A solar chip and a method for manufacturing the same

Abstract

The application relates to the technical field of solar energy, in particular to a solar chip and a preparation method thereof. The solar chip comprises a first electrode, a second electrode and a conductive connecting layer. The first electrode comprises a first base material layer, a first conductive layer and a photoelectric conversion layer which are sequentially stacked. The second electrode comprises a second base material layer and a second conductive layer which are stacked. The photoelectric conversion layer and the second base material layer are connected through the conductive connecting layer. The solar chip provided by the application does not need to be packaged again, the preparation process is relatively simple, and the production efficiency is relatively high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar chip, in particular to a solar chip and a preparation method thereof. BACKGROUND

[0002] With the enhancement of energy saving and environmental protection consciousness, the popularity rate of clean energy such as solar energy is higher and higher, and the solar chip is an important part of the solar power generation device. The current solar chip is usually connected by two electrodes, so that the solar chip must be re-packaged as a whole after the preparation is completed, which makes the preparation process of the solar chip more complicated and is not conducive to improving the production efficiency of the solar chip. SUMMARY

[0003] (I) The technical problem to be solved by the present application is that the solar chip still needs to be re-packaged after the preparation is completed, the preparation process is relatively complicated, and the production efficiency is relatively low.

[0004] (II) Technical solution

[0005] In order to solve the above technical problem, the present application provides a solar chip, which comprises: a first electrode, the first electrode comprises a first substrate layer, a first conductive layer and a photoelectric conversion layer which are sequentially stacked;

[0006] a second electrode, the second electrode comprises a second substrate layer and a second conductive layer which are stacked;

[0007] a conductive connection layer, the photoelectric conversion layer and the second substrate layer are connected through the conductive connection layer.

[0008] Optionally, at least one of the first substrate layer and the second substrate layer is made of water-blocking material with a water permeability coefficient not greater than 10 ﹣ 2 cm / s.

[0009] Optionally, the solar chip provided by the present application further comprises a positioning layer, the positioning layer is arranged between the first substrate layer and the first conductive layer, and the positioning layer is arranged between the second conductive layer and the second substrate layer, the positioning layer has a positioning groove, and the first conductive layer and the second conductive layer are arranged in the corresponding positioning groove.

[0010] Optionally, the first electrode further comprises a light-absorbing layer, and the light-absorbing layer is arranged between the first substrate layer and the first conductive layer.

[0011] Optionally, the first electrode further comprises a heat dissipation layer, and the heat dissipation layer is arranged between the first substrate layer and the light-absorbing layer.

[0012] The second aspect of the present application also provides a method for preparing a solar chip to prepare any of the above provided solar chips, the method comprising:

[0013] preparing a first electrode formed by sequentially stacking a first substrate layer, a first conductive layer and a photoelectric conversion layer;

[0014] preparing a second electrode formed by stacking a second substrate layer and a second conductive layer;

[0015] the first surface of the second substrate layer is connected to the first surface of the photoelectric conversion layer through a conductive connecting layer.

[0016] Optionally, the method provided by the present application further comprises:

[0017] providing a positioning layer with a positioning groove on the first surface of the first substrate layer;

[0018] providing the first conductive layer in the positioning groove.

[0019] providing the first conductive layer in the positioning groove.

[0020] Optionally, the method provided by the present application further comprises:

[0021] providing a light-absorbing layer on the first surface of the first conductive layer;

[0022] providing the first substrate groove layer on the first surface of the light-absorbing layer.

[0023] Optionally, the method provided by the present application further comprises:

[0024] providing a heat-dissipating layer on the first surface of the light-absorbing layer;

[0025] providing the first substrate layer on the first surface of the heat-dissipating layer.

[0026] Optionally, the method provided by the present application further comprises:

[0027] providing a positioning layer with a positioning groove on the first surface of the second substrate layer;

[0028] providing the second conductive layer in the positioning groove.

