Systems and methods for operating a mold detection device

Abstract

A system for detecting mold includes a housing that defines a chamber and an opening through a surface. The system includes a movable grating for selectively covering the opening. The system includes a substrate that is treated to promote mold growth. The system includes a mechanism for moving the substrate to move a previously unexposed portion into the chamber. The system includes a thermal control system for maintaining a predetermined environmental condition in the chamber. The system includes a sensor configured to detect mold growth in the chamber. The system includes a mold inhibitor that kills mold in the chamber when activated. The system includes a controller for coordinating the operation of the components to detect mold growth in the environment.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 62 / 787,062, filed on December 31, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This application generally relates to an integrated sensor for detecting mold in an environment. Background Art

[0004] In many environments, mold can become a serious problem. Prolonged exposure to mold can cause health problems. Excessive mold growth can soil or degrade the surfaces of structures. In addition, the presence of mold can indicate moisture problems in a structure. Typically, mold problems can exist for some time without being detected. In some cases, mold growth is easily visible and can be detected by visual inspection. In many cases, mold is present but not easily visible to an observer. Ideally, it is desirable to detect mold before it can cause health or structural problems.

[0005] Mold spreads by releasing spores into the air. When mold spores land on a medium that is suitable for growth, they can grow. Suitable growth conditions include appropriate levels of nutrients, water, and pH balance. Mold spores that do not land on such a medium can remain inactive and can be carried by the air. A certain concentration of mold spores is found in most air. Problem areas may have a higher concentration of mold spores.

[0006] Typical methods for detecting mold are to collect surface or air samples at the affected location. The particulate matter can be accumulated or placed on a microscope slide. An expert can observe the slide through a microscope to identify the mold and determine the mold concentration and the type of mold present. These methods generally require collecting the sample and sending it to a laboratory that has expertise in mold detection. This process is often labor - intensive and quite expensive. In addition, receiving the results may take some time. Existing methods do not allow for continuous sampling of an area. Summary of the Invention

[0007] A mold sensor is configured to detect mold in a surrounding area. The mold sensor includes various components coordinated and managed by a control device. A method of operating the mold sensor can include positioning a growth material in a predetermined location. The method also includes exposing the growth material to an air stream that may include mold spores. The method also includes positioning the growth material in an enclosed chamber and providing conditions that encourage mold growth. The method includes using a sensing device to detect the presence of mold. The method also includes operating a source to eliminate the mold that has grown.

[0008] A system for detecting mold includes a housing that defines a chamber and an opening through a surface of the housing. The system includes a movable grate disposed on the housing and configured to selectively cover the opening. The system includes a substrate treated to promote mold growth and a substrate advancement mechanism configured to selectively move an unexposed portion of the substrate into the chamber and move an exposed portion of the substrate out of the chamber. The system includes a temperature sensor disposed in the chamber and a heating element disposed in the chamber. The system includes a sensor and a light source, the sensor configured to detect mold growth on the substrate within the chamber, the light source disposed in the chamber and configured to kill mold within the chamber when activated. The system includes a controller programmed to operate the substrate advancement mechanism to advance an unexposed portion of the substrate into the chamber in response to initiating a mold detection cycle.

[0009] The controller may further be programmed to actuate the movable grate to allow air to enter the chamber for a predetermined duration. The controller may further be programmed to operate the heating element to maintain a predetermined temperature within the chamber during the mold detection cycle. The controller may further be programmed to operate the sensor to detect the amount of mold present within the chamber during the mold detection cycle. The controller may further be programmed to activate the light source to kill mold within the chamber in response to completing the mold detection cycle. The controller may further be programmed to, when the light source is activated, operate the sensor to detect a change in mold growth. The sensor may be a gas sensor configured to measure microbial volatile organic compounds (mVOCs) in the chamber caused by mold growth. The controller may further be programmed to activate the light source during the mold detection cycle to regulate the mold growth rate within the chamber. The controller may further be programmed to cause the light source to produce pulses and evaluate the difference in measurements from the sensor before and after exposure to the light source to determine mold intensity.

[0010] A method includes activating, by a controller, a substrate advancement mechanism to move an unexposed portion of a substrate treated with nutrients into a chamber defined by a housing. The method includes opening, by the controller, a door covering an opening defined by the housing to allow air to enter the chamber for a predetermined time. The method includes sampling, by the controller, a sensor configured to detect the presence of mold within the chamber.

[0011] The method may further include, in response to completion of a mold detection cycle, activating a light source disposed within the chamber for a predetermined amount of time, the light source configured to kill mold within the chamber. The method may further include generating an alert via a controller in response to detecting the presence of mold within the chamber. The method may further include generating an alert in response to determining that a mold concentration in the air exceeds a predetermined concentration based on an amount of mold growth detected within the chamber. The method may further include sampling a sensor to obtain a baseline sensor measurement prior to opening the door. The method may further include generating an alert in response to a difference between a current sensor measurement and the baseline sensor measurement exceeding a predetermined threshold indicative of a predetermined concentration of mold in the environment. Activating the substrate advancement mechanism may include operating a motor to cause a rolling member to rotate to advance the substrate into the chamber.

[0012] The method includes operating an electric motor coupled to a reel via a controller, the reel attached to a substrate treated with a nutrient, to expose a portion of the substrate to air for a predetermined time. The method includes, in response to termination of the predetermined time, operating the electric motor via the controller to advance the portion of the substrate into the chamber. The method includes operating a thermal control element via the controller to maintain a temperature within the chamber at a predetermined temperature. The method includes monitoring, via the controller, a sensor disposed within the chamber to detect mold growth on the substrate.

[0013] The method may further include activating a light source disposed within the chamber to kill mold in response to termination of a monitoring period. The method may further include activating a light source disposed within the chamber during monitoring to regulate a growth rate of mold within the chamber. The method may further include causing the light source disposed within the chamber to produce a pulse and evaluating a difference in measurements from the sensor before and after exposure to the light source to determine mold intensity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Depicts a single-chamber mold sensor configuration with an integrated sensor module.

[0015] Figure 2 Depicts a single-chamber mold sensor configuration with a multi-piece sensor.

[0016] Figure 3 Depicts an alternative configuration of a single-chamber mold sensor with an integrated sensor.

[0017] Figure 4 Depicts an alternative configuration of a single-chamber mold sensor with a multi-piece sensor.

[0018] Figure 5 Depicts an example of a multi-chamber mold sensor configuration.

[0019] Figure 6Depicts an example of a single-chamber mold sensor configured to expose a surface to an air flow outside the single chamber.

[0020] Figure 7 Depicts a second example of a single-chamber mold sensor configured to expose a surface to an air flow outside the single chamber.

[0021] Figure 8 Depicts a growth surface including strips of different nutrient treatments.

[0022] Figure 9 Depicts a growth surface having alternating surface type segments.

[0023] Figure 10 Depicts a growth surface including zones of different nutrient treatments.

[0024] Figure 11 Depicts an example of a belt-based surface replacement mechanism.

[0025] Figure 12A and Figure 12B Depicts different views of a drum-based surface replacement mechanism.

[0026] Figure 13A Depicts an example of a disk-based surface replacement mechanism.

[0027] Figure 13B Depicts an example of a disk configuration for a disk-based surface replacement mechanism.

[0028] Figure 14 Depicts possible configurations of a capacitive sensor for detecting mold on a growth surface.

[0029] Figure 15 Depicts possible configurations of a growth surface having integrated electrical contacts.

[0030] Figure 16 Depicts an example of a growth surface having conductive strips.

[0031] Figure 17 Depicts an example of a rolling element-based electrical contact for interacting with the conductive strips of a growth surface.

[0032] Figure 18A and Figure 18B Depicts different views of an electrode-based electrical contact for interacting with the conductive strips of a growth surface.

[0033] Figure 19 Depicts an example of a growth surface configured to measure and control the pH level of the growth surface.

[0034] Figure 20Depicts a mold sensor system including a mold sensor and a communication network.

[0035] Figure 21 Depicts a flowchart of a possible sequence of operations for operating a mold sensor. Detailed Description

[0036] Embodiments of the present disclosure are described herein. However, it should be understood that the disclosed embodiments are merely examples, and other embodiments can take various and alternative forms. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Thus, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching one skilled in the art to employ the embodiments in various ways. As will be understood by those of ordinary skill in the art, the various features shown and described with reference to any one figure can be combined with features shown in one or more other figures to produce embodiments not explicitly shown or described. The combinations of features shown provide representative embodiments for typical applications. However, for a particular application or implementation, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desirable.

[0037] An improved way of detecting mold can be an integrated sensor device that can detect the presence of mold without having to send a sample to a laboratory. Another advantage of the integrated sensor is that the mold sensor can be placed in a location to continuously monitor that location. It can generate an alarm when mold becomes a problem. A mold sensor is disclosed herein that is configured to sample the air and detect the concentration of mold in the air. The mold sensor can be configured to create a small enclosed environment that is conducive to mold growth. Mold growth can be detected in a variety of ways.

[0038] This application first discloses the general configuration and structural elements for a mold sensing device. Then specific mold sensing techniques and strategies applicable to the general configuration are disclosed. Then various operating modes and strategies are disclosed. A mold sensing system can include multiple mold sensors. The mold sensors can belong to a common design with communication capabilities. The mold sensing system can include a reference mold sensor and a target area mold sensor. The reference mold sensor can provide information on the expected mold concentration in the environment (e.g., outdoors). The target mold sensor can provide information on the mold concentration in the area of interest (e.g., basement, living room). The mold sensing system can include results from multiple sensors to accurately determine the mold concentration in the target area.

[0039] Figure 1A diagram depicting the configuration of a first mold sensor configuration 100. The first mold sensor configuration 100 may include a housing 102 that defines a cavity 103. The housing 102 may define a bottom opening to allow the surface within the cavity 103 to be exposed (e.g., the housing 102 has no bottom). The housing 102 may be constructed of plastic, metal, and / or other suitable materials that do not outgas or otherwise disadvantage mold / bacterial growth. The surface of the housing 102 within the cavity 103 may be coated with a layer to avoid or inhibit mold growth (e.g., an alkaline coating with pH > 7). Although shown as a cube, the shape of the housing 102 may be other shapes. The specific shape of the housing 102 may depend on other mechanisms coupled to the housing 102.

[0040] The first mold sensor configuration 100 may include an air inlet portal 104. The air inlet portal 104 may be configured to define an air flow path 106 into the cavity 103. In some configurations, the housing 102 may define an opening to act as the air inlet portal 104. In some configurations, the air inlet portal 104 may be configured to selectively open and close. For example, a movable grille or door may be placed above the opening defined by the housing 102. The movable grille or door may be electrically actuated to an open or closed position by a solenoid. A spring mechanism may hold the movable grille in a normally closed position. The solenoid may be actuated by a control device 116. The movable grille or door may be electrically, magnetically, or mechanically operated. Some configurations may include an air flow sensor 119 for determining the air flow into the cavity 103. The air flow sensor 119 may be electrically coupled to the control device 116. Although not shown in all configurations, the air flow sensor 119 may be included in other configurations described herein.

[0041] The control device 116 may be a controller including a processing unit and non-volatile and volatile memories. The controller may be programmed to perform various operations related to operating the mold sensor. The control device 116 may further include any electrical interface for interacting with actuators and sensors that are part of the mold sensor. Additionally, the control device 116 may include a network interface for accessing a network. The network interface may be wired and / or wireless. The network interface may provide a communication path for accessing the Internet / World Wide Web. The control device 116 may be mounted on the housing 102.

[0042] The first mold sensor configuration 100 may further include a growth surface 112. The growth surface 112 may be a surface that is exposed within the cavity 103 and suitable for mold growth. In some configurations, the growth surface 112 may be exposed to the air outside the cavity 103. For example, the growth surface 112 may be exposed to the environment outside the cavity 103 for air sampling, and then the growth surface 112 may be moved into the cavity 103 for mold growth. The air inlet port 104 may be configured to define an air flow path 106 such that air is directed to flow toward the growth surface 112. The growth surface 112 may be configured as a surface that facilitates the collection of mold spores from the air. The growth surface 112 may be configured as a medium suitable for promoting mold growth. The growth surface 112 may be treated with nutrients that promote mold growth. For example, the nutrients may include organic substances, salts, agar, and / or sugars. The growth surface 112 may further be configured to supply a sufficient moisture content to encourage mold growth, or may be packaged in a manner that retains the moisture content until it is used. The growth surface 112 may include antibacterial chemicals or treatments that prevent bacterial growth. The growth surface 112 may be a strip, a film, or a filter. The strip, film, or filter may be treated with various substances to promote the growth of mold. The strip, film, or filter may be permeable or impermeable. One or more temperature and humidity / moisture sensors may be integrated with the growth surface 112 to allow monitoring of the mold growth environment.

[0043] The specific conditions for promoting mold growth may depend on the type of mold to be grown. Different molds may prefer different nutrient environments. The growth surface 112 may further include zones (e.g., strips) configured to grow different types of molds. For example, each zone of the growth surface 112 may be treated with a different nutrient mixture that promotes the growth of a different type of mold. The advantage of this configuration is that the type of mold present can be determined by monitoring the mold growth in each zone.

