Semiconductor air conditioner

Abstract

The present application provides a semiconductor air conditioner. The air conditioner includes a housing, a heat exchange structure assembly, and a water receiving tray. An air return opening, a cold air outlet, and a hot air outlet are respectively formed on the air conditioner housing. A relatively independent hot air flow channel and a cold air flow channel are formed inside the air conditioner housing. The hot air flow channel is communicated with the hot air outlet, and the cold air flow channel is communicated with the cold air outlet. A cold air dissipation fin flow channel is formed on the cold air dissipation heat exchange structure, and a heat dissipation fin flow channel is formed on the heat dissipation heat exchange structure. The heat dissipation flow channel extends in the vertical direction, and the hot air flow channel is located above the heat dissipation flow channel. By applying the technical solution of the present invention, the hot air can quickly pass through the heat dissipation flow channel by means of the upward force of the rising hot air, thereby increasing the wind speed in the heat dissipation flow channel, enabling the heat dissipation heat exchange structure to more efficiently dissipate heat from the semiconductor refrigeration sheet, improving the refrigeration efficiency of the semiconductor refrigeration sheet, and thus enhancing the refrigeration efficiency of the semiconductor air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning equipment, and in particular to a semiconductor air conditioner. Background Art

[0002] At present, air conditioners for kitchen environments have been launched on the market, including duct models, which are installed in the kitchen ceiling; single-sided air outlet patio models, which are flush with the ceiling gusset after installation, etc. These kitchen air conditioners have a characteristic that the engineering installation volume is relatively large, and they are suitable for kitchens that have not yet been decorated. If you want to install this type of kitchen air conditioner, you need to remove the ceiling, install the unit, and then restore the ceiling. The workload of installing the unit is greater, making the installation cost of the unit higher, which is difficult for users to accept.

[0003] Moreover, most of the existing units use refrigerant cooling. At this time, the unit has large mass components such as the compressor, which makes the overall unit bulky. Even if it is an integrated wall-mounted unit, there is a problem that the unit occupies a large space. As a result, the market feedback shows that the unit is too large and is heavy, making it inconvenient to disassemble and clean. Therefore, it is necessary to develop an air conditioner that is suitable for easy installation after kitchen decoration, has a small installation workload, is light, easy to place, and simple and convenient to maintain.

[0004] In order to solve the above problems, some semiconductor air conditioners that are easy to install and maintain have begun to appear on the market. However, the air duct settings of current semiconductor air conditioners are not reasonable, resulting in insufficient heat dissipation efficiency of the heat dissipation surface of the semiconductor cooling sheet. Due to the characteristics of semiconductor cooling sheets, when the heat dissipation efficiency of the heat dissipation surface is low, the cooling efficiency will be relatively low, thus affecting the performance of the semiconductor air conditioner. Summary of the invention

[0005] The embodiment of the present invention provides a semiconductor air conditioner to solve the technical problem of low cooling efficiency due to the restricted heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration plate in the prior art semiconductor air conditioner.

[0006] An embodiment of the present application provides a semiconductor air conditioner, comprising: an air conditioning shell, on which a return air inlet, a cold air outlet and a hot air outlet are respectively provided, and a hot air flow channel connected to the hot air outlet is formed in the air conditioning shell; a heat exchange structure assembly, comprising a cooling heat exchange structure, a heat dissipation heat exchange structure and a semiconductor refrigeration plate installed between the cooling heat exchange structure and the heat dissipation heat exchange structure, a cooling fin flow channel is formed on the cooling heat exchange structure, and a heat dissipation fin flow channel is formed on the heat dissipation heat exchange structure, two ends of the heat dissipation flow channel are respectively connected to the return air inlet and the hot air flow channel, the heat dissipation fin flow channel extends in a vertical direction or extends in a manner inclined relative to the vertical direction, and the hot air flow channel is located above the heat dissipation fin flow channel.

[0007] In one embodiment, the hot air outlet is connected to the top of the hot air flow channel.

[0008] In one embodiment, the hot air outlet is located at the top of the air conditioner housing.

[0009] In one embodiment, a cold air flow channel communicating with the cold air outlet is further formed in the air conditioner housing. Both ends of the cold air dissipation channel are respectively connected to the air return opening and the cold air flow channel, and the extending direction of the cold air dissipation fin channel is consistent with the air inlet direction of the air return opening.

