A method for preparing a chip resistor and a chip resistor

Abstract

The present invention discloses a method for preparing a chip resistor and the chip resistor, the preparation method comprising: laminating the first surface of a polymer fiber resin film with the bonding surface of a resistor body layer; forming a protective layer in the central area of ​​the forming surface of the resistor body layer; the forming surface is opposite to the bonding surface; and at least two electrodes are formed on the forming surface offset from the central area to obtain a chip resistor. The chip resistor prepared by the preparation method of the present invention has the advantages of more miniaturization and lower resistance, meeting the demand for high-quality chip resistors (such as current sensing chip resistors) in the rapidly developing consumer electronics, communication industries, etc.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a method for preparing a chip resistor and the chip resistor. Background Art

[0002] In recent years, with the rapid development of the communications industry, the demand for chip resistors has been growing. At present, the common chip low-resistance resistors on the market include thick film low-resistance resistors, alloy low-resistance resistors and pure alloy low-resistance resistors. Among them, although thick film low-resistance resistors are easy to process and easy to achieve higher resistance segments, they have a high TCR (temperature coefficient of resistance), low power, narrow application range, and are not suitable for high-precision circuits; although alloy low-resistance resistors have low TCR and high power, it is difficult to achieve miniaturization and lower resistance (1-3mΩ); although pure alloy low-resistance resistors have the advantages of low TCR, high power, and low resistance, it is difficult to achieve miniaturization and thinness.

[0003] Although the above three types of low-resistance resistors have their own advantages, it is difficult to achieve smaller size and lower resistance due to the constraints of their own structure and process conditions. Therefore, how to design a new type of chip resistor to achieve smaller size and lower resistance is an urgent problem to be solved. Summary of the invention

[0004] In view of the problems existing in the prior art, the present invention provides a method for preparing a chip resistor and a chip resistor, which can achieve the advantages of smaller size and lower resistance of the chip resistor.

[0005] To achieve the above purpose, the technical solution provided by the present invention is as follows:

[0006] A method for preparing a chip resistor, comprising:

[0007] Laminating the first surface of the polymer fiber resin film to the bonding surface of the resistor layer;

[0008] forming a protective layer in a central area of ​​a forming surface of the resistor layer, wherein the forming surface is opposite to the bonding surface;

[0009] And at least two electrodes are formed on the forming surface offset from the central area to obtain a chip resistor.

[0010] In one embodiment, before forming at least two electrodes on the formation surface offset from the central area to obtain the chip resistor, the method further includes:

[0011] The photosensitive dry film is laminated on the forming surface of the resistor layer by a roller lamination method, and then the resistor layer laminated with the photosensitive dry film is sequentially exposed, developed and etched to pattern the resistor layer.

[0012] In one embodiment, after forming at least two electrodes on the formation surface offset from the central area to obtain the chip resistor, the method further includes:

[0013] The chip resistor is cut by using semiconductor precision cutting technology to obtain a single-grain chip resistor.

[0014] In one embodiment, before the chip resistor is cut by using semiconductor precision cutting technology to obtain a single chip resistor, the method further includes:

[0015] Using a preset resistance-repairing method to precisely trim the resistance of the chip resistor;

[0016] After the chip resistor is cut by using semiconductor precision cutting technology to obtain a single chip resistor, the method further includes:

[0017] A nickel layer and a tin layer are plated in sequence on the surface of the electrode and the side surface of the resistor layer by roller plating.

[0018] In a certain embodiment, laminating the first surface of the polymer fiber resin film to the bonding surface of the resistor layer includes:

[0019] Bonding the first surface of the polymer fiber resin film layer to the bonding surface of the resistor layer through a first adhesive layer;

[0020] Before the step of forming a protective layer in a central area of ​​the formation surface of the resistor body layer, the method further includes:

[0021] The second surface of the polymer fiber resin film is bonded to the inner surface of the heat conductive layer through a second adhesive layer; the second surface is opposite to the first surface.