[0044] The first mold sensor configuration 100 may include a sensing device 110 configured to sense mold growing on the growth surface. The placement of the sensing device 110 may depend on the type of sensing being performed. Additionally, the orientation of the sensing device 110 relative to the housing 102 may depend on the type of the sensing device 110. For example, Figure 1Depicts a sensing device 110 mounted at an angle relative to the housing 102. Some sensing device configurations may perform better when oriented towards or through the growth surface 112. The sensing device 110 may use a variety of techniques. The sensing device 110 may be electrically connected to the control device 116. The sensing device 110 may be contained within a single module coupled to the housing 102. Some sensor configurations (e.g., optical or audio) may utilize a source module and a receiver module. The sensing device 110 may integrate the source module and the receiver module into a single unit. In some configurations, the sensing device 110 may include multiple sensing devices of the same or different technologies, which are placed at different positions within the housing 102. Various configurations of the sensing device 110 are disclosed herein.

[0045] The first mold sensor configuration 100 may include a mold inhibitor 108 configured to eliminate mold. The mold inhibitor 108 may be mounted on one side of the housing 102. For example, the mold inhibitor 108 may be one or more ultraviolet (UV) light sources. For example, the mold inhibitor 108 may be a single UV light source or an array of UV light sources. The UV light source may be a source that irradiates a diverging beam, which may irradiate the entire growth surface 112 exposed within the chamber 103. The UV light source may be a UV source with a beam diverging component to expand the UV beam to irradiate the entire growth surface 112 exposed within the chamber 103. The mold inhibitor 108 may be a UV light source with a driver to cause the UV light source to sweep across the growth surface 112 exposed within the chamber. Additionally, the mold inhibitor 108 may be configured to eliminate mold on other surfaces (e.g., inner walls) of the chamber 103 and the air inlet port 104. The mold inhibitor 108 may be electrically actuated by the control device 116. The mold inhibitor 108 may be actuated for a predetermined period to eliminate the mold that has grown. The control device 116 may activate the mold inhibitor 108 after completing a measurement cycle to eliminate the mold that has grown during the measurement cycle. The mold inhibitor 108 may be operated to eliminate the mold within the chamber 103 to define a baseline condition before starting a measurement cycle.

[0046] The first mold sensor configuration 100 may further include a surface replacement mechanism 114 configured to support the growth surface 112 and facilitate replacement of the growth surface 112. In some configurations, the growth surface 112 may be fixed to the surface replacement mechanism 114. The surface replacement mechanism 114 may be configured to selectively couple to the housing 102. After completion of a measurement cycle, the growth surface 112 may be replaced to enable another measurement cycle. When desired, the surface replacement mechanism 114 may be attached to or detached from the housing 102 to replace the growth surface 112. The housing 102 may define an opening in the bottom surface to expose the growth surface 112 to the chamber 103 when the surface replacement mechanism 114 is coupled to the housing 102. In some configurations, the housing 102 may be constructed without a bottom surface.

[0047] In some configurations, the growth surface 112 may be movable and the surface replacement mechanism 114 may be configured to move the growth surface 112 to another location. The surface replacement mechanism 114 may be configured to store portions of the growth surface 112 that are currently not exposed within the housing 102. The stored portions may include unused and used portions. The surface replacement mechanism 114 may be configured to be electrically / mechanically actuated and may be electrically coupled to the control device 116. Various configurations of the surface replacement mechanism 114 are discussed in more detail in subsequent portions of this document. In some configurations, the surface replacement mechanism 114 may include the ability to electrostatically charge the growth surface 112 to improve the ability to attract mold spores.

[0048] The first mold sensor configuration 100 may include one or more thermal control elements 120 configured to change the temperature in the chamber 103 to promote mold growth. Additional thermal control elements may be embedded above, within, or below the growth surface 112. The thermal control element 120 may be electrically coupled to the control device 116. The thermal control element 120 may include a thermoelectric cooling element. For example, the thermal control element 120 may be a thermoelectric heat pump (e.g., a Peltier device or a heat pump). The thermal control element 120 may include a heating element, such as a resistive element. The thermal control element 120 may include an infrared source (IR). The thermal control element 120 may be a single element or may include multiple thermal control elements positioned at different locations in the chamber 103 to independently control the temperature in different regions of the chamber 103. In some configurations, the mold sensor may include a mechanism for regulating the humidity within the chamber 103. Different environmental conditions (e.g., temperature) within the same nutrient zone may be used to distinguish different types of mold. For example, a given nutrient zone exposed to different environmental conditions may create multiple zones that are favorable for the growth of different types of mold. The thermal control element 120 may be configured to create different temperature conditions in different zones of the growth surface 112. For example, by placing the thermal control element 120 on one side of the chamber 103, the temperature may increase or decrease as the distance from the thermal control element 120 increases. This may provide different environmental conditions for different parts of the growth surface 112.

[0049] The first mold sensor configuration 100 may include a chamber environmental sensor 118 configured to measure the environmental conditions within the chamber 103. The chamber environmental sensor 118 may be electrically connected to the control device 116. The chamber environmental sensor 118 may include one or more temperature sensors, humidity sensors, pressure sensors, and / or gas sensors. The temperature sensor may be positioned in the path of the airflow entering the chamber 103. The chamber environmental sensor 118 may be monitored at periodic intervals to determine the condition status within the chamber 103.

[0050] An external environmental sensing module 122 may be present to provide information about the environment external to the chamber 103. The environmental sensing module 122 may include a temperature sensor, a humidity sensor, a pressure sensor, and / or a gas sensor. The environmental sensing module 122 may be electrically coupled to the control device 116. The external environmental sensing module 122 may be integrated with the housing 102 or may be a separate module that communicates with the control device 116. Communication between the control device 116 and the external environmental sensing module 122 may occur via a wireless communication protocol (e.g., Bluetooth, Bluetooth LE, WiFi, optical). The environmental sensing module 122 may provide information about conditions around or near the first mold sensor configuration 100 that may affect mold growth. The control device 116 may further be configured to receive information from an external network (e.g., the Internet) to provide additional context for mold detection. The presence and / or concentration of mold spores may vary depending on the time of day, season, and environmental parameters. The control device 116 may collect this additional information and utilize it during the mold detection process. The control device 116 may use this information to determine the conditions for initiating a measurement cycle. For example, during the year when mold spores are present at a higher concentration, the control device 116 may initiate measurement cycles more frequently.

[0051] Figure 2 A second mold sensor configuration 200 is depicted. The second mold sensor configuration 200 may be configured for sensors in which a source module and a receiving module are not integrated. The second mold sensor configuration 200 may include a sensor source module 210 and a sensor receiving module 212. For example, in an optical sensing system, the sensor source module 210 may be a light source and the sensor receiving module 212 may be a light sensor. The transmitting and receiving modules may operate cooperatively to detect mold within the chamber 103. The sensor source module 210 and the sensor receiving module 212 may be electrically coupled to the control device 116. In operation, the control device 116 may activate the sensor source module 210 and receive a signal from the sensor receiving module 212.

[0052] In the depicted configuration, the sensor source module 210 is coupled to the sidewall of the housing 102. The sensor receiving module 212 is coupled below the growth surface 112. The sensor receiving module 212 may be mounted to a frame or platform below the growth surface 112. The sensor source module 210 and the sensor receiving module 212 may be aligned to ensure that the sensor receiving module 212 can receive a signal from the sensor source module 210. In other configurations, the positions of the sensor receiving module 212 and the sensor source module 210 may be reversed.

[0053] The first mold sensor configuration 100 can be described as having an integrated mold sensing device. That is, the sensing device 110 is a single module coupled to the housing 102. The second mold sensor configuration 200 can be described as having a two-part sensing device. The second mold sensor configuration 200 can be useful for sensing configurations that measure properties transmitted through the growth surface 112.

[0054] The air inlet port 104, the mold inhibitor 108, the (one or more) sensing devices, the thermal control element 120, and the chamber environment sensor 118 can be mounted in various configurations. The specific locations chosen can depend on the packaging limitations of the housing and / or performance considerations for mold detection. The location of the (one or more) sensing devices can be selected depending on the type of sensing device used. For example, a sensing device using an optical sensor can be positioned differently from a sensing device configured to measure electrical properties.

[0055] Figure 3 A third mold sensor configuration 300 is depicted. The third mold sensor configuration 300 can include a housing 302 that defines a chamber 303. The third mold sensor configuration 300 can include a side air inlet port 304. The side air inlet port 304 can be configured to create an air flow path 306 into the chamber 303. In some configurations, the side air inlet port 304 can redirect the air flow so that the air flow is directed towards the growth surface 112. For example, the side air inlet port 304 can include angled slats or bars to redirect the air flow. In some configurations, the housing 302 can define an opening to act as the side air inlet port 304. In some configurations, the side air inlet port 304 can be configured to selectively open and close. For example, a movable grille or door can be placed over the opening defined by the housing 302. The movable grille or door can be electrically actuated by a solenoid into an open or closed position. A spring mechanism can hold the movable grille in a normally closed position. The solenoid can be actuated by the control device 116. The movable grille or door can be electrically, magnetically, or mechanically operated.

[0056] The third mold sensor configuration 300 can include a top-mounted mold inhibitor 308. The top-mounted mold inhibitor 308 can function as described for the mold inhibitor 108 previously referenced Figure 1 The third mold sensor configuration 300 can include a top-mounted sensing device 310. The top-mounted sensing device 310 can function as described for the sensing device 110 previously referenced Figure 1 The top-mounted mold inhibitor 308 and the sensing device 310 can be integrated into a single unit (e.g., a sensor / inhibitor module). The integrated device can facilitate the assembly of the mold sensor.

[0057] The third mold sensor configuration 300 describes a configuration with different air inlet ports and sensor locations. The components can generally function as previously described.

[0058] Figure 4 The fourth mold sensor configuration 400 is depicted. The fourth mold sensor configuration 400 can be configured for a sensor in which a source module and a receiving module are not integrated therein. The fourth mold sensor configuration 400 can include a top-mounted sensor source module 410 and a sensor receiving module 412. For example, in an optical sensing system, the top-mounted sensor source module 410 can be a light source, and the sensor receiving module 412 can be a light sensor. The transmitting and receiving modules can operate cooperatively to detect mold. The top-mounted sensor source module 410 and the sensor receiving module 412 can be electrically coupled to the control device 116. In operation, the control device 116 can activate the top-mounted sensor source module 410 and receive signals from the sensor receiving module 412.

[0059] In the depicted configuration, the top-mounted sensor source module 410 is coupled to the top wall or top plate of the housing 302. The sensor receiving module 412 is coupled below the growth surface 112. The top-mounted sensor source module 410 and the sensor receiving module 412 can be aligned to ensure that the sensor receiving module 412 can receive signals from the top-mounted sensor source module 410. The top-mounted mold inhibitor 308 and the top-mounted sensor source 410 can be integrated into a single unit (e.g., a sensor source / inhibitor module). The integration means can facilitate the assembly of the mold sensor. In other configurations, the positions of the sensor source module 410 and the sensor receiving module 412 can be reversed.

[0060] Figure 5 The dual-chamber mold sensor configuration 500 is depicted. The dual-chamber mold sensor configuration 500 can include a dual-chamber housing 502 that includes a partition wall 507 defining a first chamber 503 and a second chamber 505. The first chamber 503 can be used to grow mold on a portion of the growth surface 512 that is exposed within the first chamber 503.

[0061] The dual - chamber mold sensor configuration 500 may include an air inlet port 504. The air inlet port 504 may be configured to define an air flow path 506 into the first chamber 503. In some configurations, the dual - chamber housing 502 may define an opening to act as the air inlet port 504. In some configurations, the air inlet port 504 may be configured to open and close selectively. For example, a movable grille or door may be placed over the opening defined by the dual - chamber housing 502. The movable grille or door may be electrically actuated to an open or closed position by a solenoid. A spring mechanism may hold the movable grille in a normally - closed position. The solenoid may be actuated by the control device 116. The movable grille or door may be electrically, magnetically, or mechanically operated.

[0062] The dual - chamber mold sensor configuration 500 may include one or more mold sensing devices 510 configured to sense mold growing on the growth surface 512. The placement of the sensing devices 510 may depend on the type of sensing being performed. The sensing devices 510 may use a variety of techniques. The sensing devices 510 may be electrically connected to the control device 116. The sensing devices 510 may be contained within a single module coupled to the housing 502. Various configurations of the sensing devices 510 are disclosed herein.

[0063] The dual - chamber mold sensor configuration 500 may include one or more sensor receiving modules 511. The sensor receiving modules 511 may be present in a configuration where the sensing device 510 acts as a source. The dual - chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510A configured to detect mold growth in the first chamber 503. The dual - chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510A and a single sensor receiving module 511A configured to detect mold growth in the first chamber 503. The dual - chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510B configured to detect mold growth in the second chamber 505. The dual - chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510B and a single sensor receiving module 511B configured to detect mold growth in the second chamber 505. The dual - chamber mold sensor configuration 500 may also be configured to have mold sensing devices 510A / 511A, 510B / 511B in both the first chamber 503 and the second chamber 505.

[0064] The dual - chamber mold sensor configuration 500 may include a mold inhibitor 508 configured to eliminate mold. The mold inhibitor 508 may be mounted on the side or top of the housing 502. The mold inhibitor 508 may be configured to eliminate mold in the second chamber 505. The mold inhibitor 508 may operate as previously described herein. Further, the mold inhibitor 508 may be integrated with the mold sensing device 510 as previously described herein.

