Electronic device including antenna for wireless communication

Abstract

An electronic device including an antenna for wireless communication is provided. The electronic device includes: a front plate disposed on a display; a rear plate disposed at a rear surface of the electronic device; a side member disposed between the front plate and the rear plate and forming an external appearance of the electronic device together with the front plate and the rear plate; and first, second and third antenna modules, each including a plurality of conductive plates and disposed between the front plate and the rear plate so as to be adjacent to the side member, the plurality of conductive plates being configured to transmit / receive signals in a specified first frequency band. At least a portion of the side member can be used as an antenna for signals in a specified second frequency band different from the specified first frequency band.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an antenna for wireless communication. Background Art

[0002] With the development of mobile communication technology, electronic devices equipped with antennas (such as smart phones, wearable devices, etc.) are being widely supplied. The electronic device can receive or transmit signals including data (such as messages, photos, videos, music files, games, etc.) through the antenna. In the electronic device, the signal received by using the antenna is provided to a radio frequency integrated circuit (RFIC).

[0003] In order to receive or send signals more efficiently, the antenna of the electronic device is implemented by using multiple antenna elements. For example, the electronic device may include one or more antenna arrays, in each of which multiple antenna elements are arranged in a regular shape. The antenna array has an effective isotropic radiated power (EIRP) greater than that of one antenna element. In this way, the electronic device including the antenna array can effectively receive or send signals.

[0004] The above information is presented as background information only to assist with understanding the present disclosure. No determination has been made, and no conclusion is drawn, as to whether any of the above may be applicable as prior art with respect to the present disclosure. Summary of the invention

[0005] In order to improve throughput, the fifth generation (5G) mobile communication can use wireless signals in a relatively high frequency band compared to the fourth generation (4G) mobile communication. Since the physical characteristics of the antenna vary according to the frequency of the signal, different antennas can be used according to the frequency band to be used. For example, for a signal with a center frequency less than about 6 GHz and a signal with a center frequency of about 6 GHz or higher, the electronic device can use different antennas. In the case where the signal has a center frequency of about 6 GHz or higher, the electronic device can send / receive wireless signals by using an antenna module in which a portion of the radio frequency (RF) circuit is integrated with the antenna.

[0006] In order to receive high-frequency signals (e.g., signals having a center frequency of about 6 GHz or higher), multiple antenna modules may be provided at the electronic device so that the reception coverage of the electronic device covers all directions of the electronic device (i.e., omnidirectional). Due to the miniaturization and multifunctionality of the electronic device, the electronic device may have a limited installation space. Therefore, the number of antenna modules that can be installed at the electronic device may also be limited.

[0007] Aspects of the present disclosure will address at least the above-mentioned problems and / or disadvantages and provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide an electronic device with optimized coverage.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0009] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: a display arranged at the front surface of the electronic device and a front plate arranged on the display; a rear plate arranged at the rear surface of the electronic device; a side member arranged between the front plate and the rear plate and forming the outer appearance of the electronic device together with the front plate and the rear plate; a first antenna module, including a plurality of first patch antenna elements and a plurality of first dipole antenna elements configured to send / receive signals in a first frequency band, and arranged adjacent to the side member and on the upper part of the electronic device so that the plurality of first patch antenna elements face the rear plate; a second antenna module, including a plurality of second patch antenna elements configured to send / receive signals in the first frequency band, and arranged adjacent to the side member so that the plurality of second patch antenna elements face the left side of the electronic device when the electronic device is viewed from the rear surface; and a third antenna module, including a plurality of third patch antenna elements configured to send / receive signals in the first frequency band, and arranged adjacent to the side member so that the plurality of third patch antenna elements face the right side of the electronic device when the electronic device is viewed from the rear surface.

[0010] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a display disposed at the front surface of the electronic device and a front panel disposed on the display; a rear panel disposed at the rear surface of the electronic device; a side member disposed between the front panel and the rear panel and forming the external appearance of the electronic device together with the front panel and the rear panel; a first antenna module including a plurality of first patch antenna elements and a plurality of first dipole antenna elements configured to transmit / receive signals in a first frequency band, and disposed adjacent to a speaker located in the middle of an upper portion of the electronic device when viewed from the rear surface of the electronic device; a second antenna module including a plurality of second patch antenna elements configured to transmit / receive signals in the first frequency band, and is positioned adjacent to the side member and at the upper left of the electronic device when the electronic device is viewed from the rear surface of the electronic device; and a third antenna module, including a plurality of third patch antenna elements configured to send / receive signals in a first frequency band and is positioned at the lower right of the electronic device and between the battery and the side member when the electronic device is viewed from the rear surface, the plurality of second patch antenna elements can be configured to send / receive wireless signals toward the left side of the electronic device when the electronic device is viewed from the rear surface, and the plurality of third patch antenna elements can be configured to send / receive wireless signals toward the right side of the electronic device when the electronic device is viewed from the rear surface.

[0011] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a block diagram showing an electronic device in a network environment according to an embodiment of the present disclosure;

[0014] Figure 2 is a front perspective view of a mobile electronic device according to an embodiment of the present disclosure;

[0015] Figure 3 According to one embodiment of the present disclosure Figure 2 A rear perspective view of an electronic device;

[0016] Figure 4 According to one embodiment of the present disclosure Figure 2 An exploded perspective view of an electronic device;

[0017] Figure 5 is a block diagram of an electronic device in a network environment including multiple cellular networks according to an embodiment of the present disclosure;

[0018] Figure 6 A block diagram showing an antenna module according to an embodiment of the present disclosure;

[0019] Figure 7 is a front perspective view of an antenna module according to an embodiment of the present disclosure;

[0020] Figure 8 is a perspective view of an antenna module according to an embodiment of the present disclosure;

[0021] Fig.9A is a perspective view of an antenna module according to an embodiment of the present disclosure;

[0022] Fig. 9B is a perspective view of an antenna module according to an embodiment of the present disclosure;

[0023] Fig.10 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure;

[0024] Fig.11 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure;

[0025] Fig.12 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure;

[0026] Fig.13 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure;

[0027] Fig.14 is a cross-sectional view of the interior of an electronic device according to an embodiment of the present disclosure;

[0028] Fig.15 is a cross-sectional view of the interior of an electronic device according to an embodiment of the present disclosure;

[0029] Fig.16 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure; and

[0030] Fig.17 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0031] Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures. DETAILED DESCRIPTION

[0032] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in understanding, but these are considered to be exemplary only. Therefore, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0033] The terms and words used in the following description and claims are not limited to the written meanings, but are only used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided only for the purpose of illustration and not for the purpose of limiting the present disclosure as defined by the attached claims and their equivalents.

[0034] It will be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0035] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure.

[0036] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0037] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0038] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0039] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0040] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0041] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0042] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records, and the receiver may be used for incoming calls. According to one embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0043] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0044] The audio module 170 may convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0045] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0046] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0047] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0049] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0050] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0053] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0054] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0055] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0056] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0057] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0058] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on the implementation, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0059] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory storage medium" is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium. For example, a "non-transitory storage medium" may include a buffer that temporarily stores data.

[0060] According to the implementation, the methods according to various implementations of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product (e.g., a downloadable application) may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0061] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0062] Figure 2 is a front perspective view of a mobile electronic device according to an embodiment of the present disclosure.

[0063] Figure 3 According to one embodiment of the present disclosure Figure 2 A rear perspective view of an electronic device.

[0064] Reference Figure 2 and Figure 3 According to an embodiment of the present invention, an electronic device 200 (eg Figure 1 The electronic device 101 may include a housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may refer to a housing that forms a Figure 2 The structure of a portion of the first surface 210A, the second surface 210B and the side surface 210C. According to one embodiment, the first surface 210A can be formed by the front plate 202 (for example, a glass plate or a polymer plate including various coatings), at least a portion of which is substantially transparent. The second surface 210B can be formed by a substantially opaque rear plate 211. For example, the rear plate 211 can be formed by coated or colored glass, ceramic, polymer, metal (for example, aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the materials. The side surface 210C can be connected to the front plate 202 or the rear plate 211, and can be formed by a side frame structure (or "side member") 218 ​​including a metal and / or a polymer. In one embodiment, the rear plate 211 and the side frame structure 218 can be formed integrally and can include the same material (for example, a metal material, such as aluminum).

[0065] In the illustrated embodiment, the front plate 202 may include two first regions 210D at opposite long sides of the front plate 202, the two first regions 210D being bent from the first surface 210A toward the rear plate 211 so as to extend seamlessly. Figure 3 ), the rear plate 211 may include two second areas 210E at its opposite long sides, and the two second areas 210E are bent from the second surface 210B toward the front plate 202 so as to extend seamlessly. In one embodiment, the front plate 202 (or the rear plate 211) may include only one of the first areas 210D (or the second areas 210E). In another embodiment, a portion of the first area 210D or the second area 210E may not be included. In an embodiment, when viewed from the side surface of the electronic device 200, the side frame structure 218 may have a first thickness (or width) on a side that does not include the first area 210D or the second area 210E, and may have a second thickness less than the first thickness on a side that includes the first area 210D or the second area 210E.

[0066] According to one embodiment, the electronic device 200 may include at least one or more of a display 201, an audio module (203, 207, 214), a sensor module (204, 216, 219), a camera module (205, 212, 213), a key input device 217, a light emitting device 206, and a connector hole (208, 209). In one embodiment, the electronic device 200 may not include at least one of these components (e.g., the key input device 217 or the light emitting device 206), or may further include any other components.

[0067] For example, the display 201 may be exposed through a substantial portion of the front plate 202. In one embodiment, at least a portion of the display 201 may be exposed through the first surface 210A and the front plate 202 forming the first area 210D. In one embodiment, the corner of the display 201 may be formed to be substantially the same shape as the outer portion of the front plate 202 adjacent thereto. In another embodiment (not shown), in order to increase the area where the display 201 is exposed, the difference between the outer portion of the display 201 and the outer portion of the front plate 202 may be formed to be substantially the same.

[0068] In another embodiment (not shown), a depression or opening may be formed at a portion of the screen display area of ​​the display 201, and at least one or more of the audio module 214, the sensor module 204, the camera module 205, and the light emitting device 206 may be provided to be aligned with the depression or opening. In another embodiment (not shown), at least one or more of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting device 206 may be provided on the rear surface of the display 201 corresponding to the screen display area. In another embodiment (not shown), the display 201 may be connected to a touch sensing circuit, a pressure sensor capable of measuring the intensity (or pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus, or may be disposed adjacent thereto. In one embodiment, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device 217 may be disposed in the first area 210D and / or the second area 210E.

[0069] The audio module (203, 207, 214) may include a microphone hole 203 and a speaker hole (207, 214). A microphone for obtaining external sound may be provided in the microphone hole 203. In one embodiment, a plurality of microphones may be provided to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole 207 and a receiver hole 214 for calling. In one embodiment, the speaker hole (207, 214) and the microphone hole 203 may be implemented with one hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker hole (207, 214).