[0010] In one embodiment, the air return opening is located on the side of the air conditioner housing, and the cold air dissipation fin channel extends horizontally or extends in a manner inclined relative to the horizontal direction.

[0011] In one embodiment, the cold air flow channel is arranged vertically, and the cold air outlet is opened on the lower side of the air conditioner housing.

[0012] In one embodiment, there are two air return openings, which are respectively located on both sides of the air conditioner housing. There are also two heat exchange structure components, which are respectively arranged corresponding to the two air return openings, and the cold air flow channel is formed between the two heat exchange structure components.

[0013] In one embodiment, the semiconductor air conditioner further includes a water receiving tray, which is arranged at the bottom of the cold air flow channel.

[0014] In one embodiment, a drain hole is opened at the bottom of the water receiving tray for draining water.

[0015] In one embodiment, the water receiving tray constitutes at least part of the cold air flow channel, and an air outlet communicating with the cold air outlet is formed on the water receiving tray.

[0016] In one embodiment, the semiconductor air conditioner further includes a water cooling component, which is connected between the water receiving tray and the heat exchange structure component. The water cooling component is used to suck condensed water from the water receiving tray and spray the condensed water above the heat dissipation and heat exchange structure.

[0017] In one embodiment, the water cooling component includes: a water pump installed in the water receiving tray for sucking water from the water receiving tray; a drain pipe, the first end of the drain pipe is connected to the water pump, and the second end of the drain pipe is located above the heat dissipation and heat exchange structure.

[0018] In one embodiment, the water cooling component further includes a spray head installed at the second end of the drain pipe for spraying condensed water above the heat dissipation and heat exchange structure.

[0019] In one embodiment, the heat exchange structure assembly further includes an air duct plate. The cold dissipation heat exchange structure and the heat dissipation heat exchange structure are installed between the air duct plates. The air duct plate is provided with a cold dissipation inlet and a cold dissipation outlet that communicate with the cold dissipation fin channels. The cold dissipation inlet faces the return air outlet, and the cold dissipation outlet communicates with the hot air flow channel.

[0020] In one embodiment, one cold dissipation heat exchange structure, one heat dissipation heat exchange structure, and at least one thermoelectric cooler form a heat exchange structure unit. There are multiple heat exchange structure units, and the multiple heat exchange structure units are arranged adjacent to each other.

[0021] In one embodiment, in the thickness direction, the heat dissipation heat exchange structures of two adjacent heat exchange structure units are arranged opposite to each other, and the cold dissipation heat exchange structures of two adjacent heat exchange structure units are arranged opposite to each other.

[0022] In one embodiment, in the width direction, the heat dissipation heat exchange structures of two adjacent heat exchange structure units are arranged side by side, and the cold dissipation heat exchange structures of two adjacent heat exchange structure units are arranged side by side.

[0023] In one embodiment, a hot air exhaust device is arranged in the hot air flow channel, and a cold air exhaust device is arranged in the cold air flow channel.

[0024] In one embodiment, there are multiple cold air outlets, and the multiple cold air outlets are arranged at intervals.

[0025] In the above embodiment, since the heat dissipation fin channels extend in the vertical direction and the hot air flow channel is located above the heat dissipation fin channels, in the air flow entering the heat dissipation fin channels through the return air outlet, after being heated by the heat dissipation fin channels, the hot air can rise by the force of the hot air rising, so that the hot air can quickly pass through the heat dissipation fin channels, thereby increasing the wind speed in the heat dissipation fin channels, enabling the heat dissipation heat exchange structure to dissipate heat from the thermoelectric cooler more efficiently, improving the refrigeration efficiency of the thermoelectric cooler, and thus improving the refrigeration efficiency of the semiconductor air conditioner. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0027] Figure 1 is a three-dimensional structural schematic diagram of an embodiment of a semiconductor air conditioner according to the present invention without the back shell;

[0028] Figure 2 is Figure 1 a front structural schematic diagram of an embodiment of the semiconductor air conditioner;

[0029] Figure 3 is Figure 1Side structure schematic diagram of an embodiment of a semiconductor air conditioner;