[0022] The present invention also provides a chip resistor, comprising:

[0023] A polymeric fiber resin membrane comprising a first surface;

[0024] A resistor layer, comprising a bonding surface and a forming surface opposite to each other, wherein the bonding surface is bonded to the first surface;

[0025] a protective layer disposed on a central region of the forming surface; and

[0026] At least two electrodes are respectively arranged on the forming surface offset from the central area.

[0027] In one embodiment, the chip resistor further includes a first adhesive layer, and the first adhesive layer is disposed between the bonding surface and the first surface.

[0028] In one embodiment, the electrode includes a copper electrode, and the chip resistor also includes a nickel layer and a tin layer. The surface of the copper electrode and the side of the resistor layer are respectively plated with the nickel layer and the tin layer; the side of the resistor layer connects the bonding surface and the forming surface.

[0029] In one embodiment, the chip resistor further includes a heat conductive layer and a second adhesive layer, the heat conductive layer includes an inner surface, the polymer fiber resin film further includes a second surface opposite to the first surface, and the inner surface is arranged on the second surface through the second adhesive layer.

[0030] In one embodiment, the heat-conducting layer further includes an outer surface opposite to the inner surface and a heat-conducting side surface connecting the inner surface and the outer surface, and the protective layer is further disposed on the outer surface and the heat-conducting side surface.

[0031] Compared with the prior art, the method for preparing the chip resistor of the embodiment of the present invention uses a thin polymer fiber resin film as a substrate through a thin design, and combines the bonding surface of the resistor body layer with the first surface of the polymer fiber resin film, thereby replacing the traditional thicker ceramic substrate, thereby effectively reducing the total thickness of the product and achieving a thinner chip resistor. In addition, the thin polymer fiber resin film can be matched with a thicker resistor body layer to easily achieve a chip resistor with a lower resistance. In this way, the chip resistor prepared by the preparation method of the present invention has the advantages of both smaller size and lower resistance, meeting the demand for high-quality chip resistors (such as current sensing chip resistors) in the rapidly developing consumer electronics and communications industries. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic flow chart of a method for preparing a chip resistor provided by a certain embodiment of the present invention;

[0033] Figure 2 is a schematic structural diagram of a chip resistor provided by a certain embodiment of the present invention;

[0034] Figure 3 It is a cross-sectional view of a resistor dividing groove of a chip resistor provided by a certain embodiment of the present invention;

[0035] Figure 4 is a cross-sectional view of a mechanical resistance repair of a chip resistor provided by a certain embodiment of the present invention;

[0036] Figure 5 is a cross-sectional view of a laser-trimmed chip resistor provided by a certain embodiment of the present invention;

[0037] Figure 6 It is a schematic structural diagram of a chip resistor containing a heat-conducting layer provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0038] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without creative work belong to the scope of protection of the present invention.

[0039] See also Figure 1 and Figure 2 The chip resistor manufacturing method provided by the embodiment of the present invention includes:

[0040] S01: laminating the first surface 11 of the polymer fiber resin film 10 and the bonding surface 21 of the resistor layer 20;

[0041] S02: forming a protective layer 30 in the central area of ​​the forming surface 22 of the resistor layer 20; the forming surface is opposite to the bonding surface;

[0042] S03 : forming at least two electrodes 40 on the formation surface 22 offset from the central area to obtain the chip resistor 100 .

[0043] In this embodiment, the polymer fiber resin film 10 includes a glass fiber film or a polyimide film. Among them, since the glass fiber film has excellent high and low temperature resistance and electrical insulation, its thickness is thinner than that of the ceramic substrate, and it is suitable for use as the substrate of the chip resistor 100. The polyimide film, also known as PI film (Polyimide Film), has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and dielectric resistance. Its thickness is thinner than that of the ceramic substrate, and it is also suitable for use as the substrate of the chip resistor 100. The thickness of the polymer fiber resin film material is selected according to the actual design of the product, and its thickness is generally only 0.05mm-0.15mm, while the thickness of the ceramic substrate is generally 0.2mm-0.5mm. Therefore, when the thickness of the resistor body layer 20 is the same, the new structure can reduce the overall thickness of the product by at least 20% to 30%.