[0070] The sensor modules (204, 216, 219) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or to an external environmental state. The sensor modules (204, 216, 219) may include, for example, a first sensor module 204 (e.g., a proximity sensor) disposed at the first surface 210A of the housing 210 and / or a second sensor module (not shown) (e.g., a fingerprint sensor) and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) disposed at the second surface 210B of the housing 210 and / or a fourth sensor module 216 (e.g., a fingerprint sensor). The fingerprint sensor may be disposed at the second surface 210B of the housing 210 and at the first surface 210A (e.g., a return key button, not shown). The electronic device 200 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illumination sensor.

[0071] The camera module (205, 212, 213) may include a first camera device 205 disposed at a first surface 210A of the electronic device 200 and a second camera device 212 and / or a flash 213 disposed at a second surface 210B. The camera devices 205 and 212 may include one or more lenses, image sensors, and / or image signal processors. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (e.g., an infrared camera and wide-angle and telephoto lenses) and an image sensor may be disposed at one surface of the electronic device 200.

[0072] The key input device 217 may be disposed at the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include all or part of the key input device 217, and the key input device not included may be implemented in the form of a virtual key (soft key) on the display 201. In one embodiment, the key input device may include a sensor module 216 disposed at the second surface 210B of the housing 210.

[0073] The light emitting device 206 may be disposed, for example, at the first surface 210A of the housing 210. The light emitting device 206 may provide, for example, status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device 206 may provide, for example, a light source that operates in coordination with the operation of the camera module 205. The light emitting device 206 may include, for example, a light emitting diode (LED), an IRLED, and a xenon lamp.

[0074] The connector holes (208, 209) may include a first connector hole 208 and / or a second connector hole (or headphone jack) 209, wherein the first connector hole 208 is capable of accommodating a connector (e.g., a USB connector) with an external electronic device for sending / receiving power and / or data, and the second connector hole 209 is capable of accommodating a connector with an external electronic device for sending / receiving audio signals.

[0075] Figure 4 According to one embodiment of the present disclosure Figure 2 An exploded perspective view of an electronic device.

[0076] Reference Figure 4, the electronic device 400 may include a side frame structure 410, a first support member 411 (e.g., a bracket), a front panel 420, a display 430, a printed circuit board 440, a battery 450, a second support member 460 (e.g., a rear housing), an antenna 470, and a rear panel 480. In one embodiment, the electronic device 400 may not include at least one of these components (e.g., the first support member 411 or the second support member 460), or may further include any other components. At least one of the components of the electronic device 400 may be connected to Figure 2 or Figure 3 At least one of the components of the electronic device 200 is the same or similar, and thus additional description will be omitted to avoid repetition.

[0077] The first support member 411 may be disposed in the electronic device 400 to be connected to the side frame structure 410, or may be integrally formed with the side frame structure 410. The first support member 411 may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). The display 430 may be coupled to one surface of the first support member 411, and the printed circuit board 440 may be coupled to the opposite surface of the first support member 411. The processor, memory, and / or interface may be mounted on the printed circuit board 440. For example, the processor may include one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, and a communication processor.

[0078] The memory may include, for example, volatile memory or non-volatile memory.

[0079] The interface may include, for example, an HDMI, a USB interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 400 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0080] The battery 450 is a device for supplying power to at least one component of the electronic device 400, and may include, for example, a primary battery that cannot be recharged, a secondary battery that can be recharged, or a fuel cell. For example, at least a portion of the battery 450 may be disposed on substantially the same plane as the printed circuit board 440. The battery 450 may be integrally disposed within the electronic device 400, or may be disposed to be removable from the electronic device 400.

[0081] The antenna 470 may be disposed between the back plate 480 and the battery 450. The antenna 470 may include, for example, a near field communication (NFC) antenna, an antenna for wireless charging, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 470 may communicate with an external device over a short distance, or may wirelessly send / receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 410 and / or the first support member 411, or may be formed by a combination thereof.

[0082] Figure 5 is a block diagram of an electronic device in a network environment including multiple cellular networks according to an embodiment of the present disclosure.

[0083] Reference Figure 5 , the electronic device 101 may include a first communication processor 512, a second communication processor 514, a first radio frequency integrated circuit (RFIC) 522, a second RFIC 524, a third RFIC 526, a fourth RFIC 528, a first radio frequency front end (RFFE) 532, a second RFFE 534, a first antenna module 542, a second antenna module 544, and an antenna 548. The electronic device 101 may also include a processor 120 and a memory 130. The second network 199 may include a first cellular network 592 and a second cellular network 594. For example, the first cellular network 592 and the second cellular network 594 may be physically distinguished. As another example, the first cellular network 592 and the second cellular network 594 may be logically distinguished. According to another embodiment, the electronic device 101 may also include Figure 1 At least one of the components shown in the figure, and the second network 199 may also include at least another network. According to one embodiment, the first communication processor 512, the second communication processor 514, the first RFIC 522, the second RFIC 524, the fourth RFIC 528, the first RFFE 532 and the second RFFE 534 may form at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 528 may be omitted or may be included as a part of the third RFIC 526.

[0084] The first communication processor 512 can establish a communication channel for a frequency band to be used for wireless communication with the first cellular network 592, and can support traditional network communication through the established communication channel. According to various embodiments, the first cellular network 592 can be a traditional network, which includes a second generation (2G), third generation (3G), 4G or long term evolution (LTE) network. The second communication processor 514 can establish a communication channel corresponding to a specified frequency band (e.g., in a range from about 6 GHz to about 60 GHz) in the frequency band to be used for wireless communication with the second cellular network 594, and can support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 594 can be a 5G network defined in the third generation partnership project (3GPP). In addition, according to one embodiment, the first communication processor 512 or the second communication processor 514 can establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or lower) in the frequency band to be used for wireless communication with the second cellular network 594, and can support 5G network communication through the established communication channel. According to one embodiment,

[0085] The first communication processor 512 and the second communication processor 514 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 512 or the second communication processor 514 may be implemented in a single chip or a single package together with the processor 120, the auxiliary processor 123, or the communication module 190. According to one embodiment, the first communication processor 512 and the second communication processor 514 may be directly or indirectly connected through an interface (not shown), and may provide or receive data or control signals in one direction or in the opposite direction.

[0086] In the case of transmitting a signal, the first RFIC 522 may convert a baseband signal generated by the first communication processor 512 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network 592 (e.g., a legacy network). In the case of receiving a signal, the RF signal may be obtained from the first cellular network 592 (e.g., a legacy network) through an antenna (e.g., the first antenna module 542) and may be pre-processed by an RFFE (e.g., the first RFFE 532). The first RFIC 522 may convert the pre-processed RF signal into a baseband signal so that it is processed by the first communication processor 512.

[0087] In the case of sending a signal, the second RFIC 524 can transmit the signal received by the first communication processor 512 or

[0088] The baseband signal generated by the second communication processor 514 is converted into an RF signal in the Sub6 frequency band (e.g., about 6 GHz or lower) (hereinafter referred to as a "5G Sub6 RF signal"). In the case of receiving a signal, the 5G Sub6 RF signal can be obtained from the second cellular network 594 (e.g., a 5G network) through an antenna (e.g., the second antenna module 544) and can be pre-processed by an RFFE (e.g., the second RFFE 534). The second RFIC 524 can convert the pre-processed 5G Sub6 RF signal into a baseband signal so that it can be processed by the communication processor corresponding to the 5G Sub6 RF signal among the first communication processor 512 or the second communication processor 514.

[0089] The third RFIC 526 may convert the baseband signal generated by the second communication processor 514 into an RF signal in the 5G Above6 frequency band (e.g., about 6 GHz to about 60 GHz) (hereinafter referred to as a "5G Above6 RF signal") for use in the second cellular network 594 (e.g., a 5G network). In the case of receiving a signal, the 5G Above6 RF signal may be obtained from the second cellular network 594 (e.g., a 5G network) through an antenna (e.g., antenna 548) and may be pre-processed by the third RFFE 536. The third RFIC 526 may convert the pre-processed 5G Above6 RF signal into a baseband signal so as to be processed by the second communication processor 514. According to one embodiment, the third RFFE 536 may be implemented as a part of the third RFIC 526.

[0090] According to one embodiment, the electronic device 101 may include a fourth RFIC 528 that is independent of the third RFIC 526 or is at least a part of the third RFIC 526. In this case, the fourth RFIC 528 may convert the baseband signal generated by the second communication processor 514 into an RF signal (hereinafter referred to as an "IF signal") in an intermediate frequency band (e.g., in a range from about 9 GHz to about 11 GHz), and may provide the IF signal to the third RFIC 526. The third RFIC 526 may convert the IF signal into a 5G Above 6 RF signal. In the case of receiving a signal, the 5G Above 6 RF signal may be received from the second cellular network 594 (e.g., a 5G network) through an antenna (e.g., an antenna 548) and may be converted into an IF signal by the third RFIC 526. The fourth RFIC 528 may convert the IF signal into a baseband signal so as to be processed by the second communication processor 514.

[0091] According to an embodiment, the first RFIC 522 and the second RFIC 524 may be implemented with at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 532 and the second RFFE 534 may be implemented with at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 542 and the second antenna module 544 may be omitted or may be combined with any other antenna module to process RF signals in multiple frequency bands.

[0092] According to one embodiment, the third RFIC 526 and the antenna 548 may be arranged at the same substrate to form a third antenna module 546. For example, the wireless communication module 192 or the processor 120 may be arranged at a first substrate (e.g., a main PCB). In this case, the third RFIC 526 may be arranged at a partial area of ​​a second substrate (e.g., a sub-PCB) independent of the first substrate (e.g., on the lower surface of the second substrate), the antenna 548 may be arranged at another partial area of ​​the second substrate (e.g., on the upper surface of the second substrate), and the third antenna module 546 may be implemented with the third RFIC 526 and the antenna 548 so arranged. Since the third RFIC 526 and the antenna 548 are arranged at the same substrate, the length of the transmission line between the third RFIC 526 and the antenna 548 can be reduced. The reduction in the length of the transmission line makes it possible to reduce the loss (or attenuation) of the signal in the high frequency band (e.g., in the range from about 6 GHz to about 60 GHz) for 5G network communication caused by the transmission line. In this way, the electronic device 101 can improve the communication quality or speed with the second cellular network 594 (e.g., a 5G network).

[0093] According to one embodiment, the antenna 548 may be formed by an antenna array including a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC 526 may include, for example, a plurality of phase shifters 538 corresponding to the plurality of antenna elements as part of the third RFFE 536. In the case of transmitting a signal, each of the plurality of phase shifters 538 may shift the phase of the 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (e.g., a base station of a 5G network) through the corresponding antenna element. In the case of receiving a signal, each of the plurality of phase shifters 538 may shift the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception between the electronic device 101 and the outside through beamforming.