[0065] The dual - chamber mold sensor configuration 500 may further include a surface replacement mechanism 514 configured to move the growth surface 512 to another position. For example, the surface replacement mechanism 514 may include one or more rolling members configured to move the growth surface 512. The growth surface 512 exposed within the first chamber 503 may be referred to as the active growth surface. The active growth surface may be the surface on which mold is to grow or is growing. The portion of the growth surface 512 exposed within the second chamber 505 may be referred to as the used surface. The used surface may be the surface on which mold has already grown. The surface replacement mechanism 514 may be configured to advance the growth surface 512 to provide a new active growth surface within the first chamber 503. The surface replacement mechanism 514 will be described in more detail herein. Another configuration may be one in which the growth surface 512 is exposed to air within the first chamber 503 and then moved to the second chamber 505 for growth, measurement, and eradication (e.g., similar to the single - chamber configuration).

[0066] The dual - chamber mold sensor configuration 500 may include a thermal control element 520 configured to change the temperature within the first chamber 503 to promote mold growth. Additional thermal control elements may be embedded above, within, or below the growth surface 512. The thermal control element 520 may be a thermoelectric element electrically driven by a control device 116. The dual - chamber mold sensor configuration 500 may also include a similar thermal control element within the second chamber 505. The thermal control element 520 may function as previously described for similar elements in other configurations.

[0067] The dual - chamber mold sensor configuration 500 may include a chamber environment sensor 518 configured to measure the environmental conditions within the first chamber 503. The chamber environment sensor 518 may be electrically connected to the control device 116. The chamber environment sensor 518 may include a temperature sensor, a humidity sensor, a pressure sensor, and / or a gas sensor. The chamber environment sensor 518 may be monitored at periodic intervals to determine the condition status within the first chamber 503. The dual - chamber mold sensor configuration 500 may also include a similar environmental sensor within the second chamber 505.

[0068] The dual - chamber mold sensor configuration 500 provides separate chambers for mold growth and eradication. The advantage of the dual - chamber mold sensor configuration 500 is that the sensor can be continuously used for mold sensing. The single - chamber configuration grows and eradicates mold in the same chamber, such that during the mold eradication phase, new samples cannot be initiated. In some configurations, the mold sensor may utilize more than two chambers. A multi - chamber mold sensor configuration may also be used. For example, different chambers may be configured to operate for different environmental parameters to create a growth environment for different types of mold.

[0069] The general operation of the dual-chamber mold sensor configuration 500 can be to expose a portion of the growth surface 512 to the first chamber 503. The air inlet port 504 can be opened for a predetermined amount of time at a predetermined time and then closed. The control device 116 can operate the thermal control element 520 and monitor the chamber environment sensor 518 to create an environment conducive to mold growth. The control device 116 can monitor the signals from the sensing devices 510 / 511 to determine if mold is present. At the completion of the measurement cycle, the control device 116 can activate the surface replacement mechanism 514 to move the growth surface 512 such that the exposed portion in the first chamber 503 is moved to the second chamber 505. A new active growth surface can be moved into the first chamber 503 to enable a new measurement cycle.

[0070] The control device 116 can then operate the mold inhibitor 508 to eliminate the mold on the growth surface 512. In configurations having a mold sensing device (e.g., 510B / 511B) in the second chamber 505, the control device 116 can monitor the corresponding signals for signs of mold elimination.

[0071] Figure 6 A first single-chamber with an external exposure configuration 600 is depicted. The single-chamber / external exposure configuration 600 can include a single chamber configured to grow and eliminate mold. The single-chamber / external exposure configuration 600 can include a housing 602 that defines the chamber 603. The single-chamber / external exposure configuration 600 also includes a growth surface 612. The growth surface 612 can be configured to be exposed to an air flow 606 external to the chamber 603.

[0072] The single-chamber / external exposure configuration 600 also includes a surface replacement mechanism 614 that is configured to move the growth surface 612 to different positions. An exposed portion 630 of the growth surface 612 can be exposed to the air flow 606 external to the chamber 603. The exposed portion 630 can be subjected to the air flow 606 for a predetermined amount of time to collect mold spores present in the air flow 606. The surface replacement mechanism 614 can be actuated to move the exposed portion 630 into the chamber 603. Accordingly, an additional previously unexposed portion of the growth surface 612 can be positioned to be the exposed portion 630. The surface replacement mechanism 614 is described in more detail herein.

[0073] The single - chamber / external - exposure configuration 600 may include a mold - sensing device 610 configured to sense mold growing on a growth surface 612. The placement of the sensing device 610 may depend on the type of sensing being performed. The sensing device 610 may use a variety of techniques. The sensing device 610 may be electrically connected to a control device 116. The sensing device 610 may be contained within a single module coupled to a housing 602. Various configurations of the sensing device 610 are disclosed herein. The single - chamber / external - exposure configuration 600 may include a sensor - receiving module 611. The sensor - receiving module 611 may be present in a configuration in which the sensing device 610 is configured as a source. The sensor - receiving module 611 may be positioned below a portion of the growth surface 612 within the chamber 603.

[0074] The single - chamber / external - exposure configuration 600 may include a mold inhibitor 608 configured to eliminate mold in the chamber 603. The mold inhibitor 608 may be mounted on the side or top of the housing 602 (depicted as on the top). The mold inhibitor 608 may operate as previously described herein. Additionally, as previously described herein, the mold inhibitor 608 may be integrated with at least a portion of the mold - sensing device 610.

[0075] The first single - chamber / external - exposure configuration 600 may include a thermal - control element 620 configured to change the temperature in the chamber 603 to promote mold growth. Additional thermal - control elements may also be embedded above, within, or below the growth surface 612. The thermal - control element 620 may be a thermoelectric element electrically driven by the control device 116. The single - chamber / external - exposure configuration 600 may include a chamber - environment sensor 618 configured to measure the environmental conditions within the chamber. The thermal - control element 620 may operate as described herein.

[0076] The first single - chamber with the external - exposure configuration 600 is partly characterized by the trajectory of the growth surface 612. As depicted, the growth surface 612 within the chamber 603 is oriented at a ninety - degree angle relative to the exposed growth surface 630. The angle is not limited to ninety degrees. The first single - chamber with the external - exposure configuration 600 allows for mold measurement when another air sample is exposed to the airflow 606.

[0077] Figure 7 A second single - chamber with an external - exposure configuration 700 is depicted. The single - chamber / external - exposure configuration 700 may include a single - chamber configured to grow and eliminate mold. The single - chamber / external - exposure configuration 700 may include a housing 702 that defines a chamber 703. The single - chamber / external - exposure configuration 700 also includes a movable growth surface 712. The movable growth surface 712 may be configured to be exposed to an airflow 706 external to the chamber 703.

[0078] The single - chamber / external - exposure configuration 700 also includes a surface replacement mechanism 714 configured to move the growth surface 712 to different positions. An exposed portion 730 of the growth surface 712 can be exposed to the air stream 706. The exposed portion 730 can be subjected to the air stream 706 for a predetermined amount of time to collect mold spores present in the air stream 706. The surface replacement mechanism 714 can be actuated to move the exposed portion 730 into the chamber 703. Thus, another portion of the growth surface 712 can be positioned as the exposed portion 730. The surface replacement mechanism 714 is described in more detail herein.

[0079] The single - chamber / external - exposure configuration 700 can include a mold sensing device 710 configured to sense mold growing on the growth surface 712. The placement of the sensing device 710 can depend on the type of sensing being performed. The sensing device 710 can use a variety of techniques. The sensing device 710 can be electrically connected to the control device 116. The sensing device 710 can be included within a single module coupled to the housing 702. Various configurations of the sensing device 710 are disclosed herein. The single - chamber / external - exposure configuration 700 can include a sensor receiving module 711. The sensor receiving module 711 can be present in a configuration where the sensing device 710 acts as a source. The sensor receiving module 711 can be positioned within the chamber 703 below the growth surface 712.

[0080] The single - chamber / external - exposure configuration 700 can include a mold inhibitor 708 configured to eliminate mold. The mold inhibitor 708 can be mounted on the side or the top of the housing 702 (depicted on the top). The mold inhibitor 708 can be configured to eliminate mold in the chamber 703. The mold inhibitor 708 can operate as previously described herein. Additionally, as previously described herein, the mold inhibitor 708 can be integrated with at least a portion of the mold sensing device 710.

[0081] The first single - chamber / external - exposure configuration 700 can include a thermal control element 720 configured to change the temperature in the chamber 703 to promote mold growth. Additional thermal control elements can be embedded above, within, or below the growth surface 712. The thermal control element 720 can be a thermoelectric element electrically driven by the control device 117. The single - chamber / external - exposure configuration 700 can include a chamber environmental sensor 718 configured to measure the environmental conditions within the chamber.

[0082] The second single cavity with the external exposure configuration 700 may be partially characterized by the locus of the growth surface 712. As depicted, the growth surface 712 within the cavity 703 is oriented in the same plane relative to the exposed growth surface 730. The second single cavity with the external exposure configuration 700 may be mounted at any angle relative to the air flow 706. The sensor may be mounted such that air impinges on the exposed growth surface 730 at a predetermined angle.

[0083] The mold sensor configurations disclosed herein may utilize a surface replacement mechanism that is configured to replace a portion of the growth surface within the detection cavity. Additionally, the surface replacement mechanism may be configured to move the exposed growth surface into the detection cavity. The growth surface or medium may be configured in a variety of ways. The growth medium may be a diaphragm or tape that is coated to create a sticky or tacky surface. The sticky surface helps to attract particles such as mold spores. Additionally, the surface of the diaphragm or tape may be coated with nutrients for mold growth. The surface of the diaphragm or tape may be coated with an antibacterial coating to prevent bacterial growth.

[0084] Different types of mold may prefer different nutrients for growth. The growth medium may be configured to encourage the growth of different types of mold. Figure 8 A possible configuration of the growth medium 800 is depicted. The growth medium 800 may include a substrate material 812. For example, the substrate material 812 may be a diaphragm, film, or tape. The substrate material 812 may be made of plastic, fabric, or other materials. In various configurations, the substrate material 812 may be formed as a strip, roller, or disk. A plurality of test sections 802 may be defined on the substrate material 812. The test sections 802 may be defined as areas or surfaces of the growth medium 800 that can be exposed within the cavity of the mold sensor. The test sections 802 may be characterized by a width 816 and a length 814. The width 816 and the length 814 may correspond to the dimensions of the cavity or the dimensions of the opening used to expose the test sections 802 within the cavity. The test sections 802 may be repeated continuously on the substrate material 812. During operation of the mold sensor, the test sections 802 may be exposed to air and processed through a measurement cycle. The remaining test sections defined on the substrate material 812 may be enclosed by the surface replacement mechanism.

[0085] The test section 802 can be divided into multiple strips. For example, a first strip 804, a second strip 806, a third strip 808, and a fourth strip 810 can be defined on the test section 802. Each strip can have a coating that is conducive to the growth of a different type of mold. For example, the first strip 804 can include a first nutrient coating that is conducive to the growth of a first mold type. The second strip 806 can include a second nutrient coating that is conducive to the growth of a second mold type. The third strip 808 can include a third nutrient coating that is conducive to the growth of a third mold type. The fourth strip 810 can include a fourth nutrient coating that is conducive to the growth of a fourth mold type. Within each strip, different environmental conditions (e.g., temperature) can be applied during the measurement period by the operation of a thermal control element. Within each strip, different environmental sensors (e.g., temperature, humidity, pH) can be embedded above, within, or below the strip to monitor the conditions that promote mold growth. The sensor information can be used to back-calculate the concentration of mold spores in the air.

[0086] The division of the test section 802 allows the mold sensor to effectively detect the presence of different types of molds. Additionally, different strip combinations can be generated depending on the type of mold expected to be present in the environment during testing. A test section with a single nutrient coating may not be able to effectively detect all types of molds. Another advantage of the strips is that the mold sensor can provide a more detailed report on the type of mold present. By sensing the presence and / or concentration of mold in each strip, a more detailed report can be provided.

[0087] Figure 9 Another possible configuration of the growth medium 900 is depicted. The growth medium 900 can include alternating growth regions defined on a substrate. The growth medium 900 can include a first growth region 902. Adjacent to the first growth region 902 can be a non-growth region 904. A second growth region 906 can be defined adjacent to the non-growth region 904. The pattern of growth regions and non-growth regions can be repeated along the entire length of the growth medium 900. The non-growth region 904 can be a region configured to avoid mold growth (e.g., uncoated or having a coating with a high pH value). The non-growth region 904 can be a non-sticky or non-tacky region. The non-growth region 904 can be configured to provide a buffer between the first growth region 902 and the second growth region 906. Each region can be characterized by a width 910 and a length 908. The width 910 and the length 908 can correspond to the dimensions of the cavity or the dimensions of the opening used to expose the growth region 902 to the cavity. The dimensions of each alternating region can be defined similarly.

[0088] An alternative growth medium configuration 900 in which the area exposed to air is outside the chamber can be useful. In such configurations, continuous mold detection may not be required. The non-growth area 904 can be positioned in the air-exposed zone without concern that mold spores will adhere to the surface. When ready to perform a measurement cycle, the growth medium 900 can be advanced by a surface replacement mechanism so that the second growth area 906 is exposed to air before being advanced into the chamber. When the second growth area 906 is exposed to air, the non-growth area 904 can be in the chamber. Note that the first growth area 902 and the second growth area 906 can include strips as described in reference Figure 8 as described.

