Heat exchange device and air conditioner using semiconductor refrigeration

Abstract

The present invention discloses a heat exchange device and air conditioner using semiconductor refrigeration, the heat exchange device comprising: an inner heat exchanger, the inner heat exchanger is annular; a semiconductor refrigeration device, the semiconductor refrigeration device has a cold end and a hot end, the hot end of the semiconductor refrigeration device is attached to the outer peripheral wall of the inner heat exchanger; an outer heat exchanger, the outer heat exchanger is annular, the outer heat exchanger is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigeration device is attached to the inner peripheral wall of the outer heat exchanger. The heat exchange device of the present invention sleeves the annular outer heat exchanger on the outside of the inner heat exchanger, and arranges the semiconductor refrigeration device between the two, so that the heat dissipation of the hot end of the semiconductor refrigeration device can be dissipated by the inner heat exchanger, and the temperature of the cold end of the semiconductor refrigeration device is continuously reduced during the continuous heat dissipation of the inner heat exchanger, thereby improving the refrigeration effect.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchangers, and in particular to a heat exchange device and an air conditioner using semiconductor refrigeration. Background Art

[0002] Semiconductor refrigeration is also called electronic refrigeration or thermoelectric refrigeration. It uses a PN junction composed of special semiconductor materials to form a thermocouple pair to produce the Peltier effect. Specifically, when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a thermocouple pair, after a DC current is connected in this circuit, energy transfer can be generated. The current flows from the N-type element to the P-type element joint to absorb heat and become the cold end; the current flows from the P-type element to the N-type element joint to release heat and become the hot end. The amount of energy transfer is determined by the size of the current and the number of element pairs of the semiconductor materials N and P.

[0003] By using semiconductor materials and indoor heat exchangers to change the refrigeration principle, it can theoretically be integrated and the outdoor unit can be eliminated.

[0004] However, due to the resistance of the semiconductor itself, when the current passes through the semiconductor, heat will be generated, which will affect the heat transfer. Only by dissipating the heat on the hot side in a timely and efficient manner can the cooling capacity of the cold side be obtained efficiently. The better the heat dissipation effect of the hot end of the semiconductor heat exchanger, the higher the cooling efficiency. Summary of the invention

[0005] The invention discloses a heat exchange device and an air conditioner using semiconductor refrigeration, which solves the problem of poor effect of existing semiconductor refrigeration.

[0006] According to one aspect of the present invention, a heat exchange device is disclosed, comprising: an inner heat exchanger, which is annular; a semiconductor refrigeration device, which has a cold end and a hot end, and the hot end of the semiconductor refrigeration device is attached to the outer peripheral wall of the inner heat exchanger; an outer heat exchanger, which is annular and is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigeration device is attached to the inner peripheral wall of the outer heat exchanger.

[0007] Furthermore, the inner peripheral wall of the internal heat exchanger forms a heat dissipation channel, and a fan is arranged in the heat dissipation channel.

[0008] Furthermore, a plurality of heat sinks are arranged at intervals on the inner peripheral wall of the internal heat exchanger.

[0009] Furthermore, a water storage tank is provided on the inner wall of the internal heat exchanger.

[0010] Furthermore, a heat sink is arranged on the outer periphery of the external heat exchanger, and the heat sink is arranged at an angle.

[0011] Furthermore, the plane where the heat sink is located forms an angle with the axis of the external heat exchanger.

[0012] Furthermore, the heat sinks are in multiple groups, the heat sinks in the same group are spaced apart along the circumferential direction of the external heat exchanger, and the heat sinks in the multiple groups are spaced apart along the axial direction of the external heat exchanger.

[0013] Furthermore, the heat sinks of two adjacent groups are arranged one-to-one and symmetrically.

[0014] Furthermore, the heat exchange device further comprises: a thermal insulation layer, wherein the thermal insulation layer is arranged between the inner heat exchanger and the outer heat exchanger, and the semiconductor refrigeration device is embedded in the thermal insulation layer.

[0015] Furthermore, the semiconductor refrigeration device includes a semiconductor refrigeration sheet.

[0016] According to another aspect of the present invention, an air conditioner is disclosed, comprising the above-mentioned heat exchange device.