[0094] The second cellular network 594 (e.g., a 5G network) can be used independently of the first cellular network 592 (e.g., a traditional network) (e.g., independent networking (SA)), or can be used in combination with the first cellular network 592 (e.g., non-independent networking (NSA)). For example, in the 5G network, only an access network (e.g., a 5G radio access network (RAN) or a next-generation RAN (NGRAN)) may exist, and a core network (e.g., a next-generation core (NGC)) may not be in the 5G network. In this case, the electronic device 101 can access the access network of the 5G network and can access an external network (e.g., the Internet) under the control of a core network (e.g., an evolved packet core (EPC)) of a traditional network. Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio (NR) protocol information) can be stored in the memory 130 so as to be accessed by any other component (e.g., the processor 120, the first communication processor 512, or the second communication processor 514).

[0095] Figure 6 A block diagram of an antenna module according to an embodiment of the present disclosure is shown.

[0096] Reference Figure 6 , the antenna module 600 (eg Figure 5 The third antenna module 546 of the embodiment may include a communication circuit 630 (eg, Figure 5 The third RFIC 526 of the present invention, the PCB 650, at least one antenna element (AE) group (e.g., the first AE group 640) and / or the second AE group 645. For example, the first AE group 640 and the second AE group 645 can be referred to as a "first antenna array" and a "second antenna array", respectively. For example, each antenna element (e.g., a conductive plate) included in the first AE group 640 and / or the second AE group 645 can be referred to as an "antenna" (e.g., Figure 5 For example, in the case where at least some of the antenna elements included in the first AE group 640 and / or the second AE group 645 are simultaneously used for beamforming operations, at least some of the antenna elements used in the beamforming operations among the antenna elements may operate as an array antenna. In this case, the array antenna may form a beam having directivity in at least one specified direction.

[0097] According to one embodiment, the first AE group 640 or the second AE group 645 may be disposed on the first surface of the PCB 650, and the communication circuit 630 (eg Figure 5 The third RFIC 526 of the PCB 650 may be disposed on the second surface of the PCB 650. The PCB 650 may include a circuit for connecting to another PCB (eg, Figure 4 A coaxial cable connector or a board-to-board (B-to-B) connector electrically connected to the printed circuit board 440 or the second supporting member 460).

[0098] According to one embodiment, the first AE group 640 or the second AE group 645 may include a plurality of conductive plates (e.g., antenna elements). Each of the plurality of antenna elements may include a patch antenna, a short-circuited patch antenna, a loop antenna, a notch antenna, a slot antenna, or a dipole antenna. According to one embodiment, the plurality of antenna elements belonging to the first AE group 640 may form an array antenna. For example, the antenna module 600 may perform beamforming by using the antenna elements of the first AE group 640. According to one embodiment, the plurality of antenna elements belonging to the second AE group 645 may form an array antenna. For example, the communication circuit 630 may perform beamforming by using the antenna elements (e.g., patch antenna elements) of the second AE group 645. According to one embodiment, the communication circuit 630 may perform beamforming by using the antenna elements of the first AE group 640 and the second AE group 645. According to one embodiment, each antenna element belonging to the second AE group 645 may operate as a single antenna. For example, each antenna element included in the second AE group 645 may be a dipole antenna.

[0099] According to one embodiment, at least a portion of the PCB 650 may be implemented with a flexible PCB. For example, the PCB 650 may include a plurality of PCBs, and at least some of the plurality of PCBs may be flexible PCBs (FPCBs). According to one embodiment, the first AE group 640 and the second AE group 645 may be disposed on different PCBs. For example, the PCB on which the first AE group 640 is disposed and the PCB on which the second AE group 645 is disposed may be physically and / or electrically connected via the FPCB.

[0100] Each antenna element included in the first AE group 640 and the second AE group 645 may be referred to as a “conductive plate” or a “conductive pattern”.

[0101] Figure 7 is a front perspective view of an antenna module according to an embodiment of the present disclosure.

[0102] Reference Figure 7 According to one embodiment, the antenna module 700 may include a PCB 750 (eg Figure 6 The first AE group 740 (eg, on the front surface of the PCB 650) (eg, in a direction parallel to the XY plane and facing the positive direction of the Z axis) is provided. Figure 6The antenna module 700 may include at least one communication circuit (not shown) disposed on the rear surface of the PCB 750 (e.g., in a direction parallel to the XY plane and facing the negative direction of the Z axis) (e.g., Figure 6 communication circuit 630).

[0103] According to one embodiment, the first AE group 740 may include a plurality of patch antenna elements 741, 742, 743, and 744. Each of the plurality of patch antenna elements 741, 742, 743, and 744 may be connected to a transmission line via at least one feeding point. For example, each of the plurality of patch antenna elements 741, 742, 743, and 744 may be connected to a communication circuit via at least one transmission line formed inside the PCB 750.

[0104] According to one embodiment, each of the multiple patch antenna elements 741, 742, 743 and 744 can send / receive signals by using a beam having a radiation pattern formed around a direction facing the front surface of each of the multiple patch antenna elements 741, 742, 743 and 744 (for example, the positive direction of the Z axis).

[0105] According to one embodiment, the antenna module 700 may perform beamforming by using at least two or more antenna elements among the plurality of patch antenna elements 741, 742, 743, and 744. For example, the antenna module 700 may change a radiation direction and / or shape of a beam formed by the plurality of patch antenna elements 741, 742, 743, and 744 by shifting phases associated with at least two or more antenna elements among the plurality of patch antenna elements 741, 742, 743, and 744.

[0106] exist Figure 7 , the number of patch antenna elements 741, 742, 743, and 744 and their shapes are only examples, and the embodiments of the present disclosure are not limited thereto. For example, the first AE group 740 may include two or more patch antenna elements, and each patch antenna element may be formed in a square shape. For example, the first AE group 740 may be a (4×1) array antenna, but the first AE group 740 may be an array antenna having a different form (e.g., 2×2).

[0107] Figure 8 is a perspective view of an antenna module according to an embodiment of the present disclosure.

[0108] Reference Figure 8 According to one embodiment, the antenna module 800 may include a PCB 850 (eg Figure 6The first AE group 840 (eg, on the front surface of the PCB 650) (eg, in a direction parallel to the XY plane and facing the positive direction of the Z axis) is provided. Figure 6 The antenna module 800 may include at least one communication circuit (not shown) disposed on the rear surface of the PCB 750 (e.g., in a direction parallel to the XY plane and facing the negative direction of the Z axis) (e.g., Figure 6 According to one embodiment, the first AE group 840 may include a plurality of patch antenna elements 841, 842, 843, and 844. Further descriptions of the first AE group 840 may refer to Figure 7 The description associated with the first AE group 740 is provided above, and thus for the sake of convenience of description, additional description will be omitted to avoid repetition.

[0109] According to one embodiment, the second AE group 845 may include a plurality of dipole antenna elements 801, 811, 821, and 831 and a plurality of short-circuit patch elements 802, 803, 812, 813, 822, 823, 832, and 833. For example, the plurality of dipole antenna elements 801, 811, 821, and 831 may transmit / receive signals by using a beam corresponding to a radiation pattern generated toward one side surface of the antenna module 800 (e.g., a positive direction around the Y axis). In the case of the dipole antenna elements 801, 811, 821, and 831, there may be a signal null point in the longitudinal direction of the dipole antenna elements 801, 811, 821, and 831 (e.g., a long axis direction of the radiator of the dipole antenna). For example, the short-circuit patch elements 802, 803, 812, 813, 822, 823, 832, and 833 may include feed conductive plates 802, 812, 822, and 832 and ground (GND) conductive plates 803, 813, 823, and 833 respectively corresponding to the feed conductive plates 802, 812, 822, and 832. The short-circuit patch elements 802, 803, 812, 813, 822, 823, 832, and 833 may be used to supplement the beam coverage of the dipole antenna elements 801, 811, 821, and 831.

[0110] According to an embodiment, the antenna module 800 may perform beamforming by changing phases of a plurality of antenna elements belonging to the second AE group 845 .

[0111] According to one embodiment, each antenna element of the second AE group 845 can be connected to a transmission line through at least one feeding point. For example, each antenna element of the second AE group 845 can be connected to a communication circuit through at least one transmission line formed inside the PCB 850.

[0112] exist Figure 8 In the embodiment, the number and shape of the antenna elements of the second AE group 845 are only examples, and the embodiments of the present disclosure are not limited thereto. For example, the second AE group 845 may include two or more dipole antenna elements and may not include a short-circuit patch antenna element.

[0113] According to one embodiment, the first antenna module includes a printed circuit board, which includes a first surface having a long axis and a short axis and a second surface facing away from the first surface, wherein the plurality of first patch antenna elements are arranged on the first surface along the direction of the long axis, wherein the plurality of first dipole antenna elements are arranged in a filled cut area of ​​the printed circuit board along the direction of the long axis, and wherein the filled cut area is formed of a non-conductive material.

[0114] Fig.9A is a perspective view of an antenna module according to an embodiment of the present disclosure.

[0115] Reference Fig.9A According to one embodiment, the antenna module 900 may include a first AE group 940 (eg, disposed on a front surface of the first PCB 951 (eg, in a direction parallel to the XY plane and facing the positive direction of the Z axis). Figure 6 The first AE group 640) and the second AE group 945 (eg, Figure 6 For example, the first PCB 951 and the third PCB 953 may be electrically and / or physically connected via a connecting member 952. For example, the connecting member 952 may be a flexible material (eg, FPCB).

[0116] According to one embodiment, the antenna module 900 may include at least one communication circuit (not shown) disposed on the rear surface of the first PCB 951 (eg, in a direction parallel to the XY plane and facing the negative direction of the Z axis) (eg, Figure 6 According to one embodiment, the first AE group 940 may include a plurality of patch antenna elements 941, 942, 943, and 944. Further descriptions of the first AE group 940 may refer to Figure 7 The description related to the first AE group 740 is provided, and therefore, for the convenience of description, additional description will be omitted to avoid repetition.

[0117] According to one embodiment, the second AE group 945 may include a plurality of dipole antenna elements 911, 921, and 931 and a plurality of short-circuit patch elements 912, 913, 922, 923, 932, and 933. The description related to the dipole antenna elements 911, 921, and 931 and the plurality of short-circuit patch elements 912, 913, 922, 923, 932, and 933 may refer to the description related to Figure 8 A description related to the second AE group 845 is provided.

[0118] According to one embodiment, when the antenna module 900 is installed in an electronic device (eg Figure 2 When the electronic device 200 is mounted on the electronic device 200, the electronic device can cover multiple directions by using the first AE group 940 and the second AE group 945. For example, the electronic device can cover the direction facing the rear surface of the electronic device (e.g., perpendicular to the Figure 3 direction of the rear panel 211), and can cover the front surface of the electronic device (e.g. Figure 2 The first surface 210A) and the side surface (eg Figure 2 direction between the side surfaces 210C).

[0119] Fig. 9B is a perspective view of an antenna module according to an embodiment of the present disclosure.

[0120] Reference Fig. 9B According to one embodiment, the antenna module 900 may include a first AE group 940 (eg, disposed on a front surface of the first PCB 951 (eg, in a direction parallel to the XY plane and facing the positive direction of the Z axis). Figure 6 The first AE group 640) and the second AE group 945 (eg, Figure 6 For example, the first PCB 951 and the third PCB 953 may be electrically and / or physically connected via a connecting member 952. For example, the connecting member 952 may be a flexible material (eg, FPCB).