[0029] Beneficial effects

[0030] The solar chip provided by the present application, the first electrode and the second electrode respectively comprise a first substrate layer and a second substrate layer, and the first substrate layer and the second substrate layer can provide protection for the first electrode and the second electrode after the preparation of the solar chip is completed, so that the solar chip does not need to be packaged again, and the first electrode and the second electrode can be directly connected through the conductive connection layer, the preparation process of the solar chip is simplified, the preparation process is simple, and the production efficiency of the solar chip can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] The advantages of the above and / or additional aspects of the present application will become apparent and easy to understand from the following description of embodiments, in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a cross-sectional schematic view of a first electrode in a solar chip provided by an embodiment of the present application;

[0033] Figure 2 is a cross-sectional schematic view of a second electrode in a solar chip provided by an embodiment of the present application;

[0034] Figure 3 is a cross-sectional schematic view of a solar chip provided by an embodiment of the present application;

[0035] Figure 4 is a schematic view of part of a structure in a solar chip provided by an embodiment of the present application;

[0036] Figure 5 is a flowchart of a preparation method of a solar chip provided by an embodiment of the present application;

[0037] Figure 6 is another flowchart of a preparation method of a solar chip provided by an embodiment of the present application;

[0038] Figure 7 is still another flowchart of a preparation method of a solar chip provided by an embodiment of the present application;

[0039] Figure 8 is yet another flowchart of a preparation method of a solar chip provided by an embodiment of the present application;

[0040] Figure 9 is still yet another flowchart of a preparation method of a solar chip provided by an embodiment of the present application.

[0041] REFERENCE NUMERALS

[0042] 1 - positioning layer;

[0043] 2 - conductive layer;

[0044] 3 - substrate layer;

[0045] 4 - heat dissipation layer;

[0046] 5 - light absorption layer;

[0047] 6 - photoelectric conversion layer;

[0048] 7 - conductive connection layer. DETAILED DESCRIPTION

[0049] In order to enable persons skilled in the art to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0050] As shown in Figures 1-3 The present application provides a solar chip with relatively simple preparation process and high production efficiency. The solar chip comprises a first electrode and a second electrode, the first electrode comprises a first substrate layer, a first conductive layer and a photoelectric conversion layer, the second electrode comprises a second substrate layer and a second conductive layer, and optionally, the first substrate layer and the second substrate layer can be made of the same material, so that in order to facilitate the description of the solar chip provided by the present application and the understanding of the following description, the first substrate layer and the second substrate layer are replaced by the substrate layer hereinafter, and correspondingly, the first conductive layer and the second conductive layer are replaced by the conductive layer. The first electrode and the second electrode are both provided with the substrate layer 3, so that after the packaging process of the entire photovoltaic module is completed, the photovoltaic module does not need to be additionally packaged, which can reduce the processing procedures of the photovoltaic module, thereby achieving the purpose of improving the production efficiency. The photoelectric conversion layer 6 in the first electrode can be connected with the substrate layer 3 in the second electrode through the conductive connection layer 7. The conductive connection layer 7 can be formed of OCA (Optically Clear Adhesive, optical adhesive) or the like, and the adhesive has good bonding effect, so that the separation between the first electrode and the second electrode is basically avoided, and the optical adhesive is colorless and transparent, and the light transmittance is above 90%, which is of great help to improve the power generation efficiency of the solar chip; the adhesive can be cured at room temperature or the like, and has the characteristics of small curing shrinkage, so that the requirements for the processing environment of the solar chip are not high, which is conducive to further reducing the production cost of the solar chip.

[0051] In order to further ensure the waterproof effect of the solar chip provided by the present application, the substrate layer 3 of at least one of the first electrode and the second electrode can be made of a material with a water permeability coefficient not greater than 10 ﹣2The water-blocking material has a thickness of 0.1-1 cm / s. Preferably, the substrate layer 3 of the first electrode and the second electrode of the solar chip provided by the present application can be made of the aforementioned water-blocking material, so as to further improve the waterproof performance of the entire solar chip. Specifically, the substrate layer 3 can be made of a water-blocking film with a certain thickness, which can also improve the deformation ability of the solar chip, so that the solar chip can flexibly change its structure and shape according to the installation position, so as to basically break the restriction of the solar chip on the use area and the installation terrain and the like; at the same time, the substrate layer 3 made of the water-blocking film can also reduce the weight of the entire solar chip to some extent, so as to improve the product performance and competitiveness of the solar chip. More specifically, the thickness of the substrate layer 3 can be determined according to actual conditions, which is not limited here.