[0030] Figure 4 is Figure 1 Schematic diagram of the structure for the hot air flow of an embodiment of a semiconductor air conditioner;

[0031] Figure 5 is Figure 1 Schematic diagram of the structure for the cold air flow of an embodiment of a semiconductor air conditioner;

[0032] Figure 6 is Figure 1 Schematic diagram of the structure of the heat exchange structure assembly of an embodiment of a semiconductor air conditioner;

[0033] Figure 7 is Figure 6 Exploded structure schematic diagram of the heat exchange structure assembly;

[0034] Figure 8 is Figure 6 Stereo structure schematic diagram of the heat exchange structure unit of the heat exchange structure assembly;

[0035] Figure 9 is Figure 8 Exploded structure schematic diagram of the heat exchange structure unit;

[0036] Figure 10 is Figure 8 Schematic diagram of the structure of the cold-dissipating heat exchange structure of the heat exchange structure unit;

[0037] Figure 11 is Figure 8 Schematic diagram of the structure of the heat-radiating heat exchange structure of the heat exchange structure unit;

[0038] Figure 12 Schematic diagram of the structure of another heat exchange structure assembly of the semiconductor air conditioner according to the present invention;

[0039] Figure 13 is Figure 1 Stereo structure schematic diagram of the water receiving tray of an embodiment of a semiconductor air conditioner;

[0040] Figure 14 is Figure 1 Cross-sectional structure schematic diagram at the water-cooling component of a semiconductor air conditioner;

[0041] Figure 15 is Figure 14 Stereo structure schematic diagram of the water-cooling component;

[0042] Figure 16 Installation effect schematic diagram of an embodiment of the semiconductor air conditioner according to the present invention. Detailed implementation manners

[0043] To make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below in conjunction with the embodiments and the drawings. Herein, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but not to limit the present invention.

[0044] It should be noted that the current air duct setting of the semiconductor air conditioner is not reasonable enough, resulting in a relatively low heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration sheet. Due to the characteristics of the semiconductor refrigeration sheet, when the heat dissipation efficiency of its heat dissipation surface is low, the refrigeration efficiency will be relatively low, thus affecting the performance of the semiconductor air conditioner. The present invention uses a semiconductor refrigeration sheet for refrigeration. After the semiconductor refrigeration sheet is powered on, one side will have a lower temperature and the other side will have a higher temperature. By using this characteristic of the refrigeration sheet, the two sides of the refrigeration sheet are closely attached to the heat dissipator, so that heat or cold is transferred to the heat dissipator, and the direction of the fins of the heat dissipator and the formed channel group are cleverly used to form a reasonable air duct, so that the heat dissipation side of the semiconductor refrigeration sheet can dissipate heat better, thereby improving the working efficiency of the semiconductor refrigeration sheet. As Figure 1 and Figure 2 shown, the embodiment of the semiconductor air conditioner of the present invention includes an air conditioner housing 10, a heat exchange structure assembly 20 and a water receiving tray 30. The air conditioner housing 10 is respectively provided with an air return opening 11, a cold air outlet 12 and a hot air outlet 13. A relatively independent hot air flow channel a and a cold air flow channel b are formed inside the air conditioner housing 10. The hot air flow channel a is communicated with the hot air outlet 13, and the cold air flow channel b is communicated with the cold air outlet 12. The heat exchange structure assembly 20 includes a heat dissipation heat exchange structure 21, a heat radiation heat exchange structure 22 and a semiconductor refrigeration sheet 23. The semiconductor refrigeration sheet 23 is arranged between the heat dissipation heat exchange structure 21 and the heat radiation heat exchange structure 22. A heat dissipation fin flow channel 211 is formed on the heat dissipation heat exchange structure 21; a heat radiation fin flow channel 221 is formed on the heat radiation heat exchange structure 22. As Figure 3 , Figure 4 and Figure 11 shown, the heat radiation fin flow channel 221 extends in the vertical direction, and the hot air flow channel a is located above the heat radiation fin flow channel 221.