[0121] According to one embodiment, the antenna module 900 may include at least one communication circuit (not shown) disposed on the rear surface of the first PCB 951 (eg, in a direction parallel to the XY plane and facing the negative direction of the Z axis) (eg, Figure 6 According to one embodiment, the first AE group 940 may include a plurality of patch antenna elements 941, 942, 943, and 944. Further descriptions of the first AE group 940 may refer to Figure 7 The description related to the first AE group 740 is provided, and therefore for the convenience of description, additional description will be omitted to avoid repetition.

[0122] According to one embodiment, the second AE group 945 may include a plurality of patch antenna elements 914, 924, and 934. The patch antenna elements 914, 924, and 934 may transmit / receive signals by using a beam corresponding to a radiation pattern generated toward one side surface of the antenna module 900 (e.g., around a direction perpendicular to the front surface of the third PCB 953).

[0123] According to one embodiment, when the antenna module 900 is installed in an electronic device (eg Figure 2 When the electronic device 200 is mounted on the electronic device 200, the electronic device can cover multiple directions by using the first AE group 940 and the second AE group 945. For example, the electronic device can cover the direction facing the rear surface of the electronic device (e.g., perpendicular to the Figure 3 direction of the rear panel 211), and can be covered by using the second AE group 945 on the front surface of the electronic device (e.g. Figure 2 The first surface 210A) and the side surface (eg Figure 2 For example, in order to ensure the coverage of the electronic device, the third PCB 953 of the antenna module 900 may be installed in the electronic device in a state of being tilted toward the display so as to face the direction between the front surface and the side surface of the electronic device. As another example, in order to ensure the coverage of the electronic device, the third PCB 953 of the antenna module 900 may be installed in the electronic device so as to face the side surface of the electronic device. As another example, the antenna module 900 may be installed in the electronic device in a state of being tilted so as to face the direction between the rear panel and the side surface of the electronic device.

[0124] Examples are Fig.9A and Fig. 9B 9 is shown as separate PCBs for the connection member 952 and the third PCB 953, but the connection member 952 and the third PCB 953 may be implemented with one FPCB. In this case, the dipole antenna elements 911, 921, and 931 may be formed by conductive patterns on the FPCB.

[0125] First embodiment

[0126] Fig.10 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure.

[0127] Reference Fig.10 According to one embodiment, the electronic device 1000 (eg Figure 1 The electronic device 101 may include a first antenna module 1010, a second antenna module 1020, and a third antenna module 1030. For example, Fig.101 shows the internal appearance of the electronic device 1000 when the electronic device 1000 is viewed from the rear surface of the electronic device 1000. For example, Fig.10 It can be shown that after removing the rear panel (eg Figure 4 The rear panel 480) and the antenna (eg Figure 4 The interior of the electronic device 1000 is viewed from the rear surface of the electronic device 1000 in one direction (eg, the negative direction of the Z axis) after the antenna 470 of the electronic device 1000 is removed. As another example, Fig.10 It can be shown that the rear panel, antenna and second support member (eg, Figure 4 The interior of the electronic device 1000 as seen from the rear surface of the electronic device 1000 in the one direction after the second supporting member 460 is formed.

[0128] According to one embodiment, at least a portion of the side frame structure 410 (e.g., the front metal) can be used as a radiator for transmitting / receiving wireless signals (e.g., wireless signals of 6 GHz or lower) of conventional cellular communications (e.g., 3G and 4G mobile communications). For example, the side frame structure 410 can correspond to at least a portion of an antenna including a plurality of conventional feeding points and a plurality of conventional GNDs. According to one embodiment, the side frame structure 410 can be connected to a first support member (e.g., a front metal) disposed inside the side frame structure 410. Figure 4 The side frame structure 410 is physically connected to a first supporting member 411 (eg, a bracket), and at least a portion of the side frame structure 410 may be insulated from the first supporting member.

[0129] According to one embodiment, the first antenna module 1010 may be placed at Fig.10 For example, when viewed from a side surface of the electronic device 1000 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the first antenna module 1010 may be disposed between at least a portion of the first antenna module 1010 and the speaker 1060 (e.g., Figure 1The first antenna module 1010 may be disposed at a position where the first antenna module 1010 does not overlap with the speaker 1060 and / or the sensor component / SIM slot 1050 when viewed from the rear surface of the electronic device 1000. For example, the sensor component / SIM slot 1050 may include various sensors (e.g., a proximity sensor and / or a front image sensor (e.g., a front camera)). For example, the sensor component / SIM slot 1050 may accommodate a user identification module and / or an external electronic medium. For example, the first antenna module 1010 may be disposed above the camera and fingerprint recognition module 1040 so as to be adjacent to the side frame structure 410. For example, the first antenna module 1010 may be disposed between the printed circuit board 440 and the back plate of the electronic device 1000. For example, the first antenna module 1010 may be positioned so as not to overlap with electronic components of the electronic device 1000 (eg, the camera and fingerprint recognition module 1040 , the sensor component / SIM slot 1050 , and the speaker 1060 ) on a plane (eg, an XY plane).

[0130] According to various embodiments, the first antenna module 1010 may correspond to Figure 8 Antenna module 800.

[0131] According to one embodiment, the first antenna module 1010 may include a plurality of patch antenna elements (eg, Figure 8 The first AE group 840 of the first antenna module 1010 may transmit / receive wireless signals by using a beam having a radiation pattern generated by using the plurality of patch antenna elements around a direction from the rear surface of the electronic device 1000 to the outside of the electronic device 1000 (e.g., the positive direction of the Z axis). For example, the electronic device 1000 may achieve coverage toward the rear surface of the electronic device 1000 by using the plurality of patch antenna elements of the first antenna module 1010. For example, the first antenna module 1010 may generate a beam that passes through a non-conductive rear plate (e.g., Figure 4 The rear plate 480 of the electronic device 1000 radiates from the inside of the electronic device 1000 to the outside of the electronic device 1000.

[0132] According to one embodiment, the first antenna module 1010 may include a plurality of dipole antenna elements and a plurality of short-circuit patch antenna elements (eg Figure 8The second AE group 845 of the electronic device 1000). The first antenna module 1010 can generate a beam having a radiation pattern surrounding a direction from the inside of the electronic device 1000 to the outside above the upper surface of the electronic device 1000 (e.g., the positive direction of the Y axis) and a display direction (e.g., the direction between the positive Y axis direction and the negative Z axis direction on the YZ plane) by using the multiple dipole antenna elements and the multiple short-circuit patch antenna elements. For example, the electronic device 1000 can achieve coverage in front of the upper surface of the electronic device 1000 by using the multiple dipole antenna elements and the multiple short-circuit patch antenna elements. For example, the first antenna module 1010 can generate a beam that radiates from the inside of the electronic device 1000 to the outside of the electronic device 1000 through the non-conductive area of ​​the back panel and the side frame structure 410 of the electronic device 1000.

[0133] According to one embodiment, the second antenna module 1020 may be placed in Fig.10 The second antenna module 1020 may be disposed at the upper left of the rear surface of the electronic device 1000 in FIG. 4 . For example, when viewed from the side surface of the electronic device 1000 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the second antenna module 1020 may be disposed at a position where at least a portion of the second antenna module 1020 overlaps with the camera and fingerprint recognition module 1040. For example, when viewed from the rear surface of the electronic device 1000, the second antenna module 1020 may be disposed on the left side of the camera and fingerprint recognition module 1040 so as to be adjacent to the side frame structure 410. For example, the second antenna module 1020 may be disposed at the electronic device 1000 such that the PCB of the second antenna module 1020 is perpendicular to the front display or rear panel of the electronic device 1000.

[0134] According to various embodiments, the second antenna module 1020 may correspond to Figure 7 According to one embodiment, when the electronic device 1000 is viewed from the rear surface of the electronic device 1000, the second antenna module 1020 may include a plurality of patch antenna elements (e.g., Figure 7The second antenna module 1020 may transmit / receive wireless signals by using a beam having a radiation pattern generated by using the plurality of patch antenna elements around a direction from the inside of the electronic device 1000 to the outside of one side of the electronic device 1000 (e.g., the negative direction of the X-axis). For example, the electronic device 1000 may achieve coverage toward the left side surface of the electronic device 1000 by using the plurality of patch antenna elements of the second antenna module 1020. For example, the second antenna module 1020 may generate a beam that radiates from the inside of the electronic device 1000 to the outside of the electronic device 1000 through the non-conductive area of ​​the side frame structure 410 and the non-conductive back plate of the electronic device 1000.

[0135] According to one embodiment, the third antenna module 1030 may be placed at Fig.10 The third antenna module 1030 may be disposed at the lower right side of the rear surface of the electronic device 1000 in the electronic device 1000. For example, when viewed from the side surface of the electronic device 1000 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the third antenna module 1030 may be disposed at a position where at least a portion of the third antenna module 1030 overlaps with the battery 450. For example, when viewed from the rear surface of the electronic device 1000, the third antenna module 1030 may be disposed between the battery 450 and the side frame structure 410. For example, the third antenna module 1030 may be disposed in the electronic device 1000 so that the PCB of the third antenna module 1030 is perpendicular to the front display or the rear panel of the electronic device 1000.

[0136] According to various embodiments, the third antenna module 1030 may correspond to Figure 7 According to one embodiment, when the electronic device 1000 is viewed from the rear surface of the electronic device 1000, the third antenna module 1030 may include a plurality of patch antenna elements (e.g., Figure 7 The third antenna module 1030 may send / receive wireless signals by using a beam having a radiation pattern generated by using the plurality of patch antenna elements around a direction from the inside of the electronic device 1000 to the outside of the electronic device 1000 (e.g., the positive direction of the X-axis). For example, the electronic device 1000 may achieve coverage toward the right side surface of the electronic device 1000 by using the plurality of patch antenna elements of the third antenna module 1030. For example, the third antenna module 1030 may generate a beam that radiates from the inside of the electronic device 1000 to the outside of the electronic device 1000 through the non-conductive area of ​​the side frame structure 410 and / or the non-conductive back plate of the electronic device 1000.

[0137] According to one embodiment, the first antenna module 1010 and the second antenna module 1020 may be grounded by being electrically connected to a grounding area of ​​a printed circuit board 440, which is disposed adjacent to the first antenna module 1010 and the second antenna module 1020. According to one embodiment, the third antenna module 1030 may be grounded by being electrically connected to a side frame structure 410 adjacent to the third antenna module 1030. For example, since the third antenna module 1030 is disposed on one side of the battery 450, the third antenna module 1030 disposed in this way may be spaced apart from the printed circuit board 440. In this case, the side frame structure 410 may provide grounding to the third antenna module 1030 by forming a conventional grounding point at corresponding portions of the side frame structure 410 above and below the third antenna module 1030. For example, a conventional GND may be disposed adjacent to the third antenna module 1030, compared to a conventional feeding point.