[0052] Of course, as shown in Figure 3 the first electrode and the second electrode of the solar chip provided by the present application, in addition to the substrate layer 3, also includes the conductive layer 2 and the like. The conductive layer 2 is connected with the substrate layer 3. In order to improve the connection reliability between the conductive layer 2 and the substrate layer 3, optionally, the solar chip provided by the present application also includes a positioning layer 1, which can be arranged between the first substrate layer and the first conductive layer, and also can be arranged between the second substrate layer and the second conductive layer, and the positioning layer 1 is provided with a positioning groove (not shown in the figure), so that the conductive layer 2 of the first electrode and the second electrode can be arranged in the corresponding aforementioned positioning groove, so as to ensure that the first conductive layer and the first substrate layer, and the second conductive layer and the second substrate layer have high connection reliability, so as to improve the overall performance of the photovoltaic module.

[0053] In order to reduce the overall processing time of the solar chip, further, the positioning layer 1 for carrying the conductive layer 2 can be made of a photosensitive glue. In the preparation process of the solar chip, the liquid photosensitive glue can be quickly cured under the irradiation of ultraviolet light, so as to play a role in fixing and carrying the conductive layer 2, which can greatly reduce the overall processing time of the solar chip, so as to improve the production efficiency of the solar chip.

[0054] Preferably, as shown in Figure 1As shown, in the first electrode of the solar cell, a light-absorbing layer 5 is stacked on one side surface of the substrate layer 3. The light-absorbing layer 5 can improve the power generation performance of the entire photovoltaic module. To improve the adhesion between the conductive layer 2 and the light-absorbing layer 5, the conductive layer 2 can be connected to the light-absorbing layer 5 using materials such as hot melt adhesive; alternatively, the light-absorbing layer 5 can be connected to the conductive layer 2 in other ways, which are not limited here. To prevent the temperature of the entire solar cell from becoming too high and adversely affecting the power generation efficiency, preferably, a heat dissipation layer 4 can be provided between the substrate layer 3 and the light-absorbing layer 5 of the first electrode, so as to improve the power generation efficiency of the solar cell by means of the heat dissipation and cooling effect of the heat dissipation layer 4; optionally, the light-absorbing layer 5 can be made of a dark-colored, preferably black, polymer material to improve the light absorption efficiency of the light-absorbing layer 5, thereby achieving the purpose of improving the power generation efficiency of the solar cell. Specifically, the heat dissipation layer 4, the light-absorbing layer 5, and the photoelectric conversion layer 6 can all be formed on the substrate layer 3 of the first electrode using methods such as co-evaporation or sputtering. To ensure superior performance, the heat dissipation layer 4, the light-absorbing layer 5, and the photoelectric conversion layer 6 can be fabricated in a vacuum environment. During the formation of the light-absorbing layer 5, the temperature of the forming environment can be controlled between 250℃ and 400℃, and the pressure at 20 MPa, thereby further improving the performance of the light-absorbing layer 5. Figure 2 As shown, in the second electrode of the solar cell, the conductive layer 2 can be formed on the surface of the substrate layer 3. The conductive layer 2 can be a copper wire. To improve its adhesion to the substrate layer 3, the conductive layer 2 can be connected to the substrate layer 3 by hot melt adhesive or the like. Alternatively, the conductive layer 2 in the second electrode can also be connected to the substrate layer 3 by the positioning layer 1. In addition, to ensure that the solar cell can generate electricity normally and efficiently, the heat dissipation layer 4, the light absorption layer 5, and the photoelectric conversion layer 6 can all be configured to completely cover their respective molded bases.

[0055] To improve the power generation efficiency of solar cells, energy loss within the solar cell, especially within the conductive layer 2, can be reduced. Preferably, in the solar cell provided by this invention, at least one of the first and second electrodes has a conductive layer 2 that may include metallic silver. Metallic silver has a low resistivity, thereby reducing current loss during transmission within the conductive layer and achieving improved power generation efficiency. Preferably, the conductive layers 2 of both the first and second electrodes may include metallic silver. More preferably, the conductive layers 2 of both the first and second electrodes may be made solely of metallic silver, thereby minimizing energy loss within the solar cell and maximizing power generation efficiency under otherwise unchanged conditions. Specifically, the conductive layer 2 may be formed from metallic silver wires, and its adhesion to the substrate layer 3 may be improved using hot melt adhesive or similar methods. Alternatively, the conductive layer 2 may be formed during the processing of the solar cell, such as by solidifying liquid metallic silver through a specific process. This can be determined according to actual conditions and is not limited here.