[0089] Figure 10 An alternative configuration of the growth medium 1000 is depicted. The growth medium 1000 can include a substrate material 1004. For example, the substrate material 1004 can be a diaphragm, a membrane, or a strip. The substrate material 1004 can be made of plastic, fabric, or other materials. In various configurations, the substrate material 1004 can be formed into a strip, a drum, or a disk. A plurality of test sections 1002 can be defined on the substrate material 1004. The test sections 1002 can be defined as areas or surfaces of the growth medium 1000 that can be exposed within the chamber of the mold sensor. The test sections 1002 can be characterized by a width 1018 and a length 1016. The width 1018 and the length 1016 can correspond to the dimensions of the chamber or the dimensions of the opening used to expose the test sections 1002 within the chamber. The test sections 1002 can be repeated continuously on the substrate material 1004. During operation of the mold sensor, the test sections 1002 can be exposed to air and processed through a measurement cycle. The remaining test sections defined on the substrate material 1004 can be enclosed by a surface replacement mechanism.

[0090] The test section 1002 can define one or more growth zones. For example, a first growth zone 1006, a second growth zone 1008, a third growth zone 1010, and a fourth growth zone 1012 can be defined. Each growth zone can have a coating or treatment that is conducive to the growth of a different type of mold. For example, the first growth zone 1006 can be treated with a first nutrient coating that is conducive to the growth of a first type of mold. The second growth zone 1008 can be treated with a second nutrient coating that is conducive to the growth of a second type of mold. The third growth zone 1010 can be treated with a third nutrient coating that is conducive to the growth of a third type of mold. The fourth growth zone 1012 can be treated with a fourth nutrient coating that is conducive to the growth of a fourth type of mold. The test section 1002 can further include a non-growth area 1014. The non-growth area 1014 can be defined as the area between the growth zones within the test section 1002. The non-growth area 1014 can be an area of the substrate material 1004 that has not been treated to promote mold growth. The growth zones are depicted as square, but can have different shapes. For example, the growth zones can be circular or rectangular. Further, although the pattern is shown as being generally symmetric, the pattern can also be asymmetric. The test section 1002 can be repeated continuously on the substrate material 1004. During the operation of the mold sensor, the test section 1002 can be exposed to air and processed through a measurement cycle. The remaining test sections defined on the substrate material 1004 can be enclosed by a surface replacement mechanism.

[0091] The test section 1002 can define a pattern that repeats on the substrate material 1004. The pattern can repeat at a distance that is approximately the length 1016 of the test section 1002. Each growth zone can be conducive to the growth of a specific type of mold. The division of the test section 1002 allows the sensor to effectively detect the presence of different types of mold. Additionally, different combinations of growth zones can be produced depending on the types of mold expected to be present in the environment at the time of testing. Another advantage of the different growth zones is that the mold sensor can provide a more detailed report about the types of mold present. By sensing the presence and / or concentration of mold in each growth zone, a more detailed report can be provided. The non-growth area 1014 can be useful for sensor calibration. Since it is expected that mold will not grow on the non-growth area 1014, the mold sensor can use this area to calibrate the sensing device.

[0092] The characteristics of each growth surface configuration can be combined to define additional growth surfaces. For example, Figure 8 and Figure 10 the configuration can include alternating zones that allow mold growth and prevent mold growth. The specific characteristics selected for the growth surface can depend on the mold sensor configuration. Although the growth surface configuration is depicted as strips, the growth surface configuration can be formed on the surface of a drum or a disk in a corresponding manner.

[0093] The mold sensor configuration can include a surface replacement mechanism. In some configurations, the surface replacement mechanism can be configured as a disposable cartridge that can be mounted on or removed from the mold sensor. The disposable surface replacement mechanism can include a fixed growth surface that is exposed in a cavity when the mechanism is attached to the mold sensor housing.

[0094] The surface replacement mechanism can also be configured to advance the growth surface relative to the cavity. The surface replacement mechanism can be electrically controlled by the control device 116. The surface replacement mechanism can be configured to store a predetermined amount of the growth surface that can be fed into the cavity for a measurement cycle. The surface replacement mechanism can also be configured to store the used growth surface that has been processed through a measurement cycle.

[0095] Figure 11 A side view depicting a possible configuration of a belt-based surface replacement mechanism 1100 configured to advance a belt, membrane, or diaphragm is shown. The belt-based surface replacement mechanism 1100 can include a belt housing 1104. The belt housing 1104 can define a used belt cavity 1114 and an unused belt cavity 1116. The housing 1104 can include a partition wall 1118 between the used belt cavity 1114 and the unused belt cavity 1116. The belt housing 1104 can be configured to be coupled to a growth cavity housing 1102 that defines a growth cavity 1103.

[0096] The belt-based surface replacement mechanism 1100 can include a reel or spool 1108 that rotates about an axis. The belt-based surface replacement mechanism 1100 can include a driven reel or spool 1106 that is driven by an electric drive unit. The electric drive unit can be an electric motor having an axis that is connected to the axis of the driven spool 1106. In some configurations, the electric drive unit can include an electric motor that is coupled to the driven spool 1106 through one or more gears. In some configurations, a manual crank assembly can be attached to the driven spool 1106 to allow manual advancement of the belt. The belt-based surface can be packaged such that the initial parameters of the belt (e.g., moisture level) are maintained until use. For example, the replacement mechanism 1100 can include a lining or encapsulation that prevents moisture from evaporating from the belt-based surface prior to use. The encapsulation can also prevent contamination of the belt-based surface prior to use.

[0097] A length of unused tape 1110 or diaphragm can be wound around the reel 1108. The unused tape / diaphragm 1110 can be configured as a growth surface as previously described herein. The unused tape 1110 can be defined as the portion of the tape that has not been advanced into the growth chamber 1103. One end of the unused tape 1110 can be attached to the reel 1108. The tape can further include an active test surface 1122, which is defined as the portion of the tape that is positioned within the growth chamber 1103. The tape can further include a length of used tape 1112 or diaphragm, which can be defined as the portion of the tape that has been processed through a measurement cycle in the growth chamber 1103. One end of the used tape 1112 can be attached to the driven reel 1106.

[0098] The tape housing 1104 can define a separation surface 1120, which is configured to separate the unused tape 1110 and the used tape 1112 from the growth chamber 1103. The separation surface 1120 can define a slot or opening through which the tape can pass. The tape-based surface replacement mechanism 1100 can further include a first guiding roller 1124, which is configured to guide the unused tape 1110 from the unused tape chamber 1116 into the growth chamber 1103. The tape-based surface replacement mechanism 1100 can further include a second guiding roller 1126, which is configured to guide the tape (active test surface 1122) into the used tape chamber 1114. The first guiding roller 1124 and the second guiding roller 1126 can be coupled to the separation surface 1120 by a bracket. In some configurations, the bracket can include a flexible member, which is configured to apply a certain amount of pressure to press the rollers against the bottom surface of the mold sensor housing 1102 to help seal the chamber 1103 relative to the outside air and / or improve the electrical contact between the tape and the control device 116. The lengths of the first guiding roller 1124 and the second guiding roller 1126 can be defined by the width of the tape.

[0099] The unused tape (such as Figures 8 to 10wound or coiled around the reel 1108 as described). The tape can be routed via the first guide roller 1124 and the second guide roller 1126 so that the ends can be attached to the driven reel 1106. The mold measurement cycle can be performed using the active test surface 1122 exposed within the growth chamber 1103. After completion of the measurement cycle, the driven reel 1108 can be rotated by an electric drive mechanism. The driven reel 1108 can be driven to advance the portion of the tape that serves as the active test surface 1122 into the used tape chamber 1114. By rotating the driven reel 1108, the tape will be advanced and wound around the driven reel 1106. The rotation causes the unused tape 1110 to unwind from the reel 1108 and be advanced into the growth chamber 1103 as a new active test surface 1122. The total length of the tape can be configured to perform a predetermined number of measurements.

[0100] In some configurations, the used tape chamber 1114 can contain encapsulation and / or chemicals for inhibiting mold growth. This can prevent mold from growing in the unused tape chamber 1116 and ensure that mold that grows during the measurement is further eradicated. In some configurations, the unused tape chamber 1116 can contain encapsulation and / or chemicals for maintaining the unused tape 1110 for later use. For example, the encapsulation and / or chemicals can be configured to prevent the unused tape 1110 from becoming dry or non-sticky, which can have a negative impact on the measurement validity.

[0101] The tape-based surface replacement mechanism 1100 can be implemented as a cartridge containing a tape or diaphragm of a predetermined length. The cartridge can be user-replaceable. The cartridge can be discarded after use. In some configurations, the tape or diaphragm can be replaceable within the cartridge.

[0102] In some configurations, the tape or growth surface can include notches along one or both sides of the tape. For example, the notches can be placed to identify each test section of the tape. An optical sensor can be positioned to provide a signal when a notch appears between the source and the receiver. The control device 116 can use this signal to properly position the tape so that the test sections are properly exposed within the chamber. The sensor can also be used to measure the amount of tape that has been used. For example, an optical sensor can be used to count the notches. Knowing the distance between the notches and / or the total number of notches on the tape, the control device 116 can calculate the amount of tape used and / or the amount of tape remaining and communicate these values to the user. The control device 116 can calculate the number of remaining measurement cycles based on the amount of tape remaining.

[0103] Figure 12A and Figure 12BDepicts different views of the drum-based surface replacement mechanism 1200. The drum-based surface replacement mechanism 1200 can include a drum 1204. The drum 1204 can be cylindrical. In some configurations, the drum 1204 can be solid. In some configurations, the drum 1204 can be hollow, having structural elements at each end to support and facilitate the rotation of the drum 1204. The drum 1204 can be rotated by an electric motor 1206 having a shaft coupled to the central axis of the drum 1204. The drum 1204 can include a growth surface 1208, which can be defined as the area exposed within the growth chamber of the mold sensor housing 1202. The drum 1204 can include an unexposed surface 1203, which can be defined as the surface of the drum 1204 that is not exposed within the growth chamber of the mold sensor housing 1202. The drum-based surface replacement mechanism 1200 can include a housing (not shown) configured to attach to the mold sensor housing 1202 and support the electric motor 1206. The housing can further prevent the drum surface from being exposed to external air.

[0104] The drum 1204 can be divided into a plurality of surface segments 1210. The surface segments 1210 can be configured to fit within the growth chamber of the mold sensor housing 1202. The plurality of surface segments 1210 can define the number of measurement cycles that can be performed. As previously described with respect to the belt configuration, the surface segments 1210 can be divided into strips or subdivisions.

[0105] The drum 1204 can be a replaceable element such that when all of the surface segments 1210 have been used, a new drum 1204 can be installed. The old drum can be discarded or recycled. In some configurations, the drum surface can be a replaceable sheet or substrate. The used drum surface sheet can be replaced with a new drum surface sheet.

[0106] The drum-based surface replacement mechanism 1200 can be rotated by the operation of the electric motor 1206. Measurements can be performed using the growth surface 1208 exposed within the chamber of the mold sensor housing 1202. After completion of a measurement cycle, the electric motor 1206 can be actuated to advance the drum 1204 to place the next surface segment 1210 into the growth chamber defined by the sensor housing 1202. For example, in Figure 12BIn the [description], the current section exposed in the mold sensor housing 1202 is the growth surface 1208. Assuming clockwise rotation, the surface section 1210A can be advanced into the mold sensor housing 1202. The control device 116 can be configured to actuate the electric motor 1206 for a predetermined duration that is calibrated to rotate the drum 1204 by an amount corresponding to one of the surface sections 1210. In other configurations, a sensor such as a potentiometer or an encoder can be used as a feedback signal to measure the amount of rotation and drive the electric motor 1206 accordingly. In some configurations, a manual crank assembly can be attached to the shaft of the drum 1204 to allow manual advancement of the drum 1204.

[0107] Figure 13A Depicted is a disk-based surface replacement mechanism 1300 for advancing a disk 1308 to position a growth surface 1304 within a cavity formed by a sensor housing 1302. The disk-based surface replacement mechanism 1300 can include a disk housing 1306 configured to enclose the disk 1308. The disk 1308 can be configured to rotate about a central axis. An electric motor 1310 can be coupled to the disk housing 1306. The shaft of the electric motor 1310 can be coupled to the disk 1308 to facilitate rotation of the disk 1308.

[0108] In some configurations, the entire surface of the disk 1308 can be treated to promote mold growth. The disk 1308 can also be configured as depicted in Figure 13B [description]. The disk 1308 can define a growth area 1312, which, as previously described herein, is treated to promote mold growth. The disk 1308 can include a non-growth area 1314 that separates the growth area 1312. The non-growth area 1314 can prevent the spread of mold growth to the exterior of the sensor housing 1302. The growth area 1312 can be divided into zones treated in different ways to promote the growth of different types of mold, as previously described herein.

[0109] The disk-based surface replacement mechanism 1300 can position the disk 1308 through the operation of the electric motor 1310. Measurements can be performed using the growth surface 1304 exposed in the growth housing 1302. After completion of a measurement cycle, the electric motor 1310 can be actuated to rotate the disk 1308 to the next growth area 1312. The control device 116 can be configured to actuate the electric motor 1310 for a predetermined duration that is calibrated to rotate the disk 1308 by an amount corresponding to one of the growth areas 1312. In other configurations, a sensor such as a potentiometer or an encoder can be used as a feedback signal to measure the amount of rotation and drive the electric motor 1310 accordingly.

[0110] The mold sensor configuration includes a sensing device configured to detect mold. The sensor can be electrically coupled to a control device 116. A variety of sensor technologies are suitable for detecting mold growth within a housing. Types of sensors that can be used include optical sensors, chemical sensors, biosensors, mechanical sensors, audio sensors, and electrical sensors. The sensor can be configured to measure visual, mechanical, electrical, biological, and / or chemical properties associated with mold growth. The mold sensor configuration can include different types of sensors to detect the presence of mold. Some sensor technologies may be more suitable for detecting the concentration of mold, while other sensor technologies may be suitable for detecting the presence of mold growth.

