and using solar green energy, the laminated shingle component utilizes the electrical principle of low current and low loss (the power loss of a photovoltaic component is proportional to the square of the working current), thus greatly reducing the power loss of the component. Secondly, by making full use of the area between the cells in the battery component for power generation, the energy density per unit area is high. In addition, currently, a conductive adhesive with elastomer characteristics is used to replace the conventional photovoltaic metal solder ribbon for components. Since the photovoltaic metal solder ribbon exhibits a relatively high series resistance in the entire cell and the current loop of the conductive adhesive is much shorter than that of the solder ribbon method, the laminated shingle component finally becomes a high-efficiency component. At the same time, its outdoor application reliability is more excellent than that of conventional photovoltaic components because the laminated shingle component avoids stress damage to the interconnection position of the cells and other current collection areas by the metal solder ribbon. Especially in a dynamic (such as the action of natural loads like wind and snow) environment with alternating high and low temperatures, the failure probability of conventional components interconnected and encapsulated with metal solder ribbons far exceeds that of laminated shingle components encapsulated with crystalline silicon cell chips interconnected and cut with an elastomer conductive adhesive.
[0005] The mainstream process of the current shingled module uses conductive adhesive to interconnect the cut cells. The conductive adhesive is mainly composed of a conductive phase and a bonding phase. The conductive phase is mainly composed of precious metals, such as pure silver particles or silver-coated copper, silver-coated nickel, silver-coated glass and other particles, and is used to conduct electricity between solar cells. The shape and distribution of the particles are based on the optimal electrical conduction. At present, most of the silver powders with a D50<10um grade are in the form of flakes or spherical combinations. The bonding phase is mainly composed of weather-resistant polymer resins. Acrylic resins, silicone resins, epoxy resins, polyurethanes, etc. are usually selected based on bonding strength and weathering stability. In order to achieve low contact resistance, low volume resistivity, high bonding and maintain long-term excellent weathering properties, general conductive adhesive manufacturers will complete the design of the conductive phase and bonding phase formula to ensure the stability of the performance of the shingled module in the initial environmental corrosion test and long-term outdoor actual application.
[0006] As for the battery components connected by conductive glue, after being packaged, they are subject to environmental erosion during actual outdoor use, such as the relative displacement between the conductive glues caused by alternating high and low temperature thermal expansion and contraction. The most serious is that the current is virtual or even disconnected, and the main reason is generally because the connection ability between the materials is weak after combination. The weak connection ability is mainly manifested in the fact that the conductive glue operation requires a process operation window in the process. This window is relatively narrow in the actual production process and is very susceptible to environmental factors, such as the temperature and humidity of the workplace, the length of time it stays in the air after applying the glue, etc., which will make the conductive glue lose its activity. At the same time, for the dispensing, spraying or printing process, the glue itself changes and the glue is prone to uneven glue application, which will pose a great threat to product reliability. Secondly, the conductive glue is mainly composed of polymer resin and a large amount of precious metal powder, which is expensive and damages the ecological environment to a certain extent (the production and processing of precious metals pollute the environment more). Moreover, the conductive glue is a paste, which has a certain fluidity during the glue application or lamination process, and it is very easy to overflow the glue and cause the positive and negative poles of the shingled interconnected battery string to short-circuit.
[0007] That is to say, for most shingled components made by conductive adhesive bonding, there are problems such as weak interconnection strength, high environmental requirements for the process, easy glue overflow and short circuit during use, high cost of use, and low production efficiency.
[0008] Therefore, it is necessary to provide a method for manufacturing a shingled assembly and a shingled assembly to solve the above problems. Summary of the invention
[0009] The object of the present invention is to provide a method for manufacturing an overlapping tile assembly and an overlapping tile assembly. According to the solution provided by the present invention, the solar cell can be fixed thereon by the heat-melting characteristics of the bottom-side film and / or the top-side film without additionally using conductive adhesive and / or binder. Such a solution combines the typesetting process and the lamination process into one, directly laminating and typesetting the battery cells on the bottom-side encapsulation material, and such a method has low cost, high efficiency and is easy to operate.