[0017] Furthermore, the air conditioner further comprises: a shell, and the heat exchange device is arranged in the shell.

[0018] Furthermore, a partition is provided in the shell, and the partition divides the interior of the shell into a heat exchange chamber and a fan chamber. One end of the partition is connected to the inner wall of the shell, and a flow channel is formed between the other end and the inner wall of the shell. The heat exchange chamber and the fan chamber are connected through the flow channel. The shell is also provided with an air inlet connected to the heat exchange chamber, and a cold air outlet connected to the fan chamber, and the heat exchange device is arranged in the heat exchange chamber.

[0019] Furthermore, the internal heat exchanger has a heat dissipation channel, and the shell is also provided with a return air port and a hot air outlet, and the return air port and the hot air outlet are connected to both ends of the heat dissipation channel.

[0020] Furthermore, the air conditioner also includes: a second fan, which is arranged in the fan cavity, and the partition is located between the heat exchange device and the second fan, and the partition is used to guide cold air and condensed water generated by the external heat exchanger into the fan cavity. The setting position of the partition can prevent condensed water from dripping onto the second fan.

[0021] Furthermore, the air conditioner further comprises: a water receiving tray, wherein the water receiving tray is in the fan cavity, and the water receiving tray is used to collect condensed water entering the fan cavity.

[0022] Furthermore, the air conditioner also includes a water pump, which is arranged on the water receiving tray; a water storage tank is arranged on the inner wall of the internal heat exchanger, and the water pump is connected to the water storage tank arranged on the internal heat exchanger through a pipeline.

[0023] The heat exchange device of the present invention is configured such that an annular outer heat exchanger is sleeved on the outside of an inner heat exchanger and a semiconductor refrigeration device is arranged between the two, so that the heat dissipated at the hot end of the semiconductor refrigeration device can be dissipated through the inner heat exchanger. During the continuous heat dissipation process of the inner heat exchanger, the temperature of the cold end of the semiconductor refrigeration device is continuously reduced, thereby improving the refrigeration effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention;

[0025] Figure 2 is a cross-sectional view of a heat exchange device according to an embodiment of the present invention;

[0026] Figure 3 is a structural schematic diagram of an air conditioner according to an embodiment of the present invention;

[0027] Legend: 10. Internal heat exchanger; 11. Heat dissipation channel; 12. Water storage tank; 20. Semiconductor refrigeration device; 30. External heat exchanger; 40. First fan; 50. Heat sink; 60. Insulation layer; 70. Shell; 71. Air inlet; 72. Cold air outlet; 76. Partition; 77. Heat exchange chamber; 78. Fan chamber; 79. Flow channel; 80. Second fan; 91. Water tray; 92. Water pump. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the embodiments, but is not limited to the contents of the description.

[0029] like Figure 1 and Figure 2 The present invention discloses a heat exchange device, including: an inner heat exchanger 10, a semiconductor refrigeration device 20 and an outer heat exchanger 30, wherein the inner heat exchanger 10 is annular; the semiconductor refrigeration device 20 has a cold end and a hot end, and the hot end of the semiconductor refrigeration device 20 is attached to the outer peripheral wall of the inner heat exchanger 10; the outer heat exchanger 30 is annular, and the outer heat exchanger 30 is sleeved on the inner heat exchanger 10, and the cold end of the semiconductor refrigeration device 20 is attached to the inner peripheral wall of the outer heat exchanger 30. The heat exchange device of the present invention, by sleeve-type outer heat exchanger 30 on the outside of the inner heat exchanger 10, and arranging the semiconductor refrigeration device 20 between the two, can dissipate heat from the hot end of the semiconductor refrigeration device 20 through the inner heat exchanger 10, and the temperature of the cold end of the semiconductor refrigeration device 20 is continuously reduced during the continuous heat dissipation of the inner heat exchanger 10, thereby improving the refrigeration effect.

[0030] In the above embodiment, the inner peripheral wall of the inner heat exchanger 10 forms a heat dissipation channel 11, and a fan 40 is arranged in the heat dissipation channel 11. The heat exchange device of the present invention can form forced convection by arranging the fan in the heat dissipation channel 11, thereby improving the heat dissipation effect of the hot end of the semiconductor refrigeration device 20, thereby improving the refrigeration effect of the cold end.