[0045] Applying the technical solution of the present invention, the cold-dissipating heat exchange structure 21 is attached to the cold-dissipating surface of the semiconductor refrigeration sheet 23, and the heat-dissipating heat exchange structure 22 is attached to the heat-dissipating surface of the semiconductor refrigeration sheet 23. Both ends of the cold-dissipating fin flow channel 211 are respectively connected to the return air outlet 11 and the cold air flow channel b, and both ends of the heat-dissipating fin flow channel 221 are respectively connected to the return air outlet 11 and the hot air flow channel a. Since the heat-dissipating fin flow channel 221 extends in the vertical direction and the hot air flow channel a is located above the heat-dissipating fin flow channel 221, in the air flow entering the heat-dissipating fin flow channel 221 through the return air outlet 11, after being heated by the heat-dissipating fin flow channel 221, it can utilize the upward force of the hot air rising to enable the hot air to quickly pass through the heat-dissipating fin flow channel 221, thereby increasing the air speed in the heat-dissipating fin flow channel 221, enabling the heat-dissipating heat exchange structure 22 to dissipate heat from the semiconductor refrigeration sheet 23 more efficiently, improving the refrigeration efficiency of the semiconductor refrigeration sheet 23, and thus enhancing the refrigeration efficiency of the semiconductor air conditioner.

[0046] It should be noted that in the technical solution of the present invention, the heat-dissipating heat exchange structure 21 and the cold-dissipating heat exchange structure 22 are heat exchange structures with fins, which are different concepts from the heat exchange structures on traditional air conditioners. The heat exchange structures of traditional air conditioners mainly rely on the circulation of refrigerant in the heat exchange structure for heat exchange, while the heat-dissipating heat exchange structure 21 and the cold-dissipating heat exchange structure 22 in this application transfer heat by attaching to the semiconductor refrigeration sheet 23 and then exchange heat through the fins.

[0047] As another alternative implementation, the heat-dissipating fin flow channel 221 can also be extended in a manner inclined relative to the vertical direction, so that the upward force of the hot air rising can also be utilized.

[0048] More preferably, as Figure 1 shown, in the technical solution of this embodiment, the hot air outlet 13 is connected to the top of the hot air flow channel a, which can also make the hot air in the hot air flow channel a conform to the principle of hot air rising, facilitating the discharge of the hot air. More preferably, the hot air outlet 13 is located at the top of the air conditioner housing 10, which is equivalent to setting the hot air outlet 13 at the highest position of the air conditioner housing 10 to achieve a certain chimney effect.

[0049] As Figure 3 、 Figure 5 and Figure 10As shown in the figure, the extending direction of the cold-dissipating fin flow channel 211 is consistent with the air inlet direction of the air return opening 11. During use, the hot air in the room enters the air conditioner housing 10 from the air return opening 11. A part of the air flow enters the cold-dissipating fin flow channel 211, and a part of the air flow enters the heat-dissipating fin flow channel 221. The air flow entering the heat-dissipating fin flow channel 221 takes away the heat on the heat-dissipating fins and finally discharges to the outside through the hot air flow channel a from the hot air outlet 13; the air flow entering the cold-dissipating fin flow channel 211 takes away the cold of the cold-dissipating fins and then discharges to the room through the cold air flow channel b from the cold air outlet 12. Since the air flow entering from the air return opening 11 can directly blow into the cold-dissipating fin flow channel 211, the air speed in the cold-dissipating fin flow channel 211 can be increased, thereby improving the refrigeration efficiency of the semiconductor air conditioner. As a preferred embodiment, the air return opening 11 is located on the side of the air conditioner housing 10, the cold-dissipating fins are arranged horizontally, and the cold-dissipating fin flow channel 211 extends horizontally. In this way, the extending direction of the cold-dissipating fin flow channel 211 is consistent with the air inlet direction of the air return opening 11, which is beneficial for the air flow entering from the air return opening 11 to directly blow into the cold-dissipating fin flow channel 211. Optionally, the cold air flow channel b is arranged vertically, and the cold air outlet 12 is opened on the lower side of the air conditioner housing 10. In this way, the sedimentation effect of the cold air flow can be utilized to increase the air speed of the cold air blown out.