[0111] Reference Figure 1 As an example, the sensing device 110 can be implemented in a variety of ways. Various configurations can rely on different sensor technologies. The type of sensing device can be a chemical / gas sensor, an electrical sensor, a biosensor, an optical sensor, a mechanical sensor, or an audio sensor. The type of sensing device can depend on the type of property associated with the presence and / or concentration of the mold to be detected. The sensing device 110 can be configured to detect mold by measuring optical properties, electrical properties, biological properties, mechanical properties, and / or chemical properties. Different properties can be detected by different types of sensors. For example, some chemical properties, such as pH, can be detected by optical and / or electrical sensors. Mechanical properties can be detected by electrical and / or optical sensors. The sensing device characteristics can lie in the physical property being attempted to be measured and how it measures that physical property.

[0112] Mold spores release microbial volatile organic compounds (mVOCs) as by-products during their metabolism. Mold spores can also further release mycotoxins as end products during secondary metabolism. Mold growth can be detected by sensing these chemicals during the mold life cycle. The sensing device 110 can be a chemical sensor configured to sense changes in mVOCs or other chemicals associated with mold growth.

[0113] Molds can release alcohols, aldehydes, hydrocarbons, acids, ethers, esters, ketones, terpenoids, sulfur, nitrogen, and other compounds. The type of chemicals released can depend on the type of mold that is growing. The sensing device 110 can be any type of chemical sensor capable of detecting these compounds. For example, the sensing device 110 can be an electrochemical gas sensor or a metal oxide gas sensor configured to detect these compounds. In some configurations, the sensing device 110 can include multiple chemical sensors, each configured to measure a specific chemical compound.

[0114] For example, the sensing device 110 can be a solid-state chemiresistor sensor that changes its resistance in response to exposure to certain chemical compounds. The control device 116 can be programmed to estimate the gas concentration by measuring the resistance of the chemiresistor sensor. The control device 116 can include a voltage divider network and an analog-to-digital (A2D) converter to measure the voltage across the chemiresistor sensor. The control device 116 can store one or more tables that map voltage and / or resistance values to gas concentrations. The control device 116 can be configured to generate a warning or an alarm in response to a gas sensor signal indicating that the mold concentration exceeds a threshold. For example, a warning can be generated when the mold concentration exceeds a reference concentration by more than a predetermined amount.

[0115] The control device 116 can store data that correlates the measurements of the chemical sensor with mold growth. The data can be experimentally derived from tests. The stored data can indicate the types and levels of gases during different stages of mold growth. Additionally, the stored data can include gas profiles for different types of mold. The control device 116 can sample the chemical / gas sensor over time and compare the results with the stored data to further identify the type of mold, the concentration of mold, or the stage of mold growth. Additionally, the initial concentration of mold before mold growth can be determined by back-calculating based on data that can be experimentally derived from tests and estimating the growth amount.

[0116] Mold growth can also change the properties of the growth medium as the mold grows. Common mold types such as the Aspergillus and Penicillium families shift the pH of the growth surface 112 towards acidity. The sensing device 110 can be configured to sense the pH change caused by mold growth. A first technique for detecting the pH of the growth surface 112 includes adding a universal pH indicator solution to the growth surface 112. The universal pH indicator can change color as the pH of the growth surface 112 changes. The nutrient treatment of the growth surface 112 can include the universal pH indicator solution. The sensing device 110 can be configured to detect the color change of the growth surface 112 associated with the pH change. In some configurations, the sensing device 110 can be a camera that provides a color image of the growth surface 112. For example, the camera can be a charge-coupled device (CCD) configured to provide a digital image of the growth surface 112. The control device 116 can be configured to implement an image processing algorithm to determine the color change of the growth surface 112. The sensing device 110 can be an optical sensing device that is configured to output an electromagnetic wave (e.g., light) and receive a reflected wave from the growth surface 112.

[0117] Color changes caused by pH changes can be detected by changes in optical properties such as absorption, reflection, scattering, color, and / or fluorescence. These properties can be detected using an optical sensing system, an imaging system, or a camera system. For example, an optical sensing system can be configured to provide data on the color of mold growing on a surface. The control device 116 can be programmed to process optical data including color information to identify mold growth or the color of the substrate. The color information can indicate mold growth on the substrate. For example, a change in the pH of the substrate can be identified by a change from a baseline color to a predetermined color. The predetermined color indicating mold growth can be determined experimentally.

[0118] For example, as Figure 2 shown, the sensing system can include a sensor source module 210 and a sensor receiving module 212. Although Figure 2 the sensor receiving module 212 is depicted on the opposite side of the growth surface 112 from the sensor source module 210, the sensor receiving module 212 can be placed on the same side of the growth surface 112 as the sensor source module 210.

[0119] The sensor source module 210 can be a light source (or an electromagnetic wave source), and the sensor receiving module 212 can be a photodetector. For example, the photodetector can be placed below the growth surface 112. The light source can be activated to generate electromagnetic waves in the cavity 103 to illuminate the growth surface 112. The electromagnetic waves passing through the growth surface 112 can change wavelength based on the color of the growth surface 112. The photodetector (sensor receiving module 212) can receive the electromagnetic waves and generate an electrical signal. The photodetector can be configured to detect different wavelengths of the electromagnetic waves so that different colors can be detected. In some configurations, multiple photodetectors (e.g., a photodetector array) can be implemented, where each photodetector is tuned for a given wavelength range.

[0120] An optical sensing system, imaging system, or camera system can include both a sensor source module 210 (e.g., an optical source, LED, laser) and a sensor receiving module 212 (e.g., an optical sensor, photodiode, photodetector, imager, camera). In some configurations, the optical source can be a source that irradiates a large or entire area of the growth surface 112 within the chamber 103 with a diverging beam of light. The optical source can be a light source combined with a beam diverging component that causes the beam to diverge to irradiate a large or entire area of the growth surface 112 within the chamber 103. The optical sensor can be an array of photodiodes or a camera configured to receive electromagnetic waves reflected or scattered from and / or transmitted through the growth surface 112. In this configuration, changes in the optical properties of the entire growth surface 112 can be collected simultaneously. The sensor source module 210 can be driven by one or more input signals generated by the control device 116. The sensor receiving module 212 can provide optical data indicating one or more optical properties to the control device 116. The optical data can be provided as one or more electrical signals. In some examples, the optical data can include digital data such as an image or pixel data / pattern. The specific optical data provided by the sensor receiving module 212 can depend on the type of sensor utilized.

[0121] In another configuration, the optical source can be a laser beam with high directivity and a small divergence angle, and the optical sensor can be a single photodiode or an array of photodiodes or optical sensors. The optical source can be driven by a driver or electric motor to sweep around the entire or most of the growth surface 112, and the single photodiode can also be driven by the same or a separate driver or electric motor to move accordingly as the source moves. This configuration can be useful for configurations in which different mold growth zones are defined. The presence of mold can be scanned for each zone. The zones in which mold is detected can be stored, and the type of mold present can be indicated. The array of photodiodes or optical sensors may or may not need to move.

[0122] The optical source can be a single-wavelength source or a source that outputs multiple wavelengths (e.g., a broadband source), and the optical sensor can correspondingly be a narrow-bandwidth sensor or a broadband-width sensor. Depending on the specific growth surface 112 in the chamber 103 and the mycelium being grown, changes in the optical properties of the growth surface 112 can be detected in the ultraviolet (UV) wavelength range, visible wavelength range, or infrared (IR) wavelength range. If the optical source is a multi-wavelength or broadband source, an optical spectrometer can also be used as the optical sensor to detect changes in the optical properties within the spectral range. The spectral information can also contain mVOC or other information, and in this way, both changes in the optical properties of the growth surface 112 and changes in mVOC or other information can be detected.

[0123] The optical source can also be an array of individual monochromatic optical lasers. For example, ultraviolet lasers can induce fluorescence when irradiating mold spores. By configuring two or more ultraviolet lasers as the optical source and an optical spectrometer as the optical sensor, the fluorescence of mold spores can be detected. Mold spores can be detected by the signatures of the fluorescence spectrum.

[0124] Absorption, reflection, and / or scattering changes induced by mold growth can be directly detected by the light intensity received by a photodetector. A filter with a photodiode (or array) and RGB pixels (or RGB pixel array) can be used to determine color changes induced by mold growth. The control device 116 can include algorithms to detect changes in intensity and / or color.

[0125] In addition to growing in the plane of the growth surface 112, mold can also grow out of the plane. The vertical depth of the mold can increase with the increase in growth time. The optical sensor can be configured as a laser rangefinder (e.g., based on time-of-flight, frequency-modulated continuous wave, or structured light techniques) to detect the out-of-plane depth of the growing mold. The control device 116 can be configured to periodically measure the rangefinder to monitor the vertical growth of the mold. The control device 116 can calculate the rate of change of the vertical growth.

[0126] The optical properties of the growth surface can be calibrated with a reference and saved before exposure to mold or mold growth for comparison with the optical properties observed after exposure and growth. Mold growth affects the optical properties within the cavity. By comparing the measurement results with the baseline results, the control device 116 can determine the presence of mold and the initial concentration of the mold.

[0127] Another technique for detecting the pH of the growth medium can be to utilize a pH meter, such as a potentiometric pH meter. The growth medium can include a pre-printed electrode for the potentiometric sensor. The surface above the electrode can be coated with nutrients to promote mold growth. As the pH changes, the resistance measured between the electrodes can change. The pH level can be determined by measuring the resistance between the electrodes. The control device 116 can be configured to receive the electrical signal and estimate the resistance. Inductive sensing is described in more detail herein.

[0128] Another technique for detecting pH can be to implement a system that controls the pH of a small zone of the growth medium. Figure 19Depicts a configuration for controlling the pH of a surface. The active area of the growth surface 1902 can be covered with a hydrogel or similar coating that allows diffusion and promotes mold growth. The pH sensor can include a sensing electrode 1908 integrated with the growth surface 1902. The sensing electrode 1908 can have a proportional electrical potential response to pH relative to a reference electrode 1912. A current source can supply current to one or more working electrodes (e.g., a first working electrode 1904 and a second working electrode 1906), which then flows through one or more counter electrodes 1910. The control device 116 can control the current to maintain the sensing electrode 1908 at a reference pH level 1916, which can be a constant pH value. This can be used to create a predetermined pH environment to promote the growth of certain types of mold. This also provides a feedback signal to provide a measurement of the amount of feedback that must be applied to maintain the pH at a constant level. The amplifier 1914 can receive inputs from the sensing electrode 1908 and the reference electrode 1912. The output of the amplifier 1914 can be electrically connected to the control device 116. When the pH level of the growth surface 1902 changes due to mold growth, the amount of current supplied to the working electrodes 1904, 1906 can change. As a result, the voltage measured at the sensing electrode 1908 changes.

[0129] The configuration can be applied Figure 19 to create a specific pH environment to promote the growth of certain types of mold. The feedback signal from the sensing electrode 1908 is proportional to the amount of current that must be applied to keep the pH constant. For example, if no mold is growing, the pH level should remain constant without a change in current. As mold grows on the surface, the change in pH level causes the control device 116 to apply more current to rebalance the pH level. Mold growth can be detected by monitoring changes in the feedback signal. If the feedback signal exceeds a predetermined threshold, there may be mold. The growth surface can be configured with multiple regions as configured as shown in Figure 19 . Each region can be used to create a different pH environment for mold growth. Additionally, different regions can be configured to be in different temperature zones (e.g., by operating thermal control elements associated with each region). In this way, the environment can be configured to effectively grow different types of mold.

[0130] Mold growing on growth surface 112 can cause changes in the electrical properties of the surface. For example, the impedance, capacitance, frequency response, and / or other electrical properties of growth surface 112 can be altered due to mold growth. As the mold feeds on the nutrients in growth surface 112 and its roots (hyphae) spread to obtain more nutrients, the properties of growth surface 112 can change due to the growth of the mold. Changes in both growth surface 112 and the intrusion of the hyphae cause changes in impedance, capacitance, frequency response, and other electrical properties.

[0131] Figure 14 A sensing device configured to measure electrical properties is depicted. Inductive sensing configuration 1400 can include a first electrical contact 1404 and a second electrical contact 1406 coupled to growth surface 1408. The first electrical contact 1404 and the second electrical contact 1406 can be adhered or deposited on growth surface 1408. In some configurations, the substrate of growth surface 1408 can be a diaphragm, and the contacts can be deposited or etched onto the substrate.

[0132] A voltage can be applied between the first electrical contact 1404 and the second electrical contact 1406. The voltage can create an electric field 1412 within housing 1402 and growth surface 1408. The first electrical contact 1404 and the second electrical contact 1406 can operate as a capacitance sensor. The dielectric between the first electrical contact 1404 and the second electrical contact 1406 can be defined by the air within housing 1402, the mold 1410, and the growth surface 1408. As the mold 1410 grows on the growth surface 1408 and enters the cavity defined by the housing 1402, the dielectric properties can change. By measuring the dielectric that varies over time, the system can detect mold growth, mold concentration, and / or mold type. The first electrical contact 1404 and the second electrical contact 1406 can be electrically coupled to a control device 116. The control device 116 can be configured to supply a voltage across the first electrical contact 1404 and the second electrical contact 1406. The sensing device can include a current sensor to measure the current flowing between the first electrical contact 1404 and the second electrical contact 1406. The control device 116 can be configured to generate an alternating current (AC) voltage waveform having a range of frequencies and amplitudes. By applying a known voltage waveform and measuring the resulting current, the control device 116 can use basic electrical relationships to determine the capacitance. As the mold 1410 grows and changes the dielectric, the capacitance value can change. The control device 116 can be configured to sweep the frequency to obtain the frequency response of the dielectric properties.

