Circuit manufacturing method and circuit manufacturing equipment

Abstract

The present invention provides a circuit manufacturing method and circuit manufacturing equipment, which relates to the field of printed electronic manufacturing technology. The method includes: step S1, providing a transparent substrate; a surface modification layer for adhering liquid metal is attached to the first surface of the transparent substrate; a liquid metal layer is attached to the surface modification layer; step S2, providing a light source, the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, and the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer is destroyed; step S3, removing the liquid metal with unstable connection on the liquid metal layer, and the remaining liquid metal on the liquid metal layer constitutes a circuit. In the present invention, a light beam is used to form a target pattern, which avoids the characteristic of large surface tension of liquid metal and can meet the preparation of more sophisticated liquid metal circuits; on the other hand, the efficiency of irradiating the light beam is greatly improved compared with direct liquid metal printing.

Description

Technical Field

[0001] The invention belongs to the technical field of printed electronic manufacturing, and in particular relates to a circuit manufacturing method and circuit manufacturing equipment. Background Art

[0002] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metal have made direct writing, printing and other circuit direct printing technologies possible. In existing liquid metal direct writing and printing, liquid metal ink infiltrates and adheres to the surface of an organic polymer substrate to achieve single-layer printing of conductive circuits.

[0003] At present, the production of liquid metal circuits mainly relies on direct writing and other printing methods, which leads to low manufacturing efficiency and complex manufacturing process of liquid metal flexible electronic circuits. On the other hand, due to the high surface tension of liquid metal, liquid metal cannot pass through extremely fine ink channels, resulting in the ink discharge method of direct writing pens being unable to meet the production requirements of liquid metal circuits with higher precision. Summary of the invention

[0004] In view of this, an object of the present invention is to propose a circuit preparation method to solve the problems in the prior art of low manufacturing efficiency, complex manufacturing process and inability to meet high-precision circuit production of liquid metal flexible electronic circuits.

[0005] In some illustrative embodiments, the circuit manufacturing method includes: step S1, providing a transparent substrate; a surface modification layer for adhering liquid metal is attached to the first surface of the transparent substrate; a liquid metal layer is attached to the surface modification layer; step S2, providing a light source, the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer; step S3, removing the liquid metal with unstable connection on the liquid metal layer, and the remaining liquid metal on the liquid metal layer constitutes a circuit.

[0006] In some optional embodiments, the light source is a picosecond laser beam; the surface modification layer is made of a non-transparent material; in step S2, the picosecond laser beam is transmitted to the surface modification layer to etch a corresponding area of ​​the surface modification layer, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer.

[0007] In some optional embodiments, the light source is a nanosecond laser beam; the surface modification layer is a non-transparent material resistant to high temperatures; in step S2, the nanosecond laser beam is transmitted to the surface modification layer to etch the corresponding area of ​​the surface modification layer, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer.

[0008] In some optional embodiments, the surface modification layer is a colloid uniformly mixed with microcapsules, and the core of the microcapsule is a corrosive solution of liquid metal; in step S2, the second side of the transparent substrate faces upward, and the liquid metal layer is placed downward, and the nanosecond laser beam is transmitted to the surface modification layer to destroy the capsule wall of the microcapsule in the corresponding area of ​​the surface modification layer, releasing the corrosive solution therein, and contacting with the liquid metal below through gravity to corrode the liquid metal.

[0009] In some optional embodiments, the light source includes an ultraviolet beam; the transparent substrate is made of an anti-aging material; in step S2, the ultraviolet beam is transmitted to the surface modification layer to cause the corresponding area of ​​the surface modification layer to age, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer.

[0010] In some optional embodiments, in step S3, unstable liquid metal connected to the liquid metal layer is removed by vibration.

[0011] In some optional embodiments, the surface modification layer is made of insulating material; in step S3, the liquid metal with unstable connection on the liquid metal layer is removed under the action of the electron repulsion generated by the same charge applied to the transparent substrate and the liquid metal layer.

[0012] Another object of the present invention is to provide a circuit manufacturing device to solve the technical problems existing in the prior art.