[0050] As Figure 1 shown, in the technical solution of this embodiment, there are two air return openings 11, which are respectively located on both sides of the air conditioner housing 10. There are also two heat exchange structure assemblies 20, which are respectively arranged corresponding to the two air return openings 11. The cold air flow channel b is formed between the two heat exchange structure assemblies 20. In this way, the processing efficiency of the indoor hot air can be improved. The indoor air respectively flows into the two heat exchange structure assemblies 20 from the air return openings 11 on both sides of the air conditioner housing 10 for more efficient refrigeration. Preferably, filter nets are installed on the air return openings 11 to reduce the attachment of pollutants in the air to the heat exchange structure assembly 20. Preferably, the filter nets can be disassembled by pressing the snap buttons, which is convenient for cleaning the oil stains accumulated in the filter nets.

[0051] More preferably, in the technical solution of this embodiment, there are multiple cold air outlets 12, and the multiple cold air outlets 12 are arranged at intervals to increase the air supply volume. More preferably, as Figure 2 shown, there are two cold air outlets 12, and swing mechanisms are respectively arranged on the two cold air outlets 12 to meet the requirement of multi-directional air supply.

[0052] As Figure 6 、 Figure 7As shown, optionally, the heat exchange structure assembly 20 further includes an air duct plate 24, and the cold dissipation heat exchange structure 21 and the heat dissipation heat exchange structure 22 are installed between the air duct plates 24. The air duct plate 24 is provided with a cold dissipation inlet 241 and a cold dissipation outlet 242 that communicate with the cold dissipation fin channels 211. The cold dissipation inlet 241 faces the return air outlet 11, and the cold dissipation outlet 242 communicates with the hot air flow channel a. During installation and use, directly align the cold dissipation inlet 241 on the air duct plate 24 with the return air outlet 11, and connect the cold dissipation outlet 242 with the hot air flow channel a to complete the installation of the heat exchange structure assembly 20. In the technical solution of this embodiment, the air duct plate 24 serves to relatively separate the cold dissipation fin channels 211 of the cold dissipation heat exchange structure 21 and the heat dissipation fin channels 221 of the heat dissipation heat exchange structure 22. As another alternative embodiment, as Figure 12 shown, it is also possible to have the air duct plate 24 cover the top of the heat dissipation heat exchange structure 22, and provide a heat dissipation inlet and a heat dissipation outlet 243 on the air duct plate 24 that communicate with the heat dissipation fin channels 221.

[0053] As Figure 7 , Figure 8 and Figure 9 shown, one cold dissipation heat exchange structure 21, one heat dissipation heat exchange structure 22 and at least one thermoelectric cooler 23 form a heat exchange structure unit c. There are multiple heat exchange structure units c, and the multiple heat exchange structure units c are arranged adjacent to each other. Specifically, at least one thermoelectric cooler 23 is assembled between one cold dissipation heat exchange structure 21 and one heat dissipation heat exchange structure 22. The fins of one cold dissipation heat exchange structure 21 and one heat dissipation heat exchange structure 22 face away from each other, forming cold dissipation fin channels 211 and heat dissipation fin channels 221 where heat and cold do not interfere with each other, making clever use of the characteristics of the profile cold dissipator and effectively utilizing the internal space of the unit. During installation, one cold dissipation heat exchange structure 21 and one heat dissipation heat exchange structure 22 can be tightly connected together using bolts. It should also be noted that the advantage of using multiple heat exchange structure units c is that the operations between the multiple heat exchange structure units c are independent of each other and do not affect each other, improving the fault tolerance rate; at the same time, during maintenance, only the heat exchange structure unit c with the faulty part needs to be disassembled, reducing the maintenance difficulty. In this way, the fault tolerance rate of the heat exchange structure of the semiconductor air conditioner can be improved. When a part of the heat exchange structure fails, it does not affect the operation of other parts of the heat exchange structure, and at the same time, the maintenance is accurate and convenient.

[0054] More preferably, as Figure 7As shown, in the technical solution of this embodiment, in the thickness direction, the heat dissipation and heat exchange structures 22 of two adjacent heat exchange structure units c are arranged opposite to each other, and the cold dissipation and heat exchange structures 21 of two adjacent heat exchange structure units c are arranged opposite to each other. The advantage of this is that the hot sides of two adjacent heat exchange structure units c are close to and in contact with each other; the cold sides are close to and in contact with each other, effectively preventing the phenomenon of thermal short circuit and neutralization between two adjacent heat exchange structure units c. At the same time, the formation of the air duct is orderly and compact, and the air resistance becomes smaller, which is beneficial to providing air volume.