[0133] Figure 15Depicts a capacitance sensor 1500 that includes a plurality of electrical contacts 1504 coupled to or integrated with a growth surface 1502. The electrical contacts 1504 can be arranged in a grid or other pattern. Each electrical contact 1504 can be electrically coupled (e.g., via a matching electrode grid) to a control device 116. As previously described herein, the control device 116 can be configured to measure the capacitance across any pair of electrical contacts 1504. The arrangement of the capacitance sensor 1500 allows for the detection of mold growth on different regions of the growth surface 1502. By dividing the growth surface 1502 into smaller zones, mold growth can be determined in less time. The capacitance sensor 1500 is also capable of identifying the specific zones on the growth surface 1502 where mold is growing. This can be particularly useful when the growth surface 1502 is configured with different nutrient treatments in different zones (e.g., Figure 8 and Figure 10 ). The control device 116 can be configured to apply a voltage between any pair of contacts 1504 and measure the corresponding current. When the capacitance changes by a predetermined amount, the control device 116 can identify mold growth between that pair of contacts.

[0134] Figure 16 Depicts a possible configuration of an inductive sensing growth medium 1600 for detecting the electrical properties of a growth surface 1602. The growth surface 1602 can include conductive strips that can be electrically excited to measure the electrical properties. A first conductive strip 1604 and a second conductive strip 1606 can be attached to the growth surface 1602. Between the first conductive strip 1604 and the second conductive strip 1606 can be a mold growth region 1608. The mold growth region 1608 can be treated with nutrients to encourage mold growth. The mold growing in the growth region 1608 can cause a change in the electrical properties between the conductive strips. The conductive strips can also be configured perpendicular to Figure 16 the depiction in. Other configurations of the conductive strips are possible (e.g., circular, arcuate). The first conductive strip 1604 and the second conductive strip 1606 can include periodic gaps 1605 or openings such that the measurement results are only affected by the growth surface 1602 within the growth chamber.

[0135] Figure 17Depicts a first inductive sensing configuration, in which electrical contact with the conductive bars is achieved via rolling members of a surface replacement mechanism. This inductive sensing configuration can utilize sensing means mounted on the underside of the growth surface 1602. The surface replacement mechanism can include a first rolling member 1702 and a second rolling member 1704, which are in contact with the inductive sensing growth medium 1600 when the growth surface 1602 is located within the cavity 103. One or more of the first rolling member 1702 and the second rolling member 1704 can include conductive contacts around the perimeter of the corresponding rolling member. The conductive contacts can extend around the rolling member such that the conductive contacts can contact the inductive sensing growth medium 1600 at any rotational position of the rolling member. For example, the first rolling member 1702 can include a high-side contact 1706A electrically coupled to the control device 116. The first rolling member 1702 can include a low-side contact 1708A electrically coupled to the control device 116. The second rolling member 1704 can include a high-side contact 1706B electrically coupled to the control device 116. The second rolling member 1704 can include a low-side contact 1708B electrically coupled to the control device 116. The high-side contacts 1706 on the rolling members can be configured to align with the first conductive bars 1604 of the inductive sensing growth medium 1600. The low-side contacts 1708 of the rolling members can be configured to align with the second conductive bars 1606 of the inductive sensing growth medium 1600. The electrical connection of the contacts 1706, 1708 to the control device 116 can be achieved through a slip ring or a similar device.

[0136] When the growth surface 1602 of the inductive sensing growth medium 1600 is advanced, the conductive bars can maintain contact with the contacts of the rolling members. The gap 1605 can limit the measurement to that surface within the cavity. In this way, the area outside the cavity does not affect the measurement. The control device 116 can measure the electrical properties of the inductive sensing growth medium 1600 by exciting the conductive bars. For example, the control device 116 can be programmed to apply a voltage or an electric potential across the high-side contact 1706 and the low-side contact 1708. The voltage can cause a current to flow, which is proportional to the impedance of the mold growth area 1608. The control device 116 can measure the flowing current and can determine the resistance by applying Ohm's law. The control device 116 can supply an AC voltage and sweep the frequency through a predetermined range to further characterize the impedance and / or frequency response of the growth area 1608.

[0137] For a configuration of conductive bars that are perpendicular to the depicted conductive bars, the rollers can be constructed of a conductive material and electrically connected to the control device 116. The conductive bars of the inductive sensing growth medium can be spaced apart at distances corresponding to the distances between the rollers. In this configuration, one roller can contact the high-side conductive bar, and the other roller can contact the low-side conductive bar. The conductive bars can further include gaps, and the conductive surfaces of the rollers can include corresponding gaps.

[0138] Figure 18A A second inductive sensing configuration 1800 is depicted that relies on electrodes to interface with the conductive bars in the inductive sensing growth medium 1600. The second inductive sensing configuration 1800 can include a first electrode 1806 and a second electrode 1808. The first electrode 1806 and the second electrode 1808 can be constructed of a conductive material and electrically connected to the control device 116. The first electrode 1806 can be aligned with the second conductive bar 1606 of the inductive sensing growth medium 1600. The second electrode 1808 can be aligned with the first conductive bar 1604 of the inductive sensing growth medium 1600. The inductive sensing growth medium 1600 can contact a first roller 1802 and a second roller 1804 associated with the surface replacement mechanism.

[0139] Figure 18B A side view of the second inductive sensing configuration 1800 is depicted that provides more details regarding the second electrode 1808. The second electrode 1808 can be fitted within an electrode housing 1809. The electrode housing 1809 can be sized to partially contain the second electrode 1808 and allow movement of the second electrode 1808 toward and away from the inductive sensing growth medium 1600. A spring mechanism 1810 (or other flexible element) can be positioned within the electrode housing 1809 and beneath the second electrode 1808. The spring mechanism 1810 is used to provide a force to the second electrode 1808 to maintain contact with the surface of the inductive sensing growth medium 1600. The electrode housing 1809 can be coupled to a mounting surface 1812, which can be part of the surface replacement mechanism structure. Other electrodes can be configured similarly. The first roller 1802 and the second roller 1804 can contact the inductive sensing growth medium 1600 to facilitate movement. The first roller 1802 and the second roller 1804 can also apply sufficient pressure to the inductive strip 1600 to ensure that the cavity is sealed. The first roller 1802 and the second roller 1804 can be coupled to the mounting surface 1812 via brackets.

[0140] The control device 116 can be configured to measure baseline impedance characteristics before mold grows on the growth surface. The control device 116 can then monitor changes in the impedance characteristics indicative of mold growth. The control device 116 can store data related to the impedance characteristics of different types and concentrations of mold. The control device 116 can compare the measured impedance characteristics with the stored characteristics to identify the type and / or concentration of mold within the cavity.

[0141] The inductive sensing configuration can further include features for enhancing the electrical contact between the conductive strip on the growth surface and the sensing element. For example, the inductive sensing configuration can include one or more magnets or electromagnets arranged to magnetically attract the growth surface. For example, the conductive strip can include nickel. The electromagnet can be positioned under the conductive strip near the electrode or rolling element (e.g., near where the electrical contact occurs) and energized when electrical contact is desired. The electromagnet can attract the conductive strip and ensure contact with the electrode or rolling element contact. This feature is useful when the growth surface is movable because the electrical contact may break during movement. The mechanism for re - establishing the electrical connection between the growth surface and the sensing device ensures reliable performance.

[0142] In some configurations, for sensing purposes, biological or chemical elements can be used as binders or reactants to detect mold. The biological or chemical elements can be configured to bind or react with mold spores. For example, certain antibodies or enzymes bind to certain types of mold, and the binding event can be detected using various sensing methods (e.g., changes in electrical properties). Additionally, the reaction between the mold spores and the biological or chemical element can cause the release of chemical compounds. Sensors such as chemical, optical, and electrical sensors can be utilized to detect the released compounds. The binding or reaction event can be used to determine the presence of different mold types. The binder or reactant can also be used to collect mold spores before the growth stage. Different biological or chemical elements can also be used to promote or inhibit the growth of mold.

[0143] In some configurations, an audio-based sensing device can be used to detect mold. Growing mold can affect the way sound propagates within a cavity. Due to the mechanical properties of its molecular structure, growing mold will absorb and reflect sound waves at certain frequencies. In some configurations, the sensing device can include a source configured to emit sound waves and a receiver configured to convert the sound signal into an electrical signal. The configuration can depend on the type of sound to be measured. In a configuration measuring sound wave reflection, the source module 210 and the receiving module 212 can be mounted within the cavity (e.g., on the same side of the growth surface). The receiving module 212 receives the sound waves reflected from the growth surface 112. In some configurations, the sensing device can be an ultrasonic transceiver including a source module and a receiving module. In a configuration measuring sound wave transmission through the growth surface 112, the source module 210 and the receiving module 212 can be mounted on opposite sides of the growth surface 112 (e.g., Figure 2 as depicted in). For example, the sensor source module 210 can be an ultrasonic speaker, and the sensor receiving module 212 can be a microphone configured to convert the sound signal into an electrical signal. The sensor source module 210 can be driven by the control device 116. The control device 116 can operate the sensor source module 210 to output a frequency sweep within a predetermined frequency range. The control device 116 can receive the electrical signal from the sensor receiving module 212 and can measure the amplitude of the received sound signal. The control device 116 can be configured to estimate the molecular resonance frequency of the mold to determine the specific type of growing mold.

[0144] The control device 116 can store previously generated acoustic signature profiles representative of different mold types and concentration levels. The control device 116 can be configured to compare the measured acoustic signature profile with the stored acoustic signature profiles to identify the type and / or concentration level of the mold growing within the cavity 103. In some configurations, the control device 116 can identify mold growth by the change in the acoustic signature profile compared to a baseline acoustic signature profile. Additional sensors (e.g., to measure volume or weight) can be included to provide an improved estimate.

[0145] An ultrasonic sensor can also be used to sense out-of-plane growth of mold by outputting acoustic pulses and measuring the response time (e.g., the time for the sound to travel to the receiver). Greater vertical growth can result in a shorter pulse return time. The sensing device can include an ultrasonic transmitter and an ultrasonic receiver to measure the response time. The control device 116 can include circuitry for generating the ultrasonic signal and receiving the reflected ultrasonic signal. The control device 116 can include circuitry and / or control logic to sense the delay between sending the ultrasonic signal and receiving the reflected signal. The control device 116 can be programmed to measure the height of out-of-plane mold growth. The height can be monitored over time and stored. The control device 116 can store data on mold growth patterns for different types of mold. For example, the mold growth patterns can be experimentally derived through testing. The type of mold can be determined by comparing the measured growth pattern to historical patterns.

[0146] In a configuration using an audio-based sensing device, the enclosed volume or cavity can be acoustically isolated from the outside. For example, the cavity can be coated with a material to minimize acoustic echoes. Additionally, this prevents external noise / acoustic interference with the measurement process within the cavity 103. The housing 102 can also be configured to optimize the audio / acoustic properties within the cavity 103 to minimize unwanted echoes or reflections. Additional microphones can be attached outside the cavity 103 and used to subtract external noise from the measurement signal to improve measurement accuracy (e.g., differential measurement).

[0147] The growth surface can also have certain mechanical properties (e.g., inertia, mass). When excited by sound waves, the surface can vibrate or oscillate. The vibration can be characterized by the amount of damping. Damping can be characterized by how quickly the amplitude of the vibration or oscillation dissipates after the excitation stops. A thicker mold growth layer can result in greater damping of the growth surface. That is, the vibration of the growth surface will dissipate in less time. An audio sensor source can be used to excite the growth surface with sound waves, causing vibration, which can result in a change in the response time from the transmitter to the receiver. A first baseline can be established before exposing the growth surface to external air, and a second baseline can be established before mold growth. For example, an audio signal can cause vibration or deflection of the growth surface that can be measured. After exposure and mold growth, the measurement can be repeated and compared to the second baseline. An increase in damping can indicate mold growth on the surface. The magnitude of the increase in damping can indicate the amount of mold growth that has occurred. Multiple ultrasonic speakers can be employed to create a stereo effect for measurement.

[0148] Experimental tests can be performed to determine the damping properties of mold growth in the cavity. Under controlled conditions, the mold can grow, and the damping properties can be measured at different growth stages. Data for different types of mold can be stored. The control device 116 can store data for later comparison. By comparing the damping response with a historical damping response, the control device 116 can be able to determine the growth stage, concentration, and / or type of the growing mold.

[0149] Mold can be detected by measuring the mechanical properties of the growth surface that change due to mold growth. The mechanical properties can be measured by applying an actuating pulse and measuring the resulting frequency and / or amplitude response. In some configurations, the mold sensor can include a mechanism for exciting the growth surface. For example, a piezoelectric substrate can be included to facilitate the excitation of the growth surface. The growth surface and the electrical contact system can be configured Figures 16 to 1 similarly to FIG. 8. For example, the growth surface can include a pair of conductive strips with a piezoelectric material therebetween. The piezoelectric substrate can be electrically coupled to the control device 116. The electrical contact can be implemented using electrodes or contacts on the rolling elements as previously discussed herein. The control device 116 can actuate the piezoelectric substrate (e.g., by applying a voltage or current at a predetermined level or trend) to cause the growth surface to move or deform at a given frequency or amplitude defined by the excitation. The control device 116 can stop actuating the piezoelectric substrate and measure the oscillation and / or damping. The measurement can be performed via an optical sensing device or an inductive sensing device. In some configurations, the signal from the piezoelectric substrate can be used to perform the measurement. For example, vibration can cause a voltage on the piezoelectric substrate.