[0031] In the above embodiment, a plurality of fins 50 are arranged at intervals on the inner peripheral wall of the inner heat exchanger 10. The heat exchange device of the present invention can greatly improve the heat exchange effect by arranging a plurality of fins 50 at intervals on the inner peripheral wall of the inner heat exchanger 10.

[0032] In the above embodiment, the outer periphery of the external heat exchanger 30 is provided with a heat sink 50, and the heat sink 50 is arranged obliquely. The heat exchange device of the present invention increases the heat exchange area by arranging the heat sink 50 obliquely, and also facilitates the condensed water to drip into the water receiving pan to prevent water accumulation, thereby better protecting the external heat exchanger 30 from being corroded by the condensed water and increasing the service life.

[0033] In the above embodiment, the plane where the heat sink 50 is located forms an angle with the axis of the external heat exchanger 30. The heat exchange device of the present invention increases the heat exchange area while facilitating the condensed water to drip into the water receiving pan to prevent water accumulation, thereby better protecting the external heat exchanger 30 from being corroded by the condensed water and increasing its service life.

[0034] In the above embodiment, the heat sink 50 is composed of multiple groups, and the heat sinks 50 in the same group are arranged at intervals along the circumference of the external heat exchanger 30, and the heat sinks 50 in the multiple groups are arranged at intervals along the axial direction of the external heat exchanger 30. The heat exchange device of the present invention increases the heat exchange area while facilitating the condensed water to drip into the water receiving pan to prevent water accumulation, better protect the external heat exchanger 30 from being corroded by the condensed water, and increase the service life.

[0035] In the above embodiment, a water storage tank (12) is provided on the inner wall of the internal heat exchanger (10). The heat exchange device of the present invention can drain condensed water into the water storage tank 12 by providing the water storage tank 12, and use the coldness of the condensed water to cool the internal heat exchanger 10, thereby improving the heat dissipation effect.

[0036] In the above embodiment, two adjacent groups of heat sinks 50 are arranged one by one and symmetrically. The heat exchange device of the present invention not only increases the heat exchange area, but also facilitates condensed water to drip into the water receiving tray to prevent water accumulation, better protects the external heat exchanger 30 from being corroded by condensed water, and increases its service life.

[0037] In the above embodiment, the heat exchange device further includes: a heat preservation layer 60, the heat preservation layer 60 is arranged between the inner heat exchanger 10 and the outer heat exchanger 30, and the semiconductor refrigeration device 20 is embedded in the heat preservation layer 60. The heat exchange device of the present invention, by arranging the heat preservation layer 60 between the inner heat exchanger 10 and the outer heat exchanger 30, and embedding the semiconductor refrigeration device 20 in the heat preservation layer 60, can prevent the semiconductor refrigeration device 20 from performing heat exchange through the gap between the inner heat exchanger 10 and the outer heat exchanger 30, thereby effectively improving the cooling effect.

[0038] In the above-mentioned embodiment, the semiconductor refrigeration device 20 includes a semiconductor refrigeration sheet.

[0039] like Figure 3 As shown, according to another aspect of the present invention, an air conditioner is also disclosed, comprising the above-mentioned heat exchange device.

[0040] In the above embodiment, the air conditioner further includes: a housing 70, and the heat exchange device is arranged in the housing 70. The heat exchange device of the present invention achieves indoor heat exchanger integration by using a new refrigeration principle and a new structural design. The integrated body simplifies the air conditioner installation steps, and the overall absence of a compressor and an electronic expansion valve reduces the noise source and improves the user experience.

[0041] In the above embodiment, a partition 76 is provided in the housing 70, and the partition 76 divides the interior of the housing 70 into a heat exchange chamber 77 and a fan chamber 78. One end of the partition 76 is connected to the inner wall of the housing 70, and the other end forms a flow passage 79 with the inner wall of the housing 70. The heat exchange chamber 77 is connected to the fan chamber 78 through the flow passage 79. The housing 70 is also provided with an air inlet 71 connected to the heat exchange chamber 77, and a cold air outlet 72 connected to the fan chamber 78. The heat exchange device is arranged in the heat exchange chamber 77. The air conditioner of the present invention ensures that a flow passage is formed in the unit by arranging an air inlet 71 and an air outlet 72. After the air enters from the air inlet 71, it exchanges heat with the heat exchange device to form cold air, and is discharged from the air outlet 72. Considering that this unit is used in the kitchen, a detachable filter assembly is added at the top air inlet 72 to facilitate self-cleaning of the unit.