[0044] The resistor body layer 20 is also called an alloy resistor film material. The resistor body layer 20 has a bonding surface 21 and a forming surface 22 that are opposite to each other. Under a preset vacuum environment, the first surface 11 of the pre-cut sheet-like polymer fiber resin film 10 is tightly pressed together with the bonding surface 21 of the alloy resistor film material, and then a protective layer 30 is formed on the central area of ​​the forming surface 22 of the resistor body layer 20 by printing or the like, and finally an electrode 40 is formed on the forming surface 22 offset from the central area by means of mounting plating or the like.

[0045] In summary, the method for preparing the chip resistor 100 of the embodiment of the present invention uses a thin polymer fiber resin film 10 as a substrate through a thin design, combines the bonding surface 21 of the resistor body layer 20 with the first surface 11 of the polymer fiber resin film 10, and replaces the traditional thicker ceramic substrate, thereby effectively reducing the total thickness of the product and achieving a thinner chip resistor 100. In addition, the thin polymer fiber resin film 10 can be matched with the thicker resistor body layer 20, which can easily achieve a chip resistor 100 with a lower resistance. In this way, the chip resistor 100 prepared by the preparation method of the present invention has the advantages of smaller size and lower resistance, and meets the demand for high-quality chip resistors 100 (such as current sensing chip resistors) in the rapidly developing consumer electronics and communications industries.

[0046] In one embodiment, before step S03, that is, before forming at least two electrodes 40 on the forming surface 22 offset from the central area to obtain the chip resistor 100, the preparation method further includes:

[0047] S04: The photosensitive dry film is laminated onto the forming surface 22 of the resistor body layer 20 by a roller lamination method, and then the resistor body layer 20 laminated with the photosensitive dry film is sequentially exposed, developed and etched to pattern the resistor body layer 20 .

[0048] In one embodiment, after step S03, that is, after forming at least two electrodes 40 on the forming surface 22 offset from the central area to obtain the chip resistor 100, the preparation method further includes:

[0049] S05: Using semiconductor precision cutting technology to cut the chip resistor 100 to obtain single-grain chip resistors 100.

[0050] In this embodiment, semiconductor precision slicing technology (such as wafer slicing technology) is used to slicing the plurality of chip resistors 100 in the above embodiment successively according to the slicing grooves X and slicing grooves Y to form a single chip resistor 100 with regular shape and high dimensional accuracy, so as to achieve ultra-miniaturization. In addition, the semiconductor precision slicing technology and the use of the polymer fiber resin film 10 as the substrate also avoid the difficult slicing caused by the use of a ceramic substrate as the substrate, as well as the undesirable conditions such as easy deformation, easy breakage, and easy edge collapse of the product.

[0051] In one embodiment, before step S05, that is, before using semiconductor precision dicing technology to diced the chip resistor 100 to obtain a single-grain chip resistor 100, the preparation method further includes:

[0052] S06: Using a preset resistance-repairing method to precisely trim the resistance of the chip resistor 100 .

[0053] After step S05, the preparation method further includes:

[0054] S07: A nickel layer 60 and a tin layer 70 are plated in sequence on the surface of the electrode 40 and the side surface of the resistor layer 20 by roller plating.

[0055] In one embodiment, step S01 of laminating the first surface 11 of the polymer fiber resin film 10 with the bonding surface 21 of the resistor layer 20 includes:

[0056] S08 : Bonding the first surface 11 of the polymer fiber resin film 10 and the bonding surface 21 of the resistor layer 20 by means of the first adhesive layer 50 .

[0057] Before step S03, that is, before the step of forming the protective layer 30 in the central area of ​​the forming surface 22 of the resistor body layer 20, the preparation method further includes:

[0058] S09 : bonding the second surface 12 of the polymer fiber resin film 10 to the inner surface 81 of the heat conductive layer by means of the second adhesive layer 90 ; the second surface 12 is opposite to the first surface 11 .