[0010] According to one aspect of the present invention, there is provided a method for manufacturing an overlapping tile assembly, the overlapping tile assembly comprising an encapsulation structure and an array of battery cells located within the encapsulation structure, and the encapsulation structure comprising a bottom-side film located on the bottom side of the array of battery cells and in direct contact with the array of battery cells and a top-side film located on the top side of the array of battery cells and in direct contact with the array of battery cells, the method comprising the steps of laying the bottom-side film, laminating on the bottom-side film, and laying a top-side film on the top side of the array of battery cells, wherein
[0011] in the laminating step, the solar cells are placed on the bottom-side film in an overlapping tile manner such that adjacent solar cells are conductively connected through direct contact of the main grid lines;
[0012] heating the bottom-side film and / or the top-side film to make at least a part thereof in a molten state and contacting the solar cells in the molten state so that after the molten area solidifies, it can be fixed together with the solar cells;
[0013] applying other components of the encapsulation structure on the combination of the bottom-side film, the top-side film and the array of battery cells and performing overall lamination.
[0014] In one embodiment, the method comprises the step of heating the bottom-side film, and the heating step and the step of placing the solar cells on the bottom-side film are carried out simultaneously so that the area of the bottom-side film to receive the solar cells always remains in a molten state.
[0015] In one embodiment, the method comprises: presetting the heating parameters of the heating process so that for two sequentially placed solar cells continuously, during the process of placing the latter solar cell on the bottom-side film, the former solar cell has been fixed on the bottom-side film, and the former solar cell can be used as a reference for placing the latter solar cell.
[0016] In one embodiment, the step of heating the bottom-side film comprises: applying heat to the bottom-side film and / or the top-side film through a heating mechanism independent of the overlapping tile assembly.
[0017] In one embodiment, the heating parameters of the heating process match the material parameters of the bottom-side film and / or the top-side film, and the heating method is at least one of direct heating method, infrared heating method, microwave heating method, and laser heating method.
[0018] In one embodiment, heating is achieved by a combined infrared and ultraviolet light illumination method.
[0019] In one embodiment, the method includes the step of heating the bottom-side film, and the step of heating the bottom-side film includes: placing the solar cell with its own heat on the bottom-side film to melt the bottom-side film.
[0020] In one embodiment, the method further includes a pre-laminating step before placing the solar cell on the bottom-side film, and the pre-laminating step includes: arranging each solar cell in order by electrostatic or vacuum adsorption method, but the solar cells do not contact each other.
[0021] In one embodiment, a manipulator is set to complete the lamination on the bottom-side film, and the method further includes: setting the parameters of the manipulator based on the size of the solar cell and the position of the main grid line on the solar cell, so that the main grid lines of adjacent solar cells can be accurately contacted when the manipulator operates.
[0022] In one embodiment, multiple groups of manipulators are set to work simultaneously.
[0023] In one embodiment, the method includes the following steps after placing the cell array on the bottom-side film: setting a bus bar on the cell array to lead out the current of the cell array.
[0024] In one embodiment, the encapsulation structure includes a top plate, and the method further includes the following steps after placing the cell array on the bottom-side film and before lamination: placing the top plate on the top-side film.
[0025] In one embodiment, the encapsulation structure includes a bottom plate, and the bottom-side film is laid on the bottom plate.
[0026] In one embodiment, the method includes the step of manufacturing a solar cell, and the step of manufacturing a solar cell includes:
[0027] Setting a whole piece of solar cell;
[0028] Laser grooving on the whole piece of solar cell;
[0029] Dividing the whole piece of solar cell into multiple solar cells.
[0030] In one embodiment, during the process of arranging the solar cells into a battery string, the lamination quality is detected by a detection mechanism, and the detection result is fed back to the monitoring platform in real time.
[0031] In one embodiment, the manufacturing system further includes a control device, and the control device is associated with the detection mechanism so as to be able to control the lamination operation mechanism based on the detection result of the detection mechanism.
[0032] In one embodiment, before the lamination step, EL electroluminescence or PL photoluminescence is used to detect defects of the workpiece to be laminated. If the detection is unqualified, after the workpiece to be laminated is repaired, the defect detection is carried out again.
[0033] In one embodiment, the method does not include the step of fixing the individual solar cells relative to each other without applying an adhesive.
[0034] According to another aspect of the present invention, there is provided a shingled assembly manufactured by the method described in any one of the above, the shingled assembly comprising:
[0035] An encapsulation structure, the encapsulation structure including a bottom side film and a top side film;
[0036] A battery cell array, the battery cell array being located between the bottom side film and the top side film and in contact with the top side film and the bottom side film, the battery cell array including a plurality of battery strings arranged in a first direction, each battery string including a plurality of solar cells arranged in a shingled manner in a second direction perpendicular to the first direction, main grid lines are provided on the solar cells, and any two adjacent solar cells in each battery string are in direct contact through the main grid lines to achieve electrical connection.