[0138] exist Fig.10 In the embodiment, since the second antenna module 1020 and the third antenna module 1030 are installed perpendicular to the display surface of the electronic device 1000, in order to reduce the thickness of the electronic device 1000, the second antenna module 1020 and / or the third antenna module 1030 may not include a dipole antenna element. Since the first antenna module 1010 is installed parallel to the display surface, the first antenna module 1010 can increase the coverage of the electronic device 1000 by using a dipole antenna element. The signal null points in the negative X-axis direction and the positive X-axis direction generated by the dipole antenna element of the first antenna module 1010 can be covered by the second antenna module 1020 and the third antenna module 1030.

[0139] Fig.11 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0140] Reference Fig.11 , the cross-sectional view may correspond to when viewed along the direction from +X to -X Fig.10 The cross-sectional view observed when the cross section of the electronic device 1000 is cut along the axis AA′. According to various embodiments, the first antenna module 1010 may be disposed substantially parallel to the front panel 420 and the display 430 , and may be disposed to face the rear panel 480 .

[0141] According to one embodiment, the C-clip 1140 may electrically connect the printed circuit board 440 and the conductive portion (e.g., metal portion) of the side frame structure 410. For example, the side frame structure 410 may be electrically connected to the grounding area of ​​the printed circuit board 440 through the C-clip 1140. As another example, power may be supplied to the side frame structure 410 through the C-clip 1140. At least a portion of the side frame structure 410 may be electrically connected to the printed circuit board 440 to function as a conventional antenna.

[0142] According to one embodiment, the C-clip 1140 can connect the side frame structure 410 to the legacy ground. Fig.10 A conventional grounding on the axis A-A' can be formed by a C-clip 1140. Fig.11 In the example of , according to one embodiment, C-clip 1140 may be disposed between first antenna module 1010 and side frame structure 410. For example, the contact between C-clip 1140 and side frame structure 410 may be disposed below a beam direction (e.g., a first direction) of first antenna module 1010 or at a point lower than first antenna module 1010. By setting the position of the contact between C-clip 1140 and side frame structure 410 to be relatively lower than first antenna module 1010 (or disposing it below first antenna module 1010), the influence of conventional grounding of C-clip 1140 on first antenna module 1010 may be minimized.

[0143] For example, the C-clip 1140 may be referred to as a "connection member" that electrically connects the printed circuit board 440 and the side frame structure 410. The C-clip 1140 is an example of a connection member, and the embodiments of the present disclosure are not limited thereto. For example, the C-clip 1140 may be replaced with a connection member for electrically connecting the side frame structure 410 and the printed circuit board 440, such as a screw contact, a double-sided tape (e.g., a conductive tape), an RF cable, an FPCB, etc.

[0144] According to one embodiment, a component of the electronic device 1000 disposed on the line of sight of the first antenna module 1010 may be formed of a non-conductive material. The first antenna module 1010 may be disposed to radiate a signal through the non-conductive region 1150 of the rear plate 480 and the side frame structure 410. For example, the rear plate 480 may be formed of a non-conductive material (e.g., a polymer). For example, the non-conductive region 1150 may be disposed at a portion of the side frame structure 410, and the dipole antenna element and the short-circuit antenna element of the first antenna module 1010 may form a beam from the inside of the electronic device 1000 through the non-conductive region 1150 and the rear plate 480 to the outside of the electronic device 1000. For example, the first direction may indicate a line of sight that can be generated by the dipole antenna element and the short-circuit antenna element of the first antenna module 1010.

[0145] According to one embodiment, the first antenna module 1010 may be disposed between the printed circuit board 440 and the back plate 480, and an interposer 1120 may be disposed between the first antenna module 1010 and the printed circuit board 440. For example, the interposer 1120 may be any structure (e.g., a PCB, a shielding cover, or a non-conductive structure) that allows the first antenna module 1010 to be disposed adjacent to the back plate 480. Fig.11 In the embodiment, the insertion mechanism 1120 can allow the first antenna module 1010 to be located higher (e.g., relative to the Z-axis) than a conductive region (e.g., a metal region) of the side frame structure 410, so that the first antenna module 1010 can form a beam toward the display 430. For example, when viewed from one side of the electronic device 1000 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), a gap can be formed between the first antenna module 1010 and the conductive region of the side frame structure 410 by using the insertion mechanism 1120.

[0146] According to one embodiment, the non-conductive region 1150 of the side frame structure 410 can be manufactured by a process including at least an injection molding process. For example, the non-conductive region 1150 can be placed at the side frame structure 410 by a double injection molding process.

[0147] According to one embodiment, the non-conductive region 1150 of the side frame structure 410 may not be visible from the outside. For example, since the non-conductive region 1150 is covered by the back plate 480, the non-conductive region 1150 may not be exposed to the outside. For example, only at least a portion of the conductive region (e.g., metal portion) of the side frame structure 410 may be exposed to the outside.

[0148] Fig.12 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0149] Reference Fig.12 , the cross-sectional view may correspond to the cross-sectional view when the electronic device 1000 is viewed along the direction from +Y to -Y. Fig.10 According to various embodiments, the second antenna module 1020 may be disposed substantially perpendicular to the front panel 420 and the display 430 , and may be disposed to face a side surface of the electronic device 1000 .

[0150] According to one embodiment, the second antenna module 1020 may be physically fixed by a first support member 411 (eg, a bracket) The first support member 411 may be physically connected to the side frame structure 410 .

[0151] According to one embodiment, a component of the electronic device 1000 disposed in the line of sight of the second antenna module 1020 may be formed of a non-conductive material. The second antenna module 1020 may be disposed to radiate a signal through the non-conductive back plate 480 and the non-conductive region 1230 of the side frame structure 410. For example, the back plate 480 may be formed of a non-conductive material (e.g., a polymer). For example, the non-conductive region 1230 may be disposed at a portion of the side frame structure 410, and the patch antenna element of the second antenna module 1020 may form a beam from the inside of the electronic device 1000 through the non-conductive region 1230 and the back plate 480 to the outside of the electronic device 1000.

[0152] According to one embodiment, the non-conductive region 1230 of the side frame structure 410 can be manufactured by a process including at least an injection molding process. For example, the non-conductive region 1230 can be placed at the side frame structure 410 by a double injection molding process.

[0153] According to one embodiment, the non-conductive region 1230 of the side frame structure 410 may not be visible from the outside. For example, since the non-conductive region 1230 is covered by the back plate 480, the non-conductive region 1230 may not be exposed to the outside. For example, only the conductive region (e.g., the metal portion) of the side frame structure 410 may be exposed to the outside.

[0154] Reference Fig.12 The described mounting structure of the second antenna module 1020 may be similarly applied to the third antenna module 1030 .

[0155] According to one embodiment, the C-clip 1245 can electrically connect the printed circuit board 440 and the conductive portion (e.g., metal portion) of the side frame structure 410. For example, the side frame structure 410 can be electrically connected to the ground area of ​​the printed circuit board 440 through the C-clip 1245. As another example, power can be supplied to the side frame structure 410 through the C-clip 1245. At least a portion of the side frame structure 410 can be electrically connected to the printed circuit board 440 to function as a conventional antenna.

[0156] According to one embodiment, the C-clip 1245 can connect the side frame structure 410 to a conventional ground. For example, Fig.10 A conventional grounding on the axis BB' can be formed by a C-clip 1245. Fig.12In the example of FIG. 1 , according to one embodiment, the C-clip 1245 may be positioned farther from the side frame structure 410 than the second antenna module 1020 (e.g., closer to the inside of the electronic device 200 than the second antenna module 1020). For example, the contact between the C-clip 1245 and the side frame structure 410 may be positioned behind the second antenna module 1020 (e.g., in the rearward direction) so that the contact does not exist in the beam direction of the second antenna module 1020 (e.g., in the negative direction of the Y axis). By setting the position of the contact between the C-clip 1245 and the side frame structure 410 behind the second antenna module 1020, the influence of the conventional grounding of the C-clip 1245 on the second antenna module 1020 may be minimized.

[0157] For example, the C-clip 1245 can be referred to as a "connection member" that electrically connects the printed circuit board 440 and the side frame structure 410. The C-clip 1245 is an example of a connection member, and the embodiments of the present disclosure are not limited thereto. For example, the C-clip 1245 can be replaced by a connection member for electrically connecting the side frame structure 410 and the printed circuit board 440, such as a screw contact, a double-sided tape (e.g., a conductive tape), an RF cable, an FPCB, etc.

[0158] Second embodiment

[0159] Fig.13 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure.

[0160] Reference Fig.13 According to one embodiment, the electronic device 1300 (eg Figure 1 The electronic device 101 may include a first antenna module 1310, a second antenna module 1320, and a third antenna module 1330. For example, Fig.13 1 shows the internal appearance of the electronic device 1300 when the electronic device 1300 is viewed from the rear surface of the electronic device 1300. For example, Fig.13 It can be shown that after removing the back panel (eg Figure 4 The rear panel 480) and the antenna (eg Figure 4 The interior of the electronic device 1300 is viewed from the rear surface of the electronic device 1300 in one direction (eg, the negative direction of the Z axis) after the antenna 470 of the electronic device 1300 is removed. As another example, Fig.13 It can be shown that the rear panel, antenna and second support member (eg, Figure 4 The interior of the electronic device 1300 as seen from the rear surface of the electronic device 1300 in the one direction after the second supporting member 460 is formed.

[0161] According to one embodiment, at least a portion of the side frame structure 410 (e.g., the front metal) can be used as a radiator for transmitting / receiving wireless signals (e.g., wireless signals of 6 GHz or lower) of conventional cellular communications (e.g., 3G and 4G mobile communications). For example, the side frame structure 410 can correspond to at least a portion of an antenna including a plurality of conventional feed points and a plurality of conventional GNDs. According to one embodiment, the side frame structure 410 can be connected to a first support member (e.g., a front metal) disposed inside the side frame structure 410. Figure 4 The side frame structure 410 may be physically connected to a first supporting member 411 (eg, a bracket), and at least a portion of the side frame structure 410 may be insulated from the first supporting member.

[0162] According to one embodiment, the first antenna module 1310 may be placed at Fig.13 For example, the first antenna module 1310 may be disposed above the speaker 1360. For example, when viewed from the side surface of the electronic device 1300 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the first antenna module 1310 may be disposed not to be in contact with the speaker 1360 (e.g., Figure 1 For example, the first antenna module 1310 may be disposed between the printed circuit board 440 and the rear plate of the electronic device 1300.

[0163] According to various embodiments, the first antenna module 1310 may correspond to Figure 8 The radiation pattern and mounting structure of the first antenna module 1310 can refer to the Fig.10 and Fig.11 A description of the first antenna module 1010 is given, and thus for the convenience of description, additional description will be omitted to avoid repetition.