[0059] In a specific embodiment, please combine Figure 2 The following will take the chip resistor 100 of 0603-2mΩ-1 / 2W and 0.40±0.10mm thickness as an example to describe the entire preparation process of the present invention in detail:

[0060] S011: Bonding of polymer fiber resin film 10 and resistor body layer 20 (i.e. alloy resistor film material). Specifically, under a preset vacuum environment, the pre-cut sheet polymer fiber resin film 10 and resistor body layer 20 (i.e. alloy resistor film material) are tightly pressed together by a laminator through the first adhesive layer 50, and the two layers of film material are low-temperature cured according to the set temperature, time and pressure to achieve a good bonding effect. Among them, the thickness of the polymer fiber resin film 10 is preferably 0.10mm-0.15mm; the thickness of the alloy resistor film is preferably 0.20mm-0.25mm; the low-temperature curing temperature is preferably 150℃-200℃.

[0061] S012: Patterning of resistor body. Specifically, a photosensitive dry film is laminated to the forming surface 22 of the resistor body layer 20 (ie, alloy resistor film material) by a roller lamination method, and the resistor body layer 20 is patterned by sequentially exposing, developing, and etching.

[0062] S013: Forming copper electrodes Specifically, a protective layer 30 is formed in the middle region of the resistor layer 20 by printing or the like, and copper electrodes are formed at the left and right ends of the resistor layer 20 by rack plating or the like.

[0063] S014: Precision resistance repair. Specifically, mechanical resistance repair (such as Figure 4 as shown) or laser repair (as shown Figure 5 As shown in the figure), the target resistance and accuracy requirements of the product are achieved, such as 2mΩ and ±1% accuracy.

[0064] S015: Secondary covering of the protective layer 30. Specifically, the repair opening is completely and densely encapsulated by printing or the like.

[0065] S016: Marking (resistance code). Specifically, a mark (such as a resistance code) that can be identified is formed on the second surface 12 of the polymer fiber resin film 10 by printing, laser marking, or coding. Figure 2 Marking layer 110 shown).

[0066] S017: Cutting into granules. Specifically, by using semiconductor precision cutting technology (such as wafer cutting technology), the sheet is cut into granules in sequence according to the cutting groove X, the cutting groove Y (such as Figure 3 As shown in the figure, the chip resistor 100 is cut into pieces to form a single-grain chip resistor 100 with a regular shape and high dimensional accuracy.

[0067] S018: Electroplating nickel layer 60 - tin layer 70. Specifically, by roller plating, a dense nickel layer 60 - tin layer 70 is plated on the surface of the copper electrode and the left and right ends of the resistor layer 20 in sequence, so that the product has good solderability.

[0068] In order to further improve the power characteristics of the product, the present invention will provide another specific embodiment, please refer to Figure 6 The schematic diagram of the structure of the chip resistor 100 shown in FIG. 1 is a schematic diagram of the structure of the chip resistor 100. This embodiment adds a heat-conducting layer 80 on the basis of the above-mentioned specific embodiment, specifically, a "heat sink" is attached, so that the performance of the chip resistor 100 can be improved:

[0069] S001: The same as S011 in the above specific embodiment.

[0070] S002: Bonding of heat sink. Specifically, the heat sink (such as thin copper sheet, aluminum sheet, etc.) and the second surface 12 of the polymer fiber resin film 10 are tightly pressed together through the second adhesive layer 90, and the two layers of film materials are low-temperature cured according to the set temperature, time, and pressure to achieve a good bonding effect. Figure 6 The outer surface 82 and the side surface 83 of the middle heat-conducting layer are coated with a dense protective layer 30.

[0071] S003-S009: follow the sequence of "S012-S018" in the above specific embodiment, and the corresponding steps are the same.

[0072] See also Figure 2 An embodiment of the present invention provides a chip resistor 100 , which includes a polymer fiber resin film 10 , a resistor body layer 20 , a protective layer 30 and at least two electrodes 40 .

[0073] The polymer fiber resin film 10 includes a first surface 11. The resistor layer 20 includes a bonding surface 21 and a forming surface 22 opposite to each other, and the bonding surface 21 is bonded to the first surface 11. The protective layer 30 is disposed on the central area of ​​the forming surface 22. At least two electrodes 40 are respectively disposed on the forming surface 22 offset from the central area.