[0037] Wherein, the bottom side film and / or the top side film is a thermoplastic integral film structure and can be fixed to the battery cell array together with it by heat melting.
[0038] In one embodiment, the solar cells are crystalline silicon solar cells or heterojunction solar cells.
[0039] In one embodiment, the solar cells are formed into a rectangle, and its length is 2-10 times its width.
[0040] In one embodiment, the bottom side film and the top side film are an EVA integral film structure, a POE integral film structure or a silicone integral film structure.
[0041] In one embodiment, the encapsulation structure further includes a top plate and a bottom plate located below the bottom side film, and the top plate and the bottom plate are rigid or flexible weather-resistant integral plate structures with dimensions larger than the battery string array.
[0042] In one embodiment, the size of the overlapping portion between adjacent solar cells of each battery string in the second direction is 0.05 mm - 5 mm.
[0043] In one embodiment, the main grid lines are a positive electrode disposed on the top surface of the solar cell and a back electrode disposed on the bottom surface of the solar cell, where
[0044] the positive electrode is intermittently disposed in its extending direction, and the back electrode is continuously disposed in its extending direction; or
[0045] the positive electrode is continuously disposed in its extending direction, and the back electrode is intermittently disposed in its extending direction; or
[0046] the positive electrode is intermittently disposed in its extending direction, the back electrode is intermittently disposed in its extending direction, and the positive electrode and the back electrode are aligned in the second direction.
[0047] In one embodiment, the main grid lines are a positive electrode disposed on the top surface of the solar cell and a back electrode disposed on the bottom surface of the solar cell, and both the positive electrode and the back electrode are formed into a serrated structure. When two solar cells are connected in a shingled manner, the positive electrodes and the back electrodes of the two solar cells are in contact with each other in the form of a rack and pinion engagement.
[0048] In one embodiment, the solar cells in the shingled assembly have multiple specifications.
[0049] In one embodiment, no binder is provided in the shingled assembly for fixing each solar cell relative to each other.
[0050] According to the solution provided by the present invention, the solar cells can be fixed thereon through the heat-melting characteristics of the bottom-side film and the top-side film without the need to additionally use a binder. Such a solution can combine the typesetting process and the lamination process into one, directly laminate and typeset the battery cells on the bottom-side encapsulation material, and this method has a lower cost, higher efficiency, and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0051] To better understand the above and other objects, features, advantages, and functions of the present invention, reference may be made to the preferred embodiments shown in the drawings. The same reference numerals in the drawings refer to the same components. Those skilled in the art should understand that the drawings are intended to schematically illustrate the preferred embodiments of the present invention and have no limiting effect on the scope of the present invention, and the components in the drawings are not drawn to scale.
[0052] Figure 1 Flow chart of a method for manufacturing an overlapping tile component according to a preferred embodiment of the present invention;
[0053] Figure 2 Schematic diagram of an overlapping tile component during the lamination process according to a preferred embodiment of the present invention;
[0054] Figure 3 is Figure 2 Schematic diagram after the overlapping tile component in [] has completed lamination. Detailed Embodiment
[0055] Now referring to the accompanying drawings, the detailed embodiments of the present invention will be described in detail. What is described here is only the preferred embodiment of the present invention. Those skilled in the art can think of other ways to implement the present invention based on the preferred embodiment, and those other ways also fall within the scope of the present invention.
[0056] The present invention provides a method for manufacturing an overlapping tile component and an overlapping tile component, Figures 1 to 3 which shows a preferred embodiment of the present invention.
[0057] In a preferred embodiment, the overlapping tile component includes a packaging structure and an array of solar cells located within the packaging structure. The packaging structure can further include a top plate, a top side film, a bottom plate, and a bottom side film. The top side film is located on the top surface of the solar cell array and is in direct contact with the solar cell array. The top plate covers the top side film. The bottom side film is located on the bottom surface of the solar cell array and is in direct contact with the bottom surface of the solar cell array. The bottom plate is located below the bottom side film. In the present invention, the bottom side film is a thermoplastic bottom side film. The top plate and the bottom plate can be rigid plates such as tempered glass, and the top side film and the thermoplastic bottom side film can be flexible film structures made of EVA, POE, or silicone.