[0013] In some illustrative embodiments, the circuit manufacturing equipment includes: a fixing mechanism for clamping and fixing a transparent substrate; a first coating mechanism, a second coating mechanism and a light source arranged above the transparent substrate; wherein the first coating mechanism is used to coat to form a surface modification layer; the second coating mechanism is used to coat to form a liquid metal layer; the light source is used to provide a light beam acting on the surface modification layer; a rotating mechanism connected to the fixing mechanism and used to flip the transparent substrate; and a control mechanism for driving the first coating mechanism, the second coating mechanism or the light source to perform corresponding operations on the transparent substrate.

[0014] In some optional embodiments, the fixing mechanism includes: a conductive clamp for applying positive / negative charges, and the clamp at least fastens the two opposite ends of the transparent substrate; the circuit manufacturing equipment also includes: a conductive probe for contacting the liquid metal layer, applying a charge of the same nature as the conductive clamp.

[0015] In some optional embodiments, the circuit manufacturing equipment further includes: a vibration mechanism connected to the fixing mechanism, and used to remove the liquid metal with unstable connection on the liquid metal layer.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] The present invention forms a stable connection between the liquid metal layer and the substrate through a surface modification layer, and then destroys the surface modification layer at a specified position using a light beam, thereby destroying the stable connection between the liquid metal and the substrate at that position, and then removes the unstable liquid metal by applying an external force, and the remaining liquid metal can form a liquid metal circuit that is stably connected / attached to the substrate. The present invention uses a light beam to form a target pattern, avoiding the large surface tension of liquid metal, and can meet the preparation of more sophisticated liquid metal circuits; on the other hand, the efficiency of irradiating a light beam is greatly improved compared to direct liquid metal printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flow chart of a circuit manufacturing method in an embodiment of the present invention;

[0019] Figure 2 is a flow chart of a circuit manufacturing method in an embodiment of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of a circuit manufacturing device in an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The following description and the accompanying drawings fully illustrate specific embodiments of the present invention so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The examples represent possible variations only. Unless explicitly required, separate components and functions are optional, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present invention includes the entire scope of the claims, and all available equivalents of the claims. In this article, these embodiments of the present invention may be represented individually or collectively by the term "invention", which is merely for convenience, and if more than one invention is disclosed in fact, it is not intended to automatically limit the scope of the application to any single invention or inventive concept.

[0022] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0023] The present invention provides a circuit manufacturing method, specifically, as follows Figure 1 As shown, Figure 1 Flow chart of a circuit manufacturing method in an embodiment of the present invention; the circuit manufacturing method comprises:

[0024] Step S1, providing a transparent substrate 1; a surface modification layer 2 for adhering liquid metal is attached to a first surface of the transparent substrate; a liquid metal layer 3 is attached to the surface modification layer;

[0025] Step S2, providing a light source 5, wherein the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer;

[0026] Step S3, removing the unstable liquid metal on the liquid metal layer, and the remaining liquid metal on the liquid metal layer forms a circuit.

[0027] The transparent substrate in this embodiment can be adopted but is not limited to polyvinyl chloride substrate, polyethylene terephthalate substrate, polybutylene terephthalate substrate, polypropylene substrate, polybutylene adipate terephthalate substrate, silicone rubber substrate, natural rubber substrate, isoprene rubber substrate, styrene-butadiene rubber substrate, butadiene rubber substrate, chloroprene rubber substrate, ethylene-propylene rubber substrate, nitrile rubber substrate, silicone rubber substrate, polysulfide rubber substrate, glass substrate, polyurethane substrate, acrylic substrate, silicon substrate, quartz substrate, and one of the special engineering plastics PEPK.

[0028] The surface modification layer in this embodiment may be made of, but not limited to, long-chain polymer organic materials such as PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silicone, acrylic polymer, polylactic acid, PCL (polycaprolactone), etc.