[0074] In this embodiment, the resistor body layer 20 is also referred to as an alloy resistor film material. Under a preset vacuum environment, the first surface 11 of the pre-cut sheet-shaped polymer fiber resin film 10 and the bonding surface 21 of the alloy resistor film material are tightly pressed together, and then a protective layer 30 is formed on the central area of ​​the forming surface 22 of the resistor body layer 20 by printing or the like, and finally an electrode 40 is formed on the forming surface 22 offset from the central area by means of rack plating or the like.

[0075] The thickness of the polymer fiber resin film 10 is selected according to the actual product design, and its thickness is generally only 0.05mm-0.15mm, while the thickness of the ceramic substrate is generally 0.2mm-0.5mm. Therefore, under the condition that the thickness of the resistor layer 20 is the same, the new structure reduces the overall thickness of the product by at least 20%-30%.

[0076] In summary, the chip resistor 100 of the embodiment of the present invention, through a thin design, uses a thin polymer fiber resin film 10 as a substrate, and sets the resistor body layer 20 on the polymer fiber resin film 10, replacing the traditional thick ceramic substrate, thereby effectively reducing the total thickness of the product and achieving a thinner chip resistor 100. In addition, the thin polymer fiber resin film 10 can be matched with the thicker resistor body layer 20, which can easily achieve a chip resistor 100 with a lower resistance value. In this way, the chip resistor 100 of the present invention has the advantages of smaller size and lower resistance value, meeting the demand for high-quality chip resistors 100 (such as current sensing chip resistors) in the rapidly developing consumer electronics and communications industries.

[0077] In one embodiment, the protective layer 30 is glass or epoxy resin, so as to protect the resistor layer 20 from dust and electrical isolation.

[0078] See also Figure 2 In one embodiment, the chip resistor 100 further includes a first adhesive layer 50 , and the first adhesive layer 50 is disposed between the bonding surface 21 and the first surface 11 .

[0079] Under a preset vacuum environment, the pre-cut sheet-shaped polymer fiber resin film 10 and the resistor body layer 20 are tightly pressed together by a laminator through the first adhesive layer 50, and the two layers of film materials are low-temperature cured according to preset parameters such as temperature, time, and pressure to achieve a good bonding effect. In this way, the first adhesive layer 50 is arranged between the bonding surface 21 and the first surface 11, and the bonding between the polymer fiber resin film 10 and the resistor body layer 20 is more reliable.

[0080] In one embodiment, the polymer fiber resin membrane 10 includes a glass fiber membrane or a polyimide film (hereinafter referred to as PI film). The electrode 40 includes a copper electrode.

[0081] Since the glass fiber film has excellent high and low temperature resistance and electrical insulation, its thickness is thinner than that of the ceramic substrate, and is suitable for use as the substrate of the chip resistor 100. Since the PI film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and dielectric resistance, its thickness is thinner than that of the ceramic substrate, and is also suitable for use as the substrate of the chip resistor 100. Since copper has good electrical conductivity, the copper electrode ensures good electrical connection between the chip resistor 100 and other components.

[0082] See also Figure 2 In one embodiment, at least two electrodes 40 are symmetrical with the protective layer 30 as the central axis and are respectively located at two ends of the resistor layer 20 .

[0083] At least two electrodes 40 are respectively located at two ends of the resistor layer 20 to facilitate electrical connection between the chip resistor 100 and other devices.

[0084] See also Figure 2 In one embodiment, the chip resistor 100 further includes a nickel layer 60 and a tin layer 70, and the surface of the copper electrode and the side surface 23 of the resistor body layer 20 are respectively plated with the nickel layer 60 and the tin layer 70. The side surface 23 of the resistor body layer 20 connects the bonding surface 21 and the forming surface 22.

[0085] By means of roller plating, a dense nickel layer 60 and a tin layer 70 are respectively plated on the surface of the copper electrode and the left and right sides of the resistor layer 20, so that the product has good solderability.