[0042] In the above embodiment, the internal heat exchanger 10 has a heat dissipation channel 11, and the housing 70 is also provided with a return air port and a hot air outlet, which are connected to both ends of the heat dissipation channel 11. A mesh plate is provided on the return air port, which mainly plays a protective role to prevent the high-speed fan from accidentally injuring the user.

[0043] In the above embodiment, the air conditioner also includes: a second fan 80, the second fan 80 is arranged in the fan cavity 78, the partition 76 is located between the heat exchange device and the second fan 80, the partition 76 is used to guide the cold air and the condensed water generated by the external heat exchanger 30 into the fan cavity 78, and the setting position of the partition 76 can prevent the condensed water from dripping on the second fan 80. The air conditioner of the present invention can discharge the cold air from the air outlet 72 by setting the second fan 80. The partition 76 plays two roles. One is to form a partition after being connected to the shell to ensure that the condensed water will not fall directly into the return air center area of ​​the second fan 80 to prevent the unit from blowing water when it is running. The second role is to control the wind direction flow in the cold air cavity by using the wall effect through the corner design at the rear end of the partition 76, which belongs to a multi-purpose object.

[0044] In the above embodiment, the air conditioner further includes: a water receiving tray 91 , the water receiving tray 91 is in the fan cavity 78 , and the water receiving tray 91 is used to collect condensed water entering the fan cavity 78 .

[0045] In the above embodiment, the air conditioner further includes a water pump 92, which is disposed on the water receiving tray 91; a water storage tank is disposed on the inner wall of the internal heat exchanger 10, and the water pump 92 is connected to the water storage tank disposed on the internal heat exchanger 10 through a pipeline.

[0046] The heat dissipation channel 11 of the air conditioner internal heat exchanger 10 of the present invention is not connected to the cold air cavity, and is only connected to the indoor and outdoor through the return air port and the hot air outlet. After the air conditioner is started, the first motor rotates to drive the indoor air to flow outdoors. The heat on the surface of the internal heat exchanger 10 is brought to the outdoors, and the heat of the hot surface is dissipated in a timely and efficient manner, so that the efficient cooling capacity of the cold surface can be obtained, and the higher the cooling efficiency. Two small holes are opened on the horizontal surface of the internal heat exchanger 10, so that the water pump outlet pipe can be partially inserted. The internal heat exchanger 10 is grooved at the place where the water pump drain pipe is inserted, so that the low-temperature condensed water flows along the surface of the internal heat exchanger 10 to the bottom water storage tank, and partially evaporates in the process to take away the heat of the hot surface.

[0047] Under the action of the water pump, the condensed water flowing into the water receiving pan 91 is pumped out and then flows into the internal heat exchanger 10. By controlling the tank width and the water pump power, it is ensured that the condensed water in the water storage tank will not overflow. Through this recycling method, the maximum cooling capacity and energy efficiency of the heat exchanger are improved.

[0048] The heat exchange device of the present invention achieves indoor heat exchanger integration through the use of new refrigeration principles and new structural design. The integrated body simplifies the air conditioner installation steps. The overall absence of a compressor and an electronic expansion valve reduces the noise source and improves the user experience. The mesh plate mainly plays a protective role to prevent the high-speed fan from accidentally injuring the user. After the air flows through the filter assembly at the top air inlet 71 of the shell 70, it flows along the annular external heat exchanger 30 to the bottom cold air chamber. In this process, the external heat exchanger 30 and the shell 70 are partially symmetrical structures to ensure that the wind can flow evenly through the left and right ends of the external heat exchanger 30. The water vapor in the indoor air condenses on the surface of the external heat exchanger 30 after passing through the external heat exchanger 30. Heat exchange refrigeration is thereby achieved.

[0049] In the above-mentioned embodiment, the air conditioner is used in the kitchen.