[0029] The liquid metal in the embodiment of the present invention is also called low melting point metal, which includes a low melting point metal element / low melting point metal alloy with a melting point below 100 degrees Celsius, or a conductive paste formed by mixing a low melting point metal element / low melting point metal alloy with metal nanoparticles, or a conductive nanofluid formed by mixing a low melting point metal element / low melting point metal alloy with a fluid dispersant. More specifically, when the conductive nanofluid is selected, the fluid dispersant is preferably one of ethanol, propylene glycol, glycerol, polyvinyl pyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethyl methacrylate.

[0030] Preferably, the liquid metal is a conductive paste formed by mixing a low-melting-point metal element / a low-melting-point metal alloy with metal nanoparticles, which reduces the surface tension and fluidity of the liquid metal and improves the adhesion of the liquid metal itself, thereby further improving the structural stability of the liquid metal attached to the surface modification layer. Among them, the liquid metal can be selected from one or more of gallium element, indium element, tin element, gallium-indium alloy, gallium-indium-tin alloy, gallium-tin alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin-zinc alloy, gallium-indium-tin-zinc alloy, gallium-tin-cadmium alloy, gallium-zinc-cadmium alloy, bismuth-indium alloy, bismuth-tin alloy, bismuth-indium-tin alloy, bismuth-indium-zinc alloy, bismuth-tin-zinc alloy, bismuth-indium-tin-zinc alloy, tin-lead alloy, tin-copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy. The metal nanoparticles can be selected from one or more of copper, iron, nickel, silver, and silver-clad copper. Preferably, metal nanoparticles can be used as functional materials to improve the properties of the liquid metal itself. For example, the use of metal nanoparticles such as silver-coated copper, silver, and copper can effectively improve the conductivity of the liquid metal; the use of metal nanoparticles such as nickel can improve the oxidation resistance of the liquid metal and improve the surface gloss of the liquid metal.

[0031] In some more preferred embodiments, the low melting point metal element / low melting point metal alloy is selected from room temperature liquid metal, such as one or more of gallium element, gallium-indium alloy, gallium-indium-tin alloy and gallium-tin alloy, so that the liquid metal can be in liquid or slurry state at room temperature. Alternatively, a bismuth-based alloy or indium-based alloy with a melting point slightly higher than room temperature can be selected, and the ambient temperature can be raised by a simple heating component to make it liquid.

[0032] The present invention forms a stable connection between the liquid metal layer and the substrate through a surface modification layer, and then destroys the surface modification layer at a specified position using a light beam, thereby destroying the stable connection between the liquid metal and the substrate at that position, and then removes the unstable liquid metal by applying an external force, and the remaining liquid metal can form a liquid metal circuit that is stably connected / attached to the substrate. The present invention uses a light beam to form a target pattern, avoiding the large surface tension of liquid metal, and can meet the preparation of more sophisticated liquid metal circuits; on the other hand, the efficiency of irradiating a light beam is greatly improved compared to direct liquid metal printing.

[0033] The surface modification layer in the above-mentioned embodiment of the present invention is used to modify the surface of the substrate so that the liquid metal can be stably attached to the substrate. It is particularly suitable for materials whose substrate surface is alienated from the liquid metal. When the liquid metal is coated on the substrate, the area on the substrate surface that does not have the surface modification layer does not adhere to the liquid metal. When coating the liquid metal, there is no need to consider the adhesion of the substrate itself to the liquid metal and control the coating range, thereby reducing the useless loss of the liquid metal material.

[0034] Now refer to Figure 2, step S1 in the embodiment of the present invention may specifically include:

[0035] Step S11, providing a transparent substrate 1;

[0036] Step S12, forming a surface modification layer 2 for adhering liquid metal on the first surface of the transparent substrate;

[0037] Step S13 , forming a liquid metal layer 3 on the surface modification layer 2 .

[0038] During steps S11 to S13, the surface modification layer and the liquid metal layer can be formed by spraying, printing, imprinting, dipping, and other methods.

[0039] In step S2 of the embodiment of the present invention, a light source is provided, and the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer. This can be implemented by combining different surface modification layers and corresponding light sources.