[0086] See also Figure 3In one embodiment, semiconductor precision slicing technology (such as wafer slicing technology) is used to slicing the plurality of chip resistors 100 in the above embodiment according to the slicing grooves X and Y, forming a single chip resistor 100 with regular shape and high dimensional accuracy, so as to achieve ultra-miniaturization. In addition, the semiconductor precision slicing technology and the use of the polymer fiber resin film 10 as the substrate can also avoid the difficult slicing caused by the use of a ceramic substrate as the substrate, as well as the undesirable conditions such as easy deformation, easy breakage, and easy edge collapse of the product.

[0087] In a certain embodiment, the chip resistor 100 in the above embodiment is subjected to precision resistance trimming.

[0088] Specifically, the resistor layer 20 is mechanically repaired (eg Figure 4 as shown) or laser repair (as shown Figure 5 As shown in the figure), the target resistance and accuracy requirements of the product are achieved, such as 2mΩ and ±1% accuracy.

[0089] In one embodiment, the protective layer 30 is also used to completely and densely encapsulate the repair opening by printing or other similar methods.

[0090] See also Figure 6 In one embodiment, the chip resistor 100 further includes a heat conductive layer 80 and a second adhesive layer 90. The heat conductive layer 80 includes an inner surface 81, and the polymer fiber resin film 10 further includes a second surface 12 opposite to the first surface 11, and the inner surface 81 is disposed on the second surface 12 through the second adhesive layer 90.

[0091] According to the high power requirements of actual applications, a heat conducting layer 80, such as a thin heat sink, may be laminated on the substrate surface to accelerate the heat dissipation of the chip resistor 100 during operation, thereby further improving the power level of the product.

[0092] In this embodiment, after the above-mentioned bonding of the polymer fiber resin film 10 and the resistor body layer 20 is completed, the inner surface 81 of the heat conductive layer 80 and the second surface 12 of the polymer fiber resin film 10 are tightly pressed together through the second adhesive layer 90, and the two layers of film materials are low-temperature cured according to preset parameters such as temperature, time, and pressure to achieve a good bonding effect. In this way, the second adhesive layer 90 is arranged between the inner surface 81 and the second surface 12, and the bonding between the heat conductive layer 80 and the polymer fiber resin film 10 is more reliable.

[0093] In one embodiment, the heat conducting layer 80 includes a thin copper sheet or an aluminum sheet. Both the thin copper sheet and the aluminum sheet have good thermal conductivity and can conduct heat to the resistor layer 20 relatively quickly.

[0094] Of course, in other embodiments, the heat-conducting layer 80 may also be a device made of other materials with excellent heat dissipation performance, which is not specifically limited here.

[0095] See also Figure 6 In one embodiment, the heat-conducting layer 80 further includes an outer surface 82 opposite to the inner surface 81 and a heat-conducting side surface 83 connecting the inner surface 81 and the outer surface 82 , and the protective layer 30 is further disposed on the outer surface 82 and the heat-conducting side surface 83 .

[0096] After the thermal conductive layer 80 is mounted, a dense protective layer 30 is coated on the outer surface 82 and the thermal conductive side surface 83 of the thermal conductive layer 80 to protect the thermal conductive layer 80 from dust and electrical isolation.

[0097] In one embodiment, the protection layer 30 is replaced by a solder resist layer.

[0098] See also Figure 6 In one embodiment, the chip resistor 100 further includes a marking layer 110 , and the marking layer 110 is disposed on the protective layer 30 .

[0099] In this embodiment, a mark for identifying the resistance value is formed on the outer surface of the protective layer 30 by printing, laser marking, or inkjet coding.

[0100] In a specific embodiment, the product of the present invention is mainly designed to meet the needs of miniaturization, thinness, and ultra-low resistance in consumer electronics and communications industries, and is compared with the prior art as shown in the following table:

[0101]

[0102]

[0103] It can be seen from the above comparison that, compared with the prior art, the chip resistor 100 provided by the embodiment of the present invention has the following beneficial effects:

[0104] (1) Thinner thickness can be achieved: Using a thin polymer fiber resin film 10 as the substrate to replace the traditional thicker ceramic substrate, the total thickness of the product can be reduced by about 20%-30% when the thickness of the resistor layer 20 remains the same.