[0164] According to various embodiments, the second antenna module 1320 may be placed in Fig.13 The second antenna module 1320 may be disposed at the upper left of the rear surface of the electronic device 1300 in the electronic device 1300. For example, when viewed from the side surface of the electronic device 1300 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the second antenna module 1320 may be disposed at a position where at least a portion of the second antenna module 1320 overlaps with the camera module 1340. For example, when viewed from the rear surface of the electronic device 1300, the second antenna module 1320 may be disposed on the left side of the camera module 1340 so as to be adjacent to the side frame structure 410. For example, the second antenna module 1320 may be disposed in the electronic device 1300 so that the PCB of the second antenna module 1320 is parallel to the front display or the rear panel of the electronic device 1300.

[0165] According to various embodiments, the second antenna module 1320 may correspond to Figure 8According to one embodiment, when the electronic device 1300 is viewed from the rear surface of the electronic device 1300, the second antenna module 1320 may include a plurality of patch antenna elements (e.g., Figure 8 The second antenna module 1320 may transmit / receive a wireless signal by using a beam having a radiation pattern generated by using the plurality of patch antenna elements around a direction from the inside of the electronic device 1300 to the outside of one side of the electronic device 1300 (e.g., a positive direction of the Z axis).

[0166] According to one embodiment, the second antenna module 1320 may include a plurality of dipole antenna elements and a plurality of short-circuit patch antenna elements (eg Figure 8 The second AE group 845). The second antenna module 1320 can generate a beam having a radiation pattern around a direction from the inside of the electronic device 1300 to the left side of the electronic device 1300 (e.g., the negative direction of the X-axis) and a display direction (e.g., a direction between the negative X-axis direction and the negative Z-axis direction on the XZ plane) by using the multiple dipole antenna elements and the multiple short-circuit patch antenna elements. For example, the second antenna module 1320 can generate a beam that radiates from the inside of the electronic device 1300 to the outside of the electronic device 1300 through the non-conductive area of ​​the back plate and the side frame structure 410 of the electronic device 1300.

[0167] According to various embodiments, the third antenna module 1330 may be disposed at Fig.13 The third antenna module 1330 may be disposed at the lower right side of the rear surface of the electronic device 1300 in the electronic device 1300. For example, when viewed from the side surface of the electronic device 1300 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the third antenna module 1330 may be disposed at a position where at least a portion of the third antenna module 1330 overlaps with the battery 450. For example, when viewed from the rear surface of the electronic device 1300, the third antenna module 1330 may be disposed between the battery 450 and the side frame structure 410. For example, the third antenna module 1330 may be disposed within the electronic device 1300 such that the PCB of the third antenna module 1330 is substantially parallel to the front display or the rear panel of the electronic device 1300.

[0168] According to various embodiments, the third antenna module 1330 may correspond to Figure 8 According to one embodiment, when the electronic device 1300 is viewed from the rear surface of the electronic device 1300, the third antenna module 1330 may include a plurality of patch antenna elements (e.g., Figure 8The third antenna module 1330 may transmit / receive a wireless signal by using a beam having a radiation pattern generated by using the plurality of patch antenna elements around a direction from the inside of the electronic device 1300 to the outside of one side of the electronic device 1300 (e.g., a positive direction of the Z axis).

[0169] According to one embodiment, the third antenna module 1330 may include a plurality of dipole antenna elements and a plurality of short-circuit patch antenna elements (eg Figure 8 The third antenna module 1330 may generate a beam having a radiation pattern around a direction from the inside of the electronic device 1300 to the right side of the electronic device 1300 (e.g., the positive direction of the X-axis) and a display direction (e.g., a direction between the positive X-axis direction and the negative Z-axis direction on the XZ plane) by using the plurality of dipole antenna elements and the plurality of short-circuit patch antenna elements. For example, the third antenna module 1330 may generate a beam that radiates from the inside of the electronic device 1300 to the outside of the electronic device 1300 through the non-conductive area of ​​the back plate and the side frame structure 410 of the electronic device 1300.

[0170] exist Fig.13 In an embodiment, the dipole antenna elements of the second antenna module 1320 and the third antenna module 1330 may be arranged to face a different direction from the dipole antenna element of the first antenna module 1310. For example, the upper surface and the side surface of the electronic device 1300 may be covered by the dipole antenna elements, and the rear surface of the electronic device 1300 may be covered by the patch antenna element.

[0171] Fig.14 is a cross-sectional view of the interior of an electronic device according to an embodiment of the present disclosure.

[0172] Reference Fig.14 , the cross-sectional view may correspond to when viewed along the direction from -Y to +Y Fig.13 According to various embodiments, the third antenna module 1330 may be disposed adjacent to a rear panel (not shown) so as to face the rear panel, and may be disposed substantially parallel to a display (not shown).

[0173] According to one embodiment, the third antenna module 1330 may include a shielding cover 1420. The third antenna module 1330 may be disposed on an insertion mechanism 1430 (e.g., a heat radiation structure), which is disposed on a PCB 1440. The insertion mechanism 1430 may be used to form a step (e.g., a height difference) D1-D2 between the third antenna module 1330 and the conductive region 1412 of the side frame structure 410.

[0174] According to one embodiment, a component of the electronic device 1300 disposed on the line of sight of the third antenna module 1330 may be formed of a non-conductive material. The third antenna module 1330 may be disposed to radiate a signal through the non-conductive region 1411 of the rear panel and side frame structure 410. For example, the first direction may indicate a line of sight that can be generated by a dipole antenna element and a short-circuit antenna element of the third antenna module 1330.

[0175] According to one embodiment, the non-conductive region 1411 of the side frame structure 410 can be manufactured by a process including at least an injection molding process. For example, the non-conductive region 1411 can be placed on the conductive region 1412 of the side frame structure 410 by a double injection molding process.

[0176] According to one embodiment, the non-conductive region 1411 of the side frame structure 410 may not be visible from the outside. For example, since the non-conductive region 1411 is covered by the back plate, the non-conductive region 1411 may not be exposed to the outside.

[0177] Reference Fig.14 The described configuration of the third antenna module 1330 may be similarly applied to the second antenna module 1320 .

[0178] Third embodiment

[0179] Unless otherwise described, the description given above with reference to the second embodiment can be applied to the third embodiment.

[0180] Return to Fig.13 , the first antenna module 1310 may correspond to Fig.9A or Fig. 9B According to one embodiment, the first PCB 951 may include a plurality of patch antenna elements (eg, Fig.9A or Fig. 9B For example, the first PCB 951 may be configured such that the plurality of patch antenna elements form a beam toward a rear surface of the electronic device 1300.

[0181] According to one embodiment, the first antenna module 1310 may include a plurality of dipole antenna elements and a plurality of short-circuit patch antenna elements (eg Fig.9A or Fig. 9B For example, a PCB (eg, a PCB having a dipole antenna element of the first antenna module 1310) is provided there. Fig.9A or Fig. 9BThe third PCB 953 of the electronic device 1300 may be arranged substantially perpendicular to the central portion of the display of the electronic device 1300. For example, the plurality of dipole antenna elements may be arranged to generate a beam passing through a non-display area of ​​the front surface of the electronic device 1300. For example, the plurality of dipole antenna elements may generate a beam in a negative direction around the Z axis.

[0182] In this embodiment, since the first antenna module 1310 has a curved shape, the movement of the speaker 1360 can be minimized. In addition, by using the dipole antenna element of the first antenna module 1310, the coverage of the front surface of the electronic device 1300 can be ensured.

[0183] According to one embodiment, the first antenna module 1310 may only include the plurality of dipole antenna elements and the plurality of short-circuit patch antenna elements (eg Fig.9A or Fig. 9B The first antenna module 1310 may not include a third PCB 953 of the second AE group 945). Fig.9A or Fig. 9B The first PCB 951 and the second PCB 952 of the antenna module 900 are provided. In this case, the communication circuit may be provided on the rear surface of the third PCB 953. By vertically providing the first antenna module 1310 including only a dipole antenna element on the upper portion of the electronic device 1300, the movement of the speaker 1360 may be minimized.

[0184] Fourth embodiment

[0185] Unless otherwise described, the description given above with reference to the second embodiment can be applied to the fourth embodiment.

[0186] Return to Fig.13 , the first antenna module 1310 may correspond to Fig.9A or Fig. 9B According to one embodiment, the antenna module 900 Fig.13 Unlike the illustrated example, the first antenna module 1310 may be disposed to overlap with the speaker 1360 on the XY plane.

[0187] Fig.15 is a cross-sectional view of the interior of an electronic device according to an embodiment of the present disclosure.

[0188] Reference Fig.15 , the cross-sectional view may correspond to when viewed along the direction from +X to -X Fig.13 According to various embodiments, the first antenna module 1310 may include a first PCB 1541 (eg, Fig.9A or Fig. 9B The first PCB 951), the second PCB 1542 (for example Fig.9A or Fig. 9B The second PCB 952), the third PCB 1543 (for example Fig.9A or Fig. 9B a third PCB 953), a first shielding cover 1544 and a second shielding cover 1545.

[0189] For example, the first PCB 1541 may be disposed adjacent to a rear panel (not shown) so as to face the rear panel, and may be disposed substantially parallel to a display (not shown). The first PCB 1541 may include a plurality of patch antenna elements (e.g., Fig.9A or Fig. 9B The first AE group 940). The first PCB 1541 may be disposed on the insertion mechanism 1520. For example, the heat radiation member 1521 may be disposed between the insertion mechanism 1520 and the first shielding cover 1544.

[0190] For example, the second PCB 1542 may be an FPCB. The second PCB 1542 may electrically and / or physically connect the first PCB 1541 and the third PCB 1543 on the rear surface of the speaker 1360.

[0191] For example, the third PCB 1543 may include a plurality of dipole antenna elements. The third PCB 1543 may be disposed adjacent to the side frame structure 410 and may be disposed substantially perpendicular to the display of the electronic device 1300. For example, the plurality of dipole antenna elements of the third PCB 1543 may form a beam passing through the non-conductive region 1512 of the side frame structure 410. The side frame structure 410 may include a conductive region 1511 on one side of the rear plate of the electronic device 1300 and may include a non-conductive region 1512 on one side of the display. For example, the plurality of dipole antenna elements of the third PCB 1543 may form a beam passing through the non-conductive region 1512 formed at the first support member 411 toward the front surface of the electronic device 1300.

[0192] In this embodiment, the speaker 1360 can be received through the through hole 1540 of the first supporting member 411 and the receiving hole (eg, Figure 2The receiving hole 214 of the electronic device 1300 outputs the sound to the outside of the electronic device 1300. For example, even if the position of the speaker 1360 is changed due to the third PCB 1543 thus installed, the position of the through hole 1540 can be maintained. That is, by maintaining the positions of the through hole 1540 and the receiving hole, the internal position of the speaker 1360 can be changed without changing the external appearance of the electronic device 1300. For example, the speaker 1360 can be a housing speaker.

[0193] Fifth embodiment

[0194] Fig.16 is a view showing an antenna module provided in an electronic device according to an embodiment of the present disclosure.