[0055] As a more preferred embodiment, in the width direction, the heat dissipation and heat exchange structures 22 of two adjacent heat exchange structure units c are arranged side by side, and the cold dissipation and heat exchange structures 21 of two adjacent heat exchange structure units c are arranged side by side, so as to increase the cooling capacity.

[0056] It should be noted that in the technical solution of this application, the width direction and the thickness direction refer to the directions shown in the appendix Figure 7 This direction is a description made to more clearly explain the technical solution of the present invention and does not constitute a limitation on the semiconductor air conditioner structure.

[0057] Optionally, as Figure 1 shown, a hot air exhaust device a1 is arranged in the hot air flow channel a, and a cold air exhaust device b1 is arranged in the cold air flow channel b. The hot air exhaust device a1 provides the driving force for the air flow in the hot air flow channel a, and the cold air exhaust device b1 provides the driving force for the air flow in the cold air flow channel b. Optionally, both the hot air exhaust device a1 and the cold air exhaust device b1 are centrifugal fans. The centrifugal fan includes a motor and a centrifugal impeller that is drivingly connected to the motor. Since the hot air discharged from the unit needs to be cooled in time in the hot air flow channel a, the discharged hot air can be transported to the outside through a pipeline. The transportation distance is long, and a ventilation system with strong anti-static pressure ability is required. The centrifugal impeller adopted in the present invention is arranged on the main exhaust air duct, and the generated sufficient negative pressure can make the air ducts on each heat exchange structure unit c form an air field, thereby improving the energy efficiency of the heat exchange structure unit c. Optionally, in the technical solution of this embodiment, the cold air exhaust device b1 is installed in the water receiving tray 30.

[0058] As Figure 5As shown in the figure, the cold air exhaust mode is as follows: under the action of the cold air exhaust device b1, the air flow passes through the cold air inlet 241 on the air duct plate 24 from the air return openings 11 on both sides of the air conditioner housing 10, enters the cold-dissipating fin flow channel 211 of the heat exchange structure 21, and after heat exchange, enters the middle cold air flow channel b through the cold-dissipating outlet 242, and then goes in the direction of the cold air exhaust device b1, passes through the cold air exhaust device b1, and is discharged through the cold air outlet 12. This cold air exhaust device b1 is arranged on the cold air flow channel b, so that a wind field can be formed in each air duct of each heat exchange structure unit c on a small main air duct, effectively avoiding the influence of uneven wind field on the performance of the unit.

[0059] As Figure 4 shown in the figure, the hot air exhaust mode is as follows: under the action of the hot air exhaust device a1, the air flow reaches the heat exchange structure assembly 20 from the air return openings 11 on both sides of the air conditioner housing 10. Due to the blockage of the air duct plate 24, the air flow can only enter the heat dissipation fin flow channel 221 through the opening of the heat dissipation fin flow channel 221 at the bottom of the heat exchange structure assembly 20, and then gradually heats up upward and enters the hot air flow channel a, and then passes through the hot air exhaust device a1 and is discharged from the hot air outlet 13.

[0060] As Figure 4 and Figure 13 shown in the figure, as a preferred embodiment, the semiconductor air conditioner further includes a water receiving tray 30, and the water receiving tray 30 is arranged at the bottom of the cold air flow channel b. In this way, the condensed water on the heat dissipation and heat exchange structure 22 can flow into the water receiving tray 30 under the guiding action of the cold air flow channel b. More preferably, a drain hole 32 is opened at the bottom of the water receiving tray 30, and the drain hole 32 is used for draining water, so as to drain the condensed water in the water receiving tray 30 in time and avoid overflow. More preferably, after the water receiving tray 30 is assembled, its periphery is sealed to prevent the air passing through the cold air flow channel b from leaking out and affecting the refrigeration effect.

[0061] As an alternative embodiment, the water receiving tray 30 forms at least part of the cold air flow channel b, and an air outlet 31 communicating with the cold air outlet 12 is formed on the water receiving tray 30. That is, the cold air first passes through the air outlet 31 and then blows into the room through the cold air outlet 12.