[0058] A preferred embodiment of the method for manufacturing the overlapping tile component is generally shown in Figure 1 From the figure, it can be seen that the method generally includes steps S1 to S6. It should be noted that S1 and S6 are not necessarily carried out strictly in chronological order. For example, steps S2, S3, and S4 can occur simultaneously at the same time.
[0059] Step S1 is the step of laying the thermoplastic bottom side film. Specifically, step S1 can further include setting the bottom plate and laying the thermoplastic bottom side film on the bottom plate.
[0060] Step S2 is the step of heating the area of the thermoplastic bottom film where the solar cell is to be received (hereinafter referred to as the to-be-received area). Specifically, in this step, the thermoplastic bottom film is heated so that its to-be-received area is in a molten state. Preferably, heat is applied to the thermoplastic bottom film by a heating mechanism independent of the shingled module to complete the heating. More preferably, the heating parameters (such as heating temperature, heating time, etc.) in the heating process are matched with the material parameters of the thermoplastic bottom film to ensure that the to-be-received area of the thermoplastic bottom film is in a controllable molten state. The heating method can be direct heating, infrared heating, microwave heating, or laser heating, or heating can also be achieved by a combined illumination method of infrared and ultraviolet. More preferably, the heating process can be local heating or global heating of the thermoplastic bottom film.
[0061] Step S3 is the step of placing the solar cell on the molten area of the thermoplastic bottom film. Specifically, each solar cell is accurately placed on the molten area of the thermoplastic bottom film, and the solar cells are arranged in a shingled manner to form a battery string. In each battery string, any two adjacent solar cells are conductively connected through the direct contact of the main grid lines. Since the main grid lines of the solar cells are in direct contact to achieve conductive connection, there is no need to set conductive adhesive on the cell array.
[0062] Preferably, a manipulator can be set to complete this step. For example, the parameters of the manipulator can be set based on the size of the solar cell and the position of the main grid line on the solar cell, so that the main grid lines of adjacent solar cells can be accurately contacted when the manipulator operates. More preferably, multiple groups of manipulators can be set to work simultaneously and arrange the wafers simultaneously. More preferably, during the process of arranging the solar cells into a battery string, the lamination quality is detected by a detection mechanism, and the detection result is fed back to the monitoring platform in real time. And, the manufacturing system also includes a control device, which is associated with the detection mechanism and can control the lamination operation mechanism based on the detection result of the detection mechanism.
[0063] Step S4 is the step of cooling the area where the solar cell is placed and fixing the solar cell. It can be understood that the thermoplastic bottom film can fix the solar cell on it after melting and solidifying. Since the solar cell has been fixed on the thermoplastic bottom film by this method, there is no need to additionally set bonding materials such as adhesives.
[0064] Step S5 is to set other encapsulation structures. For example, a bus bar is set, a top film is applied on the top surface of the cell array, and a top plate is covered on the top film.
[0065] Step S6 is the overall lamination step. Before the lamination step, EL electroluminescence or PL photoluminescence can be used to detect defects in the workpiece to be laminated. If the detection is unqualified, the workpiece to be laminated shall be repaired and then the defect detection shall be carried out again. The color of the overall workpiece obtained after lamination can be colors with obvious appearance features such as black or white.
[0066] It should be emphasized again that the above steps are merely illustrative, and their chronological order does not necessarily proceed in the order described above.
[0067] For example, the heating step and the step of placing the solar cell on the thermoplastic bottom film are carried out simultaneously so that the area of the thermoplastic bottom film to receive the solar cell always remains in a molten state. More preferably, the heating parameters of the heating process can be preset so that for two sequentially placed solar cells, when the latter solar cell is placed on the thermoplastic bottom film, the former solar cell has been fixed on the thermoplastic bottom film, and the former solar cell can be used as a reference for placing the latter solar cell. Such a setting can make the molten state of the thermoplastic bottom film relatively controllable and avoid damaging the thermoplastic bottom film or the solar cell due to too high overall heating temperature.
[0068] For another example, the implementation method in which the step of heating the receiving area of the thermoplastic bottom film to melting and the step of placing the solar cell on the receiving area occur simultaneously can also be: placing the solar cell with its own heat on the thermoplastic bottom film to melt the thermoplastic bottom film. Specifically, the solar cell is heated before being placed, and when it is placed on the thermoplastic bottom film, it can heat the area at its bottom to melting, and after the area melts and cools, the solar cell can be fixed on it.