[0056] Based on the solar cell chip provided in any of the above embodiments, the present invention also provides a method for preparing a solar cell chip, such as... Figure 5 As shown, the present invention provides a specific embodiment of the preparation method:

[0057] Step S1: Prepare a first electrode formed by sequentially stacking a first substrate layer, a first conductive layer, and a photoelectric conversion layer;

[0058] Step S2: Prepare a second electrode formed by stacking a second substrate layer and a second conductive layer;

[0059] Step S3: The first surface of the second substrate layer is connected to the first surface of the photoelectric conversion layer through a conductive connection layer.

[0060] Specifically, the substrate layers of both the first and second electrodes can be made of water-blocking materials. Correspondingly, the conductive layer can be made of metallic materials, such as copper or silver. The photoelectric conversion layer can be made of CI GS (CuInxGa(-x)Se) material. The photoelectric conversion layer can be formed on the conductive layer of the first electrode by co-evaporation or sputtering, thereby forming a first electrode with the first substrate layer, the first conductive layer, and the photoelectric conversion layer stacked in sequence. Correspondingly, the second electrode can be formed by forming the second conductive layer on the second substrate layer. Then, an adhesive, such as OCA (Optically Clear Adhesive), for forming a conductive connection layer can be applied to the photoelectric conversion layer and / or the second substrate layer. By connecting the photoelectric conversion layer and the second substrate layer, the entire photovoltaic module encapsulation process can be completed. The resulting photovoltaic module has waterproof performance and basically does not require re-encapsulation, resulting in high working efficiency.

[0061] It should be noted that there is no absolute time order between steps S1 and S2 in the above embodiments. Those skilled in the art can determine the order between steps S1 and S2 according to the actual situation in actual operation, and this article does not impose further restrictions.

[0062] To improve the connection reliability between the first conductive layer and the first substrate layer, optionally, as follows: Figure 6 As shown, the present invention provides another specific embodiment of the encapsulation method, wherein step S1 in the above embodiment may further include: S11, providing a positioning layer with a positioning groove on the first surface of the first substrate layer, and S12, providing a first conductive layer in the positioning groove.

[0063] Specifically, the positioning layer can be made of light-sensitive glue, and the positioning layer with positioning grooves can be formed using a specific mold, and then the first conductive layer can be formed in the aforementioned positioning grooves. Accordingly, during the preparation of the first electrode, the first positioning layer can be arranged between the first substrate layer and the photoelectric conversion layer, and the positioning grooves can face the photoelectric conversion layer, so as to ensure the normal operation of the entire photovoltaic module. In this case, the preparation process of the first electrode further includes S13, preparing the first electrode which is sequentially stacked by the first substrate layer, the positioning layer, the first conductive layer and the photoelectric conversion layer. Accordingly, the preparation sequence of the first substrate layer, the positioning layer and the photoelectric conversion layer can also be determined according to actual conditions, which is not specifically limited herein.

[0064] In order to further improve the power generation performance of the entire photovoltaic module, preferably, the photovoltaic module provided by the present application can further include a light-absorbing layer, and then, as shown in Figure 7 It is shown that the present application provides still another specific embodiment of the preparation method, which includes S14, arranging the light-absorbing layer on the first surface of the first conductive layer, and S15, arranging the first substrate layer on the first surface of the light-absorbing layer.

[0065] Specifically, the light-absorbing layer can be made of dark color, preferably black, high polymer material, so as to provide excellent light energy for the photoelectric conversion layer. During the preparation of the first electrode, the light-absorbing layer can be formed on the first substrate layer by co-evaporation method or sputtering method, and the first conductive layer is formed on the surface of the light-absorbing layer. The surface of the first conductive layer also forms the photoelectric conversion layer. Accordingly, in this case, the preparation process of the first electrode further includes S16, preparing the first electrode which is sequentially stacked by the first substrate layer, the light-absorbing layer, the first conductive layer and the photoelectric conversion layer.