[0105] (2) It can be miniaturized: Miniaturized ceramic substrates have the disadvantages of easy breakage, deformation, and double chips when cut. The polymer fiber resin film 10 is used as the substrate, which is suitable for mechanical cutting process and greatly improves the dimensional accuracy of the product. As shown in the table above, the smallest size can be achieved for the chip resistor 100 of model 0201.

[0106] (3) Lower resistance can be achieved: The thin polymer fiber resin film 10 can be matched with a thicker resistor layer 20 (alloy resistor film material) to easily achieve a lower resistance.

[0107] (4) Small size and high power: A heat-conducting layer 80 of different thicknesses is attached to the polymer fiber resin film 10 to achieve higher power.

[0108] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A method for preparing a chip resistor, characterized in that: include: Under a preset vacuum environment, the first surface of the pre-cut sheet-shaped polymer fiber resin film and the bonding surface of the resistor layer are tightly pressed together by a laminator through the first adhesive layer, and the two layers of film materials are low-temperature cured according to the preset temperature, time and pressure to achieve bonding and attachment; The second surface of the polymer fiber resin film is tightly pressed together with the inner surface of the heat conductive layer through the second adhesive layer, and the two layers of film material are low-temperature cured according to a preset temperature, time and pressure to achieve adhesion, and the second surface is opposite to the first surface; The low temperature curing temperature is 150°C to 200°C; forming a protective layer in a central area of ​​a forming surface of the resistor layer, wherein the forming surface is opposite to the bonding surface; and forming at least two electrodes on the forming surface offset from the central area to obtain a chip resistor; The semiconductor precision cutting technology is adopted to cut the plurality of chip resistors successively according to the cutting grooves X and the cutting grooves Y to obtain single-grain chip resistors.

2. The preparation method according to claim 1, characterized in that: Before forming at least two electrodes on the forming surface offset from the central area to obtain the chip resistor, the method further includes: The photosensitive dry film is laminated on the forming surface of the resistor layer by a roller lamination method, and then the resistor layer laminated with the photosensitive dry film is sequentially exposed, developed and etched to pattern the resistor layer.

3. The preparation method according to claim 1, characterized in that: Before using semiconductor precision cutting technology to cut the plurality of chip resistors successively according to the cutting grooves X and Y to obtain single-grain chip resistors, the method further includes: Using a preset resistance-repairing method to precisely trim the resistance of the chip resistor; After the semiconductor precision cutting technology is used to cut the plurality of chip resistors successively according to the cutting grooves X and Y to obtain single-grain chip resistors, the method further comprises: A nickel layer and a tin layer are plated in sequence on the surface of the electrode and the side surface of the resistor layer by roller plating.

4. A chip resistor, characterized in that: It is prepared according to the method for preparing a chip resistor according to any one of claims 1 to 3, and the chip resistor comprises: A polymeric fiber resin membrane comprising a first surface; A resistor layer, comprising a bonding surface and a forming surface opposite to each other, wherein the bonding surface is bonded to the first surface; a protective layer disposed on a central region of the forming surface; and At least two electrodes are respectively arranged on the forming surface offset from the central area.

5. The chip resistor according to claim 4, characterized in that: The chip resistor further includes a first adhesive layer, which is disposed between the bonding surface and the first surface.

6. The chip resistor according to claim 4, characterized in that: The electrode includes a copper electrode, and the chip resistor also includes a nickel layer and a tin layer. The surface of the copper electrode and the side of the resistor body layer are plated with the nickel layer and the tin layer respectively; the side of the resistor body layer connects the bonding surface and the forming surface.

7. The chip resistor according to any one of claims 4 to 6, characterized in that: The chip resistor further includes a heat conductive layer and a second adhesive layer, the heat conductive layer includes an inner surface, the polymer fiber resin film further includes a second surface opposite to the first surface, and the inner surface is disposed on the second surface through the second adhesive layer.

8. The chip resistor according to claim 7, characterized in that: The heat-conducting layer further includes an outer surface opposite to the inner surface and a heat-conducting side surface connecting the inner surface and the outer surface, and the protective layer is further arranged on the outer surface and the heat-conducting side surface.

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