[0040] In one embodiment of step S2, the light source is a picosecond laser, and the transparent substrate can be a PET film substrate, a glass substrate, or an acrylic substrate; the surface modification layer can be a non-transparent adherent liquid metal material such as polyurethane and polylactic acid (wherein, the surface modification layer of the transparent material can be dyed by adding pigments, paints, etc.); wherein, the laser beam emitted by the picosecond laser is a cold laser beam, which uses the Coulomb force effect for etching, and no high temperature is generated during the process to affect the transparent substrate.

[0041] First, the transparent substrate is horizontally inverted so that the first side of the transparent substrate with the surface modification layer and the liquid metal layer attached faces downward and the second side faces upward; a picosecond laser emitter is arranged above the transparent substrate, the direction of the laser beam is perpendicular to the transparent substrate, the laser beam is vertically injected into the transparent substrate, and penetrates the transparent substrate to directly act on the surface modification layer. By controlling the intensity and irradiation time of the laser beam, the surface modification layer at the specified position is etched, so that the area of ​​the substrate and the liquid metal layer are suspended, causing the original stable connection of the liquid metal at this position to be extremely poor. In the process, the horizontal movement and switch of the picosecond laser emitter are controlled to drive the laser beam to etch the surface modification layer according to the preset pattern, thereby reducing the stability of the area of ​​the liquid metal layer that is not the target liquid metal circuit. Among them, the liquid metal on the transparent substrate after horizontal inversion is very thin and will be stably attached to the surface modification layer, and the inversion will not affect it; for the liquid metal mixed with metal nanoparticles, it has a certain strength itself, and its thickness can be designed to be larger than that of pure liquid metal. In addition, placing the transparent substrate horizontally is the optimal embodiment of step S2, but in other embodiments, the transparent substrate can be set at any angle, as long as the light beam acts vertically on the transparent substrate to ensure the accuracy of the etching area.

[0042] In this embodiment, the picosecond laser will directly vaporize or atomize the surface modification layer under its action, thereby increasing the air pressure in the space, and the liquid metal at this position can be preliminarily removed, and the remaining liquid metal can be removed in step S3.

[0043] In another embodiment of step S2, the light source is a conventional nanosecond laser, which can directly vaporize the material at the instantaneous high temperature of the irradiation point; the transparent substrate can be a substrate with temperature resistance such as quartz, glass, special engineering plastics, etc.; the surface modification layer can be a non-transparent adhesive liquid metal material such as polyurethane, polylactic acid, etc.;

[0044] Compared with picosecond laser, the working mode of nanosecond laser is basically the same as that of picosecond laser, except that nanosecond laser uses high temperature to vaporize the surface modification layer. The transparent substrate absorbs less light and heat due to its light transmittance, and most of the light and heat are concentrated on the surface modification layer. Therefore, the transparent substrate only needs to have a certain temperature resistance to meet the requirements of nanosecond laser etching the surface modification layer without basically affecting the transparent substrate.

[0045] In another embodiment of step S2, the light source is a light source including a heat beam, and the light source can be a composite light source including a heat beam such as infrared light, incandescent lamp, or a nanosecond laser. The transparent substrate can be a substrate with temperature resistance such as quartz, glass, special engineering plastics, etc.; the surface modification layer can be a colloid (such as polyurethane or polylactic acid) uniformly mixed with microcapsules.

[0046] The capsule wall of the microcapsule is made of a material with poor heat resistance (such as one or more of paraffin, polyethylene oxide, polypropylene oxide, and block polyether), and the capsule core is a liquid metal corrosive solution (such as one or more of sodium hydroxide solution, ammonia water, calcium hydroxide solution, barium hydroxide solution, succinic acid solution, lactic acid solution, malic acid solution, salicylic acid solution, oleic acid solution, linoleic acid solution, oxalic acid solution, citric acid, and stearic acid solution). Among them, the liquid metal corrosive solution not only refers to materials that can chemically react with liquid metal, but also includes materials that can physically modify liquid metal. For example, sodium hydroxide solution can cause gallium element / gallium-based alloy to produce agglomeration effect and restore its original surface tension to form droplets.

[0047] In this embodiment, the surface modification layer is irradiated with a heat beam to melt the capsule wall of the microcapsule constituting the surface modification layer, thereby releasing the liquid metal corrosion solution therein, which contacts the liquid metal below under the action of gravity and removes the liquid metal.