[0062] As Figure 14As shown, in the technical solution of this embodiment, the semiconductor air conditioner further includes a water cooling component 50. The water cooling component 50 is connected between the water receiving tray 30 and the heat exchange structure component 20. The water cooling component 50 is used to suck condensed water from the water receiving tray 30 and spray the condensed water above the heat dissipation heat exchange structure 22. In this way, in the technical solution of the present invention, the condensed water generated during operation can be transferred to the heat dissipation fins of the heat dissipation heat exchange structure 22 to assist in cooling the heat dissipation heat exchange structure 22, thereby improving the refrigeration efficiency of the heat exchange structure component 20. In addition, since the heat dissipation fins and the heat dissipation fin channels 221 of the heat dissipation heat exchange structure 22 extend in the vertical direction, it helps the condensed water to flow downward along the heat dissipation fins under the action of gravity.

[0063] As an alternative embodiment, as Figure 15 shown, in the technical solution of this embodiment, the water cooling component 50 includes a water pump 51 and a drain pipe 52. The water pump 51 is installed in the water receiving tray 30 for sucking water from the water receiving tray 30. The first end of the drain pipe 52 is connected to the water pump 51, and the second end of the drain pipe 52 is located above the heat dissipation heat exchange structure 22. During use, the water pump 51 sucks water from the water receiving tray 30 and sprays the condensed water above the heat exchange structure 22 through the drain pipe 52. More preferably, the water cooling component 50 further includes a spray head 53. The spray head 53 is installed at the second end of the drain pipe 52 for spraying condensed water above the heat dissipation heat exchange structure 22. By spraying water on the heat dissipation heat exchange structure 22 through the spray head 53, the spraying of the condensed water can be made more uniform. Preferably, the spray head 53 is provided with a plurality of small holes so that the condensed water can be evenly sprinkled on the heat dissipation heat exchange structure 2.

[0064] More preferably, as Figure 1 shown, the semiconductor air conditioner further includes a controller 40. The controller 40 is arranged in the air conditioner housing 10 to realize the control of each component in the semiconductor air conditioner. It should also be noted that when the positive and negative poles of the semiconductor refrigeration sheet 23 in the above heat exchange structure unit c are reversely connected, the refrigeration and heating airflows are just interchanged.

[0065] As Figure 16 shown, the semiconductor air conditioner of the present invention can be installed on the wall 70. The hot air outlet 13 can directly pass through the glass 71 on the wall 70 through the air duct 60.

[0066] It should be noted that the semiconductor air conditioner of the present invention is particularly suitable for kitchens. This semiconductor air conditioner is not equipped with a compressor, only the fan runs, and the noise value is as low as 41 dB, greatly improving the user experience. The double air outlet design meets the air supply requirements when multiple people are active in the kitchen. At the same time, the unit only needs to be installed indoors, and the installation work amount is much lower than that of traditional air conditioners, reducing the installation cost.

[0067] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and variations can be made to the embodiments of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor air conditioner, characterized in that, Comprising: An air conditioner housing (10), on which an air return opening (11), a cold air outlet (12), and a hot air outlet (13) are respectively formed. A hot air flow channel (a) communicating with the hot air outlet (13) is formed inside the air conditioner housing (10); A heat exchange structure assembly (20), including a cold dissipation heat exchange structure (21), a heat radiation heat exchange structure (22), and a semiconductor refrigeration sheet (23) installed between the cold dissipation heat exchange structure (21) and the heat radiation heat exchange structure (22). A cold dissipation fin flow channel (211) is formed on the cold dissipation heat exchange structure (21), and a heat radiation fin flow channel (221) is formed on the heat radiation heat exchange structure (22). Two ends of the heat radiation fin flow channel (221) are respectively connected to the air return opening (11) and the hot air flow channel (a). The heat radiation fin flow channel (221) extends in a vertical direction or in a manner inclined relative to the vertical direction, and the hot air flow channel (a) is located above the heat radiation fin flow channel (221); The hot air outlet (13) is connected to the top of the hot air flow channel (a); A cold air flow channel (b) communicating with the cold air outlet (12) is further formed inside the air conditioner housing (10). Two ends of the cold dissipation fin flow channel (211) are respectively connected to the air return opening (11) and the cold air flow channel (b). The extending direction of the cold dissipation fin flow channel (211) is consistent with the air inlet direction of the air return opening (11); The air return opening (11) is located on the side surface of the air conditioner housing (10), and the cold dissipation fin flow channel (211) extends in a horizontal direction or in a manner inclined relative to the horizontal direction; The cold air flow channel (b) is arranged in a vertical direction, and the cold air outlet (12) is formed on the lower side of the air conditioner housing (10); The cold air flow direction and the heat radiation air flow direction of the heat exchange structure assembly (20) are relatively perpendicular and isolated from each other; The semiconductor air conditioner further includes a water receiving tray (30), and the water receiving tray (30) is arranged at the bottom of the cold air flow channel (b).