[0069] Preferably, the method provided by the present invention may also include some steps not shown in Figure 1 For example, the method further includes a pre-laminating step before placing the solar cell on the thermoplastic bottom film. The pre-laminating step includes: arranging each solar cell in order by means of electrostatic or vacuum adsorption, but the solar cells do not contact each other. For another example, the method includes the following steps after placing the cell array on the thermoplastic bottom film: arranging a bus bar on the cell array to lead out the current of the cell array. For another example, multi-layer weather-resistant materials such as TPT, KPK, KPM, KPC, and APE can be used to manufacture the top plate and the bottom plate.
[0070] Preferably, the method provided by the present invention further includes the step of manufacturing the solar cell. The step of manufacturing the solar cell includes: arranging the whole piece of the solar cell; laser grooving on the whole piece of the solar cell; splitting the whole piece of the solar cell into multiple solar cells.
[0071] Each of the above steps can also have further optimized settings. For example, when the entire solar cell is loaded, it undergoes visual inspection and position positioning. High-precision CCD cameras are installed both above and below the inspection platform to capture special patterns (such as mark points, main and auxiliary grids, etc.) on the front and back of the cell and the PL (photoluminescence laser detector) to automatically identify and reject cells with printing errors exceeding a certain range, as well as those with appearance defects or internal cracks into the NG bin. It should be noted that the large overlapping-wafer cells are sorted precisely by color, efficiency, and high and low open-circuit voltage. The cells loaded are of basically the same attributes (capable of matching the small-cell sorting function). At the same time, the equipment loading platform is suitable for loading small cells, with dedicated bins and processing mechanisms.
[0072] After that, the qualified entire solar cell is precisely transferred to the laser cutting platform. The transfer method can use servo handling or a conveyor belt with adsorption. The laser cutting trajectory is position-compensated according to the visual positioning of the cell. Finally, the entire solar cell is precisely cut and split into 2 to N solar cells by the laser along the cutting position of the cell.
[0073] High-precision visual inspection is carried out on the cut solar cells for the heat-affected zone, cutting depth, cutting line width, etc. The unqualified NG pieces inspected online are placed at the NG station. The laser cutting process includes the use of lasers with different wavelengths (for example, on the basis of red nanoseconds, matching picosecond or femtosecond lasers in lower wavelength bands such as green and purple). This method is suitable for splitting the cells in a way with low or no damage to local thermal stress.
[0074] Furthermore, the split solar cells or the solar cells that have been processed separately offline and are in good condition are automatically rejected online through CCD visual inspection for poor appearance NG, and at the same time, the relative position coordinates are output to the transfer robot or motion module to achieve the loading and stacking process. This module includes a multi-head handling mechanical device, which can realize the handling, stacking, and laying actions of multiple groups of multi-cell or single-cell overlapping-wafer batteries. Among them, the processing link integrates functions of mechanical alignment and visual positioning correction, and modules for controlling the stacking and laying angle and the force on the patch. Each mechanical and electrical system can be automatically controlled with an accuracy of up to ±0.05 mm.
[0075] After that, the bottom plate is output to the thermoplastic bottom film laying unit. After being aligned and positioned, the pre-cut or synchronously cut thermoplastic bottom film is transplanted to the surface of the bottom plate by the handling robot. The transplantation includes implementation methods such as negative pressure adsorption and traction. After completion of the laying, it is ensured that the centers of the bottom plate and the thermoplastic bottom film coincide, avoiding process defects caused by skewed laying.
[0076] When using the adhesive end lead process, the manipulator preferentially lays the pre-coated conductive leads, and then sequentially lays the solar cell and another lead until a battery string with effective connection output is formed. The conductive top plate encapsulation method is adopted. The encapsulation includes that the back of the cell array except the main grid line contains busbar or bypass pads. That is, the cell positions of the shingled module include various specifications of cells, and solar cells with pad specifications can be laid at the designated positions of the shingles according to the bypass design.