[0150] The piezoelectric substrate can be used as a sensor in other configurations, such as an audio-based sensing configuration. When the pressure from a sound wave interacts with the piezoelectric substrate, the piezoelectric substrate can generate an electrical signal. The piezoelectric substrate can act as a microphone and can be used to measure the deflection or movement of the growth surface caused by the sound wave. The piezoelectric material can be disposed on the substrate / growth surface between at least two conductive zones. The piezoelectric material can be configured to generate an electrical signal at the conductive zones based on the deflection of the substrate / growth surface. The piezoelectric material can be configured to cause the deflection of the substrate / growth surface in response to a voltage applied to the conductive zones.

[0151] The substrate can be configured as a cantilever, a cantilever array, a bridge, a bridge array, a diaphragm, or a diaphragm array, and a plate. In some configurations, independent mechanical structures can be configured to facilitate the growth of different molds. Measuring the mechanical properties of each independent structure can allow the identification of the type of mold that is growing.

[0152] The excitation of the growth surface can also be achieved by an electromagnet that interacts with the growth surface. For example, a conductive strip of nickel or ferromagnetic material can be attracted to the electromagnet. The control device 116 can be configured to cause the electromagnet to generate pulses to induce vibration of the growth surface. Then an optical sensor can be employed to measure the oscillation and / or damping of the growth surface. The mold growth can be determined by comparing the response with the first and second baseline responses obtained during the initial phase of the measurement cycle. Electrostatic actuation can also be applied to excite the growth surface. For example, a comb drive or an electrostatic motor can be used to excite the growth surface.

[0153] The mold sensor can be configured for long-term use to continuously sense mold in the environment. Such a configuration can utilize a surface replacement mechanism to continuously advance the growth surface so that multiple measurement cycles can be performed. In some configurations, the surface replacement mechanism can be an interchangeable cartridge that allows the installation of a new growth medium to continue the testing. Some sensor configurations can be well-suited for interchangeable configurations. For example, a configuration in which the sensing device is incorporated into a housing can be very suitable for these applications. A configuration including a part of the sensing device below the growth surface may require an additional cost for each replacement cartridge.

[0154] The surface advancement mechanism can be configured to identify the lack of available new growth surface. For example, when there are no more unused tapes, Figure 11 the tape-based surface replacement mechanism may not be able to advance the growth surface. This can be detected by an increase in torque or the inability to change the speed of the driven reel 1106. The control device 116 can be configured to detect this and notify the user that additional measurements are not possible. In other configurations, the growth surface that can be moved to the end of the cavity can be given different properties. For example, different characteristics that can be recognized by the sensing device can be imparted to the final growth surface. For example, the final growth surface can be transparent or mirror-like to change the intensity of the light detected by the optical sensor. The control device 116 can be configured to detect the change during the baseline measurement and mark the condition.

[0155] The mold sensor can also be configured as a single-use device for single detection of mold. The mold sensor can be configured with an interchangeable cartridge that does not advance the growth surface. Single-use applications can be better suited for some sensor configurations, such as variants that measure mechanical properties. For example, the mold sensor can define a slot that allows manual insertion of the growth surface (e.g., a glass slide or strip). After completing the measurement cycle, the growth surface can be manually removed and discarded. In some configurations, the growth surface can be cleaned, reprocessed with nutrients, and reused.

[0156] In some configurations, the continuous measurement configuration can be configured to clean and reprocess the growth surface. For example, the belt-based configuration can include an electromechanical wiper / scraper mechanism that scrubs the growth surface after the mold elimination phase. The surface replacement mechanism can be configured with a removable waste bin for collecting waste. The surface replacement mechanism can be configured to reapply nutrients to the growth surface. For example, the growth surface can be moved through a nutrient container, or a nutrient solution can be sprayed or dripped onto the growth surface.

[0157] The sensing device configurations described herein can be combined in a given application. The mold sensor can utilize more than one of the sensing techniques described to better measure mold growth or different properties indicative of mold growth.

[0158] The growth of mold and the mold growth rate can be affected by temperature. Different types of mold can have different responses to a given temperature. Referring again to Figure 1 , the thermal control element 120 can be controlled by the control device 116. The thermal control element 120 can be operated to affect the growth of mold within the chamber 103. The control device 116 can implement closed-loop temperature control within the chamber 103 by controlling the thermal control element 120 using temperature feedback from the chamber environment sensor 118. The control device 116 can be configured to select a temperature set point for a given type of mold to optimize mold growth within the chamber 103. The control device 116 can be configured to adjust the temperature set point to detect the presence of different types of mold. An open-loop strategy can also be implemented, where the control device 116 is programmed to activate the thermal control element 120 in a predetermined trend.

[0159] The control device 116 can be configured to operate the mold inhibitor 108 to affect mold growth. The control device 116 can operate the mold inhibitor 108 to determine the intensity of the mold. The control device 116 can operate the mold inhibitor 108 in short pulses that are configured to kill weaker mold spores. The control device 116 can operate the mold inhibitor 108 to regulate the mold growth rate. The control device 116 can further operate the mold inhibitor 108 to prevent saturation of the chamber 103 by eliminating some of the mold. The control device 116 can be configured to perform sensor measurements before and after applying the mold inhibitor 108 to identify differences in the mold concentration that may have occurred. The control device 116 can be configured to identify the rate of mold elimination during the activation of the mold inhibitor 108. The rate of mold elimination can be used to identify the type of mold that is growing.

[0160] The mold inhibitor 108 can be configured to output different UV wavelengths to measure the effect of different UV wavelengths on mold elimination. The mold inhibitor 108 can be configured such that the intensity of the light can vary. The control device 116 can control or select the intensity and UV wavelength of the light during the mold elimination phase. The control device 116 can operate different light sources that provide light of different wavelengths or a filtering element with one or more broadband light sources. When the control device 116 has determined that a particular type of mold is present, the control device 116 can be configured to select a UV wavelength that is effective for eliminating the particular type of mold present. The control device 116 can store data on the preferred parameters of the mold inhibitor 108 for eliminating different types of mold.

[0161] The described mold sensor can operate automatically. For example, the control device 116 can be configured to schedule measurement cycles at predetermined time intervals. The control device 116 can be configured to determine the trigger conditions for initiating a measurement cycle. For example, the control device 116 can monitor weather information from an external sensor or network to determine if conditions for mold growth exist. For example, the control device 116 can initiate a measurement cycle after detecting an increase in humidity or a decrease in temperature. The control device 116 can also be configured to learn local conditions that lead to an increased risk of mold growth. The control device 116 can store the measurement results and associated conditions during a measurement cycle. Over time, the control device 116 can learn that certain conditions are associated with mold growth. When these conditions are detected, the control device 116 can reduce the time between measurement cycles.

[0162] Figure 20Illustrates a possible configuration of a mold sensing system. The mold sensor 2000 may include a control device 116. The control device 116 may include a processing unit 2002 and volatile and non-volatile memories 2004. The mold sensor 2000 may include a human-machine interface (HMI) 2008 for interacting with the user. The HMI 2008 may be a combination of hardware and software elements. The mold sensor 2000 may be operated by the user as needed. The control device 116 may implement the HMI 2008 (e.g., buttons / lights) that allows the user to initiate a measurement cycle. The user may initiate the measurement cycle by pressing a button, and the light may indicate that the measurement cycle is in progress. The mold sensor 2000 may further include an alarm 2014 that provides feedback if a mold growth threshold is sensed. The alarm 2014 may be a visual alarm, such as a light-emitting diode (LED) or a display panel. In some configurations, the alarm 2014 may be an audible alarm. The control device 116 may be programmed to activate the alarm 2014 via the HMI 2008 in response to detecting that the mold concentration exceeds a threshold during the measurement cycle. The control device 116 may detect mold growth greater than normal mold growth when the estimated mold concentration exceeds a predetermined concentration. The alarm may be an audible alarm and / or a virtual alarm communicated to the user.

[0163] The control device 116 may include a communication interface 2006 that allows the user to communicate with the control device 116 via the cloud or a network 2010 (e.g., Ethernet, Bluetooth). The control device 116 may be programmed using a network interface that allows access to the mold sensor parameters via a web browser on a user device 2018 (e.g., a computer or other device). The HMI 2008 may include an application running on the user device 2018, which may be a mobile phone or a tablet. The HMI 2008 may be configured to allow the user to initiate and / or schedule a measurement cycle. The HMI 2008 may be configured to communicate the measurement results to the user. The HMI 2008 may be configured to notify the user of the current status of the mold sensor. For example, the HMI 2008 may communicate the remaining battery life, the remaining growth surface or measurement cycle, and warnings related to mold detection. The mold sensor 2000 may include a display module driven by the HMI 2008.

[0164] The mold sensor 2000 may include a power interface 2016 for supplying power to the mold sensor components. The power interface 2016 may include a battery. The battery may be rechargeable. In some configurations, the power interface 2016 may provide a connection to an external source. For example, power may be provided by a power supply connected to a household electrical outlet.

[0165] The system can include multiple mold sensors 2000 that work in concert to determine mold growth and concentration. In some configurations, the mold sensing system can include a first mold sensor (e.g., 2000A) and a second mold sensor (e.g., 2000B). The first mold sensor 2000A can be located in an area for which excessive mold growth is to be monitored. The second mold sensor 2000B can be located in a reference area. For example, the reference area can be outdoors. The reference area can be an area where mold overgrowth is not suspected. The second mold sensor 2000B can provide information about the mold concentration that is typically present in the environment. For example, the second mold sensor 2000B can provide mold growth information for a normal amount of mold spores that naturally exist in the environment. The first mold sensor 2000A, due to being located in an area of active mold growth, can provide information about the mold concentration that may be different from the reference area. For example, the first sensor 2000A can be located in a damp basement where mold has been growing for some time. The presence of mold in an enclosed area can cause an increase in the concentration of mold spores in the air compared to the reference area. By using multiple mold sensors, the system can determine whether the mold concentration is abnormal relative to the reference area.

[0166] Using multiple mold sensors can prevent inaccurate assessments. For example, the concentration of mold spores can typically vary over the course of a year. By including a reference mold sensor, the normal variations can be subtracted from the mold assessment of interest. This provides more accurate concentration data for the area of interest and can prevent false warnings due to seasonal variations in the concentration of mold spores. For example, when the ratio of the measured mold concentration to the reference mold concentration is less than a threshold, the mold sensing system can suppress the warning. The warning can indicate that there are more of certain types of mold spores on the interior area compared to the exterior area.

[0167] In some configurations, the system can evaluate mold growth for different types of mold. For example, growth surfaces with differently treated zones and / or growth surfaces with zones exposed to different environmental conditions can grow different types of mold. The sensors can be configured to measure the mold concentration for each zone or type of mold. The concentration of each type of mold can be compared to the corresponding reference value of a mold sensor placed in the reference area.

[0168] Mold sensors 2000 can communicate with each other via a communication interface 2006. One of the mold sensors 2000 can be configured as a master device. The master device can be configured to manage and coordinate the operations of other mold sensors. The master device can receive mold growth and concentration data from other mold sensors. The master device can synchronize the measurement cycles of the mold sensors 2000. For example, the master device can send a start measurement cycle signal to the mold sensors to initiate a measurement cycle. The master device can further be configured to determine a mold growth concentration threshold based on data from a reference mold sensor.

[0169] The control device 116 can be configured to perform data analysis. The control device 116 can further be configured to collect measurement data and send the data to a server 2012 or a cloud computer for processing. The control device 116 can be configured to send the measurement data to a user device 2018. An advantage of external processing is that algorithms can be changed in a central location without having to reprogram each individual mold sensor. Over time, the algorithms can be improved. Additionally, the ability to analyze data from many mold sensors can be used to develop improved mold sensing strategies and better characterize mold growth.

[0170] The user device 2018 can be programmed to coordinate the operations of multiple mold sensors 2000. For example, a program can be executed on the user device 2018 that allows a user to establish communication with the mold sensors 2000. The program can allow the user to identify the mold sensors 2000. For example, the program can allow one of the mold sensors to be identified as a reference mold sensor. The program can determine a mold alert threshold based on data received from the reference mold sensor. The control device 116 can communicate the results to the user device 2018 via the Internet. This allows for the placement of mold sensors 2000 with remote monitoring capabilities. Additionally, the program can allow any number of mold sensors to be added to the mold sensing system.

[0171] The mold sensors 2000 can include self-test capabilities. The control device 116 can be programmed to operate components to provide confirmation of proper operation. For example, the control device 116 can be configured to detect that the air inlet port 104 is operating properly. Some configurations can include an electrical switch or contact that closes when the air inlet port 104 is in a predetermined position. The control device 116 can actuate the air inlet port 104 and monitor the switch or contact to verify proper operation.

[0172] The control device 116 can be configured to operate the mold inhibitor 108 to confirm proper operation. For example, in a configuration with an optical sensing device, the control device 116 can activate the mold inhibitor 108 and confirm operation by sampling the optical sensing device.

[0173] The control device 116 may further be configured to calibrate the sensing system. The control device 116 may be configured to check the sensor status under conditions where no mold growth is present in order to establish a baseline state. The control device 116 may check the sensing device before and / or immediately after exposing the growth surface to air. The resulting signal should indicate no mold growth. If the sensing device provides a signal indicating mold growth, the mold sensor may need repair or need to be cleaned.