2. The semiconductor air conditioner according to claim 1, characterized in that, The hot air outlet (13) is located on the top of the air conditioner housing (10).

3. The semiconductor air conditioner according to claim 1, wherein There are two air return openings (11), which are respectively located on both sides of the air conditioner housing (10). There are also two heat exchange structure assemblies (20), which are respectively arranged corresponding to the two air return openings (11). The cold air flow channel (b) is formed between the two heat exchange structure assemblies (20).

4. The semiconductor air conditioner according to claim 1, wherein A drain hole (32) is formed at the bottom of the water receiving tray (30), and the drain hole (32) is used for draining water.

5. The semiconductor air conditioner according to claim 1, wherein, The water receiving tray (30) constitutes at least part of the cold air flow channel (b), and an air outlet (31) communicating with the cold air outlet (12) is formed on the water receiving tray (30).

6. The semiconductor air conditioner according to claim 1, characterized in that, The semiconductor air conditioner further includes a water cooling component (50), which is connected between the water receiving tray (30) and the heat exchange structure component (20). The water cooling component (50) is configured to suck condensed water from the water receiving tray (30) and spray the condensed water above the heat dissipation heat exchange structure (22).

7. The semiconductor air conditioner according to claim 6, wherein The water cooling component (50) includes: a water pump (51) installed in the water receiving tray (30) for sucking water from the water receiving tray (30); a drain pipe (52), the first end of the drain pipe (52) is connected to the water pump (51), and the second end of the drain pipe (52) is located above the heat dissipation heat exchange structure (22).

8. The semiconductor air conditioner according to claim 7, characterized in that The water cooling component (50) further includes a spray head (53), and the spray head (53) is installed at the second end of the drain pipe (52) for spraying condensed water above the heat dissipation heat exchange structure (22).

9. The semiconductor air conditioner according to claim 1, characterized in that, The heat exchange structure component (20) further includes an air duct plate (24). The cold dissipation heat exchange structure (21) and the heat dissipation heat exchange structure (22) are installed between the air duct plates (24). The air duct plate (24) is provided with a cold dissipation inlet (241) and a cold dissipation outlet (242) that communicate with the cold dissipation fin flow channel (211). The cold dissipation inlet (241) is opposite to the return air outlet (11), and the cold dissipation outlet (242) communicates with the hot air flow channel (a).

10. The semiconductor air conditioner according to claim 1, characterized in that, One cold dissipation heat exchange structure (21), one heat dissipation heat exchange structure (22) and at least one semiconductor refrigeration sheet (23) form a heat exchange structure unit (c). There are multiple heat exchange structure units (c), and multiple heat exchange structure units (c) are arranged adjacent to each other.

11. The semiconductor air conditioner according to claim 10, wherein, In the thickness direction, the heat dissipation heat exchange structures (22) of two adjacent heat exchange structure units (c) are arranged opposite to each other, and / or the cold dissipation heat exchange structures (21) of two adjacent heat exchange structure units (c) are arranged opposite to each other.

12. The semiconductor air conditioner according to claim 10, characterized in that, In the width direction, the heat dissipation heat exchange structures (22) of two adjacent heat exchange structure units (c) are arranged side by side, and the cold dissipation heat exchange structures (21) of two adjacent heat exchange structure units (c) are arranged side by side.

13. The semiconductor air conditioner according to claim 1, wherein, A hot air exhaust device (a1) is arranged in the hot air flow channel (a), and a cold air exhaust device (b1) is arranged in the cold air flow channel (b).

14. The semiconductor air conditioner according to claim 1, characterized in that, There are multiple cold air outlets (12), and multiple cold air outlets (12) are arranged at intervals.

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