[0077] After the laying is completed, the whole is transported to the next station for busbar connection processing. The metal busbar is used to complete the busbar connection through pre-coated conductive adhesive or laser heating in the designated area. The same method is used for the pattern bypass protection setting. After the busbar connection and bypass protection connection processing are completed, the back glue film, back cover plate and lead-out wire are processed. For the conductive top plate used in the stacked row integration, a separate station needs to be added to pre-coat the conductive medium on the connection points of the back cover plate circuit pads. The conductive medium such as conductive adhesive, solder paste, etc. The coating methods include spraying glue and printing. The fitting connection and conduction are realized through equipment automation. Before the fitting action occurs, a top-side film needs to be laid on the surface of the battery string, and the designated position of the top-side film is punched in the area during pre-cutting or synchronous stretching cutting, so that the conductive medium can effectively connect the cell and the top plate circuit pad.
[0078] The laminate with conductive connection function enters the lamination process after passing the EL (electroluminescence) and VI (visual appearance) inspections and being qualified. The lamination process includes three-chamber lamination. Among them, the lamination process combines the new interconnection structure and in a closed chamber, through vacuum pumping, heating and pressurization, the thermoplastic bottom-side film is completely thermally cured so as to closely fit the shingled module and finally laminated into a complete structural part. The positive and negative electrodes of the front and rear solar cells in the structural part form good physical contact and then realize electrical conduction. Immediately after the lamination process is completed, the laminate needs to pass through processes such as framing, junction box, curing, cleaning, safety inspection test, power test, EL test, finished product inspection, etc. to complete the processing of the final finished shingled module.
[0079] In another embodiment, the top-side film can be set as a thermoplastic film structure, and the top-side film can be heated to the thermally molten state and then contacted with the cell array. After the thermally molten area cools, the cell array is fixed relative to the top-side film. For example, the heat carried by the solar cell from the previous process can be used. If the lamination speed is fast enough, the top-side film can be covered on the solar cell before it cools, and the heat of the solar cell can automatically melt the area on its top; or, after the lamination is completed, the top-side film that has been heated to the thermally molten state can be covered on the cell array. Preferably, a top-side film and a bottom-side film with thermally molten characteristics can be used simultaneously. After the two of them cool, the top-side film, the bottom-side film and the cell array are fixed together.
[0080] Figure 2 and Figure 3The schematic diagrams during the lamination process and after the lamination of the shingled module manufactured by the above method are shown. Figure 2 and Figure 3 Only the cell array 3, the bottom plate 1, the thermoplastic bottom side film 2 and a part of the bus bar structure of the shingled module are shown, and other components are not shown in Figure 2 and Figure 3 are not shown.
[0081] Specifically, the shingled module includes a packaging structure and a solar cell array 3. The packaging structure further includes a top plate, a top side film located between the top plate and the cell array 3, and a bottom plate 1 located below the thermoplastic bottom side film 2. The top plate and the bottom plate 1 are rigid or flexible weather-resistant integral plate structures with dimensions larger than the cell string array. The cell array 3 is located on the top surface of the thermoplastic bottom side film 2. The cell array 3 includes a plurality of cell strings arranged in a first direction. Each cell string includes a plurality of solar cells arranged in a shingled manner in a second direction perpendicular to the first direction. Main grid lines are provided on the solar cells. Any two adjacent solar cells in each cell string are in direct contact through the main grid lines to achieve electrical connection. Among them, the thermoplastic bottom side film 2 fixes the cell array 3 on it through heat melting.
[0082] Each of the above components can have various preferred embodiments. For example, the solar cell is a crystalline silicon solar cell or a heterojunction solar cell; the solar cell is formed into a rectangle, and its length is 2-10 times its width; the thermoplastic bottom side film 2 and the top side film can be an EVA integral film structure, a POE integral film structure or a silicone integral film structure; the overlapping part between adjacent solar cells in each cell string has a size of 0.05 mm - 5 mm in the second direction.
[0083] The main grid lines on the solar cells that can be in direct contact with each other can also have various structures. The main grid lines are a positive electrode provided on the top surface of the solar cell and a back electrode provided on the bottom surface of the solar cell. Among them, the positive electrode is intermittently provided in its extending direction, and the back electrode is continuously provided in its extending direction; or the positive electrode is continuously provided in its extending direction, and the back electrode is intermittently provided in its extending direction; or the positive electrode is intermittently provided in its extending direction, and the back electrode is intermittently provided in its extending direction, and the positive electrode and the back electrode are aligned in the second direction. Preferably, the main grid lines are a positive electrode provided on the top surface of the solar cell and a back electrode provided on the bottom surface of the solar cell. Both the positive electrode and the back electrode are formed into a serrated structure. When two solar cells are connected in a shingled manner, the positive electrodes and the back electrodes of the two solar cells are in contact with each other in the form of a rack and pinion engagement.