[0050] Obviously, the above-mentioned embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the embodiments here. Any obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. An air conditioner comprising a heat exchange device, It is characterized in that The heat exchange device comprises: An internal heat exchanger (10), wherein the internal heat exchanger (10) is annular; A semiconductor refrigeration device (20), the semiconductor refrigeration device (20) having a cold end and a hot end, the hot end of the semiconductor refrigeration device (20) being attached to the outer peripheral wall of the inner heat exchanger (10); An external heat exchanger (30), the external heat exchanger (30) is annular, the external heat exchanger (30) is sleeved on the internal heat exchanger (10), and the cold end of the semiconductor refrigeration device (20) is attached to the inner peripheral wall of the external heat exchanger (30); The air conditioner further comprises a shell (70), the heat exchange device is arranged in the shell (70), a partition (76) is arranged in the shell (70), the partition (76) divides the interior of the shell (70) into a heat exchange chamber (77) and a fan chamber (78), one end of the partition (76) is connected to the inner wall of the shell (70), and the other end forms a flow passage (79) with the inner wall of the shell (70), and the heat exchange chamber (77) and the fan chamber (78) are connected by a heat exchange passage (79). The flow passage (79) is connected, the shell (70) is also provided with an air inlet (71) connected to the heat exchange chamber (77), and a cold air outlet (72) connected to the fan chamber (78), the heat exchange device is arranged in the heat exchange chamber (77), the internal heat exchanger (10) has a heat dissipation channel (11), and the shell (70) is also provided with a return air port and a hot air outlet, and the return air port and the hot air outlet are connected to both ends of the heat dissipation channel (11); The air conditioner also includes a second fan (80), which is arranged in the fan cavity (78). The partition (76) is located between the heat exchange device and the second fan (80). The partition (76) is used to guide cold air and condensed water generated by the external heat exchanger (30) into the fan cavity (78). The setting position of the partition (76) can prevent condensed water from dripping onto the second fan (80).

2. The air conditioner according to claim 1, It is characterized in that The inner peripheral wall of the internal heat exchanger (10) forms a heat dissipation channel (11), and a first fan (40) is arranged in the heat dissipation channel (11).

3. The air conditioner according to claim 1, It is characterized in that A plurality of heat sinks (50) are arranged at intervals on the inner peripheral wall of the internal heat exchanger (10).

4. The air conditioner according to claim 1, It is characterized in that A water storage tank is provided on the inner wall of the internal heat exchanger (10).

5. The air conditioner according to claim 1, It is characterized in that The outer periphery of the external heat exchanger (30) is provided with heat sinks (50), and the heat sinks (50) are arranged at an angle.

6. The air conditioner according to claim 5, It is characterized in that The plane where the heat sink (50) is located forms an angle with the axis of the external heat exchanger (30).

7. The air conditioner according to claim 5, It is characterized in that The heat sinks (50) are arranged in a plurality of groups. The heat sinks (50) in the same group are arranged at intervals along the circumference of the external heat exchanger (30). The heat sinks (50) in the plurality of groups are arranged at intervals along the axial direction of the external heat exchanger (30).

8. The air conditioner according to claim 7, It is characterized in that The heat sinks (50) of two adjacent groups correspond to each other and are symmetrically arranged.

9. The air conditioner according to claim 1, It is characterized in that The heat exchange device also includes: A thermal insulation layer (60), wherein the thermal insulation layer (60) is arranged between the internal heat exchanger (10) and the external heat exchanger (30), and the semiconductor refrigeration device (20) is embedded in the thermal insulation layer (60).

10. The air conditioner according to claim 1, It is characterized in that The semiconductor refrigeration device (20) comprises a semiconductor refrigeration sheet.

11. The air conditioner according to claim 1, It is characterized in that The air conditioner also includes: A water receiving tray (91), wherein the water receiving tray (91) is inside the fan cavity (78), and the water receiving tray (91) is used to collect condensed water entering the fan cavity (78).

12. The air conditioner according to claim 11, It is characterized in that The air conditioner further comprises a water pump (92), and the water pump (92) is arranged on the water receiving tray (91); a water storage tank is arranged on the inner wall of the internal heat exchanger (10), and the water pump (92) is connected to the water storage tank arranged on the internal heat exchanger (10) through a pipeline.

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