[0066] Based on the preparation method provided in the above embodiments, as shown in Figure 8 This embodiment further improves the previous embodiment, that is, a heat dissipation layer is additionally arranged in the first electrode, and the heat dissipation layer is arranged between the light-absorbing layer and the first substrate layer. Further, the preparation method provided by the present application further includes S17, arranging the heat dissipation layer on the first surface of the light-absorbing layer, and S18, arranging the first substrate layer on the first surface of the heat dissipation layer.

[0067] Specifically, the heat dissipation layer can also be formed between the first substrate layer and the heat dissipation layer by co-evaporation method or sputtering method, so as to improve the heat dissipation performance of the photovoltaic module provided by the present application, and further improve the power generation performance of the photovoltaic module. Accordingly, the preparation process of the first electrode can further include S19, forming the first electrode which is sequentially stacked by the first substrate layer, the heat dissipation layer, the light-absorbing layer, the first conductive layer and the photoelectric conversion layer.

[0068] Similarly, in order to ensure that the second substrate layer and the second conductive layer have a reliable connection relationship, the present application is further improved for the first embodiment, and as shown in Figure 9 The present application provides another specific embodiment of the preparation method, and the step S2 can further include: S21, arranging a positioning layer with a positioning groove on the first surface of the second substrate layer, and S22, arranging the second conductive layer in the positioning groove.

[0069] Specifically, the positioning layer can also be made of photosensitive glue, and the specific structure and size thereof can be determined according to the actual size of the second substrate layer. In this case, the preparation process of the second electrode can further include S23, forming a second electrode in which the second substrate layer, the positioning layer and the second conductive layer are stacked in sequence.

[0070] It should be noted that the above-mentioned embodiments of the present application can be freely combined according to actual needs to ensure that the photovoltaic module can work normally, and the present application is not limited in this regard.

[0071] In the description of the present application, it should be noted that the terms "upper", "lower" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0072] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "communication", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly communicated, or it can be indirectly communicated through an intermediate medium, or it can be the communication between the two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0073] The above-mentioned only for the preferred embodiments of the present application, and not to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included in the protection scope of the present application.

Claims

1. A solar cell, characterized in that, include: A first electrode, comprising a first substrate layer, a first conductive layer, and a photoelectric conversion layer sequentially stacked; a second electrode, comprising a second substrate layer and a second conductive layer stacked; a conductive connection layer, wherein the photoelectric conversion layer and the second substrate layer are connected through the conductive connection layer; at least one of the first substrate layer and the second substrate layer has a water permeability coefficient of not more than 10. ﹣2 Made of water-resistant material with a speed of cm / s; It also includes a positioning layer, wherein the positioning layer is disposed between the first substrate layer and the first conductive layer, and between the second conductive layer and the second substrate layer, the positioning layer having a positioning groove, and the first conductive layer and the second conductive layer are both disposed in the corresponding positioning groove.

2. The solar cell according to claim 1, characterized in that, The first electrode further includes a light-absorbing layer, which is disposed between the first substrate layer and the first conductive layer.

3. The solar cell chip according to claim 2, characterized in that, The first electrode further includes a heat dissipation layer, which is disposed between the first substrate layer and the light-absorbing layer.

4. A method for fabricating a solar cell, used to form the solar cell according to any one of claims 1-3, characterized in that, include: A first electrode is fabricated by sequentially stacking a first substrate layer, a first conductive layer, and a photoelectric conversion layer; A second electrode is prepared by stacking a second substrate layer and a second conductive layer; The first surface of the second substrate layer is connected to the first surface of the photoelectric conversion layer through a conductive connection layer.

5. The preparation method according to claim 4, characterized in that, Also includes: A positioning layer with positioning grooves is provided on the first surface of the first substrate layer; The first conductive layer is disposed within the positioning groove.

6. The preparation method according to claim 4, characterized in that, Also includes: A light-absorbing layer is formed on the first surface of the first conductive layer; The first substrate layer is disposed on the first surface of the light-absorbing layer.

7. The preparation method according to claim 6, characterized in that, Also includes: A heat dissipation layer is disposed on the first surface of the light-absorbing layer; A first substrate layer is disposed on the first surface of the heat dissipation layer.

8. The preparation method according to claim 4, characterized in that, Also includes: A positioning layer with positioning grooves is provided on the first surface of the second substrate layer; The second conductive layer is disposed within the positioning groove.

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