[0195] Reference Fig.16 According to one embodiment, the electronic device 1600 (eg Figure 1 The electronic device 101 may include a first antenna module 1610, a second antenna module 1620, and a third antenna module 1630. For example, Fig.16 1 shows the internal appearance of the electronic device 1600 when the electronic device 1600 is viewed from the rear surface of the electronic device 1600. For example, Fig.16 It can be shown that after removing the back panel (eg Figure 4 The rear panel 480) and the antenna (eg Figure 4 The interior of the electronic device 1600 is viewed from the rear surface of the electronic device 1600 in one direction (eg, the negative direction of the Z axis) after the antenna 470 of the electronic device 1600 is removed. As another example, Fig.16 It can be shown that the back panel, antenna and second support member (eg, Figure 4 The interior of the electronic device 1600 as seen from the rear surface of the electronic device 1600 in the one direction after the second support member 460 is attached. Unless otherwise described, the structure of the electronic device 1600 may refer to the structure of Fig.13 In this embodiment, the first antenna module 1610 may be the same antenna module as the first antenna module 1310 of the third embodiment or the fourth embodiment.

[0196] According to various embodiments, the second antenna module 1620 may be placed in Fig.16The second antenna module 1620 may be disposed at the upper left of the rear surface of the electronic device 1600 in FIG. 4 . For example, when viewed from the side surface of the electronic device 1600 (e.g., the positive direction of the X-axis or the negative direction of the X-axis), the second antenna module 1620 may be disposed at a position where at least a portion of the second antenna module 1620 overlaps with the camera module 1640. For example, when viewed from the rear surface of the electronic device 1600, the second antenna module 1620 may be disposed on the left side of the camera module 1640 so as to be adjacent to the side frame structure 410.

[0197] According to various embodiments, each of the second antenna module 1620 and the third antenna module 1630 may correspond to Fig.9A or Fig. 9B According to one embodiment, each of the second antenna module 1620 and the third antenna module 1630 may include a first PCB (eg, Fig.9A or Fig. 9B The first PCB 951) and the third PCB (eg Fig.9A or Fig. 9B The third PCB 953 of the first PCB includes a plurality of patch antenna elements (e.g. Fig.9A or Fig. 9B The first AE group 940) includes a plurality of dipole antenna elements and a plurality of short-circuit patch antenna elements. According to one embodiment, the first PCB and the third PCB can be connected by a second PCB having flexibility (e.g. Fig.9A or Fig. 9B According to one embodiment, the first PCB and the third PCB may be directly connected, and the second PCB may be implemented with a flexible PCB.

[0198] According to one embodiment, in each of the second antenna module 1620 and the third antenna module 1630, the first PCB may be disposed facing the rear surface of the electronic device 1600 (e.g., the positive direction of the Z axis), and the third PCB may be disposed at a curved portion (e.g., between the rear plate of the electronic device 1600 and the side frame structure 410) Figure 3 For example, when the third PCB is installed in the electronic device 1600 in a shape bent from the first PCB to correspond to the bent portion, the beam generated by the dipole antenna element of the third PCB can well face the front direction of the electronic device 1600 (e.g., the negative direction of the Z axis).

[0199] Fig.17 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0200] Reference Fig.17, the cross-sectional view may correspond to when viewed along the direction from -Y to +Y Fig.16 A cross-sectional view observed when the cross section of the electronic device 1600 is intercepted along the axis A-A'. According to various embodiments, the patch antenna element portion 1731 (e.g., the first PCB) of the third antenna module 1630 may be disposed adjacent to the rear panel 480 so as to face the rear panel 480, and may be disposed substantially parallel to the display 430. For example, the rear panel 480 may include a rear glass 1781 and a non-conductive layer 1782. The dipole and short-circuited patch antenna element portion 1732 of the third antenna module 1630 may be disposed adjacent to the rear panel 480, and may extend from the patch antenna element portion 1731 along the curved surface of the rear panel 480 in a direction facing the side frame structure 410. Unless otherwise described, the structure of the third antenna module 1630 may be similar to that of the third antenna module 1330.

[0201] According to one embodiment, the third antenna module 1630 may further include a PCB fill cut area 1733. For example, when installed, the PCB fill cut area 1733 may extend from one end of the dipole and shorted patch antenna element portion 1732 toward the side frame structure 410 and may be bent along a curved portion of the back plate 480. For example, the PCB fill cut area 1733 may indicate an area of ​​the PCB that does not include a wiring structure. The PCB fill cut area 1733 may be used to physically fix the third antenna module 1630 to the back plate 480.

[0202] According to one embodiment, a step “D” may exist between the antenna surface of the third antenna module 1630 and the conductive area of ​​the side frame structure 410. For example, similar to reference Fig.14 By setting the height of the conductive area of ​​the side frame structure 410 to be relatively lower than the height of the antenna surface of the third antenna module 1630, the third antenna module 1630 can further generate a beam toward the front surface of the electronic device 1600. Fig.14 As described, a structure such as an insertion mechanism may be used.

[0203] Table 1 below shows the -90 degree gain of the dipole and shorted patch antenna element portion 1732 as a function of step "D" and the gain at the PCB fill cut area 1733.

[0204] Table 1

[0205]

[0206] like Fig.17As shown, since the non-conductive layer 1782 is covered by the rear glass 1781 and isolated from the outside, the injection-molded band of the non-conductive layer 1782 is not visible at the external appearance of the electronic device 1600.

[0207] Reference Fig.17 The described configuration of the third antenna module 1630 may be similarly applied to the second antenna module 1620 .

[0208] According to various embodiments, an electronic device (eg Figure 4 The electronic device 400 may include: a display (eg, Figure 4 A display 430) and a front panel (eg, Figure 4 a rear panel (eg, a front panel 420) disposed at the rear surface of the electronic device; Figure 4 rear plate 480); side members (eg Figure 4 The frame structure 410 is disposed between the front plate and the rear plate and forms the external appearance of the electronic device together with the front plate and the rear plate; and at least one antenna module (eg Figure 6 The antenna module 600 includes a plurality of conductive plates (eg Figure 6 The plurality of conductive plates are configured to transmit / receive signals in a specified first frequency band. For example, at least some of the plurality of conductive plates may be disposed at the at least one antenna module so as to transmit / receive wireless signals through the rear panel. For example, at least some of the plurality of conductive plates may be disposed at the at least one antenna module so as to pass through a non-conductive area (e.g., Fig.11 The non-conductive region 1150, Fig.12 The non-conductive region 1230, Fig.14 The non-conductive area 1411 or Fig.15 For example, the side member may include a conductive region and a non-conductive region, at least a portion of which is capable of serving as an antenna for signals in a designated second frequency band different from the designated first frequency band, and the non-conductive region may be covered by a back plate and may not be visible from the outside of the electronic device.

[0209] According to one embodiment, the at least one antenna module may include a first antenna module (eg Fig.10 The first antenna module 1010, Fig.13 The first antenna module 1310 or Fig.16 The first antenna module 1610 may be disposed in the middle of the upper portion of the electronic device so as to be adjacent to the speaker (eg, Fig.10 Speaker 1060, Fig.13 Speaker 1360 or Fig.16 The speaker 1660) can be connected to the front panel of the electronic device through a receiving hole (eg, Fig.15 The receiving hole 1540) outputs sound.

[0210] According to one embodiment, the first antenna module (eg Fig.13 The first antenna module 1310 or Fig.16 The first antenna module 1610) may include a printed circuit board (PCB) disposed between the speaker and the side member and above the speaker when viewed from the rear surface of the electronic device, and a printed circuit board (PCB) including a plurality of patch-type conductive plates and a plurality of dipole-type conductive plates, the plurality of patch-type conductive plates may be arranged to form a beam toward the rear plate, and the plurality of dipole-type conductive plates may be arranged above the plurality of patch-type conductive plates so as to be closer to the side member than the plurality of patch-type conductive plates.

[0211] According to one embodiment, when the electronic device is viewed from the rear surface, the position of the multiple dipole conductive plates can be arranged to be higher than the conductive area of ​​the side member, so that at least a portion of the beam pattern formed by the multiple dipole conductive plates is formed toward the front surface of the electronic device.

[0212] According to one embodiment, the first antenna module may be placed in an insertion mechanism (eg Fig.15 An insertion mechanism 1520) is provided between the side member and the back plate, wherein the insertion mechanism is provided on a supporting member within the electronic device so that the positions of the plurality of dipole-type conductive plates of the first antenna module are higher than the conductive area of ​​the side member.

[0213] According to one embodiment, when viewed from the rear surface of the electronic device, the first antenna module (eg Fig.9A or Fig. 9B The first antenna module 900 may be disposed between the speaker and the side member and above the speaker. The first antenna module may include a first PCB (eg, Fig.9A or Fig. 9B A first PCB 951) and a second PCB (eg, Fig.9A or Fig. 9B The first PCB may be arranged in the electronic device so that the plurality of patch-type conductive plates (eg, Fig.9A or Fig. 9B One surface of the first PCB of the first AE group 940 is substantially parallel to the rear plate, and the second PCB may extend from one end of the one surface of the first PCB toward the side member and may include a bent portion (e.g. Fig.9A or Fig. 9B The bending portion may be a connecting member 952 of the first PCB, at least a portion of which has a shape bent from the one surface of the first PCB toward the front surface of the electronic device. For example, the bending portion may be a flexible printed circuit board (FPCB) that physically and electrically connects the first PCB and the second PCB.

[0214] According to one embodiment, the at least one antenna module may include a second antenna module (eg Fig.10 The second antenna module 1020, Fig.13 The second antenna module 1320 or Fig.16 The second antenna module 1620) and the third antenna module (eg Fig.10 The third antenna module 1030, Fig.13 The third antenna module 1330 or Fig.16 When the electronic device is viewed from the rear surface of the electronic device, the second antenna module may be arranged at the upper left of the electronic device so as to be adjacent to the side member. When the electronic device is viewed from the rear surface of the electronic device, the third antenna module may be arranged at the right side of the electronic device and between the battery and the side member of the electronic device.

[0215] For example, each of the second antenna module and the third antenna module may include at least one printed circuit board (PCB), on which a plurality of patch-type conductive plates and a plurality of dipole-type conductive plates are arranged, the plurality of patch-type conductive plates may be arranged to form beams toward the rear plate, and the plurality of dipole-type conductive plates may be arranged above the plurality of patch-type conductive plates so as to be closer to the side member than the plurality of patch-type conductive plates.

[0216] For example, each of the second antenna module and the third antenna module may include: a first PCB on which the multiple patch-type conductive plates are arranged and a second PCB on which the multiple dipole-type conductive plates are arranged, the first PCB can be placed in the electronic device so that a surface of the first PCB on which the multiple patch-type conductive plates are arranged is substantially parallel to the back plate, the second PCB can extend from one end of the one surface of the first PCB toward the side member and may include a bent portion and a filling cutting area, at least a portion of the bent portion has a shape bent from the one surface of the first PCB toward the front surface of the electronic device, the filling cutting area extends from the area in which the multiple dipole-type conductive plates are arranged, and the filling cutting area can be formed of a non-conductive material.