[0084] Reference Figure 3 On the cell array, a main bus bar 41 and a bypass bus bar 42 can also be provided to lead the current outwards.
[0085] It can be understood that since the solar cells are conductively connected through the direct contact of the main grid lines, there is no longer a need to provide conductive glue. And since the solar cells are fixed through the thermal melting of the thermoplastic bottom film, there is also no longer a need for an adhesive for fixing each of the solar cells relative to each other.
[0086] As an alternative or supplement to the above solution, the top film on the top surface of the cell array can also be made of a thermoplastic material, and the top film can fix the cell array relative thereto through thermal melting.
[0087] The solution provided by the present invention can fix the solar cells on the bottom film through the heating and melting characteristics of the thermoplastic bottom film without the need to additionally use an adhesive. Such a solution can combine the typesetting process and the lamination process into one, directly stack and typeset the cells on the bottom encapsulation material, and this way has a lower cost, higher efficiency and is easy to operate.
[0088] The above description of various embodiments of the present invention is provided to a person of ordinary skill in the relevant art for the purpose of description. It is not intended to exclude or limit the present invention to a single disclosed embodiment. As described above, those of ordinary skill in the art taught above will understand various alternatives and modifications of the present invention. Therefore, although some alternative embodiments are specifically described, those of ordinary skill in the art will understand or relatively easily develop other embodiments. The present invention is intended to include all alternatives, modifications and variations of the present invention described herein, as well as other embodiments falling within the spirit and scope of the present invention described above.
[0089] Reference numerals:
[0090] Bottom plate 1
[0091] Thermoplastic bottom film 2
[0092] Cell array 3
[0093] Main bus bar 41
[0094] Bypass bus bar 42.
Claims
1. A method for manufacturing an overlapping shingle component, the overlapping shingle component including a packaging structure and an array of solar cells located within the packaging structure, and the packaging structure including a bottom film located on the bottom side of the array of solar cells and in direct contact with the array of solar cells and a top film located on the top side of the array of solar cells and in direct contact with the array of solar cells. The method includes the steps of laying the bottom film, laminating on the bottom film, and laying the top film on the top side of the array of solar cells. Characterized in that, The solar cells are placed on the bottom film in an overlapping shingle manner such that adjacent solar cells are conductively connected through direct contact of the main grid lines. The bottom film and / or the top film are heated to make at least part of them in a molten state and contact the solar cells in the molten state so that the solidified molten regions can be fixed together with the solar cells. Other components of the packaging structure are applied to the combination of the bottom film, the top film, and the array of solar cells, and the whole is laminated. And, the method further includes the step of heating the bottom film, and this heating step is carried out simultaneously with the step of placing the solar cells on the bottom film so that the region of the bottom film to receive the solar cells always remains in a molten state.
2. The method according to claim 1, Characterized in that, The method includes: presetting the heating parameters of the heating process so that for two sequentially placed solar cells, during the process of placing the latter solar cell on the bottom film, the former solar cell has been fixed on the bottom film, and the former solar cell can be used as a reference for placing the latter solar cell.
3. The method according to claim 1, Characterized in that, The step of heating the bottom film includes: applying heat to the bottom film and / or the top film through a heating mechanism independent of the overlapping shingle component.
4. The method according to claim 3, Characterized in that, The heating parameters of the heating process match the material parameters of the bottom film and / or the top film, and the heating method is at least one of direct heating method, infrared heating method, microwave heating method, and laser heating method.
5. The method according to claim 3, Characterized in that, Heating is achieved through a combined infrared and ultraviolet light illumination method.
6. The method according to claim 1, Characterized in that, The method includes the step of heating the bottom film, and the step of heating the bottom film includes: placing the solar cells with self - contained heat on the bottom film to melt the bottom film.
7. The method according to claim 1, Characterized in that, The method further includes a pre - laminating step before placing the solar cells on the bottom film. The pre - laminating step includes: arranging each solar cell in order by electrostatic or vacuum adsorption method, but the solar cells do not contact each other.
8. The method according to claim 1, Characterized in that, A manipulator is set to complete the lamination on the bottom-side film, and the method further includes: setting parameters of the manipulator based on the size of the solar cell and the position of the main grid lines on the solar cell, so that the main grid lines of adjacent solar cells can be accurately contacted when the manipulator operates.