[0048] The thermal beam used in this embodiment can be provided with an additional light-blocking structure so that the beam is irradiated at a designated position. Preferably, a photomask placed on the second surface of the transparent substrate can be used to achieve irradiation of a preset pattern.

[0049] In another embodiment of step S2, the light source is a light source including ultraviolet light beams, and the light source can be a composite light source including ultraviolet light beams, such as ultraviolet light, incandescent lamps, xenon lamps, etc. The transparent substrate can be an anti-aging substrate such as quartz, glass, special engineering plastics, etc.; the surface modification layer can be an easily aged material such as polylactic acid, PCL, etc.

[0050] In this embodiment, by irradiating with ultraviolet light beams, the aging of the surface modification layer can be accelerated, so that the long-chain polymer material of the surface modification layer is broken, thereby destroying the stable connection between the surface modification layer and the liquid metal layer.

[0051] In each embodiment of step S2 of the present invention, nanosecond laser and picosecond laser have relatively higher control accuracy and are more likely to meet the requirements of high-precision liquid metal production.

[0052] The method of removing the unstable liquid metal on the liquid metal layer in step S3 of the embodiment of the present invention can also be implemented in various ways, such as vibration, ultrasound, electronic force, etc.

[0053] In one embodiment of step S3, at least two ends of the transparent substrate are supported and fixed, and then the unstable liquid metal is removed by vibration / shaking, and the shaking force should be less than the adhesion force between the liquid metal and the surface modification layer, and greater than the connection force between the liquid metals.

[0054] In another embodiment of step S3, at least two ends of the transparent substrate are fixed, and then the same charge is applied to the transparent substrate and the liquid metal layer at the same time, and the liquid metal with unstable connection on the liquid metal layer is removed due to the repulsive force between the charges. The repulsive force between the charges should be less than the adhesion between the liquid metal and the surface modification layer, and greater than the connection force between the liquid metals.

[0055] Now refer to Figure 3 , Figure 3 A schematic diagram of the structure of a circuit manufacturing device in an embodiment of the present invention is shown. As shown in the schematic diagram, the present invention discloses a circuit manufacturing device, comprising: a fixing mechanism 101, a first coating mechanism (not shown, and can refer to a print head or coating structure in the prior art), a second coating mechanism (not shown, and can refer to a print head or coating structure in the prior art), a light source 102, a rotating mechanism 103 and a control mechanism (not shown, and can refer to a mechanical arm structure in the prior art); wherein the fixing mechanism 101 is used to clamp and fix a transparent substrate 1; the first coating mechanism, the second coating mechanism and the light source 102 are located above the substrate; the first coating mechanism is used to coat and form a surface modification layer 2; the second coating mechanism is used to coat and form a liquid metal layer 3; the light source is used to provide a light beam 5 acting on the surface modification layer; the rotating mechanism 103 is connected to the fixing mechanism 101 in a matching manner to flip the transparent substrate 1; and the control mechanism is used to drive the first coating mechanism, the second coating mechanism or the light source 102 to perform corresponding operations on the transparent substrate 1.

[0056] In some embodiments, the fixing mechanism 101 includes: a conductive clamp for applying positive / negative charges, and the clamp at least fastens the opposite ends of the transparent substrate 1; the circuit manufacturing equipment also includes: a conductive probe 104 for contacting the liquid metal layer, applying a charge of the same nature as the conductive clamp.

[0057] In some embodiments, the circuit manufacturing equipment further includes: a vibration mechanism (not shown, ultrasound or a vibration motor may be used), connected to the fixing mechanism, and used to remove the liquid metal with unstable connection on the liquid metal layer.