[0217] According to various embodiments, an electronic device (eg Figure 4 The electronic device 400 may include: a display (eg, Figure 4A display 430) and a front panel (eg, Figure 4 a rear panel (eg, a front panel 420) disposed at the rear surface of the electronic device; Figure 4 rear plate 480); side members (eg Figure 4 The frame structure 410 is disposed between the front plate and the rear plate and forms the external appearance of the electronic device together with the front plate and the rear plate; the first antenna module (eg Fig.10 The first antenna module 1010, Fig.13 The first antenna module 1310 or Fig.16 The first antenna module 1610 includes a plurality of conductive plates configured to transmit / receive signals in a first frequency band and is disposed in the middle of the upper portion of the electronic device so as to be adjacent to the speaker; the second antenna module (e.g. Fig.10 The second antenna module 1020, Fig.13 The second antenna module 1320 or Fig.16 A second antenna module 1620) includes a plurality of conductive plates configured to transmit / receive signals in a first frequency band and is disposed at the upper left of the electronic device when viewed from the rear surface of the electronic device so as to be adjacent to the side member; and a third antenna module (e.g. Fig.10 The third antenna module 1030, Fig.13 The third antenna module 1330 or Fig.16 The third antenna module 1630) includes a plurality of conductive plates configured to transmit / receive signals in the first frequency band, and is disposed at the lower right of the electronic device when viewed from the rear surface of the electronic device so as to be adjacent to the side member.

[0218] At least some of the plurality of conductive plates of the second antenna module may be disposed at the second antenna module so as to transmit / receive wireless signals through the rear plate and transmit / receive wireless signals through the non-conductive area of ​​the side member, at least some of the plurality of conductive plates of the third antenna module may be disposed at the third antenna module so as to transmit / receive wireless signals through the rear plate and transmit / receive wireless signals through the non-conductive area of ​​the side member. The side member may include a conductive area and a non-conductive area, at least a portion of the conductive area may be used as an antenna for a signal in a designated second frequency band different from the designated first frequency band, and a speaker may output sound through a receiving hole formed at the front panel of the electronic device.

[0219] According to one embodiment, the non-conductive area may be covered by the back plate and may not be visible from the outside of the electronic device.

[0220] According to one embodiment, when viewed from the rear surface of the electronic device, the first antenna module may be disposed between the speaker and the side member and above the speaker, and may include a PCB including a plurality of patch-type conductive plates and a plurality of dipole-type conductive plates. For example, the plurality of patch-type conductive plates may be arranged to form a beam toward the rear plate, and the plurality of dipole-type conductive plates may be arranged above the plurality of patch-type conductive plates so as to be closer to the side member than the plurality of patch-type conductive plates.

[0221] For example, when viewing the electronic device from the rear surface, the plurality of dipole conductive plates may be positioned higher than the conductive region of the side member so that at least a portion of the beam pattern formed by the plurality of dipole conductive plates is formed toward the front surface of the electronic device.

[0222] For example, the first antenna module may be disposed between an insertion mechanism on a support member disposed in the electronic device and a rear plate so that the plurality of dipole conductive plates of the first antenna module are located higher than the conductive region of the side member.

[0223] For example, the first antenna module may include: a first PCB, which is arranged below the speaker when the electronic device is viewed from the rear surface of the electronic device, and on which a plurality of patch-type conductive plates are arranged; a third PCB, which is arranged between the speaker and the side member and above the speaker when viewed from above the rear surface of the electronic device, and on which a plurality of dipole-type conductive plates are arranged; and a second PCB, which physically connects one end of the first PCB and one end of the third PCB above the speaker, and electrically connects the first PCB and the third PCB. The first PCB may be arranged in the electronic device so that a surface of the first PCB on which the plurality of patch-type conductive plates are arranged is substantially parallel to the rear plate. The third PCB may extend from the end connected to the second PCB toward the front surface of the electronic device, and may be arranged in the electronic device so as to be substantially perpendicular to the rear plate.

[0224] For example, the plurality of dipole conductive plates disposed at the third PCB may be disposed to form beams toward the front surface of the electronic device from the one end of the third PCB connected to the second PCB. At least some of the beams formed by the dipole conductive plates may be formed toward the front surface of the electronic device through the remaining area of ​​the front plate of the electronic device except for the display.

[0225] According to one embodiment, when the electronic device is viewed from a rear surface of the electronic device, the second antenna module may be positioned between the camera module of the electronic device and the side member so as to be adjacent to the side member, and when the electronic device is viewed from a rear surface of the electronic device, the third antenna module may be positioned on the right side of the electronic device and between the battery of the electronic device and the side member.

[0226] For example, each of the second antenna module and the third antenna module may include at least one PCB on which a plurality of patch-type conductive plates and a plurality of dipole-type conductive plates are disposed. The plurality of patch-type conductive plates may be disposed to form a beam toward the rear plate, and the plurality of dipole-type conductive plates may be disposed above the plurality of patch-type conductive plates so as to be closer to the side member than the plurality of patch-type conductive plates.

[0227] For example, each of the second antenna module and the third antenna module may include a first PCB at which the plurality of patch-type conductive plates are disposed and a second PCB at which the plurality of dipole-type conductive plates are disposed. The first PCB may be arranged in the electronic device so that one surface of the first PCB at which the plurality of patch-type conductive plates are disposed is substantially parallel to the back plate, and the second PCB may extend from one end of the one surface of the first PCB toward the side member, and may include a bent portion and a filling cut region, at least a portion of which has a shape bent from the one surface of the first PCB toward the front surface of the electronic device, and the filling cut region extends from the region in which the plurality of dipole-type conductive plates are disposed toward the side member. The filling cut region may be formed of a non-conductive material.

[0228] According to an embodiment of the present disclosure, the electronic device may provide coverage without signal null points by using a plurality of antenna modules configured to have optimized coverage.

[0229] According to an embodiment of the present disclosure, an electronic device may include an antenna module configured to minimize interference with another antenna, and may thus support both conventional mobile communications and 5G mobile communications.

[0230] Furthermore, various effects directly or indirectly understood by the present disclosure can be provided.

[0231] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: a display disposed at a front surface of the electronic device and a front plate disposed on the display; A rear plate, disposed at the rear surface of the electronic device; a side member disposed between the front plate and the rear plate and forming an external appearance of the electronic device together with the front plate and the rear plate; a first antenna module including a plurality of first patch antenna elements configured to transmit / receive signals in a first frequency band and disposed adjacent to the side member and on an upper portion of the electronic device such that the plurality of first patch antenna elements face the rear plate; a second antenna module including a first substrate, a first communication circuit disposed on a rear surface of the first substrate, and a plurality of second patch antenna elements disposed on a front surface of the first substrate and electrically connected to the first communication circuit, the first communication circuit being configured to transmit / receive the signal in the first frequency band, the second antenna module being disposed adjacent to the side member so that the plurality of second patch antenna elements face a left side of the electronic device when the electronic device is viewed from the rear surface; as well as A third antenna module includes a second substrate, a second communication circuit arranged on the rear surface of the second substrate, and a plurality of third patch antenna elements arranged on the front surface of the second substrate and electrically connected to the second communication circuit, wherein the second communication circuit is configured to send / receive the signal in the first frequency band, and the third antenna module is arranged adjacent to the side member so that the plurality of third patch antenna elements face the right side of the electronic device when the electronic device is viewed from the rear surface.

2. The electronic device according to claim 1, further comprising: a speaker disposed in the middle of an upper portion of the electronic device and configured to output sound through a receiving hole formed at the front plate of the electronic device, When the electronic device is viewed from the rear surface, the first antenna module is disposed on the right side of the speaker.

3. The electronic device according to claim 2, wherein the plurality of first patch antenna elements are arranged to face the back plate so that wireless signals are transmitted / received through the back plate, wherein the side member includes a conductive region and a non-conductive region, at least a portion of the conductive region being capable of functioning as an antenna for signals in a second frequency band different from the first frequency band, and The non-conductive area is covered by the back plate and is not visible from the outside of the electronic device.

4. The electronic device according to claim 3, The first antenna module further comprises a plurality of first dipole antenna elements, and Wherein, when the electronic device is viewed from the rear surface, the plurality of first dipole antenna elements are positioned higher than the conductive region of the side member adjacent to the first antenna module, so that at least a portion of a beam pattern formed by the plurality of first dipole antenna elements is formed toward the front surface of the electronic device. 5 . The electronic device according to claim 1 , wherein the first antenna module is disposed between an insertion mechanism provided on a supporting member within the electronic device and the rear plate.

6. The electronic device according to claim 4, further comprising: a connecting member to electrically connect the conductive area of ​​the side member adjacent to the first antenna module to a grounding area disposed in the electronic device, wherein the connecting member is disposed between the first antenna module and the side member, and When the electronic device is viewed from the rear surface, the connection member and the side member are in contact with each other at a position lower than the first antenna module.

7. The electronic device according to claim 1, The first antenna module further comprises a printed circuit board, the printed circuit board comprising a first surface having a long axis and a short axis and a second surface facing away from the first surface, The plurality of first patch antenna elements are arranged on the first surface along the direction of the long axis. 8 . The electronic device according to claim 2 , wherein the first antenna module is disposed such that at least a portion of the first antenna module overlaps the speaker when viewed from a right side or a left side of the electronic device.

9. An electronic device according to claim 1, wherein the second antenna module is installed in the electronic device so that the plurality of second patch antenna elements are perpendicular to the back plate and are positioned adjacent to the side member and at the upper left of the electronic device when the electronic device is viewed from the back surface.

10. The electronic device according to claim 9, wherein the plurality of second patch antenna elements are arranged to transmit / receive wireless signals through the non-conductive areas of the rear plate and the side member, wherein the side member includes a conductive region and the non-conductive region, at least a portion of the conductive region being capable of serving as an antenna for signals in a second frequency band different from the first frequency band, and The non-conductive area is covered by the back plate and is not visible from the outside of the electronic device.

11. The electronic device according to claim 10, further comprising: a connecting member to electrically connect the conductive area of ​​the side member adjacent to the second antenna module to a grounding area disposed in the electronic device, wherein when the electronic device is viewed from the rear surface, the connecting member is disposed on the right side of the second antenna module, and When the electronic device is viewed from the rear surface, contact between the connecting member and the side member is formed on the right side of the second antenna module.

12. An electronic device according to claim 1, wherein the third antenna module is installed in the electronic device so that the plurality of third patch antenna elements are perpendicular to the back plate and are positioned on the right side of the electronic device and between the battery of the electronic device and the side member when the electronic device is viewed from the back surface.

13. The electronic device according to claim 12, wherein the plurality of third patch antenna elements are arranged to transmit / receive wireless signals through the non-conductive areas of the rear plate and the side member, wherein the side member includes a conductive region and the non-conductive region, at least a portion of the conductive region being capable of serving as an antenna for signals in a second frequency band different from the first frequency band, and The non-conductive area is covered by the back plate and is not visible from the outside of the electronic device.

14. The electronic device according to claim 13, further comprising: When viewed from the rear surface of the electronic device, upper and lower portions of the conductive region of the side member adjacent to the third antenna module are in contact to electrically connect a ground region disposed within the electronic device.

Images