9. The method according to claim 8, wherein, multiple groups of manipulators are set to work simultaneously.
10. The method according to claim 1, wherein, the method includes the following steps after placing the cell array on the bottom-side film: arranging bus bars on the cell array to lead out the current of the cell array outward.
11. The method according to claim 1, wherein, the encapsulation structure includes a top plate, and the method further includes the following steps after placing the cell array on the bottom-side film and before lamination: placing a top-side film and a top plate on the cell array.
12. The method according to claim 1, wherein, the encapsulation structure includes a bottom plate, and the bottom-side film is laid on the bottom plate.
13. The method according to claim 1, wherein, the method includes the step of manufacturing solar cells, and the step of manufacturing solar cells includes: setting a whole piece of solar cell; laser grooving on the whole piece of solar cell; fragmenting the whole piece of solar cell into multiple solar cells.
14. The method according to claim 1, wherein, during the process of arranging the solar cells into a battery string, the lamination quality is detected by a detection mechanism, and the detection result is fed back to the monitoring platform in real time.
15. The method according to claim 14, wherein, the manufacturing system further includes a control device, and the control device is associated with the detection mechanism so as to be able to control the lamination operation mechanism based on the detection result of the detection mechanism.
16. The method according to claim 1, wherein, before the lamination step, EL electroluminescence or PL photoluminescence is used to detect defects of the workpiece to be laminated. If the detection is unqualified, the workpiece to be laminated is repaired and then the defect detection is carried out again.
17. The method according to any one of claims 1-15, wherein, the method does not include the step of fixing the respective solar cells relative to each other by applying an adhesive.
18. A shingled module manufactured by the method according to any one of claims 1-17, wherein, the shingled module includes: an encapsulation structure, the encapsulation structure including a bottom-side film and a top-side film; a cell array, the cell array being located between the bottom-side film and the top-side film and in contact with the top-side film and the bottom-side film. The cell array includes a plurality of battery strings arranged in a first direction, and each battery string includes a plurality of solar cells arranged in a shingled manner in a second direction perpendicular to the first direction. Main grid lines are provided on the solar cells, and any two adjacent solar cells in each battery string are in direct contact through the main grid lines to achieve conductive connection. Wherein, the bottom side film and / or the top side film are of a thermoplastic integral film structure and can be fixed to the cell array by thermal melting.
19. The shingled module according to claim 18, wherein, the solar cell is a crystalline silicon solar cell or a heterojunction solar cell.
20. The shingled module according to claim 18, wherein, the solar cell is formed into a rectangle, and its length is 2 - 10 times its width.
21. The shingled module according to claim 18, wherein, the bottom side film and the top side film are of an EVA integral film structure, a POE integral film structure or a silicone integral film structure.
22. The shingled module according to claim 18, wherein, the encapsulation structure further includes a top plate and a bottom plate located below the bottom side film, and the top plate and the bottom plate are rigid or flexible weather-resistant integral plate structures with dimensions larger than the cell string array.
23. The shingled module according to claim 18, wherein, the size of the overlapping part between adjacent solar cells of each cell string in the second direction is 0.05 mm - 5 mm.
24. The shingled module according to claim 18, wherein, the main grid lines are a positive electrode provided on the top surface of the solar cell and a back electrode provided on the bottom surface of the solar cell, wherein the positive electrode is intermittently provided in its extending direction, and the back electrode is continuously provided in its extending direction; or the positive electrode is continuously provided in its extending direction, and the back electrode is intermittently provided in its extending direction; or the positive electrode is intermittently provided in its extending direction, and the back electrode is intermittently provided in its extending direction, and the positive electrode and the back electrode are aligned in the second direction.
25. The shingled module according to claim 18, wherein, the main grid lines are a positive electrode provided on the top surface of the solar cell and a back electrode provided on the bottom surface of the solar cell, and both the positive electrode and the back electrode are formed into a serrated structure. When two solar cells are connected in a shingled manner, the positive electrodes and the back electrodes of the two solar cells are in contact with each other in the form of a rack and pinion engagement.
26. The shingled module according to claim 18, wherein, the solar cells in the shingled module have multiple specifications.
27. The shingled module according to any one of claims 18 - 26, wherein, no binder is provided in the shingled module for fixing each solar cell relative to each other.
Citation Information
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