[0058] In some embodiments, after the transparent substrate is fixed to the fixing mechanism, there is no positional movement, the first coating mechanism and the second coating mechanism can use a spray or direct writing print head, and the control mechanism includes a mechanical arm that drives the first coating mechanism, the second coating mechanism, and the light source. The control process of the circuit manufacturing equipment in this embodiment includes:

[0059] Step a, clamping the transparent substrate by a fixing mechanism;

[0060] Step b: the control mechanism drives the first coating mechanism to form a surface modification layer on the first surface of the transparent substrate;

[0061] Step c: the control mechanism drives the second coating mechanism to form a liquid metal layer on the surface modification layer;

[0062] Step d, the rotating mechanism drives the transparent substrate to flip horizontally so that the second surface is located at the top;

[0063] Step e: the control mechanism drives the light source to irradiate a light beam on the second surface of the transparent substrate according to a predetermined pattern;

[0064] Step f: applying the same charge to the transparent substrate and the liquid metal layer to remove the unstable liquid metal and form a liquid metal circuit.

[0065] In other embodiments, the circuit manufacturing equipment also includes a track; the first coating mechanism and the second coating mechanism can adopt a printing coating device; the first coating mechanism, the second coating mechanism and the light source are sequentially arranged above the track, and the fixing mechanism drives the transparent substrate to move on the track, thereby entering the working areas of the first coating mechanism, the second coating mechanism and the third coating mechanism in turn.

[0066] Those skilled in the art will also appreciate that the various illustrative logic blocks, modules, circuits, and algorithmic steps described in conjunction with the embodiments herein can all be implemented as electronic hardware, computer software, or a combination thereof. In order to clearly illustrate the interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above around their functions. Whether such functions are implemented as hardware or software depends on specific applications and the design constraints imposed on the entire system. A skilled person can implement the described functions in an alternative manner for each specific application, but such implementation decisions should not be interpreted as departing from the scope of protection of the present disclosure.

Claims

1. A circuit manufacturing method, characterized in that: include: Step S1, providing a transparent substrate; a surface modification layer for adhering liquid metal is attached to a first surface of the transparent substrate; A liquid metal layer is attached to the surface modification layer; Step S2, providing a light source, wherein the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer; Wherein, in the case where the surface modification layer is made of a non-transparent material, a picosecond laser beam is transmitted to the surface modification layer to etch the corresponding area of ​​the surface modification layer, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer; or, in the case where the surface modification layer is made of a non-transparent material, a nanosecond laser beam is transmitted to the surface modification layer to etch the corresponding area of ​​the surface modification layer, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer; or, in the case where the transparent substrate is made of an anti-aging material, an ultraviolet beam is transmitted to the surface modification layer to age the corresponding area of ​​the surface modification layer, thereby destroying the connection stability between the corresponding area of ​​the surface modification layer and the liquid metal layer; Step S3, removing the unstable liquid metal on the liquid metal layer, and the remaining liquid metal on the liquid metal layer constitutes a circuit; wherein, the unstable liquid metal on the liquid metal layer is removed by vibration, or when the surface modification layer is an insulating material, the unstable liquid metal on the liquid metal layer is removed under the action of the electronic repulsion generated by the same charge applied to the transparent substrate and the liquid metal layer.

2. A circuit manufacturing device, characterized in that: The method for manufacturing a circuit according to claim 1 comprises: A fixing mechanism, used for clamping and fixing the transparent substrate; A first coating mechanism, a second coating mechanism and a light source are arranged above the transparent substrate; wherein the first coating mechanism is used to coat and form a surface modification layer; the second coating mechanism is used to coat and form a liquid metal layer; and the light source is used to provide a light beam acting on the surface modification layer; A rotating mechanism, connected to the fixing mechanism, for turning over the transparent substrate; The control mechanism is used to drive the first coating mechanism, the second coating mechanism or the light source to perform corresponding operations on the transparent substrate.

3. The circuit manufacturing device according to claim 2, characterized in that: The fixing mechanism includes: a conductive clamp for applying positive / negative charges, the clamp at least fastening two opposite ends of the transparent substrate; It also includes: a conductive probe for contacting the liquid metal layer and applying an electric charge of the same nature as that of the conductive fixture.

4. The circuit manufacturing device according to claim 2, characterized in that: Also includes: The vibration mechanism is connected to the fixing mechanism and is used to remove the unstable liquid metal on the liquid metal layer.

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