[0174] The mold sensor may be used to estimate the concentration of mold spores. When the mold sensor is configured with predetermined fixed parameters (e.g., temperature, humidity, pressure, measurement time period), the concentration of mold spores detected in a volume can be related to the concentration of mold spores from a reference area. For example, mold growth data may be determined to relate the measured parameters to the mold concentration. This feature can be useful in the design of multi-chamber mold sensors for detecting certain types of mold.

[0175] By implementing mold growth curve fitting and / or pattern recognition algorithms, the measurement time can be reduced and the detection accuracy can be improved. Mold grows differently in different environments. Curve fitting or pattern recognition can be achieved by changing one of the parameters (e.g., temperature, humidity, pressure) during the measurement. The sensing device can be monitored to determine how the measured property changes in response to the change in the parameter. For example, if the sensor output changes more rapidly at higher humidity compared to lower humidity, there may be mold spores. This allows for mold detection without having to wait for the mold spores to grow to a large concentration.

[0176] Figure 21 Flowchart 2100 depicting a possible sequence of operations for operating a mold sensor configuration is shown. At operation 2102, a check may be performed to determine if there is a measurement trigger condition. For example, the measurement may be triggered manually via a button or switch, via a network command, and / or be scheduled. In some configurations, the control device 116 may determine the trigger condition based on environmental conditions. The trigger condition may include a check to determine if there is sufficient growth surface available to perform the measurement (e.g., tape remaining in excess of the amount required for the measurement). If there is no trigger condition, operation 2102 may be repeated.

[0177] If the measurement trigger condition is met, operation 2104 may be performed to locate the growth surface. The measurement cycle may begin by first positioning the unused portion of the growth surface to a location where it can receive an air flow. In configurations having a movable growth surface, the control device 116 may actuate the surface replacement mechanism to advance the growth surface to a predetermined position. For example, the unused portion of the growth surface may be advanced into the growth chamber. In some configurations (e.g., Figure 6 and Figure 7), the growth surface can be positioned in an exposed area outside the growth chamber.

[0178] At operation 2106, the growth surface can be exposed to air. For example, the control device 116 can open the air inlet port to allow air flow into the growth chamber. The air inlet port can be opened for a predetermined period of time and then closed. The predetermined period of time can be determined based on the environmental conditions detected by the environmental sensor. In some configurations, an air flow sensor or a pressure sensor can be monitored to determine when to close the air inlet port.

[0179] At operation 2108, a baseline measurement of the particles attached to the growth surface can be performed. Before performing the baseline measurement, the air inlet port can be closed. The baseline measurement can depend on the type of sensing technique used. For example, in a gas / chemical sensor configuration, mVOC in the closed chamber can be sensed and recorded. For an optical sensor, the properties of the light / electromagnetic waves reflected from or transmitted through the growth surface can be measured.

[0180] If there are mold spores attached to the nutrient-rich growth surface, the mold will start to grow. At operation 2110, the chamber environment can be controlled to predetermined parameters. The control device 116 can be configured to enhance the growth environment by operating one or more thermal control elements 120. The control device 116 can operate the thermal control elements 120 to increase the rate of mold growth. Additionally, any additional systems for promoting mold growth (e.g., humidity control) can be activated.

[0181] At operation 2112, sensor measurements can be performed. The control device 116 can use one or more sensing devices to make measurements during the growth period and compare the results with the baseline measurement results. For example, the control device 116 can monitor the change in mVOC during the growth period. For an optical sensor, the properties of the reflected or transmitted light can be monitored.

[0182] At operation 2114, an inspection can be performed to determine whether the measurement cycle is complete. For example, the measurement cycle can be completed after a predetermined duration. In some configurations, the sensor data can be monitored, and if mold growth is detected, the measurement cycle can be terminated. If the measurement cycle is not complete, operations 2112 and 2114 can be repeated.

[0183] If the measurement period is completed, operation 2116 can be performed to process the sensor data. The presence of mold can be determined by comparing the sensor data with the stored data indicating mold growth. Algorithms such as quantitative polymerase chain reaction (QPCR) can be used to back-calculate the amount of mold growth to determine the concentration of mold spores. The processed measurement results can include mold detection data from other mold sensors connected within the same communication network. The mold concentration from a reference sensor can be compared with other measured mold concentrations. The control device 116 can be programmed to change the signal indicating mold growth based on the changes detected in the sensor measurements. For example, the control device 116 can make periodic measurements and compare the results with baseline measurements.

[0184] At operation 2118, an inspection can be performed to determine whether mold has been detected, as previously described herein. For example, if the ratio of the measured mold concentration to the reference mold concentration exceeds a threshold, the system can indicate the presence of mold. If mold is detected, operation 2120 can be performed to generate an alarm or warning signal. A signal indicating mold growth can be generated and output. The alarm or warning can be sent to and displayed on the user device 2018. After generating the warning or indication, operation 2122 can be performed. If no mold is detected, operation 2122 can be performed. The signal indicating mold growth can be an indicator of the mold growth that has been detected in the sample. In some configurations, the signal indicating mold growth can be an indicator that the amount or ratio of mold in the air exceeds a predetermined threshold. In some configurations, the signal indicating mold growth can be an indication of the measurement of the amount of mold present in the sample or in the air.

[0185] At operation 2122, the control device 116 can operate the mold inhibitor to eliminate any mold that may have grown. During the elimination phase, the control device 116 can sample the sensing device to detect any changes to ensure that the mold has been eliminated. Then the entire process can be repeated.

[0186] The mold sensor configuration provides the ability to monitor mold growth in an environment over time. The enclosed volume provides a controlled environment for mold growth, which allows for more rapid detection of mold. Additionally, the enclosed volume allows mold to grow without allowing it to spread to other areas. Furthermore, after the measurement period, the mold inhibitor can be activated to eliminate the growing mold. The surface replacement mechanism allows for the replacement of the growth surface to enable additional measurement cycles. The mold sensor allows for continuous monitoring of an area for a period of time.

[0187] Some configurations of the growth surface can allow the identification of the type of mold that is growing. The sensing device can be configured to measure mold growth in a specific zone of the growth surface. In this way, the mold sensor can determine the type of mold that is growing. The mold detection device is configured to grow mold from mold spores present in the air at the time of sampling. The device is configured to make inferences or back-calculations to determine the concentration of mold spores in the sampled air.

[0188] The mold detection device can be used in a variety of ways. In some applications, the mold detection device can be used to determine an absolute measurement of the mold concentration. In other applications, the mold detection device can be used to indicate whether the mold concentration exceeds a threshold indicating a mold problem (e.g., a threshold mold sensor). In some applications, the mold detection device can be configured to provide a yes / no indication of the presence of mold. The rate of mold growth on the growth surface depends on the amount of mold spores inoculated onto the growth surface. The inoculation is related to the concentration of mold spores in the air. The mold detection device can be placed in the environment for a predetermined time duration. The mold detection device can be configured such that the detection of mold growth at the end of the time duration indicates that the concentration of mold spores in the sampled air is higher than the threshold. The threshold can be selected to indicate a mold problem in the environment in which the mold detection device is placed. If no mold growth is detected at the end of this time duration, the concentration of mold spores in the sampled air is less than the threshold, and it is indicated that there is no mold problem.

[0189] The threshold mold sensor can be configured for a predetermined type of mold. For example, the nutrient platform can be configured to allow the growth of a predetermined type of mold. Nutrients can be added to the growth surface that are favorable for the growth of the predetermined type of mold.

[0190] In other examples, the mold sensor can be configured for multiple mold types. In these configurations, the growth relationships between multiple mold types can be investigated and understood. For example, the growth or presence of one type of mold can inhibit the growth of a second type of mold. Understanding this relationship allows the mold sensor to be configured to minimize such conditions. Additionally, environmental parameters such as temperature and humidity can be controlled to encourage mold growth.

[0191] The processes, methods or algorithms disclosed herein can be transferred to and implemented by, or through, a processing device, controller or computer capable of comprising any existing programmable electronic control unit or dedicated electronic control unit. Similarly, the processes, methods or algorithms can be stored in many forms as data and instructions executable by a controller or computer, including but not limited to information permanently stored on a non-writable storage medium such as a ROM device and information changeably stored on a writable storage medium such as a floppy disk, magnetic tape, CD, RAM device and other magnetic and optical media. The processes, methods or algorithms can also be implemented in a software executable object. Alternatively, the processes, methods or algorithms can be implemented in whole or in part using appropriate hardware components such as application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), state machines, controllers or other hardware components or devices, or combinations of hardware, software and firmware components.

[0192] Although the exemplary embodiments have been described above, it is not intended that these embodiments describe all possible forms covered by the claims. The words used in the specification are descriptive words rather than limiting words, and it should be understood that various changes can be made without departing from the spirit and scope of the disclosure. As previously described, the features of the various embodiments can be combined to form other embodiments of the invention that may not be explicitly described or shown. Although the various embodiments may have been described as providing advantages over one or more desired characteristics or being preferred to other embodiments or prior art implementations, those of ordinary skill in the art recognize that one or more features or characteristics can be compromised to achieve the desired overall system attributes, depending on the particular application and implementation. These attributes can include, but are not limited to, cost, strength, durability, life cycle cost, marketability, appearance, packaging, size, serviceability, weight, manufacturability, ease of assembly, etc. Accordingly, with respect to any embodiments described as less desirable in one or more characteristics compared to other embodiments or prior art implementations, these embodiments are not outside the scope of the disclosure and can be desirable for a particular application.

Claims

1. A system for detecting mold, the system comprising: A housing that defines a cavity and an opening through a surface of the housing; A movable grille disposed on the housing and configured to selectively cover the opening; A substrate that is treated to promote mold growth; A substrate propulsion mechanism configured to selectively move an unexposed portion of the substrate outside the cavity into the cavity and move an exposed portion of the substrate within the cavity out of the cavity; A temperature sensor disposed within the cavity; A heating element disposed within the cavity; A sensor configured to detect mold growth on the substrate within the cavity; A light source disposed within the cavity and configured to kill mold within the cavity when activated; And A controller programmed to operate the substrate propulsion mechanism in response to initiating a mold detection cycle to advance the unexposed portion of the substrate from outside the cavity into the cavity.

2. The system according to claim 1, wherein The controller is further programmed to actuate the movable grille to allow air to enter the cavity for a predetermined duration.

3. The system according to claim 1, wherein, The controller is further programmed to operate the heating element to maintain a predetermined temperature within the cavity during the mold detection cycle.

4. The system according to claim 1, wherein The controller is further programmed to operate the sensor to detect the amount of mold present within the cavity during the mold detection cycle.

5. The system according to claim 1, wherein The controller is further programmed to activate the light source to kill mold within the cavity in response to completing the mold detection cycle.

6. The system according to claim 5, wherein, The controller is further programmed to operate the sensor to detect a change in the mold growth when the light source is activated.

7. The system according to claim 1, wherein The sensor is a gas sensor configured to measure microbial volatile organic compounds (mVOCs) within the cavity caused by mold growth.

8. The system according to claim 1, wherein The controller is further programmed to activate the light source to regulate the mold growth rate within the cavity during the mold detection cycle.

9. The system according to claim 1, wherein The controller is further programmed to pulse the light source and evaluate the difference in measurements from the sensor before and after exposure to the light source to determine mold intensity.

10. A method, the method comprising: Activating, by a controller, a substrate propulsion mechanism to move an unexposed portion of a substrate treated with nutrients from outside a cavity defined by a housing into the cavity; Opening, by the controller, a door covering an opening defined by the housing to allow air to enter the cavity for a predetermined time; And Sampling, by the controller, a sensor configured to detect the presence of mold within the cavity.

11. The method according to claim 10, the method further comprising, in response to completing a mold detection cycle, activating a light source disposed within the cavity for a predetermined amount of time, the light source configured to kill mold within the cavity.

12. The method according to claim 10, the method further comprising: Generating, by the controller, an alarm in response to detecting the presence of mold within the cavity.

13. The method according to claim 10, the method further comprising: An alarm is generated in response to determining that the mold concentration in the air exceeds a predetermined concentration based on the amount of mold growth detected in the chamber.

14. The method according to claim 10, wherein the method further comprises: The sensor is sampled before opening the door to obtain a baseline sensor measurement.

15. The method according to claim 14, the method further comprising: An alarm is generated in response to a difference between the current sensor measurement and the baseline sensor measurement exceeding a predetermined threshold indicating a predetermined concentration of mold in the environment.

16. The method according to claim 10, wherein, Activating the substrate propulsion mechanism includes: operating a motor to cause a rolling member to rotate to propel the substrate into the chamber.

17. A method, the method comprising: operating, by a controller, an electric motor coupled to a reel, the reel being attached to a substrate treated with a nutrient, to expose a portion of the substrate to air for a predetermined time; in response to the termination of the predetermined time, operating, by the controller, the electric motor to propel a portion of the substrate into a chamber; operating, by the controller, a thermal control element to maintain the temperature in the chamber at a predetermined temperature; and monitoring, by the controller, a sensor disposed in the chamber to detect mold growth on the substrate.

18. The method according to claim 17, the method further comprising: Activating a light source disposed in the chamber to kill mold in response to the termination of a monitoring time.

19. The method according to claim 17, the method further comprising: During the monitoring, activating a light source disposed in the chamber to adjust the growth rate of mold in the chamber.

20. The method according to claim 17, the method further comprising: Causing a light source disposed in the chamber to generate a pulse and evaluating a difference in measurements from the sensor before and after exposure to the light source to determine mold intensity.

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